CN2671119Y - Radiator - Google Patents
Radiator Download PDFInfo
- Publication number
- CN2671119Y CN2671119Y CN 200320104360 CN200320104360U CN2671119Y CN 2671119 Y CN2671119 Y CN 2671119Y CN 200320104360 CN200320104360 CN 200320104360 CN 200320104360 U CN200320104360 U CN 200320104360U CN 2671119 Y CN2671119 Y CN 2671119Y
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- CN
- China
- Prior art keywords
- radiator
- heat
- heat abstractor
- pedestal
- utility
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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- Cooling Or The Like Of Electrical Apparatus (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The utility model discloses radiator, comprising a first radiation body, and the first radiation body is provided with a base which contacts with a heating electronic component. The base is provided with a plurality of cylindrical heat sinks, and a second radiation body is arranged above the first radiation body. The second radiation body is formed from the superposition of a plurality of radiation fins, and the base of the first radiation body is provided with at least two L-shaped heat conduction pipes. One end of each heat conduction pipe is arranged on the second radiation body, and the heat conduction pipes are evenly distributed on the second radiation body. The radiator of the utility model can greatly increase radiation efficiency and can achieve the heat radiation of the heating electronic component.
Description
Technical field
The utility model relates to a kind of heat abstractor, relates in particular to a kind of heat abstractor that can significantly improve radiating efficiency that is used for the central processing unit heat radiation.
Background technology
As shown in Figure 1, the heat abstractor 10a that tradition is used for central processing unit (CPU) comprises an aluminium extruded type heat radiator body 1a, heat radiator body 1a is provided with integrated a plurality of radiating fin 11a, above these radiating fins 11a the radiator fan (not shown) is installed.In addition, for the radiating efficiency that makes entire heat dissipation device 10a is higher, can one heat-conducting block 12a be installed in the bottom of heat radiator body 1a, this heat-conducting block 12a is the good copper metal material of heat-conducting effect.Mounting means is to be provided with a groove 13a in the bottom of heat radiator body 1a, this heat-conducting block 12a is fixedly mounted in the groove 13a again.Like this, just this heat abstractor 10a can be installed in the central processing unit 21a top of printed circuit board (PCB) 2a, and heat-conducting block 12a is fitted on the central processing unit 21a.The heat that is produced when by heat-conducting block 12a central processing unit 21a being turned round passes to radiating fin 11a, by radiator fan heat is inhaled or is blown to the external world, thereby realize the purpose of heat radiation.
Though above-mentioned heat abstractor 10a has increased by a heat-conducting block 12a, can conduct heat on the radiating fin 11a, but when conducting heat to end face and being discharged into the external world, because the heat-conducting block 12a that is positioned at the bottom and the radiating fin 11a of end face have a segment distance, so the overall thermal coefficient of conductivity is still on the low side, can't reach needed radiating effect.Therefore, how improving the radiating efficiency of heat abstractor, with the more and more faster central processing unit of speed-adaptive, is the technical problem of the required solution of present stage those skilled in the art.
Designer of the present utility model, concentrates on studies in conjunction with the experience of being engaged in the sector for many years at above-mentioned defective, in line with excelsior spirit, has designed the utility model.
Content of the present utility model
Main purpose of the present utility model provides a kind of heat abstractor, and this heat abstractor is made of two radiators and a plurality of heat pipe, significantly to improve radiating efficiency.
For achieving the above object, the utility model provides a kind of heat abstractor, this heat abstractor comprises one first radiator, described first radiator have one with heating electronic building brick contacted pedestal, described pedestal is provided with the heat sink of a plurality of columns, is provided with second radiator above first radiator, and described second radiator is repeatedly put by a plurality of radiating fins and formed, be provided with the heat pipe of at least two L shapes on the pedestal of first radiator, an end of these heat pipes is arranged on second radiator.These heat pipes are staggered, so that the top of these heat pipes is evenly distributed on second radiator, thereby the spread heat that these heat pipes is conducted come can more promptly discharge heat on described second radiator from second radiator.
Use heat abstractor of the present utility model, can significantly improve radiating efficiency.
Brief description of drawings
Fig. 1 is the stereo appearance figure of known heat abstractor;
Fig. 2 is the three-dimensional appearance exploded view of the heat abstractor of an embodiment of the utility model;
Fig. 3 is the three-dimensional appearance constitutional diagram of the heat abstractor of an embodiment of the utility model;
Fig. 4 is the side sectional view of the heat abstractor of an embodiment of the utility model;
Fig. 5 is the side sectional view of another angle of the heat abstractor of an embodiment of the utility model;
Fig. 6 is the three-dimensional appearance exploded view of the heat abstractor embodiment of another embodiment of the utility model;
Fig. 7 is the three-dimensional appearance constitutional diagram of the heat abstractor embodiment of another embodiment of the utility model.
The assembly conventional letter is listed as follows in the accompanying drawing 1:
Heat abstractor 10a heat radiator body 1a
Radiating fin 11a heat-conducting block 12a
Groove 13a printed circuit board (PCB) 2a
Central processing unit 21a
Accompanying drawing 2 assembly conventional letter in the accompanying drawing 7 is listed as follows:
Heat abstractor 10 first radiators 1
Heat sink 12 spacings 13
Second radiator, 2 radiating fins 21
Through hole 211 heat pipes 3
Embodiment
Below in conjunction with accompanying drawing feature of the present utility model and technology contents are elaborated.Only for reference and the explanation usefulness of accompanying drawing is not to restriction of the present utility model.
As shown in Figure 2, in an embodiment of the present utility model, this heat abstractor 10 is used for the heat radiation of central processing unit.Wherein, heat abstractor 10 comprise one first radiator, 1, the first radiator 1 have one with the contacted pedestal 11 of central processing unit.Pedestal 11 is provided with the heat sink 12 of a plurality of columns, and these heat sinks 12 are arranged in many rows, are reserved with spacing 13 (as shown in Figure 5) between row and row.Pedestal 11 is mainly made by aluminum metallic material with heat sink 12, is provided with the installation portion 111 of extension in a side of pedestal 11.
Above first radiator 1 of heat abstractor 10, be provided with second radiator 2.This second radiator 2 is repeatedly put by a plurality of radiating fins 21 and is formed, and these radiating fins 21 can be made by aluminum metallic material.Be provided with the heat pipe 3 of at least two L shapes on the pedestal 11 of first radiator 1, heat pipe 3 comprises a horizontal part 31 and a vertical component effect 32.In these heat pipes 3, have working fluid.These heat pipes 3 are staggered, and vertical component effect 32 is arranged in the through hole 211 of these radiating fins 21.
As shown in Figure 3, Figure 4, during these heat abstractor 10 assemblings, horizontal part 31 with these heat pipes 3 is arranged in the spacing of being reserved between the column heat sink 12 of first radiator 1 13 (as shown in Figure 5) earlier, radiating fin 21 with second radiator 2 is arranged on first radiator, 1 top again, the vertical component effect 32 of these heat pipes 3 penetrates in the through hole 211 on these radiating fins 21, and the top that makes these heat pipes 3 is evenly distributed on second radiator 2, so just finished the assembling of a heat abstractor 10 substantially.
As Fig. 6, shown in Figure 7, in another embodiment of the present utility model, a radiator fan 4 can be installed on this heat abstractor 10 and shield 5.Wherein, shielding 5 is arranged on first radiator 1 and second radiator 2, and this shielding 5 can be made by metal material, and by bolt assembly 51 its bottom is fixed on the pedestal 11 of first radiator 1.Radiator fan 4 is erected on the set installation portion 111 of pedestal 11 1 sides of first radiator 1, and is fixed on by bolt assembly 41 on the lug 52 of shielding 5, thereby radiator fan 4 is fixed on the pedestal 11 of first radiator 1.
When being installed in heat abstractor 10 of the present utility model on the central processing unit, the pedestal 11 of first radiator 1 pastes on the surface at central processing unit top.At this moment, the heat that first radiator 1 is produced during with central processing unit or other electronic component running on every side up conducts, part heat is blown out by radiator fan 4, another part heat then is delivered on these radiating fins 21 fifty-fifty by heat pipe 3, by these radiating fins 21 heat is discharged again.
Like this, the utility model is by first radiator 1 and the structure of second radiator 2 and the setting of each heat pipe 3, the heat that is produced in the time of can making central processing unit and other electronic component running on every side thereof is discharged rapidly, increases substantially the radiating efficiency of entire heat dissipation device 10.
In sum, heat abstractor of the present utility model can be realized described purpose by described structure really.And the utility model application openly is not disclosed use by publication yet, meets the important document such as novelty, creativeness of utility model patent fully.
The above is a preferred embodiment of the present utility model, is not to restriction of the present utility model.The equivalence done of with good grounds specification of the present utility model and accompanying drawing change, directly or indirectly be used in other relevant technical field, all be encompassed in the Patent right requirement scope of the present utility model.
Claims (8)
1. heat abstractor comprises:
One first radiator has a pedestal;
One second radiator is arranged on described first radiator top, is repeatedly put by a plurality of radiating fins to form; And
At least two heat pipes;
It is characterized in that the pedestal of described first radiator is provided with the heat sink of a plurality of columns, described heat pipe one end is arranged on the described pedestal, and the other end is arranged on described second radiator, and described heat pipe is staggered.
2. heat abstractor according to claim 1 is characterized in that, a side of the pedestal of described first radiator is provided with installation portion.
3. heat abstractor according to claim 2 is characterized in that described heat abstractor further comprises a radiator fan, and described radiator fan is arranged on the installation portion of pedestal one side of described first radiator.
4. heat abstractor according to claim 1 is characterized in that, described heat pipe is " L " shape, comprises a horizontal part and a vertical component effect.
5. heat abstractor according to claim 1 is characterized in that described heat abstractor further comprises a radiator fan, and described radiator fan is adjacent with described heat sink.
6. according to claim 1,3 or 5 described heat abstractors, it is characterized in that described heat abstractor further comprises a shielding, described shielding is arranged on described first radiator and described second radiator.
7. heat abstractor according to claim 6 is characterized in that described shielding is made by metal material.
8. heat abstractor according to claim 6 is characterized in that described shielding is fixed on the pedestal of described first radiator by bolt assembly.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200320104360 CN2671119Y (en) | 2003-11-18 | 2003-11-18 | Radiator |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200320104360 CN2671119Y (en) | 2003-11-18 | 2003-11-18 | Radiator |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN2671119Y true CN2671119Y (en) | 2005-01-12 |
Family
ID=34474217
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 200320104360 Expired - Fee Related CN2671119Y (en) | 2003-11-18 | 2003-11-18 | Radiator |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN2671119Y (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101661317B (en) * | 2008-08-29 | 2013-03-13 | 富准精密工业(深圳)有限公司 | Heat radiation device |
| CN103185367A (en) * | 2013-03-15 | 2013-07-03 | 青岛奥环新能源科技发展有限公司 | Heat pipe-type movable heating phase-change heat storage device |
| CN109788720A (en) * | 2013-07-10 | 2019-05-21 | 雅特生嵌入式计算有限公司 | The cooling cabinet of conduction with embedded heat pipe |
| CN111430916A (en) * | 2020-03-25 | 2020-07-17 | 北京前沿探索深空科技有限公司 | EHF frequency band phased array antenna |
-
2003
- 2003-11-18 CN CN 200320104360 patent/CN2671119Y/en not_active Expired - Fee Related
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101661317B (en) * | 2008-08-29 | 2013-03-13 | 富准精密工业(深圳)有限公司 | Heat radiation device |
| CN103185367A (en) * | 2013-03-15 | 2013-07-03 | 青岛奥环新能源科技发展有限公司 | Heat pipe-type movable heating phase-change heat storage device |
| CN109788720A (en) * | 2013-07-10 | 2019-05-21 | 雅特生嵌入式计算有限公司 | The cooling cabinet of conduction with embedded heat pipe |
| CN111430916A (en) * | 2020-03-25 | 2020-07-17 | 北京前沿探索深空科技有限公司 | EHF frequency band phased array antenna |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C19 | Lapse of patent right due to non-payment of the annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |