TWI676884B - Electronic device - Google Patents

Abstract

An electronic device includes a casing wall and a heat dissipation module. The heat dissipation module includes a heat dissipation fin group, a heat dissipation fan, and an isolation layer. The heat dissipation fin group is adjacent to the casing wall, and has a first air inlet and a second air inlet. The heat dissipation fin group includes a plurality of heat dissipation fins. The cooling fan has an air outlet. The air outlet is adjacent to the first air inlet and spaced a distance from the second air inlet. The isolation layer is at least partially located between the first air inlet and the second air inlet.

Description

Electronic device

An electronic device, in particular, relates to a high-efficiency heat-dissipating electronic device.

Generally, electronic devices, such as notebooks and personal computers, need to be equipped with heat sink modules, such as heat sink fins and fan modules, to dissipate heat generated by computing elements or other components during normal operation. To prevent heat from accumulating in the electronic device, the temperature inside the electronic device will rise, which will affect the operation of the computing device. In severe cases, components in the computing device may even be damaged or stopped.

However, with the trend of thinner and lighter electronic devices, the body of the electronic device becomes thinner, the internal space of the body is reduced, and the associated heat dissipation module must be reduced accordingly. The shrinking of the heat sink module results in poor heat dissipation performance, which increases the temperature of the heat sink module. After the temperature of the heat dissipation module rises, the thermal energy of the heat dissipation module is transmitted to the case, which causes the surface temperature of the case to be too high, which results in a poor user experience.

In view of this, one object of the present disclosure is to provide an electronic device capable of effectively improving heat dissipation efficiency.

To achieve the above object, according to an embodiment of the present disclosure, an electronic device includes a casing wall and a heat dissipation module. The heat dissipation module includes a heat dissipation fin group, a heat dissipation fan, and an isolation layer. The heat dissipation fin group is adjacent to the casing wall, and has a first air inlet and a second air inlet. The heat dissipation fin group includes a plurality of heat dissipation fins. The cooling fan has an air outlet. The air outlet is adjacent to the first air inlet and spaced a distance from the second air inlet. The isolation layer is at least partially located between the first air inlet and the second air inlet.

In one or more embodiments of the present disclosure, the second air inlet is closer to the casing wall than the first air inlet.

In one or more embodiments of the present disclosure, the above-mentioned isolation layer is disposed on the heat dissipation fin. The isolation layer is perpendicular to one side of the heat dissipation fins and extends along the arrangement direction of the heat dissipation fins.

In one or more embodiments of the present disclosure, the above-mentioned isolation layer has an opening. The second air inlet is an area exposed by the opening.

In one or more embodiments of the present disclosure, the above-mentioned isolation layer includes an insulating and air-impermeable material.

In one or more embodiments of the present disclosure, both the first air inlet and the second air inlet are facing the air outlet of the cooling fan.

In one or more embodiments of the present disclosure, the end of the heat dissipation fin group far from the air outlet has a thickness that is greater than the thickness of the end of the heat radiation fin group adjacent to the air outlet.

In one or more embodiments of the present disclosure, the end of the heat dissipation fin group far from the air outlet has a height that is greater than the height of the end of the heat radiation fin group adjacent to the air outlet.

In one or more embodiments of the present disclosure, the above-mentioned isolation layer is spaced apart from the air outlet of the cooling fan by a distance.

In one or more embodiments of the present disclosure, the thickness of the air outlet of the heat dissipation fan is greater than the thickness of the first air inlet of the heat dissipation fin group.

In summary, the electronic device of the present disclosure is provided with an isolation layer on the heat dissipation fin tissue, and an opening is provided on the isolation layer as the second air inlet of the heat dissipation fin group, so that the airflow from the heat dissipation fan is divided into Two. One flowed through the cooling fin group to cool the cooling fin group, and the other flowed over the cooling fin group to cool the case. In addition, after the airflow flowing over the heat dissipation fin group cools the wall of the cabinet, it can flow into the heat dissipation fin group through the second air inlet of the heat dissipation fin group to enhance the heat dissipation efficiency of the heat dissipation fin group. Therefore, the design of the heat dissipation module not only improves its own heat dissipation performance, but also cools the wall of the cabinet that the user may touch to improve the user's operating experience.

The above is only used to explain the problems to be solved, the technical means to solve the problems, and the effects produced by this disclosure, etc. The specific details of this disclosure will be described in detail in the following embodiments and related drawings.

Several embodiments of the present disclosure will be disclosed graphically below. For the sake of clarity, many practical details will be explained in the following description. It should be understood, however, that these practical details should not be used to limit the present disclosure. That is, in some embodiments of the present disclosure, these practical details are unnecessary. In addition, in order to simplify the drawings, some conventional structures and components will be shown in the drawings in a simple and schematic manner.

In addition, the terms used throughout the specification and the scope of patent applications, unless otherwise specified, usually have the ordinary meaning of each term used in this field, in the content disclosed here, and in special content. . Certain terms used to describe this disclosure are discussed below or elsewhere in this specification to provide additional guidance to those skilled in the art on the description of this disclosure.

Regarding the "first", "second", ..., etc. used in this document, they do not specifically refer to the order or order, nor are they used to limit the present invention. They are only used to distinguish elements or operations described in the same technical terms. That's it.

Secondly, the terms "including", "including", "having", "containing" and the like used in this article are all open-ended terms, which means including but not limited to.

Moreover, in this article, unless the article specifically restricts the article, "a" and "the" can refer to a single or multiple. It will be further understood that the terms "including", "including", "having" and similar words used in this document indicate the features, regions, integers, steps, operations, elements and / or components recorded therein, but do not exclude It describes or additionally one or more of its other features, regions, integers, steps, operations, elements, components, and / or groups thereof.

Referring to FIG. 1 and FIG. 2, FIG. 1 is a perspective view illustrating a heat dissipation module 100 in the electronic device 10 according to an embodiment of the present disclosure. FIG. 2 is an exploded perspective view showing the heat dissipation module 100 in FIG. 1. The electronic device 10 in this embodiment may be a notebook computer, but the disclosure is not limited thereto. As shown in FIGS. 1 and 2, the heat dissipation module 100 includes a heat dissipation fin group 110, a heat dissipation fan 120, and an isolation layer 130. The cooling fan 120 has an air inlet 122 and an air outlet 124. The heat dissipation fin group 110 includes a plurality of heat dissipation fins 112. Each heat dissipation fin 112 is stacked in parallel with each other, and is disposed at the air outlet 124 of the heat dissipation fan 120. The two adjacent heat dissipation fins 112 are spaced from each other to form a first flow channel 112a. The top of each heat dissipation fin 112 has two sections of folds 1126, and the folds 1126 extend to the adjacent heat dissipation fins 112 to cover the first flow channel 112 a between the two adjacent heat dissipation fins 112. The heat radiation fin group 110 has a first air inlet 114 and a second air inlet 116. Both the first air inlet 114 and the second air inlet 116 face the air outlet 124 of the heat dissipation fan 120 and are configured to receive the airflow blown from the air outlet 124 of the heat dissipation fan 120. Further, the first air inlet 114 is adjacent to the air outlet 124 of the cooling fan 120. The second air inlet 116 is spaced a distance D1 from the air outlet 124 of the cooling fan 120. The second air inlet 116 is located between the two sections of the hem 1126. In this way, the wind resistance at the second air inlet 116 can be reduced, and the airflow can be accelerated through the second air inlet 116.

In some embodiments, the cooling fan 120 is a centrifugal cooling fan 120, but the disclosure is not limited thereto.

The isolation layer 130 is disposed on the heat dissipation fin group 110, is close to a side of the second air inlet 116, and is separated from the air outlet 124 of the heat dissipation fan 120 by a distance D2. The isolation layer 130 has an opening 132 and a covering portion 134. A partial covering portion 134 is located between the first air inlet 114 and the second air inlet 116. The other part of the covering portion 134 surrounds the opening 132. When the isolation layer 130 is disposed on the heat dissipation fin group 110, the position of the opening 132 and the second air inlet 116 overlap. Specifically, the isolation layer 130 is perpendicular to one side of the heat dissipation fins 112 and extends along the arrangement direction of the heat dissipation fins 112. As such, the covering portion 134 of the isolation layer 130 extends along the arrangement direction of the heat dissipation fins 112 to cover the heat dissipation fins 112 and the first flow path 112 a between the heat dissipation fins 112. The opening 132 extends along the arrangement direction of the heat dissipation fins 112, so that a region of the heat dissipation fins 112 exposed by the openings 132 is the second air inlet 116. A second flow channel 112b is formed between the isolation layer 130 and the upper casing wall 200 (as shown in FIG. 3). Further, the isolation layer 130 is located between the first flow passage 112a and the second flow passage 112b, so as to avoid the air flow passing through the first flow passage 112a and the air flow passing through the second flow passage 112b from interfering with each other, resulting in turbulence or turbulence .

In some embodiments, the material of the isolation layer 130 includes an insulating, air-impermeable material, such as a polyester film, but the disclosure is not limited thereto.

Refer to Figure 3. FIG. 3 is a partial cross-sectional view illustrating the electronic device 10 according to an embodiment of the present disclosure, in which the heat dissipation module 100 is a partial cross-sectional view taken along a direction indicated by a line segment 3-3 in the first figure. In this embodiment, the electronic device 10 includes an upper casing wall 200, a lower casing wall 300, and a heat dissipation module 100. As shown in FIG. 3, the heat dissipation module 100 is installed between the upper and lower casing walls 200 and 300. The heat dissipation fin group 110 is adjacent to the upper casing wall 200. The heat dissipation fin 112 further includes a main body portion 1122 and a bent portion 1124. The main body portion 1122 is adjacent to the air outlet 124 and extends away from the air outlet 124. The bent portion 1124 is connected to the main body portion 1122 and is bent close to the upper casing wall 200 relative to the main body portion 1122, so that the end of the heat dissipation fin group 110 away from the air outlet 124, that is, the end where the second air inlet 116 is located, has a thickness T1 is greater than the thickness T2 of one end of the heat dissipation fin group 110 adjacent to the air outlet 124.

Furthermore, the height H1 of the end of the radiating fin 112 away from the air outlet 124 near the upper cabinet wall 200 to the lower housing wall 300 is greater than the end of the radiating fin 112 near the air outlet 124 near the upper cabinet. The height H2 from one side of the wall 200 to the lower cabinet wall 300. In this way, the second air inlet 116 is closer to the upper casing wall 200 than the first air inlet 114. A section of hem 1126 is connected to the main body portion 1122 and extends to the adjacent heat dissipation fin 112 relative to the main body portion 1122. The other fold 1126 is connected to the bent portion 1124 and extends to the adjacent heat dissipation fin 112 relative to the bent portion 1124.

Further, the air outlet 124 of the cooling fan 120 has a thickness T3 greater than the thickness T2 of one end of the heat radiation fin group 110 adjacent to the air outlet 124, that is, the thickness T2 of the first air inlet 114. As a result, a part of the airflow blown out by the cooling fan 120 flows into the first flow channel 112 a between the cooling fins 112 through the first air inlet 114 to help the cooling fins 112 dissipate heat. The folded edge 1126 of the heat dissipation fin 112 can increase the contact area between the heat dissipation fin 112 and the airflow, and further improve the heat dissipation efficiency.

The other part of the airflow flows through the upper casing wall 200 through the second flow channel 112b between the isolation layer 130 and the upper casing wall 200 to help the upper casing wall 200 cool down and dissipate heat. In addition, the airflow that helps the upper casing wall 200 to cool down through the second flow channel 112b can flow into the heat dissipation fin group 110 through the second air inlet 116 with a smaller air resistance, further helping the heat dissipation fin group 110 to dissipate heat, and increasing the heat dissipation fin group 110 cooling efficiency. In this way, the effect of radiating the casing wall and improving the radiating efficiency of the radiating module 100 can be achieved at the same time. Avoiding the accumulation of thermal energy in the heat dissipation module 100 causes the temperature in the electronic device 10 to rise and affects the normal operation of the electronic device 10.

From the above detailed description of the specific implementation of the present disclosure, it can be clearly seen that the electronic device of the present disclosure is provided with an isolation layer on the heat dissipation fin tissue, and an opening is formed on the isolation layer as the heat dissipation fin group. The second air inlet makes the airflow from the cooling fan divided into two. One flowed through the cooling fin group to cool the cooling fin group, and the other flowed over the cooling fin group to cool the case. In addition, after the airflow flowing over the heat dissipation fin group cools the wall of the cabinet, it can flow into the heat dissipation fin group through the second air inlet of the heat dissipation fin group to enhance the heat dissipation efficiency of the heat dissipation fin group. Therefore, the design of the heat dissipation module not only improves its own heat dissipation performance, but also cools the wall of the cabinet that the user may touch to improve the user's operating experience.

Although the present disclosure has been disclosed as above in the form of implementation, it is not intended to limit the present disclosure. Any person skilled in the art can make various modifications and retouches without departing from the spirit and scope of the present disclosure. Therefore, the protection of the present disclosure is protected. The scope shall be determined by the scope of the attached patent application.

10‧‧‧ electronic device

100‧‧‧ Thermal Module

110‧‧‧Cooling Fin Set

112‧‧‧Heat fins

1122‧‧‧Body

1124‧‧‧Bend

1126‧‧‧Folding

112a‧‧‧First runner

112b‧‧‧Second runner

114‧‧‧First air inlet

116‧‧‧Second air inlet

120‧‧‧cooling fan

122‧‧‧air inlet

124‧‧‧outlet

130‧‧‧Isolation layer

132‧‧‧ opening

134‧‧‧ Covering Department

200‧‧‧ on the shell wall

300‧‧‧ lower case wall

D1, D2‧‧‧ distance

T1, T2, T3‧‧‧thickness

H1, H2‧‧‧ height

In order to make the above and other objects, features, advantages, and embodiments of the present disclosure more comprehensible, the description of the drawings is as follows: FIG. 1 is a diagram illustrating a heat dissipation module in an electronic device of an embodiment of the present disclosure Perspective view. Figure 2 is a three-dimensional exploded view showing the heat dissipation module in Figure 1. FIG. 3 is a partial cross-sectional view illustrating an electronic device according to an embodiment of the present disclosure, in which the heat dissipation module is a partial cross-sectional view taken along a direction indicated by a line segment 3-3 in FIG. 1.

Claims (9)

An electronic device includes: a casing wall; and a heat dissipation module including: a heat dissipation fin group adjacent to the casing wall, having a first air inlet and a second air inlet, and including a plurality of heat radiation Fin; a cooling fan having an air outlet, the air outlet is adjacent to the first air inlet, and is spaced apart from the second air inlet, wherein the first air inlet and the second air inlet are facing the air outlet The air inlet; and an isolation layer, at least part of which is located between the first air inlet and the second air inlet. The electronic device according to claim 1, wherein the second air inlet is closer to the casing wall than the first air inlet. The electronic device according to claim 1, wherein the isolation layer is disposed on the heat dissipation fins, is perpendicular to a side of the heat dissipation fins, and extends along an arrangement direction of the heat dissipation fins. The electronic device according to claim 1, wherein the isolation layer has an opening, and the second air inlet is an area exposed by the opening. The electronic device according to claim 1, wherein the isolation layer comprises an insulating, air-impermeable material. The electronic device according to claim 1, wherein an end of the heat dissipation fin group far from the air outlet has a thickness greater than a thickness of an end of the heat dissipation fin group adjacent to the air outlet. The electronic device according to claim 1, wherein an end of the heat dissipation fin group remote from the air outlet has a height that is greater than a height of an end of the heat dissipation fin group adjacent to the air outlet. The electronic device according to claim 1, wherein the isolation layer is spaced apart from the air outlet of the cooling fan by a distance. The electronic device according to claim 1, wherein a thickness of the air outlet of the heat dissipation fan is greater than a thickness of the first air inlet of the heat dissipation fin group.