CN2807478Y

CN2807478Y - Radiation structure of micro computer

Info

Publication number: CN2807478Y
Application number: CN 200520113337
Authority: CN
Inventors: 郑万成
Original assignee: QINGANG ZIXUN CO Ltd
Current assignee: QINGANG ZIXUN CO Ltd; King Young Tech Co Ltd
Priority date: 2005-07-08
Filing date: 2005-07-08
Publication date: 2006-08-16
Anticipated expiration: 2015-07-08

Abstract

The utility model discloses heat dissipation structure of a microcomputer which comprises at least one casing and one mainboard, wherein the end edge of the mainboard is provided with a plurality of connectors and electronic components. One surface of the mainboard is provided with heating components, such as a central processing unit (CPU), electronic chips, etc., and is correspondingly provided with a heat dissipating unit. The heat dissipating unit is provided with contact sections which respectively correspond to the heating components such as the CPU, the electronic chips, etc. Each of the contact sections is smoothly attached to one surface of each of the heating component such as the CPU, the electronic chips, etc. As a result, a prior fan of the microcomputer can be omitted, and the utility model is suitable for a low-power mainboard having better effects of heat dissipation and electromagnetic interference (EMI) prevention.

Description

The radiator structure of microcomputer

Technical field

The utility model relates to a kind of radiator structure, refers in particular to a kind ofly applicable on the lower powered mainboard, and has the radiator structure of the microcomputer of preferable heat radiation and anti-electromagnetic interference (EMI) effect simultaneously.

Background technology

The radiator structure of general microcomputer is to dispose a fin on the central processing unit of mainboard, and this fin is covered on the central processing unit, and group is provided with a fan on this fin in addition; The mode of its heat radiation is to draw the hot gas that central processing unit produced by fin, produces air-flow by the fan blowing that assembles on the fin again, the hot-fluid of fin is flowed, to reach the effect of heat radiation thus to the four directions.

But, because main frame housing inside is an enclosure space, and on this mainboard except that central processing unit, all the other each spare parts also can produce thermal source when operation, and in the enclosure space of this main frame housing inside, can't directly fully hot gas be discharged outside the host shell, and make that hot gas can be in the host shell inner loop, therefore, the mode that fan blows to fin still can produce thermal current in host shell inside, not good at the mobile repeatedly radiating effect that is produced of enclosure space, can't reach fully the function of heat radiation, and it is too high and have operational paradigm to reduce or take place when the situation of machine often to produce central processing unit Yin Wendu; Moreover have the generation of noise often when this fan running; and the damage that overuses; moreover owing to lower its pyrotoxin of mainboard of some power is less; therefore; do not need to cooperate fan to dispel the heat, but with present lower powered microcomputer, it still has and fan is set dispels the heat; therefore lose the meaning of what is called " miniature " computer so cause its volume to dwindle again, the radiator structure of known central processing unit and required can't realisticly use the time.

The utility model content

The technical problems to be solved in the utility model is: provide a kind of radiator structure of microcomputer, to overcome the defective of above-mentioned known technology.

Technical solution of the present utility model is: a kind of radiator structure of microcomputer, this microcomputer includes a casing at least, reaches a mainboard that is arranged in the casing, the ora terminalis of this mainboard is provided with a plurality of connectors and electronic building brick, and the one side of mainboard is provided with heat generating components such as central processing unit and electronic chip, wherein: correspondence is provided with a heat-sink unit on the one side of this mainboard, and this heat-sink unit pastes and the one side of each contact site and described heat generating component is smooth corresponding to being respectively arranged with contact site on the described heat generating component.

The radiator structure of aforesaid microcomputer, wherein, this heat-sink unit is a plate body.

The radiator structure of aforesaid microcomputer, wherein, this heat-sink unit is preferable copper for heat radiation.

The radiator structure of aforesaid microcomputer, wherein, this heat-sink unit is the preferable aluminium matter of heat radiation.

The radiator structure of aforesaid microcomputer, wherein, the appropriate location of this heat-sink unit has more than one fixing hole, can cooperate fixation kit to combine with mainboard thus.

The radiator structure of aforesaid microcomputer, wherein, two sides of this heat-sink unit are respectively arranged with a kink, one base plate clamping can be limited on the another side of mainboard by this kink.

The radiator structure of aforesaid microcomputer, wherein, this contact site is for being covered on the indent district on the heat generating components such as central processing unit and electronic chip.

The radiator structure of aforesaid microcomputer, wherein, this contact site is for can directly being contacted with the bossy body on the heat generating components such as central processing unit and electronic chip.

The radiator structure of the utility model microcomputer can effectively improve the various shortcoming of known technology, it can be by being arranged at the heat-sink unit on the mainboard, reach and save the original fan of microcomputer and be applicable on the lower powered mainboard, and simultaneously with preferable heat radiation and anti-electromagnetic interference (EMI) effect.

Description of drawings

Fig. 1 is the perspective exploded view of the utility model first embodiment.

Fig. 2 is the assembled state schematic diagram of the utility model first embodiment.

Fig. 3 is the profile status schematic diagram after the utility model first embodiment assembling.

Fig. 4 is the perspective exploded view of the utility model second embodiment.

Fig. 5 is the utility model second embodiment assembled state schematic diagram.

Fig. 6 is the profile status schematic diagram after the utility model second embodiment assembling.

Fig. 7 is the profile status schematic diagram of the utility model the 3rd embodiment.

The drawing reference numeral explanation:

1, casing 11, peristome 2, mainboard

21, connector 22, electronic building brick 23, central processing unit

24, electronic chip 25, connect hole 3, heat-sink unit

31,31a, contact site 32, fixing hole 33, fixation kit

34, kink 4, base plate

Embodiment

See also Fig. 1, Fig. 2 and shown in Figure 3, be respectively the perspective exploded view of the utility model first embodiment, the assembled state schematic diagram of the utility model first embodiment and the profile status schematic diagram after the utility model first embodiment assembling.As shown in the figure: the radiator structure that the utility model proposes a kind of microcomputer, it is made of a casing 1, a mainboard 2 and a heat-sink unit 3, can save the original fan of microcomputer and be applicable on the lower powered mainboard 2, and simultaneously with preferable heat radiation and anti-electromagnetic interference (EMI) effect.

The above-mentioned casing of carrying 1 has a peristome 11 at least.

This mainboard 2 is arranged among the said machine casing 1, and the ora terminalis of this mainboard 2 is provided with a plurality of connectors 21 and electronic building brick 22, and the one side of mainboard 2 is provided with heat generating components such as central processing unit 23 and electronic chip 24, and the appropriate location of this mainboard 2 has the more than one hole 25 that connects.

This heat-sink unit 3 is that a correspondence is arranged at the plate body on the one side of above-mentioned mainboard 1, and this heat-sink unit 3 can be copper, the metal material that heat radiation such as aluminium is preferable, and this heat-sink unit 3 is corresponding to being respectively arranged with contact site 31 on the heat generating components such as central processing unit 23 and electronic chip 24, this contact site 31 is for being covered on the indent district on the heat generating components such as central processing unit 23 and electronic chip 24, and smooth the pasting of one side of each contact site 31 and heat generating components such as central processing unit 23 and electronic chip 24, and in the appropriate location of this heat-sink unit 3 have more than one with mainboard 2 connect the corresponding fixing hole 32 in hole 25, can cooperate fixation kit 33 to combine thus with the hole 25 that connects of mainboard 2.So, constitute the radiator structure of a brand-new microcomputer by above-mentioned structure.

See also shown in Figure 3ly, be the profile status schematic diagram after the utility model first embodiment assembling.As shown in the figure: be to be covered on the heat generating components such as central processing unit 23 and electronic chip 24 when using by the contact site 31 of heat-sink unit 3 as the indent district, when heat generating components such as this central processing unit 23 and electronic chip 24 when running produces thermal source, can directly its thermal source be passed on the contact site 31 of heat-sink unit 3, after making the contact site 31 of heat-sink unit 3 directly absorb the thermal source of heat generating components such as central processing units 23 and electronic chip 24, conduct on the heat-sink unit 3, reaching large-area thermal source dissipation, and reach preferable radiating effect; And, therefore, after being covered on the mainboard 2, this heat-sink unit 3 can reach the effect of preferable anti-electromagnetic interference (EMI) simultaneously because this heat-sink unit 3 is made with metal materials such as copper, aluminium.

See also Fig. 4, Fig. 5 and shown in Figure 6, be respectively the three-dimensional exploded view, the utility model second embodiment assembled state schematic diagram of the utility model second embodiment and the profile status schematic diagram after the utility model second embodiment assembling.As shown in the figure: heat-sink unit 3 two sides of the present utility model can be respectively arranged with a kink 34, stubborn folding by this kink 34 is arranged among the casing 1 after 4 clampings of one base plate can being limited on the another side of mainboard 2 again, and base plate 4 also can be made as the preferable metal materials of heat radiation such as copper, aluminium, and then strengthens its radiating effect; Maybe this heat-sink unit 3 and base plate 4 directly can be processed the external form that is designed to required casing, save the casing that former need are set up, can finish the assembling of microcomputer, and then reach the effect of saving material, can reach the effect of above-mentioned put forward equally with preferable heat radiation and anti-electromagnetic interference (EMI).

See also shown in Figure 7ly, be the profile status schematic diagram of the utility model the 3rd embodiment.As shown in the figure: can be according to actual state when using required, this contact site 31a is made bossy body on the heat generating components such as can directly being contacted with central processing unit 23 and electronic chip 24, make heat-sink unit 3 surfaces form a tabular surface, the easier external form that directly is designed to required casing.

In sum, the radiator structure of the utility model microcomputer can effectively improve known various shortcoming, can be by being arranged at the heat-sink unit on the mainboard, reach and save the original fan of microcomputer and be applicable on the lower powered mainboard, and simultaneously with preferable heat radiation and anti-electromagnetic interference (EMI) effect, and then make the utility model more progressive, more practical, more meet the required of user.

Only the above person only is preferred embodiment of the present utility model, when not limiting the scope that the utility model is implemented with this; So, allly change and modify according to the utility model claim and the simple equivalent done of creation description, all should still belong in the scope that the utility model patent contains.

Claims

1. the radiator structure of a microcomputer, this microcomputer includes a casing at least, reaches a mainboard that is arranged in the casing, the ora terminalis of this mainboard is provided with a plurality of connectors and electronic building brick, and the one side of mainboard is provided with heat generating component, described heat generating component comprises central processing unit and electronic chip, it is characterized in that:

Correspondence is provided with a heat-sink unit on the one side of this mainboard, and this heat-sink unit pastes and the one side of each contact site and described heat generating component is smooth corresponding to being respectively arranged with contact site on the described heat generating component.

2. the radiator structure of microcomputer as claimed in claim 1, it is characterized in that: this heat-sink unit is a plate body.

3. the radiator structure of microcomputer as claimed in claim 1 is characterized in that: this heat-sink unit is the preferable copper heat-sink unit of heat radiation.

4. the radiator structure of microcomputer as claimed in claim 1 is characterized in that: this heat-sink unit is the preferable aluminium matter heat-sink unit of heat radiation.

5. the radiator structure of microcomputer as claimed in claim 1, it is characterized in that: this heat-sink unit has the more than one fixing hole that cooperates fixation kit to combine with mainboard.

6. the radiator structure of microcomputer as claimed in claim 1, it is characterized in that: two sides of this heat-sink unit are respectively arranged with a kink, by this kink one base plate clamping are limited on the another side of described mainboard.

7. the radiator structure of microcomputer as claimed in claim 1 is characterized in that: this contact site is for being covered on the indent district on the described heat generating component.

8. the radiator structure of microcomputer as claimed in claim 1 is characterized in that: this contact site is for can directly being contacted with the bossy body on the described heat generating component.