WO2021237406A1

WO2021237406A1 - Electronic assembly and movable platform

Info

Publication number: WO2021237406A1
Application number: PCT/CN2020/092095
Authority: WO
Inventors: 惠堂懋; 高诗经; 周中琴
Original assignee: 深圳市大疆创新科技有限公司
Priority date: 2020-05-25
Filing date: 2020-05-25
Publication date: 2021-12-02
Also published as: CN113796174A

Abstract

An electronic assembly and a movable platform. The electronic assembly comprises a first heat source (10), a second heat source (11) and a radiator (12); the radiator (12) comprises a first heat conducting plate, a second heat conducting plate and a heat dissipation element, the first heat conducting plate and the second heat conducting plate being provided opposite to each other, and the heat dissipation element being fixed between the first heat conducting plate and the second heat conducting plate; the first heat source (10) is fixed on the surface of the first heat conducting plate away from the heat dissipation element, and the second heat source (11) is fixed on the surface of the second heat conducting plate away from the heat dissipation element, and the amount of heat produced by the first heat source (10) is greater than the amount of heat produced by the second heat source (11). The electronic assembly can increase the heat dissipation efficiency, and improve the working performance of electrical devices.

Description

Electronic components and movable platforms

Technical field

The invention relates to the technical field of electronic equipment, in particular to an electronic component and a movable platform.

Background technique

With the development and progress of electronic technology, there are drive modules or ESC modules with higher heat generation related to electric energy and mechanical conversion of motors, etc., in various automation devices such as unmanned aerial vehicles and unmanned vehicles, as well as signal processing functions. Related control modules with lower heat generation.

In the prior art, a common heat dissipation structure layout scheme is to fix the drive module with higher heat generation and the control module with lower heat generation on the same side of the heat sink. In this scheme, the layout scheme where the drive module and the control module are located on the same side, the drive module emits more heat, and this part of the heat will radiate and affect the control module, making the heat dissipation efficiency around the control module lower.

Therefore, in the existing heat dissipation solution, the heat between different device modules will affect each other, resulting in a decrease in heat dissipation efficiency and a decrease in the working performance of electrical devices.

Summary of the invention

In view of this, in order to solve the problem that the heat between different device modules in the existing heat dissipation scheme will affect each other, resulting in a decrease in heat dissipation efficiency and a decrease in the working performance of electrical devices, the present invention provides an electronic component and a movable platform.

In a first aspect, an embodiment of the present invention provides an electronic component, the electronic component includes: a first heat source, a second heat source, and a heat sink;

The heat sink includes a first heat-conducting plate, a second heat-conducting plate, and a heat-dissipating element. The first heat-conducting plate and the second heat-conducting plate are arranged opposite to each other. Between heat conducting plates;

The first heat source is fixed on the side of the first heat conducting plate away from the heat dissipation element, and the second heat source is fixed on the side of the second heat conducting plate away from the heat dissipation element, wherein the first heat source generates The heat of is greater than the heat generated by the second heat source.

In a second aspect, an embodiment of the present invention provides a movable platform, including: the electronic component of the first aspect and a heat dissipation air duct, wherein the first heat conduction plate and the second heat conduction plate constitute the heat dissipation air Part of the air duct wall of the duct, the heat dissipating element is arranged in the heat dissipating air duct, and the heat dissipating air duct includes an air inlet and an air outlet;

The airflow passing through the heat dissipation air duct can take away the heat on the heat dissipation element.

In a third aspect, an embodiment of the present invention also provides an electronic component, the electronic component including a first heat source, a second heat source, and a heat sink;

The heat sink includes a first heat conduction surface and a second heat conduction surface, and the first heat conduction surface and the second heat conduction surface are different surfaces.

The first heat source is fixed to the first heat conducting surface, the second heat source is fixed to the second heat conducting surface, and the heat generated by the first heat source is greater than the heat generated by the second heat source.

The electronic components described in the embodiments of the present invention at least include the following advantages:

The electronic component in the embodiment of the present invention can improve the heat dissipation efficiency of the electronic component and improve the working performance of the electrical device.

The above description is only an overview of the technical solution of the present invention. In order to understand the technical means of the present invention more clearly, it can be implemented in accordance with the content of the specification, and in order to make the above and other objectives, features and advantages of the present invention more obvious and easy to understand. In the following, specific embodiments of the present invention will be cited.

Description of the drawings

In order to explain the embodiments of the present invention or the technical solutions in the prior art more clearly, the following will briefly introduce the drawings that need to be used in the description of the embodiments or the prior art. Obviously, the drawings in the following description These are some embodiments of the present invention. For those of ordinary skill in the art, other drawings can be obtained based on these drawings without creative work.

Fig. 1 schematically shows a structural diagram of an electronic component according to an embodiment of the present invention;

Fig. 2 schematically shows a schematic diagram of Fig. 1 along the A direction of an embodiment of the present invention;

Fig. 3 schematically shows a three-dimensional structure diagram of a heat sink according to an embodiment of the present invention;

Fig. 4 schematically shows a schematic diagram of a first heat source according to an embodiment of the present invention;

Fig. 5 schematically shows a schematic diagram of a second heat source according to an embodiment of the present invention;

Fig. 6 schematically shows a schematic diagram of another first heat source according to an embodiment of the present invention;

Fig. 7 schematically shows a schematic diagram of a movable platform according to an embodiment of the present invention;

Fig. 8 schematically shows a schematic diagram of an air duct of a movable platform according to an embodiment of the present invention;

FIG. 9 schematically shows a schematic structural diagram of a second type of electronic component according to an embodiment of the present invention;

FIG. 10 schematically shows a schematic structural diagram of a third electronic component according to an embodiment of the present invention;

FIG. 11 schematically shows a structural diagram of a fourth type of electronic component according to an embodiment of the present invention;

Fig. 12 schematically shows a structural diagram of a fifth electronic component according to an embodiment of the present invention.

Specific embodiment

In order to make the objectives, technical solutions, and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be described clearly and completely in conjunction with the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments It is a part of the embodiments of the present invention, but not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative work shall fall within the protection scope of the present invention.

1 to 3, there is shown an electronic component provided by an embodiment of the present invention, the electronic component includes: a first heat source 10, a second heat source 11 and a heat sink 12;

The heat sink 12 includes a first heat-conducting plate 121, a second heat-conducting plate 122, and a heat-dissipating element 123. The first heat-conducting plate 121 and the second heat-conducting plate 122 are arranged opposite to each other, and the heat-dissipating element 123 is fixed on the first heat-conducting plate. Between a heat-conducting plate 121 and the second heat-conducting plate 122;

The first heat source 10 is fixed on the side of the first heat conducting plate 121 away from the heat dissipation element 123, and the second heat source 11 is fixed on the side of the second heat conducting plate 122 away from the heat dissipation element 123, wherein, The heat generated by the first heat source 10 is greater than the heat generated by the second heat source 11.

Specifically, as shown in FIG. 1, an electronic component provided in an embodiment of the present invention is an electronic component with a heat dissipation function, and different types of electronic components exist in the electronic component. Different types of electronic components generate different amounts of heat. The first heat source 10 can be defined as the first heat source 10 that generates a large amount of heat during operation. The first heat source 10 can be a component that converts electrical energy into mechanical energy or other different forms of energy, and these components generate a large amount of heat. The second heat source 11 is defined as the heat generated during operation is less than the first heat source 10. When the first heat source 10 and the second heat source 11 are arranged on the same side, since both need to dissipate heat, the high temperature first heat source 10 will instead radiate to the adjacent low temperature second heat source 11, making the environment of the second heat source 11 The temperature continues to be difficult to decrease, which is not conducive to the operation of the second heat source 11 device. As shown in FIG. 1, in the embodiment of the present invention, the first heat source 10 and the second heat source 11 with different calorific values are respectively arranged on both sides of the radiator 12, and the radiator 12 is physically separated between the two, which can reduce In the first heat source 10 and the second heat source 11, the high-temperature heat source affects the radiation of the low-temperature heat source. It should be noted that the electronic components in the embodiments of the present invention can be used in movable platforms such as unmanned aerial vehicles, unmanned transport vehicles, and unmanned ships. While flying, it can also communicate and interact with other terminal devices such as ground image transmission and receiving equipment.

As shown in FIG. 2, the heat sink 12 includes a first heat-conducting plate 121, a second heat-conducting plate 122, and a heat-dissipating element 123. The first heat-conducting plate 121 and the second heat-conducting plate 122 are respectively arranged on both sides of the heat-dissipating element 123, the heat-dissipating element 123 The first heat conduction plate 121 and the second heat conduction plate 122 can be separated by a certain distance between the first heat conduction plate 121 and the second heat conduction plate 122 to prevent the first heat conduction plate 121 and the second heat conduction plate 122 from directly contacting each other.

As shown in FIG. 3, the first heat source 10 is fixed on the side of the first heat conducting plate 121 away from the heat dissipation element 123, and the second heat source 11 is fixed on the side of the second heat conducting plate 122 away from the heat dissipation element 123. Therefore, different heat transfer paths can be formed in the electronic component. The heat generated by the first heat source 10 is transferred to the heat dissipation element 123 through the first heat conducting plate 121 to be dissipated, and the heat generated by the second heat source 11 passes through the The two heat conducting plates 122 are transferred to the heat dissipation element 123 and dissipated.

In an embodiment of the present invention, an electronic component is provided. A first heat source with a larger amount of heat dissipation and a second heat source with a smaller amount of heat are respectively arranged on both sides of the radiator. The first heat source is fixed in the radiator. The side of the first heat-conducting plate away from the heat dissipation element, and the second heat source is fixed on the side of the second heat-conducting plate away from the heat dissipation element in the radiator, so that the heat of the first heat source can be guided to the heat dissipation element through the first heat-conducting plate, and the second heat source The heat conducting plate guides the heat of the second heat source to the heat dissipation element, avoids the interference of heat radiation caused by the arrangement of the first heat source and the second heat source on the same side, can improve the heat dissipation efficiency of the electronic components, and improve the working performance of the electrical devices.

Optionally, referring to FIGS. 4 and 5, the first heat source 10 includes a first electronic component 101 and a first circuit board 102, and the first circuit board 102 carries the first electronic component 101;

The second heat source 11 includes a second electronic component 111 and a second circuit board 112, and the second circuit board 112 carries the second electronic component 111.

Specifically, in an embodiment, as shown in FIG. 4, the above-mentioned first heat source 10 may include a first electronic component 101 and a first circuit board 102, and the first circuit board 102 carries the first electronic component 101. That is, when the first circuit board 102 is energized, the first electronic component 101 is in a working state, and the temperature rises to generate heat, and part of the electric energy delivered by the first circuit board 102 to the first electronic component 101 is converted into heat energy. Similarly, as shown in FIG. 5, the second heat source 11 may include a second electronic component 111 and a second circuit board 112, and the second circuit board 112 carries the second electronic component 111. When the calorific value of the second electronic component 111 is less than the calorific value of the first electronic component 101, that is, the calorific value of the first heat source 10 is greater than the calorific value of the second heat source 11.

Optionally, the first circuit board 102 is fixed on the first heat conducting plate 121, and the second circuit board 112 is fixed on the second heat conducting plate 122.

Specifically, in one embodiment, screw holes or copper posts may be reserved on the first heat conducting plate 121 and the second heat conducting plate 122, respectively, and the circuit board can be tightened and fixed by screws, or the circuit board can be fixed by nuts. By locking, the first circuit board 102 is fixed on the first heat conducting plate 121, and the second circuit board 112 is fixed on the second heat conducting plate 122, thereby realizing the connection between the first heat source 10 and the first heat conducting plate 121, The connection between the second heat source 11 and the second heat conducting plate 122 is realized.

Optionally, the first electronic component 101 includes at least one of a power component driver, an electronic speed regulator, a power distribution device, and a battery management device.

Specifically, in an embodiment, the above-mentioned first electronic component 101 may include a power component driver of a power component with larger power such as a motor, for example, a motor driver. When the motor driver is working, it receives the control signal and outputs the driving signal of the motor to drive the motor to run according to the corresponding speed law. The motor driver generates a lot of heat in the process. The first electronic component 101 may also include an electronic speed governor. The electronic speed governor is abbreviated as ESC. The PWM (Pulse Width Modulation) signal output by the receiver or the flight control board is processed by the internal chip and then output for driving adjustment. The signal conditioning MOS (Metal Oxide Semiconductor) drive tube allows the MOS drive tube to adjust the output voltage and control the operation of each motor. Therefore, the electronic speed governor is also an electronic component with a large amount of heat. The first electronic component 101 may also include a power distribution device. The power distribution device is generally a power distribution board. The power distribution board is a circuit board used to connect the battery and the ESC. The device module, therefore, the electrical distributing device is also a kind of electronic component that generates a large amount of heat. The first electronic component 111 may also include a battery management device. The battery management device usually refers to a power supply board that manages charging and discharging, and has the functions of overcharge/overcurrent power failure and power monitoring. These functions can be implemented by corresponding power management chips. Therefore, the battery management device is also an electronic component that generates a large amount of heat. In practical applications, the first electronic component 101 may be any one or a combination of several of the above-mentioned power component driver, electronic speed governor, power distribution device, and battery management device.

Optionally, the power component driver is a pan/tilt motor driver or a paddle motor driver.

Specifically, in one embodiment, the power component of some products may be a pan/tilt that carries a camera, and the direction of the pan/tilt can be adjusted freely under the drive of a motor. Then, the above-mentioned power component driver may drive the pan/tilt along different directions. PTZ motor driver for direction movement. The power component of some products may be the power component of the equipment movement, for example, a walking motor that drives wheeled equipment to travel, or a blade motor that drives the rotation of the drone blades. Correspondingly, the power component driver can be a blade motor drive . Whether it is a pan/tilt motor driver or a paddle motor driver, it is a driver used to output motor control signals. The difference is that one is used to drive the motor to move slowly to control the direction of the pan/tilt, and the other is used to control the high-speed rotation of the motor.

Optionally, the first electronic component 111 includes the electronic speed governor and the power distributing device, and the electronic speed governor and the power distributing device are integratedly arranged on a first circuit board.

Specifically, in one embodiment, when the first electronic component 111 includes the above-mentioned electronic speed governor and the power distribution device, since the power distribution device mainly has the function of distributing electric energy, it relies on the circuit board as the carrier. The battery is far away. The electronic speed governor mainly receives electric energy to control the speed of the motor, and the electronic speed governor also relies on the structural carrier of the circuit board. Moreover, both the electronic speed governor and the power distributing device are components that generate a large amount of heat. When the electronic speed governor and the power distributing device are close to each other, the mutual interference caused by heat radiation is weak. Therefore, the electronic speed control can be The converter and the power distribution device are integrated and arranged on the first circuit board 102 at the same time. For example, during the development and design of the first circuit board 102, the ESC circuit corresponding to the electronic speed governor and the power distribution circuit corresponding to the power distributing device can be designed on the first circuit board 102 at the same time, and the corresponding control of the electronic speed governor The chip and the components corresponding to the power distribution device are welded and fixed on the first circuit board 102 at the same time to realize the centralized arrangement of high-temperature heat sources and avoid the scattered layout of the high-temperature heat sources to cause radiation effects on the low-temperature heat sources contained therein. Fig. 6 exemplarily shows a schematic diagram of a circuit board in which the electronic speed governor and the power distribution device are integrated, and the electronic speed governor A and the power distributing device B are integrated and arranged on the first circuit board 102 in Fig. 6 at the same time. Exemplarily, the left half of FIG. 6 may be the circuits and components corresponding to the electronic speed governor A, and the right half of FIG. 6 may be the circuits and components corresponding to the power distribution device B.

Optionally, the second heat source 11 includes at least one of a flight control processor, a radio frequency device, an image transmission device, and a positioning device.

Specifically, in one embodiment, unlike the first heat source 10, the energy form of the second heat source 11 may not change during the working process, and may be a control device, the input of which is an electrical signal, and the output is still For electrical signals. These components mainly realize the control function during the working process, therefore, the amount of heat generated is less than that of the first heat source 10. For example, the second heat source 11 may include a flight control processor, which can control the flight attitude of the drone through a control circuit by receiving input signals from different sensors. The second heat source 11 may also include a radio frequency device, which can realize a communication connection between the drone and a mobile terminal such as a remote control or a mobile phone. The second heat source 11 may also include an image transmission device, which can transmit the picture collected by the unmanned equipment through the camera to the monitor of the operator in real time. The second heat source 11 may also include a positioning device related to geographic location information such as RTK or GPS. The above-mentioned flight control processor, radio frequency device, image transmission device, and positioning device complete the corresponding control function through the logic circuit integrated in the chip during the working process, and the current required in the process of realizing the control function is relatively small. Therefore, its calorific value is small, and any one or a combination of several of them can be used as the second heat source 11.

Optionally, referring to FIG. 3, there is a space for heat dissipation between the first heat conducting plate 121 and the second heat conducting plate 122.

Specifically, in one embodiment, as shown in FIG. 3, after the first heat conduction plate 121 and the second heat conduction plate 122 are arranged oppositely, the space between them can form a heat dissipation space, which can be The heat transferred between the first heat conducting plate 121 and the second heat conducting plate 122 is dissipated as soon as possible.

Optionally, referring to FIG. 3, the heat dissipation element 123 includes a plurality of heat dissipation fins arranged at intervals, and the heat dissipation fins are fixedly connected to the first heat conduction plate 121 and the second heat conduction plate 122.

Specifically, in an embodiment, as shown in FIG. 3, for the heat dissipation element 123 disposed between the first heat conducting plate 121 and the second heat conducting plate 122, the heat dissipation element 123 may include a plurality of heat dissipation elements arranged at intervals. Fins, a plurality of heat dissipation fins extend from the surface of one heat conduction plate of the first heat conduction plate 121 and the second heat conduction plate 122 to the surface of the other heat conduction plate, so as to be fixed between the two heat conduction plates, with a gap between them. Forms a channel for airflow. A plurality of heat dissipation fins arranged in a comb tooth shape effectively increase the heat dissipation area of the heat sink, and can improve the heat dissipation efficiency of the heat sink.

Optionally, the first heat conducting plate 121, the second heat conducting plate 122 and the heat dissipation fins are integrally formed.

Specifically, in one embodiment, the first heat conduction plate 121, the second heat conduction plate 122, and the heat dissipation fins can be processed from the metal parts at one time by mechanical processing or chemical reaction, so that the first heat conduction The plate 121, the second heat conducting plate 122 and the heat dissipation fins are integrally formed, which can reduce the assembly process and reduce the assembly complexity.

Optionally, the heat dissipation fins include first heat dissipation fins and second heat dissipation fins, one end of the first heat dissipation fins is fixedly connected to the first heat conducting plate 121, and the second heat dissipation fins One end is fixedly connected to the second heat conducting plate 122, and the free ends of the first heat dissipation fins and the free ends of the second heat dissipation fins are staggered with each other.

Specifically, in an embodiment, when the heat dissipation element 123 includes a plurality of heat dissipation fins arranged at intervals, a part of the heat dissipation fins may be the first heat dissipation fins connected to the first heat conducting plate 121, and the other part of the heat dissipation fins may be the first heat dissipation fins connected to the first heat conducting plate 121. The fin may be a second heat dissipation fin connected to the second heat conducting plate 122. The first heat dissipation fins and the second heat dissipation fins are adjacent to each other and are alternately staggered to form a comb-shaped heat dissipation channel.

Optionally, the heat dissipating element 123 includes a plurality of heat dissipating pillars arranged at intervals, and the heat dissipating pillars are fixedly connected to the first heat conducting plate 121 and the second heat conducting plate 122 at the same time.

Specifically, in an embodiment, the aforementioned heat dissipation element 123 may also be a heat dissipation column connecting the first heat conduction plate 121 and the second heat conduction plate 122, and may be between the first heat conduction plate 121 and the second heat conduction plate 122. A plurality of heat dissipation pillars with a circular or rectangular cross section are arranged, and the plurality of heat dissipation pillars are arranged at intervals. On the one hand, the heat dissipation pillars connect and fix the first heat conduction plate 121 and the second heat conduction plate 122; The gap can be used as an air duct for heat dissipation and ventilation.

Optionally, the heat dissipation element 123 includes at least one curved and spiral heat dissipation pipe, and the heat dissipation pipe is fixedly connected to the first heat conduction plate 121 and the second heat conduction plate 122, wherein the heat dissipation pipe is used for Fill with coolant.

Specifically, in one embodiment, the above-mentioned radiator may also be water-cooled to dissipate heat, and the heat dissipation element 123 may include at least one curved and circling heat dissipation pipe. The heat dissipation pipe is a hollow pipe that can be filled with cooling liquid. It is understood that a circulating pump is provided on the circulating pipeline of the cooling liquid to realize the circulating flow of the cooling liquid. The above-mentioned heat pipes are respectively fixedly connected to the first heat conducting plate 121 and the second heat conducting plate 122. When the low-temperature cold wind liquid flows through the first heat conducting plate 121 and the second heat conducting plate 122, the first heat conducting plate 121 can be connected by heat exchange. And the heat on the second heat conducting plate 122 is taken away, realizing efficient heat dissipation.

7 and 8, the embodiment of the present invention also provides a movable platform 2, the movable platform 2 includes any one of the aforementioned electronic components and heat dissipation air duct 20, wherein the first heat conducting plate 121. The second heat conducting plate 122 constitutes a part of the air duct wall of the heat dissipation air duct 20, the heat dissipation element 123 is arranged in the heat dissipation air duct 20, and the heat dissipation air duct 20 includes an air inlet 201 and an air outlet 202;

The airflow passing through the heat dissipation air duct 20 can take away the heat on the heat dissipation element 123.

Specifically, as shown in FIG. 7, in a movable platform 2 disclosed in an embodiment of the present invention, the heat dissipation air duct 20 shown in FIG. 8 is formed through the mutual cooperation of the shells of the movable platform. When the electronic component disclosed in the embodiment is installed in the heat dissipation air duct 20, the first heat conduction plate 121 and the second heat conduction plate 122 of the heat sink 12 can form part of the air duct wall of the heat dissipation air duct 20, and can guide the flow direction of the wind. At this time, the heat dissipation element 123 is disposed in the heat dissipation air duct 20. The heat transferred from the first heat-conducting plate 121 and the second heat-conducting plate 122 to the heat dissipating element 123 can be quickly discharged under the action of wind.

Optionally, referring to FIG. 8, the above-mentioned movable platform 2 further includes a fan 21, the fan 21 is disposed in the heat dissipation air duct 20, and the fan 21 is used to dissipate heat of the electronic components.

Specifically, as shown in FIG. 8, in an embodiment, the above-mentioned movable platform 2 may further include a fan 21, which can be installed and fixed in the heat dissipation duct 20 of the movable platform 2, and the fan 21 Under the action of, strong cold air can be generated to realize the rapid heat dissipation of the radiator 12.

Optionally, the fan 21 is located at the air outlet 202.

Specifically, in one embodiment, the fan 21 can be installed and fixed at the air outlet 202 of the heat dissipation air duct 20. When the fan 21 is running, the fan 21 located at the air outlet 202 drives the airflow in the heat dissipation air duct 20. , The cold air with a lower temperature is sucked in from the air inlet 201. When passing through the electronic component, it exchanges heat with the radiator 12 in the electronic component. It is discharged from the air outlet 202. The fan 21 is arranged at the air outlet 202, which can avoid the compact internal space when it is arranged close to the inside of the heat dissipation air duct. It should be noted that when two heat sources of electronic components are arranged in practical applications, the first heat source 10 with high temperature can be arranged close to the air inlet 201, and the second heat source 11 with low temperature can be arranged close to the air outlet 202, so that when cold air enters When in the air duct 20, first complete the heat exchange with the high temperature first heat source 10, and lower the temperature of the first heat source 10 to give priority to improving the reliability of the components in the first heat source 10. For the cooling control of the first heat source 10, The heat exchange can be completed by subsequent cold air.

It is understandable that the type of fan 21 can be a centrifugal fan with airflow moving in a radial direction or an axial fan with airflow moving in an axial direction. When an axial fan is used, it can better guide and control the flow direction of the wind. Quickly extract the heat from the air outlet and discharge it.

Optionally, the movable platform 2 includes at least one of an unmanned aerial vehicle, an unmanned transport vehicle, and an unmanned ship.

Specifically, in one embodiment, the above-mentioned movable platform 2 includes at least one of an unmanned aerial vehicle, an unmanned transport vehicle, and an unmanned ship. It should be noted that no matter what kind of movable platform among unmanned aerial vehicles, unmanned transport vehicles and unmanned ships, its movement is mainly driven by motors to generate moving power. The work of other devices on the movable platform 2 mainly depends on the control device of the control system. Therefore, in the movable platform 2 given in the above example, there will be a first heat source 10 with a larger amount of heat and a second heat source 11 with a smaller amount of heat. Therefore, the aforementioned electronic components can be used in unmanned aerial vehicles, unmanned transport vehicles or unmanned ships to ensure the working stability of the electronic devices in the movable platform 2 when heating, and improve the working stability and reliability of the movable platform 2 sex. As shown in FIG. 7, a schematic diagram of the movable platform 2 of the embodiment of the present invention is an unmanned aerial vehicle, and the electronic components can be installed inside the unmanned aerial vehicle.

Optionally, the movable platform 2 is an unmanned aerial vehicle, and the heat dissipation element 123 is fixed in the heat dissipation air duct of the central body of the unmanned aerial vehicle, or the heat dissipation element 123 is fixed to the paddle of the unmanned aerial vehicle. The location of the leaf motor.

Specifically, in one embodiment, when the movable platform 2 is an unmanned aerial vehicle, the shell of the unmanned aerial vehicle organism can form a heat dissipation air duct in the shell, and the heat dissipation element 123 can be fixed at the center of the unmanned aerial vehicle. The heat dissipation air duct of the body discharges the main heat in the body. The flight of the unmanned aerial vehicle relies on the blade motor that drives the blades to rotate. In addition to centrally installing the electronic speed controller inside the body, the electronic speed controller can also be installed in the position of the blade motor if space permits. , Then correspondingly, the heat dissipation element 123 can be fixed to the position of the blade motor of the UAV. A heat source 10 electronic governor, and the second heat conducting plate 122 of the radiator is used to connect to the second heat source 11. When the blade motor rotates, the airflow disturbance caused by the rotation of the blade can be used to accelerate the heat dissipation.

9, an embodiment of the present invention also provides an electronic component, the electronic component includes a first heat source 10, a second heat source 11 and a heat sink 12;

The heat sink 12 includes a first heat conduction surface 124 and a second heat conduction surface 125, and the first heat conduction surface 124 and the second heat conduction surface 125 are different surfaces. Among them, different planes refer to different planes. In other words, the first heat conducting surface 124 and the second heat conducting surface 125 are located on different planes. In one embodiment, the plane where the first heat conducting surface 124 is located is parallel to the plane where the second heat conducting surface is located. In another embodiment, there is an angle between the plane where the first heat conducting surface 124 is located and the plane where the second heat conducting surface is located. The included angle is greater than 0 and less than 180 degrees.

The first heat source 10 is fixed to the first heat conducting surface 124, the second heat source 11 is fixed to the second heat conducting surface 125, and the heat generated by the first heat source 10 is greater than the heat generated by the second heat source 11.

Specifically, as shown in FIG. 9, an embodiment of the present invention also provides another electronic component, which includes a first heat source 10, a second heat source 11 and a heat sink 12. In this structure, the heat sink 12 includes a first heat conduction surface 124 and a second heat conduction surface 125. The first heat-conducting surface 124 and the second heat-conducting surface 125 are not on the same plane, and there may be a certain angle between them, so that the two surfaces are staggered. Specifically, a metal plate can be bent through a sheet metal process to obtain a heat sink 12 with an included angle. The two surfaces of the heat sink 12 forming the included angle are the first heat conducting surface 124 and the second heat conducting surface 125. The first heat source 10 is fixed to the first heat conducting surface 124, and the second heat source 11 is fixed to the second heat conducting surface 125. Therefore, the first heat source 10 that generates more heat and the second heat source 11 that generates less heat are arranged separately and isolated, so that the influence of heat radiation between each other can be avoided.

Optionally, referring to FIG. 9, the first heat conducting surface 124 and the second heat conducting surface 125 are adjacent to each other.

Specifically, as shown in FIG. 9, in an embodiment, the first heat conduction surface 124 and the second heat conduction surface 125 may be two surfaces that are adjacent to each other after bending the sheet metal.

Optionally, referring to FIG. 10, the first heat conducting surface 124 and the second heat conducting surface 125 are respectively located on the upper and lower sides of the heat sink 12.

Specifically, as shown in FIG. 10, in one embodiment, the heat sink 12 may be a U-shaped piece formed by bending a sheet metal, and the first heat conducting surface 124 and the second heat conducting surface 125 are located on the heat sink 12, respectively. The upper and lower sides of the machine are connected by a transition part in the middle.

It should be noted that, in actual applications, the actual size of the first heat source 10 and the second heat source 11 and the size of the installation space can be used to determine which structure of the heat sink 12 to use, which is not restricted in the embodiment of the present invention.

Optionally, referring to FIG. 11, the heat sink 12 further includes a heat dissipating element 123, the heat dissipating element 123 is disposed on the other surface opposite to the first heat conducting surface 124 and/or opposite to the second heat conducting surface 125 The other side.

Specifically, as shown in FIG. 11, in such a heat sink 12 composed of a single metal plate, a heat dissipation element 123 may also be provided on the other side opposite to the heat conduction surface, and the heat dissipation element 123 may be separately provided with the first heat dissipation element 123. The opposite side of the heat conduction surface 124 can also be separately provided on the other side opposite to the second heat conduction surface 125, or can be provided on both surfaces, and the corresponding heat dissipation scheme can be selected according to different heat sources.

It is understandable that in such a heat sink 12 composed of a single metal plate, the heat dissipation element 123 used may also include a plurality of heat dissipation fins arranged at intervals. In other words, the heat dissipation fin structure can also be used to increase the heat dissipation area.

Optionally, the first heat source 10 is a strong electric component, and the second heat source 11 is a weak electric component. In one embodiment, the voltage of the first heat source 10 is greater than or equal to a threshold, and the voltage of the second heat source 11 is less than the threshold. For example, the threshold is 12V.

Specifically, in an embodiment, the above-mentioned first heat source 10 may be a strong electric component, and the second heat source 11 may be a weak electric component. It should be noted that high-power components refer to components in which the energy form of electric energy changes at the input and output ends of the heat source. Such components usually work with a higher DC voltage (for example: 12V), such as power-related management devices. , The motor and its controller components that convert electrical energy into mechanical energy, etc. Weak components refer to components that do not change the energy form of electric energy at the input and output ends of the heat source. Such components usually work with a lower DC voltage (for example: 3V or 5V), such as; flight control processor, positioning device, etc. . Of course, the calorific value of the first heat source 10 and the second heat source 11 are relative. When the first heat source 10 is a weak electric component, the second heat source 11 is a strong electric component, which will not be repeated in the embodiment of the present invention.

The electronic component in the embodiment of the present invention can guide the heat of the first heat source to the heat dissipation element through the first heat conduction plate, and guide the heat of the second heat source to the heat dissipation element through the second heat conduction plate; the first heat conduction plate and the first heat conduction plate The relative arrangement of the two heat conducting plates avoids the interference of heat radiation caused by the arrangement of the first heat source and the second heat source on the same side, can improve the heat dissipation efficiency of the electronic components, and improve the working performance of the electrical devices.

12, the embodiment of the present invention also provides another electronic component, and the electronic component includes:

The first heat source 10 is connected to the first area 126 of the radiator 12,

The second heat source 11 is connected to the second area 127 of the heat sink 12, and the second area 127 and the first area 126 are located at different positions of the heat sink 12; and

The heat sink 12 is used to dissipate heat from the first heat source 10 and the second heat source 11;

Wherein, the heat generated by the first heat source 10 is conducted to the first region 126 of the radiator 12, and the heat generated by the second heat source 11 is conducted to the second region of the radiator 12 127; the heat generated by the first heat source 10 is greater than the heat generated by the second heat source 11.

Specifically, as shown in FIG. 12, in another embodiment of the present invention, the two heat sources of different heat included in the electronic component may be connected to different regions of the radiator 12, respectively. It should be noted that the different areas connected by different heat sources may be different areas on the same surface separated by a predetermined distance, or two completely different planes. Exemplarily, as shown in FIG. 12, the first heat source 10 may be connected to the first area 126 of the first surface of the heat sink 12, and the second heat source 11 may be connected to the second area 127 of the second surface of the heat sink 12 , The distance L between the first area 126 and the second area 127 is greater than the preset distance, so that the heat generated by the first heat source 10 can be conducted to the first area 126, and the heat generated by the second heat source 11 can be conducted to the second area 127. The influence of heat radiation caused by the first heat source 10 and the second heat source 11 being too close can be avoided.

Optionally, referring to FIG. 12, the first area 126 and the second area 127 are located on different planes.

Specifically, as shown in FIG. 12, in one embodiment, the first area 126 for connecting the first heat source 10 and the second area 127 for connecting the second heat source 11 may be different planes. In this case, if two different heat sources are connected on different planes, it is easier to isolate each other in space, and the risk of mutual thermal radiation is greatly reduced.

Optionally, the voltage of the first heat source 10 is greater than or equal to a threshold, and the voltage of the second heat source 11 is less than the threshold.

Optionally, the first heat source 10 and the first heat source 11 share the same heat dissipation channel 128 for heat dissipation.

Specifically, in the above electronic components, a heat dissipation channel 128 can also be designed in the heat sink 12. When the first heat source 10 is connected to the first area 126 of the heat sink 12, the second heat source 11 and the second heat sink 12 are connected to each other. After the areas 127 are connected, the heat collected in the first area 126 and the heat collected in the second area 127 can be dissipated through the heat dissipation channel 128 at the same time, that is to say, the first heat source 10 and the second heat source 11 can be transferred to The heat dissipation channel 128. Therefore, there is no need to separately design a heat dissipation channel for each heat source, which helps to reduce the volume of electronic components and save installation space.

The electronic component in the embodiment of the present invention can guide the heat generated by the first heat source and the second heat source to different areas, avoiding the interference of heat radiation caused by the proximity of the first heat source and the second heat source, and can improve the electron The heat dissipation efficiency of the components improves the working performance of electrical devices.

The device embodiments described above are merely illustrative, where the units described as separate components may or may not be physically separate, and the components displayed as units may or may not be physical units, that is, they may be located in One place, or it can be distributed to multiple network units. Some or all of the modules can be selected according to actual needs to achieve the objectives of the solutions of the embodiments. Those of ordinary skill in the art can understand and implement without creative work.

The “one embodiment”, “an embodiment” or “one or more embodiments” referred to herein means that a specific feature, structure or characteristic described in conjunction with the embodiment is included in at least one embodiment of the present invention. In addition, please note that the word examples "in one embodiment" here do not necessarily all refer to the same embodiment.

In the instructions provided here, a lot of specific details are explained. However, it can be understood that the embodiments of the present invention can be practiced without these specific details. In some instances, well-known methods, structures, and technologies are not shown in detail, so as not to obscure the understanding of this specification.

In the claims, any reference signs placed between parentheses should not be constructed as a limitation to the claims. The word "comprising" does not exclude the presence of elements or steps not listed in the claims. The word "a" or "an" preceding an element does not exclude the presence of multiple such elements. The invention can be implemented by means of hardware comprising several different elements and by means of a suitably programmed computer. In the unit claims that list several devices, several of these devices may be embodied in the same hardware item. The use of the words first, second, and third, etc. do not indicate any order. These words can be interpreted as names.

Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention, not to limit them; although the present invention has been described in detail with reference to the foregoing embodiments, those of ordinary skill in the art should understand that: The technical solutions recorded in the foregoing embodiments are modified, or some of the technical features thereof are equivalently replaced; these modifications or replacements do not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the embodiments of the present invention.

Claims

An electronic component, characterized in that the electronic component comprises: a first heat source, a second heat source and a radiator;

The heat sink includes a first heat-conducting plate, a second heat-conducting plate, and a heat-dissipating element. The first heat-conducting plate and the second heat-conducting plate are arranged opposite to each other, and the heat-dissipating element is fixed on the first heat-conducting plate and the Between two heat conducting plates;

The first heat source is fixed on the side of the first heat conducting plate away from the heat dissipation element, and the second heat source is fixed on the side of the second heat conducting plate away from the heat dissipation element, wherein the first heat source generates The heat of is greater than the heat generated by the second heat source.
The electronic component according to claim 1, wherein:

The first heat source includes a first electronic component and a first circuit board, and the first circuit board carries the first electronic component;

The second heat source includes a second electronic component and a second circuit board, and the second circuit board carries the second electronic component.
3. The electronic component according to claim 2, wherein the first circuit board is fixed to the first heat conducting board, and the second circuit board is fixed to the second heat conducting board.
The electronic component according to claim 3, wherein:

The first electronic component includes at least one of a power component driver, an electronic speed regulator, a power distribution device, and a battery management device.
The electronic component according to claim 4, wherein:

The power component driver is a pan/tilt motor driver or a paddle motor driver.
The electronic component according to claim 2, wherein:

The first electronic component includes the electronic speed governor and the power distributing device, and the electronic speed governor and the power distributing device are integratedly arranged on a first circuit board.
The electronic component according to claim 1, wherein:

The second heat source includes at least one of a flight control processor, a radio frequency device, an image transmission device, and a positioning device.
The electronic component according to claim 1, wherein:

There is a space for heat dissipation between the first heat conducting plate and the second heat conducting plate.
The electronic component according to claim 1, wherein:

The heat dissipation element includes a plurality of heat dissipation fins arranged at intervals, and the heat dissipation fins are fixedly connected to the first heat conduction plate and the second heat conduction plate.
The electronic component according to claim 9, wherein:

The first heat conduction plate, the second heat conduction plate and the heat dissipation fin are integrally formed.
The electronic component according to claim 10, wherein the heat dissipation fin comprises a first heat dissipation fin and a second heat dissipation fin, and one end of the first heat dissipation fin is fixedly connected to the first heat conducting plate One end of the second heat dissipation fin is fixedly connected to the second heat conducting plate, and the free end of the first heat dissipation fin and the free end of the second heat dissipation fin are staggered with each other.
The electronic component according to claim 1, wherein:

The heat dissipating element includes a plurality of heat dissipating pillars arranged at intervals, and the heat dissipating pillars are fixedly connected to the first heat conducting plate and the second heat conducting plate at the same time.
The electronic component according to claim 1, wherein:

The heat dissipation element includes at least one curved and spiral heat dissipation pipe, the heat dissipation pipe is respectively fixedly connected with the first heat conduction plate and the second heat conduction plate, wherein the heat dissipation pipe is used for filling a cooling liquid.
A movable platform, characterized by comprising: the electronic component and a heat dissipation air duct according to any one of claims 1-13, wherein the first heat conducting plate and the second heat conducting plate constitute the part of the heat dissipation air duct Part of the air duct wall, the heat dissipation element is arranged in the heat dissipation air duct, and the heat dissipation air duct includes an air inlet and an air outlet;

The airflow passing through the heat dissipation air duct can take away the heat on the heat dissipation element.
The movable platform according to claim 14, further comprising: a fan, the fan is arranged in the heat dissipation air duct, and the fan is used for dissipating heat of the electronic component.
The movable platform according to claim 15, wherein the fan is located at the air outlet.
The movable platform according to claim 16, wherein the fan is a centrifugal fan or an axial fan.
The movable platform according to claim 17, characterized in that,

The movable platform includes at least one of an unmanned aerial vehicle, an unmanned transport vehicle, and an unmanned ship.
The movable platform according to claim 18, wherein:

The movable platform is an unmanned aerial vehicle, and the heat dissipation element is fixed in the heat dissipation air duct of the central body of the unmanned aerial vehicle, or the heat dissipation element is fixed at the position of the blade motor of the unmanned aerial vehicle.
An electronic component, characterized in that the electronic component includes a first heat source, a second heat source and a radiator;

The heat sink includes a first heat conduction surface and a second heat conduction surface, and the first heat conduction surface and the second heat conduction surface are different surfaces;

The first heat source is fixed to the first heat conducting surface, the second heat source is fixed to the second heat conducting surface, and the heat generated by the first heat source is greater than the heat generated by the second heat source.
The electronic component according to claim 20, wherein:

The first heat conduction surface and the second heat conduction surface are adjacent to each other.
The electronic component according to claim 20, wherein:

The first heat conduction surface and the second heat conduction surface are respectively located on the upper and lower sides of the heat sink.
The electronic component according to claim 20, wherein:

The heat sink further includes a heat dissipation element, and the heat dissipation element is arranged on the other surface opposite to the first heat conducting surface and/or the other surface opposite to the second heat conducting surface.
The electronic component according to claim 23, wherein:

The heat dissipation element includes a plurality of heat dissipation fins arranged at intervals.
The electronic component according to claim 20, wherein:

The voltage of the first heat source is greater than or equal to a threshold, and the voltage of the second heat source is less than the threshold.
An electronic component, characterized in that the electronic component comprises:

The first heat source, connected to the first area of the radiator,

A second heat source connected to a second area of the heat sink, where the second area and the first area are located at different positions of the heat sink; and

The heat sink is used to dissipate heat from the first heat source and the second heat source;

Wherein, the heat generated by the first heat source is conducted to the first area of the heat sink, and the heat generated by the second heat source is conducted to the second area of the heat sink; the first The heat generated by the heat source is greater than the heat generated by the second heat source.
The electronic assembly of claim 26, wherein:

The first area and the second area are located on different planes.
The electronic assembly of claim 26, wherein:

The voltage of the first heat source is greater than or equal to a threshold, and the voltage of the second heat source is less than the threshold.
The electronic assembly of claim 28, wherein:

The first heat source and the second heat source share the same heat dissipation channel for heat dissipation.