CN105848447A - Heat radiating device and heat radiating system - Google Patents

Heat radiating device and heat radiating system Download PDF

Info

Publication number
CN105848447A
CN105848447A CN 201510019779 CN201510019779A CN105848447A CN 105848447 A CN105848447 A CN 105848447A CN 201510019779 CN201510019779 CN 201510019779 CN 201510019779 A CN201510019779 A CN 201510019779A CN 105848447 A CN105848447 A CN 105848447A
Authority
CN
Grant status
Application
Patent type
Prior art keywords
cooling
end
outlet
heat sink
reservoir tank
Prior art date
Application number
CN 201510019779
Other languages
Chinese (zh)
Inventor
杨波
李旭
Original Assignee
鸿富锦精密工业(武汉)有限公司
鸿海精密工业股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date

Links

Classifications

    • GPHYSICS
    • G06COMPUTING; CALCULATING; COUNTING
    • G06FELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00Details not covered by groups G06F3/00 – G06F13/00 and G06F21/00
    • G06F1/16Constructional details or arrangements
    • G06F1/20Cooling means
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/34Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/473Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
    • GPHYSICS
    • G06COMPUTING; CALCULATING; COUNTING
    • G06FELECTRIC DIGITAL DATA PROCESSING
    • G06F2200/00Indexing scheme relating to G06F1/04 - G06F1/32
    • G06F2200/20Indexing scheme relating to G06F1/20
    • G06F2200/201Cooling arrangements using cooling fluid
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/34Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws

Abstract

A heat radiating device, which is installed on an electronic component, comprises a liquid storage tank, a driving device arranged in the liquid storage tank, a radiator, and a cooling pipe circularly running through the radiator. The liquid storage tank is used for storing cooling liquid, and has an outlet and an inlet. A first end of the cooling pipe is inserted into the outlet, and a second end opposite to the first end is inserted into the inlet. The driving device is used for driving the cooling liquid in the liquid storage tank to be led out of the liquid storage tank via the outlet and flow through the cooling pipe on the radiator and then back to the liquid storage tank to enable the radiator to radiate heat of the electronic component. The invention further discloses a heat radiating system.

Description

散热装置及散热系统 And a heat sink cooling system

技术领域 FIELD

[0001] 本发明涉及一种应用于电子装置中的散热装置及散热系统。 [0001] The present invention relates to a cooling system and the heat dissipation device is applied to an electronic device.

背景技术 Background technique

[0002] 随着科技的进步,电脑技术的进步更为迅速,而了解电脑的人都知道,一部电脑的必脏即是我们所称的中央处理器(CPU),而中央处理器是决定电脑资料运算速度最重要的元件,因电脑技术的不断进步,主机的处理速度也在不断提升中,而相信大家都知道,中央处理器于工作时将产生工作温度,而工作温度的高低则取决于电压及中央处理器运算速度。 [0002] As technology advances, advances in computer technology more quickly, and understand the computer knows, a computer must dirty that is what we call a central processing unit (CPU), while the central processor is determined computer data computing speed the most important element, because of advances in computer technology, the processing speed of the host is also rising, whereas we all know, the central processor to work will have a working temperature, and the temperature is dependent on the level of work voltage and a central processor speed. 简单的说,使用较高电压且运算速度愈快的中央处理器,其将产生较高的工作温度,而过高的工作温度将影响中央处理器的工作速度,甚至造成死机或损坏。 Briefly, using a higher voltage, and the faster the operation speed of the central processor, which will result in higher operating temperature, whereas excessively high operating temperature will affect the speed of the central processing unit, or even cause damage to the crash. 正常的工作温度将使中央处理器保持正常的运算速度,甚至可使目前具有超频功能的中央处理器的运算速度大幅提升,因此,降低中央处理器的工作温度则是电脑业者的首要目标。 Normal operating temperature will cause the central processor to maintain normal operation speed, even at present can greatly enhance the computing speed of the central processor overclocking function, thus reducing the operating temperature of the central processor is the primary goal of the computer industry.

[0003] 目前市面上常见的散热装置大都为风冷式,其大都于各种不同形态的散热座上锁设有风扇,并于该散热座的底面依所需固设有四支底端具扣槽的扣柱,通过所述扣柱穿过中央处理器而使散热座固定于所述中央处理器上。 [0003] Common market mostly air-cooled heat sink, the heat sink which in most various forms of locking a fan, and a bottom end by four desired solids on the bottom surface of the heat sink base having back posts of the catching groove, the heat sink is fixed to the central processor through a central processor via said back posts. 但仅W风扇做为空气对流W达热交换的目的的散热效果并不佳,因此,现有的散热装置欲将中央处理器的工作温度降低极为有限。 However, only W W convection fan as object of heat exchange and the poor cooling effect, therefore, the conventional heat sink wishing to reduce the operating temperature of the central processor is very limited.

发明内容 SUMMARY

[0004] 鉴于W上内容,有必要提供一种提升散热效果的散热装置及散热系统。 [0004] In view of the contents of W, it is necessary to provide a heat sink and cooling system to enhance heat dissipation effect.

[0005] -种散热装置,用于安装在一电子元件上,包括有一储液箱、一装设于所述储液箱内的驱动装置、一散热器、一循环贯穿所述散热器的冷却管,所述储液箱用于储存冷却液并包括有一出口及一进口,所述冷却管的第一端插接所述出口,一与所述第一端相对的第二端插接所述进口,所述驱动装置用于驱动所述储液箱内的冷却液由所述出口导出所述储液箱,并经过所述散热器上的冷却管再回流至所述所述储液箱内,W使所述散热器对所述电子元件进行散热。 [0005] - heat dissipation means for mounting on an electronic component comprising a liquid storage tank, a drive means mounted to the reservoir tank, a radiator, a radiator circulating through the cooling tube, the reservoir tank for storing the cooling liquid and comprising an inlet and an outlet, a first end of the cooling tube of the outlet plug, said plug opposite said first end and a second end inlet, a driving means for driving said cooling liquid reservoir tank of the reservoir tank deriving from said outlet, and through the cooling pipe to the radiator refluxing the reservoir tank , W so that the radiator for cooling the electronic components.

[0006] 进一步地,所述散热装置还包括有一第一弯管及一第二弯管,所述冷却管的第一端通过所述第一弯管连接于所述出口,所述冷却管的第二端通过所述第二弯管连接于所述进口。 [0006] Further, the heat sink further comprises a first bend and a second bend, a first end of the cooling pipe through the first bend connected to the outlet of the cooling pipe a second terminal through the second inlet is connected to the elbow.

[0007] 进一步地,所述散热装置还包括有第一紧固件及一第二紧固件,所述第一紧固件将所述第一弯管紧固于所述出口上,所述第二紧固件将所述第二弯管紧固于所述进口上。 [0007] Further, the heat sink further comprises a first fastener and a second fastener, said first fastener securing the first bend to the outlet, the a second fastener secured to the second bend on the inlet.

[0008] 进一步地,所述散热装置还包括有一用于固定在一主板上的固定件,所述储液箱安装于所述固定件上。 [0008] Further, the heat sink further comprising a motherboard for fixing on a fixing member, the reservoir tank mounted on the fixing member.

[0009] 进一步地,所述散热装置还包括有一风扇,所述风扇固定于所述散热的一侧。 [0009] Further, the heat dissipation means further comprises a fan, secured to the side of the cooling fan.

[0010] 进一步地,所述驱动装置为一泉。 [0010] Further, the drive means is a spring.

[0011] 进一步地,所述冷却液为水。 [0011] Furthermore, the cooling liquid is water.

[0012] 一种散热系统,包括一电子装置及一装设于电子装置内的散热装置,所述电子装置包括有一主板及位于所述主板上的电子元件,所述散热装置包括有一位于所述电子元件上方的储液箱、一装设于所述储液箱内的驱动装置、一散热器、一循环贯穿所述散热器的冷却管,所述储液箱用于储存冷却液并包括有一出口及一进口,所述冷却管的第一端插接所述出口,一与所述第一端相对的第二端插接所述进口,所述驱动装置用于驱动所述储液箱内的冷却液由所述出口导出所述储液箱,并经过所述散热器上的冷却管再回流至所述所述储液箱内,W使所述散热器对所述电子元件进行散热。 [0012] A cooling system comprising an electronic device and a heat dissipating device mounted in the electronic device, said electronic device comprising a board and an electronic component located on the motherboard, said means comprising a heat sink located tank above the electronic components, a drive means mounted to the reservoir tank, a radiator, a cooling tube circulating through the heat sink, the reservoir tank for storing a cooling fluid and comprising an inlet and an outlet, a first end of the cooling tube of the plug outlet, the first end opposing a second end of the inlet connector, the driving means for driving the reservoir tank derived from the coolant outlet of the reservoir tank, and through the condenser on the radiator was refluxed to the reservoir tank, W so that the radiator for cooling the electronic components.

[0013] 进一步地,所述散热装置还包括有一第一弯管及一第二弯管,所述冷却管的第一端通过所述第一弯管连接于所述出口,所述冷却管的第二端通过所述第二弯管连接于所述进口。 [0013] Further, the heat sink further comprises a first bend and a second bend, a first end of the cooling pipe through the first bend connected to the outlet of the cooling pipe a second terminal through the second inlet is connected to the elbow.

[0014] 进一步地,所述散热装置还包括有一固定件,所述固定件用于将所述电子元件固定于所述主板上,所述储液箱安装于所述固定件上。 [0014] Further, the heat sink further comprises a fixing member, a fixing member for fixing the electronic component on the motherboard, the reservoir tank is attached to said fixing member.

[0015] 与现有技术相比,上述散热装置及散热系统中,在风冷式的散热器上加上了液冷式的结构,即,所述驱动装置能够驱动所述储液箱内的冷却液由所述出口导出所述储液箱, 并经过所述散热器上的冷却管再回流至所述所述储液箱内,W使所述散热器对所述电子元件进行散热。 [0015] Compared with the prior art, the heat dissipation means and the cooling system, the air-cooled heat sink on the liquid-added structure, i.e., the driving means capable of driving said accumulator tank derived from the coolant outlet of the reservoir tank, and through the condenser on the radiator was refluxed to the reservoir tank, W so that the radiator for cooling the electronic components. 送样,所述散热装置不仅有风冷式也有液冷式,有效地提升了对电子元件散热的散热效果。 Samples, not only the air-cooled heat sink also has a liquid-cooled, to effectively improve the heat dissipation effect of the electronic component.

附图说明 BRIEF DESCRIPTION

[0016] 图1是本发明系统的一较佳实施方式的一立体分解图。 [0016] FIG. 1 is an exploded perspective view of a preferred embodiment of the system of the present embodiment of the invention.

[0017] 图2是图1中本发明散热系统中的一散热装置的一立体图。 [0017] FIG. 2 is a perspective view of a heat sink cooling system of the present invention in FIG.

[0018] 图3是图1中本发明散热系统中的一立体组装图。 [0018] FIG. 1 FIG. 3 is a perspective assembled view of the present invention, a cooling system.

[0019] 图4是图3中散热装置与一主板的一侧视图。 [0019] FIG. 4 is a side view in FIG. 3 and a heat dissipation device motherboard.

[0020] 主要元件符号说明 [0020] Main reference numerals DESCRIPTION

Figure CN105848447AD00041

Figure CN105848447AD00051

如下具体实施方式将结合上述附图进一步说明本发明。 The following detailed description in conjunction with the accompanying drawings, the present invention is described.

具体实施方式 detailed description

[0021] 请参阅图1,在本发明的一较佳实施方式中,一散热系统100包括一电子装置10及一可安装于所述电子装置10内的散热装置30。 [0021] Referring to FIG. 1, in a preferred embodiment of the present invention, a cooling system 100 includes an electronic device 10 and a heat dissipation device 30 may be mounted to the electronic device 10 is. 在一实施方式中,所述电子装置10为一电脑。 In one embodiment, the electronic device 10 is a computer.

[0022] 所述电子装置10包括有一底板11、一前板13、及一与所述前板13相对的后板15。 [0022] The electronic device 10 includes a base 11, a front plate 13 and a front plate 13 relative to the rear plate 15. 所述底板11上安装有一主板20。 The base plate 20 is mounted on a motherboard 11. 所述主板20上安装有若干电子元件,如一中央处理器40。 Mounted on the main board 20 with a plurality of electronic components, such as a central processor 40. 四固定孔21开设于所述主板20上并位于所述中央处理器40的四个角落处。 Four fixing holes 21 opened in the main board 20 and located on the four corners of the central processor 40. 所述前板13 上开设有若干进风口131,所述后板15上开设有一出风口151。 The front plate 13 defines a number of air inlet 131, a rear air outlet 151 defines an upper plate 15.

[0023] 请参阅图2,所述散热装置30包括有一固定件31、一储液箱32、一散热器33、一循环贯穿于所述散热器33上的冷却管34、一连接所述冷却管34的第一端341的第一弯管35、一连接所述冷却管34的第二端342的第二弯管36、及一位于所述散热器33 -侧的风扇37〇 [0023] Referring to FIG 2, the heat sink 30 includes a fixed member 31, a reservoir tank 32, a radiator 33, a cooling pipe loop runs through the radiator 3334, a connection of the cooling a first end of the tube 34 is a first bend 35 341, a cooling pipe 34 connected to the second end 342 of the second bend 36, and a radiator located in the 33 - side of the fan 37〇

[0024] 所述固定件31用于将所述中央处理器40固定于所述主板20上,并包括有四个螺柱311。 [0024] The fixing member 31 for the central processing unit 40 is fixed to the motherboard 20, and comprises four studs 311. 所述螺柱311可插设于所述主板20的固定孔21上,W将所述固定件21固定于主板20上。 The studs 311 may be inserted in the fixing hole 20 on the motherboard 21, W 21 to the fixing member 20 is fixed to the motherboard. 所述固定件31另开设有一收容所述储液箱32的收容孔312。 The fixing member 31 further defines a receiving hole receiving the reservoir tank 32 to 312.

[0025] 所述储液箱32固定于所述固定件32上并收容于所述收容孔312中。 The [0025] reservoir tank 32 is fixed to the fixed member 32 and received in the receiving hole 312. 所述储液箱32用于储存冷却液,如水等。 The reservoir tank 32 for storing the cooling liquid, such as water. 所述储液箱32包括有一出口321及一进口323。 The reservoir 32 includes an inlet 321 and an outlet 323. 所述第一弯管35的一端通过一第一紧固件38紧固于所述出口321上,另一端连接所述冷却管34的第一端341。 The end of the first bend 35 is fastened to the outlet 321 by a first fastener 38, and the other end connected to a first end of said cooling tube to 34,134. 所述第二弯管36的一端通过一第二紧固件39紧固于所述进口323上,另一端连接所述冷却管34的第二端342。 The end of the second bend 36 by a fastener 39 fastened to the second inlet 323 on another end connected to the second end 342 of the cooling tube 34.

[0026] -驱动装置325 (见图4)位于所述储液箱32内,用于驱动所述所述储液箱32内的冷却液由所述出口321导出所述储液箱32,并经过所述散热器33上的冷却管34再回流至所述所述储液箱32内,W使所述散热器33对所述中央处理器20进行散热。 [0026] - a drive means 325 (see FIG. 4) located in the liquid tank 32, for driving the coolant within the reservoir tank 32 is derived by the outlet 321 of the reservoir tank 32, and after cooling tube 34 on the heat sink 33 and then returned to the inside of the reservoir tank 32, W so that the central processor 33 of the heat sink 20 to dissipate heat.

[0027] 请参阅图3及图4,组装时,将所述第一弯管35的一端通过一第一紧固件38紧固于所述出口321上,另一端连接所述冷却管34的第一端341。 [0027] Please refer to FIGS. 3 and 4, in assembly, the end of the first bend 35 is fastened to the outlet 321 by a first fastener 38, the other end of the cooling tube 34 The first end 341. 所述第二弯管36的一端通过一第二紧固件39紧固于所述进口323上,另一端连接所述冷却管34的第二端342。 The end of the second bend 36 by a fastener 39 fastened to the second inlet 323 on another end connected to the second end 342 of the cooling tube 34. 所述固定件31的螺柱311插设于所述主板20的固定孔21上,W将所述固定件21固定于主板20 上。 The stud fixing member 31131 is inserted in the fixing hole 20 on the motherboard 21, W 21 to the fixing member 20 is fixed to the motherboard. 所述风扇37靠在所述后板15上并对齐所述出风口151。 The fan 37 and is aligned against the back of the plate 15 on the outlet 151. 送样,即可完成整个组装。 Samples, to complete the assembly.

[0028] 使用时,所述中央处理器40开始工作而发热,所述驱动装置325驱动所述所述储液箱32内的冷却液由所述出口321导出所述储液箱32,并经过所述散热器33上的冷却管34再回流至所述所述储液箱32内,W使所述散热器33对所述中央处理器20进行散热,同时,所述风扇37开始工作而将所述散热器33上的热量由所述出风口151排出。 [0028] In use, the central processor 40 generates heat to work, the driving means for driving said tank 32 by the coolant within the outlet 321 of the reservoir tank 32 deriving 325 and after the cooling tube 34 on the heat sink 33 and then returned to the inside of the reservoir tank 32, W so that the central processor 33 of the heat sink 20 for cooling, while the fan 37 starts to work on the heat radiator 33 is discharged by the outlet 151. 另一方面, 由所述进风口131进入所述电子装置10内部的冷空气,经由散热器33与风扇37,通过所述出风口151排出。 On the other hand, by the cooling air inlet 131 into the interior of the electronic device 10, via the radiator 33 and the fan 37, is discharged through the outlet 151. 送样,所述中央处理器40的大部分热量即可被散热装置30的作用下被排出电子装置10,有效地降低了中央处理器40的工作温度。 Samples, most of the heat of the central processing unit 40 is discharged to the heat sink of the electronic device 10, effectively reducing the operating temperature of the central processor 40 under the action of 30.

[0029] 尽管已结合上述特定实施例对本发明进行了描述,但是本领域的技术人员显然会清楚多种替代方案、改型和变型。 [0029] Although embodiments in conjunction with the specific embodiments of the present invention has been described, those skilled in the art will obviously be more apparent alternatives, modifications and variations. 因此,如上所述的本发明的优选实方式仅为示例性,而非限制性。 Accordingly, the preferred embodiment of the present invention as described above is merely illustrative, and not restrictive.

Claims (10)

  1. 1. 一种散热装置,用于安装在一电子元件上,其特征在于:所述散热装置包括有一储液箱、一装设于所述储液箱内的驱动装置、一散热器、一循环贯穿所述散热器的冷却管,所述储液箱用于储存冷却液并包括有一出口及一进口,所述冷却管的第一端插接所述出口, 一与所述第一端相对的第二端插接所述进口,所述驱动装置用于驱动所述储液箱内的冷却液由所述出口导出所述储液箱,并经过所述散热器上的冷却管再回流至所述所述储液箱内,以使所述散热器对所述电子元件进行散热。 1. A heat dissipation device for mounting an electronic component on, wherein: said heat sink means comprises a liquid tank, a drive means mounted to the reservoir tank, a radiator, a loop through the radiator cooling tube, a reservoir tank for storing the cooling liquid and comprising an inlet and an outlet, a first end of the cooling tube of the plug outlet, a first end opposite the a second end of the inlet connector, the drive for driving the cooling liquid reservoir tank outlet by said deriving the reservoir tank, and after the cooling pipe to the radiator refluxed the said reservoir tank, so that the radiator for cooling the electronic components.
  2. 2. 如权利要求1所述的散热装置,其特征在于:所述散热装置还包括有一第一弯管及一第二弯管,所述冷却管的第一端通过所述第一弯管连接于所述出口,所述冷却管的第二端通过所述第二弯管连接于所述进口。 2. The heat dissipation device as claimed in claim 1, wherein: said heat sink means further comprises a first bend and a second bend, a first end of the cooling pipe through the first elbow connector at the outlet of the cooling tube through the second end of the second elbow connector to the inlet.
  3. 3. 如权利要求2所述的散热装置,其特征在于:所述散热装置还包括有第一紧固件及一第二紧固件,所述第一紧固件将所述第一弯管紧固于所述出口上,所述第二紧固件将所述第二弯管紧固于所述进口上。 3. The heat dissipation device as claimed in claim 2, wherein: said heat sink means further comprises a first fastener and a second fastener, said first fastener to said first bend fastened to the outlet, the second fastener fastened to the second bend on the inlet.
  4. 4. 如权利要求1所述的散热装置,其特征在于:所述散热装置还包括有一用于固定在一主板上的固定件,所述储液箱安装于所述固定件上。 The heat dissipation device as claimed in claim 1, wherein: said apparatus further comprises a heat sink fixed on a motherboard for the fixing member, the reservoir tank is attached to said fixing member.
  5. 5. 如权利要求1所述的散热装置,其特征在于:所述散热装置还包括有一风扇,所述风扇固定于所述散热器的一侧。 The heat dissipation apparatus according to claim 1, wherein: said heat sink means further comprises a fan, a fan fixed to one side of the heat sink.
  6. 6. 如权利要求1所述的散热装置,其特征在于:所述驱动装置为一泵。 6. The heat dissipation device as claimed in claim 1, wherein: said drive means is a pump.
  7. 7. 如权利要求1所述的散热装置,其特征在于:所述冷却液为水。 The heat dissipation apparatus according to claim 1, wherein: said cooling liquid is water.
  8. 8. -种散热系统,包括一电子装置及一装设于电子装置内的散热装置,所述电子装置包括有一主板及位于所述主板上的电子元件,其特征在于:所述散热装置包括有一位于所述电子元件上方的储液箱、一装设于所述储液箱内的驱动装置、一散热器、一循环贯穿所述散热器的冷却管,所述储液箱用于储存冷却液并包括有一出口及一进口,所述冷却管的第一端插接所述出口,一与所述第一端相对的第二端插接所述进口,所述驱动装置用于驱动所述储液箱内的冷却液由所述出口导出所述储液箱,并经过所述散热器上的冷却管再回流至所述所述储液箱内,以使所述散热器对所述电子元件进行散热。 8. - heat dissipation system, comprising an electronic device and a heat dissipating device mounted in the electronic device, the electronic device comprises a main board and located on the motherboard of the electronic device, wherein: said heat sink means comprises a the electronic component positioned above the reservoir, a drive means mounted to the reservoir tank, a radiator, a cooling tube circulating through the heat sink, the reservoir tank for storing cooling liquid and comprising an inlet and an outlet, a first end of the cooling tube of the plug outlet, the first end opposing a second end of the inlet connector, the driving means for driving said reservoir coolant liquid tank of the reservoir tank deriving from said outlet, and through the cooling pipe to the radiator refluxing the reservoir tank, so that the electronic component to the heat sink cooling.
  9. 9. 如权利要求8所述的散热系统,其特征在于:所述散热装置还包括有一第一弯管及一第二弯管,所述冷却管的第一端通过所述第一弯管连接于所述出口,所述冷却管的第二端通过所述第二弯管连接于所述进口。 9. The cooling system according to claim 8, wherein: said heat sink means further comprises a first bend and a second bend, a first end of the cooling pipe through the first elbow connector at the outlet of the cooling tube through the second end of the second elbow connector to the inlet.
  10. 10. 如权利要求8所述的散热系统,其特征在于:所述散热装置还包括有一固定件,所述固定件用于将所述电子元件固定于所述主板上,所述储液箱安装于所述固定件上。 10. The cooling system according to claim 8, wherein: said heat sink means further comprises a fixing member, a fixing member for fixing the electronic component on the motherboard, the reservoir tank is mounted on said fixing member.
CN 201510019779 2015-01-15 2015-01-15 Heat radiating device and heat radiating system CN105848447A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN 201510019779 CN105848447A (en) 2015-01-15 2015-01-15 Heat radiating device and heat radiating system

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
CN 201510019779 CN105848447A (en) 2015-01-15 2015-01-15 Heat radiating device and heat radiating system
TW104101725A TW201625895A (en) 2015-01-15 2015-01-19 Heat dissipating device and heat dissipating system
US14607293 US20160209892A1 (en) 2015-01-15 2015-01-28 Heat dissipating device and heat disspating system

Publications (1)

Publication Number Publication Date
CN105848447A true true CN105848447A (en) 2016-08-10

Family

ID=56407860

Family Applications (1)

Application Number Title Priority Date Filing Date
CN 201510019779 CN105848447A (en) 2015-01-15 2015-01-15 Heat radiating device and heat radiating system

Country Status (2)

Country Link
US (1) US20160209892A1 (en)
CN (1) CN105848447A (en)

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN2410678Y (en) * 1999-11-16 2000-12-13 简川富 Computer host radiator
CN2713643Y (en) * 2004-08-05 2005-07-27 大众电脑股份有限公司 Heat sink
US20070035928A1 (en) * 2003-09-10 2007-02-15 Qnx Cooling Systems Inc. Cooling system
CN101115379A (en) * 2006-07-25 2008-01-30 富士通株式会社 Liquid cooling unit and heat exchanger therefor
US20100326634A1 (en) * 2003-11-07 2010-12-30 Asetek A/S. Cooling system for a computer system
US8416567B2 (en) * 2010-02-11 2013-04-09 Liang-Ho Cheng Tower computer system

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN2410678Y (en) * 1999-11-16 2000-12-13 简川富 Computer host radiator
US20070035928A1 (en) * 2003-09-10 2007-02-15 Qnx Cooling Systems Inc. Cooling system
US20100326634A1 (en) * 2003-11-07 2010-12-30 Asetek A/S. Cooling system for a computer system
CN2713643Y (en) * 2004-08-05 2005-07-27 大众电脑股份有限公司 Heat sink
CN101115379A (en) * 2006-07-25 2008-01-30 富士通株式会社 Liquid cooling unit and heat exchanger therefor
US8416567B2 (en) * 2010-02-11 2013-04-09 Liang-Ho Cheng Tower computer system

Also Published As

Publication number Publication date Type
US20160209892A1 (en) 2016-07-21 application

Similar Documents

Publication Publication Date Title
US7599184B2 (en) Liquid cooling loops for server applications
US6328097B1 (en) Integrated heat dissipation apparatus
US7256993B2 (en) Adjustable heat sink shroud
US6900990B2 (en) Electronic apparatus provided with liquid cooling type cooling unit cooling heat generating component
US20040201958A1 (en) System and method for cooling an electronic device
US6914782B2 (en) Multi-opening heat-dissipation device for high-power electronic components
US20040130873A1 (en) Structure for removable cooler
US20080043425A1 (en) Methods and systems for cooling a computing device
US20090219687A1 (en) Memory heat-dissipating mechanism
US5671120A (en) Passively cooled PC heat stack having a heat-conductive structure between a CPU on a motherboard and a heat sink
US6717811B2 (en) Heat dissipating apparatus for interface cards
US6762932B2 (en) Method and system for mounting an information handling system storage device
US6945315B1 (en) Heatsink with active liquid base
US20070291452A1 (en) Heat Transfer Systems for Dissipating Thermal Loads From a Computer Rack
US7349212B2 (en) Heat dissipation device
US7133284B2 (en) Power supply without cooling fan
US7212404B2 (en) Integrated heat sink device
US8077463B2 (en) Heat dissipating system
US20070165374A1 (en) Electronic cooling system having a ventilating duct
US7363963B2 (en) Heat dissipation device
US7163050B2 (en) Heat dissipating device
US20050286229A1 (en) Modular heat-dissipation assembly structure for a PCB
US20070076376A1 (en) Method, apparatus and computer system for providing for the transfer of thermal energy
US20070146990A1 (en) Heat dissipating assembly
US20050094371A1 (en) Electronic device and heat-dissipating module thereof

Legal Events

Date Code Title Description
C06 Publication
C10 Entry into substantive examination
WD01