CN206461885U - Heat dissipation device combination - Google Patents
Heat dissipation device combination Download PDFInfo
- Publication number
- CN206461885U CN206461885U CN201621190172.0U CN201621190172U CN206461885U CN 206461885 U CN206461885 U CN 206461885U CN 201621190172 U CN201621190172 U CN 201621190172U CN 206461885 U CN206461885 U CN 206461885U
- Authority
- CN
- China
- Prior art keywords
- base plate
- heat transfer
- transfer base
- dissipation device
- heat dissipation
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The utility model discloses a kind of heat dissipation device combination, including：One radiator, including a heat transfer base plate and the radiating fin portion be fixed in the heat transfer base plate；One locking part, compresses downwards and is passed down through the heat transfer base plate, and the radiator is locked on a circuit board；One guide posts, pass the heat transfer base plate upwards；One stop part, it is installed on the top of the guide posts, and block is in the top of the heat transfer base plate, during the locking part locking crimping heat transfer base plate, heat transfer base plate described in the stop part block upwarps flexural deformation, keeps heat transfer base plate flatness, the heat transfer base plate is closely crimped the chip module, improve the radiating effect of the chip module, it is ensured that the stability of system operation.
Description
Technical field
The utility model is related to a kind of heat dissipation device combination, more particularly to a kind of radiator to be installed on chip module
Combination.
Background technology
With the development of science and technology the execution speed of the electronic component such as electronic computer central processing unit is also more and more fast, body
Product it is less and less, caloric value is also increasing, thus the radiator needed for being used as central processor radiating already turn into can not
One of or scarce main member.All it is direct in existing heat sink arrangement to make radiator is stable to be fixed on circuit board
The heat transfer base plate of radiator is anchored on circuit board with multiple symmetrical bolts.It is well known that to reach good radiating
Effect, radiator heat transfer bottom plate is generally used the higher metal material of the thermal conductivitys such as copper or aluminium alloy and is made, it is well known that copper
Or the higher metal material quality of thermal conductivity such as aluminium alloy is softer, therefore, during bolt is locked, due to each bolt without
Synchronous crimping heat transfer base plate is completely secured in method, unavoidably causes heat transfer base plate to upwarp or flexural deformation, makes heat transfer base plate with
Central processor crimping is not tight, causes radiating effect poor, and then influences the normal work of system.
It is therefore desirable to design a kind of heat dissipation device combination of improvement, to overcome above mentioned problem.
The content of the invention
For background technology problem encountered, the purpose of this utility model is that providing one kind makes the stable crimping of radiator
In chip module, strengthen the heat dissipation device combination of radiating effect.
To achieve the above object, the utility model uses following technological means：One heat dissipation device combination, including：One radiator,
Including a heat transfer base plate and the radiating fin portion being fixed in the heat transfer base plate；One locking part, compresses downwards and wears downwards
The heat transfer base plate is crossed, and the radiator is locked in a guide posts on a circuit board, the heat transfer base plate is passed upwards；One
Stop part, is installed on the top of the guide posts, and block is in the top of the heat transfer base plate.
Further, there is gap between the stop part and the heat transfer base plate；
Further, the apical side height of the stop part is less than the upper surface in the radiating fin portion, the top of the locking part
Face is highly higher than the upper surface in the radiating fin portion；
Further, the stop part and the locking part are located at the adjacent both sides of the heat transfer base plate；
Further, the quantity of the stop part is that the line between three, three stop parts is in isosceles triangle；
Further, there is guide posts a cylinder to pass the heat transfer base plate upwards, and shape is upwardly extended from the cylinder
Into a threaded portion, the diameter of the threaded portion is less than the cylinder, and there is the stop part screwed hole to match somebody with somebody with the threaded portion
Close；
Further, the heat transfer base plate is passed downwards with one first circular hole for locking part and one second circular hole is led for described in
Draw post to pass upwards, the diameter of first circular hole is more than the diameter of second circular hole；
Further, the bottom surface of the heat transfer base plate has a groove, and a packing ring is riveting in the locking part, and the packing ring is received
It is dissolved in the groove；
Further, the heat transfer base plate is crimped on a chip module, and a holding piece is provided with most snap fit clamping chip dies
Block, the guide posts pass through the holding piece；
Further, a backboard is further comprised, backboard is sealed provided with projection and locking part, and the guide posts are located at backboard.
Compared with prior art, the utility model has the advantages that：
The utility model heat dissipation device combination is by the way that a stop part to be installed on to the tops of the guide posts, and block is in described
The top of heat transfer base plate, during bolt lock presses and connects the heat transfer base plate, heat transfer base plate described in the stop part block
Flexural deformation is upwarped, heat transfer base plate flatness is kept, the heat transfer base plate is closely crimped the chip module, the core is improved
The radiating effect of piece module, it is ensured that the stability of system operation.
【Brief description of the drawings】
Fig. 1 is the utility model heat dissipation device combination three-dimensional exploded view；
Fig. 2 is the three-dimensional exploded view at another visual angle of the utility model heat dissipation device combination；
Fig. 3 is the utility model heat dissipation device combination part isometric exploded view；
Fig. 4 is three-dimensional combination figure before the assembling of the utility model heat dissipation device combination locking part；
Fig. 5 is the utility model heat dissipation device combination three-dimensional combination figure；
Fig. 6 is the utility model heat dissipation device combination sectional view.
The drawing reference numeral explanation of embodiment：
| Heat dissipation device combination 100 | Circuit board 1 | Electric connector 2 | Insulating body 21 |
| Backboard 3 | Guide posts 31 | Cylinder 311 | Threaded portion 312 |
| Projection 32 | Chip module 4 | Holding piece 5 | Opening 501 |
| First frame side 51 | Protuberance 511 | Second frame side 52 | 3rd frame side 53 |
| Snap fit 54 | Positioning hole 55 | Radiator 6 | Heat transfer base plate 61 |
| First circular hole 611 | Second circular hole 612 | Groove 613 | Radiating fin portion 62 |
| Locking part 7 | Stop part 8 | Screwed hole 81 | Packing ring 9 |
【Embodiment】
For ease of being better understood from the purpose of this utility model, structure, feature and effect etc., in conjunction with accompanying drawing and specifically
The utility model is described in further detail for embodiment.
As shown in Figure 1, Figure 4 and Figure 5, the utility model heat dissipation device combination 100 includes a circuit board 1；One electric connector 2,
It is installed on the upper surface of the circuit board 1；One backboard 3 is fixed on the lower surface of the circuit board 1；One chip module 4, is installed on
On the electric connector 2；One holding piece 5, fixed chip module 4 is to carry the chip module 4 to the electric connector 2, one
Radiator 6 is suppressed on the chip module 4.
As shown in figure 1, the electric connector 2 includes an insulating body 21, it is installed on the upper surface of the circuit board 1 and holds
The chip module 4 is carried, multiple terminals (not shown) are immobilizated in the insulating body 21 and are electrically connected with chip module 4 and electricity
Road plate 1, in the present embodiment, to reduce the buckling deformation of insulating body 21,21 points of the insulating body is symmetrical
Two pieces, can according to the actual requirements in other implementations, the insulating body 21 is set to arbitrary form, is not limited herein.
As depicted in figs. 1 and 2, the holding piece 5 has a frame portion, and the frame portion includes one first frame side being oppositely arranged
51 and one second frame side 52, and the first frame of connection is at 51 and second frame 52 and two the 3rd frame sides 53 that are oppositely arranged, it is described
3rd frame when 53 length is more than first frame 51 and the second frame side 52 length, the 3rd frame side 53 described in two with
First frame 52 surrounds an opening 501 at 51 and second frame, is passed through for the chip module 4；The first frame side
51 are downwardly extending a snap fit 54, and the second frame side 52 is downwardly extending two snap fits 54 being oppositely arranged, by three
The bottom surface of chip module 4 described in the clamping of snap fit 54, makes the holding piece 5 to carry the chip module 4 to the insulation
Body 21.Three snap fits 54 are set in isosceles triangle, just can so strengthen 5 pairs of the holding piece chip module 4
The stability of clamping.The second frame side 52 is provided with two positioning holes 55, and the first frame side 51 is towards away from the opening 501
Direction is horizontal-extending to form a protuberance 511, and the protuberance 511 also is provided with a positioning hole 55.
As shown in Figure 2, Figure 5 and Figure 6, the radiator 6 includes a heat transfer base plate 61 and is fixed on the heat transfer base plate 61
On a radiating fin portion 62, the opposite sides of heat transfer base plate 61 is respectively equipped with two the first circular holes 611,3 pairs of the backboard
Each first circular hole 611 is answered to be respectively equipped with a projection 32, locking part 7 (in the present embodiment, locking part 7 is bolt) is worn downwards
Go out first circular hole 611 and the projection 32 is sealed, the radiator 6 is locked in the circuit board 1；The heat transfer bottom
The position of three positioning holes 55 of correspondence of plate 61 is respectively equipped with one second circular hole 612, second circular hole 612 and described first
Circular hole 611 is located at the adjacent both sides of the heat transfer base plate 61, the correspondence positioning hole 55 of backboard 3 and second circular hole
612 position is provided with a guide posts 31, and the guide posts 31 have a cylinder 311, are upward through the positioning hole 55 and institute
The second circular hole 612 is stated, the radiator 6 is guided and Suo Shu Clip holds the installation of piece 5.Further, three guide posts 31 in etc.
Lumbar triangle shape is arranged, fully plays a part of the assembling that fool proof is also convenient for the heat dissipation device combination 100.From the cylinder 311
Upwardly extend to form a threaded portion 312, the diameter of the threaded portion 312 is less than the cylinder 311, (this implementation of a stop part 8
In example, stop part 8 is the nut of cylindrical type) there is a screwed hole 81, the screwed hole 81 coordinates with the threaded portion 312, made
The stop part 8 be located at the heat transfer base plate 61 top, just can so make heat transfer base plate 61 described in the block of stop part 8 to
Upper buckling deformation.In the present embodiment, the diameter of first circular hole 611 is more than the diameter of second circular hole 612 so that
The guide posts 31 of locking part 7 are thick, it is ensured that the locking force of the locking part 7.In addition, the top surface of the stop part 8 is high
Degree is less than the upper surface in the radiating fin portion 62, and the apical side height of the locking part 7 is upper higher than the radiating fin portion 62
Surface, it is to avoid when locking the locking part 7 with instrument, the stop part 8 disturbs the operating space of the instrument.Further, institute
Stating has small gap between stop part 8 and the heat transfer base plate 61, it is to avoid when the stop part 8 is installed, excessive downwards to support
Press the heat transfer base plate 61.The bottom surface of the heat transfer base plate 61 also has a groove 613, and a packing ring 9 is riveting in the locking part
7, the packing ring 9 is contained in the groove 613, it is to avoid the packing ring 9 protrudes from the bottom surface of the heat transfer base plate 61, disturbs institute
State the installation of holding piece 5.
As shown in Figure 1, Figure 4 and Figure 5, in the assembling process of the heat abstractor, first the guide posts 31 are attached to
The backboard 3, the backboard 3 is attached to the lower surface of the circuit board 1, then the electric connector 2 is welded in into the circuit
The upper surface of plate 1, the chip module 4 is fixed on the holding piece 5, then three positioning holes 55 is respectively aligned to the guiding
Post 31, from top to bottom, holds piece 5 Jiang Suo Shu Clip and is attached on the electric connector 2, three second circular holes 612 are respectively aligned to
The guide posts 31, assemble the upper radiator 6, then screw a gear on each top of guide posts 31 respectively from top to bottom
Stop member 8, finally passes through first circular hole 611 by the locking part 7, is tightly locked with the projection 32, you can.
In summary, the utility model heat dissipation device combination 100 has following beneficial effect：
(1) the part block that blocks is in the top of the heat transfer base plate 61, in the locking part 7 locking crimping heat transfer
During bottom plate 61, heat transfer base plate 61 described in the block of stop part 8 upwarps flexural deformation, keeps heat transfer base plate 61 smooth
Degree, makes the heat transfer base plate 61 closely crimp the chip module 4, improves the radiating effect of the chip module 4, it is ensured that be
The stability of system operation.
(2) there is small gap between the stop part 8 and the heat transfer base plate 61, it is to avoid when the stop part 8 is installed,
It is excessive downwards to compress the heat transfer base plate 61；
(3) bottom surface of the heat transfer base plate 61 also has a groove 613, and a packing ring 9 is riveting in the locking part 7, described
Packing ring 9 is contained in the groove 613, it is to avoid the packing ring 9 protrudes from the bottom surface of the heat transfer base plate 61, disturbs the clamping
The installation of piece 5；
(4) three guide posts 31 are arranged in isosceles triangle, are fully played a part of fool proof and are also convenient for described be electrically connected
Connect the assembling of the component of device 2.
Claims (10)
1. a heat dissipation device combination, it is characterised in that including：
One radiator, including a heat transfer base plate and the radiating fin portion be fixed in the heat transfer base plate；
One locking part, compresses downwards and is passed down through the heat transfer base plate, and the radiator is locked on a circuit board；
One guide posts, pass the heat transfer base plate upwards；
One stop part, is installed on the top of the guide posts, and block is in the top of the heat transfer base plate.
2. heat dissipation device combination as claimed in claim 1, it is characterised in that：Between having between the stop part and the heat transfer base plate
Gap.
3. heat dissipation device combination as claimed in claim 1, it is characterised in that：The apical side height of the stop part is less than the radiating
The upper surface in fin portion, the apical side height of the locking part is higher than the upper surface in the radiating fin portion.
4. heat dissipation device combination as claimed in claim 1, it is characterised in that：The stop part and the locking part are located at described pass
The adjacent both sides of hot bottom plate.
5. heat dissipation device combination as claimed in claim 1, it is characterised in that：The quantity of the stop part is three, described in three
Line between stop part is in isosceles triangle.
6. heat dissipation device combination as claimed in claim 1, it is characterised in that：There is guide posts a cylinder to pass the biography upwards
Hot bottom plate, upwardly extends to form a threaded portion from the cylinder, and the diameter of the threaded portion is less than the cylinder, described
There is stop part a screwed hole to coordinate with the threaded portion.
7. heat dissipation device combination as claimed in claim 1, it is characterised in that：The heat transfer base plate has one first circular hole for locking
Part is passed downwards and one second circular hole is passed upwards for the guide posts, and the diameter of first circular hole is more than second circular hole
Diameter.
8. heat dissipation device combination as claimed in claim 1, it is characterised in that：The bottom surface of the heat transfer base plate has a groove, one
Packing ring is riveting in the locking part, and the packing ring is contained in the groove.
9. heat dissipation device combination as claimed in claim 1, it is characterised in that：The heat transfer base plate is crimped on a chip module,
One holding piece is provided with most snap fit clamping chip modules, and the guide posts pass through the holding piece.
10. heat dissipation device combination as claimed in claim 1, it is characterised in that：Further comprise a backboard, backboard is provided with projection
Sealed with locking part, the guide posts are located at backboard.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201621190172.0U CN206461885U (en) | 2016-10-28 | 2016-10-28 | Heat dissipation device combination |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201621190172.0U CN206461885U (en) | 2016-10-28 | 2016-10-28 | Heat dissipation device combination |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN206461885U true CN206461885U (en) | 2017-09-01 |
Family
ID=59690934
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201621190172.0U Active CN206461885U (en) | 2016-10-28 | 2016-10-28 | Heat dissipation device combination |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN206461885U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112172708A (en) * | 2020-10-14 | 2021-01-05 | 云中芯半导体技术(苏州)有限公司 | Mounting structure and mounting method of automobile driving distance control main board |
-
2016
- 2016-10-28 CN CN201621190172.0U patent/CN206461885U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112172708A (en) * | 2020-10-14 | 2021-01-05 | 云中芯半导体技术(苏州)有限公司 | Mounting structure and mounting method of automobile driving distance control main board |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| EP2706828B1 (en) | Coupling assembly of power semiconductor device and PCB and method for manufacturing the same | |
| CN1423838A (en) | Parallel-plate/pin-fin hybrid copper heat sink for coding high-powered microprocessor | |
| US8992267B2 (en) | Connecting system for electrically connecting electronic devices and method for connecting an electrically conductive first connector and an electrically conductive second connector | |
| CN101808490A (en) | Heat dissipating device | |
| CN206461885U (en) | Heat dissipation device combination | |
| CN201629328U (en) | Heat radiator structure | |
| CN108598048A (en) | Heat sink assembly | |
| CN109342912A (en) | The frock clamp of SMD surface mount packages device ageing | |
| CN210326162U (en) | Copper wiring terminal with heat dissipation structure | |
| CN208191119U (en) | A kind of controller for electric vehicle structure | |
| CN215578527U (en) | Thyristor assembly with efficient heat dissipation function | |
| CN217306492U (en) | Novel discrete semiconductor device | |
| CN208300108U (en) | A kind of accurate printed wiring board | |
| CN2773903Y (en) | Radiator | |
| CN2671119Y (en) | Radiator | |
| CN201194261Y (en) | Electric connector device | |
| CN2752993Y (en) | Electric connector combined device | |
| CN2909797Y (en) | Heat sink | |
| CN2649826Y (en) | Radiating device | |
| CN205249683U (en) | Inlay copper heat sink component | |
| CN214102153U (en) | Overlapping type radiating fin device | |
| CN215121654U (en) | Circuit board heat radiator | |
| CN208923120U (en) | Press mounting structure applied to crimp type MOSFET | |
| CN220544975U (en) | Photovoltaic junction box with high-heat-dissipation insulating sheet | |
| CN212628997U (en) | Automatic fastening radiating fin structure for strong fan |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant |