TWM550836U - Partition for computer host - Google Patents
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- TWM550836U TWM550836U TW106207213U TW106207213U TWM550836U TW M550836 U TWM550836 U TW M550836U TW 106207213 U TW106207213 U TW 106207213U TW 106207213 U TW106207213 U TW 106207213U TW M550836 U TWM550836 U TW M550836U
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
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Description
本新型創作涉及電腦硬體設備的技術領域,尤其是一種電腦主機中的隔板的技術。 The novel creation relates to the technical field of computer hardware devices, and in particular to a technology for a partition in a computer mainframe.
現有的傳統桌上型電腦主機的主流為塔式主機,其總體體型為長方體。桌上型電腦的主機有臥式和立式之分,一般以立式最為常見。主機內所有的物理零部件一般稱為電腦硬體,包括主機板、硬碟、CPU、記憶體條、獨立顯示卡、光碟機和電源,以及各散熱器。現有的塔式主機箱為非超薄主機箱,體型大、重量重。 The mainstream of the existing traditional desktop computer mainframe is a tower mainframe, and its overall shape is a rectangular parallelepiped. The mainframe of the desktop computer is divided into horizontal and vertical, and is usually the most common in vertical. All physical components in the mainframe are generally referred to as computer hardware, including motherboards, hard drives, CPUs, memory sticks, stand-alone graphics cards, optical drives, and power supplies, as well as heat sinks. The existing tower mainframe is a non-slim mainframe, which is large in size and heavy in weight.
1)硬體配置與走線:目前傳統桌上型主機箱內的硬體配置設計為,一個位置空間幾乎只能安裝使用一種電腦硬體,所以為了滿足支援更多的硬體,主機箱內設置了很多各硬體的安裝空間位置,當有些硬體安裝位置使用不到時,就只能空閒在那,極大的浪費了主機箱內的空間體積,使主機箱內的空間利用率很低。 1) Hardware configuration and routing: At present, the hardware configuration in the traditional desktop mainframe is designed to be able to install almost one type of computer hardware in one location space, so in order to support more hardware, the main chassis Set a lot of hardware installation space location, when some hardware installation location is not used, it can only be idle there, greatly wasting the space volume inside the mainframe, making the space utilization in the mainframe low .
傳統桌上型電腦的主機箱內各硬體之間的資料或供電連接,絕大部分採用的是RVV導線,通過導線將相關聯的各硬體之 間連接起來。但由於傳統主機箱內的佈局和走線方式落後,加上各種硬體眾多,所形成的連接導線也就縱橫交錯、複雜繁多,使用起來不僅使用者需要具備一定的專業基礎知識,而且嚴重影響了主機箱內部的美觀,各種走線還大大佔用了主機箱內的空間體積。傳統的主機箱內,由於各硬體配置存在不合理的原因,加上採用普通導線相連接,且硬體間的連接距離不是最短的,也無法做到最短程的連接,因為太短了,普通導線變得又粗又硬,所以非常不便於用戶安裝使用。 Most of the data or power connection between the hardware in the mainframe of the traditional desktop computer is the RVV wire, and the associated hardware is connected through the wire. Connected together. However, due to the backward layout and routing in the traditional mainframe, and the various hardware, the connecting wires are also criss-crossed, complicated and complicated. The user needs to have certain professional basic knowledge and serious influence. The interior of the main box is beautiful, and the various lines also occupy the space volume in the main box. In the traditional mainframe, due to the unreasonable reason of the hardware configuration, and the connection of the common wires, and the connection distance between the hardware is not the shortest, the shortest connection cannot be achieved because it is too short. Ordinary wires become thick and hard, so it is very inconvenient for users to install and use.
2)CPU散熱器的結構及其安裝:傳統的CPU散熱器是用4顆螺絲/膨脹卡銷,通過主機板上的CPU安裝孔,剛性或接近剛性的材料、結構方式將CPU散熱器固定在主機板上。常常出現以下五種問題:第一,由於螺絲/膨脹卡銷擰的過緊,散熱器與主機板間的受力過大,致使主機板不同程度的變形彎曲。第二,有時由於這4顆螺絲緊固時各自受力程度不均衡,導致CPU晶片表面與散熱器的導熱底座間局部翹起,產生細微空隙,大大增加了CPU晶片與散熱器導熱底座之間的導熱係數,阻礙了CPU晶片向散熱器間的熱傳遞。第三,傳統的CPU散熱器及配套的扣具、零件繁多,安裝起來較繁瑣,大多需要幾分鐘到十幾分鐘不等。第四,部分傳統CPU散熱器安裝在主機板上時,不能移動或者只能單向移動。致使有時出現CPU散熱器與某些主機板上元部件位置相衝突,而不能正常安裝的弊端。第五,大多數傳統高階的CPU散熱器為了達到更好的散熱效果,只能一味的增加散熱器的尺寸 體型。這樣使得大型CPU散熱器對主機箱和主機板的相容性大大降低,用戶購買的花費也明顯增加。 2) Structure of the CPU heat sink and its installation: The traditional CPU heat sink uses 4 screws/expansion bayonet pins to fix the CPU heat sink through the CPU mounting holes on the motherboard, rigid or nearly rigid material and structure. On the motherboard. The following five problems often occur: First, because the screw/expansion pin is tightened too much, the force between the heat sink and the motherboard is too large, causing the motherboard to deform and bend to varying degrees. Second, sometimes the four screws are unbalanced when they are tightened, resulting in partial tilting between the surface of the CPU chip and the heat-conducting base of the heat sink, resulting in fine gaps, which greatly increases the thermal conductivity of the CPU chip and the heat sink. The thermal conductivity between the two blocks the heat transfer between the CPU chip and the heat sink. Third, the traditional CPU heatsink and the matching buckles and parts are numerous and complicated to install. Most of them take several minutes to ten minutes. Fourth, when some conventional CPU heat sinks are mounted on the motherboard, they cannot move or can only move in one direction. As a result, sometimes the CPU heatsink conflicts with the position of some components on the motherboard, and the drawbacks of normal installation cannot occur. Fifth, most traditional high-end CPU heat sinks can only increase the size of the heat sink in order to achieve better heat dissipation. Body type. This greatly reduces the compatibility of the large CPU heat sink with the main chassis and the motherboard, and the cost of the user purchase is also significantly increased.
另外,普通用戶使用的CPU絕大部分TDP功耗都在100W以內,但考慮到頂級CPU和超頻用戶的苛刻需求,CPU散熱器能承載的功耗要達到180W以上。因此對散熱器的性能也提出了更高的要求。 In addition, most of the CPUs used by ordinary users consume less than 100W of TDP power. However, considering the demanding requirements of top CPUs and overclocking users, the CPU heatsink can carry more than 180W. Therefore, higher requirements are placed on the performance of the heat sink.
3)獨立顯示卡的安裝及散熱:傳統桌上型主機箱內的獨立顯示卡,如果是中低階顯示卡,一般是使用顯示卡原配的散熱器進行散熱。如果是大功率高階顯示卡,要麼使用高昂、繁瑣的水冷方案,要麼重新安裝更好的風冷散熱器。但市面上大部分獨立顯示卡風冷散熱器要麼具有一定的相容性範圍,要麼配套零件多、安裝過程繁瑣。而且不具備一定專業知識的用戶根本不知道應該選擇什麼樣的散熱器最合適。 3) Installation and heat dissipation of the independent display card: The independent display card in the traditional desktop mainframe, if it is a low-end display card, generally uses the original heat sink of the display card for heat dissipation. In the case of high-power, high-end graphics cards, either use expensive, cumbersome water-cooling solutions or reinstall better air-cooled heat sinks. However, most of the independent display card air-cooled radiators on the market have a certain compatibility range, or there are many matching parts and the installation process is cumbersome. And users who don't have a certain amount of expertise don't even know what kind of radiator should be chosen.
傳統的桌上型主機箱,獨立顯示卡在散熱方面存在以下幾點問題: In the traditional desktop mainframe, the independent display card has the following problems in terms of heat dissipation:
第一,獨立顯示卡如果採用風冷,由於安裝方式和尺寸規格的限制,散熱器尺寸幾乎不能超過顯示卡本身的尺寸範圍。且其匹配的風扇還要佔據散熱器的一部分體積,所以散熱器的實際散熱面積有限。 First, if the independent display card is air-cooled, the size of the heat sink can hardly exceed the size range of the display card itself due to the limitation of the mounting method and size specifications. And the matching fan also occupies a part of the volume of the heat sink, so the actual heat dissipation area of the heat sink is limited.
第二,如果採用水冷,光其高昂的費用不說。與水冷配套的水箱、水泵、散熱器、風扇、水管等都需要額外增加主機箱的體積和重量。且安裝繁瑣,用戶安裝水冷時還需具備一定的專 業動手能力。 Second, if water cooling is used, the high cost will not be said. Water tanks, pumps, radiators, fans, water pipes, etc., which are compatible with water cooling, need to increase the volume and weight of the main box. And the installation is cumbersome, and users need to have certain specialization when installing water cooling. Industry ability.
第三,獨立顯示卡是與主機箱側板進風口是相垂直的。如果採用風冷,由進風口流入的冷空氣受到主機板上的CPU散熱風扇和顯示卡散熱風扇的共同無序干擾,主機箱外的冷空氣不能完全、單向有序的流經獨立顯示卡散熱器中進行高效散熱,因為主機箱內不科學、嚴密的風道,使流入獨立顯示卡、CPU散熱器的冷空氣中夾帶著回流熱空氣,影響了散熱器的熱交換效果。 Third, the independent display card is perpendicular to the air inlet of the main panel side panel. If air cooling is adopted, the cold air flowing in from the air inlet is interfered by the CPU cooling fan and the display card cooling fan, and the cold air outside the main box cannot flow completely and unidirectionally through the independent display card. Efficient heat dissipation in the radiator, because the unscientific and tight air duct in the main box, the cold air flowing into the independent display card and the CPU radiator is caught with the returning hot air, which affects the heat exchange effect of the radiator.
第四,獨立顯示卡散熱器是呈水平平行放置,非常不利於空氣熱流自然向上的升力。 Fourth, the independent display card heat sinks are placed horizontally in parallel, which is very unfavorable for the natural upward movement of the air heat flow.
傳統的桌上型主機箱,獨立顯示卡是直接垂直插在主機板的顯示卡插槽內使用。由於主機板和獨立顯示卡在主機箱內都屬於大尺寸的硬體,兩者相互垂直安裝的方式佔用的空間體積很大。但這種方式對硬體的相容性很好。 In the traditional desktop mainframe, the independent display card is directly inserted vertically into the display card slot of the motherboard. Since the motherboard and the independent display card are both large-sized hardware in the main chassis, the space occupied by the two perpendicularly is large. But this way is very compatible with the hardware.
4)散熱風道:傳統桌上型主機箱內的散熱風道設計不科學、無序,幾乎都存在回流熱風的現象。且為了增加CPU或獨立顯示卡散熱的效果,一味的靠增加散熱器尺寸體積來解決。並沒有簡單、有效的借助於主機箱本身的金屬外殼來傳遞、擴散一部分熱源。 4) Cooling air duct: The design of the heat dissipating air duct in the traditional desktop main box is unscientific and disorderly, and almost all of them have the phenomenon of returning hot air. In order to increase the heat dissipation effect of the CPU or the independent display card, it is solved by increasing the size of the heat sink. There is no simple and effective way to transfer and diffuse a part of the heat source by means of the metal casing of the main box itself.
另外,風扇轉速與其產生的噪音一直都是風冷散熱的一大矛盾。傳統桌上型電腦主機箱內的風扇轉速通常有兩種形式:一種是固定轉速,一種是通過連接主機板PWM插口進行溫控轉速。前者,不管主機箱內溫度高低始終都是一個轉速,不科學; 後者,風扇首先要具備PWM功能,然後要進主機板BISS下進行開啟、設置,使用者需要具備一定的專業知識。而且風扇型號繁多,處於PWM控速模式下的風扇如果噪音過大或者風速偏小,用戶幾乎沒有辦法進行有效調節。 In addition, the fan speed and the noise generated by it have always been a major contradiction between air cooling and heat dissipation. The fan speed in a conventional desktop mainframe usually has two forms: one is a fixed speed, and the other is a temperature-controlled speed by connecting a motherboard PWM jack. The former, regardless of the temperature inside the main box is always a speed, unscientific; In the latter case, the fan must first have the PWM function, and then enter the motherboard BISS to open and set, the user needs to have certain professional knowledge. Moreover, there are many types of fans, and if the fan in the PWM speed control mode is too noisy or the wind speed is too small, there is almost no way for the user to effectively adjust.
5)電源:傳統桌上型主機箱內的電源盒體積較大,其功能是將輸入的交流電直接轉換成各硬體所需不同電壓值的直流輸出,使用眾多RVV導線分別與各硬體對接,加上傳統主機箱內的設計配置落後,致使主機內箱的各種導線密密麻麻、縱橫交錯,極大的佔用浪費了主機箱內的空間體積和影響了主機的美觀,還阻礙了用戶使用的便捷性。 5) Power supply: The power supply box in the traditional desktop mainframe is large in size. Its function is to directly convert the input AC power into DC output of different voltage values required by each hardware, and connect with each hardware by using many RVV wires. In addition, the design configuration in the traditional mainframe is backward, which causes the various wires of the inner box of the mainframe to be densely packed and criss-crossed. The huge occupation wastes the space volume in the mainframe and affects the appearance of the mainframe, and also hinders the convenience of the user. .
為克服現有產品技術的缺陷,本新型創作目的是提供一種可以重新配置電腦硬體,使硬體間所需的連接走線集中成超薄電路且具有隱藏效果,能大大縮減主機體積和重量的電腦主機中的隔板,為設計超薄主機提供優勢支援。 In order to overcome the shortcomings of the existing product technology, the present invention aims to provide a hardware device that can be reconfigured to concentrate the required connection lines between the hardware into an ultra-thin circuit and has a hidden effect, which can greatly reduce the size and weight of the host. The partition in the mainframe provides superior support for designing ultra-thin hosts.
進一步的目的是安裝電腦硬體精準、快捷。 A further goal is to install computer hardware accurately and quickly.
本新型創作通過下述技術方案來實現:一種電腦主機中的隔板,隔板上設有正面與背面,主機中還包括有主機板、硬碟、電源盒、獨立顯示卡、風扇等電腦硬體,所述隔板將電腦主機空間一分為二,所述隔板正面和/或背面或隔板內緊密貼合/內嵌有超薄扁平形態的電路,更加清楚的表述 是所述隔板正面或背面緊密貼合有超薄扁平形態的電路,或者所述隔板正面或背面內嵌有超薄扁平形態的電路;或者所述隔板正面和背面均緊密貼合有超薄扁平形態的電路,或者所述隔板正面和背面均內嵌有超薄扁平形態的電路;或者所述隔板內有內嵌電路。電路中導體的厚度0.5mm。各電腦硬體間通過與隔板上超薄電路對應連通的隔板插座相匹配對接後彼此正確連通,或直接將硬體的特製介面貼觸安裝在隔板上對應的裸露導電的電路接觸點上進行正確匹配、接觸後導通。 The novel creation is realized by the following technical solutions: a partition in the computer main body, the partition has a front side and a back side, and the host computer also includes a computer board such as a motherboard, a hard disk, a power supply box, a separate display card, a fan, and the like. The partition divides the mainframe space into two, and the circuit has an ultra-thin flat shape in close contact/embedded on the front and/or back or the partition of the partition, and the clearer expression is the partition The front or back of the board is closely attached to the circuit of the ultra-thin flat form, or the circuit of the ultra-thin flat shape is embedded in the front or back of the board; or the front and back sides of the board are closely attached with an ultra-thin flat shape The circuit, or the front and back sides of the partition are embedded with an ultra-thin flat form circuit; or the partition has an embedded circuit therein. Thickness of the conductor in the circuit 0.5mm. The computer hardwares are properly connected to each other through the baffle sockets corresponding to the ultra-thin circuits on the baffles, or directly connected to the corresponding bare conductive circuit contacts on the baffles by the special interface of the hardware. Perform correct matching on the top and turn on after contact.
上述主機中隔板上/內緊密貼合/內嵌的超薄扁平形態的電路,以下簡稱為“隔板電路”。這些通過隔板插座、導線與對應的隔板電路相連通和直接貼觸安裝在相匹配的裸露導電的隔板電路上的電腦硬體,這些硬體將平行或平行貼觸安裝在隔板的一面或雙面上。 The ultra-thin flat-shaped circuit in which the upper/inner side of the above-mentioned main body is tightly bonded/embedded is hereinafter referred to as a "separator circuit". These are connected to the corresponding bulkhead circuit through the bulkhead sockets, the wires, and directly to the computer hardware mounted on the matching bare conductive separator circuit, which are mounted in parallel or parallel to the spacer. One or both sides.
上述隔板電路與上述隔板間相互絕緣,扁平的導體電路表面高度不高於其周圍隔板表面的高度。整個隔板電路表面有絕緣和耐磨層的緊密覆蓋。 The separator circuit and the separator are insulated from each other, and the surface of the flat conductor circuit is not higher than the height of the peripheral surface of the separator. The entire separator circuit surface has a tight coverage of the insulation and wear layer.
上述隔板為玻璃纖維/半玻璃纖維基印製電路內嵌隔板、金屬基印製電路板、FPC軟線排內嵌隔板、超薄絕緣銅片內嵌隔板或金屬基導電塗層電路隔板;或者上述隔板為玻璃纖維/半玻璃纖維基印製電路內嵌隔板,將玻璃纖維/半玻璃纖維基PCB電路板製作成設計所需的佈線電路和物理外形尺寸,隔板為鋁合金或銅質的金屬平板,在隔板上一面或雙面設計的位置,加工出與上述 PCB電路板形狀和厚度相匹配的凹槽,將上述PCB電路板緊密貼覆在隔板上對應的凹槽內,使PCB電路板表面與其所在隔板表面處於同一平面高度。上述內嵌PCB電路板的隔板整面上有絕緣、耐磨層的緊密覆蓋。 The above-mentioned separator is a glass fiber/semi-glass fiber-based printed circuit embedded partition plate, a metal-based printed circuit board, an FPC flexible wire inner embedded partition plate, an ultra-thin insulating copper plate embedded partition plate or a metal-based conductive coating circuit. a separator; or the separator is a glass fiber/semi-glass fiber-based printed circuit embedded partition, and the glass fiber/semi-glass fiber-based PCB circuit board is formed into a wiring circuit and a physical physical dimension required for the design, and the partition is Aluminum or copper metal plate, which is fabricated on the side or both sides of the partition The groove of the PCB circuit board is matched with the thickness of the PCB, and the PCB circuit board is closely attached to the corresponding groove on the partition plate, so that the surface of the PCB circuit board is at the same plane height as the surface of the partition plate. The above-mentioned embedded PCB circuit board has a tight covering of the insulating and wear-resistant layers on the entire surface.
上述隔板與電腦主機的金屬外殼或骨架是同一材質的且構成一體,通過模具將材料熱熔或擠壓後使隔板與電腦機箱的金屬外殼或骨架一體成型而成;或者上述隔板和電腦主機的金屬骨架或外殼是分離獨立的,隔板與機箱金屬骨架或外殼內壁之間焊接固定。 The partition plate is made of the same material as the metal casing or the skeleton of the computer main body, and is integrally formed by hot-melting or squeezing the material through a mold, and the partition plate is integrally formed with the metal casing or the skeleton of the computer case; or the above-mentioned partition plate and The metal frame or outer casing of the computer mainframe is separated and independent, and the partition plate is welded and fixed to the metal frame of the chassis or the inner wall of the outer casing.
上述隔板插座直接焊接或貼觸連接在對應的隔板電路上。隔板插座的硬體介面類別型包括SATA 2.0資料介面、SATA 3.0資料介面、SATA Express硬碟介面、SAS硬碟介面、SATA 7+15pin資料+供電 硬碟介面、SATA 7+6pin資料+供電 光碟機介面、主機板的開機啟動插針POWER SW、主機板的重新啟動插針RESET SW、USB 3.0 19/20pin插口、USB 2.0 9pin插口、主機板音訊插針HD AUDIO、獨立顯示卡PCI-E 16X插槽、主機板主供電24pin插槽、主機板輔助供電4/8pin插槽和獨立顯示卡輔助供電6/8pin插槽,或者是上述硬體介面的任意組合。 The baffle sockets are directly soldered or contacted to the corresponding baffle circuit. The hardware interface type of the partition socket includes SATA 2.0 data interface, SATA 3.0 data interface, SATA Express hard disk interface, SAS hard disk interface, SATA 7+15pin data + power hard disk interface, SATA 7+6pin data + power supply CD Machine interface, motherboard boot pin POWER SW, motherboard restart pin RESET SW, USB 3.0 19/20pin jack, USB 2.0 9pin jack, motherboard audio pin HD AUDIO, standalone graphics card PCI-E 16X The slot, the motherboard main power supply 24pin slot, the motherboard auxiliary power supply 4/8pin slot and the independent display card auxiliary power supply 6/8pin slot, or any combination of the above hardware interfaces.
上述隔板插座的底部有序排列著該插座對應的引腳,在隔板電路相應的安裝位置上有焊接點,上述隔板插座底部的引腳直接焊接固定在對應的隔板電路位置上。或者上述隔板插座的底部有序排列著該插座對應的引腳,且這些引腳以裸露的導電金屬 彈片的形式存在,在隔板插座底部的所述彈片的周邊設有凸起的定位銷,在隔板上對應的安裝位置有呈內凹形構造的安裝區域,內凹形區域中有序排列著裸露導電的電路接觸點,在內凹形區域外周邊的隔板上設有相應的定位孔,隔板插座通過螺絲/膨脹卡銷緊固在隔板上對應的安裝位置後,隔板插座底部的導電金屬彈片與隔板上對應的內凹形區域中的電路接觸點相互一一貼觸導通,隔板插座底部凸起的定位銷也與隔板上對應的安裝位置上的定位孔相互一一插入匹配。 The bottom of the baffle socket is arranged with the corresponding pins of the socket, and the soldering point is arranged at the corresponding mounting position of the baffle circuit, and the pins at the bottom of the baffle socket are directly soldered and fixed at the corresponding baffle circuit position. Or the bottom of the spacer socket is arranged with the corresponding pins of the socket, and the pins are exposed conductive metal The elastic piece is in the form of a protruding positioning pin at the periphery of the elastic piece at the bottom of the partition socket, and a corresponding mounting position on the partition has a concavely-shaped mounting area, and the inner concave area is arranged in an orderly manner. The bare conductive circuit contact point is provided with a corresponding positioning hole on the outer periphery of the inner concave portion, and the partition socket is fastened to the corresponding mounting position on the partition plate by the screw/expansion bayonet, and the partition socket The conductive metal shrapnel at the bottom and the circuit contact points in the corresponding concave regions on the partition plate are in contact with each other, and the protruding positioning pins at the bottom of the partition socket are also mutually aligned with the positioning holes at the corresponding mounting positions on the partition plate. Insert the matches one by one.
上述隔板的一面上分佈、固定有若干個主機板支撐柱(此面設為隔板的正面),支撐柱凸出於板面的高度為4~7mm,且上述主機板支撐柱的分佈位置與所對應支持的主機板上的安裝孔位相一一匹配,上述主機板支撐柱為導電金屬材質。 A plurality of motherboard support columns (the front surface of which is a front surface of the partition plate) are distributed and fixed on one side of the partition plate, and the height of the support column protrudes from the plate surface is 4-7 mm, and the distribution position of the support plate of the main board is Matching the mounting holes on the corresponding supported motherboards, the main board support columns are made of conductive metal.
上述主機板支撐柱內有垂直於隔板板面的內螺紋孔或與膨脹卡銷相匹配的卡銷孔,所述主機板支撐柱將主機板平行懸離於隔板正面上,且主機板背面與隔板正面相對,通過螺絲或膨脹卡銷將主機板固定在隔板上的主機板支撐柱中。 The main board support column has an internally threaded hole perpendicular to the surface of the partition plate or a bayonet hole matched with the expansion bayonet, the main board support column suspending the main board parallel to the front surface of the partition plate, and the main board The back side is opposite to the front side of the partition, and the main board is fixed to the main board support column on the partition by screws or expansion pins.
本申請披露了另外的一種技術方案:一種電腦主機中的隔板,其中:所述隔板將電腦主機空間一分為二,隔板上設有正面與背面,所述隔板基材為導電的金屬平板,隔板上設有隔板插座,其設計為電腦主機整機的直流負極/接地傳輸的主要承載導體,包括主機板、硬碟、電源盒、獨立顯示卡、風扇在內的電腦硬體平行或平行貼觸安裝在隔板的一面 或兩面上,包括主機板、硬碟、電源盒、獨立顯示卡、風扇在內的電腦硬體通過隔板插座或直接與導電金屬隔板相貼觸將硬體中的直流負極電路/接地與金屬隔板相導通。 The present application discloses another technical solution: a partition in a computer main body, wherein: the partition divides a computer mainframe space into two, the partition is provided with a front side and a back side, and the partition substrate is electrically conductive. The metal plate has a partition socket on the partition, which is designed as the main bearing conductor of the DC negative/ground transmission of the whole computer host, including a computer such as a motherboard, a hard disk, a power supply box, a separate display card, and a fan. Hardware parallel or parallel contact on one side of the partition On both sides, the computer hardware including the motherboard, the hard disk, the power supply box, the independent display card, and the fan can be connected to the DC negative circuit/ground in the hardware through the separator socket or directly contacting the conductive metal separator. The metal separator is electrically conductive.
本新型創作的有益效果是:本新型創作可以重新佈局電腦主機中大部分硬體,明顯縮減電腦主機體積和重量,使硬體間所需的連接走線集中成超薄電路且具有隱藏效果,為設計超薄機箱提供有力支援。該超薄主機體積是傳統全塔機箱的約1/6,滿載硬體的情況下,超薄主機是傳統全塔機箱重量的一半左右。此超薄主機能滿足安裝支援目前市場上幾乎所有常見的主機板型號(如:ATX、M-ATX、ITX等),能安裝支援所有3.5寸硬碟、2.5寸硬碟,能安裝支援所有全高、半高、超長、大功率的獨立顯示卡,能安裝支持14mm厚度以內的薄型光碟機。主機箱內的各硬體進行了重新配置、連接形式定義。箱內有一金屬平板,各硬體有序的平行安裝在該金屬平板的兩面上,用戶可極為快捷、準確的拆裝、組配所需的硬體;此主機箱有一相匹配的一體式“U”字形滑蓋外殼(此滑蓋外殼可為透明、半透明的材質),為用戶打開/封閉主機箱提供了極為簡便的操作模式。整機還具備優異的散熱性能和人性化的一鍵智慧溫控系統。此超薄主機內的CPU散熱器、獨立顯示卡散熱器、電源盒和排風風扇均為與此超薄主機相匹配的定制尺寸型號。 The beneficial effect of the novel creation is that the novel creation can re-lay most of the hardware in the computer mainframe, significantly reducing the volume and weight of the computer mainframe, and concentrating the required connection lines between the hardware into an ultra-thin circuit and having a hidden effect. Provides strong support for designing ultra-thin chassis. The ultra-thin mainframe is about 1/6 of the size of a traditional full-tower chassis. In the case of full-load hardware, the ultra-thin mainframe is about half the weight of a traditional full-tower chassis. This ultra-thin host can meet almost all common motherboard models (such as ATX, M-ATX, ITX, etc.) currently installed on the market. It can be installed to support all 3.5-inch hard drives, 2.5-inch hard drives, and can be installed to support all full heights. The semi-high, ultra-long, high-power independent display card can be installed to support thin optical disc drives within 14mm thickness. The hardware in the main chassis has been reconfigured and the connection form is defined. There is a metal plate in the box, and the hardware is arranged in parallel on both sides of the metal plate. The user can disassemble and assemble the required hardware extremely quickly and accurately; the main box has a matching integrated type. The U-shaped slider housing (this slider housing is available in a transparent, translucent material) provides an extremely simple operating mode for the user to open/close the main unit. The whole machine also has excellent heat dissipation performance and humanized one-button intelligent temperature control system. The CPU heatsink, stand-alone display card heatsink, power supply box, and exhaust fan in this slim host are custom-sized models that match this slim host.
本申請具體相關零部件的設置具有如下優點: The setting of the specific related components of the present application has the following advantages:
1)隔板上的主機板支撐柱與傳統機箱是一樣的作用,但 這裡多一個用途。因為主機板支撐柱為導電的,且與隔板相連接。因為此超薄機箱將金屬隔板設計為整機的直流負極和接地的承載主導體。PC類主機板的安裝孔是與主機板的輸出直流負極及接地位相連通的,通過導電螺絲或卡銷通過主機板安裝孔固定在隔板上的主機板支撐柱中,即實現了主機板輸出的部分直流負極/接地與金屬隔板的直接連通,主機板輸出的部分直流負極/接地先經過主機板支撐柱傳輸到金屬隔板上,再由電源盒底部與金屬隔板板面大面積貼觸傳回給電源盒。而傳統PC主機箱內是採用大量導線與主機板的供電插槽相連,將主機板全部的直流負極輸出直接傳回給電源盒,將需要大量導線和佔用較多空間體積。 1) The main board support column on the partition is the same as the traditional one, but There is one more use here. Because the motherboard support column is electrically conductive and connected to the separator. Because this ultra-thin chassis is designed with the metal separator as the DC negative pole of the whole machine and the grounding bearing main conductor. The mounting hole of the PC type motherboard is connected with the output DC negative pole and the grounding position of the motherboard, and is fixed to the supporting plate of the motherboard on the partition plate through the mounting hole of the motherboard through the conductive screw or the bayonet, thereby realizing the motherboard The part of the DC negative pole/ground is directly connected to the metal baffle, and part of the DC negative/ground ground output from the main board is transmitted to the metal baffle through the support plate of the main board, and then the bottom of the power supply box and the metal baffle plate have a large area. Touch back to the power box. In the traditional PC mainframe, a large number of wires are connected to the power supply slot of the motherboard, and all the DC negative output of the motherboard is directly transmitted back to the power supply box, which requires a large number of wires and takes up a lot of space.
2)隔板上隱蔽的內嵌/覆蓋了超薄扁平電路,所述隔板可稱為“隱形電路隔板”。電腦主機內通過重新定義配置,硬體相容性極好(能支援市面上99%以上的常見硬體)。還巧妙的實現了同一位置空間可根據使用者不同的需求安裝不同的硬體,在提高了機箱內空間位置的利用率和自由搭配性時,將機箱體積縮減到最小:第一,隱形電路隔板高效解決了各硬體間的信號、供電傳輸,重新配置各硬體,大大縮小了機箱的體積;第二,為各硬體提供安裝固定支撐的平臺;第三,因為金屬基質的隔板與機箱金屬外殼相連,為平行貼觸安裝在隔板背面的硬體提供良好的導熱、散熱支援。 2) The cover plate is concealed/covered with an ultra-thin flat circuit, which may be referred to as a "invisible circuit spacer". By redefining the configuration in the mainframe, the hardware compatibility is excellent (supporting more than 99% of the common hardware on the market). It also ingeniously realizes that the same position space can be installed according to different needs of users, and the chassis volume is reduced to a minimum when the utilization of the space position in the chassis and the free collocation are improved: First, the invisible circuit is separated. The board efficiently solves the signal and power transmission between the hardware, reconfigures the hardware, and greatly reduces the size of the chassis. Second, it provides a platform for mounting the fixed support for each hardware. Third, because of the partition of the metal matrix. It is connected to the metal casing of the chassis to provide good thermal and thermal support for the hardware attached to the back of the partition in parallel.
3)隔板插座是根據不同硬體的介面類別型將機箱內的硬體與對應的隔板電路直接或間接地相對接;FFC線排的優點是超 薄柔軟、精準、能過較大電流,適用於隔板插座與硬體間較短距離的對接。隔板插座直接焊接或貼觸連接在對應的隔板電路上。 3) The spacer socket is directly or indirectly connected to the hardware in the chassis according to different interface types of the hardware; the advantage of the FFC line is super Thin, flexible, and capable of passing large currents, suitable for the short distance between the bulkhead and the hardware. The bulkhead sockets are soldered or contacted directly to the corresponding bulkhead circuit.
第一,機箱內有些硬體可直接插入相匹配的隔板插座中使用。如3.5寸、2.5寸硬碟,因其為較常更替使用的硬體,這樣可直插使用的設計,非常快捷人性化。那些無法直接插入隔板插座中使用的硬體,則採用最短執行緒的連接理念,用軟線排將這些硬體與匹配的隔板插座相對接。也大大縮減了硬體間的走線,使整機內簡潔、美觀。 First, some hardware in the chassis can be directly plugged into a matching bulkhead socket for use. Such as 3.5-inch, 2.5-inch hard disk, because it is a more common use of hardware, so that the design can be used directly, very fast and user-friendly. For hardware that cannot be plugged directly into the bulkhead socket, the shortest thread connection concept is used to connect the hardware to the matching bulkhead socket with a cord. It also greatly reduces the wiring between the hardware, making the whole machine simple and beautiful.
第二,活動式的隔板插座,一般用於同一隔板位置可安裝不同硬體的設計。即在不增加機箱體積的情況下,增加機箱內能支援擴展的硬體數量和類型。 Second, the movable partition socket is generally used for the design of different hardware in the same partition position. That is, increase the number and type of hardware that can support expansion in the chassis without increasing the size of the chassis.
第三,由於活動式隔板插座在隔板電路上的安裝位置是一塊內凹形區域,內凹區域中有裸露導線的電路接觸點。當同一位置安裝了其他硬體時,內凹區域中的裸露電路接觸點的表面高度低於周圍隔板表面的高度,所以不會因為觸碰到其他硬體而產生短路。在不使用該內凹區域時,可用配套的絕緣貼片將該內凹區域填平,產生隔離絕緣和防塵的作用。 Third, since the mounting position of the movable bulkhead socket on the bulkhead circuit is an inner concave area, there is a circuit contact point of the bare conductor in the concave area. When other hardware is installed at the same position, the surface height of the bare circuit contact point in the recessed area is lower than the height of the surrounding spacer surface, so that a short circuit is not caused by touching other hardware. When the recessed area is not used, the recessed area can be filled with a matching insulating patch to provide isolation insulation and dustproof.
為讓本新型創作的上述特徵和優點能更明顯易懂,下文特舉實施例,並配合所附圖式作詳細說明如下。 The above described features and advantages of the present invention will become more apparent and understood from the following description.
1‧‧‧主機箱外殼 1‧‧‧Hosting case
11‧‧‧主機箱外殼的頂部 11‧‧‧Top of the main box casing
12‧‧‧主機箱外殼的底部 12‧‧‧Bottom of the main box casing
13‧‧‧主機箱外殼的尾部 13‧‧‧The tail of the main box casing
15‧‧‧箱底進風口 15‧‧‧ bottom air inlet
16‧‧‧主機板I/O擋板隔板卡槽 16‧‧‧Main board I/O baffle partition card slot
17‧‧‧排風開孔 17‧‧‧Exhaust opening
18‧‧‧手動調節開關 18‧‧‧Manual adjustment switch
2‧‧‧滑蓋 2‧‧‧Sliding cover
21‧‧‧滑蓋前面板(主機箱外殼前部) 21‧‧‧Sliding front panel (front part of the main box housing)
22‧‧‧CPU進風口 22‧‧‧CPU air inlet
23‧‧‧顯示卡進風口 23‧‧‧ display card air inlet
24‧‧‧入碟開孔 24‧‧‧Into the disc opening
25‧‧‧防塵網 25‧‧‧Dust net
3‧‧‧隔板 3‧‧‧Baffle
31‧‧‧主機板支撐柱 31‧‧‧ motherboard support column
32‧‧‧隔板電路 32‧‧‧Baffle circuit
33‧‧‧內凹形接觸點 33‧‧‧ concave contact points
34‧‧‧固定式隔板插座 34‧‧‧Fixed bulkhead socket
35‧‧‧活動式隔板插座 35‧‧‧Mobile partition socket
36‧‧‧定位孔 36‧‧‧Positioning holes
37‧‧‧溫度探頭 37‧‧‧Temperature probe
38‧‧‧通風孔 38‧‧‧ventilation holes
39‧‧‧顯示卡風擋 39‧‧‧Display card windshield
4‧‧‧主機板 4‧‧‧ motherboard
41‧‧‧主機板I/O介面組 41‧‧‧ motherboard I/O interface group
42‧‧‧CPU晶片 42‧‧‧CPU chip
43‧‧‧PCI-E/顯示卡插槽 43‧‧‧PCI-E/display card slot
44‧‧‧記憶體條插槽 44‧‧‧ memory strip slot
45‧‧‧主機板主供電插槽 45‧‧‧Main board main power supply slot
46‧‧‧主機板輔助供電插槽 46‧‧‧ motherboard auxiliary power supply slot
47‧‧‧主機板安裝孔 47‧‧‧ motherboard mounting holes
5‧‧‧扣具 5‧‧‧ buckle
51‧‧‧支撐柱,也稱作扣具支撐柱 51‧‧‧Support column, also known as the buckle support column
52‧‧‧滑動杆 52‧‧‧Sliding rod
53‧‧‧橋壓杆 53‧‧‧ Bridge bar
54‧‧‧膨脹銷釘 54‧‧‧Expansion pin
6‧‧‧CPU散熱器 6‧‧‧CPU cooler
61‧‧‧(CPU)導熱底座 61‧‧‧(CPU) thermal base
62‧‧‧(CPU)真空熱導管 62‧‧‧(CPU) vacuum heat pipe
63‧‧‧(CPU)散熱鰭片 63‧‧‧(CPU) heat sink fins
64‧‧‧CPU附加散熱器 64‧‧‧CPU additional radiator
7‧‧‧獨立顯示卡 7‧‧‧Independent display card
70‧‧‧獨立顯示卡PCB板 70‧‧‧Independent display card PCB board
71‧‧‧獨立顯示卡I/O介面組 71‧‧‧Independent display card I/O interface group
72‧‧‧GPU晶片 72‧‧‧ GPU chip
73‧‧‧獨立顯示卡輔助供電插槽 73‧‧‧Independent display card auxiliary power supply slot
74‧‧‧(獨立顯示卡)金手指 74‧‧‧ (independent display card) gold finger
8‧‧‧獨立顯示卡散熱器 8‧‧‧Independent display card cooler
81‧‧‧(獨立顯示卡散熱器的)導熱底座 81‧‧‧ (independent display card radiator) thermal base
82‧‧‧(獨立顯示卡散熱器的)真空熱導管 82‧‧‧ (independent display card radiator) vacuum heat pipe
83‧‧‧(獨立顯示卡散熱器的)散熱鰭片 83‧‧‧ (individual display card heatsink) heat sink fins
9‧‧‧電源盒 9‧‧‧Power box
91‧‧‧底面 91‧‧‧ bottom
92‧‧‧輸出埠 92‧‧‧ Output埠
93‧‧‧接觸銅片 93‧‧‧Contact copper
94‧‧‧定位銷 94‧‧‧Locating pin
10‧‧‧配電模組 10‧‧‧Power distribution module
101‧‧‧(配電模組的)底面 101‧‧‧ (underside of power distribution module)
102‧‧‧直流輸入口 102‧‧‧DC input port
103‧‧‧直流輸出口 103‧‧‧DC output
104‧‧‧彈片 104‧‧‧Shrap
201‧‧‧風扇 201‧‧‧fan
202‧‧‧2.5寸硬碟 202‧‧‧2.5 inch hard drive
203‧‧‧硬碟 203‧‧‧ Hard disk
204‧‧‧光碟機 204‧‧‧CD player
205‧‧‧擴充插座 205‧‧‧Expansion socket
206‧‧‧矽膠墊 206‧‧‧矽 pads
208‧‧‧主機板I/O擋板 208‧‧‧ motherboard I/O baffle
圖1-8為本新型創作使用中的電腦主機箱結構示意圖。 Figure 1-8 is a schematic diagram of the structure of a computer mainframe in the creation and use of the present invention.
圖9-12為電腦主機箱之隔板使用中的結構示意圖。 Figure 9-12 shows the structure of the partition of the mainframe of the computer.
圖13為安裝有滑蓋的電腦主機箱結構示意圖。 Figure 13 is a schematic view showing the structure of a mainframe of a computer equipped with a slide cover.
圖14為滑蓋結構示意圖。 Figure 14 is a schematic view of the structure of the slider.
圖15為本新型創作隔板上裝有顯示卡時的安裝結構示意圖。 Fig. 15 is a schematic view showing the mounting structure of the present invention when a display card is mounted on the original partition.
圖16為本新型創作隔板上安裝顯示卡的結構示意圖。 Figure 16 is a schematic view showing the structure of a display card mounted on a novel creation partition.
圖17為獨立顯示卡散熱器的結構示意圖。 17 is a schematic structural view of a standalone display card heat sink.
圖18為電源盒的結構示意圖。 18 is a schematic structural view of a power supply box.
圖19為配電模組的結構示意圖。 19 is a schematic structural view of a power distribution module.
圖20為活動式隔板插座的結構示意圖。 Figure 20 is a schematic view showing the structure of a movable partition socket.
圖21為CPU散熱器安裝時的結構示意圖。 Figure 21 is a schematic view showing the structure of the CPU heat sink when it is installed.
圖22為CPU散熱器的安裝固定裝置的結構示意圖。 Figure 22 is a schematic view showing the structure of a mounting and fixing device for a CPU heat sink.
電腦主機在本申請的中文含義上來說,與電腦主機箱為一個意思,電腦主機箱簡稱電腦機箱。 In the Chinese meaning of this application, the computer host has a meaning with the computer mainframe, and the computer mainframe is referred to as the computer chassis.
如圖1-圖14,一種電腦主機箱,包括主機箱外殼1/骨架和電腦硬體,其中電腦硬體包括主機板4、硬碟203/電源盒9以及相應的散熱器,主機箱外殼1/骨架內設有隔板3,隔板3將主機箱外殼1/骨架所構成的空腔一分為二,主機板4固定在隔板3的一個側面上,該側面為隔板3的正面。硬碟203/電源盒9設在隔板3的另一個側面上,該側面為隔板3的背面。主機板4、硬碟203/ 電源盒9均與隔板3的側面平行,隔板3正面或/和背面或隔板3內設有電路,在隔板3上設有用於電腦硬體進行電路連接的隔板插座。隔板3是金屬材質製造時,稱為金屬隔板。 As shown in FIG. 1 to FIG. 14, a computer mainframe includes a main casing 1 frame and a computer hardware, wherein the computer hardware includes a motherboard 4, a hard disk 203/power box 9 and a corresponding heat sink, and the main casing 1 / The skeleton is provided with a partition 3 which divides the cavity formed by the main casing 1 / skeleton into two, and the main plate 4 is fixed on one side of the partition 3 which is the front of the partition 3 . A hard disk 203/power supply box 9 is provided on the other side of the partition 3, which is the back surface of the partition 3. Motherboard 4, hard disk 203/ The power box 9 is parallel to the side surface of the partition 3, and the circuit board 3 is provided with a circuit on the front side or/and the back side or the partition 3, and the partition plate 3 is provided with a partition socket for computer hardware connection. When the separator 3 is made of a metal material, it is called a metal separator.
該電腦主機為立式超薄電腦主機,總體輪廓體型為扁平的方體,但局部的邊角、平面有不同的角度或構造,體積是傳統PC主機箱的約1/6,滿載硬體的情況下,此超薄主機是傳統PC主機箱重量的一半左右。同時,可以安裝支持目前市場上幾乎所有PC類的主機板4型號(如:ATX、M-ATX、ITX等)。隔板3上安裝有光碟機204,優先安裝支援14mm厚度以內的薄型光碟機204。此超薄主機內的各硬體進行了重新配置、連接形式定義。箱內有一金屬平板,各硬體有序的平行安裝在該金屬平板的兩面上,用戶可極為快捷、準確的拆裝、組配所需的硬體;此超薄主機有一相匹配的一體式“U”字形滑蓋2外殼(此滑蓋2外殼可為透明、半透明的材質),為使用者打開/封閉此主機提供了極為簡便的操作模式。隔板3的正面上還設置有主機板支撐柱31(主機板4安裝其上)、隔板3隱形電路、隔板插座、CPU散熱器6扣具5、CUP附加散熱器、內壁擴充插座205、主機板I/O擋板隔板卡槽16。 The computer mainframe is a vertical ultra-thin computer mainframe, and the overall contour is a flat square body, but the partial corners and planes have different angles or structures, and the volume is about 1/6 of the traditional PC main box, full of hardware. In this case, this ultra-thin host is about half the weight of a traditional PC mainframe. At the same time, you can install motherboard 4 models (such as ATX, M-ATX, ITX, etc.) that support almost all PCs currently on the market. The optical disk drive 204 is attached to the partition plate 3, and the thin optical disk drive 204 supporting the thickness of 14 mm is preferentially mounted. The hardware in this ultra-thin host has been reconfigured and the connection form is defined. There is a metal plate in the box, and the hardware is arranged in parallel on both sides of the metal plate. The user can disassemble and assemble the required hardware extremely quickly and accurately; the ultra-thin host has a matching integrated body. The U-shaped slider 2 housing (this slider 2 housing can be a transparent, translucent material) provides an extremely simple mode of operation for the user to open/close the unit. The front side of the partition plate 3 is further provided with a main board support column 31 (the main board 4 is mounted thereon), the partition 3 stealth circuit, the partition socket, the CPU heat sink 6 buckle 5, the CUP additional heat sink, the inner wall expansion socket 205. The motherboard I/O baffle partition slot 16 is provided.
具體結構如下: The specific structure is as follows:
01)主機板支撐柱31 01) Motherboard support column 31
隔板3的正面設有主機板支撐柱31,主機板4通過主機板支撐柱31固定在隔板3面上。主機板支撐柱31內有垂直於隔 板3板面的內螺紋孔或與膨脹卡銷相匹配的卡銷孔,所述主機板支撐柱31將主機板4平行懸離於隔板3正面上,且主機板4背面與隔板3正面相對,通過螺絲或膨脹卡銷將主機板4固定在隔板3上的主機板支撐柱31中。主機板4與隔板3懸離,使得主機板4背面電路板上凸出的針腳不會與隔板3板面相觸而引發短路的可能性。 The front surface of the partition plate 3 is provided with a main board support column 31, and the main board 4 is fixed on the surface of the partition plate 3 through the main board support column 31. The main board support column 31 has a vertical partition An internal threaded hole of the plate 3 or a matching pin hole matched with the expansion bayonet, the main board support column 31 suspends the main board 4 in parallel on the front surface of the partition 3, and the back surface of the main board 4 and the partition 3 Facing the front side, the main board 4 is fixed to the main board support column 31 on the partition 3 by screws or expansion detents. The motherboard 4 and the partition 3 are suspended so that the protruding pins on the circuit board on the back of the motherboard 4 do not come into contact with the surface of the partition 3 to cause a short circuit.
在隔板3的正面上設置若干個主機板支撐柱31,凸出於隔板3板面的高度為4~7mm,且這些主機板支撐柱31的分佈位置與所對應支援的主機板4的安裝孔位相一一匹配。主機板支撐柱31為導電金屬材質,且與隔板3緊固、導電相連。 A plurality of main board support columns 31 are disposed on the front surface of the partition plate 3, and the height of the board surface of the partition plate 3 is 4-7 mm, and the distribution positions of the main board support columns 31 and the corresponding supporting main board 4 are The mounting holes are matched one by one. The main board support column 31 is made of a conductive metal material and is fastened and electrically connected to the partition plate 3.
本申請文件中的主機板支撐柱31不但具備傳統主機箱裡主機板支撐柱31的功能外,還因為此超薄PC主機箱將隔板3設計為整機直流負極/接地承載的主導體,而普通主機板的安裝孔是與主機板4的輸出直流負極及接地相連通的,導電螺絲或卡銷通過主機板安裝孔47固定在隔板3上的主機板支撐柱31中,即實現了主機板4的輸出直流負極/接地與隔板3的直接連通。 The motherboard support column 31 in the present application not only has the function of the main board support column 31 in the conventional main box, but also because the ultra-thin PC main box is designed as the main body of the DC negative/ground bearing of the whole machine. The mounting hole of the common motherboard is connected to the output DC negative pole and the ground of the motherboard 4, and the conductive screw or the bayonet is fixed to the motherboard support column 31 on the partition 3 through the motherboard mounting hole 47, thereby realizing The output DC negative/ground of the motherboard 4 is in direct communication with the bulkhead 3.
02)具有隱形電路的隔板3, 02) a partition 3 having an invisible circuit,
上述電路為扁平的導體電路且導體的最大厚度0.5mm,扁平的導體電路與隔板3間相互絕緣,扁平的導體電路表面高度不高於其周圍隔板3表面的高度,除安裝插座的區域外其他整個電路表面有絕緣和耐磨層的覆蓋。隔板3的兩面上都平行安裝了許多硬體,將各硬體間相連接的大部分走線,採用上述非常扁平 的導體電路覆蓋於隔板3表面上或內嵌於隔板3中,進行密集配置、集中走線,高效解決了各硬體間的信號、供電傳輸,重新配置各硬體,大大縮小了主機箱的體積。 The above circuit is a flat conductor circuit and the maximum thickness of the conductor 0.5mm, the flat conductor circuit and the partition 3 are insulated from each other, and the surface height of the flat conductor circuit is not higher than the height of the surface of the partition plate 3 around it, except for the area where the socket is mounted, the entire circuit surface has an insulating layer and an abrasion resistant layer. cover. A plurality of hard bodies are mounted on both sides of the partition plate 3 in parallel, and most of the wires connecting the respective hard bodies are covered on the surface of the partition plate 3 or embedded in the partition plate 3 by using the above-mentioned very flat conductor circuit. Intensive configuration, centralized routing, efficient resolution of the signal between the hardware, power transmission, re-configuration of each hardware, greatly reducing the size of the main chassis.
隔板3為玻璃纖維/半玻璃纖維基印製電路內嵌隔板3、金屬基印製電路板、FPC軟線排內嵌隔板3、超薄絕緣銅片內嵌隔板3或金屬基導電塗層電路隔板3。可為各硬體提供安裝固定支撐的平臺。 The partition plate 3 is a glass fiber/semi-glass fiber-based printed circuit embedded partition plate 3, a metal-based printed circuit board, an FPC flexible wire inner embedded partition plate 3, an ultra-thin insulating copper plate embedded partition plate 3 or a metal-based conductive Coating circuit separator 3. A platform for mounting fixed supports can be provided for each hardware.
優選地,隔板3為玻璃纖維/半玻璃纖維基印製電路內嵌隔板3,其中玻璃纖維/半玻璃纖維為基板,製作成符合設計要求的電路佈線和物理形狀的玻璃纖維/半玻璃纖維基PCB電路板,隔板3為鋁合金或銅材質的金屬平板,在隔板3上一面或雙面設計的位置,加工出與對應PCB電路板形狀和尺寸厚度相對等的凹槽,將PCB電路板緊密貼覆在隔板3上對應的凹槽內,使PCB電路板表面與其所在隔板3表面處於同一平面高度。由於隔板3上的扁平導體電路與隔板3緊密貼合一體,除開此電路的焊接點、接觸點之外,整個電路表面進行了絕緣層和耐磨層的覆蓋處理,所以幾乎看不到隔板3上的電路,故稱為“隱形電路隔板3”。隱形電路隔板3上的扁平導體電路,以下簡稱為“隔板電路32”。內嵌PCB電路板的隔板3整面上進行絕緣、耐磨層的覆蓋。 Preferably, the separator 3 is a glass fiber/semi-glass fiber-based printed circuit-embedded separator 3, wherein the glass fiber/semi-glass fiber is a substrate, and the glass fiber/semi-glass is formed to meet the design requirements of the circuit wiring and the physical shape. The fiber-based PCB circuit board, the partition plate 3 is a metal plate made of aluminum alloy or copper, and a groove which is opposite to the shape and size of the corresponding PCB circuit board is processed at a position of one or both sides of the partition plate 3, The PCB circuit board is closely attached to the corresponding recess in the partition 3, so that the surface of the PCB circuit board is at the same plane height as the surface of the partition 3 on which it is placed. Since the flat conductor circuit on the separator 3 is closely integrated with the separator 3, the entire circuit surface is covered with the insulating layer and the wear layer except for the solder joints and the contact points of the circuit, so that almost no visible is observed. The circuit on the spacer 3 is referred to as "invisible circuit spacer 3". The flat conductor circuit on the hidden circuit board 3 is hereinafter referred to as "separator circuit 32". The partition 3 of the embedded PCB circuit board is covered with an insulating layer and a wear layer.
具體的操作過程為,在隔板3上加工出深0.1~1mm的凹槽,凹槽的位置、形狀、尺寸依走線的具體需求而定,再將超薄印刷集成PCB電路板填充至此凹槽中,隔板3凹槽與PCB電路板 表面都進行絕緣塗層處理,通過粘合劑將PCB電路板無縫緊固在對應的隔板3凹槽內。緊固好後,PCB電路板表面高度基本與所在的隔板3板面高度一致,最後再在緊固好的,內嵌PCB電路板的隔板3整面上進行絕緣、耐磨的塗層,這樣隔板3與PCB電路板表面上就合為一體,也幾乎看不到裡面的電路。 The specific operation process is to process a groove having a depth of 0.1 to 1 mm on the partition plate 3. The position, shape and size of the groove are determined according to the specific requirements of the wire, and then the ultra-thin printed integrated PCB circuit board is filled to the concave surface. In the groove, the partition 3 groove and the PCB circuit board The surface is subjected to an insulating coating treatment, and the PCB circuit board is seamlessly fastened in the corresponding groove of the separator 3 by an adhesive. After tightening, the surface height of the PCB circuit board is basically the same as the height of the board surface of the partition plate 3, and finally the insulating and wear-resistant coating is applied on the entire surface of the partition plate 3 in which the PCB circuit board is fastened. Therefore, the partition 3 is integrated with the surface of the PCB circuit board, and the circuit inside is hardly seen.
由於考慮到隔板3背面更需要導熱散熱,加上簡化設計、製程,統一將PCB電路板內嵌於隔板3的正面中。 Since the heat dissipation and heat dissipation of the back surface of the separator 3 is required, and the simplified design and process are integrated, the PCB circuit board is uniformly embedded in the front surface of the separator 3.
優選地,隔板3為超薄絕緣銅片內嵌隔板3,即用蝕刻、CNC銑床加工或模具一體成型的製程,將金屬平板(隔板3)上需要走線的位置區域加工成所需的形狀、尺寸的凹槽。用蝕刻或模具衝壓剪切製程再將厚度為0.05~0.5mm厚度的銅片製作成設計所需的各種走線,且這些銅質的走線密集排列後的最外輪廓規格與該金屬平板(隔板3)上凹槽的形狀、尺寸相匹配。將金屬平板(隔板3)上的凹槽和加工後的超薄銅片走線,表面進行絕緣處理,最後通過粘合劑將超薄絕緣銅片走線緊密嵌入金屬平板(隔板3)上所對應的凹槽位置內,且超薄銅片走線的表面高度不高於其周圍金屬平板(隔板3)的表面高度。此製程方案適合在金屬平板(隔板3)上設計排列過大電流的電路走線。 Preferably, the partition plate 3 is an ultra-thin insulating copper plate embedded with the partition plate 3, that is, a process of etching, CNC milling or die-molding, and processing the position of the metal plate (separator 3) where the wire is required to be processed into a place. The desired shape and size of the groove. Etching or die stamping process is used to make copper sheets with a thickness of 0.05~0.5mm into various traces required for design, and the outermost outlines of these copper traces are densely arranged with the metal plate ( The shape and size of the grooves on the partition 3) match. The groove on the metal plate (separator 3) and the processed ultra-thin copper piece are routed, the surface is insulated, and finally the ultra-thin insulating copper piece is closely embedded in the metal plate (separator 3) by an adhesive. In the corresponding groove position, the surface height of the ultra-thin copper wire is not higher than the surface height of the surrounding metal plate (separator 3). This process scheme is suitable for designing circuit traces that are arranged with excessive current on a metal plate (separator 3).
優選地,隔板3為FPC軟線排內嵌隔板3,除了嵌入的電路材質為FPC軟線排之外,其他內嵌入隔板3中的製程與上述“玻璃纖維/半玻璃纖維基印製電路內嵌隔板3”基本一致。 Preferably, the partition 3 is an FPC flexible wire interposer 3, except that the embedded circuit material is an FPC flexible wire, the other processes embedded in the separator 3 and the above-mentioned "glass fiber/semi-glass fiber-based printed circuit" The embedded partitions 3" are substantially identical.
優選地,隔板3為金屬基導電塗層電路隔板3,即在金屬 表面覆蓋有絕緣層,再在絕緣層上用液態/膠態/粉末的導電塗料塗畫成所需的走線電路,再經風乾或高溫後固化,形成穩固的導電電路塗層,最後再在整個電路隔板3上進行絕緣、耐磨層的覆蓋(連接隔板插座的局部區域除外)。此方案所用的塗料和製程都比較偏貴。 Preferably, the separator 3 is a metal-based conductive coating circuit separator 3, that is, in a metal The surface is covered with an insulating layer, and then coated with a liquid/colloidal/powder conductive coating on the insulating layer to form a desired trace circuit, and then air-dried or cured at a high temperature to form a stable conductive circuit coating, and finally The entire circuit board 3 is covered with an insulating and wear-resistant layer (except for a partial area connecting the bulkhead sockets). The coatings and processes used in this solution are relatively expensive.
隔板3與電腦主機箱的金屬外殼或骨架是同一材質的且構成一體,通過模具將材料熱熔或擠壓後一體成型而成。隔板3和電腦主機箱的金屬骨架或外殼也可以是分離獨立的,隔板3與主機箱金屬骨架或外殼內壁之間焊接固定。因為隔板3與主機箱金屬外殼相連,為平行貼觸安裝在隔板3表面的硬體提供良好的導熱、散熱支援。上述“主機箱的金屬外殼”即圖中“主機箱外殼1”。 The partition plate 3 is made of the same material as the metal casing or the skeleton of the mainframe of the computer, and is integrally formed by heat-melting or extruding the material through a mold. The metal frame or the outer casing of the partition 3 and the mainframe of the computer may also be separated and separated, and the partition 3 is welded and fixed to the metal frame of the main box or the inner wall of the outer casing. Because the partition 3 is connected to the metal casing of the main box, it provides good heat conduction and heat dissipation support for the hardware attached to the surface of the partition 3 in parallel. The above-mentioned "metal case of the main chassis" is the "main case 1" in the figure.
具有金屬隱形電路的隔板3與主機箱金屬外殼或骨架固定相連的製程方式為:一體式,即隔板3與主機箱金屬外殼或骨架是同一材質的、一體的,用模具將材料熱熔或擠壓後一體成形的。再在成型後的主機箱內的隔板3上進行製程加工,使隔板3上/內排列有設計所需的超薄電路走線;回流焊,隔板3和主機箱金屬骨架或外殼是分離獨立的,隔板3上/內已經先加工好了設計所需的超薄電路走線,之後將隔板3與主機箱金屬骨架或外殼內壁所要連接固定的部位,先塗抹好焊料,組合匹配好後,再放入回流設備中進行回流焊接。出來冷卻後,隔板3就與主機箱金屬骨架或外殼相緊密固定了。 The manufacturing method of the partition 3 with the metal invisible circuit and the metal shell or the skeleton of the main box is fixed: the integral type, that is, the partition 3 and the metal shell or the skeleton of the main box are of the same material, and the material is thermally melted by the mold. Or integrally formed after extrusion. Then, the process is processed on the partition 3 in the formed main box, so that the ultra-thin circuit traces required for the design are arranged on/in the partition 3; the reflow soldering, the partition 3 and the metal frame or the outer casing of the main box are Separate and independent, the ultra-thin circuit traces required for the design have been processed on/in the separator 3, and then the solder joint is applied to the metal frame of the main frame or the inner wall of the outer casing. After the combination is matched, it is placed in a reflow device for reflow soldering. After cooling out, the partition 3 is tightly fixed to the metal frame or outer casing of the main box.
03)隔板插座 03) partition socket
隔板插座直接焊接或貼觸連接在對應的隔板3的電路上,隔板插座的硬體介面類別型包括SATA 2.0資料介面、SATA 3.0資料介面、SATA Express硬碟203介面、SAS硬碟203介面、SATA 7+15pin資料+供電 硬碟203介面、SATA 7+6pin資料+供電 光碟機204介面、主機板4的開機啟動插針POWER SW、主機板4的重新啟動插針RESET SW、USB 3.0 19/20pin插口、USB 2.0 9pin插口、主機板4的音訊插針HD AUDIO、獨立顯示卡7的PCI-E 16X插槽、主機板4的主供電24pin插槽、主機板4的輔助供電4/8pin插槽和獨立顯示卡7的輔助供電6/8pin插槽,或者是上述硬體介面的任意組合。主機箱內的某些硬體可直接插入隔板插座中使用,有的則需通過FFC線排將硬體與對應的隔板插座相連接,所以,隔板插座為了與眾硬體相匹配連接,具有不同的介面類別型和形狀尺寸。隔板插座根據不同硬體的介面類別型將主機箱內的硬體與對應的隔板電路32相對接。FFC線排的優點是超薄柔軟、精準、能過較大電流,適用於隔板插座與硬體間短距離的對接。 The separator socket is directly soldered or contacted to the circuit of the corresponding partition 3. The hardware interface type of the partition socket includes SATA 2.0 data interface, SATA 3.0 data interface, SATA Express hard disk 203 interface, SAS hard disk 203 Interface, SATA 7+15pin data + power hard disk 203 interface, SATA 7+6pin data + power supply CD player 204 interface, motherboard 4 boot pin POWER SW, motherboard 4 restart pin RESET SW, USB 3.0 19/20pin socket, USB 2.0 9pin jack, audio pin HD AUDIO for motherboard 4, PCI-E 16X slot for independent display card 7, main power supply 24pin slot for motherboard 4, auxiliary power supply for motherboard 4/ The 8pin slot and the auxiliary power supply 6/8pin slot of the independent display card 7, or any combination of the above hardware interfaces. Some hardware in the main chassis can be directly inserted into the bulkhead socket, and some need to be connected to the corresponding bulkhead socket through the FFC wire, so the bulkhead socket is matched with the hardware. , with different interface category types and shape sizes. The bulkhead sockets interface the hardware in the main chassis with the corresponding bulkhead circuit 32 according to the interface type of the different hardware. The advantage of the FFC line is that it is ultra-thin, soft, accurate, and capable of passing a large current. It is suitable for short-distance docking between the partition socket and the hardware.
上述文中的“隔板插座”為下述“焊接式/固定式隔板插座”和“活動式隔板插座”的統稱。 The "separator socket" described above is a general term for the following "welded/fixed bulkhead socket" and "movable bulkhead socket".
根據主機箱內的配置和設計需求,隔板插座分為焊接式和活動式。焊接式,“隔板插座”的底部有序排列著該插座對應的針腳(引腳),隔板電路32相應的安裝位置上有焊接點,將“隔 板插座”底部的針腳(引腳)直接焊接固定於對應的隔板電路32的焊接點位置上。焊接式隔板插座也稱為固定式隔板插座34。 The bulkhead sockets are divided into welded and movable types according to the configuration and design requirements in the main chassis. The soldering type, the bottom of the "separator socket" is arranged with the corresponding pins (pins) of the socket, and the corresponding position of the spacer circuit 32 has solder joints, which will be separated. The pins (pins) at the bottom of the board socket are directly soldered to the solder joint locations of the corresponding bulkhead circuit 32. The soldered bulkhead sockets are also referred to as fixed bulkhead sockets 34.
活動式,“隔板插座”的底部有序排列著該插座對應的針腳(引腳),且這些針腳(引腳)以裸露的導電金屬彈片104的形式存在,在“隔板插座”底部金屬彈片104的周邊有若干個定位銷94。活動式隔板插座35一般用於同一隔板3位置可安裝不同硬體的設計,即在不增加主機箱體積的情況下,增加主機箱內能支援擴充的硬體數量和類型。 In the movable type, the bottom of the "baffle socket" is arranged with the corresponding pins (pins) of the socket, and these pins (pins) are in the form of exposed conductive metal domes 104, and the metal at the bottom of the "separator socket" There are a plurality of positioning pins 94 around the shrapnel 104. The movable partition socket 35 is generally used for the design of different hardware in the same partition 3 position, that is, the number and type of hardware capable of supporting expansion in the main box can be increased without increasing the volume of the main box.
隔板電路32上用於安裝“活動式隔板插座35”的區域呈內凹形構造33,內凹區域中有序配置著裸露導電、平整的電路接觸點,所述“電路接觸點”為圖中的“內凹形接觸點33”。在內凹區域外周邊的隔板3上有若干個定位孔36,且這些定位孔36的大小、數量、孔距與與之匹配的“活動式隔板插座35”底部的定位銷94完全一致。 The area of the baffle circuit 32 for mounting the "moving baffle receptacle 35" has a concave configuration 33 in which the exposed conductive, flat circuit contacts are arranged in an orderly manner. The "circuit contact point" is "Inner concave contact point 33" in the figure. There are a plurality of positioning holes 36 in the partition 3 on the outer periphery of the concave area, and the size, the number, and the hole distance of the positioning holes 36 are completely identical with the matching positioning pins 94 at the bottom of the "moving bulkhead socket 35". .
當活動式隔板插座35的底部對向隔板電路32上的安裝區域時,只有當此介面類別型的活動式隔板插座35與隔板電路32上內凹區域中的電路接觸點配置規格、電路定義、插座方向完全相匹配時,活動式隔板插座35底部的定位銷94才能插入到該隔板電路32內凹區域邊的定位孔36中,最後通過螺絲/膨脹卡銷將活動式隔板插座35固定在隔板3上,此時“活動式隔板插座35”底部的導電金屬彈片104與隔板電路32上內凹區域中的電路接觸點完全、精準相互一一貼觸連通。由於活動式隔板插座35在隔板 電路32上的安裝位置是一塊內凹形區域,內凹區域中有裸露的電路接觸點,當同一位置安裝了其他硬體時,內凹區域中的裸露電路接觸點的表面高度低於周圍隔板3表面的高度,所以不會因為觸碰到其他硬體而產生短路。在不使用該內凹區域時,可用配套的絕緣貼片將該內凹區域填平,產生隔離絕緣和防塵的作用。 When the bottom of the movable bulkhead receptacle 35 faces the mounting area on the bulkhead circuit 32, only the circuit contact point configuration specifications in the recessed area of the movable partition receptacle 35 of the interface type and the spacer circuit 32 are specified. When the circuit definition and the socket direction are completely matched, the positioning pin 94 at the bottom of the movable partition socket 35 can be inserted into the positioning hole 36 of the concave portion of the partition circuit 32, and finally the movable type by the screw/expansion bayonet The spacer socket 35 is fixed on the partition plate 3. At this time, the conductive metal dome 104 at the bottom of the movable spacer socket 35 and the circuit contact points in the concave portion of the spacer circuit 32 are completely and accurately connected to each other. . Due to the movable partition socket 35 in the partition The mounting position on the circuit 32 is an inner concave area having exposed circuit contact points in the concave area. When other hardware is installed at the same position, the surface height of the bare circuit contact point in the concave area is lower than the surrounding space. The height of the surface of the board 3, so there is no short circuit caused by touching other hardware. When the recessed area is not used, the recessed area can be filled with a matching insulating patch to provide isolation insulation and dustproof.
簡而言之,隔板插座的底部有序排列著該插座對應的引腳,隔板電路32相應的安裝位置上有焊接點,所述隔板插座底部的引腳直接焊接固定於對應的隔板電路32位置上;或者隔板插座的底部有序排列著該插座對應的引腳,且這些引腳以裸露的導電金屬彈片104的形式存在,在隔板插座底部的所述彈片104的周邊設有定位銷94,在隔板3上用於安裝所述隔板插座的區域呈內凹形構造,內凹區域中有序配置著裸露導電、平整的電路接觸點,在內凹區域外周邊的隔板3上設有相應的定位孔36,隔板插座通過螺絲/膨脹卡銷固定在隔板3上,隔板插座底部的導電金屬彈片104與隔板3上內凹區域中的電路接觸點一一精準貼觸導通。 Briefly, the bottom of the spacer socket is arranged with the corresponding pins of the socket, and the corresponding mounting position of the spacer circuit 32 has soldering points, and the pins at the bottom of the spacer socket are directly soldered and fixed to the corresponding spacers. The board circuit 32 is positioned; or the bottom of the bulkhead socket is arranged with the corresponding pins of the socket, and the pins are present in the form of bare conductive metal domes 104 around the shrapnel 104 at the bottom of the bulkhead socket. The positioning pin 94 is disposed, and the area for mounting the partition socket on the partition 3 has a concave structure, and the exposed conductive and flat circuit contact points are arranged in the concave area, and the outer periphery of the concave area The partition plate 3 is provided with a corresponding positioning hole 36. The partition hole is fixed to the partition plate 3 by a screw/expansion bayonet. The conductive metal dome 104 at the bottom of the partition plate is in contact with the circuit in the concave area on the partition plate 3. Point one by one to accurately touch the conduction.
主機箱內有些硬體可直接插入“隔板插座”中使用,如3.5寸、2.5寸硬碟202,因其為較常更替使用的硬體,這樣可直插使用的設計,非常快捷人性化。那些無法直接插入“隔板插座”中使用的硬體,則採用最短執行緒連接的理念,用軟線排將這些硬體與匹配的“隔板插座”相對接,也大大縮減了硬體間的走線,使整機內簡潔、美觀。 Some hardware in the main chassis can be directly inserted into the "separator socket", such as 3.5-inch, 2.5-inch hard disk 202, because it is a more commonly used hardware, so that the design can be used directly, very fast and user-friendly . Hardware that can't be directly plugged into the “Baffle Socket” uses the concept of the shortest thread connection. The cable is used to connect these hardware to the matching “separator socket”, which greatly reduces the hardware. The wiring is made to make the whole machine simple and beautiful.
04)主機板4朝向 04) Motherboard 4 orientation
由上所述,主機板4是背靠隔板3正面,平行固定在隔板3正面的主機板支撐柱31上。因為主機箱為立式設計,一方面考慮到整機的重心要儘量下移,而主機板4靠近CPU位的一端是明顯偏重的,朝下放置可以使主機箱的整體重心下移,使主機箱在立式的時候更加平穩;另一方面,主機箱為立式的,其內的空氣熱流是不斷向上升騰的,匯聚在主機箱內空間上層,相對於上層氣流,主機箱下層氣流的溫度要偏低,所以靠近CPU的主機板4北端邊朝下放置,更加有利於CPU散熱器6在氣流中的散熱效果。 As described above, the main board 4 is abutted against the front surface of the partition 3, and is fixed in parallel to the main board support column 31 on the front side of the partition 3. Because the mainframe is of vertical design, on the one hand, the center of gravity of the whole machine should be moved down as much as possible, and the end of the motherboard 4 close to the CPU is obviously biased, and the downward placement can lower the overall center of gravity of the mainframe, so that the host The box is more stable in the vertical mode; on the other hand, the main box is vertical, and the air heat flow inside is continuously rising, and is concentrated in the upper space of the main box, and the temperature of the lower airflow of the main box relative to the upper air flow. To be low, the north end of the motherboard 4 near the CPU is placed downward, which is more conducive to the heat dissipation effect of the CPU heat sink 6 in the airflow.
因此,將靠近CPU位的主機板4北端邊朝下(可垂直,也可向下的方向與垂直間的夾角5°),主機板4西端邊(即主機板I/O介面組41的一端)朝向主機箱的尾部13,主機板4背面對向隔板3正面,平行於隔板3固定在主機板支撐柱31上。由於在主機板4的北端邊與西端邊間的角邊位置,有一個主機板輔助供電插槽46,以就近走線連接的原則,在主機板4北端邊投影到隔板3正面上的區域,靠近此主機板輔助供電插槽46的隔板3正面位置上有一隔板插座。此隔板插座的底部針腳(引腳)與隔板電路32中的輸出+12V DC和直流負極(接地)分別有序連接,通過導線一頭與主機板4上的主機板輔助供電插槽46插入連通,導線的另一端插入該隔板插座連通,使隔板3上對應的供電電路與主機板4上的主機板輔助供電插槽46相連通。 Therefore, the north end side of the motherboard 4 near the CPU position is downward (can be vertical, or the angle between the downward direction and the vertical direction) 5°), the west end of the motherboard 4 (ie, one end of the motherboard I/O interface group 41) faces the tail 13 of the main chassis, and the back of the motherboard 4 faces the front of the partition 3, and is fixed to the main board support parallel to the partition 3. On the column 31. Due to the angular position between the north end side and the west end side of the main board 4, there is a main board auxiliary power supply slot 46, which is projected on the front side of the partition 3 on the north end side of the main board 4 on the principle of the near-line connection. There is a bulkhead socket on the front side of the partition 3 adjacent to the motherboard auxiliary power supply slot 46. The bottom pin (pin) of the baffle socket is sequentially connected to the output +12V DC and the DC negative (ground) in the baffle circuit 32, respectively, through one end of the wire and the main board auxiliary power supply slot 46 on the main board 4. In communication, the other end of the wire is inserted into the bulkhead socket to communicate with the corresponding power supply circuit of the partition 3 and the motherboard auxiliary power supply slot 46 on the motherboard 4.
即,主機板4是背靠隔板3正面,靠近CPU位的主機板 4北端邊朝下,主機板4西端邊即主機板I/O介面組41的一端朝向主機箱的尾部, 在主機板4北端邊投影到隔板3正面上的區域,靠近主機板4的輔助供電插槽的隔板3正面位置上有一隔板插座,所述隔板插座的底部針腳與隔板電路32連接,通過導線一頭與主機板4上的主機板輔助供電插槽46插入連通,導線的另一端插入該隔板插座連通,使隔板3上對應的供電電路與主機板4上的主機板輔助供電插槽46相連通。 That is, the motherboard 4 is a motherboard that is placed against the front of the partition 3 and is close to the CPU. 4 The north end side faces downward, and one end of the motherboard 4, that is, one end of the motherboard I/O interface group 41 faces the tail of the main chassis. Projected on the north end of the motherboard 4 to the area on the front side of the partition 3, a partition receptacle is disposed on the front side of the partition 3 adjacent to the auxiliary power supply slot of the motherboard 4, and the bottom pin and partition circuit 32 of the bulkhead socket The connection is connected to the motherboard auxiliary power supply slot 46 on the motherboard 4 through a wire, and the other end of the wire is inserted into the bulkhead socket to connect the corresponding power supply circuit on the partition 3 with the motherboard on the motherboard 4. The power supply slots 46 are in communication.
05)CPU的散熱器以及CPU散熱器的安裝固定裝置 05) CPU heat sink and CPU heat sink mounting fixture
該電腦CPU的散熱器包括CPU附加散熱器64和CPU散熱器6,CPU散熱器6通過一H型橋壓扣具支架固定,亦即該CPU散熱器的安裝固定裝置,H型橋壓扣具支架包括兩條滑動杆52,兩條滑動杆52中間區段呈相互平行的狀態,兩條滑動杆52兩端部都彎折,往外呈45°夾角,在兩條滑動杆52兩端部的彎折的區段上各有一個可在該區段上移動的支撐柱51,支撐柱51底端有一個膨脹卡頭,此膨脹卡頭大小、形狀是與主機板4上的CPU散熱器6安裝孔相匹配的。那麼,兩條滑動杆52彎折的兩端共有4個可移動的支撐柱51,由於不同型號的主機板4,其4個CPU散熱器6安裝孔之間的孔距也不同,所以滑動杆52兩端的支撐柱51設計成可移動的,就能滿足各種不同的CPU散熱器6安裝孔間的孔距需求,與之匹配安裝固定。H型橋壓扣具支架就是前述扣具5。支撐柱51也稱為扣具支撐柱。 The heat sink of the computer CPU includes a CPU additional heat sink 64 and a CPU heat sink 6. The CPU heat sink 6 is fixed by an H-bridge clamp device, that is, the mounting and fixing device of the CPU heat sink, the H-bridge press buckle The bracket comprises two sliding rods 52. The middle sections of the two sliding rods 52 are in parallel with each other. Both ends of the two sliding rods 52 are bent at an angle of 45° outward, at the two ends of the two sliding rods 52. Each of the bent sections has a support post 51 movable on the section. The bottom of the support post 51 has an expansion chuck. The size and shape of the expansion chuck are the same as the CPU heat sink 6 on the motherboard 4. The mounting holes are matched. Then, there are four movable support columns 51 at the two ends of the two sliding rods 52. Because of different types of the motherboard 4, the hole spacing between the mounting holes of the four CPU heat sinks 6 is different, so the sliding rod The support columns 51 at both ends of the 52 are designed to be movable, and can meet the hole spacing requirements of various mounting holes of the CPU heatsink 6, and are matched and fixed. The H-type bridge buckle bracket is the aforementioned buckle 5. The support post 51 is also referred to as a clip support post.
在兩條滑動杆52中間相平行的區段上設有一條可在兩條滑動杆52的杆軸方向上自由移動的橋壓杆53,所述橋壓杆53中間區段呈內凹槽構造,其中所述兩條滑動杆52為回彈性材質件或者橋壓杆53為回彈性材質件。由於此扣具5中的滑動杆52、橋壓杆53甚至導熱底座背面的凸起結構為回彈特性材質,不會因為人為緊固時受力過大或不均衡而導致導熱底座與CPU晶片42表面間接觸的導熱係數變化過大,也不易使主機板4變形彎曲。所述兩條滑動杆52和橋壓杆53組合一起構成所述“H”型結構,故此CPU的扣具5稱為“H型橋壓扣具支架”。 A bridge bar 53 which is freely movable in the direction of the axis of the two slide bars 52 is provided in a section parallel to the middle of the two slide bars 52, and the intermediate section of the bridge bar 53 has an inner groove structure. The two sliding rods 52 are resilient material members or the bridge pressing rods 53 are resilient material members. Since the sliding rod 52 of the buckle 5, the bridge bar 53 and even the convex structure on the back surface of the heat-conducting base are of a resilient characteristic material, the heat-conducting base and the CPU chip 42 are not caused by excessive force or imbalance during manual fastening. The thermal conductivity of the contact between the surfaces is excessively changed, and it is also difficult to deform and bend the main board 4. The two sliding rods 52 and the bridge pressing rods 53 are combined to form the "H" type structure, so the fastener 5 of the CPU is referred to as an "H-shaped bridge fastener bracket".
CPU附加散熱器64的一頭是扁直的真空熱導管蒸發端,另一頭是焊接有(CPU)散熱鰭片63的真空熱導管冷凝端,CPU附加散熱器64這兩端之間的區段加工成波紋管狀,大大提升了(CPU)真空熱導管62的彎曲性,用戶安裝起來更加容易操作和適應不同類型的主機板4。CPU附加散熱器64的冷凝端的底部為平整的,通過螺絲或卡扣貼觸固定在距離CPU最近的主機箱金屬外殼內壁上,從而將CPU導熱底座61的部分熱量傳遞到主機箱金屬外殼上和CPU附加散熱器64冷凝端的散熱鰭片上進行散熱。 One end of the CPU additional heat sink 64 is a flat vacuum heat pipe evaporation end, and the other end is a vacuum heat pipe condensation end to which the (CPU) heat sink fin 63 is welded, and the CPU is attached to the heat sink 64. The corrugated tube greatly enhances the flexibility of the (CPU) vacuum heat pipe 62, making it easier for the user to operate and adapt to different types of motherboards 4. The bottom of the condensation end of the CPU additional heat sink 64 is flat, and is fixed on the inner wall of the metal shell of the main box closest to the CPU by screws or snaps, thereby transferring part of the heat of the CPU heat-conducting base 61 to the metal shell of the main box. The heat is dissipated from the heat sink fins on the condensation end of the CPU attached heat sink 64.
CPU散熱器6為真空熱導管式散熱器,CPU散熱器6的底部有一導熱底座,安裝在CPU晶片42之上。在CPU散熱器6的導熱底座邊緣上,有一與導熱底座上排列的真空熱導管走向相垂直的溝槽,且此溝槽的形狀大小剛好與CPU附加散熱器64的蒸發端相匹配,CPU附加散熱器64的蒸發端配合卡入導熱底座邊 緣的溝槽內後,用蓋板和螺絲緊固在導熱底座邊緣上。導熱底座的正面是直接平行貼觸在CPU晶片42表面上的。而導熱底座的背面的大致中心位置有一凸起結構,橋壓杆53中間區段的內凹滑軌槽能剛好扣住此凸起結構,橋壓杆53放置於導熱底座背面之上。由於扣具5中的橋壓杆53通過導熱底座背面中心位置的凸起結構,將扣具5緊固時產生的下壓力集中作用於導熱底座的中心區域,這樣使導熱底座與CPU晶片42間接觸面的受力很均勻,使它們之間的導熱係數穩定。 The CPU heat sink 6 is a vacuum heat pipe type heat sink, and the bottom of the CPU heat sink 6 has a heat conducting base mounted on the CPU chip 42. On the edge of the heat-conducting base of the CPU heat sink 6, there is a groove perpendicular to the direction of the vacuum heat pipe arranged on the heat-conducting base, and the shape of the groove is just matched with the evaporation end of the CPU additional heat sink 64, and the CPU is attached. The evaporation end of the heat sink 64 fits into the side of the heat conductive base After the groove in the edge, fasten it to the edge of the heat-conducting base with a cover plate and a screw. The front side of the thermally conductive base is directly parallel to the surface of the CPU wafer 42. The substantially central position of the back surface of the heat-conducting base has a convex structure, and the concave sliding groove of the middle portion of the bridge pressing rod 53 can just buckle the protruding structure, and the bridge pressing rod 53 is placed on the back surface of the heat-conductive base. Since the bridge pressing rod 53 of the buckle 5 passes through the convex structure at the center position of the back surface of the heat-conducting base, the downward pressure generated when the buckle 5 is tightened is concentrated on the central area of the heat-conductive base, so that the heat-conductive base and the CPU chip 42 are interposed. The contact surfaces are evenly stressed, making the thermal conductivity between them stable.
導熱底座是通過橋壓杆53扣住其背面的凸起結構緊貼在CPU晶片42之上的,而橋壓杆53是活動固定在兩條滑動杆52上,兩條滑動杆52是通過活動式支撐柱51上的卡頭分別卡入主機板4上4個CPU散熱器6安裝孔內,最後將膨脹銷釘54插入支撐住中的銷孔中,從而將整個扣具5支架連同CPU散熱器6一起緊固在主機板4上。由於導熱底座背面凸起結構可在橋壓杆53內凹滑軌槽中移動,橋壓杆53又能在滑動杆52上移動,所以整個CPU散熱器6可在主機板4平面中的任意方向上小範圍的平移,大大降低了因為CPU散熱器6邊緣與主機板4上元配件位置相衝突而不能正常安裝的機率。 The heat conducting base is a convex structure that is fastened to the back surface of the CPU wafer 42 by the bridge pressing rod 53, and the bridge pressing rod 53 is movably fixed to the two sliding rods 52, and the two sliding rods 52 are movable. The chucks on the support columns 51 are respectively inserted into the mounting holes of the four CPU heat sinks 6 on the motherboard 4, and finally the expansion pins 54 are inserted into the pin holes in the support, thereby connecting the entire buckle 5 brackets together with the CPU heat sink. 6 is fastened together on the motherboard 4. Since the convex structure on the back surface of the heat conducting base can move in the concave sliding rail groove in the bridge pressing rod 53, the bridge pressing rod 53 can move on the sliding rod 52, so that the entire CPU heat sink 6 can be in any direction in the plane of the motherboard 4. The small-scale translation greatly reduces the probability that the edge of the CPU heat sink 6 cannot be properly installed due to the conflict with the position of the component on the motherboard 4.
CPU附加散熱器64採用的是活動式安裝方式,使用者可根據需求自由選擇是否安裝,而不需要更換整個CPU散熱器6,大大節省了用戶的經濟開支。主機箱雖然體積小,但巧妙的利用了主機箱的金屬外殼,將部分CPU熱量快速傳遞到外殼上進行散 熱,大大增加了散熱的有效面積。 The CPU additional heat sink 64 adopts a movable installation mode, and the user can freely select whether to install according to the demand, without replacing the entire CPU heat sink 6, which greatly saves the user's economic expenses. Although the main chassis is small in size, it cleverly utilizes the metal casing of the main box to quickly transfer part of the CPU heat to the casing for dispersion. The heat greatly increases the effective area of heat dissipation.
由於扣具5支架多處採用活動式固定設計,幾乎相容所有普通主機板型號,扣具5配件少、重量輕,拆裝操作極其便捷,徒手10秒便能完成拆裝。 Since the buckle 5 bracket adopts the movable fixed design in many places, it is almost compatible with all common motherboard models, the buckle 5 has few accessories and light weight, and the disassembly and assembly operation is extremely convenient, and the disassembly and assembly can be completed in 10 seconds.
並且,此超薄PC主機箱外殼的底部12中有一細長條形的進風開口,既增加了主機箱底板周圍的氣流交換;又因為這一條長長的開口,極大的阻礙了隔板3正面空間內的主機箱底板區域上的熱量傳遞到隔板3背面空間的主機箱底板區域和隔板3自身上,從而使貼觸安裝在隔板3正面空間內的主機箱底板上的CPU附加散熱器64傳遞過來的熱量既能更加快速的被氣流帶走,又不會傳遞到主機箱其他部位而影響其他硬體的散熱。 Moreover, the bottom 12 of the ultra-thin PC main box casing has an elongated strip-shaped air inlet opening, which increases the airflow exchange around the bottom of the main box; and because of this long opening, the front of the partition 3 is greatly hindered. The heat on the floor area of the main box in the space is transferred to the main board floor area of the back space of the partition 3 and the partition 3 itself, so that the CPU attached to the main board bottom plate installed in the front space of the partition 3 is additionally cooled. The heat transferred by the device 64 can be taken away by the airflow more quickly, and is not transmitted to other parts of the mainframe to affect the heat dissipation of other hardware.
06)內壁擴充插座205 06) inner wall expansion socket 205
其中電腦主機箱為立式,主機板4靠近CPU的一端即主機板4北端邊向下放置,主機板4南端邊向上,靠近主機板4南端邊的主機箱外殼內壁是主機箱的頂部內壁,在此內壁上垂直高於主機板4正面15~45mm的長條形區域中,活動安裝了一長條形的插座,構成主機箱內壁擴充插座205,所述內壁擴充插座205上包含有三種介面,DC+5V、直流負極的供電介面、7+6pin SATA光碟機204介面和7+15pin SATA硬碟介面。 The mainframe of the main board 4 is placed near the north end of the main board 4, and the south end of the main board 4 is upward. The inner wall of the main casing of the main board 4 is located at the top of the main box. In the elongated area of the inner wall which is vertically 15~45 mm higher than the front surface of the main board 4, a long strip-shaped socket is movably mounted to constitute an inner wall expansion socket 205 of the main box, and the inner wall expansion socket 205 It includes three interfaces, DC+5V, DC negative power supply interface, 7+6pin SATA optical drive 204 interface and 7+15pin SATA hard disk interface.
內壁擴充插座205採用長條形PCB電路板集中走線,長條形PCB電路板緊密貼合主機箱內壁,電路板部分延伸至隔板3正面的邊緣,且長條形PCB電路板延伸部分上的電路與隔板3上 對應的電路相一一對接,通過焊接連通固定。上述介面插座底部的引腳通過焊接固定或貼觸活動固定在長條形PCB電路板上對應的電路上,其插座介面的朝向與隔板3面相平行。 The inner wall expansion socket 205 adopts a long strip PCB circuit board to concentrate the wires, the long strip PCB circuit board closely fits the inner wall of the main box, the circuit board portion extends to the edge of the front surface of the partition plate 3, and the long strip PCB circuit board extends Part of the circuit and the partition 3 The corresponding circuits are connected in a pair and are fixed by welding. The pins on the bottom of the interface socket are fixed on the corresponding circuit of the long PCB circuit board by soldering or contact action, and the orientation of the socket interface is parallel to the surface of the partition 3.
考慮到光碟機204這種電腦硬體,大部分使用者使用頻率很低,所以人性化的將“內壁擴充插座205”設計成活動安裝式的,使用者可根據自己的使用需求選擇是否安裝。 Considering the computer hardware of the optical disk drive 204, most users use the frequency very low, so the user-friendly "inner wall expansion socket 205" is designed to be movable and installed, and the user can select whether to install according to his own use requirements. .
但薄型光碟機204或2.5寸硬碟202插入安裝在內壁擴充插座205中時,薄型光碟機204或2.5寸硬碟202平行於主機板4,且位於主機板4南端邊附近區域上空位置。考慮到實用性,薄型光碟機204的入碟口朝向主機箱的前面。巧妙地高效利用了主機板4南端邊附近上空的空閒空間,由於薄型光碟機204和2.5寸硬碟202十分輕小,發熱量很低,所以對整個主機箱的重心和散熱的影響幾乎可以忽略。此外,由於主機板4在南端邊有很多插針、插槽及走線,影響美觀,正好平行安裝在主機板4此位置上空的薄型光碟機204、2.5寸硬碟202,可以巧妙地遮擋住,使主機箱整體配置更加美觀。 When the thin optical disc drive 204 or the 2.5-inch hard disc 202 is inserted into the inner wall expansion socket 205, the thin optical disc drive 204 or the 2.5-inch hard disc 202 is parallel to the main board 4 and is located above the south end side of the main board 4. In view of practicality, the inlet port of the thin optical disk drive 204 faces the front of the main chassis. Cleverly and efficiently utilizes the free space above the south end of the motherboard 4, since the thin optical disc drive 204 and the 2.5-inch hard disc 202 are very light and low in heat generation, the influence on the center of gravity and heat dissipation of the entire main chassis is almost negligible. . In addition, since the motherboard 4 has a plurality of pins, slots and wires on the south end side, which affects the appearance, the thin optical disk drive 204 and the 2.5-inch hard disk 202 which are installed in parallel at the position of the motherboard 4 can be subtly blocked. To make the overall configuration of the mainframe more beautiful.
07)主機板I/O擋板隔板卡槽16 07) Motherboard I/O bezel partition card slot 16
在主機板4西端邊上I/O介面組所在的主機板4邊緣區段投影到隔板3上的位置設有主機板I/O擋板隔板卡槽16,所述卡槽為開有一條縫寬約1mm、縫深2~3mm的筆直凹槽/孔縫,開槽/開孔的總長尺寸主機板I/O擋板208(主機板4後擋板)的總長尺寸,在將主機板4裝入主機箱之前,先將主機板I/O擋板208 (主機板4後擋板)的一長邊卡入到該隔板3凹槽/孔縫中,再將整個主機板I/O擋板208(主機板4後擋板)卡入至主機箱尾部的主機板I/O擋板208(主機板4後擋板)相匹配的開孔中固定。由於本主機箱採用的是極限超薄設計理念,為了將主機板4在主機箱中所需佔用的高度空間降到最低,故將主機板I/O擋板208(主機板4後擋板)靠近主機板4背面的一邊卡入到隔板3的開槽中,且安裝方式與傳統主機箱一樣簡潔。 A board I/O baffle partition card slot 16 is disposed at a position where an edge portion of the motherboard 4 on which the I/O interface group is located on the west end of the motherboard 4 is projected onto the partition 3, and the card slot is opened. a straight groove/hole slit with a slit width of about 1 mm and a seam depth of 2 to 3 mm, the total length of the slot/opening The total length of the motherboard I/O bezel 208 (the motherboard 4 tailgate), before the motherboard 4 is loaded into the main chassis, the motherboard I / O bezel 208 (the motherboard 4 back panel) A long side snaps into the groove/hole of the partition 3, and then the entire motherboard I/O baffle 208 (the main board 4 tailgate) is snapped into the main board I/O baffle at the rear of the main box. The 208 (main board 4 tailgate) is fixed in the matching opening. Since the main box adopts the ultra-thin design concept, in order to minimize the space required for the main board 4 in the main box, the main board I/O baffle 208 (the main board 4 tailgate) The side near the back of the motherboard 4 is snapped into the slot of the partition 3 and is mounted in a manner as simple as a conventional mainframe.
隔板3背面的空間內安裝的硬體包括包含散熱器的獨立顯示卡7、電源盒9、渦輪風扇201、硬碟203、配電模組10且都是平行貼觸安裝在隔板3上,由於平行貼觸安裝在隔板3背面的多種硬體對散熱有一定的需求,所以隔板3背面除了與電源盒9、隔板插座、配電模組10安裝相匹配的內凹形隔板電路32接觸點之外,隔板3背面其他區域的表面是以平整、導熱的金屬平板呈現。具體結構如下: The hardware installed in the space on the back side of the partition 3 includes a separate display card 7 including a heat sink, a power supply box 9, a turbo fan 201, a hard disk 203, and a power distribution module 10, and are all mounted in parallel on the partition 3, Since the plurality of hard bodies mounted on the back surface of the partition plate 3 have a certain requirement for heat dissipation, the back surface of the partition plate 3 is not only matched with the power supply box 9, the bulkhead socket, and the power distribution module 10, and the concave partition circuit is matched. In addition to the 32 contact points, the surface of the other areas on the back side of the separator 3 is presented as a flat, thermally conductive metal plate. The specific structure is as follows:
08)獨立顯示卡7 08) Independent display card 7
獨立顯示卡7與隔板3背面相平行設置。本超薄電腦主機箱能夠安裝支持所有全高、半高、超長、大功率的獨立顯示卡7。所述獨立顯示卡7上的I/O介面與主機板4上的I/O介面朝向相同,獨立顯示卡7上的I/O介面區域部位與主機板4PCB板邊沿部錯開,主機板4PCB板邊沿為設置了1/O介面的PCB板邊沿部,即主機板4西端邊沿部。上述“獨立顯示卡7上的I/O介面”即為圖中“獨立顯示卡I/O介面組71”,上述“主機板4上的I/O 介面”即為圖中“主機板I/O介面組41”。 The independent display card 7 is disposed in parallel with the back surface of the partition 3. This ultra-thin computer mainframe can be installed to support all full-height, half-height, ultra-long, high-power independent display cards7. The I/O interface on the independent display card 7 is oriented in the same direction as the I/O interface on the motherboard 4, and the I/O interface area on the independent display card 7 is offset from the edge portion of the motherboard 4 PCB, and the motherboard 4 PCB board The edge is the edge portion of the PCB that is provided with the 1/O interface, that is, the west end edge of the motherboard 4. The above-mentioned "I/O interface on the independent display card 7" is the "independent display card I/O interface group 71" in the figure, and the above-mentioned "I/O on the motherboard 4" The interface is the "master board I/O interface group 41" in the figure.
獨立顯示卡7平行安裝在主機板4背面包括了以下2種形式: The parallel display of the independent display card 7 on the back of the motherboard 4 includes the following two forms:
①內散式:獨立顯示卡7與主機板4之間有一塊平行的導熱材質的隔板3,獨立顯示卡7上裝有散熱器的一面與隔板3板面相對,且獨立顯示卡7的PCB板面靠近電腦主機箱的外殼側面板,即圖13中滑蓋2的一側面。所述“獨立顯示卡7的PCB板”即圖中“獨立顯示卡PCB板70”。獨立顯示卡7上的I/O介面組71所處的PCB板的端邊在I/O介面朝向的方向上要凸出於主機板4上的I/O介面組所處的PCB板所在端邊15~40mm的距離。主機板4與獨立顯示卡7的PCB板卡間採用相平行、近距離安置的方式,極大的減少了佔用的空間體積。 1 Internal dispersion type: There is a parallel heat-conducting material partition plate 3 between the independent display card 7 and the motherboard 4, and the side of the independent display card 7 with the heat sink is opposite to the surface of the partition plate 3, and the independent display card 7 The PCB surface is close to the side panel of the outer casing of the mainframe, that is, one side of the sliding cover 2 in FIG. The "PCB board of the independent display card 7" is the "independent display card PCB board 70" in the figure. The end side of the PCB board on which the I/O interface group 71 on the independent display card 7 is located is oriented in the direction in which the I/O interface faces, and the end of the PCB board where the I/O interface group on the motherboard 4 is located The distance is 15~40mm. The motherboard board 4 and the PCB board of the independent display card 7 are arranged in parallel and close to each other, which greatly reduces the occupied space volume.
具體講,獨立顯示卡7與主機板4之間有一塊金屬平板存在,即金屬平板的一面平行安裝的是主機板4,主機板4背面對向金屬平板,金屬平板的另一面平行安裝的是獨立顯示卡7,獨立顯示卡7上有GPU晶片72的一面對向金屬平板,且獨立顯示卡7是平行放置於主機板4靠近南端邊區域的背面。 Specifically, there is a metal plate between the independent display card 7 and the motherboard 4, that is, the one side of the metal plate is mounted in parallel with the main board 4, the back side of the main board 4 is opposite to the metal flat plate, and the other side of the metal flat plate is installed in parallel. The independent display card 7 has a facing metal plate of the GPU chip 72 on the independent display card 7, and the independent display card 7 is placed in parallel on the back side of the motherboard 4 near the south end region.
上所述,獨立顯示卡7I/O介面與主機板4I/O介面朝向一致,且在它們I/O介面朝向的方向上,獨立顯示卡7I/O介面所在的PCB板邊緣要凸出於主機板4I/O介面所在的PCB板邊緣15~40mm的距離,即將獨立顯示卡7上的I/O介面區域部分平移到主機板4西端邊之外。且上述凸出於主機板4西端邊之外的獨立顯 示卡7I/O介面區域部分與主機板4間是沒有隔板3的。由於中高階獨立顯示卡7的I/O介面大多是雙層的,考慮到既要完全相容所有顯示卡,又要將其佔用的空間體積降至最小,故巧妙的將獨立顯示卡7上的I/O介面區域部分平移到主機板4西端邊之外。加上獨立顯示卡7I/O介面區域部分與主機板4間沒有隔板3的阻隔,這樣不管獨立顯示卡7的I/O介面是單層的還是雙層的,都不影響其在主機箱內的安裝使用,達到了與傳統主機箱一樣好的相容性。獨立顯示卡7通過轉接卡或延長排線與主機板4上對應的顯示卡插槽43相連通。 As described above, the 7I/O interface of the independent display card is aligned with the interface of the motherboard 4I/O, and in the direction in which their I/O interfaces are oriented, the edge of the PCB where the independent display card 7I/O interface is located protrudes from the host. The distance between the edge of the PCB board where the 4I/O interface is located is 15~40 mm, that is, the I/O interface area on the independent display card 7 is translated to the west end of the motherboard 4. And the above-mentioned independent display protruding from the west end of the motherboard 4 There is no partition 3 between the portion of the card 7I/O interface area and the motherboard 4. Since the I/O interface of the high-end independent display card 7 is mostly double-layered, it is ingenious to separate the display card 7 in consideration of being fully compatible with all the display cards and minimizing the space occupied by the display card. The I/O interface area is partially translated out of the west end of the motherboard 4. In addition, there is no barrier between the 7I/O interface area of the independent display card and the motherboard 4, so that the I/O interface of the independent display card 7 is single-layer or double-layer, which does not affect the main chassis. The internal installation is as good as the traditional mainframe. The independent display card 7 communicates with the corresponding display card slot 43 on the motherboard 4 via a riser card or extension cable.
②外散式:獨立顯示卡PCB板70上不能安裝散熱器的一面(背面)朝向主機板4背面,主機板4與獨立顯示卡7間不一定有隔板3存在,獨立顯示卡7I/O介面所在的PCB板邊緣也不一定要凸出於主機板4I/O介面所在的PCB板邊緣。獨立顯示卡7通過轉接卡或延長排線與主機板4上對應的顯示卡插槽相連通。主機板4與獨立顯示卡7間採用相平行、近距離安置的方式,極大的減少了佔用的空間體積。這種方式最大的優點是不用改裝獨立顯示卡7的散熱器和風扇201,使用獨立顯示卡7原配的散熱器和風扇201即可,且此方式相容性很好。缺點是所需佔用的主機箱空間比“內散式”較大。 2 External type: The side (back side) on which the heat sink cannot be mounted on the independent display card PCB board 70 faces the back of the motherboard 4, and the partition board 3 does not necessarily exist between the motherboard 4 and the independent display card 7, and the independent display card 7I/O The edge of the PCB where the interface is located does not have to protrude from the edge of the PCB where the 4I/O interface of the motherboard is located. The independent display card 7 communicates with a corresponding display card slot on the motherboard 4 through a riser card or an extension cable. The motherboard 4 and the independent display card 7 are arranged in parallel and close to each other, which greatly reduces the occupied space volume. The biggest advantage of this method is that the heat sink and the fan 201 of the independent display card 7 need not be modified, and the original heat sink and the fan 201 of the independent display card 7 can be used, and the compatibility is good in this manner. The disadvantage is that the required mainframe space is larger than the "internal dispersion".
09)內散式獨立顯示卡散熱器8 09) Internal scattered independent display card cooler 8
獨立顯示卡7上安裝的散熱器設有真空導熱管82和導熱底座81,真空導熱管上有蒸發端與冷凝端,所述散熱器上的所有 真空熱導管的蒸發端直接或間接與獨立顯示卡7的GPU晶片72相貼觸,部分或全部真空熱導管的冷凝端與隔板3或主機箱金屬外殼內壁直接或間接的貼觸。所述“主機箱金屬外殼”即圖中“主機箱外殼1”。 The heat sink mounted on the independent display card 7 is provided with a vacuum heat pipe 82 and a heat conducting base 81. The vacuum heat pipe has an evaporation end and a condensation end, and all of the heat sinks The evaporation end of the vacuum heat pipe is directly or indirectly in contact with the GPU chip 72 of the independent display card 7, and the condensation end of some or all of the vacuum heat pipes is in direct or indirect contact with the partition 3 or the inner wall of the metal casing of the main box. The "host box metal casing" is the "main box casing 1" in the figure.
上述獨立顯示卡散熱器8整體為扁平狀散熱器,佔用體積很小。其包括有相平行間隔排列的鋁質或銅質散熱鰭片83、2~8根所述真空熱導管和1~2個所述導熱底座。鋁質或銅質散熱鰭片組成扁平狀散熱器的主體部分,扁平狀散熱器平行安裝在獨立顯示卡7上或隔板3背面上,導熱底座設在散熱器的正面,散熱器的背面的表面上排列著扁平的所述真空熱導管的冷凝端,所述真空熱導管的蒸發端與銅質或鋁質的導熱底座相緊密貼合。真空熱導管的冷凝端通過模具擠壓成橫截面為半弧狀或扁平狀,緊密貼合在鰭片上,所述散熱器背面上半弧/扁平的真空熱導管冷凝端還平行貼觸在隔板3背面上進行導熱。 The above-mentioned independent display card heat sink 8 is a flat heat sink as a whole, and has a small occupying volume. The utility model comprises aluminum or copper heat dissipation fins 83 arranged in parallel intervals, 2 to 8 vacuum heat pipes and 1 to 2 heat conduction bases. The aluminum or copper heat sink fins form a main portion of the flat heat sink, and the flat heat sink is mounted in parallel on the independent display card 7 or on the back surface of the partition plate 3. The heat conductive base is disposed on the front surface of the heat sink, and the back surface of the heat sink The flattened condensation end of the vacuum heat pipe is arranged on the surface, and the evaporation end of the vacuum heat pipe is in close contact with the copper or aluminum heat conductive base. The condensing end of the vacuum heat pipe is extruded through a die into a semi-arc or flat shape in cross section, and is closely attached to the fin, and the condensing end of the semi-arc/flat vacuum heat pipe on the back surface of the heat sink is also in parallel Conductive heat is applied to the back of the board 3.
或上述扁平狀散熱器還包括排列著的真空熱導管,每根真空熱導管均含有蒸發端和冷凝端,所有真空熱導管的蒸發端都有序地緊密貼合或內嵌於所述導熱底座上,真空熱導管的冷凝端通過模具擠壓成橫截面為“D”形狀,即在所述真空熱導管冷凝端形成扁平的一面,且此扁平的一面與所述散熱器的背面相平行,而上述“D”形狀的真空熱導管冷凝端所形成的非扁平一面的部分與所述散熱器的散熱鰭片相結合固定在所述散熱器的背面。當所述扁平狀散熱器的背面平行安裝或貼觸在隔板面上時,上述 “D”形狀的真空熱導管冷凝端形成扁平的一面將平行貼觸在隔板面上進行導熱。 Or the above flat heat sink further comprises arranged vacuum heat pipes, each vacuum heat pipe has an evaporation end and a condensation end, and the evaporation ends of all the vacuum heat pipes are closely attached or embedded in the heat conductive base. The condensing end of the vacuum heat pipe is extruded through a die into a "D" shape in cross section, that is, a flat side is formed at the condensation end of the vacuum heat pipe, and the flat side is parallel to the back surface of the heat sink. The non-flat side portion formed by the condensing end of the "D" shaped vacuum heat pipe is fixed to the back surface of the heat sink in combination with the heat dissipating fin of the heat sink. When the back surface of the flat heat sink is mounted in parallel or in contact with the partition surface, The flat side of the condensing end of the "D" shaped vacuum heat pipe will be placed in parallel on the face of the separator for heat conduction.
由於此散熱器通過真空熱導管的冷凝區段巧妙的與隔板3或主機箱金屬外殼內壁相緊密貼觸,且顯示卡散熱器風扇201不是安裝在散熱器上,沒有額外佔用散熱器的體積,所以大大增加了獨立顯示卡7的實際散熱面積。並且,其散熱利用的隔板3和主機箱金屬外殼本身就存在,也大大節省了材料成本和顯示卡散熱器的品質。 Since the heat sink is intimately in contact with the inner wall of the partition 3 or the metal casing of the main casing through the condensation section of the vacuum heat pipe, and the display card radiator fan 201 is not mounted on the radiator, there is no additional heat sink. The volume, so greatly increases the actual heat dissipation area of the independent display card 7. Moreover, the separator 3 for heat dissipation and the metal casing of the main box itself exist, and the material cost and the quality of the display card radiator are also greatly saved.
散熱器是固定在所述隔板3背面的獨立顯示卡7安裝位置區域,所述散熱器設有一個或一個以上的導熱底座,所述導熱底座與真空熱導管的蒸發端相緊密配合安裝,真空熱導管的冷凝端加工成扁平狀,緊密的貼合在隔板3背面上或主機箱金屬外殼的內壁上,整齊相平行間隔排列的散熱鰭片貼合在有扁平狀真空熱導管的隔板3背面或主機箱金屬外殼內壁上。 The heat sink is a mounting position area of the independent display card 7 fixed on the back of the partition plate 3. The heat sink is provided with one or more heat conducting bases, and the heat conducting base is closely fitted with the evaporation end of the vacuum heat pipe. The condensation end of the vacuum heat pipe is processed into a flat shape, and is closely attached to the back surface of the separator 3 or the inner wall of the metal shell of the main box, and the heat radiating fins arranged in parallel are arranged in a flat vacuum heat pipe. The back of the partition 3 or the inner wall of the metal casing of the main box.
具體為:因為獨立顯示卡7有GPU晶片72的一面平行對向隔板3,獨立顯示卡7朝向隔板3的一面與隔板3間存在一段距離空間,此空間內安裝有獨立顯示卡散熱器8。散熱器中的散熱鰭片為平行相間隔排列,且垂直於隔板3上的條狀散熱鰭片與地理垂直方向間呈一定的傾斜夾角。散熱器的導熱底座與獨立顯示卡7的GPU晶片72表面相緊密貼觸,真空熱導管中的“蒸發區段”緊密內嵌於導熱底座中;真空熱導管另一部分的“冷凝區段”分佈於隔板3背面與散熱鰭片間,且與隔板3、散熱鰭片相緊 密貼合。或分佈於顯示卡就近的主機箱金屬外殼內壁上,與外殼內壁相緊密貼合。 Specifically, since the independent display card 7 has one side of the GPU chip 72 facing the partition plate 3, the side of the independent display card 7 facing the partition plate 3 and the partition plate 3 have a space, and the space is installed with a separate display card for heat dissipation. 8. The heat dissipating fins in the heat sink are arranged in parallel and spaced apart, and the strip fins perpendicular to the partition 3 have a certain oblique angle with the geographical vertical direction. The heat conducting base of the heat sink is in close contact with the surface of the GPU chip 72 of the independent display card 7, and the "evaporation section" in the vacuum heat pipe is tightly embedded in the heat conducting base; the "condensing section" of the other part of the vacuum heat pipe is distributed. Between the back surface of the spacer 3 and the heat dissipation fins, and the spacer 3 and the heat dissipation fins are tight Close fit. Or distributed on the inner wall of the metal shell of the main box near the display card, and closely fits the inner wall of the outer casing.
即獨立顯示卡7GPU晶片72中的熱量,由緊貼其表面的導熱底座傳導至真空熱導管的“蒸發區段”進行吸熱,再由“蒸發區段”迅速傳遞至“冷凝區段”,通過與“冷凝區段”相緊密貼觸的散熱鰭片、隔板3或主機箱金屬外殼大面積的與空氣進行熱交換,達到散熱冷卻目的。 That is, the heat in the independent display card 7GPU wafer 72 is conducted by the "evaporation section" of the vacuum heat pipe which is conducted by the heat-conducting base close to the surface, and is quickly transferred to the "condensation section" by the "evaporation section". The heat-dissipating fins, the partitions 3 or the metal casing of the main box, which are in close contact with the "condensing section", exchange heat with the air for a large area to achieve the purpose of heat dissipation.
10)內散式獨立顯示卡散熱器8與獨立顯示卡7間的固定方式 10) Fixing manner between the internal discrete type display card heat sink 8 and the independent display card 7
由於“內散式獨立顯示卡散熱器8”,以下簡稱“顯示卡散熱器”。下述中的“顯示卡”即為圖中“獨立顯示卡7”,下文中的“主機箱蓋板/蓋板”即為圖中“滑蓋2”,“獨立顯示卡7的PCB板”即為圖中“獨立顯示卡PCB板70”。根據主機箱的設計和用戶需求,分為2種形式: Due to the "internal discrete type display card heat sink 8", hereinafter referred to as "display card heat sink". The "display card" in the following is the "independent display card 7" in the figure, and the "main case cover/cover" in the following is the "slider 2" in the figure, "the PCB of the independent display card 7" That is, the "independent display card PCB board 70" in the figure. According to the design of the main box and user requirements, it is divided into two forms:
動式:顯示卡散熱器先與獨立顯示卡PCB板70正確安裝固定後,再將顯示卡的金手指插口插入主機箱背面空間的顯示卡插槽內相對固定,此時顯示卡散熱器已經與隔板3背面平行相觸。再在獨立顯示卡7的GPU晶片72垂直投影至此顯示卡PCB板背面的中心位置粘貼/安裝匹配的絕緣彈性矽膠墊206,當主機箱蓋板通過主機箱內的滑槽推進箱體後,由於蓋板與獨立顯示卡7的PCB板間的間距小於彈性矽膠墊206的尺寸,彈性矽膠墊206受到擠壓後產生回彈壓力垂直作用於獨立顯示卡PCB板70背面。又 由於顯示卡散熱器與獨立顯示卡PCB板70間是固定的,所以這個產生的壓力最後使顯示卡散熱器緊貼於隔板3表面上。達到顯示卡散熱器中的一部分熱量高效傳導至隔板3上進行散熱。 After the display card heatsink is correctly installed and fixed with the independent display card PCB board 70, the gold finger socket of the display card is inserted into the display card slot of the back space of the main box, and the display card heat sink has been fixed. The backs of the partitions 3 are in parallel contact. Then, the GPU chip 72 of the independent display card 7 is vertically projected to the center of the back surface of the PCB of the display card, and the matching insulating elastic rubber pad 206 is pasted/mounted. When the main box cover is pushed through the chute in the main box, the The spacing between the cover plate and the PCB board of the independent display card 7 is smaller than the size of the elastic silicone pad 206. After the elastic silicone pad 206 is squeezed, a rebound pressure is generated to vertically act on the back surface of the independent display card PCB board 70. also Since the display card heat sink and the individual display card PCB board 70 are fixed, this generated pressure finally causes the display card heat sink to adhere to the surface of the spacer 3. A part of the heat reaching the display card heat sink is efficiently conducted to the partition 3 for heat dissipation.
固定式:顯示卡散熱器先平行安裝固定於主機箱背面空間對應的隔板3位置上,此時散熱器中的真空熱導管82的“冷凝區段”與隔板3表面或主機箱金屬外殼內壁相緊密貼合。再在空置的獨立顯示卡7GPU晶片72垂直投影至此顯示卡PCB板背面的中心位置粘貼/安裝匹配的絕緣彈性矽膠墊206。 Fixed type: the display card heat sink is firstly mounted in parallel on the corresponding partition 3 position of the back space of the main box, at this time, the "condensing section" of the vacuum heat pipe 82 in the heat sink and the surface of the partition 3 or the metal shell of the main box The inner walls are in close contact. Then, a matching insulating elastic silicone pad 206 is pasted/mounted on the vacant independent display card 7 GPU wafer 72 vertically projected to the center of the back surface of the display card PCB.
將空置的獨立顯示卡7有GPU晶片72的一面對向顯示卡散熱器,將獨立顯示卡7上的金手指介面正確插入匹配的顯示卡插槽中相對固定,此時獨立顯示卡7的GPU晶片72與顯示卡散熱器的導熱底座81相貼近。只需將主機箱蓋板通過主機箱內的滑槽推進箱體後,由於蓋板與獨立顯示卡7的PCB板間的間距小於彈性矽膠墊206的尺寸,彈性矽膠墊206受到擠壓後產生回彈壓力垂直作用於獨立顯示卡PCB板70背面。在獨立顯示卡7上的GPU晶片72背面中心受到垂直向隔板3方向的作用壓力後,GPU晶片72表面與顯示卡散熱器導熱底座81正面相平行、緊密貼合。 The vacant independent display card 7 has a facing display card heat sink of the GPU chip 72, and the gold finger interface on the independent display card 7 is correctly inserted into the matching display card slot, and the independent display card 7 is The GPU chip 72 is in close proximity to the thermally conductive base 81 of the display card heat sink. After the main box cover is pushed through the sliding slot in the main box, the spacing between the cover and the PCB of the independent display card 7 is smaller than the size of the elastic silicone pad 206, and the elastic silicone pad 206 is squeezed. The rebound pressure acts vertically on the back of the individual display card PCB board 70. After the center of the back surface of the GPU chip 72 on the independent display card 7 is pressed perpendicularly to the direction of the spacer 3, the surface of the GPU chip 72 is in parallel with the front surface of the display card heatsink base 81.
獨立顯示卡7在與固定式顯示卡散熱器安裝的簡易程度上達到了歷史性的快捷,幾乎一秒鐘安裝。由於GPU晶片72是其背部中心位置受力,GPU晶片72表面能平穩的貼合在顯示卡散熱器的導熱底座81表面上,使GPU晶片72與導熱底座間81的作用力達到自然均衡,用戶再也不用擔心像安裝傳統散熱器時因4 個螺絲受力不均衡而影響其導熱效果。 The stand-alone display card 7 is historically quick and easy to install with a fixed display card heatsink, and is installed in almost one second. Since the GPU chip 72 is subjected to the center position of the back, the surface of the GPU chip 72 can be smoothly attached to the surface of the heat-conducting base 81 of the display card heat sink, so that the force between the GPU chip 72 and the heat-conductive base 81 is naturally balanced. No longer have to worry about installing a traditional radiator. The screws are not balanced and affect the heat conduction effect.
11)電源盒9 11) Power supply box 9
電源盒9為超薄貼觸式電源盒9,其設有底面91、頂面和側面,還設有電源的輸入埠和電源的輸出埠92,所述電源盒9的輸出埠92設有直接與電腦主機箱內的隔板3上所對應的電路受壓後相導通的傳輸結構,所述電源盒9的輸出埠92與電腦主機箱內的隔板3上所對應的電路之間不存在協力廠商的插頭、插座進行連接。 The power box 9 is an ultra-thin contact type power supply box 9, which is provided with a bottom surface 91, a top surface and a side surface, and is provided with an input port of a power source and an output port 92 of a power source, and the output port 92 of the power box 9 is directly provided. A transmission structure that is electrically connected to the corresponding circuit on the partition 3 in the mainframe, and the output port 92 of the power box 9 does not exist between the corresponding circuit on the partition 3 in the mainframe of the computer. Connect the plugs and sockets of the third manufacturer.
電源盒9與隔板3表面平行貼觸的一面設為電源盒9的底面,電源盒9的底面上有兩組凸起0.5~3mm的接觸銅片93,第一組上有序排列著的獨立的接觸銅片93,其向外的正面都是非常平整光滑、裸露導電的,且每個接觸銅片93正面與電源盒9底面是相平行的,接觸銅片93的背面都是固定在一層絕緣彈性橡膠上,絕緣彈性橡膠又固定在電源盒9內,且每個接觸銅片93背面只與電源盒9內的正極DC 12V輸出電路相連通。每個接觸銅片93的正面積在0.2~1cm2;第二組銅片為接觸彈片104,與電源盒9內VC 220V電路相連通。且這兩組接觸銅片93與電源盒9底面是相互絕緣的。所述隔板3背面上且在電源安置區域內有與之匹配的內凹壓觸點,內凹壓觸點中的裸露接觸電路與電源底面凸起的接觸銅片93組相一一對應,在電源安置區域內有若干個定位孔36,所述電源盒9底面除了凸起0.5~3mm的定位銷94和導電接觸銅片93之外,整面都是平整光滑的,且電源盒9底面與電 源盒9內的負極DC 12V輸出電路和接地相連通,所述電源盒9通過緊固螺絲使電源盒9平行貼觸固定在隔板3上。 The side of the power supply box 9 that is in parallel with the surface of the partition plate 3 is set as the bottom surface of the power supply box 9. On the bottom surface of the power supply box 9, there are two sets of contact copper pieces 93 with protrusions of 0.5 to 3 mm, and the first group is arranged in an orderly manner. The independent contact copper piece 93 has a front surface which is very smooth and bare and electrically conductive, and the front surface of each contact copper piece 93 is parallel to the bottom surface of the power supply box 9, and the back surface of the contact copper piece 93 is fixed at On one layer of insulating elastic rubber, the insulating elastic rubber is fixed in the power supply box 9, and the back surface of each contact copper piece 93 is only in communication with the positive DC 12V output circuit in the power supply box 9. The positive area of each contact copper piece 93 is 0.2~1 cm 2 ; the second set of copper pieces is the contact spring piece 104, which is in communication with the VC 220V circuit in the power supply box 9. And the two sets of contact copper sheets 93 and the bottom surface of the power supply box 9 are insulated from each other. a concave contact contact on the back surface of the partition 3 and matching the power supply installation area, and the bare contact circuit in the concave contact is in one-to-one correspondence with the contact copper piece 93 on the bottom surface of the power supply. There are a plurality of positioning holes 36 in the power supply installation area. The bottom surface of the power supply box 9 is flat and smooth except for the positioning pins 94 and the conductive contact copper pieces 93 which are protruded by 0.5~3 mm, and the bottom surface of the power supply box 9 is provided. It is connected to the negative DC 12V output circuit and the ground in the power supply box 9, and the power supply box 9 is fixed to the partition 3 by the fastening of the power supply box 9 by fastening screws.
上述電源盒的另一種供電傳輸埠的存在形式:所述電源盒的電源輸入埠和電源輸出埠在所述電源盒的底面上合併為一個集成埠,所述集成埠內設有可直接與所述隔板上相對應的裸露導電的電路受壓貼觸後相一一匹配導通的接觸銅片組,所述接觸銅片組中的各接觸銅片可具有不同的電路定義並分別與電源盒內對應的電路相連通。所述電源盒的底面平行貼觸安裝到所述隔板面上對應的電路區域。 Another type of power transmission port of the power supply box is: the power input port and the power output port of the power box are combined into an integrated port on the bottom surface of the power box, and the integrated device is directly connected to the device The corresponding bare conductive circuits on the spacers are pressed and contacted one after another to form a contact copper strip group, and the contact copper strips in the contact copper strip group may have different circuit definitions and respectively respectively and the power supply box The corresponding circuits are connected. The bottom surface of the power box is mounted in parallel to a corresponding circuit area mounted on the partition surface.
以下為電源盒9底面輸出埠92為金屬彈片104的形式存在的方案。 The following is a scheme in which the bottom surface output port 92 of the power supply box 9 is in the form of a metal dome 104.
電源盒9是平行貼觸安裝在主機箱內隔板3面上。電源盒9面積最大的一面為其底面,是導電金屬材質,且直接與隔板3表面相平行貼觸。電源盒9底面有一“輸出埠92”。“輸出埠92”內平整、有序排地列著一些裸露導電的金屬彈片104,這些金屬彈片104與電源盒9金屬材質的底面是相互絕緣的,且金屬彈片104的表面高度要凸出於電源盒9底面的表面0.5~3mm。 The power box 9 is mounted in parallel on the surface of the partition 3 in the main box. The largest side of the power box 9 has its bottom surface, which is made of a conductive metal material and directly contacts the surface of the spacer 3 in parallel. The bottom of the power box 9 has an "output port 92". The "output 埠 92" has a flat, ordered array of bare conductive metal domes 104. The metal domes 104 are insulated from the bottom surface of the metal of the power supply box 9, and the surface height of the metal domes 104 is convex. The surface of the bottom surface of the power supply box 9 is 0.5 to 3 mm.
“輸出埠92”內的金屬彈片104分為面積較大和面積較小的兩組。電源盒9上有一“輸入埠”,通過插入導線插頭,將主機箱外的交流電或匹配的直流電輸入電源盒9內。其中一部分交流電被電源盒9轉換成穩定的直流輸出,其中直流正極與“輸出埠92”內面積較大的一組金屬彈片104相連通,直流負極/接地 與電源盒9的導電金屬底面相連通;另一部分交流電被連接至“輸出埠92”中面積較小的一組金屬彈片104上。 The metal dome 104 in the "output 埠 92" is divided into two groups of larger areas and smaller areas. The power box 9 has an "input port" through which the alternating current or matching direct current outside the main box is input into the power box 9. A part of the alternating current is converted into a stable direct current output by the power box 9, wherein the direct current positive pole is connected with a group of metal shrapnel 104 having a larger area in the "output 埠 92", and the DC negative pole is grounded. It is in communication with the conductive metal bottom surface of the power supply box 9; another portion of the alternating current is connected to a group of metal domes 104 of smaller area in the "output port 92".
在電源盒9底面有若干個凸出的定位銷94,而隔板3上安裝電源盒9的區域上有一個內凹形的隔板電路32和若干個定位孔36,內凹形的隔板電路32上有裸露導電、光滑平整的電路接觸點。且隔板3上所述的內凹形隔板電路32接觸點和定位孔36與電源盒9底面的“輸出埠92”內的金屬彈片104組和凸出的定位銷94,在尺寸規格、排列位置、電路定義上相完全匹配。將電源盒9底面對向其在隔板3的安裝區域上,通過電源盒9底面的定位銷94完全與隔板3上的定位孔36相匹配、插入後,用螺絲/膨脹卡銷將電源盒9緊固在隔板3上。此時電源盒9底部的“輸出埠92”內的各組導電金屬彈片104與隔板3上對應的內凹形的隔板電路32接觸點相完全精準匹配、一一壓觸連通。由於電源盒9是通過隔板3上內凹形的隔板電路32接觸點相連通,當此處不安裝電源盒9時,用匹配的絕緣片填平該內凹區域後,可在此位置空間安裝其他硬體。實現主機箱內同一位置空間的多效搭配利用。同時,由於電源盒9內極其緊湊的結構,加上採用直接與隔板電路32相貼觸傳輸供電,不用導線,大大縮減了電源盒9在主機箱內所佔用的空間體積。 There are a plurality of protruding positioning pins 94 on the bottom surface of the power box 9, and a region of the partition 3 on which the power supply box 9 is mounted has a concave partition circuit 32 and a plurality of positioning holes 36, and a concave partition. Circuit 32 has exposed conductive, smooth, flat circuit contacts. And the concave-shaped spacer circuit 32 on the partition 3 and the positioning hole 36 and the metal elastic piece 104 in the "output port 92" of the bottom surface of the power supply box 9 and the protruding positioning pin 94 are in the size specification, The arrangement position and the circuit definition are perfectly matched. The bottom surface of the power supply box 9 is opposed to the mounting area of the partition plate 3, and the positioning pin 94 on the bottom surface of the power supply box 9 is completely matched with the positioning hole 36 on the partition plate 3, and then inserted, and then screwed/expanded. The power supply box 9 is fastened to the partition 3. At this time, the set of conductive metal domes 104 in the "output port 92" at the bottom of the power box 9 and the corresponding concave-shaped baffle circuit 32 on the spacer 3 are completely precisely matched and one-touch contact. Since the power supply box 9 is connected through the contact point of the concave partition circuit 32 on the partition 3, when the power supply box 9 is not mounted here, the concave area is filled with a matching insulating sheet, and the position can be at this position. Space to install other hardware. Achieve multi-effect matching of the same location space in the mainframe. At the same time, due to the extremely compact structure in the power box 9, and the direct connection with the diaphragm circuit 32 for transmitting power, without wires, the space occupied by the power box 9 in the main box is greatly reduced.
電路定義:考慮到不同用戶對主機箱的供電需求不同,主機箱內設計了兩處電源盒9的安裝位置,即可同時安裝兩個電源盒9,並聯使用。隔板3上也有兩個對應的內凹形隔板電路32 接觸點。其中用導線插頭將交流電連接至第一個電源盒9的“輸入埠”,由其底面“輸出埠92”內面積較小的一組金屬彈片104通過隔板電路32傳輸至隔板3上第二個內凹形隔板電路32對應的接觸點上,而第二個電源盒9是正確安裝在第二個內凹形隔板電路32接觸點上的。即交流電通過第二個內凹形隔板電路32對應的接觸點輸入到第二個電源盒9中轉換成所需穩定的直流。第二個電源盒9中轉換後的直流正極與“輸出埠92”內面積較大的一組金屬彈片104相連通,經過第二個內凹形隔板電路32對應的接觸點和隔板電路32將直流正極傳輸給“配電模組10”。 Circuit definition: Considering the different power supply requirements of different users for the mainframe, two installation positions of the power supply box 9 are designed in the mainframe, and two power supply boxes 9 can be installed at the same time and used in parallel. There are also two corresponding concave-shaped baffle circuits 32 on the partition 3 Contact point. Wherein the "input port" of the first power supply box 9 is connected by a wire plug, and a group of metal domes 104 having a smaller area in the bottom surface "output port 92" is transmitted to the partition plate 3 through the spacer circuit 32. The two recessed baffle circuits 32 correspond to the contact points, and the second power supply box 9 is properly mounted at the contact point of the second inner recessed baffle circuit 32. That is, the alternating current is input to the second power supply box 9 through the corresponding contact point of the second inner concave diaphragm circuit 32 to be converted into a desired stable direct current. The converted DC positive electrode in the second power supply box 9 communicates with a group of metal domes 104 having a larger area in the "output port 92", and passes through the contact point and the spacer circuit corresponding to the second inner concave diaphragm circuit 32. 32 transmits the DC positive pole to "Power Distribution Module 10".
電源盒9內轉換後的直流負極是接通至電源盒9的導電金屬底面上。由上所知,電源盒9的底面是平行貼觸安裝在隔板3上,且主機箱內的隔板3作為整機直流負極/接地承載的主導體。故電源盒9的金屬底面與隔板3板面間是緊密貼合、導電的。隔板3上的直流負極通過電源盒9的導電金屬底面可實現大面積、大電流的傳回至電源盒9內的直流負極電路中。之所以設計成將電源盒9的直流輸出直接貼觸傳遞到隔板3上對應的隔板電路32中,是因為其貼觸面積大、貼合緊密,可實現大電流的穩定通過。而且,電源盒9通過與隔板3或主機箱金屬外殼內壁的大面積、緊密貼觸,不僅僅將電源盒9內的直流負極/接地順利連通至隔板3上,還巧妙、高效的解決了電源盒9散熱的問題。 The converted DC negative electrode in the power supply box 9 is connected to the bottom surface of the conductive metal of the power supply box 9. As can be seen from the above, the bottom surface of the power box 9 is mounted in parallel on the partition 3, and the partition 3 in the main box serves as the main conductor of the DC negative/ground bearing of the whole machine. Therefore, the metal bottom surface of the power supply box 9 and the surface of the partition plate 3 are in close contact with each other and are electrically conductive. The DC negative electrode on the partition 3 can pass through the conductive metal bottom surface of the power supply box 9 to transmit a large area and a large current to the DC negative circuit in the power supply box 9. The reason why the DC output of the power supply box 9 is directly contacted and transmitted to the corresponding partition circuit 32 of the partition 3 is because the contact area is large and the fit is tight, and a large current can be stably passed. Moreover, the power supply box 9 is in close contact with the partition wall 3 or the inner wall of the metal casing of the main box, and not only the DC negative electrode/ground in the power supply box 9 is smoothly connected to the partition plate 3, but also ingenious and efficient. The problem of heat dissipation of the power box 9 is solved.
電源盒9整體形狀為扁平的六面體,電源盒9的最大厚度31mm,其中長150mm,寬110mm;或者長260mm,寬 120mm,所述電源盒9的電源的輸入埠為輸入DC 12V或VC 220V,電源盒9的輸出埠92為輸出DC 12V或VC 220V。 The power box 9 is generally in the shape of a flat hexahedron, and the maximum thickness of the power box 9 31mm, which is long 150mm, wide 110mm; or long 260mm, wide 120mm, the input port of the power source of the power box 9 is input DC 12V or VC 220V, and the output port 92 of the power box 9 is output DC 12V or VC 220V.
電源盒9整體輪廓為扁平的方體,具體尺寸、外形視設計需求和功率大小而定。 The overall outline of the power box 9 is a flat square body, and the specific size and shape depend on the design requirements and the power level.
電源盒9的散熱方式:此超薄電源盒9由於內部結構緊湊,熱源較集中。電源盒9外殼大面積採用鋁合金材質,通過將電源盒9內的發熱元件直接貼觸到鋁合金外殼上,或用真空熱導管連接至鋁合金外殼上,將大部分熱量快速傳遞至電源盒9金屬外殼上。因為電源盒9是緊密平行貼觸在隔板3上或一部分貼觸在主機箱金屬外殼的內壁上,通過隔板3或主機箱金屬外殼,加上主機箱內的通風實現大面積高效散熱。 The heat dissipation mode of the power supply box 9: The ultra-thin power supply box 9 has a compact internal structure and a concentrated heat source. The outer casing of the power box 9 is made of aluminum alloy. The heat element in the power box 9 is directly attached to the aluminum alloy case, or the vacuum heat pipe is connected to the aluminum alloy case, and most of the heat is quickly transferred to the power box. 9 metal casings. Because the power box 9 is closely parallel to the partition 3 or a part of the inner wall of the metal shell of the main box, through the partition 3 or the metal shell of the main box, plus ventilation in the main box to achieve large-area efficient heat dissipation .
12)配電模組10 12) Power distribution module 10
配電模組10貼觸在隔板3背面上的那一面設為底面102,所述底面上設有“直流輸入口102”和“直流輸出口103”,“直流輸入口102”和“直流輸出口103”內都整齊有序配置著一些凸出於所述底面0.5~3mm高的接觸銅片93。這些接觸銅片93向外的正面都是光滑平整、裸露導電的,這些接觸銅片93向內的背面固定在與其他電路相絕緣的彈性材質件上,所述彈性材質件又固定在配電模組10內。 The side of the power distribution module 10 that is in contact with the back surface of the partition 3 is a bottom surface 102. The bottom surface is provided with a "DC input port 102" and a "DC output port 103", a "DC input port 102" and a "DC output. Each of the ports 103" is arranged neatly and orderly with a contact copper piece 93 protruding from the bottom surface by 0.5 to 3 mm. The front faces of the contact copper strips 93 are smooth and bare and electrically conductive. The inwardly facing back faces of the copper strips 93 are fixed on elastic material members insulated from other circuits, and the elastic material members are fixed to the distribution mode. Within group 10.
配電模組10底面上除“直流輸入口102”和“直流輸出口103”之外設有若干個凸起的定位銷94,在隔板3上安裝配電模組10的區域內分別有與配電模組10底面的“直流輸入口 102”、“直流輸出口103”和定位銷94在尺寸規格、位置方向、電路定義上相完全正確匹配的內凹形電路接觸點和定位孔36。內凹形電路接觸點表面是裸露導電的,但與隔板3間是相絕緣的,內凹形電路接觸點分別與其對應的隔板電路32相連通。 On the bottom surface of the power distribution module 10, a plurality of raised positioning pins 94 are provided in addition to the "DC input port 102" and the "DC output port 103", and the power distribution module 10 is mounted on the partition plate 3 respectively. "DC input port on the bottom of module 10" 102", "DC output port 103" and positioning pin 94 are completely correctly matched in the size specification, position direction, circuit definition of the concave circuit contact point and the positioning hole 36. The surface of the concave circuit contact point is bare conductive However, it is insulated from the partition 3, and the concave circuit contact points are respectively connected to the corresponding partition circuit 32.
配電模組10中還整合了溫控模組,配電模組10為溫控模組提供供電和安裝位置空間和/或電路走線結構。 The power distribution module 10 also incorporates a temperature control module. The power distribution module 10 provides power supply and installation location space and/or circuit routing structure for the temperature control module.
結構電路定義:配電模組10底面的“直流輸入口102”內的接觸銅片93與配電模組10內的直流輸入電路相連通;配電模組10底面的“直流輸出口103”內的接觸銅片93分別與配電模組10內的不同輸出電壓值的直流輸出供電相連通。且不同電路定義的接觸銅片93之間是相互獨立和絕緣的,接觸銅片93與配電模組10底面也是相絕緣的。 Structure circuit definition: the contact copper piece 93 in the "DC input port 102" on the bottom surface of the power distribution module 10 is connected with the DC input circuit in the power distribution module 10; the contact in the "DC output port 103" on the bottom surface of the power distribution module 10 The copper sheets 93 are respectively in communication with DC output power of different output voltage values within the power distribution module 10. The contact copper pieces 93 defined by different circuits are independent and insulated from each other, and the contact copper piece 93 is also insulated from the bottom surface of the power distribution module 10.
配電模組10底面的“直流輸入口102”內的接觸銅片93通過與隔板3上對應的內凹形電路接觸點相匹配對接後,將電源盒9輸出到上述隔板電路32中的直流導入到配電模組10中再轉換成各硬體設備所需的不同電壓值的直流供電,再將上述不同電壓值的直流供電經配電模組10底面的“直流輸出口103”內的各接觸銅片93通過與隔板3上對應的內凹形電路接觸點相匹配對接後,將上述不同電壓值的直流供電分別傳輸至對應的隔板電路32中。 The contact copper piece 93 in the "DC input port 102" on the bottom surface of the power distribution module 10 is matched with the corresponding concave circuit contact point on the partition plate 3, and then the power supply box 9 is outputted to the above-mentioned partition circuit 32. DC is introduced into the power distribution module 10 and converted into DC power supply of different voltage values required by each hardware device, and the DC power of the different voltage values is respectively transmitted through the "DC output port 103" on the bottom surface of the power distribution module 10. After the contact copper pieces 93 are mated with the corresponding concave circuit contact points on the partition 3, the DC power supplies of the different voltage values are respectively transmitted to the corresponding partition circuit 32.
在隔板3背面的中間區段,靠近主機箱外殼前面板的隔板3背面邊緣位置上安裝有配電模組10,且所述配電模組10上整 合了與以下一種或多種類介面相匹配的一個或多個插座、隔板插座:6/8pin獨立顯示卡輔助供電插槽73、24pin主機板主供電插槽45、渦輪風扇201供電介面、7+15pin SATA硬碟203介面、SATA Express硬碟203介面、SAS硬碟203介面、USB 3.0 19/20pin插口、USB 2.0 9pin插口、7+6pin SATA光碟機介面。 In the middle section of the back of the partition 3, the power distribution module 10 is mounted on the back edge of the partition 3 adjacent to the front panel of the main casing, and the power distribution module 10 is One or more sockets and bulkhead sockets that match one or more of the following types of interfaces: 6/8pin independent display card auxiliary power supply slot 73, 24pin motherboard main power supply slot 45, turbofan 201 power supply interface, 7 +15pin SATA hard drive 203 interface, SATA Express hard drive 203 interface, SAS hard drive 203 interface, USB 3.0 19/20pin jack, USB 2.0 9pin jack, 7+6pin SATA disc player interface.
配電模組10的底面除“直流輸入口102”和“直流輸出口103”之外為平整的金屬導電材質,配電模組10內的直流輸出負極/接地電路與配電模組10的金屬底面相連通。配電模組10通過螺絲或膨脹卡銷平行貼觸緊固在主機箱內隔板3面上,與隔板3表面間進行大面積接觸導通。加上上述配電模組10上還整合了一種或多種硬體相匹配的插座或隔板插座,通過導線或者將硬體自帶介面直接插入配電模組10上相匹配的插座/隔板插座中連通。因此這些與配電模組10上整合的插座/隔板插座相連通的硬體的直流負極/接地通過配電模組10的金屬導電底面導通至隔板3上。由上所述可知,隔板3又因與電源盒9導電底面相貼觸,所以最終配電模組10底面與電源盒9底面相連通,即兩者的直流負極/接地電路是相連通的。 The bottom surface of the power distribution module 10 is a flat metal conductive material except for the "DC input port 102" and the "DC output port 103", and the DC output negative/ground circuit in the power distribution module 10 is connected to the metal bottom surface of the power distribution module 10. . The power distribution module 10 is fastened to the surface of the partition plate 3 in the main casing by screws or expansion pins in parallel, and is in contact with the surface of the partition plate 3 for large-area contact. In addition, one or more hardware-matched sockets or bulkhead sockets are integrated on the power distribution module 10, and are directly inserted into the matched socket/separator sockets of the power distribution module 10 through wires or the hardware self-contained interface. Connected. Therefore, the hard DC negative/ground connected to the socket/separator socket integrated on the power distribution module 10 is conducted to the partition 3 through the metal conductive bottom surface of the power distribution module 10. As can be seen from the above, the partition 3 is in contact with the conductive bottom surface of the power supply box 9, so that the bottom surface of the power distribution module 10 is connected to the bottom surface of the power supply box 9, that is, the DC negative/ground circuits of the two are in communication.
由上述所知,因為配電模組10是將電源盒9傳送過來的單一電壓值的直流電再次轉換成各硬體所需的不同電壓值的直流供電,加上配電模組10上整合了一種或多種與硬體介面相匹配的插座/隔板插座。即配電模組10中轉換輸出的各電壓值的直流供電,一部分分別與這些所述整合的插座/隔板插座相對應連通,再 通過導線或硬體直插的形式將對應的供電傳輸給匹配的硬體中;另一部分輸出的各電壓值的直流供電,通過配電模組10底面的“直流輸出口103”經隔板3上相匹配的內凹形隔板電路32接觸點分別導通至對應的隔板電路32中,與所述隔板電路32相對應連通的隔板插座再分別與所需供電的電腦硬體的介面/插槽相對接。 As described above, the power distribution module 10 is a DC power supply that converts a single voltage value of the DC power transmitted from the power supply box 9 into a different voltage value required for each hardware, and integrates one or A variety of socket/separator sockets that match the hardware interface. That is, the DC power supply of each voltage value converted and outputted in the power distribution module 10 is partially connected to the integrated socket/separator socket respectively, and then The corresponding power supply is transmitted to the matched hardware through wire or hardware in-line form; the DC power supply of each voltage value outputted by the other part is passed through the "DC output port 103" on the bottom surface of the power distribution module 10 via the partition plate 3. The matching contact points of the concave-shaped baffle circuit 32 are respectively conducted into the corresponding baffle circuits 32, and the baffle sockets corresponding to the baffle circuits 32 are respectively connected to the interface of the computer hardware to be supplied/ The slots are opposite each other.
由於配電模組10底面使用了與電源盒9底面結構原理相同的大面積壓觸式導電傳輸構造,使得配電模組10與隔板電路32間可進行大電流的穩定傳輸。且配電模組10中還整合了多種硬體介面插座和/或溫控模組,使其結構設計更加高效緊湊,使整合後的配電模組10具有多功能的一體式,便於用戶的拆裝和使用。 Since the bottom surface of the power distribution module 10 uses the same large-area pressure-contact conductive transmission structure as that of the power supply box 9, the large-current stable transmission can be performed between the power distribution module 10 and the partition circuit 32. Moreover, a plurality of hardware interface sockets and/or temperature control modules are integrated in the power distribution module 10, so that the structural design is more efficient and compact, and the integrated power distribution module 10 has a multifunctional integrated structure, which is convenient for the user to disassemble and assemble. and use.
13)智慧溫控系統 13) Intelligent temperature control system
電腦主機箱內設有智慧溫控系統,包括手動調節開關18、溫控模組、風扇201、溫度探頭37,手動調節開關18安置於主機箱外殼上,便於用戶操作使用,溫控模組、風扇201位於主機箱內所需的位置,溫度探頭37放置在接近CPU散熱器6或顯示卡散熱器的旁邊,且處於散熱器氣流的下風風道中,溫控模組同時與手動調節開關18、風扇201、溫度探頭37相連接。首先手動調節開關18的檔位就已經限制了溫控模組輸出給風扇201電壓的最高數值和最低數值區段;其次溫度探頭37屬於一種熱敏電阻,溫度探頭37所處的環境溫度高低將會改變其自身的電阻值,與溫度探頭37相連接的溫控模組,根據溫度探頭37回饋的數值, 在電壓區段內精確的給風扇201輸出相應的供電電壓,從而達到通過溫度探頭37即時監控環境溫度而自動改變風扇201轉速的目的。 The intelligent main control system is provided in the mainframe of the computer, including a manual adjustment switch 18, a temperature control module, a fan 201, and a temperature probe 37. The manual adjustment switch 18 is disposed on the main casing of the mainframe, which is convenient for the user to operate, the temperature control module, The fan 201 is located at a desired position in the main box, and the temperature probe 37 is placed beside the CPU heat sink 6 or the display card radiator, and is in the downwind duct of the radiator airflow, and the temperature control module simultaneously and the manual adjustment switch 18 The fan 201 and the temperature probe 37 are connected. Firstly, manually adjusting the gear position of the switch 18 has limited the highest value and the lowest value segment of the voltage output from the temperature control module to the fan 201; secondly, the temperature probe 37 belongs to a thermistor, and the ambient temperature of the temperature probe 37 is high. Will change its own resistance value, the temperature control module connected to the temperature probe 37, according to the value fed back by the temperature probe 37, The corresponding supply voltage is accurately outputted to the fan 201 in the voltage section, thereby achieving the purpose of automatically changing the speed of the fan 201 by the temperature probe 37 monitoring the ambient temperature in real time.
主機板支撐柱31式溫度探頭37,由於桌上型電腦不一定都有獨立顯示卡7,而且相比之下CPU的溫度更能客觀的反應出整機溫度的變化情況,所以有必要在CPU散熱器6附近安置一個溫度探頭37。 The main board support column 31 type temperature probe 37, since the desktop computer does not necessarily have a separate display card 7, and the temperature of the CPU can more objectively reflect the change of the whole machine temperature, so it is necessary to be in the CPU A temperature probe 37 is placed near the radiator 6.
在主機板4上的PCI-E插槽與記憶體條插槽44間有個主機板安裝孔47,此安裝孔相應的在隔板3上對應的那個主機板支撐柱31上連接安裝有一所述溫度探頭37,此溫度探頭37包括以下2種形式:①固定式,溫度探頭37整體呈柱狀,上端是溫度探頭37元件,大小能剛好穿過對應的主機板安裝孔47;下端是此溫度探頭37元件的針腳,通過焊接固定在對應的隔板電路32上,且溫度探頭37整體垂直於隔板3正面上,位於主機板4上PCI-E插槽與記憶體條插槽44間的主機板安裝孔47在隔板3正面上相映射對應的位置;②活動式,在主機板4PCI-E插槽與記憶體條插槽44間的主機板安裝孔47映射對應在隔板3正面的位置上,有一溫度探頭37的插座。此溫度探頭37插座焊接固定在對應的隔板電路32上,且其高度不高於其他主機板支撐柱31的高度,當主機板4正確安裝在主機箱內隔板3上後,有一杆狀的溫度探頭37,上端為 溫度探頭37元件,下端為連接插頭。將該杆狀溫度探頭37的下端穿過主機板4上PCI-E插槽與記憶體條插槽44間的主機板安裝孔47,插入到隔板3上的溫度探頭37插座中,此時溫度探頭37與隔板3上對應的電路相正確連通,其上端的溫度探頭37元件處於主機板4正面之上,用於讀取該位置的氣流溫度。 There is a motherboard mounting hole 47 between the PCI-E slot on the motherboard 4 and the memory strip slot 44. The mounting hole is correspondingly connected to the corresponding motherboard support post 31 on the partition 3. The temperature probe 37 includes the following two forms: 1 fixed type, the temperature probe 37 is generally columnar, and the upper end is a temperature probe 37 element, and the size can just pass through the corresponding motherboard mounting hole 47; the lower end is this The pins of the temperature probe 37 are fixed to the corresponding spacer circuit 32 by soldering, and the temperature probe 37 is entirely perpendicular to the front surface of the spacer 3, and is located between the PCI-E slot and the memory strip slot 44 on the motherboard 4. The motherboard mounting holes 47 are mapped to the corresponding positions on the front surface of the partition plate 3; 2 movable type, the motherboard mounting holes 47 between the motherboard 4 PCI-E slot and the memory strip slot 44 are mapped corresponding to the partition 3 In the front position, there is a socket for the temperature probe 37. The temperature probe 37 socket is soldered and fixed on the corresponding partition circuit 32, and its height is not higher than the height of the other main board support columns 31. When the main board 4 is correctly mounted on the main box 3, there is a rod shape. Temperature probe 37, the upper end is The temperature probe has 37 components and the lower end is a connection plug. The lower end of the rod-shaped temperature probe 37 is inserted into the motherboard mounting hole 47 between the PCI-E slot and the memory strip slot 44 of the motherboard 4, and inserted into the temperature probe 37 socket of the partition 3, at this time. The temperature probe 37 is in proper communication with the corresponding circuit on the bulkhead 3, and the upper temperature probe 37 element is above the front surface of the motherboard 4 for reading the temperature of the airflow at that location.
電腦主機箱採用上述智慧溫控系統,可擁有極好用戶操作性,非常人性化,再也不用考慮風扇201是否具有PWM功能,也不用進入主機板4BISS下開啟、設置,並且散熱和噪音可以得到完美動態平衡。 The computer mainframe adopts the above intelligent temperature control system, which has excellent user operation and is very user-friendly. It is no longer necessary to consider whether the fan 201 has a PWM function, nor does it need to enter the motherboard 4BISS to open and set, and the heat dissipation and noise can be obtained. Perfect dynamic balance.
14)散熱風道 14) Cooling air duct
電腦主機箱內設有吸風式散熱風道,散熱方式採用排風式風冷散熱,其中用於向主機箱外排風的渦輪風扇201安裝於主機箱的尾部13,整機有兩個大的主進風口和兩個小的輔助進風口,兩個大的主進風口為CPU進風口22、顯示卡進風口23,兩個小的輔助進風口為箱底進風口15、側頂進風口。 The mainframe of the computer is provided with a suction-type cooling air duct, and the cooling method adopts an exhaust-type air-cooling heat dissipation, wherein the turbo fan 201 for exhausting air outside the main box is installed at the tail portion 13 of the main box, and the whole machine has two large The main air inlet and two small auxiliary air inlets, the two large main air inlets are the CPU air inlet 22 and the display card air inlet 23, and the two small auxiliary air inlets are the bottom air inlet 15 and the side air inlet.
CPU進風口22位於主機箱外殼右側板,靠近CPU散熱器6的位置上有一較大開孔;顯示卡進風口23位於主機箱外殼前部,與主機箱內安裝獨立顯示卡7的區域相對應的位置上有一較大的長條形開孔;箱底進風口15位於主機箱底部外殼上,在主機箱內的隔板3與主機板4垂直延伸到主機箱底板上的2條相交線之間開有一段細長的開孔;側頂進風口位於主機箱外殼左側板靠近主機箱頂部11和前部的位置上有一較小的長條形開孔。 The CPU air inlet 22 is located on the right side panel of the main unit casing, and has a large opening near the CPU heat sink 6; the display card air inlet 23 is located at the front of the main unit casing, corresponding to the area of the main box in which the independent display card 7 is mounted. There is a large elongated opening in the position; the bottom air inlet 15 is located on the bottom casing of the main box, and the partition 3 in the main box and the main board 4 extend perpendicularly to the two intersecting lines on the bottom plate of the main box. There is a slender opening; the side top air inlet has a small elongated opening at a position on the left side of the main casing casing near the top 11 and the front of the main casing.
吸風式散熱風道中整個主機箱除上述4處進風開孔和光碟機204入碟開孔24之外,再無其他進風孔洞,主機箱尾部內的風扇201不停的將箱內的空氣抽向箱體外,導致箱體內的氣壓低於箱體外的大氣壓,迫使箱體外的空氣通過各進風口流向箱體內。通常,吹風形式所產生的快速氣流遇到實物時,實物表面的氣壓會上升,氣壓升高空氣反而會趨於放熱狀態,不利於實物表面與氣流空氣間的熱交換;而如果採用抽風式,風道中實物表面的氣壓略微下降,低氣壓空氣會更加趨於吸熱狀態而膨脹自身體積,有利於實物表面與氣流空氣間的熱交換。 In the air suction type air duct, except for the above four air inlet openings and the optical disc machine 204 into the disc opening 24, there is no other air inlet hole, and the fan 201 in the tail of the main unit box keeps the inside of the box. The air is pumped to the outside of the box, causing the air pressure in the box to be lower than the atmospheric pressure outside the box, forcing the air outside the box to flow through the air inlets into the box. Usually, when the rapid airflow generated by the air blowing form encounters the real object, the air pressure on the surface of the object will rise, and the air pressure will increase to the heat state, which is not conducive to the heat exchange between the surface of the object and the air of the airflow; The air pressure on the surface of the air duct slightly decreases, and the low-pressure air will more absorb the heat and expand its volume, which is beneficial to the heat exchange between the surface of the object and the air of the air.
CPU進風口22流入的冷風流經對應的CPU散熱器6,吸收其熱量後冷風變成了熱流。由於主機箱為立式,CPU散熱器6在下半部,渦輪風扇201在上半部。溫度較高的熱流由於其自然升力和渦輪風扇201的吸力,流向主機箱頂部,溫度較低的部分熱流受隔板3背面渦輪風扇201的吸力,經隔板3邊緣與滑蓋前面板21內壁間的間隙流向至隔板3背面的下半部空間內。由於隔板3背面的下半部分是平行貼觸安裝的電源盒9或硬碟203,故流入此處溫度較低的熱流,可以吸收帶走電源盒9、硬碟203一部分的發熱量。 The cold air flowing in from the CPU inlet 22 flows through the corresponding CPU radiator 6, and the cold air becomes a heat flow after absorbing the heat. Since the main chassis is vertical, the CPU heat sink 6 is in the lower half and the turbo fan 201 is in the upper half. The higher temperature heat flow flows to the top of the main box due to its natural lift and the suction of the turbo fan 201, and the lower temperature part of the heat flow is absorbed by the turbo fan 201 on the back side of the partition 3, through the edge of the partition 3 and the front panel 21 of the sliding cover. The gap between the walls flows into the lower half of the space on the back of the partition 3. Since the lower half of the back surface of the partition 3 is a power supply box 9 or a hard disk 203 which is mounted in parallel, the heat flow flowing therethrough can absorb the heat generated by the power supply box 9 and the hard disk 203.
顯顯示卡進風口23流入的冷風直接流經對應的獨立顯示卡散熱器8、隔板3背面的上半部分及隔板3背面空間中的主機箱內頂。在隔板3背面的中間位置,即獨立顯示卡7安裝區域的下方,從顯示卡進風口23位置至隔板3背面的渦輪風扇201之間設 置了一塊顯示卡風擋39,此顯示卡風擋39同時密封貼觸隔板3背面和滑蓋2內壁。簡單高效的將顯示卡進風口23的冷風全部引流經過獨立顯示卡7的散熱器進行吸熱,最後被渦輪風扇201抽出箱體外,而此風道中途不受主機箱內其他空間內的熱流干擾。 The cold air flowing into the air inlet 23 of the display card directly flows through the corresponding independent display card heat sink 8, the upper half of the back surface of the partition 3, and the top of the main box in the back space of the partition 3. The intermediate position of the back surface of the partition 3, that is, the lower side of the mounting area of the independent display card 7, is provided between the position of the air inlet 23 of the display card and the turbo fan 201 at the back of the partition 3. A display card windshield 39 is placed, and the display card windshield 39 is simultaneously sealed against the back surface of the partition 3 and the inner wall of the sliding cover 2. The cold air of the air inlet 23 of the display card is simply and efficiently drained through the heat sink of the independent display card 7 to absorb heat, and finally extracted by the turbo fan 201, and the air passage is not interfered with by the heat flow in other spaces in the main box.
由於在隔板3中部區域上開有通風孔38,且正對此通風孔38在隔板3背面上緊貼著安裝有渦輪風扇201。箱底進風口15流入的冷風,流經隔板3正面的下半部和主機板4背面下半部。由於隔板3背面的下半部分是平行貼觸安裝的電源盒9或硬碟203,所以其發熱量的一部分傳遞到了隔板3下半部分,被箱底進風口15流入的冷風吸熱帶走;另一部分熱量主要傳遞至主機箱金屬外殼的尾部和底部進行散熱;還有一部分熱量被上述所說的CPU進風口22流經後剩下的部分溫度較低的熱流所吸收帶走。 Since the vent hole 38 is opened in the central portion of the partition 3, the turbo fan 201 is attached to the vent hole 38 on the back surface of the partition 3. The cold air flowing in the bottom air inlet 15 flows through the lower half of the front surface of the partition 3 and the lower half of the back surface of the main board 4. Since the lower half of the back surface of the partition plate 3 is a power supply box 9 or a hard disk 203 which is mounted in parallel, a part of the heat generation is transmitted to the lower half of the partition plate 3, and the cold air which flows in from the air inlet 15 of the tank bottom is taken away by the cold air; The other part of the heat is mainly transferred to the tail and the bottom of the metal casing of the main box for heat dissipation; and a part of the heat is absorbed by the lower temperature heat flow remaining after the CPU air inlet 22 flows as described above.
由於考慮到大功率獨立顯示卡7發熱量很大,且顯示卡進風口23風量有限,還增加一個側頂進風口,其流入的冷風主要吸收主機箱內頂在隔板3背面空間的區域和小部分隔板3背面上端區域的熱量。所述四種進風口流入的冷風,與各散熱器、隔板3、發熱硬體、部分主機箱金屬外殼內壁進行熱交換後變成空氣熱流,被安裝於主機箱上半部、尾部的若干個渦輪風扇201排出箱體外。 Considering that the high-power independent display card 7 generates a large amount of heat, and the air volume of the air inlet 23 of the display card is limited, a side air inlet is also added, and the inflowing cold air mainly absorbs the area of the main box in the space behind the partition 3 and The heat of the upper end region of the small portion of the partition 3 is small. The cold air flowing in the four air inlets is heat-exchanged with the heat sinks of the radiators, the partitions 3, the heat generating hardware, and the metal casing of the main casing, and then becomes air heat flow, and is installed in the upper half and the tail of the main box. The turbofans 201 are exhausted from the outside of the tank.
除了幾個進風口之外,整機採用的密封式設計,加上主機箱內的各硬體配置科學、簡潔,所產生的風阻較小。此外超薄PC主機箱的體積小,採用抽風形式時,其箱體內所產生的氣壓差 要比大主機箱更加明顯,主機箱內所形成的風道流量大、風速快。而且,吸風產生的低壓所形成的風道,加上硬體配置科學、簡潔,風阻小,風道中的空氣有序流動,不會產生回流熱風的現象。 In addition to several air inlets, the sealed design of the whole machine, together with the hardware configuration in the main box, is scientific and concise, and the generated wind resistance is small. In addition, the ultra-thin PC mainframe is small in size, and the air pressure difference generated in the box is in the form of ventilation. It is more obvious than the large main box, and the air duct formed in the main box has a large flow rate and a high wind speed. Moreover, the air passage formed by the low pressure generated by the suction, together with the scientific arrangement of the hardware, is simple, the wind resistance is small, and the air in the air passage flows in an orderly manner, and the phenomenon of returning hot air does not occur.
上述四個進風開孔上都活動安裝有防塵網25,用以過濾進入箱內空氣中的灰塵,使主機箱內保持清潔和長久的良好通風、散熱性能。 An air filter 25 is arranged on the four air inlet openings to filter dust entering the air in the box, so that the main box is kept clean and has good ventilation and heat dissipation performance for a long time.
15)渦輪風扇201 15) Turbofan 201
隔板3正面空間和隔板3背面空間內都安裝有渦輪風扇201,隔板3正面空間,在主機板4西端邊有一段位置區域上是主機板4的I/O介面組,而在主機板I/O介面組41旁邊餘下的主機板4西端邊部分,其主機板4上的元件高度都在18mm以內,所以其主機板4上空的空間比較空闊,且主機板4西端邊是靠近主機箱尾部外殼的。故在主機板4此位置上空的主機箱尾部外殼內壁上安裝有渦輪風扇201,渦輪風扇201的出風口與主機箱尾部外殼的開孔17相連,將氣流排向箱體外。安裝在主機板4西端邊空閒位置上的渦輪風扇201,巧妙、高效地利用了該空閒位置進行排風散熱,沒有額外增加主機箱的體積,且活動式的安裝結構也完全不影響硬體的拆裝使用。 A turbofan 201 is installed in the front space of the partition 3 and the back space of the partition 3. The front space of the partition 3 is an I/O interface group of the motherboard 4 at a position on the west end of the motherboard 4, and is in the host. The west end portion of the remaining motherboard 4 next to the panel I/O interface group 41 has a component height of less than 18 mm on the motherboard 4, so the space above the motherboard 4 is relatively wide, and the west end of the motherboard 4 is close. The main chassis is the outer casing of the case. Therefore, a turbo fan 201 is installed on the inner wall of the tail casing of the main box at the position of the main board 4, and the air outlet of the turbo fan 201 is connected to the opening 17 of the tail casing of the main casing to discharge the airflow to the outside of the casing. The turbo fan 201 installed in the idle position of the west end of the motherboard 4 utilizes the idle position for exhaust and heat dissipation in an ingenious and efficient manner, without additionally increasing the volume of the main chassis, and the movable mounting structure does not affect the hardware at all. Disassembly and use.
在隔板3上開有通風孔38,渦輪風扇201的一面緊貼著此通風孔38安裝在隔板3背面上。此渦輪風扇201的一面透過隔板3上的通風孔38抽取隔板3與主機板4間間隙中的空氣;渦輪 風扇201的另一面抽取隔板3背面空間內的空氣。此渦輪風扇201的出風口與主機箱尾部外殼的開孔相連,將所有抽取的空氣排出箱體之外;安裝在主機箱尾部外殼內壁上的渦輪風扇201,包含以下2種形式存在:①固定式,即渦輪風扇201通過螺絲或安裝卡槽固定於主機箱尾部外殼的內壁上;②活動式,與渦輪風扇201出風口相垂直的兩條邊框上安裝有導軌,在主機箱尾部外殼安裝風扇201位置上有開孔,且此開孔的形狀、尺寸都剛好與渦輪風扇201所在的出風口橫截面相匹配。有一導軌滑槽正好垂直正對此開孔安裝在主機箱尾部外殼的內壁上,帶有導軌的渦輪風扇201與主機箱尾部外殼內壁上的導軌滑槽相匹配,渦輪風扇201通過主機箱尾部外殼上的開孔可自由在主機箱體內外移動,當安裝的此渦輪風扇201阻礙到主機箱內硬體的拆裝時,可將此渦輪風扇201移動到主機箱體外,待主機箱內的硬體拆裝好了後,再將此渦輪風扇201移回至主機箱體內的內壁上。 A vent hole 38 is formed in the partition plate 3, and one side of the turbo fan 201 is attached to the back surface of the partition plate 3 against the vent hole 38. One side of the turbo fan 201 extracts air in the gap between the partition plate 3 and the main plate 4 through the vent hole 38 in the partition plate 3; the turbine The other side of the fan 201 extracts air from the back space of the partition 3. The air outlet of the turbo fan 201 is connected to the opening of the tail casing of the main box, and all the extracted air is discharged out of the box; the turbo fan 201 installed on the inner wall of the tail casing of the main box includes the following two forms: The fixed type, that is, the turbo fan 201 is fixed to the inner wall of the tail casing of the main box by screws or mounting slots; 2 the movable type, the two frames perpendicular to the air outlet of the turbo fan 201 are mounted with guide rails, and the outer casing of the main casing The installation fan 201 has an opening at a position, and the shape and size of the opening are exactly matched with the cross section of the air outlet where the turbo fan 201 is located. A rail chute is vertically mounted on the inner wall of the tail casing of the main casing, and the turbine fan 201 with the rail is matched with the rail chute on the inner wall of the tail casing of the main casing, and the turbo fan 201 passes through the main casing. The opening on the tail casing can be freely moved inside and outside the main box. When the installed turbo fan 201 obstructs the disassembly and assembly of the hardware in the main box, the turbo fan 201 can be moved to the outside of the main box, and the main box is placed in the main box. After the hardware is disassembled, the turbo fan 201 is moved back to the inner wall of the main body casing.
雖然本新型創作已以實施例揭露如上,然其並非用以限定本新型創作。在上述介紹中電腦主機箱,在中文中習慣上是指電腦主機,電腦主機箱也簡稱電腦機箱。任何所屬技術領域中具有通常知識者,在不脫離本新型創作的精神和範圍內,當可作些許的更動與潤飾,故本新型創作的保護範圍當視後附的申請專利 範圍所界定者為準。 Although the present invention has been disclosed above by way of example, it is not intended to limit the novel creation. In the above introduction, the computer mainframe is customarily referred to as a computer mainframe in Chinese, and the mainframe of the computer is also referred to as a computer chassis. Anyone with ordinary knowledge in the technical field can make some changes and refinements without departing from the spirit and scope of this new creation. Therefore, the scope of protection of this new creation should be regarded as the attached patent application. The scope is defined.
1‧‧‧主機箱外殼 1‧‧‧Hosting case
12‧‧‧主機箱外殼的底部 12‧‧‧Bottom of the main box casing
16‧‧‧主機板I/O擋板隔板卡槽 16‧‧‧Main board I/O baffle partition card slot
3‧‧‧隔板 3‧‧‧Baffle
31‧‧‧主機板支撐柱 31‧‧‧ motherboard support column
32‧‧‧隔板電路 32‧‧‧Baffle circuit
34‧‧‧固定式隔板插座 34‧‧‧Fixed bulkhead socket
Claims (11)
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CN201520342672 | 2015-05-25 | ||
CN201610353262.5A CN105892590A (en) | 2015-05-25 | 2016-05-24 | Partition plate in computer host |
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TWM550836U true TWM550836U (en) | 2017-10-21 |
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TW106207213U TWM550836U (en) | 2015-05-25 | 2017-05-19 | Partition for computer host |
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CN (2) | CN205880769U (en) |
TW (1) | TWM550836U (en) |
WO (1) | WO2017202249A1 (en) |
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CN205880769U (en) * | 2015-05-25 | 2017-01-11 | 周奋豪 | Baffle among computer |
CN206162286U (en) * | 2015-05-25 | 2017-05-10 | 周奋豪 | Mainframe box |
CN106919234B (en) * | 2017-02-28 | 2019-08-30 | 林星星 | A kind of computer hardware Special heat dissipating case |
CN207216561U (en) * | 2017-06-28 | 2018-04-10 | 深圳市英蓓特科技有限公司 | A kind of Raspberry Pi series card computer security power control |
CN109254629A (en) * | 2017-07-13 | 2019-01-22 | 技嘉科技股份有限公司 | Computer system |
TWI634414B (en) * | 2017-07-13 | 2018-09-01 | 技嘉科技股份有限公司 | Computer system |
CN112822899B (en) * | 2020-12-29 | 2022-08-16 | 中国航天时代电子有限公司 | Dual-redundancy 270V high-voltage high-power load monitoring device |
CN116931687B (en) * | 2023-09-15 | 2023-11-28 | 四川华鲲振宇智能科技有限责任公司 | Server architecture and chassis structural design thereof |
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CN200979678Y (en) * | 2006-11-28 | 2007-11-21 | 朱辉 | A small-sized computer case with double-placing and compatibility |
CN201654637U (en) * | 2009-11-26 | 2010-11-24 | 鸿富锦精密工业(深圳)有限公司 | Computer system |
CN102478906B (en) * | 2010-11-30 | 2013-08-28 | 英业达股份有限公司 | Rack server |
CN202102350U (en) * | 2011-04-11 | 2012-01-04 | 周超 | H-structured computer case |
CN202453788U (en) * | 2012-01-19 | 2012-09-26 | 周奋豪 | Hard disk installation structure of desktop computer |
CN205880794U (en) * | 2015-05-25 | 2017-01-11 | 周奋豪 | Installation fixing device and dedicated CPU radiator of computer CPU radiator |
CN205880769U (en) * | 2015-05-25 | 2017-01-11 | 周奋豪 | Baffle among computer |
CN105807869A (en) * | 2015-05-25 | 2016-07-27 | 周奋豪 | Radiating structure and mounting structure for independent graphics card of computer |
CN205880806U (en) * | 2015-05-25 | 2017-01-11 | 周奋豪 | Computer power supply box |
CN206162286U (en) * | 2015-05-25 | 2017-05-10 | 周奋豪 | Mainframe box |
CN104991618A (en) * | 2015-07-24 | 2015-10-21 | 上海航天科工电器研究院有限公司 | VPX bus based integration architecture |
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