CN103885556A - Heat transfer type server machine shell - Google Patents
Heat transfer type server machine shell Download PDFInfo
- Publication number
- CN103885556A CN103885556A CN201410139946.6A CN201410139946A CN103885556A CN 103885556 A CN103885556 A CN 103885556A CN 201410139946 A CN201410139946 A CN 201410139946A CN 103885556 A CN103885556 A CN 103885556A
- Authority
- CN
- China
- Prior art keywords
- server
- machine shell
- base
- chassis base
- electronic devices
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Images
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The invention discloses a heat transfer server machine shell. The heat transfer server machine shell comprises a machine shell base, a machine shell upper cover and an air turbulence device. A bottom plate of the machine shell base and four side plates of the bottom plate are made of metal good in heat conducting performance through casting, and the machine shell base is of an integrated structure. A groove type structure or convex type solid structures are cast in the bottom plate of the machine shell base and can be in tight contact with electronic components, generating much heat, on a server. Cooling fins are arranged in a space range, corresponding to electronic components generating less heat, of the bottom plate of the machine shell base, wherein the electronic components generating less heat are arranged on the server, and the cooling fins and the bottom plate are integrated. The air turbulence device is arranged on the machine shell base and conducts turbulence on air in a sealed space of the server machine shell, so that hot air is cooled by the cooling fins. According to the heat transfer type server machine shell, due to the design of the groove type structure in the cast aluminum server machine shell, the number of fans needing installing is small, the space of the server machine shell is saved, and the size of the server machine shell is smaller.
Description
Technical field
The present invention relates to server shell, be specifically related to one and can realize transmission of heat by contact formula server shell.
Background technology
The heat radiation of server is the focus of industry forever, more and more higher at bulk density, today that power consumption is increasing, server, especially widely apply the data center of server, heat dissipation problem is " that waves is not loose " forever, now, because external cooling is difficult to deal with problems completely, and radiating efficiency is lower, often cause the inner local overheating of server, thereby can not reach the requirement of server radiating, so increasing manufacturer server focuses on server inside by the heat radiation of server.For server radiating, especially internal heat dissipating, simple increase number of fans or increase rotation speed of the fan can not well be dealt with problems, fan is more, and rotating speed is faster, and power consumption is also just more, noise also can be larger, and for user, power consumption and noise are also very large problems.
Summary of the invention
The object of the invention is to solve existing server radiating problem, and provide the transmission of heat by contact formula server shell of a kind of heat transfer type server shell and server close contact, power and the number of the required fan of server radiating minimize, the heat coming out for the larger electronic devices and components of thermal value on server can directly be transferred in environment by metal server shell, and the heat that the electronic devices and components that on server, thermal value is less come out is accelerated to flow through air turbulence device, pass to metal server shell by the heat radiator of server shell inside, then be directly transferred in environment.
In order to solve the problems of the technologies described above, the technical solution adopted in the present invention is as follows:
A kind of heat transfer type server shell, comprises a chassis base (1), casing upper cover (10) and air turbulence device (5), it is characterized in that, the base plate of described this chassis base (1) and this base plate four side plates are the integral structure of casting; Described chassis base (1) is the good ingot metal housing of thermal conductivity, the base plate interior of described chassis base (1) is cast with fluted body (3) or convex (2) solid construction according to upper larger electronic devices and components (9) planform of thermal value of server (7), and the base plate that makes described chassis base (1) and described server (7) are gone up electronic devices and components (9) that thermal value is larger can close contact; On the base plate of described chassis base (1), in the less corresponding spatial dimension of electronic devices and components (8) of the upper thermal value of described server (7), be provided with the heat radiator (4) with base plate one, between described heat radiator (4) and described server (7) electronic devices and components (8) that above thermal value is less, leave space, they are discontiguous; It is upper that described air turbulence device (5) is arranged at described chassis base (1), and the air in server shell seal cavity is stirred; The outside surface of the base plate of described this chassis base (1) is a flat metal plates; On faying face between described chassis base (1) and casing upper cover (10), be respectively arranged with liner; The side plate of described chassis base (1) is provided with line outlet (6), guarantees that the I/O mouth on server shell internal server (7) is connected with outside by described line outlet (6).
The above air turbulence device (5) is fan.
Between the base plate of the above chassis base (1) and described server (7) electronic devices and components (9) that above thermal value is larger, be provided with insulating heat-conduction material, the base plate electronic devices and components (9) larger with the upper thermal value of described server (7) that guarantee described chassis base (1) reach contacting of maximum area, and the heat that the upper larger electronic devices and components (9) of thermal value of described server (7) are come out can directly transfer out by metal server shell.
The above casing upper cover (10) is the smooth plastic construction of outside surface or metal construction.
The above server shell base (1) is the good cast aluminum casings of thermal conductivity.
The present invention compared with prior art, has the following advantages:
1, this server shell inner air closed circulation, the larger electronic devices and components of server thermal value directly contact with metal shell, reach transmission of heat by contact, and the heat that the electronic devices and components that on server, thermal value is less come out is accelerated Air Flow through air turbulence device, pass to metal server shell by the heat radiator of server shell inside, be then directly transferred in environment;
2, use the server of this casing, be sealed in casing inside, without flow of external air, avoided the gas of the electronic devices and components on airborne dust or perishable server to enter, can increase the serviceable life of server;
3, the design of this heat transfer type server shell, can reduce the energy consumption of whole data center, and PUE approaches 1, and external advanced data center machine room PUE value is less than 2 conventionally, and the PUE value of most of data centers of China is between 2-3;
4, in server shell, required provided with fan is few, has saved server machine shell-space, makes the volume of server smaller and more exquisite.
Accompanying drawing explanation
Fig. 1 is server shell schematic cross-section of the present invention.
Fig. 2 is server shell side schematic view of the present invention.
In figure, number: (1) chassis base; (2) chassis base convex structure; (3) chassis base fluted body structure; (4) heat radiator; (5) air turbulence device; (6) line outlet; (7) server; (8) the less electronic devices and components of thermal value on server; (9) the larger electronic devices and components of thermal value on server; (10) casing upper cover.
Embodiment
In conjunction with above-mentioned accompanying drawing explanation specific embodiments of the invention.
Server shell schematic cross-section of the present invention and Fig. 2 are server shell side schematic view of the present invention as shown in Figure 1, comprise chassis base (1), casing upper cover (2) and air turbulence device (5); The base plate of described this chassis base (1) and this base plate four side plates are the integral structure of casting; Described chassis base (1) is the good ingot metal housing of thermal conductivity, the base plate interior of described chassis base (1) is cast with fluted body (3) or convex (2) solid construction according to upper larger electronic devices and components (9) planform of thermal value of server (7), and the base plate that makes described chassis base (1) and described server (7) are gone up electronic devices and components (9) that thermal value is larger can close contact; On the base plate of described chassis base (1), in the less corresponding spatial dimension of electronic devices and components (8) of the upper thermal value of described server (7), be provided with the heat radiator (4) with base plate one, between described heat radiator (4) and described server (7) electronic devices and components (8) that above thermal value is less, leave space, they are discontiguous; It is upper that described air turbulence device (5) is arranged at described chassis base (1), and the air in server shell seal cavity is stirred; The outside surface of the base plate of described this chassis base (1) is a flat metal plates; On faying face between described chassis base (1) and casing upper cover (10), be respectively arranged with liner; The side plate of described chassis base (1) is provided with line outlet (6), guarantees that the I/O mouth on server shell internal server (7) is connected with outside by described line outlet (6).
The design philosophy of this server shell all adapts to for present all electronic devices and components that need heat radiation, can on the base plate of chassis base (1), cast according to the shape of different server mainboard different convex-concave structure contacts its electronic devices and components larger with thermal value, the heat of directly electronic devices and components larger thermal value being sent is transmitted to outside by transmission of heat by contact mode, and its radiating efficiency is much larger than air-cooled or water-cooling; And the heat that the electronic devices and components that on server, thermal value is less come out is accelerated Air Flow through air turbulence device, pass to metal server shell by the heat radiator of server shell inside, then be directly transferred in environment, use the server of this casing, be sealed in casing inside, without flow of external air, avoid the gas of the electronic devices and components on airborne dust or perishable server to enter, can increase the serviceable life of server.And this casing simple in structure, production cost is low, be easy to processing, complete function, directly the server of coupling is put in and can directly be dispelled the heat, and uses very aspect.
Above content is in conjunction with concrete preferred implementation further description made for the present invention, can not assert that specific embodiment of the invention is confined to these explanations.For general technical staff of the technical field of the invention, without departing from the inventive concept of the premise, can also make some simple deduction or replace, all should be considered as belonging to protection scope of the present invention.
Claims (5)
1. a heat transfer type server shell, comprises a chassis base (1), casing upper cover (10) and air turbulence device (5), it is characterized in that, the base plate of described this chassis base (1) and this base plate four side plates are the integral structure of casting; Described chassis base (1) is the good ingot metal housing of thermal conductivity, the base plate interior of described chassis base (1) is cast with fluted body (3) or convex (2) solid construction according to upper larger electronic devices and components (9) planform of thermal value of server (7), and the base plate that makes described chassis base (1) and described server (7) are gone up electronic devices and components (9) that thermal value is larger can close contact; On the base plate of described chassis base (1), in the less corresponding spatial dimension of electronic devices and components (8) of the upper thermal value of described server (7), be provided with the heat radiator (4) with base plate one, between described heat radiator (4) and described server (7) electronic devices and components (8) that above thermal value is less, leave space, they are discontiguous; It is upper that described air turbulence device (5) is arranged at described chassis base (1), and the air in server shell seal cavity is stirred; The outside surface of the base plate of described this chassis base (1) is a flat metal plates; On faying face between described chassis base (1) and casing upper cover (10), be respectively arranged with liner; The side plate of described chassis base (1) is provided with line outlet (6), guarantees that the I/O mouth on server shell internal server (7) is connected with outside by described line outlet (6).
2. a kind of heat transfer type server shell according to claim 1, is characterized in that, described air turbulence device (5) is fan.
3. a kind of heat transfer type server shell according to claim 1, it is characterized in that, between the base plate of described chassis base (1) and described server (7) electronic devices and components (9) that above thermal value is larger, be provided with insulating heat-conduction material, the base plate electronic devices and components (9) larger with the upper thermal value of described server (7) that guarantee described chassis base (1) reach contacting of maximum area, and the heat that the upper larger electronic devices and components (9) of thermal value of described server (7) are come out can directly transfer out by metal server shell.
4. a kind of heat transfer type server shell according to claim 1, is characterized in that, described casing upper cover (10) is the smooth plastic construction of outside surface or metal construction.
5. a kind of heat transfer type server shell according to claim 1, is characterized in that, described server shell base (1) is the good cast aluminum casings of thermal conductivity.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410139946.6A CN103885556A (en) | 2014-04-09 | 2014-04-09 | Heat transfer type server machine shell |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410139946.6A CN103885556A (en) | 2014-04-09 | 2014-04-09 | Heat transfer type server machine shell |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN103885556A true CN103885556A (en) | 2014-06-25 |
Family
ID=50954497
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201410139946.6A Pending CN103885556A (en) | 2014-04-09 | 2014-04-09 | Heat transfer type server machine shell |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN103885556A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108445977A (en) * | 2017-02-16 | 2018-08-24 | 光宝电子(广州)有限公司 | Casing structure |
| US10712787B2 (en) | 2017-02-16 | 2020-07-14 | Lite-On Electronics (Guangzhou) Limited | Chassis structure |
Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5060114A (en) * | 1990-06-06 | 1991-10-22 | Zenith Electronics Corporation | Conformable pad with thermally conductive additive for heat dissipation |
| CN2807478Y (en) * | 2005-07-08 | 2006-08-16 | 庆扬资讯股份有限公司 | Radiation structure of micro computer |
| CN101174172A (en) * | 2006-10-30 | 2008-05-07 | 联想（新加坡）私人有限公司 | Housing temperature suppressing structure in electronic device and portable computer |
| CN201115200Y (en) * | 2007-10-23 | 2008-09-10 | 成都希望电子研究所有限公司 | An efficient heat radiation enclosure |
| CN101325862A (en) * | 2008-08-01 | 2008-12-17 | 北京星网锐捷网络技术有限公司 | Cabinet, radiating device and method for installing the radiating device |
| CN201607677U (en) * | 2010-04-16 | 2010-10-13 | 肖宾宾 | Dust-proof case |
| CN202677291U (en) * | 2012-07-06 | 2013-01-16 | 南京南瑞继保电气有限公司 | Integral heat dissipation structure for switch chip case |
| CN203788632U (en) * | 2014-04-09 | 2014-08-20 | 北京德能恒信科技有限公司 | Novel server heat transfer casing |
-
2014
- 2014-04-09 CN CN201410139946.6A patent/CN103885556A/en active Pending
Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5060114A (en) * | 1990-06-06 | 1991-10-22 | Zenith Electronics Corporation | Conformable pad with thermally conductive additive for heat dissipation |
| CN2807478Y (en) * | 2005-07-08 | 2006-08-16 | 庆扬资讯股份有限公司 | Radiation structure of micro computer |
| CN101174172A (en) * | 2006-10-30 | 2008-05-07 | 联想（新加坡）私人有限公司 | Housing temperature suppressing structure in electronic device and portable computer |
| CN201115200Y (en) * | 2007-10-23 | 2008-09-10 | 成都希望电子研究所有限公司 | An efficient heat radiation enclosure |
| CN101325862A (en) * | 2008-08-01 | 2008-12-17 | 北京星网锐捷网络技术有限公司 | Cabinet, radiating device and method for installing the radiating device |
| CN201607677U (en) * | 2010-04-16 | 2010-10-13 | 肖宾宾 | Dust-proof case |
| CN202677291U (en) * | 2012-07-06 | 2013-01-16 | 南京南瑞继保电气有限公司 | Integral heat dissipation structure for switch chip case |
| CN203788632U (en) * | 2014-04-09 | 2014-08-20 | 北京德能恒信科技有限公司 | Novel server heat transfer casing |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108445977A (en) * | 2017-02-16 | 2018-08-24 | 光宝电子(广州)有限公司 | Casing structure |
| US10712787B2 (en) | 2017-02-16 | 2020-07-14 | Lite-On Electronics (Guangzhou) Limited | Chassis structure |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| TW200506220A (en) | Cooling device and centrifugal pump to be used in the same device | |
| CN102791107A (en) | Sealing and water-cooling method and equipment for cooling electronic equipment | |
| JP2015130440A (en) | Electronic apparatus | |
| WO2021129443A1 (en) | Wireless charging device | |
| US10816279B2 (en) | High-efficiency water-cooled heat dissipation device | |
| CN207219278U (en) | A kind of electrical equipment and its radiator structure | |
| CN105759923A (en) | Separating type radiating device and method for closed industrial computer | |
| CN203788632U (en) | Novel server heat transfer casing | |
| CN214901806U (en) | Embedded closed industrial personal computer with fan | |
| CN205266113U (en) | Sheet system fin | |
| CN103885556A (en) | Heat transfer type server machine shell | |
| CN203689295U (en) | Server case | |
| CN203786654U (en) | Novel radiating machine enclosure | |
| CN204793110U (en) | Group battery with heat abstractor | |
| CN103838335A (en) | Heat transfer type server chassis | |
| CN208210525U (en) | A kind of water proof and dust proof cooling system | |
| CN206378782U (en) | A kind of sealed air-cooled ruggedized computer | |
| CN203775010U (en) | Frequency converter | |
| CN210042634U (en) | Wireless charging seat adopting phase change inhibition heat transfer material and piezoelectric ceramic fan | |
| CN103885562A (en) | Heat transfer type server machine shell | |
| CN204349764U (en) | External heat radiation formula frequency converter | |
| CN209949722U (en) | Totally-enclosed dustproof magnetron power supply | |
| CN208402330U (en) | Electronic equipment dissipating heat system | |
| CN207765584U (en) | A kind of new energy car battery group heat converter structure | |
| CN208077106U (en) | A kind of air suction type radiator of notebook computer |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| CB02 | Change of applicant information |
Address after: 100041 Beijing, Badachu hi tech park, West Wells Road, building 9415, room 3, No., room 3 Applicant after: Beijing Science and Technology Co., Ltd. Germany To Hanson Address before: 100094 Beijing, Badachu hi tech park, West Wells Road, building 9415, room 3, No., room 3 Applicant before: Beijing Science and Technology Co., Ltd. Germany to Hanson |
|
| COR | Change of bibliographic data | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20140625 |
|
| WD01 | Invention patent application deemed withdrawn after publication |