CN202677291U - Integral heat dissipation structure for switch chip case - Google Patents
Integral heat dissipation structure for switch chip case Download PDFInfo
- Publication number
- CN202677291U CN202677291U CN 201220325874 CN201220325874U CN202677291U CN 202677291 U CN202677291 U CN 202677291U CN 201220325874 CN201220325874 CN 201220325874 CN 201220325874 U CN201220325874 U CN 201220325874U CN 202677291 U CN202677291 U CN 202677291U
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- China
- Prior art keywords
- heat conduction
- heat
- switch chip
- cpu
- shell
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
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Abstract
The utility model discloses an integral heat dissipation structure for a switch chip case, comprising a casing and a CPU (central processing unit), a switch chip and an optical module which are arranged in the casing. The integral heat dissipation structure for a switch chip case further comprises a heat conduction column and a heat conduction aluminum plate, wherein the lower parts of the CPU and the switch chip closely contact the inner wall of the casing by using heat conduction adhesives, the upper parts of the CPU and the switch chip contact the heat conduction column by using heat conduction adhesive, and the other end of the heat conduction column closely contacts the inner wall of the casing; the lower part of the optical module closely contacts one side of the heat conduction aluminum plate by using heat conduction adhesives, and the other side of the heat conduction aluminum plate closely contacts the inner wall of the casing. The heat dissipation structure allows a switch to reliably run within the temperature range of -40 to +85 DEG C.
Description
Technical field
The utility model and a kind of radiator structure, particularly a kind of digital transformer substation is with the radiator structure of full optical fiber interface switch.
Background technology
In digital transformer substation, make up network between wall and the process layer by switch; send on trip protection order output in standing, the switching signal, send on the analog acquisition etc. all must realize by switch, and the ruuning situation of switch will directly affect the operational reliability at full station.The employed switch of process layer adopts optical fiber interface in the digital transformer substation generally speaking, and interface quantity more (can reach 24 mouths), thermal value is larger, generally, the heat radiation of switch high-power components relies on the superincumbent heat radiator of subsides to carry out fully, because switch generally adopts the whole layer of 1U closed case structural design, narrow space, radiating effect is not good, long-play easily causes the interior local temperature of cabinet too high, reduce the life in application of chip, also can cause the printed board local overheating and deform and bring the permanent damage of irrecoverability, greatly reduce operation stability and the reliability of switch.
Based on above analysis, the design people carries out Improvement to existing switch radiator structure, and this case produces thus.
The utility model content
The purpose of this utility model is to provide a kind of exchanger chip cabinet integral heat dissipation structure, and it can be so that switch reliability service in-40 ℃～+ 85 ℃ temperature range.
In order to reach above-mentioned purpose, solution of the present utility model is:
A kind of exchanger chip cabinet integral heat dissipation structure, comprise shell and be located at CPU, exchange chip, the optical module of described enclosure, also comprise at least one heating column and aluminum heat conducting plate, wherein, the bottom of CPU and exchange chip is respectively by the inwall close contact of heat-conducting glue and shell, and the top of described CPU and exchange chip contacts with heating column by heat-conducting glue respectively, and the inwall close contact of the other end of this heating column and shell; The bottom of described optical module is by the inwall close contact of heat-conducting glue and shell, and the top of optical module is by a side contacts of heat-conducting glue and aluminum heat conducting plate, the inwall close contact of the opposite side of described aluminum heat conducting plate and shell.
After adopting such scheme, the utility model closely links to each other with shell by heating column and aluminum heat conducting plate by the high-power components in switch chassis inside, realize combining closely of chip and cabinet, so that metal chassis becomes the main body of switch heat radiation, strengthen area of dissipation, greatly promoted radiating effect.
Description of drawings
Fig. 1 is structural representation of the present utility model.
Embodiment
Below with reference to accompanying drawing, the technical solution of the utility model is elaborated.
As shown in Figure 1, the utility model provides a kind of exchanger chip cabinet integral heat dissipation structure, comprise the shell 1 of cabinet and be located at the CPU 2 of described shell 1 inside, exchange chip 3 and optical module 4, also comprise at least one heating column 5 and aluminum heat conducting plate 6, wherein, CPU 2, exchange chip 3 and optical module 4 all weld or are fixed on the circuit board 8, the bottom of CPU 2 and exchange chip 3 is respectively by the inwall close contact of heat-conducting glue 7 with shell 1, top then contacts with heating column 5 by heat-conducting glue 7 respectively, and the inwall close contact of the other end of heating column 5 and shell 1, thereby at CPU 2, set up the heat transmission between exchange chip 3 and the shell 1, described heating column 5 can be selected according to the actual size of chip the section bar of different-diameter; The bottom of optical module 4 is by the inwall close contact of heat-conducting glue 7 with shell 1, and top is by the side contacts of heat-conducting glue 7 with aluminum heat conducting plate 6, and the inwall close contact of the opposite side of aluminum heat conducting plate 6 and shell 1, thereby between optical module 4 and shell 1, set up the heat transmission, so that metal chassis becomes the main body of switch heat radiation, strengthened area of dissipation, improving radiating effect greatly, according to test, after adopting radiator structure provided by the utility model, can guarantee switch reliability service in-40 ℃～+ 85 ℃ temperature range of 24 optical fiber ports.
Above embodiment only is explanation technological thought of the present utility model; can not limit protection domain of the present utility model with this; every technological thought according to the utility model proposes, any change of doing on the technical scheme basis all falls within the utility model protection domain.
Claims (1)
1. exchanger chip cabinet integral heat dissipation structure comprises shell and is located at CPU, exchange chip, the optical module of described enclosure; It is characterized in that: also comprise at least one heating column and aluminum heat conducting plate, wherein, the bottom of CPU and exchange chip is respectively by the inwall close contact of heat-conducting glue and shell, and the top of described CPU and exchange chip contacts with heating column by heat-conducting glue respectively, and the inwall close contact of the other end of this heating column and shell; The bottom of described optical module is by the inwall close contact of heat-conducting glue and shell, and the top of optical module is by a side contacts of heat-conducting glue and aluminum heat conducting plate, the inwall close contact of the opposite side of described aluminum heat conducting plate and shell.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201220325874 CN202677291U (en) | 2012-07-06 | 2012-07-06 | Integral heat dissipation structure for switch chip case |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201220325874 CN202677291U (en) | 2012-07-06 | 2012-07-06 | Integral heat dissipation structure for switch chip case |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN202677291U true CN202677291U (en) | 2013-01-16 |
Family
ID=47498181
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 201220325874 Expired - Lifetime CN202677291U (en) | 2012-07-06 | 2012-07-06 | Integral heat dissipation structure for switch chip case |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN202677291U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103885562A (en) * | 2014-04-09 | 2014-06-25 | 北京德能恒信科技有限公司 | Heat transfer type server machine shell |
| CN103885556A (en) * | 2014-04-09 | 2014-06-25 | 北京德能恒信科技有限公司 | Heat transfer type server machine shell |
-
2012
- 2012-07-06 CN CN 201220325874 patent/CN202677291U/en not_active Expired - Lifetime
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103885562A (en) * | 2014-04-09 | 2014-06-25 | 北京德能恒信科技有限公司 | Heat transfer type server machine shell |
| CN103885556A (en) * | 2014-04-09 | 2014-06-25 | 北京德能恒信科技有限公司 | Heat transfer type server machine shell |
| CN103885562B (en) * | 2014-04-09 | 2018-06-08 | 北京丰联奥睿科技有限公司 | A kind of heat transfer type server shell |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CX01 | Expiry of patent term | ||
| CX01 | Expiry of patent term |
Granted publication date: 20130116 |