CN218244190U - Heat radiation structure and electronic equipment - Google Patents

Abstract

The embodiment of the application discloses a heat dissipation structure and electronic equipment, and relates to the technical field of electronic equipment radiators. The heat radiation structure that this application embodiment provided includes: the heat dissipation device comprises at least two heat dissipation parts, a first heat conduction part and an adjusting component, wherein the at least two heat dissipation parts are respectively arranged in different heat dissipation areas and used for dissipating heat of the heat dissipation areas, and the different heat dissipation areas correspond to at least one heat generation part; the first heat-conducting piece is arranged between the heat dissipation piece and the heat dissipation area and is communicated with the heat dissipation pieces of at least two different heat dissipation areas; and the adjusting assembly is arranged between the at least two radiating pieces and is used for adjusting the radiating parameters of the at least two radiating pieces. The heat radiation structure that this application embodiment provided is used for dispelling the heat to the part that generates heat.

Description

Heat radiation structure and electronic equipment

Technical Field

The embodiment of the application relates to the technical field of electronic equipment radiators, in particular to a heat dissipation structure and electronic equipment.

Background

When the electronic equipment works, each electronic element generates heat, and if the heat cannot be dissipated in time, the normal operation of the electronic equipment can be influenced, the electronic elements in the electronic equipment can be damaged, and even the electronic equipment explodes or catches fire. With the development of electronic devices toward miniaturization and integration, the heat dissipation space in the electronic devices is also less and less, so it is important to add auxiliary devices to dissipate heat of the electronic devices, for example, the heat dissipation structure can be added to dissipate heat of the electronic devices.

Generally, an electronic device includes a plurality of heating elements, and for example, an electronic device is a computer, and the computer includes main heating elements such as a Central Processing Unit (CPU), a Graphics Processing Unit (GPU), a Voltage Regulator Module (VRM), and the like. Moreover, the electronic components in the electronic device are arranged in different areas, and correspondingly have different heat dissipation areas,

at present, the form of the heat dissipation structure of the electronic equipment is single, the heat dissipation structure cannot be well applied to a plurality of heat dissipation areas, and the heat dissipation efficiency of the electronic equipment is low.

SUMMERY OF THE UTILITY MODEL

The technical scheme of the embodiment of the application is realized as follows:

in a first aspect, an embodiment of the present application provides a heat dissipation structure, including: at least two heat dissipation members, a first heat conduction member, and an adjustment assembly. The heat dissipation device comprises at least two heat dissipation parts, at least one heat dissipation part and at least one heating component, wherein the at least two heat dissipation parts are respectively arranged in different heat dissipation areas and used for dissipating heat of the heat dissipation areas; the first heat-conducting piece is arranged between the heat dissipation piece and the heat dissipation area and is communicated with at least two heat dissipation pieces corresponding to different heat dissipation areas; the adjusting assembly is arranged between the at least two heat dissipation elements and used for adjusting heat dissipation parameters of the at least two heat dissipation elements.

The heat radiation structure that this application embodiment provided, through setting up first heat-conducting piece with the radiating piece heat transfer of difference link together, can make the heat transmit between the radiating piece of difference to make the temperature distribution between the radiating piece more even, can reduce the highest temperature of radiating piece, avoid electronic component because the high temperature leads to operating speed to slow down, lead to the situation that electronic component damaged even. Meanwhile, by adding the adjusting assembly, the heat dissipation parameters of the heat dissipation part can be adjusted, and the heat dissipation efficiency of the heat dissipation part is improved. Therefore, the heat dissipation structure provided by the embodiment of the application can be well suitable for a plurality of heat dissipation areas, and the heat dissipation efficiency of the electronic equipment is improved.

In a possible implementation manner of the present application, the heat dissipation area, the first heat conduction member, and the heat dissipation member are sequentially stacked, the first heat conduction member is disposed on a side of the heat dissipation member facing the heat dissipation area, and the first heat conduction member is capable of transferring heat between the heat dissipation members.

In one possible implementation manner of the present application, the first heat conduction member is disposed to extend along a longest connection line between the disposition positions of the heat dissipation member.

In one possible implementation of the present application, the adjustment assembly includes: and the second heat conduction piece is arranged between the main body structures of the at least two heat dissipation pieces and used for transferring heat between the at least two heat dissipation pieces, wherein the relative distance between the second heat conduction piece and the heat dissipation area is larger than the relative distance between the first heat conduction piece and the heat dissipation area.

In one possible implementation of the present application, the adjustment assembly includes: the fan, the fan is provided with two at least air outlets, and two at least air outlets correspond with two at least radiating pieces and set up.

In one possible implementation manner of the present application, the heat dissipation member is a fin heat sink, the fin heat sink includes a plurality of groups of fins arranged at intervals, and an extending direction of a space between the fins is parallel to or perpendicular to an extending direction of the air outlet.

In a possible implementation manner of the present application, the fin heat sink is provided with an air duct along an extending direction of the air outlet corresponding to the fin heat sink, and one end of the air duct, which is far away from the air outlet, is closed.

In a possible implementation of the application, the adjusting assembly comprises a liquid cooling system, the liquid cooling system comprises cooling liquid and liquid cooling pipelines, the liquid cooling pipelines are in heat conduction connection with the plurality of heat dissipation pieces, and the cooling liquid can flow along the liquid cooling pipelines to cool the heat dissipation pieces.

In one possible implementation manner of the present application, the heat dissipation structure further includes a temperature sensor and a controller, and the controller can control the rotation speed of the fan according to the temperature collected by the temperature sensor.

In a second aspect, embodiments of the present application provide an electronic device, which includes a main board, a heat-generating component, and the first aspect provides a heat dissipation structure, which is thermally connected to the heat-generating component for dissipating heat from the heat-generating component.

Because the electronic equipment that this application embodiment provided includes the heat radiation structure that the first aspect provided, consequently have same technological effect, namely: the heat dissipation structure is suitable for a plurality of heat dissipation areas, and improves the heat dissipation efficiency of the electronic equipment.

Drawings

Fig. 1 is a schematic overall structural view (oblique view from top to bottom) of a heat dissipation structure provided in an embodiment of the present application;

fig. 2 is a schematic overall structural diagram (an oblique view from bottom to top) of the heat dissipation structure according to the embodiment of the present application;

fig. 3 is a schematic view illustrating a heat pipe disposed in a first heat-conducting member of a heat dissipation structure according to an embodiment of the present application;

fig. 4 is a detailed schematic view of a heat pipe arranged in a first heat conducting member of the heat dissipation structure according to the embodiment of the present application;

fig. 5 is a schematic view illustrating a second heat-conducting member of the heat dissipation structure according to an embodiment of the present application;

fig. 6 is a schematic view of a fan of a heat dissipation structure according to an embodiment of the present disclosure;

fig. 7 is a schematic view of an air duct of a heat dissipation structure according to an embodiment of the present application.

Reference numerals are as follows:

1-a heat sink; 11-a first heat sink; 12-a second heat sink; 2-a first thermally conductive member; 21-a first thermally conductive member substrate; 22-heat conducting glue; 23-a first heat pipe; 3-a regulating component; 31-a second thermally conductive member; 311-a second heat pipe; 32-a fan; 321-an air outlet; 4-an air duct; 5-a metal plate; 6-fastening piece.

Detailed Description

In order to make the objects, technical solutions and advantages of the embodiments of the present application clearer, specific technical solutions of the present application will be described in further detail below with reference to the accompanying drawings in the embodiments of the present application. The following examples are intended to illustrate the present application but are not intended to limit the scope of the present application.

In the embodiments of the present application, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or to implicitly indicate the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of the embodiments of the present application, "a plurality" means two or more unless otherwise specified.

In addition, in the embodiments of the present application, directional terms such as "upper", "lower", "left", and "right" are defined with respect to the schematically-placed orientation of components in the drawings, and it is to be understood that these directional terms are relative concepts, which are used for descriptive and clarifying purposes, and may be changed accordingly according to changes in the orientation in which the components are placed in the drawings.

In the embodiments of the present application, unless otherwise explicitly specified or limited, the term "connected" is to be understood broadly, for example, "connected" may be fixedly connected, detachably connected, or integrally formed; may be directly connected or indirectly connected through an intermediate.

In the embodiments of the present application, the terms "include", "include" or any other variations are intended to cover non-exclusive inclusions, so that a process, a method, an article, or an apparatus including a series of elements includes not only those elements but also other elements not explicitly listed, or further includes elements inherent to such a process, a method, an article, or an apparatus. Without further limitation, an element defined by the phrases "comprising a component of' 8230; \8230;" does not exclude the presence of another like element in a process, method, article, or apparatus that comprises the element.

In the embodiments of the present application, the words "exemplary" or "such as" are used herein to mean serving as an example, instance, or illustration. Any embodiment or design described herein as "exemplary" or "e.g.," is not necessarily to be construed as preferred or advantageous over other embodiments or designs. Rather, use of the word "exemplary" or "such as" is intended to present concepts related in a concrete fashion.

The embodiment of the application provides an electronic device, and the commonly used electronic devices are of various types, such as a desktop computer, a notebook computer, a tablet computer, a mobile phone, a television and the like. Generally, electronic devices include electronic components with different functions, and during operation of the electronic devices, the electronic components generate heat, and the heat-generating electronic components form heat-generating components. Meanwhile, in order to ensure the installation of the electronic element, the electronic equipment further comprises a mainboard, the mainboard is a carrier for installing the electronic element, and the heating component is arranged on the mainboard. It should be noted that the motherboard is not particularly limited to a motherboard of a desktop computer, and in the embodiments of the present application, any substrate on which an electronic component is mounted may be referred to as a motherboard, and for example, a Printed Circuit Board (PCB) of a general electronic device may be referred to as a motherboard.

In addition, as electronic devices are miniaturized and integrated, a special heat dissipation structure is generally provided to dissipate heat of the electronic devices. Specifically, the heat dissipation structure is connected to the heat generating component in a heat transferring manner, so that heat of the electronic equipment can be dissipated.

The embodiment of the application provides a heat dissipation structure, which is used for dissipating heat of electronic equipment, and for better describing the heat dissipation structure provided by the embodiment of the application, a desktop computer is taken as an example to explain the heat dissipation structure.

For a desktop computer, the main heat generating components are CPU, GPU, memory, VRM, etc., different heat generating components form different heat dissipating areas, and the same heat dissipating area may correspond to a plurality of heat generating components. Compared with the related art, the heat dissipation structure provided by the embodiment of the application can be well suitable for a plurality of heat dissipation areas, and the heat dissipation efficiency of the electronic equipment is improved.

Specifically, referring to fig. 1, the heat dissipation structure provided in the embodiment of the present application includes: at least two heat dissipation members 1 respectively disposed in different heat dissipation areas for dissipating heat from the heat dissipation areas, wherein the different heat dissipation areas correspond to at least one heat generating component; the first heat-conducting piece 2 is arranged between the heat dissipation piece and the heat dissipation area and is communicated with at least two heat dissipation pieces corresponding to different heat dissipation areas; and the adjusting assembly 3 is arranged between the at least two radiating pieces and used for adjusting the radiating parameters of the at least two radiating pieces.

Referring to fig. 1, an exemplary diagram of a heat dissipation structure according to an embodiment of the present application is provided. In fig. 1, the heat dissipation structure provided in the embodiment of the present application is described by taking two heat dissipation members 1 as an example, and for convenience of distinction, the two heat dissipation members 1 are referred to as a first heat dissipation member 11 and a second heat dissipation member 12, respectively. It should be noted that the number of the heat sink 1 is not limited in the embodiment of the present application. More than two heat dissipation elements 1 may be provided with reference to fig. 1. The first heat dissipation element 11 and the second heat dissipation element 12 may be disposed corresponding to the CPU and the GPU, respectively, or may be disposed corresponding to the CPU and the VRM, or may be disposed corresponding to other heat dissipation areas. In addition, in the case where one electronic component includes a plurality of electronic components, the heat sink 1 may be provided for each electronic component, for example, a VRM of a computer includes a plurality of voltage regulator components, the heat sink 1 may be provided for each voltage regulator component, or the plurality of voltage regulator components may be divided into regions, the whole VRM may be divided into several regions, and then one heat sink 1 may be provided for each region. Meanwhile, the voltage regulator may be used to explain the heat dissipation area in the present application, for example, one heat dissipation member 1 may be arranged corresponding to a plurality of voltage regulators, and in this case, one heat dissipation area corresponds to a plurality of voltage regulators, that is, one heat dissipation area corresponds to a plurality of heat generating components.

In the present embodiment, the heat dissipation area may refer to a surface of a heat generating component, or may refer to an area formed around one heat generating component or two or more heat generating components.

In addition, in the heat dissipation structure provided in the embodiment of the present application, a first heat conduction member 2 is further included, and by way of example, referring to fig. 1, the first heat conduction member 2 is disposed between the heat dissipation member 1 and the heat dissipation region, and connects the heat dissipation members 1 corresponding to the two different regions together. Thus, the first heat conduction member 2 can transfer heat of the heat generating component to the heat radiating member 1, and the temperature of the heat generating component can be reduced after the heat radiating member 1 is cooled. In addition, the heat dissipation structure that this application embodiment provided still includes adjusting part 3, and adjusting part 3 sets up between at least two heat dissipation pieces 1 for adjust the heat dissipation parameter of heat dissipation piece 1. It should be noted that, in fig. 1, a heat dissipation area is not shown, and the heat dissipation area is located on a side of the first heat conduction member 2 away from the heat dissipation member 1, and for example, the heat dissipation area is located below the first heat conduction member 2 by taking the direction in fig. 1 as an example.

In order to explain the process of the heat sink 1 for dissipating heat from the heat generating component, the air-cooled heat sink is simply explained as follows:

the heat flow rate of the heat sink 1 transferring heat to the surrounding air is mainly related to parameters such as the thermal conductivity of the heat sink 1, the heat dissipation area of the heat sink 1, the efficiency of the heat sink 1, and the difference between the maximum temperature of the heat sink 1 and the ambient temperature. The adjusting component 3 of the heat dissipation structure provided by the embodiment of the present application can adjust one or more of the above parameters.

By way of example, one of the main effects of the thermal conductivity is radiation heat dissipation or convection heat dissipation, which is more efficient than radiation heat dissipation, so that, in some embodiments of the present application, the adjusting assembly 3 can improve the radiation heat dissipation of the heat dissipation member 1 into convection heat dissipation, thereby adjusting the heat dissipation parameters of the heat dissipation member 1.

It should be noted that, because the heat of different heat dissipation areas is generally different, the temperatures of different heat dissipation areas are also different, the temperatures of the heat dissipation members 1 corresponding to different heat dissipation areas are also different, and the difference between the maximum temperature of the heat dissipation member 1 and the ambient temperature is also an important heat dissipation parameter of the heat dissipation member 1, so in some embodiments of the present application, a heat conduction member is provided to connect different heat dissipation members 1 together, so that the heat can be transferred between different heat dissipation members 1, thereby adjusting the maximum temperature of the heat dissipation member 1, and further adjusting the heat dissipation parameter of the heat dissipation member 1.

It should be noted that the shapes of the heat sink 1, the first heat conduction member 2, and the adjustment assembly 3 are not limited in the embodiments of the present application, and may be selected according to actual situations, for example, when the heat sink 1 is disposed corresponding to a CPU, the shape of the heat sink 1 may be set to an approximately square shape corresponding to the shape of the CPU, when the heat sink 1 is disposed corresponding to a VRM, the shape of the heat sink 1 may be set to an approximately rectangular shape corresponding to a VRM module, and the first heat conduction member 2 and the adjustment assembly 3 may also be disposed with reference to the arrangement of the heat sink 1. In addition, the material of the heat sink 1, the first heat conducting element 2, and the adjusting assembly 3 is not limited in the embodiment of the present application, and may be set according to the heat conductivity coefficients of different materials, for example, the heat sink 1, the first heat conducting element 2, and the adjusting assembly 3 may be set to copper, which has a better heat dissipation coefficient, but the copper material is softer and is not suitable for the situation with a higher requirement on strength; in addition, also can choose for use the aluminum alloy to set up radiating piece 1, first heat-conducting piece 2 and adjusting part 3, the aluminum alloy has higher intensity, also has better coefficient of heat dissipation simultaneously, this application embodiment does not prescribe a limit to this, can carry out the adaptability according to radiating piece 1, first heat-conducting piece 2 and adjusting part 3's structural feature and select. Referring to fig. 1 and 2, the subject structure of the first heat conduction member 2 may be configured as a first heat conduction member substrate 21, so that the first heat conduction member substrate 21 may also provide a mounting base for the heat dissipation member 1 at the same time, and at the same time, in order to increase a contact area between the first heat conduction member substrate 21 and an electronic component and to make contact between the first heat conduction member substrate 21 and the electronic component tight, the first heat conduction member further includes a heat conduction paste 22. Referring to fig. 2, in order to adapt the first heat-conducting member 2 to the space requirement for contacting with the electronic component, other structures may be provided on the first heat-conducting member 2, for example, in fig. 2, a convex structure is provided below the first heat-conducting member to adapt to the contact with the electronic component or the motherboard.

Referring to fig. 3 and 4, in order to improve the heat transfer efficiency of the first heat conduction member, a heat pipe 23 is further provided in the first heat conduction member.

The heat radiation structure that this application embodiment provided, through setting up first heat-conducting piece 2 with the heat dissipation piece 1 heat transfer connection of difference together, can make the heat transmit between the heat dissipation piece 1 of difference to it is more even to make the temperature distribution between the heat dissipation piece 1, can reduce the highest temperature of heat dissipation piece 1, avoids electronic component to lead to the operating speed to slow down, lead to the situation that electronic component damaged even because the high temperature. Meanwhile, by adding the adjusting component 3, the heat dissipation parameters of the heat dissipation member 1 can be adjusted, and the heat dissipation efficiency of the heat dissipation member 1 is improved.

On this basis, in some embodiments of the present application, the heat dissipation area, the first heat conduction member 2, and the heat dissipation member 1 are sequentially stacked, and the first heat conduction member 2 is disposed on the side of the heat dissipation member 1 facing the heat dissipation area, and since the first heat conduction member 2 communicates with different heat dissipation members 1, the first heat conduction member 2 can transfer heat between the heat dissipation members 1.

For example, referring to fig. 1, in fig. 1, the first heat dissipation element 11 and the second heat dissipation element 12 are independent of each other and correspond to different heat dissipation regions, respectively, and the heat dissipation regions, the first heat conduction element 2, and the heat dissipation element 1 are stacked in this order. Specifically, the first heat conduction member 2 is provided on the upper surface of the heat dissipation area, and the first heat dissipation member 11 and the second heat dissipation member 12 are provided on the upper surface of the first heat conduction member 2, respectively. Referring to fig. 1, the first heat dissipation member 11 and the second heat dissipation member 12 are respectively disposed at different portions of the first heat conduction member 2, and the first heat conduction member 2 can transfer heat between the first heat dissipation member 11 and the second heat dissipation member 12, for example, when the temperature of one of the heat dissipation members 1 is high, heat can be transferred to the other heat dissipation member 1 through the first heat conduction member 2. In this way, the first heat-conducting member 2 can transfer heat between the heat-dissipating members 1, so that the temperature of the heat-dissipating member 1 with a higher temperature is reduced, the temperature distribution of the heat-dissipating member 1 is more uniform, the highest temperature of the heat-generating component is reduced, and the limitation of the operating speed of the heat-generating component due to overtemperature is prevented; the temperature of the heating part can be within the alarm temperature, and the service life of the corresponding electronic element is prolonged.

In the embodiment of the present invention, the size of the heat sink 1 is not limited, and for example, referring to fig. 1, the size of the first heat sink 11 may be set to be large, and the size of the second heat sink 12 may be set to be small, specifically, the first heat sink 11 may be associated with an electronic component having a large heat generation amount, and the second heat sink 12 may be associated with an electronic component having a small heat generation amount.

Further, in order to sufficiently transfer heat between the heat generating region and the heat radiating member 1, referring to fig. 1, in some embodiments of the present application, the first heat conduction member 2 is disposed to extend along the longest line between the disposed positions of the heat radiating member 1.

It should be noted that, the first heat conduction element 2 is extended along the longest connecting line between the positions of the heat dissipation element 1, and does not mean that the first heat conduction element 2 is connected to two ends of the heat dissipation element 1 away from each other along a straight line. Instead, the first heat conduction member 2 is provided along the heat dissipation member 1 and the heat dissipation area, and the first heat conduction member 2 extends along the entire length of the heat dissipation member 1 corresponding to the heat dissipation area. Illustratively, referring to fig. 1, the first heat conduction member 2 is disposed at a position connecting at least two ends of the first heat dissipation member 11 and the second heat dissipation member 12 away from each other.

In some embodiments of the present application, the adjustment assembly 3 comprises a second heat-conducting element 31, the second heat-conducting element 31 being arranged between the body structures of at least two heat dissipation members 1 for transferring heat between the heat dissipation members 1, and the relative distance between the second heat-conducting element 31 and the heat dissipation area being greater than the relative distance between the first heat-conducting element 2 and the heat dissipation area.

In brief, the distance between the second heat-conducting member 31 and the heat dissipation area is greater than the distance between the first heat-conducting member 2 and the heat dissipation area, for example, referring to fig. 1, that is, the second heat-conducting member 31 is disposed above the first heat-conducting member 2. It should be noted that, in the embodiments of the present application, the shape of the second heat conduction member 31 is not limited, and the second heat conduction member 31 may be provided in a plate-like structure, or the second heat conduction member 31 may be provided in a tubular structure, for example, referring to fig. 5, in some embodiments of the present application, the second heat conduction member 31 is the second heat pipe 311. In the present embodiment, the material of the second heat-conducting member 31 is not limited, and the material of the second heat-conducting member 31 may be copper, aluminum alloy, or other materials.

It should be noted that, in the present embodiment, the position of the second heat-conducting member 31 relative to the heat-dissipating member 1 is not limited, for example, referring to fig. 5, the second heat-conducting member 31 may pass through the main structure of different heat-dissipating members 1 to connect different heat-dissipating members 1 in heat transfer; different heat dissipation members 1 can be communicated in a heat transfer mode on the surface of the heat dissipation member 1; it is also possible to connect different heat dissipation members 1 in heat transfer communication inside one heat dissipation member 1 and on the surface of the other heat dissipation member 1.

Thus, on the basis that the first heat conduction piece 2 transfers heat among the heat dissipation pieces 1, the second heat conduction piece 31 is added to transfer heat among the heat dissipation pieces 1, the heat dissipation pieces 1 can transfer heat among a plurality of heat transfer channels, the efficiency of transferring heat among different heat dissipation pieces 1 can be improved, and the temperature distribution of the heat dissipation pieces 1 is more uniform. By providing the second heat-conducting element 31, the difference between the maximum temperature of the heat sink 1 and the ambient temperature is changed, and at the same time the efficiency of the heat sink 1 is changed, so that the heat dissipation parameters of the heat sink 1 are changed.

Furthermore, in some embodiments of the present application, the adjusting assembly 3 includes a fan 32, and in particular, the fan 32 is provided with at least two air outlets 321, and the at least two air outlets 321 are arranged corresponding to the at least two heat dissipation elements 1.

For example, referring to fig. 2 and 3, two heat sinks 1 and two air outlets 321 of the fan 32 will be described. In the embodiment of the present application, the two air outlets 321 of the fan 32 are respectively disposed corresponding to the first heat dissipation element 11 and the second heat dissipation element 12, so that the radiation heat dissipation of the heat dissipation element 1 can be improved to the convection heat dissipation, and the heat dissipation efficiency of the heat dissipation element 1 is improved.

It should be noted that, in the embodiment of the present application, the position where the fan 32 is disposed is not limited, for example, referring to fig. 1, fig. 2, and fig. 3, the fan 32 may be disposed between the heat dissipation members 1, so that the air outlet 321 of the fan 32 directly corresponds to the heat dissipation member 1; the fan 32 may be disposed at other positions, and the air outlet 321 of the fan 32 may be made to correspond to the heat sink 1 by providing an air duct. In addition, the embodiment of the present application does not limit the form of the fan 32, the fan 32 may be selected from an axial flow type, a mixed flow type, a centrifugal type, or the like, and the centrifugal fan 32 may be selected for disposing the fan 32 between the heat dissipation members 1, so that the plurality of air outlets 321 are conveniently disposed to correspond to the plurality of heat dissipation members 1; for the fan 32 disposed at other positions, the air outlet 321 is made to correspond to the heat sink 1 by disposing an air duct, and the axial flow fan 32 or the mixed flow fan 32 may be selected. The embodiment of the application does not limit the space, and reasonable selection can be performed according to the actual situation and the space requirement of the heat dissipation structure.

Referring to fig. 6, a fan of the heat dissipation structure provided in the embodiment of the present application is an example of a centrifugal fan.

On the basis, in some embodiments of the present application, referring to fig. 7, the heat sink 1 is a fin heat sink, which includes a plurality of sets of fins arranged at intervals, and the extending direction of the fins is parallel or perpendicular to the air outlet direction of the fan 32. The heat dissipation structure is characterized in that the heat dissipation part 1 of the heat dissipation structure is arranged as a fin type heat dissipation device, so that the heat dissipation area of the heat dissipation part 1 can be increased to a large extent, the heat dissipation efficiency of the heat dissipation part 1 is improved, meanwhile, the heat transfer efficiency of the heat dissipation part 1 and the heat transfer efficiency of the first heat conduction part 2 can also be improved, and the temperature distribution among the heat dissipation parts 1 is more uniform.

Further, in order to increase the flow rate of the air passing through the fin heat sink, referring to fig. 7, in some embodiments of the present application, an air duct 4 is disposed in the extending direction of the fin heat sink corresponding to the air outlet 321, and one end of the air duct 4 away from the air outlet 321 is closed. For example, referring to fig. 7, a notch structure is disposed at a middle position of the fin heat sink corresponding to the air outlet 321 of the fan 32, the notch structure forms the air duct 4, and the fin at the farthest end of the heat sink 1 away from the air outlet 321 is not provided with a notch, forming a closed structure. Thus, after the airflow at the air outlet 321 of the fan 32 enters the air duct 4 through the inlet of the air duct 4, the airflow can only flow out through the gaps between the fins, so that the airflow can fully exchange heat with the fin heat sink, and the heat exchange efficiency between the airflow and the fin heat sink is improved.

It should be noted that, in the embodiment of the present application, the shape of the cross section of the air duct 4 is not limited, and the cross section may be set according to the shape of the air outlet 321 of the fan 32 and considering factors such as convenience in processing, for example, referring to fig. 2, the cross section of the air duct 4 may be set to be rectangular, and the air duct 4 with the rectangular cross section is easy to process and implement; in addition, as for the manner of providing the air duct, the air duct 4 may be provided in a shape matching the cross section of the air duct, for example, the cross section of the air duct 4 may be provided in a circular shape.

In addition, in other embodiments of this application, adjusting part 3 includes the liquid cooling system, and the liquid cooling system includes coolant liquid and liquid cooling pipeline, and the liquid cooling pipeline is connected with a plurality of heat dissipation parts 1 heat conduction, and the coolant liquid can flow along the liquid cooling pipeline to cool off heat dissipation parts 1.

It should be noted that, there are many options for the implementation manner of the heat conduction connection between the liquid cooling pipeline and the heat dissipation member 1, for example, the liquid cooling pipeline may be set as a metal pipe, the heat dissipation member 1 is connected to the outer surface of the metal pipe, and the cooling liquid flows in the metal pipe, so that the cooling liquid completes the heat transfer between the cooling liquid and the heat dissipation member 1 through the pipe wall of the metal pipe, and the cooling liquid takes away the heat of the heat dissipation member 1, thereby cooling the heat dissipation member 1. The heat dissipation member 1 may be disposed inside the liquid cooling pipe, so that the cooling liquid can directly flow through the heat dissipation member 1 to dissipate heat of the heat dissipation member 1. And the liquid cooling pipeline is connected with the heat conduction of a plurality of radiating pieces 1 and is realized also having multiple mode, for example, can set up many liquid cooling pipelines, correspond a plurality of radiating pieces 1 respectively and be connected with the heat conduction of a plurality of radiating pieces 1. A liquid cooling pipe may be provided, and one liquid cooling pipe may be connected in series to the plurality of heat radiating members 1. In order to realize that the cooling liquid flows along the liquid cooling pipeline, the liquid cooling system can be set into a passive structure, and the density difference is generated by utilizing the temperature difference between the cooling liquid outlet and the cooling liquid inlet, so that the cooling liquid is driven to circulate. In addition, also can set up the water pump on the liquid cooling pipeline and drive the coolant liquid and flow along the cooling pipeline, this application embodiment does not restrict this.

In order to realize intelligent control of the fan 32, in some embodiments of the present application, the heat dissipation structure further includes a temperature sensor and a controller, and the controller is capable of controlling the rotation speed of the fan 32 according to the temperature collected by the temperature sensor. For example, a temperature sensor may be in thermal communication with the heat-generating component to monitor the temperature of the heat-generating component; a temperature sensor may also be connected in heat transfer connection with the heat sink 1 to monitor the temperature of the heat sink 1. Meanwhile, the temperature sensor and the fan 32 are electrically connected with the controller, the controller can acquire a temperature signal acquired by the temperature sensor and control the rotating speed of the fan 32 according to the temperature, and when the temperature measured by the temperature sensor is higher, the controller controls the fan 32 to increase the rotating speed of the fan 32 so as to accelerate the heat dissipation of the heat dissipation member 1; when the temperature measured by the temperature sensor is low, the controller controls the fan 32 to decrease the rotation speed of the fan 32, and the heat dissipation capacity of the fan 32 is matched with the temperature of the heat sink 1 to decrease the power consumption of the fan 32.

It should be noted that, referring to fig. 1, in some embodiments of the present application, a metal plate 5 is further disposed on the top of the fin heat sink, and the metal plate 5 can protect the fin heat sink, and meanwhile, can also provide a mounting base for mounting the fan 32, and the fan 32 is disposed below the metal plate 5, so that the fan 32 can be hidden, so that the whole heat dissipation structure provided in the embodiments of the present application is kept beautiful, and the visual effect is increased. Meanwhile, the metal plate 5 can be arranged by utilizing a material with a good heat conductivity coefficient, for example, the metal plate 5 can be arranged by adopting a nickel-plated aluminum sheet, so that the metal plate 5 can also play a role in heat dissipation, and the heat dissipation capability of the heat dissipation structure provided by the embodiment of the application is further improved.

It should be noted that, in some embodiments of the present application, in order to connect the heat dissipation structure and the motherboard together, a fastening member 6 is further disposed on the first heat conduction member 2, and the heat dissipation structure can be conveniently connected to the motherboard through the fastening member 6, and the heat dissipation structure is also convenient to be disassembled and maintained.

The above-mentioned serial numbers of the embodiments of the present application are merely for description and do not represent the merits of the embodiments. The above description is only a preferred embodiment of the present application, and not intended to limit the scope of the present application, and all the equivalent structures or equivalent processes that can be directly or indirectly applied to other related technical fields by using the contents of the specification and the drawings of the present application are also included in the scope of the present application.

Claims (10)

1. A heat dissipation structure, comprising:

the heat dissipation device comprises at least two heat dissipation parts, a heat dissipation part and a control part, wherein the at least two heat dissipation parts are respectively arranged in different heat dissipation areas and used for dissipating heat of the heat dissipation areas, and the different heat dissipation areas correspond to at least one heating component;

the first heat conduction element is arranged between the heat dissipation element and the heat dissipation area and is communicated with the heat dissipation elements of at least two different heat dissipation areas;

and the adjusting assembly is arranged between the at least two radiating pieces and used for adjusting the radiating parameters of the at least two radiating pieces.

2. The heat dissipation structure according to claim 1, wherein the heat dissipation region, the first heat conduction member, and the heat dissipation member are arranged in a stacked manner in this order, the first heat conduction member being provided on a side of the heat dissipation member facing the heat dissipation region, the first heat conduction member being capable of transferring heat between the heat dissipation members.

3. The heat dissipating structure of claim 1, wherein the first heat conducting member is disposed to extend along a longest line between the locations where the heat dissipating member is disposed.

4. The heat dissipation structure of claim 1, wherein the adjustment assembly comprises:

a second heat-conducting element disposed between the body structures of the at least two heat dissipation members for transferring heat between the at least two heat dissipation members, wherein a relative distance between the second heat-conducting element and the heat dissipation region is greater than a relative distance between the first heat-conducting element and the heat dissipation region.

5. The heat dissipation structure of claim 1, wherein the adjustment assembly comprises:

the fan, the fan is provided with two at least air outlets, two at least air outlets with two at least radiating pieces correspond the setting.

6. The heat dissipation structure of claim 5, wherein the heat dissipation member is a fin heat sink, the fin heat sink includes a plurality of groups of fins arranged at intervals, and the extending direction of the intervals between the fins is parallel to or perpendicular to the extending direction of the air outlet.

7. The heat dissipation structure of claim 6, wherein the fin heat sink is provided with an air duct along an extension direction of the corresponding air outlet, and an end of the air duct away from the air outlet is closed.

8. The heat dissipation structure of any one of claims 1-4, wherein the adjustment assembly comprises a liquid cooling system, the liquid cooling system comprising a cooling liquid and a liquid cooling conduit, the liquid cooling conduit being in thermally conductive communication with a plurality of the heat dissipation members, the cooling liquid being capable of flowing along the liquid cooling conduit to cool the heat dissipation members.

9. The heat dissipation structure of claim 5, further comprising a temperature sensor and a controller capable of controlling the rotation speed of the fan according to the temperature collected by the temperature sensor.

10. An electronic device, comprising:

a main board;

a heating component disposed on the main board;

the heat dissipating structure of any one of claims 1-9, being thermally coupled to the heat generating component for dissipating heat therefrom.

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