Electronic installation
Technical field
The present invention relates to a kind of electronic installation, relate in particular to the preferable electronic installation of a kind of radiating effect.
Background technology
Along with the progress of science and technology, the running speed of electronic installation constantly improves in recent years, and the heating power of the electronic component of its main frame inside is also constantly soaring.Overheated for the electronic component of the inside of preventing main frame, and cause electronic component to lose efficacy, enough heat dissipations must be provided the electronic component of its inside.
Generally speaking, the heat radiation module mainly is made up of fan, radiating fin group and heat pipe.The radiating fin group is arranged on the air outlet of fan, and is connected with heat pipe, in order to disperse the heat that is absorbed from the thermal source place by heat pipe.The radiating fin group is made up of a plurality of sheet metals that are arranged in parallel, and has certain clearance between the adjacent metal sheet, uses allowing heat dissipation in air.Therefore, when fan is under the operating state, cooling blast can flow to the radiating fin group via air outlet, by convection action hot type being gone out outside the body, and then reduces temperature in the electronic installation.
Yet, based on making considering of tolerance, radiating fin group and fan can leave the gap with the housing of electronic installation after assembling is finished, thereby easily cause used heat in the gap, to circulate, cause casing surface temperature overheated, more may be too high because of the temperature of radiating fin group, be directly delivered to surface of shell, thereby the case temperature of raising electronic installation, and allow the user when the contact surface of shell, not feel well.
Summary of the invention
The invention provides a kind of electronic installation, can effectively reduce its case temperature.
The present invention proposes a kind of electronic installation, comprises a housing, a fan module, a fins group and a conducting element.The fan module is arranged in the housing, has an air outlet, so that a cooling blast to be provided.Fins group is connected with air outlet, and has a gap between air outlet and fins group.Conducting element has at least one first air port and at least one second air port, first air port is communicated with second air port, and conducting element is arranged on the air outlet and is embedded in the gap, make the cooling blast of part flow into first air port, second air port is between fins group and housing, and the frontal projected area in first air port is greater than the frontal projected area in second air port.
In one embodiment of this invention, above-mentioned conducting element also comprises at least two stop parts, be arranged at the relative both sides in adjacent second air port respectively and be bearing on housing and fins group between.
In one embodiment of this invention, one first bearing of trend of above-mentioned each stop part is parallel with a mobile direction of cooling blast.
In one embodiment of this invention, one second bearing of trend in above-mentioned gap is vertical with a mobile direction of cooling blast.
In one embodiment of this invention, above-mentioned conducting element also comprises one first conducting element and one second conducting element, first conducting element is around the air outlet setting, and second conducting element is embedded in the gap, forms first air port and second air port between first conducting element and second conducting element.
In one embodiment of this invention, above-mentioned first conducting element also comprises at least one extension and at least two stop parts, stop part be arranged at the relative both sides in adjacent second air port respectively and be bearing on housing and fins group between, and one first bearing of trend of each stop part is parallel with a mobile direction of cooling blast, first bearing of trend that extension connects each stop part and past stop part extends, second conducting element is arranged between fins group and first conducting element and the breasting fins group, second conducting element is combined with first conducting element, to form at least one obstruct runner between fins group and housing.
In one embodiment of this invention, above-mentioned second conducting element has one first end and second end with respect to first end, and first end is adjacent to air outlet.
In one embodiment of this invention, above-mentioned second conducting element also comprises at least one distributary division, and distributary division is arranged at that first end extends in the fan module so that conducting element is embedded in the gap, the cooling blast of part is flow to by splitter section intercept in the runner.
In one embodiment of this invention, above-mentioned second conducting element also comprises a plurality of openings, and opening is arranged at second end of second conducting element respectively and faces a side of fins group, the cooling blast that flows into the obstruct runner is flowed out via opening intercept runner with the cooling fin group.
In one embodiment of this invention, above-mentioned electronic installation also comprises at least one elastomer, is bearing between housing and first conducting element.
Based on above-mentioned, utilization of the present invention is arranged at the conducting element between fan module and fins group, and the part cooling blast that the fan module is provided directly enters conducting element and need not pass through fins group, and via the guiding of conducting element, flow between fins group and the housing, directly housing is cooled off.Therefore, the present invention effectively reduces the case temperature of electronic installation, more can promote the radiating efficiency of fan module.
For above-mentioned feature and advantage of the present invention can be become apparent, embodiment cited below particularly, and cooperate appended accompanying drawing to be described in detail below.
Description of drawings
Fig. 1 does not arrange the partial perspective schematic diagram of conducting element for the electronic installation of one embodiment of the invention.
Fig. 2 arranges the partial perspective schematic diagram of conducting element for the electronic installation of one embodiment of the invention.
Fig. 3 and Fig. 4 are the schematic perspective view of the conducting element of one embodiment of the invention.
Fig. 5 is the partial cutaway schematic of the electronic installation of one embodiment of the invention.
Fig. 6 is the partial cutaway schematic of the electronic installation of another embodiment of the present invention.
Fig. 7 is the perspective exploded view of first conducting element and second conducting element of Fig. 6.
Fig. 8 is first conducting element of Fig. 6 and the solid combination schematic diagram of second conducting element.
Fig. 9 is the schematic diagram of another angle of Fig. 8.
The main element symbol description:
100,600: electronic installation
110: housing
120: the fan module
122: air outlet
130: fins group
140: conducting element
142: the first air ports
144: the second air ports
146: stop part
148: extension
150: the second conducting elements
152: distributary division
154: opening
156: the first ends
158: the second ends
160: intercept runner
170: elastomer
640: the first conducting elements
CF: cooling blast
GP: gap
ED1: first bearing of trend
ED2: second bearing of trend
FD: flow direction
Embodiment
Fig. 1 does not arrange the partial perspective schematic diagram of conducting element for the electronic installation of one embodiment of the invention.Fig. 2 arranges the partial perspective schematic diagram of conducting element for the electronic installation of one embodiment of the invention.It should be noted that because conducting element 140 is arranged at the below of fins group 130, so the electronic installation 100 of Fig. 1 and Fig. 2 is all the state of turned upside down, conveniently to draw the relation that arranges of 130 of conducting element 140 and fins group.In addition, the internal structure of electronic installation 100 for convenience of description, the housing 110 of electronic installation 100 is all drawn with the method for perspective.Please also refer to Fig. 1 and Fig. 2, in the present embodiment, electronic installation 100 comprises a housing 110, a fan module 120, a fins group 130 and a conducting element 140.Wherein, electronic installation 100 can be desktop computer, notebook computer (notebook) or arbitrary electronic installation with operation independent and Presentation Function.In the present embodiment, electronic installation 100 is a notebook computer, but the present invention does not limit the kind of electronic installation 100.Fan module 120 is arranged in the housing 110, and has an air outlet 122, so that a cooling blast CF to be provided.Fins group 130 is connected with air outlet 122, and air outlet 122 and 130 of fins group have a clearance G P.
Fig. 3 and Fig. 4 are the schematic perspective view of the conducting element of one embodiment of the invention.Please also refer to Fig. 2, Fig. 3 and Fig. 4, conducting element 140 has at least one first air port 142 and at least one second air port 144, and in the present embodiment, the quantity in first air port 142 and second air port 144 respectively is one.Wherein, first air port 142 is communicated with second air port 144, and conducting element 140 is arranged on the air outlet 122 and is embedded in the clearance G P, make the cooling blast CF of part flow into first air port 142, second air port 144 is between fins group 130 and housing 110, and the part cooling blast CF that fan module 120 is provided need not pass through fins group 130, can be via the guiding of conducting element 140, flow between fins group 130 and the housing 110, with the surface of direct cooling housing 110.
In the present embodiment, conducting element 140 also comprises at least two stop parts 146, be arranged at the relative both sides in adjacent one second air port 144 respectively and be bearing on housing 110 and fins group 130 between, to prevent that hot air reflow is to the dead angle of 110 of fan module 120 or fins group 130 and housings.Wherein, stop part 146 is suitable for conducting element 140 one-body molded, and one first bearing of trend ED1 of stop part 146 is parallel with the mobile direction FD of cooling blast CF, and the one second bearing of trend ED2 of clearance G P is vertical with the flow direction FD of cooling blast CF, makes the cooling blast CF can be via the housing 110 of guiding cooling fin group 130 belows of stop part 146.
Fig. 5 is the partial cutaway schematic of the electronic installation of one embodiment of the invention.Please refer to Fig. 5, as above-mentioned configuration, the part cooling blast CF that is provided by fan module 120 enters conducting element 140 via first air port 142, flow between fins group 130 and the housing 110 via second air port 144, with cooling housing 110 again.And, the cooling blast CF cooling that the hot-air that fins group 130 discharges can be flowed out by second air port 144 immediately, more because the stopping of stop part 146 and second air port 144, hot-air is unlikely to be back to the dead angle that cooling blast CF such as fan module 120 belows can't arrive, so can effectively reduce the temperature of housing 110.Actual, the frontal projected area in first air port 142 of conducting element 140 is greater than the frontal projected area in second air port 144, the cooling blast CF that makes the conducting element 140 of flowing through reduces to increase its flow rate because of the air-out area in second air port 144, and then promotes the speed of its heat exchange.
Fig. 6 is the partial cutaway schematic of the electronic installation of another embodiment of the present invention.Fig. 7 is the perspective exploded view of first conducting element and second conducting element of Fig. 6.Please also refer to Fig. 6 and Fig. 7, in another embodiment of the present invention, conducting element 140 also comprises one first conducting element 640 and one second conducting element 150.First conducting element 640 arranges around the air outlet 122 of fan module 120, and second conducting element 150 is embedded in the clearance G P, wherein, and formation first air port 142 and second air port 144 between first conducting element 640 and second conducting element 150.In the present embodiment, first air port 142 of first conducting element 640 and the quantity in second air port 144 are all two, first air port 142 lays respectively at the both sides of the close relatively housing 110 of air outlet 122, second air port 144 corresponding first air port 142 respectively arranges, and between fins group 130 and housing 110.First conducting element 640 also comprises at least one extension 148 (being two in the present embodiment), and stop part 146 is positioned on first conducting element 640, extension 148 is arranged at each second air port 144 relatively near a side of housing 110, and the first bearing of trend ED 1 that connects each stop part 146 and past stop part 146 extends.
Hold above-mentionedly, second conducting element 150 is arranged between fins group 130 and first conducting element 640 and is bearing on fins group 130.Fig. 8 is first conducting element of Fig. 6 and the solid combination schematic diagram of second conducting element.Please also refer to Fig. 6 and Fig. 8, second conducting element 150 and 640 combinations of first conducting element are to form at least one obstruct runner 160 (being two in the present embodiment) between fins group 130 and housing 110.Second conducting element 150 has one first end 156 and second end, 158, the first ends 156 with respect to first end 156 are adjacent to air outlet 122.Second conducting element 150 has at least one distributary division 152 (being two in the present embodiment), corresponding first air port 142 arranges first end 156 and extends in the fan module respectively, intercepts in the runner 160 so that the cooling blast CF that the fan module 120 of part provides is branched to by distributary division 152.As above-mentioned configuration, cooling blast CF is branched to the obstruct runner 160 that is positioned at 110 of fins group 130 and housings by distributary division 152, to form an obstruct air-flow in fins group 130 and 110 of housings, stop that the hot gas that fins group 130 produces directly is passed to housing 110, and cause housing 110 surface temperatures overheated.
Fig. 9 is the schematic diagram of another angle of Fig. 8.Please also refer to Fig. 6 and Fig. 9, second conducting element 150 also comprises a plurality of openings 154, be arranged at second end, 158 places of close relatively second conducting element 150 respectively, and be positioned at the side in the face of fins group 130, the cooling blast CF that flows into obstruct runner 160 flowed out via opening 154 intercept runners 160 with cooling fin group 130.In addition, electronic installation 600 also comprises at least one elastomer 170 (being two in the present embodiment), be bearing between housing 110 and first conducting element 640, preventing hot air reflow to the dead angle that cooling blast CF such as 110 of fins group 130 and housings can't arrive, and cause hot-air in the gap of housing 110, to circulate.Wherein, elastomer 170 can be rubber-like materials such as sponge, foam or plastic cement, and in the present embodiment, elastomer 170 is foam, but the present invention does not limit to elastomeric material.
In sum, the present invention arranges a conducting element between fan module and fins group, the part cooling blast that the fan module is provided need namely not enter conducting element through fins group, and via the guiding of conducting element, flow between fins group and the housing, directly housing and fins group being cooled off, and between fins group and housing, form one and intercept air-flow, stop that the hot gas that fins group produces conducts to housing.In addition, the present invention more can stop hot air reflow to cooling blasts such as fan module below can't arrive part.Therefore, the present invention effectively reduces the case temperature of electronic installation, more can promote the radiating efficiency of fan module.
Though the present invention discloses as above with embodiment, so it is not in order to limiting the present invention, any under those of ordinary skill in the technical field, when can doing a little change and retouching, and do not break away from the spirit and scope of the present invention.