CN203057769U - Board card heat dissipation structure and heat dissipation cabinet - Google Patents
Board card heat dissipation structure and heat dissipation cabinet Download PDFInfo
- Publication number
- CN203057769U CN203057769U CN 201220710158 CN201220710158U CN203057769U CN 203057769 U CN203057769 U CN 203057769U CN 201220710158 CN201220710158 CN 201220710158 CN 201220710158 U CN201220710158 U CN 201220710158U CN 203057769 U CN203057769 U CN 203057769U
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- CN
- China
- Prior art keywords
- radiator
- circuit board
- integrated circuit
- heat
- cabinet
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
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Abstract
The utility model relates to a board card heat dissipation structure and a heat dissipation cabinet. The board card heat dissipation structure comprises a board card and a radiator; heating elements are distributed on the board card; and the radiator covers the heating elements and is fixedly connected with the board card. Because the radiator is directly contacted with the heating elements, the heat conduction path is short, the thermal resistance is low, and the heat transfer efficiency is high; and thus the heat dissipation performance is improved. Moreover, the radiator is fixedly connected with the board card and the installing hole distance is long, so that the board card can be reinforced and the board card can be prevented from deformation.
Description
Technical field
The utility model relates to a kind of radiator structure, more particularly, relates to a kind of integrated circuit board radiator structure and cooling cabinet.
Background technology
In the prior art, the heat major part that euthermic chip produces is carried out free convection and heat loss through radiation through heat-conducting cream or heat conductive pad → heat conduction aluminium block → heat conductive pad or heat-conducting cream → cabinet wall radiator and outside, and the fraction heat passes to PCB → air → cabinet wall and free convection and heat loss through radiation are carried out in the outside.The heat transfer circuit path length of this conductive structure, because the structure tolerance precision is difficult to reach desirable requirement, it is thicker heat conductive pad that two heat conduction filled medias must have one, so thermal resistance is just corresponding bigger, causes heat conduction efficiency lower; And the heat conduction aluminium block need be fixed on cabinet wall radiator or the pcb board card, so when integrated circuit board was pull plug form, radiator can't be realized pull together, integrated circuit board is changed to be needed earlier radiator to be removed, and is not easy to safeguard.
The utility model content
The technical problems to be solved in the utility model is, at the above-mentioned defective of prior art, provides a kind of integrated circuit board radiator structure and cooling cabinet.
The technical scheme that its technical problem that solves the utility model adopts is: construct a kind of integrated circuit board radiator structure, comprise integrated circuit board and radiator, be distributed with heater element on the described integrated circuit board, described radiator covers on the described heater element and is affixed with described integrated circuit board.
Integrated circuit board radiator structure described in the utility model wherein, also is provided with the heat-conducting medium for the increased thermal conductivity energy between described radiator and the described heater element.
Integrated circuit board radiator structure described in the utility model, wherein,, described heat-conducting medium comprises the heat-conducting glue that is filled between described heater element and the described radiator.
Integrated circuit board radiator structure described in the utility model, wherein, described heat-conducting medium comprises the heat conductive pad that is arranged between described heater element and the described radiator.
Another technical scheme that its technical problem that solves the utility model adopts is: construct a kind of cooling cabinet, comprise cabinet and be removably disposed in the interior integrated circuit board radiator structure as described above of described cabinet.
Cooling cabinet described in the utility model, wherein, but described integrated circuit board radiator structure pull be arranged in the described cabinet, have the perforate be used to the radiator that exposes described integrated circuit board radiator structure on the described cabinet.
Implement integrated circuit board radiator structure of the present utility model and cooling cabinet, have following beneficial effect:
1, compare with traditional radiator structure, dispensed thick heat conductive pad and extra heat conduction aluminium block, heat conduction path is brief, and thermal resistance is less, the heat transfer efficiency height, and heat dispersion promotes;
2, employing is affixed between radiator and the integrated circuit board, and installing hole is reinforced the pcb board card apart from bigger, prevents the integrated circuit board distortion;
When 3, changing integrated circuit board, do not need earlier radiator to be removed, radiator can be with the integrated circuit board pull, and the installation and maintenance of product is much easy relatively;
4, cabinet wall radiator position perforate directly exposes the fin of radiator, promotes the free convection heat exchanger effectiveness in radiator and the external world, promotes heat dispersion;
5, compare with traditional radiator structure form, radiator structure spare reduces, and has saved materials and processing costs such as filled media, heat conduction aluminium block; Installation and maintenance is easier, the time cost when having saved installation and maintenance.
Description of drawings
The utility model is described in further detail below in conjunction with drawings and Examples, in the accompanying drawing:
Fig. 1 is the front view of a kind of integrated circuit board radiator structure of the utility model preferred embodiment;
Fig. 2 is the end view of a kind of integrated circuit board radiator structure of the utility model preferred embodiment;
Fig. 3 is the structure installation diagram of a kind of cooling cabinet preferred embodiment of the utility model;
Fig. 4 is the use state diagram of a kind of cooling cabinet preferred embodiment of the utility model.
Embodiment
As shown in Figure 1, in the preferred embodiment of a kind of integrated circuit board radiator structure of the present utility model, this integrated circuit board radiator structure comprises integrated circuit board 100 and radiator 200, as shown in Figure 2, be distributed with heater element 101 on the integrated circuit board 100, this heater element 101 can be euthermic chip or other heater members particularly, and radiator 200 covers on the heater element 100 and be affixed with integrated circuit board 100.Because radiator 200 directly contacts with heater element 100, so heat conduction path is brief, thermal resistance is less, and therefore heat transfer efficiency height, heat dispersion also are improved; Secondly, adopt affixedly between radiator 200 and the integrated circuit board 100, therefore installing hole can play reinforcement effect to integrated circuit board 100 apart from bigger, prevents that integrated circuit board is out of shape.In addition, on this basis, can also set up the heat-conducting medium for the increased thermal conductivity energy in the gap between radiator 200 and the heater element 101.This heat-conducting medium can adopt the heat-conducting glue that is filled between heater element 101 and the radiator 200, or adopts the heat conductive pad that is arranged between heater element 101 and the radiator 200.Than the heat conduction aluminium block, the thickness of heat-conducting glue and heat conductive pad is less, therefore is conducive to shorten thermally conductive pathways and thermal resistance, thereby improves heat transfer efficiency.
Compare with traditional radiator structure form, because radiator structure spare has reduced, saved materials and processing costs such as filled media, heat conduction aluminium block; Installation and maintenance simultaneously is easier, the time cost when having saved installation and maintenance.
As shown in Figure 3-4, in the specific embodiment of the utility model cooling cabinet, this cooling cabinet comprises cabinet 300 and is removably disposed in integrated circuit board radiator structure as described above in the cabinet 300.The inboard that but this integrated circuit board radiator structure is the mode of employing pull is arranged on cabinet 300, as can be seen from the figure, one side of cabinet 300 offers perforate 301, after the integrated circuit board radiator structure is in place fully, radiator 200 can expose in this perforate 301, the radiated rib of radiator 200 is directly exposed, promoted the free convection heat exchanger effectiveness of radiator 200 with the external world, thereby promoted heat dispersion.
Above embodiment only is explanation technical conceive of the present utility model and characteristics, and its purpose is to allow the personage who is familiar with this technology can understand content of the present utility model and enforcement accordingly, can not limit protection range of the present utility model.All equalizations of doing with the utility model claim scope change and modify, and all should belong to the covering scope of the utility model claim.
Claims (6)
1. integrated circuit board radiator structure, comprise integrated circuit board (100) and radiator (200), be distributed with heater element (101) on the described integrated circuit board (100), it is characterized in that, described radiator (200) covers described heater element (101) upward and is affixed with described integrated circuit board (100).
2. integrated circuit board radiator structure according to claim 1 is characterized in that, also is provided with the heat-conducting medium for the increased thermal conductivity energy between described radiator (200) and the described heater element (101).
3. integrated circuit board radiator structure according to claim 2 is characterized in that, described heat-conducting medium comprises the heat-conducting glue that is filled between described heater element (101) and the described radiator (200).
4. integrated circuit board radiator structure according to claim 2 is characterized in that, described heat-conducting medium comprises the heat conductive pad that is arranged between described heater element (101) and the described radiator (200).
5. a cooling cabinet is characterized in that, comprise cabinet (300) and be removably disposed in the described cabinet (300) as each described integrated circuit board radiator structure of claim 1-4.
6. cooling cabinet according to claim 5, it is characterized in that, but be arranged in the described cabinet (300) described integrated circuit board radiator structure pull, have the perforate (301) be used to the radiator that exposes described integrated circuit board radiator structure (200) on the described cabinet (300).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201220710158 CN203057769U (en) | 2012-12-20 | 2012-12-20 | Board card heat dissipation structure and heat dissipation cabinet |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201220710158 CN203057769U (en) | 2012-12-20 | 2012-12-20 | Board card heat dissipation structure and heat dissipation cabinet |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN203057769U true CN203057769U (en) | 2013-07-10 |
Family
ID=48740678
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 201220710158 Expired - Lifetime CN203057769U (en) | 2012-12-20 | 2012-12-20 | Board card heat dissipation structure and heat dissipation cabinet |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN203057769U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2020107310A (en) * | 2018-12-26 | 2020-07-09 | 廣達電腦股▲ふん▼有限公司Ｑｕａｎｔａ Ｃｏｍｐｕｔｅｒ Ｉｎｃ． | Common carrier for different types of cards |
| CN112839470A (en) * | 2021-03-12 | 2021-05-25 | 成都前锋信息技术股份有限公司 | Quick-maintenance-supporting totally-enclosed chassis natural heat dissipation assembly |
-
2012
- 2012-12-20 CN CN 201220710158 patent/CN203057769U/en not_active Expired - Lifetime
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2020107310A (en) * | 2018-12-26 | 2020-07-09 | 廣達電腦股▲ふん▼有限公司Ｑｕａｎｔａ Ｃｏｍｐｕｔｅｒ Ｉｎｃ． | Common carrier for different types of cards |
| CN112839470A (en) * | 2021-03-12 | 2021-05-25 | 成都前锋信息技术股份有限公司 | Quick-maintenance-supporting totally-enclosed chassis natural heat dissipation assembly |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CX01 | Expiry of patent term | ||
| CX01 | Expiry of patent term |
Granted publication date: 20130710 |