CN213755416U - Electronic assembly and movable platform - Google Patents

Abstract

The embodiment of the utility model provides an electronic component and movable platform, electronic component includes: a first electronic device, a second electronic device, and a heat sink; the radiator comprises a first heat conducting plate, a second heat conducting plate and a radiating element, wherein the first heat conducting plate and the second heat conducting plate are arranged oppositely; the first electronic device is fixed on one surface of the first heat conduction plate, which is far away from the radiating element, and the second electronic device is fixed on one surface of the second heat conduction plate, which is far away from the radiating element, wherein the heat generated by the first electronic device is larger than that generated by the second electronic device. The embodiment of the utility model provides an in electronic component, can improve electronic component's radiating efficiency, promote electrical device's working property.

Description

Electronic assembly and movable platform

Technical Field

The utility model relates to an electronic equipment technical field, especially an electronic component and movable platform.

Background

With the development and progress of electronic technology, various automatic devices such as unmanned aerial vehicles and unmanned vehicles have a driving module or an electric adjusting module with high calorific value related to the realization of electric energy and mechanical conversion of motors and the like, and also have a control module with low calorific value related to a signal processing function.

In the prior art, a common layout scheme of a heat dissipation structure is to fix a driving module with higher heat productivity and a control module with lower heat productivity at the same side of a heat dissipation plate. In the scheme, the driving module and the control module are arranged on the same side, the heat emitted by the driving module is more, and the part of heat can radiate and influence the control module, so that the heat radiation efficiency around the control module is low.

Therefore, in the existing heat dissipation scheme, heat between different device modules can affect each other, which results in reduced heat dissipation efficiency and reduced working performance of electrical devices.

SUMMERY OF THE UTILITY MODEL

In view of this, in order to solve the problem that the heat between different device modules influences each other in the current heat dissipation scheme, lead to the radiating efficiency to reduce, make electrical device working property descend, the utility model provides an electronic component and movable platform.

In a first aspect, an embodiment of the present invention provides an electronic assembly, which includes: the electronic device comprises a first electronic module, a second electronic module and a radiator;

the radiator comprises a first heat-conducting plate, a second heat-conducting plate and a radiating element, wherein the first heat-conducting plate and the second heat-conducting plate are arranged oppositely, and the radiating element is fixed between the first heat-conducting plate and the second heat-conducting plate;

the first electronic module is fixed on the surface, far away from the radiating element, of the first heat-conducting plate, the second electronic module is fixed on the surface, far away from the radiating element, of the second heat-conducting plate, and the heat generated by the first electronic module is larger than that generated by the second electronic module.

In a second aspect, an embodiment of the present invention provides a movable platform, including: the electronic component and the heat dissipation air duct of the first aspect, wherein the first heat conduction plate and the second heat conduction plate form part of an air duct wall of the heat dissipation air duct, the heat dissipation element is disposed in the heat dissipation air duct, and the heat dissipation air duct includes an air inlet and an air outlet;

the air flow passing through the heat dissipation air duct can take away the heat on the heat dissipation element.

In a third aspect, an embodiment of the present invention further provides an electronic assembly, where the electronic assembly includes a first electronic module, a second electronic module, and a heat sink;

the radiator comprises a first heat conduction surface and a second heat conduction surface, and the first heat conduction surface and the second heat conduction surface are different surfaces.

The first electronic module is fixed on the first heat-conducting surface, the second electronic module is fixed on the second heat-conducting surface, and the heat generated by the first electronic module is larger than that generated by the second electronic module.

The electronic component of the embodiment of the utility model at least comprises the following advantages;

the embodiment of the utility model provides an in electronic component, can improve electronic component's radiating efficiency, promote electrical device's working property.

The above description is only an overview of the technical solutions of the present invention, and in order to make the technical means of the present invention more clearly understood, the present invention may be implemented according to the content of the description, and in order to make the above and other objects, features, and advantages of the present invention more obvious and understandable, the following detailed description of the present invention is given.

Drawings

In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings required to be used in the description of the embodiments of the present invention will be briefly introduced below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to these drawings without inventive labor.

Fig. 1 schematically illustrates a schematic structural diagram of an electronic assembly according to an embodiment of the present invention;

fig. 2 schematically shows a schematic view of fig. 1 along direction a of an embodiment of the invention;

fig. 3 schematically shows a three-dimensional structure diagram of a heat sink according to an embodiment of the present invention;

fig. 4 schematically shows a schematic view of a first electronic device of an embodiment of the invention;

fig. 5 schematically shows a schematic view of a second electronic device of an embodiment of the invention;

fig. 6 schematically shows a schematic view of another first electronic device according to an embodiment of the invention;

fig. 7 schematically illustrates a schematic view of a movable platform according to an embodiment of the present invention;

figure 8 schematically illustrates a schematic view of the air duct of the movable platform of an embodiment of the present invention;

fig. 9 schematically shows a structural schematic diagram of a second electronic assembly according to an embodiment of the present invention;

fig. 10 schematically illustrates a schematic structural diagram of a third electronic assembly according to an embodiment of the present invention;

fig. 11 schematically illustrates a structural schematic diagram of a fourth electronic assembly according to an embodiment of the present invention;

fig. 12 schematically shows a schematic structural diagram of a fifth electronic component according to an embodiment of the present invention.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are some, not all, of the embodiments of the present invention. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative efforts belong to the protection scope of the present invention.

It should be appreciated that reference throughout this specification to "one embodiment" or "an embodiment" means that a particular feature, structure or characteristic described in connection with the embodiment is included in at least one embodiment of the present invention. Thus, the appearances of the phrases "in one embodiment" or "in an embodiment" in various places throughout this specification are not necessarily all referring to the same embodiment. Furthermore, the particular features, structures, or characteristics may be combined in any suitable manner in one or more embodiments.

Referring to fig. 1 to 3, an electronic assembly provided by an embodiment of the present invention is shown, including: a first electronic device 10, a second electronic device 11, and a heat sink 12;

the heat sink 12 includes a first heat-conducting plate 121, a second heat-conducting plate 122 and a heat-dissipating element 123, the first heat-conducting plate 121 and the second heat-conducting plate 122 are oppositely disposed, and the heat-dissipating element 123 is fixed between the first heat-conducting plate 121 and the second heat-conducting plate 122;

the first electronic device 10 is fixed on a surface of the first heat conducting plate 121 far away from the heat dissipating element 123, and the second electronic device 11 is fixed on a surface of the second heat conducting plate 122 far away from the heat dissipating element 123, wherein the heat generated by the first electronic device 10 is greater than the heat generated by the second electronic device 11.

Specifically, as shown in fig. 1, an electronic component according to an embodiment of the present invention is an electronic component with a heat dissipation function, and different types of electronic components exist in the electronic component. The different types of electronic components generate different amounts of heat. The first electronic device 10 may be defined as a device that generates a large amount of heat during operation, and the first electronic device 10 may be a device that converts electrical energy into mechanical energy or other energy in different forms, and the device generates a large amount of heat. The second electronic device 11 is defined as a device that generates less heat during operation than the first electronic device 10. When the first electronic device 10 and the second electronic device 11 are disposed on the same side, since both require heat dissipation, the first electronic device 10 with high temperature will instead radiate to the second electronic device 11 with low temperature, so that the ambient temperature of the second electronic device 11 is difficult to decrease continuously, and thus the operation of the second electronic device 11 is not facilitated. As shown in fig. 1, in the embodiment of the present invention, the first electronic device 10 and the second electronic device 11 with different heat generation amounts are respectively disposed on two sides of the heat sink 12, and the heat sink 12 forms a physical isolation therebetween, so that the radiation effect of the high-temperature electronic device on the low-temperature electronic device in the first electronic device 10 and the second electronic device 11 can be reduced. It should be noted that the electronic component in the embodiment of the present invention may be used in the movable platforms such as the unmanned aerial vehicle, the unmanned transport vehicle, and the unmanned ship, for example, when the electronic component is used in the unmanned aerial vehicle, while driving the unmanned aerial vehicle to perform a flying motion, the electronic component may also perform a communication interaction with other terminal devices such as the ground map transceiver.

As shown in fig. 2, the heat sink 12 includes a first heat-conducting plate 121, a second heat-conducting plate 122 and a heat-dissipating member 123, the first heat-conducting plate 121 and the second heat-conducting plate 122 are respectively disposed at both sides of the heat-dissipating member 123, and the heat-dissipating member 123 may isolate the first heat-conducting plate 121 and the second heat-conducting plate 122 by a certain distance between the first heat-conducting plate 121 and the second heat-conducting plate 122, thereby preventing the first heat-conducting plate 121 and the second heat-conducting plate 122 from directly contacting each other.

As shown in fig. 3, the first electronic device 10 is fixed to a side of the first heat conduction plate 121 remote from the heat radiating member 123, and the second electronic device 11 is fixed to a side of the second heat conduction plate 122 remote from the heat radiating member 123. Thus, different heat transfer paths can be formed in the electronic assembly, for the heat generated by the first electronic device 10, the heat is transferred to the heat dissipation member 123 through the first heat conduction plate 121 and dissipated, for the heat generated by the second electronic device 11, the heat is transferred to the heat dissipation member 123 through the second heat conduction plate 122 and dissipated.

The embodiment of the utility model provides an in, an electronic component is provided, be provided with the great first electron device of heat dissipation capacity and the less second electron device of heat dissipation capacity respectively in the both sides of radiator, through fixing first electron device in the radiator first heat-conducting plate keep away from the one side of heat-radiating element, fix the second electron device in the radiator second heat-conducting plate keep away from the one side of heat-radiating element, thereby can guide the heat of first electron device to the heat-radiating element through first heat-conducting plate, guide the heat of second electron device to the heat-radiating element through the second heat-conducting plate, avoid the heat radiation interference that first electron device and second electron device homonymy set up and arouse, can improve electron component's radiating efficiency, promote the working property of electricity device.

Alternatively, referring to fig. 4 and 5, the first electronic device 10 includes a first electronic component 101 and a first circuit board 102, the first circuit board 102 carrying the first electronic component 101;

the second electronic device 11 includes a second electronic element 111 and a second circuit board 112, and the second circuit board 112 carries the second electronic element 111.

Specifically, in one embodiment, the device may be considered as a device module having a certain electrical signal transmission or processing function formed after the circuit board is soldered to the electronic component. As shown in fig. 4, the first electronic device 10 may include a first electronic component 101 and a first circuit board 102, the first circuit board 102 carrying the first electronic component 101. That is, when the first circuit board 102 is powered on, the first electronic component 101 is in an operating state, the temperature rises, and heat is generated, and a part of the electric energy transmitted by the first circuit board 102 to the first electronic component 101 is converted into heat energy. Similarly, as shown in fig. 5, the second electronic device 11 may include a second electronic element 111 and a second circuit board 112, the second circuit board 112 carrying the second electronic element 111. When the heat generation amount of the second electronic element 111 is smaller than that of the first electronic element 101, that is, the heat generation amount of the first electronic device 10 is larger than that of the second electronic device 11.

Optionally, the first circuit board 102 is fixed on the first heat-conducting plate 121, and the second circuit board 112 is fixed on the second heat-conducting plate 122.

Specifically, in one embodiment, screw holes or copper columns may be reserved on the first heat conduction plate 121 and the second heat conduction plate 122, and the circuit board is screwed and fixed by screws or fastened by nuts, so that the first circuit board 102 is fixed on the first heat conduction plate 121, and the second circuit board 112 is fixed on the second heat conduction plate 122, so that the first electronic component 10 is connected to the first heat conduction plate 121, and the second electronic component 11 is connected to the second heat conduction plate 122.

Optionally, the first electronic component 101 includes at least one of a power pack driver, an electronic governor, a power distribution device, and a battery management device.

Specifically, in one embodiment, the first electronic component 101 may include a power assembly driver of a power assembly with relatively large power, such as a motor, for example, a motor driver. When the motor driver works, the motor driver receives the control signal and outputs a driving signal of the motor so as to drive the motor to run according to a corresponding rotating speed rule, and a large amount of heat can be generated in the process of the motor driver. The first electronic component 101 may further include an electronic speed regulator, which is called electronic speed regulator for short, and a PWM (Pulse Width Modulation) signal output by the receiver or the flight control board is processed by an internal chip and then outputs a driving regulation signal to regulate an MOS (Metal Oxide Semiconductor) driving tube, so that the MOS driving tube regulates the output voltage and controls the operation of each motor, and thus, the electronic speed regulator is also an electronic component with a large heat generation amount. The first electronic component 101 may further include a power distribution device, which is generally a power distribution board, and the power distribution board is a circuit board for connecting a battery and an electric regulator, and divides electric energy from the battery into multiple paths to be transmitted to different device modules, so that the power distribution device is also an electronic component with a large heat generation amount. The first electronic component 111 may further include a battery management device, which is generally referred to as a power board for managing charging and discharging, and has functions of over-charging/over-current power-off and power monitoring, which may be implemented by a corresponding power management chip, and therefore, the battery management device is also an electronic component with a large heat generation amount. In practical applications, the first electronic component 101 may be any one of the power assembly driver, the electronic governor, the power distribution device, and the battery management device or a combination of several of the above.

Optionally, the power assembly driver is a pan-tilt motor driver or a blade motor driver.

Specifically, in an embodiment, the power assembly of some products may be a pan/tilt head for carrying a camera, and the pan/tilt head is driven by a motor to freely adjust the direction, and then the power assembly driver may be a pan/tilt motor driver for driving the pan/tilt head to move along different directions. Some power components of the product may be power components for moving the device, for example, a walking motor for driving a wheeled device to walk, or a paddle motor for driving a paddle of the unmanned aerial vehicle to rotate, and accordingly, the power component driver may be a paddle motor driver. No matter the pan-tilt motor driver or the paddle motor driver is the driver for outputting the motor control signal, the difference lies in that one is used for driving the motor to move slowly to realize the control of the pan-tilt direction, and the other is used for controlling the motor to rotate at high speed

Optionally, the first electronic component 111 includes the electronic speed regulator and the power distribution device, and the electronic speed regulator and the power distribution device are integrally disposed on the first circuit board.

Specifically, in one embodiment, when the first electronic component 111 includes the electronic governor and the distributor device described above, the distributor device relies on the circuit board as a carrier, typically remote from the battery, due to its primarily electrical energy distribution function. The electronic speed regulator mainly receives electric energy to control the rotating speed of the motor, and the electronic speed regulator also depends on a structural carrier of a circuit board. Moreover, the electronic governor and the distributor are both elements with large heat productivity, and when the electronic governor and the distributor are close to each other, the mutual interference caused by the heat radiation is weak, so that the electronic governor and the distributor can be integrated on the first circuit board 102 at the same time. For example, when the first circuit board 102 is developed, an electrical tuning circuit corresponding to the electronic governor and a distribution circuit corresponding to the distribution device may be simultaneously designed on the first circuit board 102, and a control chip corresponding to the electronic governor and a device corresponding to the distribution device are simultaneously soldered and fixed on the first circuit board 102, so as to realize the concentrated layout of high-temperature electronic devices, and avoid the radiation influence on the low-temperature electronic devices mixed therein caused by the scattered layout of the high-temperature electronic devices. As fig. 6 exemplarily shows a schematic diagram of a circuit board in which an electronic governor and a distributor are integrally disposed, the electronic governor a and the distributor B are integrally disposed on the first circuit board 102 of fig. 6 at the same time, for example, the left half of fig. 6 may be a circuit and components corresponding to the electronic governor a, and the right half of fig. 6 may be a circuit and components corresponding to the distributor B.

Optionally, the second electronic device 11 includes at least one of a flight control processor, a radio frequency device, an image transmission device, and a positioning device.

Specifically, in one embodiment, unlike the first electronic device 10, the energy form of the second electronic device 11 may not change during the operation, and may be a control type device, the input of which is an electrical signal, and the output of which is still an electrical signal. These components are mainly used to realize a control function during operation, and therefore generate less heat than the first electronic device 10. For example, the second electronic device 11 may include a flight control processor, which receives input signals from various sensors and controls the flight attitude of the drone through a control circuit. The second electronic device 11 may further include a radio frequency device, and the radio frequency device may implement communication connection between the unmanned aerial vehicle and a mobile terminal such as a remote controller or a mobile phone. The second electronic device 11 may further include an image transmission device, and may transmit the picture acquired by the unmanned device through the camera to a monitor of an operator in real time. The second electronic device 11 may also include a positioning device such as an RTK or GPS that is associated with the geographic location information. In the working process of the flight control processor, the radio frequency device, the image transmission device and the positioning device, the corresponding control function is completed through the logic circuits respectively integrated in the chip, and the current required in the process of realizing the control function is small, so that the heat productivity is small, and any one or combination of a plurality of the flight control processor, the radio frequency device, the image transmission device and the positioning device can be used as the second electronic device 11.

Optionally, referring to fig. 3, a space for heat dissipation is provided between the first heat-conducting plate 121 and the second heat-conducting plate 122.

Specifically, in one embodiment, as shown in fig. 3, after the first heat-conducting plate 121 and the second heat-conducting plate 122 are disposed opposite to each other, a space therebetween may form a heat-dissipating space, and heat transferred between the first heat-conducting plate 121 and the second heat-conducting plate 122 may be dissipated as quickly as possible by wind.

Alternatively, referring to fig. 3, the heat dissipating element 123 includes a plurality of heat dissipating fins arranged at intervals, and the heat dissipating fins are fixedly connected with the first heat conducting plate 121 and the second heat conducting plate 122.

Specifically, in one embodiment, as shown in fig. 3, for the heat dissipation member 123 disposed between the first and second heat conduction plates 121 and 122, the heat dissipation member 123 may include a plurality of heat dissipation fins disposed at intervals, the plurality of heat dissipation fins extending from the surface of one of the first and second heat conduction plates 121 and 122 to the surface of the other heat conduction plate so as to be fixed between the two heat conduction plates, and the gaps spaced from each other may form passages for the air flow. The plurality of radiating fins arranged in the comb shape effectively increase the radiating area of the radiator, and can improve the radiating efficiency of the radiator.

Optionally, the first heat-conducting plate 121, the second heat-conducting plate 122 and the heat-dissipating fins are integrally formed.

Specifically, in one embodiment, the first heat conducting plate 121, the second heat conducting plate 122 and the heat dissipating fins can be machined at one time on the metal piece by means of mechanical processing or chemical reaction, so that the first heat conducting plate 121, the second heat conducting plate 122 and the heat dissipating fins are integrally formed, the assembling process can be reduced, and the assembling complexity can be reduced.

Optionally, the heat dissipation fins include first heat dissipation fins and second heat dissipation fins, one end of each first heat dissipation fin is fixedly connected to the first heat conduction plate 121, one end of each second heat dissipation fin is fixedly connected to the second heat conduction plate 122, and free ends of the first heat dissipation fins and free ends of the second heat dissipation fins are staggered with each other.

Specifically, in one embodiment, when the heat discharging element 123 includes a plurality of heat discharging fins arranged at intervals, a portion of the heat discharging fins may be first heat discharging fins attached to the first heat conductive plate 121, and another portion of the heat discharging fins may be second heat discharging fins attached to the second heat conductive plate 122. The first radiating fins and the second radiating fins are adjacent to each other and staggered alternately to form a comb-tooth-shaped radiating channel.

Optionally, the heat dissipating element 123 includes a plurality of heat dissipating pillars disposed at intervals, and the heat dissipating pillars are fixedly connected to the first heat conducting plate 121 and the second heat conducting plate 122 at the same time.

Specifically, in an embodiment, the heat dissipation element 123 may also be a heat dissipation column connecting the first heat conduction plate 121 and the second heat conduction plate 122, a plurality of heat dissipation columns with circular cross sections or rectangular cross sections may be disposed between the first heat conduction plate 121 and the second heat conduction plate 122, and the plurality of heat dissipation columns are disposed at intervals, on one hand, the heat dissipation columns connect and fix the first heat conduction plate 121 and the second heat conduction plate 122, and on the other hand, gaps between the heat dissipation columns may serve as air ducts for heat dissipation and ventilation.

Optionally, the radiating element 123 comprises at least one radiating pipe which is bent and coiled and is fixedly connected with the first heat conducting plate 121 and the second heat conducting plate 122 respectively, wherein the radiating pipe is used for filling cooling liquid.

Specifically, in one embodiment, the heat sink may also dissipate heat by using a water cooling method, and the heat dissipating element 123 may include at least one bent and coiled heat dissipating pipe, which is a hollow pipe and may be filled with a cooling liquid, and it is understood that a circulating pump is disposed on a circulating pipeline of the cooling liquid for circulating the cooling liquid. With above-mentioned cooling tube respectively with first heat-conducting plate 121 and second heat-conducting plate 122 fixed connection, when low-temperature cold wind liquid flowed through first heat-conducting plate 121 and second heat-conducting plate 122, accessible heat exchange took away the heat on first heat-conducting plate 121 and the second heat-conducting plate 122, realized high-efficient heat dissipation.

Referring to fig. 7 and 8, the embodiment of the present invention further provides a movable platform 2, where the movable platform 2 includes the electronic component and the heat dissipation air duct 20 of any one of the foregoing embodiments, where the first heat conduction plate 121 and the second heat conduction plate 122 constitute part of an air duct wall of the heat dissipation air duct 20, the heat dissipation element 123 is disposed in the heat dissipation air duct 20, and the heat dissipation air duct 20 includes an air inlet 201 and an air outlet 202;

the air flow passing through the heat dissipation air duct 20 can take away the heat on the heat dissipation element 123.

Specifically, as shown in fig. 7, in the embodiment of the present invention, a heat dissipation air duct 20 as shown in fig. 8 is formed by the mutual cooperation of the shells of the movable platform 2, when the electronic component disclosed in the aforementioned embodiment is installed in this heat dissipation air duct 20, the first heat conduction plate 121 and the second heat conduction plate 122 of the heat sink 12 can form part of the air duct wall of the heat dissipation air duct 20, so as to guide the flow direction of the air, and at this time, the heat dissipation element 123 is disposed in the heat dissipation air duct 20. The heat transferred from the first and second heat conduction plates 121 and 122 to the heat radiating member 123 can be rapidly discharged by the wind.

Optionally, referring to fig. 8, the movable platform 2 further includes: the fan 21 is disposed in the heat dissipation air duct 20, and the fan 21 is used for dissipating heat of the electronic component.

Specifically, as shown in fig. 8, in an embodiment, the movable platform 2 may further include a fan 21, and the fan 21 may be installed and fixed in the heat dissipation air duct 20 of the movable platform 2, and under the action of the fan 21, strong cold air may be generated, so as to achieve rapid heat dissipation of the heat sink 12.

Optionally, the fan 21 is located at the air outlet 202.

Specifically, in an embodiment, the fan 21 may be installed and fixed at the air outlet 202 of the heat dissipation air duct 20, when the fan 21 operates, the fan 21 located at the air outlet 202 drives the airflow in the heat dissipation air duct 20 to flow, and cold air with a lower temperature is sucked from the air inlet 201, and when passing through the electronic component, heat exchange occurs with the heat sink 12 in the electronic component, and the cold air is changed into hot air, so that the temperature of the electronic component is reduced, and the hot air is discharged from the air outlet 202 under the action of the airflow. The fan 21 is disposed at the air outlet 202, so as to avoid the internal space from being compact when the fan is disposed close to the interior of the heat dissipation air duct. It should be noted that, when arranging two electronic devices of an electronic assembly in practical application, the high-temperature first electronic device 10 may be arranged close to the air inlet 201, and the low-temperature second electronic device 11 may be arranged close to the air outlet 202, so that, when cold air enters the air duct 20, heat exchange is firstly completed with the high-temperature first electronic device 10, the temperature of the first electronic device 10 is reduced, reliability of components in the first electronic device 10 is preferentially improved, and for cooling control of the first electronic device 10, heat exchange may be completed through subsequent cold air.

It will be appreciated that, as for the type of the fan 21, it may be a centrifugal fan with air flow moving along the radial direction or an axial flow fan with air flow moving along the axial direction, when the axial flow fan is used, it can better guide and control the air flow direction, and can quickly draw heat away from the air outlet.

Optionally, the movable platform 2 comprises at least one of an unmanned aerial vehicle, an unmanned transport vehicle, and an unmanned ship.

Specifically, in one embodiment, the movable platform 2 includes at least one of an unmanned aerial vehicle, an unmanned transport vehicle, and an unmanned ship. It should be noted that no matter which kind of movable platform in unmanned vehicles, unmanned transport vehicles and unmanned ships, the motion of the movable platform mainly takes a motor as a driving part to generate moving power. The operation of the other devices on the movable platform 2 mainly depends on the control devices of the control system. Therefore, the movable platform 2 given by the above example may have the first electronic device 10 that generates a larger amount of heat and the second electronic device 11 that generates a smaller amount of heat. Therefore, the electronic assembly can be used in an unmanned aerial vehicle, an unmanned transport vehicle or an unmanned ship, the working stability of the electronic devices in the movable platform 2 during heating is ensured, and the working stability and reliability of the movable platform 2 are improved. As shown in fig. 7, the schematic diagram of the movable platform 2 according to the embodiment of the present invention is given as an unmanned aerial vehicle, and the electronic component may be installed inside the unmanned aerial vehicle.

Optionally, the movable platform 2 is an unmanned aerial vehicle, and the heat dissipation element 123 is fixed in a heat dissipation air duct of a central body of the unmanned aerial vehicle, or the heat dissipation element 123 is fixed at a position of a blade motor of the unmanned aerial vehicle.

Specifically, in one embodiment, when the movable platform 2 is an unmanned aerial vehicle, the unmanned aerial vehicle may have a housing of the body, and a heat dissipation duct may be formed in the housing, and the heat dissipation element 123 may be fixed in the heat dissipation duct of the central body of the unmanned aerial vehicle to dissipate the main heat in the body. The flight of the unmanned aerial vehicle depends on a paddle motor for driving the paddle to rotate, the electronic speed regulator and the like are arranged in the machine body in a centralized mode, the electronic speed regulator can be arranged at the position of the paddle motor under the condition that space allows, accordingly, the heat dissipation element 123 can be fixed at the position of the paddle motor of the unmanned aerial vehicle, and it can be understood that the heat sink is arranged and fixed at the position, the first heat conduction plate 121 of the heat sink is used for being connected with the electronic speed regulator of the first electronic device 10, the second heat conduction plate 122 of the heat sink is used for being connected with the second electronic device 11, and when the paddle motor rotates, airflow disturbance caused by rotation of the paddle can be utilized to accelerate heat dissipation.

Referring to fig. 9, an embodiment of the present invention further provides an electronic assembly, which includes a first electronic device 10, a second electronic device 11, and a heat sink 12;

the heat sink 12 includes a first heat-conducting surface 124 and a second heat-conducting surface 125, and the first heat-conducting surface 124 and the second heat-conducting surface 125 are different surfaces. Wherein, the different planes are different planes. That is, the first heat transfer surface 124 and the second heat transfer surface 125 are located on different planes. In one embodiment, the plane of the first heat transfer surface 124 is parallel to the plane of the second heat transfer surface. In another embodiment, the plane of the first heat transfer surface 124 and the plane of the second heat transfer surface form an angle therebetween. The included angle is larger than 0 and smaller than 180 degrees.

The first electronic device 10 is fixed on the first heat-conducting surface 124, the second electronic device 11 is fixed on the second heat-conducting surface 125, and the heat generated by the first electronic device 10 is larger than the heat generated by the second electronic device 11.

Specifically, as shown in fig. 9, the embodiment of the present invention also provides another electronic component, which includes a first electronic device 10, a second electronic device 11, and a heat sink 12. In this configuration, the heat sink 12 includes a first heat-conducting surface 124 and a second heat-conducting surface 125. The first heat-conducting surface 124 and the second heat-conducting surface 125 are not on the same plane, and may have an included angle therebetween, so that the two surfaces are staggered. Specifically, the heat sink 12 with an included angle may be obtained by bending a metal plate through a sheet metal process, and two surfaces of the heat sink 12 forming the included angle are the first heat conduction surface 124 and the second heat conduction surface 125. The first electronic component 10 is fixed to the first heat-conducting surface 124, and the second electronic component 11 is fixed to the second heat-conducting surface 125. Thus, the first electronic component 10 generating a large amount of heat and the second electronic component 11 generating a small amount of heat are separately provided, and the influence of mutual heat radiation can be avoided.

Alternatively, referring to fig. 9, the first heat transfer surface 124 and the second heat transfer surface 125 abut.

Specifically, as shown in fig. 9, in one embodiment, the first heat conduction surface 124 and the second heat conduction surface 125 may be two surfaces that are adjacent to each other after being bent by a metal plate.

Alternatively, referring to fig. 10, the first heat conduction surface 124 and the second heat conduction surface 125 are respectively located at the upper and lower sides of the heat sink 12.

Specifically, as shown in fig. 10, in one embodiment, the heat sink 12 may be a U-shaped member formed by bending a sheet metal, and the first heat-conducting surface 124 and the second heat-conducting surface 125 are respectively located at the upper and lower sides of the heat sink 12, and the middle portions are connected by a transition portion.

It should be noted that, in practical application, which kind of structural shape of the heat sink 12 is adopted may be determined according to the actual size of the first electronic device 10 and the second electronic device 11 and the size of the installation space, and the embodiment of the present invention does not restrict this.

Optionally, referring to fig. 11, the heat sink 12 further includes a heat dissipation element 123, and the heat dissipation element 123 is disposed on another surface opposite to the first heat conduction surface 124 and/or another surface opposite to the second heat conduction surface 125.

Specifically, as shown in fig. 11, in the heat sink 12 formed by a single metal plate, a heat dissipation element 123 may be further provided on the other surface opposite to the heat conduction surface, and the heat dissipation element 123 may be separately provided on the other surface opposite to the first heat conduction surface 124, may be separately provided on the other surface opposite to the second heat conduction surface 125, may be provided on both surfaces, and a corresponding heat dissipation scheme may be selected according to the electronic device.

It will be appreciated that in such a heat sink 12 constructed from a single sheet metal piece, the heat-dissipating component 123 employed may likewise comprise a plurality of spaced-apart heat-dissipating fins. That is, the heat dissipation area can be increased by the heat dissipation fin structure as well.

Alternatively, the first electronic device 10 is a strong current component, and the second electronic device 11 is a weak current component. In one embodiment, the voltage of the first electronic device 10 is greater than or equal to a threshold value, and the voltage of the second electronic device 11 is less than the threshold value. For example, the threshold is 12V.

Specifically, in one embodiment, the first electronic device 10 may be a strong current component, and the second electronic device 11 may be a weak current component. It should be noted that the strong electric component refers to a component in which the energy form of electric energy changes at the input and output terminals of the electronic device, and such a component usually operates with a higher direct current voltage (for example, 12V voltage), for example; power supply related management devices, motors for converting electrical energy into mechanical energy, controller assemblies thereof, and the like. The weak current component refers to a component in which the energy form of electric energy at the input end and the output end of the electronic device is not changed, and the component generally adopts lower direct current voltage (for example, 3V or 5V voltage) to work, for example; flight control processors, positioning devices, and the like. Of course, the heat output of first electronic device 10 and second electronic device 11 is high and low relatively, and when first electronic device 10 was the weak current subassembly, second electronic device 11 was the forceful electric power subassembly, the embodiment of the utility model provides a no longer describe to this.

The electronic component in the embodiment of the present invention can guide the heat of the first electronic device to the heat dissipation element through the first heat conduction plate, and guide the heat of the second electronic device to the heat dissipation element through the second heat conduction plate; the first heat-conducting plate with the relative setting of second heat-conducting plate has avoided first electron device and the thermal radiation interference that second electron device homonymy set up and arouse, can improve electronic component's radiating efficiency, promotes the working property of electricity device.

Referring to fig. 12, the present invention provides another electronic assembly, including:

a first heat source 10, connected to a first region 126 of the heat sink 12,

a second heat source 11 connected to a second region 127 of the heat sink 12, the second region 127 being located at a different location of the heat sink 12 than the first region 126; and

the heat sink 12 is configured to dissipate heat from the first heat source 10 and the second heat source 11;

wherein heat generated by the first heat source 10 is conducted to the first region 126 of the heat sink 12 and heat generated by the second heat source 11 is conducted to the second region 127 of the heat sink 12; the heat generated by the first heat source 10 is greater than the heat generated by the second heat source 11.

Specifically, as shown in fig. 12, in another embodiment of the present invention, two heat sources with different heat quantities included in the electronic component can be respectively connected to different areas of the heat sink 12. It should be noted that the different areas connected by different heat sources may be different areas separated by a preset distance on the same surface, or two completely different planes. For example, as shown in fig. 12, the first heat source 10 may be connected to a first region 126 of the first surface of the heat sink 12, the second heat source 11 may be connected to a second region 127 of the second surface of the heat sink 12, and a distance L between the first region 126 and the second region 127 is greater than a predetermined distance, so that heat generated by the first heat source 10 may be conducted to the first region 126, heat generated by the second heat source 11 may be conducted to the second region 127, and thermal radiation influence caused by too close distance between the first heat source 10 and the second heat source 11 may be avoided.

Alternatively, referring to fig. 12, the first region 126 and the second region 127 are located on different planes.

In particular, as shown in fig. 12, in one embodiment, the first zone 126 for connecting the first heat source 10 and the second zone 127 for connecting the second heat source 11 may be different planes, in which case the two different heat sources are connected in different planes, which are more easily spatially separated from each other, with a greatly reduced risk of mutual thermal radiation effects.

Optionally, the voltage of the first heat source 10 is greater than or equal to a threshold, and the voltage of the second heat source 11 is less than the threshold.

Specifically, in one embodiment, the first heat source 10 may be a strong current component, and the second heat source 11 may be a weak current component. It should be noted that the strong electric component refers to a component in which the energy form of the electric energy changes at the input and output ends of the heat source, and such a component usually works with a higher direct current voltage (for example, 12V); power supply related management devices, motors for converting electrical energy into mechanical energy, controller assemblies thereof, and the like. The weak current component refers to a component in which the energy form of the electric energy at the input end and the output end of the heat source is not changed, and the component generally adopts lower direct current voltage (for example, 3V or 5V voltage) to work, for example; flight control processors, positioning devices, and the like. Certainly, the heat output of first heat source 10 and second heat source 11 is high or low relatively, and when first heat source 10 was the weak current subassembly, second heat source 11 was the strong current subassembly, the embodiment of the utility model discloses no longer describe to this.

Optionally, the first heat source 10 and the first heat source 11 share the same heat dissipation channel 128 for heat dissipation.

Specifically, in the electronic component, a heat dissipation channel 128 may be further designed in the heat sink 12, and after the first heat source 10 is connected to the first region 126 of the heat sink 12 and the second heat source 11 is connected to the second region 127 of the heat sink 12, the heat collected by the first region 126 and the heat collected by the second region 127 may be simultaneously dissipated through the heat dissipation channel 128, that is, both the first heat source 10 and the second heat source 11 may be transferred to the heat dissipation channel 128. Therefore, a heat dissipation channel does not need to be designed for each heat source independently, the size of the electronic assembly is reduced, and the installation space is saved.

The embodiment of the utility model provides an in electronic component, the heat branch that can produce first heat source and second heat source is guided to the region of difference, has avoided first heat source and second heat source to be close to the thermal radiation interference that arouses each other, can improve electronic component's radiating efficiency, promotes electrical device's working property.

The above-described embodiments of the apparatus are merely illustrative, and the units described as separate parts may or may not be physically separate, and parts displayed as units may or may not be physical units, may be located in one place, or may be distributed on a plurality of network units. Some or all of the modules may be selected according to actual needs to achieve the purpose of the solution of the present embodiment. One of ordinary skill in the art can understand and implement it without inventive effort.

Reference herein to "one embodiment," "an embodiment," or "one or more embodiments" means that a particular feature, structure, or characteristic described in connection with the embodiment is included in at least one embodiment of the invention. Moreover, it is noted that instances of the word "in one embodiment" are not necessarily all referring to the same embodiment.

In the description provided herein, numerous specific details are set forth. It is understood, however, that embodiments of the invention may be practiced without these specific details. In some instances, well-known methods, structures and techniques have not been shown in detail in order not to obscure an understanding of this description.

In the claims, any reference signs placed between parentheses shall not be construed as limiting the claim. The word "comprising" does not exclude the presence of elements or steps not listed in a claim. The word "a" or "an" preceding an element does not exclude the presence of a plurality of such elements. The invention can be implemented by means of hardware comprising several distinct elements, and by means of a suitably programmed computer. In the unit claims enumerating several means, several of these means may be embodied by one and the same item of hardware. The usage of the words first, second and third, etcetera do not indicate any ordering. These words may be interpreted as names.

Finally, it should be noted that: the above embodiments are only used to illustrate the technical solution of the present invention, and not to limit it; although the present invention has been described in detail with reference to the foregoing embodiments, it should be understood by those skilled in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some technical features may be equivalently replaced; such modifications and substitutions do not depart from the spirit and scope of the present invention in its corresponding aspects.

Claims (29)

1. An electronic assembly, comprising: a first electronic device, a second electronic device, and a heat sink;

the radiator comprises a first heat-conducting plate, a second heat-conducting plate and a radiating element, wherein the first heat-conducting plate and the second heat-conducting plate are arranged oppositely, and the radiating element is fixed between the first heat-conducting plate and the second heat-conducting plate;

the first electronic device is fixed on one surface, far away from the radiating element, of the first heat conducting plate, the second electronic device is fixed on one surface, far away from the radiating element, of the second heat conducting plate, and the heat generated by the first electronic device is larger than that generated by the second electronic device.

2. The electronic assembly of claim 1,

the first electronic device comprises a first electronic element and a first circuit board, and the first circuit board carries the first electronic element;

the second electronic device includes a second electronic component and a second circuit board that carries the second electronic component.

3. The electronic assembly of claim 2, wherein the first circuit board is secured to the first thermally conductive plate and the second circuit board is secured to the second thermally conductive plate.

4. The electronic assembly of claim 3,

the first electronic component comprises at least one of a power assembly driver, an electronic speed regulator, a power distribution device and a battery management device.

5. The electronic assembly of claim 4,

the power component driver is a holder motor driver or a blade motor driver.

6. The electronic assembly of claim 2,

the first electronic element comprises an electronic speed regulator and a power distribution device, and the electronic speed regulator and the power distribution device are integrally arranged on the first circuit board.

7. The electronic assembly of claim 1,

the second electronic device comprises at least one of a flight control processor, a radio frequency device, an image transmission device and a positioning device.

8. The electronic assembly of claim 1,

a space for heat dissipation is formed between the first heat conduction plate and the second heat conduction plate.

9. The electronic assembly of claim 1,

the radiating element comprises a plurality of radiating fins arranged at intervals, and the radiating fins are fixedly connected with the first heat-conducting plate and the second heat-conducting plate.

10. The electronic assembly of claim 9,

the first heat-conducting plate, the second heat-conducting plate and the radiating fins are integrally formed.

11. The electronic assembly of claim 10, wherein the heat dissipating fins comprise a first heat dissipating fin and a second heat dissipating fin, one end of the first heat dissipating fin is fixedly connected to the first heat conducting plate, one end of the second heat dissipating fin is fixedly connected to the second heat conducting plate, and a free end of the first heat dissipating fin and a free end of the second heat dissipating fin are staggered from each other.

12. The electronic assembly of claim 1,

the radiating element comprises a plurality of radiating columns arranged at intervals, and the radiating columns are fixedly connected with the first heat-conducting plate and the second heat-conducting plate at the same time.

13. The electronic assembly of claim 1,

radiating element includes the cooling tube that at least one crooked was spiraled, the cooling tube respectively with first heat-conducting plate with second heat-conducting plate fixed connection, wherein, the cooling tube is used for filling the coolant liquid.

14. A movable platform, comprising: the electronic assembly and heat dissipation duct of any of claims 1-13, wherein the first thermally conductive plate and the second thermally conductive plate form a portion of a duct wall of the heat dissipation duct, the heat dissipation element is disposed within the heat dissipation duct, and the heat dissipation duct includes an air inlet and an air outlet;

the air flow passing through the heat dissipation air duct can take away the heat on the heat dissipation element.

15. The movable platform of claim 14, further comprising: the fan is arranged in the heat dissipation air channel and used for dissipating heat of the electronic assembly.

16. The movable platform of claim 15, wherein the fan is located at the air outlet.

17. The movable platform of claim 16, wherein the fan is a centrifugal fan or an axial fan.

18. The movable platform of claim 17,

the movable platform includes at least one of an unmanned aerial vehicle, an unmanned transport vehicle, and an unmanned ship.

19. The movable platform of claim 18,

the movable platform is an unmanned aerial vehicle, and the heat dissipation element is fixed in a heat dissipation air duct of a central body of the unmanned aerial vehicle, or the heat dissipation element is fixed at the position of a blade motor of the unmanned aerial vehicle.

20. An electronic assembly, comprising a first electronic device, a second electronic device, and a heat sink;

the radiator comprises a first heat conduction surface and a second heat conduction surface, and the first heat conduction surface and the second heat conduction surface are different surfaces;

the first electronic device is fixed on the first heat-conducting surface, the second electronic device is fixed on the second heat-conducting surface, and the heat generated by the first electronic device is larger than that generated by the second electronic device.

21. The electronic assembly of claim 20,

the first and second heat transfer surfaces are contiguous.

22. The electronic assembly of claim 20,

the first heat conduction surface and the second heat conduction surface are respectively positioned at the upper side and the lower side of the radiator.

23. The electronic assembly of claim 20,

the heat sink further comprises a heat dissipation element, and the heat dissipation element is arranged on the other surface opposite to the first heat conduction surface and/or the other surface opposite to the second heat conduction surface.

24. The electronic assembly of claim 23,

the heat dissipation element comprises a plurality of heat dissipation fins arranged at intervals.

25. The electronic assembly of claim 20,

the voltage of the first electronic device is greater than or equal to a threshold value, and the voltage of the second electronic device is less than the threshold value.

26. An electronic assembly, comprising:

a first electronic device connected to the first region of the heat spreader,

a second electronic device connected to a second region of the heat sink, the second region being located at a different location of the heat sink than the first region; and

the heat radiator is used for radiating heat of the first electronic device and the second electronic device;

wherein heat generated by the first electronic device is conducted to the first region of the heat sink and heat generated by the second electronic device is conducted to the second region of the heat sink; the first electronic device generates a greater amount of heat than the second electronic device.

27. The electronic assembly of claim 26,

the first region and the second region are located on different planes.

28. The electronic assembly of claim 26,

the voltage of the first electronic device is greater than or equal to a threshold value, and the voltage of the second electronic device is less than the threshold value.

29. The electronic assembly of claim 28,

the first electronic device and the second electronic device share the same heat dissipation channel for heat dissipation.

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