US20110310561A1 - Television, radiating member, and electronic apparatus - Google Patents
Television, radiating member, and electronic apparatus Download PDFInfo
- Publication number
- US20110310561A1 US20110310561A1 US13/157,872 US201113157872A US2011310561A1 US 20110310561 A1 US20110310561 A1 US 20110310561A1 US 201113157872 A US201113157872 A US 201113157872A US 2011310561 A1 US2011310561 A1 US 2011310561A1
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- United States
- Prior art keywords
- heat
- heat sink
- generating component
- housing
- air
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20009—Modifications to facilitate cooling, ventilating, or heating using a gaseous coolant in electronic enclosures
- H05K7/20136—Forced ventilation, e.g. by fans
- H05K7/20154—Heat dissipaters coupled to components
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/20—Cooling means
- G06F1/203—Cooling means for portable computers, e.g. for laptops
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20954—Modifications to facilitate cooling, ventilating, or heating for display panels
- H05K7/20963—Heat transfer by conduction from internal heat source to heat radiating structure
Abstract
According to one embodiment, an electronic apparatus includes a housing, a heat-generating component in the housing, a first radiating portion in the housing thermally connected to the heat-generating component, a second radiating portion in the housing thermally connected to the heat-generating component, and a fan configured to blow air to the first radiating portion and the second radiating portion.
Description
- This application is based upon and claims the benefit of priority from Japanese Patent Application No. 2010-139797, filed Jun. 18, 2010, the entire contents of which are incorporated herein by reference.
- Embodiments described herein relate generally to a radiating member and radiation structures of a television and an electronic apparatus.
- Some electronic apparatuses have a radiation structure including a heat sink, a heat pipe, and a fan.
- A general architecture that implements the various features of the embodiments will now be described with reference to the drawings. The drawings and the associated descriptions are provided to illustrate the embodiments and not to limit the scope of the invention.
-
FIG. 1 is an exemplary perspective view illustrating an example of an electronic apparatus according to a first embodiment; -
FIG. 2 is an exemplary plan view illustrating an example of a lower surface of the electronic apparatus shown inFIG. 1 ; -
FIG. 3 is an exemplary perspective view illustrating an example of a side surface of the electronic apparatus shown inFIG. 1 ; -
FIG. 4 is an exemplary plan view illustrating an example of an internal structure of the electronic apparatus shown inFIG. 1 ; -
FIG. 5 is an exemplary perspective view illustrating an example of the internal structure of the electronic apparatus shown inFIG. 1 ; -
FIG. 6 is an exemplary perspective view illustrating an example of a radiation structure shown inFIG. 4 ; -
FIG. 7 is an exemplary plan view illustrating an example of the radiation structure shown inFIG. 4 ; -
FIG. 8 is an exemplary plan view illustrating an example of the radiation structure shown inFIG. 4 ; -
FIG. 9 is an exemplary cross-sectional view illustrating the radiation structure taken along the line F9-F9 ofFIG. 8 ; -
FIG. 10 is an exemplary cross-sectional view illustrating the radiation structure taken along the line F10-F10 ofFIG. 8 ; -
FIG. 11 is an exemplary perspective view illustrating an example of a television according to a second embodiment; -
FIG. 12 is an exemplary cross-sectional view schematically illustrating an example of an electronic apparatus according to a third embodiment; and -
FIG. 13 is an exemplary cross-sectional view schematically illustrating an example of an electronic apparatus according to a fourth embodiment. - Various embodiments will be described hereinafter with reference to the accompanying drawings.
- In general, according to one embodiment, an electronic apparatus comprises a housing, a heat-generating component in the housing, a first radiating portion in the housing thermally connected to the heat-generating component, a second radiating portion in the housing thermally connected to the heat-generating component, and a fan configured to blow air to the first radiating portion and the second radiating portion.
- Hereinafter, exemplary embodiments will be described with reference to the accompanying drawings.
-
FIGS. 1 to 10 show anelectronic apparatus 1 according to a first embodiment. Theelectronic apparatus 1 is, for example, a notebook personal computer. Electronic apparatuses to which the embodiment can be applied are not limited thereto. The embodiment can be widely applied to various kinds of electronic apparatuses, such as a television, a recording/reproducing apparatus, a PDA (Personal Digital Assistant), and a game machine. - As shown in
FIG. 1 , theelectronic apparatus 1 includes amain unit 2, adisplay unit 3, and hinges 4 a and 4 b. Themain unit 2 is an electronic apparatus main body provided with a main board. Themain unit 2 includes ahousing 5. Thehousing 5 has a flat box shape including anupper wall 6, alower wall 7, and acircumferential wall 8. - The
lower wall 7 faces a desk surface when theelectronic apparatus 1 is placed on a desk. Thelower wall 7 is substantially parallel to the desk surface. Theupper wall 6 is opposite to thelower wall 7 with a space therebetween and extends substantially in parallel (that is, substantially in a horizontal direction) to thelower wall 7. Akeyboard 9 is attached to theupper wall 6. Thecircumferential wall 8 rises with respect to thelower wall 7, and connects the edge portion of thelower wall 7 and the edge portion of theupper wall 6. - The
housing 5 includes abase 11 and acover 12. Thebase 11 includes thelower wall 7 and a part of thecircumferential wall 8. Thecover 12 includes theupper wall 6 and a part of thecircumferential wall 8. Thecover 12 is combined with thebase 11 to form thehousing 5. - The
housing 5 includes a rear end portion 13 (first end portion) to which thedisplay unit 3 is rotatably connected and a front end portion 14 (second end portion) provided opposite to therear end portion 13. Thecircumferential wall 8 includes afront wall 16, arear wall 17, aleft wall 18, and aright wall 19. Thefront wall 16 extends in the width direction (left-right direction) of thehousing 5 at thefront end portion 14. Therear wall 17 extends in the width direction of thehousing 5 at therear end portion 13. Theleft wall 18 and theright wall 19 extend in the depth direction (front-rear direction) of thehousing 5 and connect the end portions of thefront wall 16 and the end portions of therear wall 17. - The
display unit 3 is rotatably (openably) connected to therear end portion 13 of themain unit 2 by thehinges display unit 3 can be pivoted between a closed position where thedisplay unit 3 falls and covers themain unit 2 from the upper side and an opened position where thedisplay unit 3 rises with respect to themain unit 2. - As shown in
FIG. 1 , thedisplay unit 3 includes adisplay housing 21 and adisplay panel 22 in thedisplay housing 21. Adisplay screen 22 a of thedisplay panel 22 is exposed to the outside through anopening portion 21 a in the front wall of thedisplay housing 21. - As shown in
FIG. 1 , theupper wall 6 includes akeyboard mounting portion 24 to which thekeyboard 9 is attached and apalm rest 25. Thepalm rest 25 is in front of thekeyboard mounting portion 24 in the depth direction, that is, between thekeyboard mounting portion 24 and thefront wall 16. As shown inFIG. 9 , thekeyboard mounting portion 24 is recessed from thepalm rest 25 to the inside of thehousing 5. In this way, the height of the upper surface of thekeyboard 9 attached to thekeyboard mounting portion 24 is substantially equal to or slightly greater than that of the upper surface of thepalm rest 25. - As shown in
FIG. 2 , a plurality ofleg portions 26 is provided on thelower wall 7 of thehousing 5. Theleg portions 26 come into contact with the upper surface of the desk and thelower wall 7 of thehousing 5 is supported at a position separated from the upper surface of the desk. As shown inFIGS. 2 and 3 , thehousing 5 includesfirst inlets 31,second inlets 32, andthird inlets 33. Thefirst inlets 31, thesecond inlets 32, and thethird inlets 33 are provided so as to be concentrated on, for example, the front left portion of thehousing 5. - As shown in
FIG. 2 , thefirst inlets 31 and thethird inlets 33 are provided in thelower wall 7. Thefirst inlets 31 are below afan 35, which will be described below, so as to face thefan 35. Thethird inlets 33 are not below thefan 35 and are provided between thefirst inlets 31 and thefront wall 16. - As shown in
FIG. 3 , thesecond inlets 32 are provided in theleft wall 18. Thesecond inlets 32 are, for example, opening portions for exposing various kinds ofconnectors 36. Thesecond inlets 32 enable fresh air to flow into thehousing 5 through the gap between theconnector 36 and thehousing 5. - As shown in
FIG. 3 , thehousing 5 includesfirst outlets 38 andsecond outlets 39. Thefirst outlets 38 are provided in theleft wall 18 at therear end portion 13 of thehousing 5, and extend, for example, in the side of thekeyboard 9 and therear end portion 13. Thefirst outlets 38 face afirst heat sink 41, which will be described below from the side thereof. Thesecond outlets 39 are provided in thelower wall 7 at therear end portion 13 of thehousing 5 and face thefirst heat sink 41 from the lower side thereof. - As shown in
FIG. 7 , thehousing 5 includes acircuit board 43, aheat receiving portion 44, aheat pipe 45, thefirst heat sink 41, asecond heat sink 42, and the fan 35 (i.e., cooling fan). Thecircuit board 43 is, for example, the main board. As shown inFIG. 9 , thecircuit board 43 is provided below thekeyboard mounting portion 24. - As shown in
FIG. 7 , thecircuit board 43 includes a first heat-generatingcomponent 51 and a second heat-generatingcomponent 52. An example of the first heat-generatingcomponent 51 is a CPU (Central Processing Unit). The first heat-generatingcomponent 51 is a component that generates a relatively large amount of heat among the components of thecircuit board 43. An example of the second heat-generatingcomponent 52 is a power supply circuit component. The amount of heat generated from the second heat-generatingcomponent 52 is less than the amount of heat generated from the first heat-generatingcomponent 51. The heat-generating components on thecircuit board 43 are not limited thereto. The “heat-generating component” appropriately corresponds to various kinds of electronic components. The first heat-generatingcomponent 51 is closer to thefan 35 than the second heat-generatingcomponent 52. - A first direction D1 and a second direction D2 are defined as follows. As shown in
FIG. 7 , the first direction D1 is from thefan 35 to the first heat-generatingcomponent 51 and is a direction in which air is discharged from thefan 35. The second direction D2 is substantially orthogonal to the first direction D1 and is from thesecond heat sink 42 to thefirst heat sink 41. - In the specification, the vertical and horizontal directions are defined based on the normal position (the position shown in
FIG. 1 ) of theelectronic apparatus 1. Therefore, in the description usingFIGS. 2 , 4, 5, and 7 to 10 in which theelectronic apparatus 1 is reversed, the upper, lower, right, and left expressions are contrary to the FIGS. - As shown in
FIG. 7 , thefirst heat sink 41 is provided at therear end portion 13 of thehousing 5 and faces thefirst outlets 38 of thehousing 5. Thefirst heat sink 41 is an example of a first radiating portion. Thefirst heat sink 41 is, for example, a fin unit including a plurality of fins. Thefirst heat sink 41 is below thekeyboard mounting portion 24. In thefirst heat sink 41, the gap between the fins faces thefirst outlets 38. Theheat sink 41 does not overlap thecircuit board 43. Thecircuit board 43 includes a cut-outportion 54 provided so as to avoid thefirst heat sink 41. - As shown in
FIG. 7 , theheat receiving portion 44 is attached to the first heat-generatingcomponent 51. Theheat receiving portion 44 has a plate shape and faces the first heat-generatingcomponent 51. Theheat receiving portion 44 is thermally connected to the first heat-generatingcomponent 51 through, for example, heat transfer grease or a heat transfer sheet. - The
heat pipe 45 is an example of a heat transfer member. Theheat pipe 45 is attached to and thermally connected to theheat receiving portion 44. In this way, theheat pipe 45 is thermally connected to the first heat-generatingcomponent 51 through theheat receiving portion 44. Theheat pipe 45 extends from the first heat-generatingcomponent 51 to thefirst heat sink 41. - The
heat pipe 45 thermally connects the first heat-generatingcomponent 51 to thefirst heat sink 41 such that heat generated from the first heat-generatingcomponent 51 is transferred to thefirst heat sink 41. Thefirst heat sink 41 is arranged so as to deviate from the first heat-generatingcomponent 51 to the rear side of thehousing 5. In this way, it is possible to relatively reduce the total length of theheat pipe 45. - As shown in
FIG. 7 , thefan 35 is provided at thefront end portion 14 of thehousing 5 so as to be away from thefirst heat sink 41. Thefan 35 is disposed so as to face thefirst heat sink 41 and thesecond heat sink 42 with the first heat-generatingcomponent 51 interposed therebetween. - As shown in
FIG. 9 , thefan 35 is below thepalm rest 25. That is, thefan 35 is not below thekeyboard mounting portion 24 where the thickness of thehousing 5 is relatively small, and is below thepalm rest 25 where the thickness of thehousing 5 is relatively large. - The
fan 35 is a centrifugal fan and includes afan case 55 and animpeller 56 rotated in thefan case 55. Thefan case 55 includesfirst intakes 57,second intakes 58, and adischarge hole 59. - As shown in
FIG. 9 , thefan case 55 includes alower surface 55 a facing thelower wall 7, anupper surface 55 b opposite to thelower surface 55 a and facing theupper wall 6, and acircumferential surface 55 c facing thecircuit board 43. Thefirst intakes 57 are provided in thelower surface 55 a of thefan case 55 and face thefirst inlets 31 of thelower wall 7. Thesecond intakes 58 are provided in theupper surface 55 b of thefan case 55 and face thepalm rest 25. - The
discharge hole 59 is provided in thecircumferential surface 55 c. Thedischarge hole 59 is opened in the first direction D1 and faces the first heat-generatingcomponent 51. Thefan 35 draws air in thehousing 5 through thefirst intakes 57 and thesecond intakes 58 and discharges the air from thedischarge hole 59 to the first heat-generatingcomponent 51. Thefan 35 blows air to thefirst heat sink 41 and thesecond heat sink 42, which will be described below. - As shown in
FIG. 8 , theelectronic apparatus 1 includes awind shielding portion 61 that partitions a portion of the inner space of thehousing 5. A wind guide path 62 (air flow path) that guides air from thefan 35 to thefirst heat sink 41 through the first heat-generatingcomponent 51 is formed by thewind shielding portion 61. - The
wind shielding portion 61 is formed by, for example,electronic components circuit board 43 and some sealingmembers FIG. 7 , the sealingmembers FIGS. 7 and 8 , for convenience of description, the components forming thewind shielding portion 61 are hatched. In addition, thewind shielding portion 61 may be formed by ribs provided as a portion of thehousing 5 or other pieces made of a synthetic resin. - As shown in
FIG. 7 , amemory slot connector 63, anLCD connector 64, afirst power coil 65, and asecond power coil 66 are mounted on thecircuit board 43. Thememory slot connector 63 is an example of a board component and an example of a long connector. The term “long connector” means a connector with a side longer than one side of the chip of the first heat-generating component 51 (first heat-generating component) in the longitudinal direction. The “long connector” is not limited to thememory slot connector 63, but may be, for example, a docking connector or a connector for a television tuner. - As shown in
FIG. 7 , the longitudinal direction of thememory slot connector 63 is aligned with the discharge direction (first direction D1) of thefan 35. Amemory 68 is connected to thememory slot connector 63. Thememory 68 includes amemory board 68 b provided with a plurality ofmemory chips 68 a. Thememory slot connector 63 is adjacent to the first heat-generatingcomponent 51, with thememory 68 facing the opposite side of the first heat-generatingcomponent 51. - The
memory slot connector 63 includes a pair ofholders 69 that holds thememory 68 so as to make a gap between thememory 68 and thecircuit board 43, and aterminal portion 70 fixed to thecircuit board 43. Theterminal portion 70 closely adheres to thecircuit board 43 such that there is no gap between theterminal portion 70 and thecircuit board 43. - As shown in
FIG. 10 , thememory slot connector 63 is a second connector of a so-called two-stage memory accommodating portion. That is, anothermemory slot connector 63 a is between thememory 68 attached to thememory slot connector 63 and thecircuit board 43. In other words, theterminal portion 70 of thememory slot connector 63 is relatively tall. - As shown in
FIG. 7 , thememory slot connector 63 is arranged such that theterminal portion 70 is closer to the first heat-generatingcomponent 51 than theholders 69. A part of thememory slot connector 63 faces the first heat-generatingcomponent 51. Thememory slot connector 63 is in parallel to the first heat-generatingcomponent 51. Thememory slot connector 63 extends from the side of the first heat-generatingcomponent 51 to the side of the second heat-generatingcomponent 52. Thememory slot connector 63 faces a part of thefirst heat sink 41 and thesecond power coil 66 in the second direction D2. - As shown in
FIG. 7 , thefirst power coil 65 and theLCD connector 64 are between the end portion of thememory slot connector 63 and the end portion of thefirst heat sink 41. Each of thefirst power coil 65 and theLCD connector 64 is an example of the board component. Thefirst power coil 65 and theLCD connector 64 are arranged in the second direction D2. - The
first power coil 65 and theLCD connector 64 face thedischarge hole 59 of thefan 35 in the first direction Dl. That is, air discharged from thedischarge hole 59 of thefan 35 passes through the first heat-generatingcomponent 51 and the second heat-generatingcomponent 52, collides with thefirst power coil 65 and theLCD connector 64, and flows to thefirst heat sink 41. - The
second power coil 66 is opposite to thememory slot connector 63 with the first heat-generatingcomponent 51 interposed therebetween. The gap between thesecond power coil 66 and thememory slot connector 63 is substantially equal to the width of thedischarge hole 59 of thefan 35. - The
memory slot connector 63, thefirst power coil 65, theLCD connector 64, and thesecond power coil 66 form thewind guide path 62 with a substantially L shape through which cooling air flows from thefan 35 to the first heat sink 47, in cooperation with thelower wall 7 of thehousing 5 and theleft wall 18 of thehousing 5. - That is, each of the
memory slot connector 63, thefirst power coil 65, theLCD connector 64, and thesecond power coil 66 forms at least a portion of the wall of thewind guide path 62. In other words, each of thememory slot connector 63, thefirst power coil 65, theLCD connector 64, and thesecond power coil 66 serves as a wall that guides cooling air from thefan 35 to the first heat sink 47. - Each of the sealing
members members - As shown in
FIGS. 8 and 10 , the first sealingmember 71 is between theterminal portion 70 of thememory slot connector 63 and the inner surface of thehousing 5. Thefirst sealing member 71 extends in the first direction D1. Thefirst sealing member 71 has substantially the same length as theterminal portion 70 of thememory slot connector 63. Thefirst sealing member 71 is compressed in the gap between thememory slot connector 63 and the inner surface of thehousing 5, thereby air-tightly sealing the gap. - The
second sealing member 72 is between thefirst power coil 65 and the inner surface of thehousing 5. For example, the second sealingmember 72 extends from the end portion of thememory slot connector 63 to the end portion of theLCD connector 64. Thesecond sealing member 72 is compressed in the gap between thefirst power coil 65 and the inner surface of thehousing 5, thereby air-tightly sealing the gap. For example, the second sealingmember 72 may extend to the end portion of thefirst heat sink 41. Alternatively, the second sealingmember 72 may extend between theLCD connector 64 and the inner surface of thehousing 5. - As shown in
FIG. 8 , the third sealingmember 73 is between thesecond power coil 66 and the inner surface of thehousing 5. For example, the third sealingmember 73 extends from the end portion of thefan 35 to the end portion of thefirst heat sink 41. Thethird sealing member 73 is compressed in the gap between thesecond power coil 66 and the inner surface of thehousing 5, thereby air-tightly sealing the gap. In addition, for example, the third sealingmember 73 may be only in a portion of the space between thefan 35 and thefirst heat sink 41. - As shown in
FIGS. 8 and 10 , the fourth sealingmember 74 is between thefirst heat sink 41 and the inner surface of thehousing 5. Thefourth sealing member 74 extends over the entire length of thefirst heat sink 41 in the longitudinal direction (first direction D1). Thefourth sealing member 74 is compressed in the gap between thefirst heat sink 41 and the inner surface of thehousing 5, thereby air-tightly sealing the gap. - In this way, cooling air reaching the
first heat sink 41 is exhausted to the outside through the gap between the fins of thefirst heat sink 41 without passing through the gap between thefirst heat sink 41 and the inner surface of thehousing 5. According to the above-mentioned structure, air discharged from thefan 35 passes through the first heat-generatingcomponent 51 and flows to thefirst heat sink 41. That is, the air discharged from thefan 35 flows through a substantially L-shaped flow path. - As shown in
FIG. 8 , thesecond heat sink 42 is in thewind guide path 62. Thesecond heat sink 42 is an example of a second radiating portion. Thesecond heat sink 42 is between the first heat-generatingcomponent 51 and thefirst heat sink 41 in the flow path of the air from thefan 35. That is, the first heat-generatingcomponent 51 is between thefan 35 and thesecond heat sink 42. - The
second heat sink 42 is formed by a flat metal plate. Thesecond heat sink 42 is arranged so as to overlap thecircuit board 43 and is substantially parallel to thecircuit board 43. That is, thesecond heat sink 42 is in the region of thecircuit board 43. - As shown in
FIG. 6 , thesecond heat sink 42 is connected to theheat receiving portion 44. Thesecond heat sink 42 and theheat receiving portion 44 are integrally formed of, for example, a metal plate. Thesecond heat sink 42 is thermally connected to the first heat-generatingcomponent 51 through theheat receiving portion 44. That is, a radiatingmember 81 including theheat receiving portion 44 and the radiating portion (second heat sink 42) integrally formed with each other is attached to the first heat-generatingcomponent 51. - As shown in
FIG. 9 , thesecond heat sink 42 extends from theheat receiving portion 44 to the rear side (the downstream side of cooling air). Thesecond heat sink 42 covers the second heat-generatingcomponent 52. Thesecond heat sink 42 has a substantially rectangular shape and is substantially parallel to thememory slot connector 63 and thefirst heat sink 41. Thesecond heat sink 42 faces thefirst heat sink 41 in the second direction D2. Thesecond heat sink 42 is between a portion of thememory slot connector 63 and thefirst heat sink 41. - As shown in
FIG. 9 , astep portion 82 is provided between thesecond heat sink 42 and theheat receiving portion 44, and thesecond heat sink 42 is further away from thecircuit board 43 than theheat receiving portion 44. In this way, a space S through which air flows is formed between thesecond heat sink 42 and thecircuit board 43. - The height of the
step portion 82 between thesecond heat sink 42 and theheat receiving portion 44 is more than the thickness of theheat pipe 45. In this way, thesecond heat sink 42 is further away from thecircuit board 43 than theheat pipe 45. Therefore, air from thefan 35 is more likely to reach thesecond heat sink 42 without being hindered by theheat pipe 45. InFIG. 9 , for convenience of description, a pressingmember 91 is omitted. - As shown in
FIG. 9 , thesecond heat sink 42 includes afirst surface 84 and asecond surface 85. Thefirst surface 84 faces thecircuit board 43. Thesecond surface 85 is opposite to thefirst surface 84 and faces the inner surface of thehousing 5. A plurality ofprojections 86 is provided on thesecond surface 85. Theprojections 86 are arranged in parallel to the direction (first direction D1) in which thefan 35 blows air and a direction (second direction D2) substantially orthogonal to the first direction D1. - As shown in
FIG. 6 , theprojections 86 are formed by bending a portion of the plate-shapedsecond heat sink 42 by, for example, pressing so as to protrude. Theprojection 86 is formed in a mountain shape and extends in the direction in which thefan 35 blows air. Therefore, theprojection 86 includes a throughhole 87 which extends in the direction in which thefan 35 blows air and through which the air flows. The throughhole 87 passes through theprojection 86 in the direction in which thefan 35 blows air. - The through
hole 87 also passes through thesecond heat sink 42 from thefirst surface 84 to thesecond surface 85 and faces thecircuit board 43. The throughhole 87 is provided in the region in which theprojection 86 is formed by forming theprojection 86 so as to protrude in a mountain shape. Air from thefan 35 can flow into the space S between thesecond heat sink 42 and thecircuit board 43 through the through holes 87. - As shown in
FIG. 8 , theprojection 86 is not provided at the end portion (corner portion) of thesecond heat sink 42 that is opposite to the first heat-generatingcomponent 51 and is close to thefirst heat sink 41, and the end portion of thesecond heat sink 42 is flat. Therefore, air passing through thesecond heat sink 42 can smoothly flow toward thefirst heat sink 41. - As shown in
FIG. 7 , the pressingmember 91 is attached to theheat receiving portion 44. The pressingmember 91 includes apressing portion 92 facing theheat pipe 45, fixing portions 93 (first fixing portion) fixed to thecircuit board 43, and fixing portions 94 (second fixing portion) fixed to theheat receiving portion 44. The pressingmember 91 functions as a leaf spring and presses theheat receiving portion 44 against the first heat-generatingcomponent 51. In this way, the thermal conductivity between theheat receiving portion 44 and the first heat-generatingcomponent 51 is improved. - The fixing
portions 93 of the pressingmember 91 extend over theheat receiving portion 44 in the first direction Dl. Thesecond heat sink 42 includes a cut-outportion 95 which is formed in thesecond heat sink 42 from thefirst surface 84 to thesecond surface 85 and into which one of the fixingportions 93 of the pressingmember 91 is inserted. The fixingportion 93 of the pressingmember 91 is attached to thecircuit board 43 through the cut-outportion 95. The cut-outportion 95 is formed across thesecond heat sink 42, thestep portion 82, and theheat receiving portion 44. The cut-outportion 95 is provided at the upstream end portion of thesecond heat sink 42 and faces thedischarge hole 59 of thefan 35. - Air passing through the
heat receiving portion 44 can flow from the cut-outportion 95 into the space S between thesecond heat sink 42 and thecircuit board 43. The cut-out portion is formed by cutting out an end portion of a component, but the embodiment is not limited thereto. For example, the “cut-out portion” also includes an opening portion (through hole) at the center of a component, as shown inFIG. 6 . As shown inFIG. 8 , thesecond heat sink 42 includes another cut-outportion 97 provided so as to avoid aconnector 96. - Next, the operation of the
electronic apparatus 1 will be described. - When the
electronic apparatus 1 is used, heat is generated from the first heat-generatingcomponent 51 and the second heat-generatingcomponent 52. A part of the heat generated from the first heat-generatingcomponent 51 is transferred to thefirst heat sink 41 through theheat receiving portion 44 and theheat pipe 45. In addition, another part of the heat generated from the first heat-generatingcomponent 51 is transferred to thesecond heat sink 42 through theheat receiving portion 44. - The
fan 35 draws fresh air from the outside of thehousing 5 through thefirst inlets 31, thesecond inlets 32, and thethird inlets 33 of thehousing 5. Thefan 35 discharges the drawn relatively cold air (air that is not warm) to the first heat-generatingcomponent 51. - The air discharged to the first heat-generating
component 51 takes heat from the first heat-generatingcomponent 51 while flowing around the first heat-generatingcomponent 51. The air passing through the first heat-generatingcomponent 51 flows to thesecond heat sink 42. Then, the air takes heat from thesecond heat sink 42 while passing around thesecond heat sink 42. - In this case, a part of the air flowing to the
second heat sink 42 flows from the throughholes 87 or the cut-outportion 95 of thesecond heat sink 42 to the space S between thesecond heat sink 42 and thecircuit board 43. The air flowing to the space S takes heat from the second heat-generatingcomponent 52 while passing around the second heat-generatingcomponent 52. - The air passing through the
second heat sink 42 flows to thefirst heat sink 41 by thewind guide path 62. The air takes heat from thefirst heat sink 41 while passing through thefirst heat sink 41. The air passing through thefirst heat sink 41 is discharged to the outside of thehousing 5 through thefirst outlets 38 and thesecond outlets 39. - According to this structure, it is possible to improve heat radiation efficiency. That is, when two
heat sinks component 51, a plurality of heat radiation paths is formed with respect to one heat-generatingcomponent 51. Therefore, it is possible to effectively cool the heat-generatingcomponent 51. - That is, it is possible to radiate heat from the heat-generating
component 51 using thefirst heat sink 41 and the additionalsecond heat sink 42. Therefore, it is possible to achieve high heat radiation efficiency. When the twoheat sinks fan 35, it is not necessary to increase the number of fans, and thus it is possible to reduce the size and cost of an electronic apparatus. - In this embodiment, the first heat-generating
component 51 is between thesecond heat sink 42 and thefan 35 in the flow path of the air from thefan 35. That is, the first heat-generatingcomponent 51 is provided on the upstream side of thefirst heat sink 41 and thesecond heat sink 42 in the flow path of the air from thefan 35. - According to this structure, relatively cold air not heated by the
first heat sink 41 or thesecond heat sink 42 is preferentially supplied to the first heat-generatingcomponent 51 that may need to be cooled first. According to this structure, it is possible to accelerate the cooling of the first heat-generatingcomponent 51, as compared to the structure in which air passing through thesecond heat sink 42 is supplied to the first heat-generatingcomponent 51. Therefore, it is possible to improve the overall heat radiation efficiency of theelectronic apparatus 1. - In this embodiment, the
first heat sink 41 is thermally connected to the first heat-generatingcomponent 51 by theheat pipe 45 and faces theoutlets 38 of thehousing 5. Thesecond heat sink 42 is between the first heat-generatingcomponent 51 and thefirst heat sink 41. That is, thesecond heat sink 42 is in the space between thefirst heat sink 41 adjacent to theoutlets 38 and the first heat-generatingcomponent 51. Therefore, it is possible to effectively use the space. The use of the arrangement structure makes it possible to reduce the size of theelectronic apparatus 1 even when thesecond heat sink 42 is provided. - In this embodiment, the
first heat sink 41 is a fin unit and thesecond heat sink 42 has a plate shape. The plate-shapedsecond heat sink 42 can be arranged so as to overlap other units or components. Therefore, it is possible to reduce the size of theelectronic apparatus 1 even when thesecond heat sink 42 is provided. When thesecond heat sink 42 is arranged so as to overlap thecircuit board 43, it is possible to arrange thesecond heat sink 42 without limiting the size of thecircuit board 43. - Flexibility in the shape of the
second heat sink 42 is higher than that in the shape of the fin unit and thesecond heat sink 42 may include a cut-out portion. For example, thesecond heat sink 42 includes the cut-outportion 97 provided so as to avoid theconnector 96. The mounting of thesecond heat sink 42 is less limited than that of the fin unit, and thesecond heat sink 42 can be in the extra space. - In this embodiment, the
second heat sink 42 and theheat receiving portion 44 are integrally formed of a metal plate. According to this structure, it is possible to ensure high heat transfer efficiency between thesecond heat sink 42 and theheat receiving portion 44 and thus accelerate the radiation of heat from the first heat-generatingcomponent 51. In addition, since thesecond heat sink 42 is formed integrally with theheat receiving portion 44, it is possible to reduce the number of components or manufacturing costs. - In this embodiment, the
second heat sink 42 is provided on the upstream side of thefirst heat sink 41. Air from thefan 35 flows through thesecond heat sink 42 and is then supplied to thefirst heat sink 41. Therefore, a part of dust included in air adheres to thesecond heat sink 42 before it reaches thefirst heat sink 41. - In other wards, the provision of the
second heat sink 42 makes it possible to reduce the amount of dust adhering to thefirst heat sink 41. It is easier to clean the plate-shapedsecond heat sink 42 than thefirst heat sink 41, which is a fin unit. Therefore, it is possible to improve the overall cleaning efficiency of an electronic apparatus. - In this embodiment, the
second heat sink 42 includes a plurality ofprojections 86. Therefore, the radiation area of thesecond heat sink 42 increases and it is possible to further improve heat radiation efficiency. When theprojection 86 includes the throughhole 87 extending in the direction in which thefan 35 blows air, the flow of cooling air is less likely to be disturbed, and it is possible to further increase the radiation area of thesecond heat sink 42. - In this embodiment, the
projections 86 are arranged in the direction in which thefan 35 blows air. According to this structure, the flow of air from thefan 35 is adjusted by theprojections 86 such that air is guided to thefirst heat sink 41 with little disturbance. Therefore, air is less likely to remain or flow backward in thehousing 5, and it is possible to improve heat radiation efficiency. - When the through
holes 87 pass through the rear surface (first surface 84) of thesecond heat sink 42, air can flow between thesecond heat sink 42 and thecircuit board 43 through the through holes 87. That is, the rear surface of thesecond heat sink 42 is directly exposed to cooling air and the heat radiation efficiency of thesecond heat sink 42 is further improved. - Since air flows between the
second heat sink 42 and thecircuit board 43, it is possible to accelerate the cooling of electronic components (for example, the second heat-generating component 52) on thecircuit board 43. That is, the arrangement of thesecond heat sink 42 makes it possible to supply cooling air to components covered with thesecond heat sink 42. - In this embodiment, the
second heat sink 42 is further away from thecircuit board 43 than theheat receiving portion 44. In this way, it is possible to further increase the size of the space S between thesecond heat sink 42 and thecircuit board 43 through which air flows. Therefore, it is possible to accelerate the cooling of electronic components on thecircuit board 43. - In this embodiment, the
second heat sink 42 includes the cut-outportion 95. The cut-outportion 95 passes through thesecond heat sink 42. The fixingportion 93 of the pressingmember 91 is inserted into the cut-out portion. Air from thefan 35 can flow to the space between thesecond heat sink 42 and thecircuit board 43 through the cut-outportion 95. In this way, similarly, it is possible to accelerate the cooling of electronic components on thecircuit board 43. - In this embodiment, the electronic apparatus includes the
heat receiving portion 44 facing the heat-generatingcomponent 51, and thesecond heat sink 42 including theprojections 86, and theheat receiving portion 44 and thesecond heat sink 42 are integrally formed with each other as the radiatingmember 81 which is a metal plate. According to the radiatingmember 81, it is possible to ensure high heat transfer efficiency between theheat receiving portion 44 and thesecond heat sink 42 and improve the heat radiation efficiency of thesecond heat sink 42. In addition, when theheat receiving portion 44 is formed integrally with thesecond heat sink 42, it is possible to reduce manufacturing costs. - Next, a
television 101 according to a second embodiment will be described with reference toFIG. 11 . In the second embodiment, components having the same or similar functions as those of the first embodiment are denoted by the same reference numerals and a description thereof will not be repeated. In addition, structures other than the following structures are the same as those in the first embodiment. - As shown in
FIG. 11 , thetelevision 101 includes ahousing 5 and adisplay panel 22 in thehousing 5. The same components as those in the first embodiment are in thehousing 5.FIG. 11 shows only some components, but, for example, acircuit board 43, a first heat-generatingcomponent 51, a second heat-generatingcomponent 52, afan 35, afirst heat sink 41, asecond heat sink 42, and aheat receiving portion 44 are provided in thehousing 5 substantially in the same structure and with the same arrangement relationship as those in the first embodiment. - According to this structure, similar to the first embodiment, it is possible to improve heat radiation efficiency. In addition, the
television 101 may have substantially the same structure as those in the following third and fourth embodiments. - Next, an
electronic apparatus 1 according to a third embodiment will be described with reference toFIG. 12 . In the third embodiment, components having the same or similar functions as those of the first embodiment are denoted by the same reference numerals and a description thereof will not be repeated. In addition, structures other than the following structures are the same as those in the first embodiment. - As shown in
FIG. 12 , ahousing 5 includes a heat-generatingcomponent 51. Afirst heat sink 41 facesoutlets 38 of thehousing 5. The heat-generatingcomponent 51 is between first andsecond heat sinks fan 35. Thefan 35 discharges air to the heat-generatingcomponent 51. The flow path of air from thefan 35 is straight from thefan 35 to theoutlets 38 of thehousing 5. - The
second heat sink 42 is between the heat-generatingcomponent 51 and thefirst heat sink 41 in the flow path of air from thefan 35. Each of thefirst heat sink 41 and thesecond heat sink 42 is, for example, a fin unit. Thefirst heat sink 41 is thermally connected to the heat-generatingcomponent 51 by afirst heat pipe 45. Thesecond heat sink 42 is thermally connected to the heat-generatingcomponent 51 by asecond heat pipe 111. - According to this structure, similar to the first embodiment, it is possible to improve heat radiation efficiency.
- Next, an
electronic apparatus 1 according to a fourth embodiment will be described with reference toFIG. 13 . In the fourth embodiment, components having the same or similar functions as those of the first embodiment are denoted by the same reference numerals and a description thereof will not be repeated. In addition, structures other than the following structures are the same as those in the third embodiment. - As shown in
FIG. 13 , afan 35 is between a heat-generatingcomponent 51 and asecond heat sink 42. According to this structure, similar to the first embodiment, it is possible to improve heat radiation efficiency. - The embodiments are not limited to the above-described embodiments, and the components of the above-described embodiments may be changed without departing from the scope and spirit of the embodiment. In addition, a plurality of components according to the above-described embodiments may be appropriately combined with each other to form various structures. For example, some of the components according to the above-described embodiments may be removed. The components according to different embodiments may be appropriately combined with each other.
- For example, in the first embodiment and the second embodiment, the
second heat sink 42 may be thermally connected to the first heat-generatingcomponent 51 by a heat pipe. Theheat receiving portion 44 and thesecond heat sink 42 may not be integrated with each other. For example, the number ofprojections 86, throughholes 87, and cut-outportions 95 of thesecond heat sink 42, or the shape or structure thereof is not particularly limited. Theprojections 86, the throughholes 87, and the cut-outportions 95 may be appropriately omitted. - The
first heat sink 41 may not face theoutlets 38 of thehousing 5. Thefirst heat sink 41 may not be thermally connected to the first heat-generatingcomponent 51 by theheat pipe 45. Thefirst heat sink 41 may be formed integrally with theheat receiving portion 44. Thefirst heat sink 41 may not be a fin unit, but may be formed in, for example, a plate shape. - While certain embodiments have been described, these embodiments have been presented by way of example only, and are not intended to limit the scope of the inventions. Indeed, the novel embodiments described herein may be embodied in a variety of other forms; furthermore, various omissions, substitutions and changes in the form of the embodiments described herein may be made without departing from the spirit of the inventions. The accompanying claims and their equivalents are intended to cover such forms or modifications as would fall within the scope and spirit of the inventions.
Claims (13)
1. A television comprising:
a housing comprising an outlet;
a heat-generating component in the housing;
a fan configured to discharge air to the heat-generating component;
a first heat sink having a surface facing the outlet;
a heat transfer member configured to thermally connect the heat-generating component to the first heat sink; and
a second heat sink between the heat-generating component and the first heat sink in a flow path of the air from the fan and thermally connected to the heat-generating component.
2. The television of claim 1 ,
wherein the second heat sink has a plate shape.
3. The television of claim 1 , further comprising:
a metal plate comprising the second heat skink and a heat-receiving portion facing the heat-generating component.
4. The television of claim 1 ,
wherein the second heat sink comprises a plurality of projections.
5. The television of claim 4 ,
wherein at least some of the projections comprise a hole through which the air can flow.
6. The television of claim 5 , further comprising:
a circuit board comprising the heat-generating component,
wherein at least a portion of the second heat sink is disposed over the circuit board.
7. The television of claim 6 ,
wherein the second heat sink comprises a first surface facing the circuit board and a second surface opposite the first surface, and
the holes pass through the second heat sink from the first surface to the second surface.
8. The television of claim 7 , comprising a gap between the second heat sink and the circuit board, through which the air can flow,
wherein the second heat sink is further away from the circuit board than the heat receiving portion.
9. The television of claim 7 , further comprising:
a pressing member comprising a first portion facing the heat pipe and a second portion fixed to the circuit board,
wherein the second heat sink comprises a cut-out portion passing through the second heat sink from the first surface to the second surface,
and wherein the second portion of the pressing member is disposed in the cut-out portion.
10. A radiating member comprising:
a metal plate comprising
a heat-receiving portion configured to face a heat-generating component of a circuit board; and
a radiating portion comprising a projection.
11. The radiating member of claim 10 , wherein the projection comprises a hole through which air can flow.
12. An electronic apparatus comprising:
a housing;
a heat-generating component in the housing;
a first radiating portion in the housing thermally connected to the heat-generating component;
a second radiating portion in the housing thermally connected to the heat-generating component; and
a fan configured to blow air to the first radiating portion and the second radiating portion.
13. The electronic apparatus of claim 12 ,
wherein the heat-generating component is between the second radiating portion and the fan in a flow path of the air, and
the fan is configured to discharge the air to the heat-generating component.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US13/875,057 US9277672B2 (en) | 2010-06-18 | 2013-05-01 | Television, radiating member, and electronic apparatus |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
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JP2010-139797 | 2010-06-18 | ||
JP2010139797A JP4929377B2 (en) | 2010-06-18 | 2010-06-18 | Television receiver and electronic device |
Related Child Applications (1)
Application Number | Title | Priority Date | Filing Date |
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US13/875,057 Continuation US9277672B2 (en) | 2010-06-18 | 2013-05-01 | Television, radiating member, and electronic apparatus |
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US20110310561A1 true US20110310561A1 (en) | 2011-12-22 |
Family
ID=45328481
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
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US13/157,872 Abandoned US20110310561A1 (en) | 2010-06-18 | 2011-06-10 | Television, radiating member, and electronic apparatus |
US13/875,057 Expired - Fee Related US9277672B2 (en) | 2010-06-18 | 2013-05-01 | Television, radiating member, and electronic apparatus |
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US13/875,057 Expired - Fee Related US9277672B2 (en) | 2010-06-18 | 2013-05-01 | Television, radiating member, and electronic apparatus |
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US (2) | US20110310561A1 (en) |
JP (1) | JP4929377B2 (en) |
Cited By (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20110279977A1 (en) * | 2010-05-11 | 2011-11-17 | Kabushiki Kaisha Toshiba | Display device and electronic apparatus |
US20130235525A1 (en) * | 2010-06-18 | 2013-09-12 | Kabushiki Kaisha Toshiba | Television, radiating member, and electronic apparatus |
US20130286292A1 (en) * | 2012-04-27 | 2013-10-31 | Kabushiki Kaisha Toshiba | Television receiver and electronic apparatus |
US20130286297A1 (en) * | 2012-04-27 | 2013-10-31 | Kabushiki Kaisha Toshiba | Television receiver and electronic device |
US20150005043A1 (en) * | 2012-01-16 | 2015-01-01 | Nec Casio Modile Communications, Ltd. | Portable terminal device |
US20150062818A1 (en) * | 2013-08-30 | 2015-03-05 | Kabushiki Kaisha Toshiba | Electronic apparatus |
US20150084490A1 (en) * | 2013-09-25 | 2015-03-26 | Kabushiki Kaisha Toshiba | Electronic apparatus |
US20150282387A1 (en) * | 2014-03-27 | 2015-10-01 | Samsung Electronics Co., Ltd. | Shield can assembly and electronic device having the same |
US20160157383A1 (en) * | 2014-11-27 | 2016-06-02 | Inventec (Pudong) Technology Corporation | Signal input device |
US10969838B2 (en) * | 2019-09-05 | 2021-04-06 | Dell Products, L.P. | Hybrid cooling system with multiple outlet blowers |
US20220253113A1 (en) * | 2021-02-10 | 2022-08-11 | Dell Products L.P. | Cooling system for an information handling system |
US11503740B2 (en) * | 2021-02-10 | 2022-11-15 | Dell Products L.P. | Cooling system for an information handling system |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN106025869B (en) * | 2016-07-25 | 2018-10-09 | 国电南瑞科技股份有限公司 | A kind of second power equipment of site installation convenient for heat dissipation |
JP7459631B2 (en) | 2020-04-10 | 2024-04-02 | セイコーエプソン株式会社 | Light source device and projector |
Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6430042B1 (en) * | 2000-03-17 | 2002-08-06 | Hitachi, Ltd. | Electronic apparatus having means for cooling a semiconductor element mounted therein |
US7365989B2 (en) * | 2006-03-08 | 2008-04-29 | Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. | Heat dissipating device for computer add-on cards |
US20090103262A1 (en) * | 2007-10-19 | 2009-04-23 | Kabushiki Kaisha Toshiba | Electronic apparatus |
US20090135563A1 (en) * | 2007-11-27 | 2009-05-28 | Sony Corporation | Heat radiation structure of electronic component and display device |
US20090168331A1 (en) * | 2006-05-19 | 2009-07-02 | Kabushiki Kaisha Toshiba | Electronic apparatus |
US20100039772A1 (en) * | 2003-10-30 | 2010-02-18 | Fujitsu Limited | Cooling device and electronic device |
US7986520B2 (en) * | 2009-06-22 | 2011-07-26 | Kabushiki Kaisha Toshiba | Electronic device |
Family Cites Families (19)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH01133338A (en) * | 1987-11-18 | 1989-05-25 | Mitsubishi Electric Corp | Heat sink |
JP3164518B2 (en) * | 1995-12-21 | 2001-05-08 | 古河電気工業株式会社 | Flat heat pipe |
JP2000214958A (en) | 1999-01-22 | 2000-08-04 | Toshiba Corp | Electronic apparatus |
JP2000216575A (en) | 1999-01-22 | 2000-08-04 | Toshiba Corp | Cooler and electronic apparatus incorporating it |
US6352104B1 (en) * | 1999-10-19 | 2002-03-05 | International Business Machines Corporation | Heat sink with enhanced heat spreading and compliant interface for better heat transfer |
US7128131B2 (en) * | 2001-07-31 | 2006-10-31 | The Furukawa Electric Co., Ltd. | Heat sink for electronic devices and heat dissipating method |
JP2004039861A (en) * | 2002-07-03 | 2004-02-05 | Fujikura Ltd | Cooler for electronic element |
TW545104B (en) * | 2002-11-28 | 2003-08-01 | Quanta Comp Inc | Cooling apparatus |
KR100804525B1 (en) * | 2005-03-24 | 2008-02-20 | 삼성에스디아이 주식회사 | Heat radiation member for integrated circuit chip and display module comprising the same |
JP4908355B2 (en) * | 2007-09-06 | 2012-04-04 | 株式会社東芝 | Electronic equipment and daughter board |
JP2009099740A (en) * | 2007-10-16 | 2009-05-07 | Furukawa Electric Co Ltd:The | Cooling device for housing |
JP2009128947A (en) * | 2007-11-19 | 2009-06-11 | Toshiba Corp | Electronic apparatus |
JP2009169752A (en) * | 2008-01-17 | 2009-07-30 | Toshiba Corp | Electronic equipment |
JP4357569B2 (en) * | 2008-01-31 | 2009-11-04 | 株式会社東芝 | Electronics |
CN101605442B (en) * | 2008-06-13 | 2013-01-23 | 富准精密工业(深圳)有限公司 | Heat dissipation device |
JP5061068B2 (en) | 2008-09-02 | 2012-10-31 | レノボ・シンガポール・プライベート・リミテッド | Electronics |
JP2010087044A (en) * | 2008-09-29 | 2010-04-15 | Toshiba Corp | Electronic apparatus |
JP2010091715A (en) * | 2008-10-07 | 2010-04-22 | Panasonic Corp | Display device |
JP4929377B2 (en) * | 2010-06-18 | 2012-05-09 | 株式会社東芝 | Television receiver and electronic device |
-
2010
- 2010-06-18 JP JP2010139797A patent/JP4929377B2/en active Active
-
2011
- 2011-06-10 US US13/157,872 patent/US20110310561A1/en not_active Abandoned
-
2013
- 2013-05-01 US US13/875,057 patent/US9277672B2/en not_active Expired - Fee Related
Patent Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6430042B1 (en) * | 2000-03-17 | 2002-08-06 | Hitachi, Ltd. | Electronic apparatus having means for cooling a semiconductor element mounted therein |
US20100039772A1 (en) * | 2003-10-30 | 2010-02-18 | Fujitsu Limited | Cooling device and electronic device |
US7365989B2 (en) * | 2006-03-08 | 2008-04-29 | Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. | Heat dissipating device for computer add-on cards |
US20090168331A1 (en) * | 2006-05-19 | 2009-07-02 | Kabushiki Kaisha Toshiba | Electronic apparatus |
US20090103262A1 (en) * | 2007-10-19 | 2009-04-23 | Kabushiki Kaisha Toshiba | Electronic apparatus |
US20090135563A1 (en) * | 2007-11-27 | 2009-05-28 | Sony Corporation | Heat radiation structure of electronic component and display device |
US7986520B2 (en) * | 2009-06-22 | 2011-07-26 | Kabushiki Kaisha Toshiba | Electronic device |
Cited By (18)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US8422224B2 (en) * | 2010-05-11 | 2013-04-16 | Kabushiki Kaisha Toshiba | Display device and electronic apparatus |
US20110279977A1 (en) * | 2010-05-11 | 2011-11-17 | Kabushiki Kaisha Toshiba | Display device and electronic apparatus |
US20130235525A1 (en) * | 2010-06-18 | 2013-09-12 | Kabushiki Kaisha Toshiba | Television, radiating member, and electronic apparatus |
US9277672B2 (en) * | 2010-06-18 | 2016-03-01 | Kabushiki Kaisha Toshiba | Television, radiating member, and electronic apparatus |
US20150005043A1 (en) * | 2012-01-16 | 2015-01-01 | Nec Casio Modile Communications, Ltd. | Portable terminal device |
US20130286292A1 (en) * | 2012-04-27 | 2013-10-31 | Kabushiki Kaisha Toshiba | Television receiver and electronic apparatus |
US20130286297A1 (en) * | 2012-04-27 | 2013-10-31 | Kabushiki Kaisha Toshiba | Television receiver and electronic device |
US9304558B2 (en) * | 2013-08-30 | 2016-04-05 | Kabushiki Kaisha Toshiba | Electronic apparatus |
US20150062818A1 (en) * | 2013-08-30 | 2015-03-05 | Kabushiki Kaisha Toshiba | Electronic apparatus |
US20150084490A1 (en) * | 2013-09-25 | 2015-03-26 | Kabushiki Kaisha Toshiba | Electronic apparatus |
US20150282387A1 (en) * | 2014-03-27 | 2015-10-01 | Samsung Electronics Co., Ltd. | Shield can assembly and electronic device having the same |
US10010012B2 (en) * | 2014-03-27 | 2018-06-26 | Samsung Electronics Co., Ltd. | Shield can assembly and electronic device having the same |
US20160157383A1 (en) * | 2014-11-27 | 2016-06-02 | Inventec (Pudong) Technology Corporation | Signal input device |
US9600043B2 (en) * | 2014-11-27 | 2017-03-21 | Inventec (Pudong) Technology Corporation | Signal input device |
US10969838B2 (en) * | 2019-09-05 | 2021-04-06 | Dell Products, L.P. | Hybrid cooling system with multiple outlet blowers |
US20220253113A1 (en) * | 2021-02-10 | 2022-08-11 | Dell Products L.P. | Cooling system for an information handling system |
US11429164B1 (en) * | 2021-02-10 | 2022-08-30 | Dell Products L.P. | Cooling system for an information handling system |
US11503740B2 (en) * | 2021-02-10 | 2022-11-15 | Dell Products L.P. | Cooling system for an information handling system |
Also Published As
Publication number | Publication date |
---|---|
US9277672B2 (en) | 2016-03-01 |
JP2012004975A (en) | 2012-01-05 |
US20130235525A1 (en) | 2013-09-12 |
JP4929377B2 (en) | 2012-05-09 |
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Legal Events
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Owner name: KABUSHIKI KAISHA TOSHIBA, JAPAN Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNOR:HATA, YUKIHIKO;REEL/FRAME:026428/0074 Effective date: 20110315 |
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STCB | Information on status: application discontinuation |
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