CN113796174A - Electronic assembly and movable platform - Google Patents

Abstract

An electronic assembly and a movable platform, the electronic assembly comprising: a first heat source (10), a second heat source (11) and a heat sink (12); the radiator (12) comprises a first heat-conducting plate, a second heat-conducting plate and a radiating element, wherein the first heat-conducting plate and the second heat-conducting plate are arranged oppositely, and the radiating element is fixed between the first heat-conducting plate and the second heat-conducting plate; the first heat source (10) is fixed on one surface of the first heat conduction plate far away from the radiating element, and the second heat source (11) is fixed on one surface of the second heat conduction plate far away from the radiating element, wherein the heat generated by the first heat source (10) is larger than the heat generated by the second heat source (11). The electronic component can improve the heat dissipation efficiency and the working performance of the electrical device.

Description

Electronic assembly and movable platform

Technical Field

The present invention relates to the field of electronic devices, and in particular, to an electronic component and a movable platform.

Background

With the development and progress of electronic technology, various automatic devices such as unmanned aerial vehicles and unmanned vehicles have a driving module or an electric adjusting module with high calorific value related to the realization of electric energy and mechanical conversion of motors and the like, and also have a control module with low calorific value related to a signal processing function.

In the prior art, a common layout scheme of a heat dissipation structure is to fix a driving module with higher heat productivity and a control module with lower heat productivity at the same side of a heat dissipation plate. In the scheme, the driving module and the control module are arranged on the same side, the heat emitted by the driving module is more, and the part of heat can radiate and influence the control module, so that the heat radiation efficiency around the control module is low.

Therefore, in the existing heat dissipation scheme, heat between different device modules can affect each other, which results in reduced heat dissipation efficiency and reduced working performance of electrical devices.

Disclosure of Invention

In view of this, the invention provides an electronic assembly and a movable platform to solve the problem that the heat between different device modules in the existing heat dissipation scheme affects each other, thereby reducing the heat dissipation efficiency and the working performance of the electrical device.

In a first aspect, an embodiment of the present invention provides an electronic component, where the electronic component includes: a first heat source, a second heat source and a heat sink;

the radiator comprises a first heat-conducting plate, a second heat-conducting plate and a radiating element, wherein the first heat-conducting plate and the second heat-conducting plate are arranged oppositely, and the radiating element is fixed between the first heat-conducting plate and the second heat-conducting plate;

The first heat source is fixed on one surface, far away from the radiating element, of the first heat conduction plate, the second heat source is fixed on one surface, far away from the radiating element, of the second heat conduction plate, and the heat generated by the first heat source is larger than that generated by the second heat source.

In a second aspect, an embodiment of the present invention provides a movable platform, including: the electronic component and the heat dissipation air duct of the first aspect, wherein the first heat conduction plate and the second heat conduction plate form part of an air duct wall of the heat dissipation air duct, the heat dissipation element is disposed in the heat dissipation air duct, and the heat dissipation air duct includes an air inlet and an air outlet;

the air flow passing through the heat dissipation air duct can take away the heat on the heat dissipation element.

In a third aspect, embodiments of the present invention further provide an electronic component, where the electronic component includes a first heat source, a second heat source, and a heat sink;

the radiator comprises a first heat conduction surface and a second heat conduction surface, and the first heat conduction surface and the second heat conduction surface are different surfaces.

The first heat source is fixed on the first heat conduction surface, the second heat source is fixed on the second heat conduction surface, and the heat generated by the first heat source is larger than the heat generated by the second heat source.

The electronic assembly according to the embodiment of the present invention includes at least the following advantages;

the electronic component in the embodiment of the invention can improve the heat dissipation efficiency of the electronic component and improve the working performance of an electrical device.

The foregoing description is only an overview of the technical solutions of the present invention, and the embodiments of the present invention are described below in order to make the technical means of the present invention more clearly understood and to make the above and other objects, features, and advantages of the present invention more clearly understandable.

Drawings

In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, and it is obvious that the drawings in the following description are some embodiments of the present invention, and those skilled in the art can also obtain other drawings according to the drawings without creative efforts.

FIG. 1 schematically illustrates a structural schematic of an electronic assembly of an embodiment of the present invention;

FIG. 2 schematically illustrates the schematic view of FIG. 1 along direction A of an embodiment of the present invention;

Fig. 3 schematically shows a three-dimensional structure diagram of a heat sink of an embodiment of the present invention;

FIG. 4 schematically illustrates a schematic view of a first heat source of an embodiment of the invention;

FIG. 5 schematically illustrates a schematic view of a second heat source of an embodiment of the invention;

FIG. 6 schematically illustrates a schematic view of another first heat source in accordance with an embodiment of the invention;

FIG. 7 schematically illustrates a schematic view of a movable platform of an embodiment of the present invention;

FIG. 8 schematically illustrates a schematic view of a duct of a movable platform of an embodiment of the present invention;

FIG. 9 schematically illustrates a structural view of a second electronic assembly in accordance with an embodiment of the present invention;

FIG. 10 schematically illustrates a structural view of a third electronic assembly in accordance with an embodiment of the present invention;

FIG. 11 schematically illustrates a fourth electronic assembly in accordance with an embodiment of the present invention;

fig. 12 schematically shows a structural diagram of a fifth electronic component according to an embodiment of the present invention.

DETAILED DESCRIPTION OF EMBODIMENT (S) OF INVENTION

In order to make the objects, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are some, but not all, embodiments of the present invention. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.

Referring to fig. 1 to 3, an electronic component provided by an embodiment of the present invention is illustrated, and includes: a first heat source 10, a second heat source 11, and a heat sink 12;

the heat sink 12 includes a first heat-conducting plate 121, a second heat-conducting plate 122 and a heat-dissipating element 123, the first heat-conducting plate 121 and the second heat-conducting plate 122 are oppositely disposed, and the heat-dissipating element 123 is fixed between the first heat-conducting plate 121 and the second heat-conducting plate 122;

the first heat source 10 is fixed on a surface of the first heat conduction plate 121 far away from the heat dissipation element 123, and the second heat source 11 is fixed on a surface of the second heat conduction plate 122 far away from the heat dissipation element 123, wherein the heat generated by the first heat source 10 is greater than the heat generated by the second heat source 11.

Specifically, as shown in fig. 1, an electronic component according to an embodiment of the present invention is an electronic component having a heat dissipation function, where different types of electronic components are present in the electronic component. The different types of electronic components generate different amounts of heat. The first heat source 10 may be defined as a device that generates a large amount of heat during operation, and the first heat source 10 may be a device that converts electrical energy into mechanical energy or other energy in different forms, and the device generates a large amount of heat. The second heat source 11 is defined as a heat source which generates less heat than the first heat source 10 when operated. When the first heat source 10 and the second heat source 11 are disposed on the same side, since both heat sources need to dissipate heat, the high temperature first heat source 10 instead radiates to the adjacent low temperature second heat source 11, so that the ambient temperature of the second heat source 11 continues to be difficult to reduce, thereby being unfavorable for the operation of the second heat source 11. As shown in fig. 1, in the embodiment of the present invention, the first heat source 10 and the second heat source 11 with different heat generation amounts are respectively disposed on two sides of the heat sink 12, and the heat sink 12 forms a physical isolation therebetween, which can mitigate the radiation effect of the high-temperature heat source on the low-temperature heat source in the first heat source 10 and the second heat source 11. It should be noted that the electronic component in the embodiment of the present invention may be used in a movable platform such as an unmanned aerial vehicle, an unmanned transport vehicle, and an unmanned ship, for example, when the electronic component is used in an unmanned aerial vehicle, the electronic component may also implement communication interaction with other terminal devices such as a ground map transmission and reception device while driving the unmanned aerial vehicle to perform a flying motion.

As shown in fig. 2, the heat sink 12 includes a first heat-conducting plate 121, a second heat-conducting plate 122 and a heat-dissipating member 123, the first heat-conducting plate 121 and the second heat-conducting plate 122 are respectively disposed at both sides of the heat-dissipating member 123, and the heat-dissipating member 123 may isolate the first heat-conducting plate 121 and the second heat-conducting plate 122 by a certain distance between the first heat-conducting plate 121 and the second heat-conducting plate 122, thereby preventing the first heat-conducting plate 121 and the second heat-conducting plate 122 from directly contacting each other.

As shown in fig. 3, the first heat source 10 is fixed to a side of the first heat conduction plate 121 remote from the radiating member 123, and the second heat source 11 is fixed to a side of the second heat conduction plate 122 remote from the radiating member 123. Thus, different heat transfer paths can be formed in the electronic component, for the heat generated by the first heat source 10, the heat is transferred to the heat dissipation member 123 through the first heat conduction plate 121 and dissipated, for the heat generated by the second heat source 11, the heat is transferred to the heat dissipation member 123 through the second heat conduction plate 122 and dissipated.

In the embodiment of the invention, the first heat source with larger heat dissipation capacity and the second heat source with smaller heat dissipation capacity are respectively arranged on two sides of the radiator, the first heat source is fixed on one surface, away from the heat dissipation element, of the first heat conduction plate in the radiator, and the second heat source is fixed on one surface, away from the heat dissipation element, of the second heat conduction plate in the radiator, so that the heat of the first heat source can be guided to the heat dissipation element through the first heat conduction plate, the heat of the second heat source can be guided to the heat dissipation element through the second heat conduction plate, the heat radiation interference caused by the arrangement of the first heat source and the second heat source on the same side is avoided, the heat dissipation efficiency of the electronic component can be improved, and the working performance of an electrical device is improved.

Alternatively, with reference to fig. 4 and 5, the first heat source 10 comprises a first electronic component 101 and a first circuit board 102, the first circuit board 102 carrying the first electronic component 101;

the second heat source 11 comprises a second electronic component 111 and a second circuit board 112, the second circuit board 112 carrying the second electronic component 111.

Specifically, in one embodiment, as shown in fig. 4, the first heat source 10 may include a first electronic component 101 and a first circuit board 102, and the first circuit board 102 carries the first electronic component 101. That is, when the first circuit board 102 is powered on, the first electronic component 101 is in an operating state, the temperature rises, and heat is generated, and a part of the electric energy transmitted by the first circuit board 102 to the first electronic component 101 is converted into heat energy. Similarly, as shown in fig. 5, the second heat source 11 may include a second electronic component 111 and a second circuit board 112, the second circuit board 112 carrying the second electronic component 111. When the heat generation amount of the second electronic component 111 is smaller than that of the first electronic component 101, that is, the heat generation amount of the first heat source 10 is larger than that of the second heat source 11.

Optionally, the first circuit board 102 is fixed on the first heat-conducting plate 121, and the second circuit board 112 is fixed on the second heat-conducting plate 122.

Specifically, in one embodiment, screw holes or copper columns may be reserved on the first heat conduction plate 121 and the second heat conduction plate 122, and the circuit board may be screwed and fixed by screws or fastened by nuts, so that the first circuit board 102 is fixed on the first heat conduction plate 121, and the second circuit board 112 is fixed on the second heat conduction plate 122, so that the first heat source 10 is connected to the first heat conduction plate 121, and the second heat source 11 is connected to the second heat conduction plate 122.

Optionally, the first electronic component 101 includes at least one of a power pack driver, an electronic governor, a power distribution device, and a battery management device.

Specifically, in one embodiment, the first electronic component 101 may include a power assembly driver of a power assembly with relatively large power, such as a motor, for example, a motor driver. When the motor driver works, the motor driver receives the control signal and outputs a driving signal of the motor so as to drive the motor to run according to a corresponding rotating speed rule, and a large amount of heat can be generated in the process of the motor driver. The first electronic component 101 may further include an electronic speed regulator, which is called electronic speed regulator for short, and a PWM (Pulse Width Modulation) signal output by the receiver or the flight control board is processed by an internal chip and then outputs a driving regulation signal to regulate an MOS (Metal Oxide Semiconductor) driving tube, so that the MOS driving tube regulates the output voltage and controls the operation of each motor, and thus, the electronic speed regulator is also an electronic component with a large heat generation amount. The first electronic component 101 may further include a power distribution device, which is generally a power distribution board, and the power distribution board is a circuit board for connecting a battery and an electric regulator, and divides electric energy from the battery into multiple paths to be transmitted to different device modules, so that the power distribution device is also an electronic component with a large heat generation amount. The first electronic component 111 may further include a battery management device, which is generally referred to as a power board for managing charging and discharging, and has functions of over-charging/over-current power-off and power monitoring, which may be implemented by a corresponding power management chip, and therefore, the battery management device is also an electronic component with a large heat generation amount. In practical applications, the first electronic component 101 may be any one of the power assembly driver, the electronic governor, the power distribution device, and the battery management device or a combination of several of the above.

Optionally, the power assembly driver is a pan-tilt motor driver or a blade motor driver.

Specifically, in an embodiment, the power assembly of some products may be a pan/tilt head for carrying a camera, and the pan/tilt head is driven by a motor to freely adjust the direction, and then the power assembly driver may be a pan/tilt motor driver for driving the pan/tilt head to move along different directions. Some power components of the product may be power components for moving the device, for example, a walking motor for driving a wheeled device to walk, or a paddle motor for driving a paddle of the unmanned aerial vehicle to rotate, and accordingly, the power component driver may be a paddle motor driver. No matter the pan-tilt motor driver or the paddle motor driver is the driver for outputting the motor control signal, the difference lies in that one is used for driving the motor to move slowly to realize the control of the pan-tilt direction, and the other is used for controlling the motor to rotate at high speed

Optionally, the first electronic component 111 includes the electronic speed regulator and the power distribution device, and the electronic speed regulator and the power distribution device are integrally disposed on the first circuit board.

Specifically, in one embodiment, when the first electronic component 111 includes the electronic governor and the distributor device described above, the distributor device relies on the circuit board as a carrier, typically remote from the battery, due to its primarily electrical energy distribution function. The electronic speed regulator mainly receives electric energy to control the rotating speed of the motor, and the electronic speed regulator also depends on a structural carrier of a circuit board. Moreover, the electronic governor and the distributor are both elements with large heat productivity, and when the electronic governor and the distributor are close to each other, the mutual interference caused by the heat radiation is weak, so that the electronic governor and the distributor can be integrated on the first circuit board 102 at the same time. For example, when the first circuit board 102 is developed, an electric tuning circuit corresponding to the electronic governor and a distribution circuit corresponding to the distribution device may be simultaneously designed on the first circuit board 102, and a control chip corresponding to the electronic governor and a device corresponding to the distribution device are simultaneously soldered and fixed on the first circuit board 102, so as to realize the concentrated layout of the high-temperature heat source and avoid the radiation influence on the low-temperature heat source mixed therein caused by the dispersed layout of the high-temperature heat source. As fig. 6 exemplarily shows a schematic diagram of a circuit board in which an electronic governor and a distributor are integrally disposed, the electronic governor a and the distributor B are integrally disposed on the first circuit board 102 of fig. 6 at the same time, for example, the left half of fig. 6 may be a circuit and components corresponding to the electronic governor a, and the right half of fig. 6 may be a circuit and components corresponding to the distributor B.

Optionally, the second heat source 11 includes at least one of a flight control processor, a radio frequency device, an image transmission device, and a positioning device.

Specifically, in one embodiment, unlike the first heat source 10, the energy form of the second heat source 11 may not change during operation, and may be a control device, which has an input of an electrical signal and an output of an electrical signal. These components are mainly controlled during operation, and therefore generate less heat than the first heat source 10. For example, the second heat source 11 may include a flight control processor, which receives input signals from various sensors and controls the flight attitude of the drone through a control circuit. The second heat source 11 may further include a radio frequency device, and the radio frequency device may implement communication connection between the unmanned aerial vehicle and a mobile terminal such as a remote controller or a mobile phone. The second heat source 11 may further include an image transmission device, which may transmit a picture collected by the unmanned device through the camera to a monitor of an operator in real time. The second heat source 11 may further include a positioning device such as RTK or GPS that is associated with the geographical position information. In the working process of the flight control processor, the radio frequency device, the image transmission device and the positioning device, the corresponding control function is completed through the logic circuits respectively integrated in the chip, and the current required in the process of realizing the control function is small, so that the heat productivity is small, and any one or combination of a plurality of the flight control processor, the radio frequency device, the image transmission device and the positioning device can be used as the second heat source 11.

Optionally, referring to fig. 3, a space for heat dissipation is provided between the first heat-conducting plate 121 and the second heat-conducting plate 122.

Specifically, in one embodiment, as shown in fig. 3, after the first heat-conducting plate 121 and the second heat-conducting plate 122 are disposed opposite to each other, a space therebetween may form a heat-dissipating space, and heat transferred between the first heat-conducting plate 121 and the second heat-conducting plate 122 may be dissipated as quickly as possible by wind.

Alternatively, referring to fig. 3, the heat dissipating element 123 includes a plurality of heat dissipating fins arranged at intervals, and the heat dissipating fins are fixedly connected with the first heat conducting plate 121 and the second heat conducting plate 122.

Specifically, in one embodiment, as shown in fig. 3, for the heat dissipation member 123 disposed between the first and second heat conduction plates 121 and 122, the heat dissipation member 123 may include a plurality of heat dissipation fins disposed at intervals, the plurality of heat dissipation fins extending from the surface of one of the first and second heat conduction plates 121 and 122 to the surface of the other heat conduction plate so as to be fixed between the two heat conduction plates, and the gaps spaced from each other may form passages for the air flow. The plurality of radiating fins arranged in the comb shape effectively increase the radiating area of the radiator, and can improve the radiating efficiency of the radiator.

Optionally, the first heat-conducting plate 121, the second heat-conducting plate 122 and the heat-dissipating fins are integrally formed.

Specifically, in one embodiment, the first heat conducting plate 121, the second heat conducting plate 122 and the heat dissipating fins can be machined at one time on the metal piece by means of mechanical processing or chemical reaction, so that the first heat conducting plate 121, the second heat conducting plate 122 and the heat dissipating fins are integrally formed, the assembling process can be reduced, and the assembling complexity can be reduced.

Optionally, the heat dissipation fins include first heat dissipation fins and second heat dissipation fins, one end of each first heat dissipation fin is fixedly connected to the first heat conduction plate 121, one end of each second heat dissipation fin is fixedly connected to the second heat conduction plate 122, and free ends of the first heat dissipation fins and free ends of the second heat dissipation fins are staggered with each other.

Specifically, in one embodiment, when the heat discharging element 123 includes a plurality of heat discharging fins arranged at intervals, a portion of the heat discharging fins may be first heat discharging fins attached to the first heat conductive plate 121, and another portion of the heat discharging fins may be second heat discharging fins attached to the second heat conductive plate 122. The first radiating fins and the second radiating fins are adjacent to each other and staggered alternately to form a comb-tooth-shaped radiating channel.

Optionally, the heat dissipating element 123 includes a plurality of heat dissipating pillars disposed at intervals, and the heat dissipating pillars are fixedly connected to the first heat conducting plate 121 and the second heat conducting plate 122 at the same time.

Specifically, in an embodiment, the heat dissipation element 123 may also be a heat dissipation column connecting the first heat conduction plate 121 and the second heat conduction plate 122, a plurality of heat dissipation columns with circular cross sections or rectangular cross sections may be disposed between the first heat conduction plate 121 and the second heat conduction plate 122, and the plurality of heat dissipation columns are disposed at intervals, on one hand, the heat dissipation columns connect and fix the first heat conduction plate 121 and the second heat conduction plate 122, and on the other hand, gaps between the heat dissipation columns may serve as air ducts for heat dissipation and ventilation.

Optionally, the radiating element 123 comprises at least one radiating pipe which is bent and coiled and is fixedly connected with the first heat conducting plate 121 and the second heat conducting plate 122 respectively, wherein the radiating pipe is used for filling cooling liquid.

Specifically, in one embodiment, the heat sink may also dissipate heat by using a water cooling method, and the heat dissipating element 123 may include at least one bent and coiled heat dissipating pipe, which is a hollow pipe and may be filled with a cooling liquid, and it is understood that a circulating pump is disposed on a circulating pipeline of the cooling liquid for circulating the cooling liquid. With above-mentioned cooling tube respectively with first heat-conducting plate 121 and second heat-conducting plate 122 fixed connection, when low-temperature cold wind liquid flowed through first heat-conducting plate 121 and second heat-conducting plate 122, accessible heat exchange took away the heat on first heat-conducting plate 121 and the second heat-conducting plate 122, realized high-efficient heat dissipation.

Referring to fig. 7 and 8, an embodiment of the present invention further provides a movable platform 2, where the movable platform 2 includes the electronic component and the heat dissipation air duct 20 of any one of the foregoing embodiments, where the first heat conduction plate 121 and the second heat conduction plate 122 form part of an air duct wall of the heat dissipation air duct 20, the heat dissipation element 123 is disposed in the heat dissipation air duct 20, and the heat dissipation air duct 20 includes an air inlet 201 and an air outlet 202;

the air flow passing through the heat dissipation air duct 20 can take away the heat on the heat dissipation element 123.

Specifically, as shown in fig. 7, in the movable platform 2 disclosed in the embodiment of the present invention, the heat dissipation air duct 20 shown in fig. 8 is formed by the mutual cooperation of the shells of the movable platform, when the electronic component disclosed in the foregoing embodiment is installed in the heat dissipation air duct 20, the first heat conduction plate 121 and the second heat conduction plate 122 of the heat sink 12 may form part of the air duct wall of the heat dissipation air duct 20, so as to guide the air flow, and at this time, the heat dissipation element 123 is disposed in the heat dissipation air duct 20. The heat transferred from the first and second heat conduction plates 121 and 122 to the heat radiating member 123 can be rapidly discharged by the wind.

Optionally, referring to fig. 8, the movable platform 2 further includes: the fan 21 is disposed in the heat dissipation air duct 20, and the fan 21 is used for dissipating heat of the electronic component.

Specifically, as shown in fig. 8, in an embodiment, the movable platform 2 may further include a fan 21, and the fan 21 may be installed and fixed in the heat dissipation air duct 20 of the movable platform 2, and under the action of the fan 21, strong cold air may be generated, so as to achieve rapid heat dissipation of the heat sink 12.

Optionally, the fan 21 is located at the air outlet 202.

Specifically, in an embodiment, the fan 21 may be installed and fixed at the air outlet 202 of the heat dissipation air duct 20, when the fan 21 operates, the fan 21 located at the air outlet 202 drives the airflow in the heat dissipation air duct 20 to flow, and cold air with a lower temperature is sucked from the air inlet 201, and when passing through the electronic component, heat exchange occurs with the heat sink 12 in the electronic component, and the cold air is changed into hot air, so that the temperature of the electronic component is reduced, and the hot air is discharged from the air outlet 202 under the action of the airflow. The fan 21 is disposed at the air outlet 202, so as to avoid the internal space from being compact when the fan is disposed close to the interior of the heat dissipation air duct. It should be noted that, in practical application, when two heat sources of the electronic component are arranged, the high-temperature first heat source 10 may be arranged close to the air inlet 201, and the low-temperature second heat source 11 may be arranged close to the air outlet 202, so that when cold air enters the air duct 20, heat exchange is firstly completed with the high-temperature first heat source 10, the temperature of the first heat source 10 is reduced, reliability of components in the first heat source 10 is preferentially improved, and for temperature reduction control of the first heat source 10, heat exchange may be completed through subsequent cold air.

It will be appreciated that, as for the type of the fan 21, it may be a centrifugal fan with air flow moving along the radial direction or an axial flow fan with air flow moving along the axial direction, when the axial flow fan is used, it can better guide and control the air flow direction, and can quickly draw heat away from the air outlet.

Optionally, the movable platform 2 comprises at least one of an unmanned aerial vehicle, an unmanned transport vehicle, and an unmanned ship.

Specifically, in one embodiment, the movable platform 2 includes at least one of an unmanned aerial vehicle, an unmanned transport vehicle, and an unmanned ship. It should be noted that no matter which kind of movable platform in unmanned vehicles, unmanned transport vehicles and unmanned ships, the motion of the movable platform mainly takes a motor as a driving part to generate moving power. The operation of the other devices on the movable platform 2 mainly depends on the control devices of the control system. Therefore, the movable platform 2 given in the above example may have the first heat source 10 generating a large amount of heat and the second heat source 11 generating a small amount of heat. Therefore, the electronic assembly can be used in an unmanned aerial vehicle, an unmanned transport vehicle or an unmanned ship, the working stability of the electronic devices in the movable platform 2 during heating is ensured, and the working stability and reliability of the movable platform 2 are improved. As shown in fig. 7, a schematic diagram of the unmanned aerial vehicle as the movable platform 2 according to the embodiment of the present invention is given, and electronic components may be installed inside the unmanned aerial vehicle.

Optionally, the movable platform 2 is an unmanned aerial vehicle, and the heat dissipation element 123 is fixed in a heat dissipation air duct of a central body of the unmanned aerial vehicle, or the heat dissipation element 123 is fixed at a position of a blade motor of the unmanned aerial vehicle.

Specifically, in one embodiment, when the movable platform 2 is an unmanned aerial vehicle, the unmanned aerial vehicle may have a housing of the body, and a heat dissipation duct may be formed in the housing, and the heat dissipation element 123 may be fixed in the heat dissipation duct of the central body of the unmanned aerial vehicle to dissipate the main heat in the body. The flight of the unmanned aerial vehicle depends on a paddle motor for driving the paddle to rotate, the electronic speed regulator and the like are arranged in the machine body in a centralized mode, the electronic speed regulator can be arranged at the position of the paddle motor under the condition that space allows, accordingly, the heat dissipation element 123 can be fixed at the position of the paddle motor of the unmanned aerial vehicle, and it can be understood that the heat sink is installed and fixed at the position, the first heat conduction plate 121 of the heat sink is used for being connected with the electronic speed regulator of the first heat source 10, the second heat conduction plate 122 of the heat sink is used for being connected with the second heat source 11, and when the paddle motor rotates, airflow disturbance caused by rotation of the paddle can be utilized to accelerate heat dissipation.

Referring to fig. 9, an embodiment of the present invention also provides an electronic component including a first heat source 10, a second heat source 11, and a heat sink 12;

the heat sink 12 includes a first heat-conducting surface 124 and a second heat-conducting surface 125, and the first heat-conducting surface 124 and the second heat-conducting surface 125 are different surfaces. Wherein, the different planes are different planes. That is, the first heat transfer surface 124 and the second heat transfer surface 125 are located on different planes. In one embodiment, the plane of the first heat transfer surface 124 is parallel to the plane of the second heat transfer surface. In another embodiment, the plane of the first heat transfer surface 124 and the plane of the second heat transfer surface form an angle therebetween. The included angle is larger than 0 and smaller than 180 degrees.

The first heat source 10 is fixed to the first heat-transfer surface 124, the second heat source 11 is fixed to the second heat-transfer surface 125, and the amount of heat generated by the first heat source 10 is larger than the amount of heat generated by the second heat source 11.

Specifically, as shown in fig. 9, the embodiment of the present invention also provides another electronic component including a first heat source 10, a second heat source 11, and a heat sink 12. In this configuration, the heat sink 12 includes a first heat-conducting surface 124 and a second heat-conducting surface 125. The first heat-conducting surface 124 and the second heat-conducting surface 125 are not on the same plane, and may have an included angle therebetween, so that the two surfaces are staggered. Specifically, the heat sink 12 with an included angle may be obtained by bending a metal plate through a sheet metal process, and two surfaces of the heat sink 12 forming the included angle are the first heat conduction surface 124 and the second heat conduction surface 125. The first heat source 10 is fixed to the first heat transfer surface 124, and the second heat source 11 is fixed to the second heat transfer surface 125. Therefore, the first heat source 10 generating a large amount of heat and the second heat source 11 generating a small amount of heat are separately provided, and the influence of heat radiation from each other can be avoided.

Alternatively, referring to fig. 9, the first heat transfer surface 124 and the second heat transfer surface 125 abut.

Specifically, as shown in fig. 9, in one embodiment, the first heat conduction surface 124 and the second heat conduction surface 125 may be two surfaces that are adjacent to each other after being bent by a metal plate.

Alternatively, referring to fig. 10, the first heat conduction surface 124 and the second heat conduction surface 125 are respectively located at the upper and lower sides of the heat sink 12.

Specifically, as shown in fig. 10, in one embodiment, the heat sink 12 may be a U-shaped member formed by bending a sheet metal, and the first heat-conducting surface 124 and the second heat-conducting surface 125 are respectively located at the upper and lower sides of the heat sink 12, and the middle portions are connected by a transition portion.

It should be noted that, in practical applications, which structural shape of the heat sink 12 is adopted may be determined according to the actual sizes of the first heat source 10 and the second heat source 11 and the size of the installation space, and this is not limited by the embodiment of the present invention.

Optionally, referring to fig. 11, the heat sink 12 further includes a heat dissipation element 123, and the heat dissipation element 123 is disposed on another surface opposite to the first heat conduction surface 124 and/or another surface opposite to the second heat conduction surface 125.

Specifically, as shown in fig. 11, in the heat sink 12 formed by a single metal plate, a heat dissipation element 123 may be provided on the other surface opposite to the heat conduction surface, and the heat dissipation element 123 may be provided on the other surface opposite to the first heat conduction surface 124 alone, may be provided on the other surface opposite to the second heat conduction surface 125 alone, may be provided on both surfaces, and a corresponding heat dissipation scheme may be selected according to the heat source.

It will be appreciated that in such a heat sink 12 constructed from a single sheet metal piece, the heat-dissipating component 123 employed may likewise comprise a plurality of spaced-apart heat-dissipating fins. That is, the heat dissipation area can be increased by the heat dissipation fin structure as well.

Optionally, the first heat source 10 is a strong current component, and the second heat source 11 is a weak current component. In one embodiment, the voltage of the first heat source 10 is greater than or equal to a threshold value, and the voltage of the second heat source 11 is less than the threshold value. For example, the threshold is 12V.

Specifically, in one embodiment, the first heat source 10 may be a strong current component, and the second heat source 11 may be a weak current component. It should be noted that the strong electric component refers to a component in which the energy form of the electric energy changes at the input and output ends of the heat source, and such a component usually works with a higher direct current voltage (for example, 12V); power supply related management devices, motors for converting electrical energy into mechanical energy, controller assemblies thereof, and the like. The weak current component refers to a component in which the energy form of the electric energy at the input end and the output end of the heat source is not changed, and the component generally adopts lower direct current voltage (for example, 3V or 5V voltage) to work, for example; flight control processors, positioning devices, and the like. Of course, the heat generation amounts of the first heat source 10 and the second heat source 11 are relative, and when the first heat source 10 is a weak current component, the second heat source 11 is a strong current component, which is not described again in the embodiments of the present invention.

In the electronic component in the embodiment of the invention, the heat of the first heat source can be guided to the heat dissipation element through the first heat conduction plate, and the heat of the second heat source can be guided to the heat dissipation element through the second heat conduction plate; the first heat-conducting plate and the second heat-conducting plate are arranged oppositely, so that the thermal radiation interference caused by the arrangement of the first heat source and the second heat source on the same side is avoided, the heat dissipation efficiency of the electronic component can be improved, and the working performance of the electrical device is improved.

Referring to fig. 12, an embodiment of the present invention further provides another electronic component, including:

a first heat source 10, connected to a first region 126 of the heat sink 12,

a second heat source 11 connected to a second region 127 of the heat sink 12, the second region 127 being located at a different location of the heat sink 12 than the first region 126; and

the heat sink 12 is configured to dissipate heat from the first heat source 10 and the second heat source 11;

wherein heat generated by the first heat source 10 is conducted to the first region 126 of the heat sink 12 and heat generated by the second heat source 11 is conducted to the second region 127 of the heat sink 12; the heat generated by the first heat source 10 is greater than the heat generated by the second heat source 11.

Specifically, as shown in fig. 12, in another embodiment of the present invention, two heat sources with different heat quantities included in the electronic component can be respectively connected to different areas of the heat sink 12. It should be noted that the different areas connected by different heat sources may be different areas separated by a preset distance on the same surface, or two completely different planes. For example, as shown in fig. 12, the first heat source 10 may be connected to a first region 126 of the first surface of the heat sink 12, the second heat source 11 may be connected to a second region 127 of the second surface of the heat sink 12, and a distance L between the first region 126 and the second region 127 is greater than a predetermined distance, so that heat generated by the first heat source 10 may be conducted to the first region 126, heat generated by the second heat source 11 may be conducted to the second region 127, and thermal radiation influence caused by too close distance between the first heat source 10 and the second heat source 11 may be avoided.

Alternatively, referring to fig. 12, the first region 126 and the second region 127 are located on different planes.

In particular, as shown in fig. 12, in one embodiment, the first zone 126 for connecting the first heat source 10 and the second zone 127 for connecting the second heat source 11 may be different planes, in which case the two different heat sources are connected in different planes, which are more easily spatially separated from each other, with a greatly reduced risk of mutual thermal radiation effects.

Optionally, the voltage of the first heat source 10 is greater than or equal to a threshold, and the voltage of the second heat source 11 is less than the threshold.

Specifically, in one embodiment, the first heat source 10 may be a strong current component, and the second heat source 11 may be a weak current component. It should be noted that the strong electric component refers to a component in which the energy form of the electric energy changes at the input and output ends of the heat source, and such a component usually works with a higher direct current voltage (for example, 12V); power supply related management devices, motors for converting electrical energy into mechanical energy, controller assemblies thereof, and the like. The weak current component refers to a component in which the energy form of the electric energy at the input end and the output end of the heat source is not changed, and the component generally adopts lower direct current voltage (for example, 3V or 5V voltage) to work, for example; flight control processors, positioning devices, and the like. Of course, the heat generation amounts of the first heat source 10 and the second heat source 11 are relative, and when the first heat source 10 is a weak current component, the second heat source 11 is a strong current component, which is not described again in the embodiments of the present invention.

Optionally, the first heat source 10 and the first heat source 11 share the same heat dissipation channel 128 for heat dissipation.

Specifically, in the electronic component, a heat dissipation channel 128 may be further designed in the heat sink 12, and after the first heat source 10 is connected to the first region 126 of the heat sink 12 and the second heat source 11 is connected to the second region 127 of the heat sink 12, the heat collected by the first region 126 and the heat collected by the second region 127 may be simultaneously dissipated through the heat dissipation channel 128, that is, both the first heat source 10 and the second heat source 11 may be transferred to the heat dissipation channel 128. Therefore, a heat dissipation channel does not need to be designed for each heat source independently, the size of the electronic assembly is reduced, and the installation space is saved.

The electronic component in the embodiment of the invention can guide the heat generated by the first heat source and the second heat source to different areas, thereby avoiding the thermal radiation interference caused by the mutual approach of the first heat source and the second heat source, improving the heat dissipation efficiency of the electronic component and improving the working performance of the electrical device.

The above-described embodiments of the apparatus are merely illustrative, and the units described as separate parts may or may not be physically separate, and parts displayed as units may or may not be physical units, may be located in one place, or may be distributed on a plurality of network units. Some or all of the modules may be selected according to actual needs to achieve the purpose of the solution of the present embodiment. One of ordinary skill in the art can understand and implement it without inventive effort.

Reference herein to "one embodiment," "an embodiment," or "one or more embodiments" means that a particular feature, structure, or characteristic described in connection with the embodiment is included in at least one embodiment of the invention. Moreover, it is noted that instances of the word "in one embodiment" are not necessarily all referring to the same embodiment.

In the description provided herein, numerous specific details are set forth. It is understood, however, that embodiments of the invention may be practiced without these specific details. In some instances, well-known methods, structures and techniques have not been shown in detail in order not to obscure an understanding of this description.

In the claims, any reference signs placed between parentheses shall not be construed as limiting the claim. The word "comprising" does not exclude the presence of elements or steps not listed in a claim. The word "a" or "an" preceding an element does not exclude the presence of a plurality of such elements. The invention may be implemented by means of hardware comprising several distinct elements, and by means of a suitably programmed computer. In the unit claims enumerating several means, several of these means may be embodied by one and the same item of hardware. The usage of the words first, second and third, etcetera do not indicate any ordering. These words may be interpreted as names.

Finally, it should be noted that: the above examples are only intended to illustrate the technical solution of the present invention, but not to limit it; although the present invention has been described in detail with reference to the foregoing embodiments, it will be understood by those of ordinary skill in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some technical features may be equivalently replaced; and such modifications or substitutions do not depart from the spirit and scope of the corresponding technical solutions of the embodiments of the present invention.

Claims (29)

1. An electronic assembly, comprising: a first heat source, a second heat source and a heat sink;

the radiator comprises a first heat-conducting plate, a second heat-conducting plate and a radiating element, wherein the first heat-conducting plate and the second heat-conducting plate are arranged oppositely, and the radiating element is fixed between the first heat-conducting plate and the second heat-conducting plate;

the first heat source is fixed on one surface, far away from the radiating element, of the first heat conduction plate, the second heat source is fixed on one surface, far away from the radiating element, of the second heat conduction plate, and the heat generated by the first heat source is larger than that generated by the second heat source.

2. The electronic assembly of claim 1,

the first heat source comprises a first electronic element and a first circuit board, and the first circuit board carries the first electronic element;

the second heat source includes a second electronic component and a second circuit board carrying the second electronic component.

3. The electronic assembly of claim 2, wherein the first circuit board is secured to the first thermally conductive plate and the second circuit board is secured to the second thermally conductive plate.

4. The electronic assembly of claim 3,

the first electronic component comprises at least one of a power assembly driver, an electronic speed regulator, a power distribution device and a battery management device.

5. The electronic assembly of claim 4,

the power component driver is a holder motor driver or a blade motor driver.

6. The electronic assembly of claim 2,

the first electronic element comprises the electronic speed regulator and the power distribution device, and the electronic speed regulator and the power distribution device are integrally arranged on the first circuit board.

7. The electronic assembly of claim 1,

The second heat source comprises at least one of a flight control processor, a radio frequency device, an image transmission device and a positioning device.

8. The electronic assembly of claim 1,

a space for heat dissipation is formed between the first heat conduction plate and the second heat conduction plate.

9. The electronic assembly of claim 1,

the radiating element comprises a plurality of radiating fins arranged at intervals, and the radiating fins are fixedly connected with the first heat-conducting plate and the second heat-conducting plate.

10. The electronic assembly of claim 9,

the first heat-conducting plate, the second heat-conducting plate and the radiating fins are integrally formed.

11. The electronic assembly of claim 10, wherein the heat dissipating fins comprise a first heat dissipating fin and a second heat dissipating fin, one end of the first heat dissipating fin is fixedly connected to the first heat conducting plate, one end of the second heat dissipating fin is fixedly connected to the second heat conducting plate, and a free end of the first heat dissipating fin and a free end of the second heat dissipating fin are staggered from each other.

12. The electronic assembly of claim 1,

The radiating element comprises a plurality of radiating columns arranged at intervals, and the radiating columns are fixedly connected with the first heat-conducting plate and the second heat-conducting plate at the same time.

13. The electronic assembly of claim 1,

radiating element includes the cooling tube that at least one crooked was spiraled, the cooling tube respectively with first heat-conducting plate with second heat-conducting plate fixed connection, wherein, the cooling tube is used for filling the coolant liquid.

14. A movable platform, comprising: the electronic assembly and heat dissipation duct of any of claims 1-13, wherein the first thermally conductive plate and the second thermally conductive plate form a portion of a duct wall of the heat dissipation duct, the heat dissipation element is disposed within the heat dissipation duct, and the heat dissipation duct includes an air inlet and an air outlet;

the air flow passing through the heat dissipation air duct can take away the heat on the heat dissipation element.

15. The movable platform of claim 14, further comprising: the fan is arranged in the heat dissipation air channel and used for dissipating heat of the electronic assembly.

16. The movable platform of claim 15, wherein the fan is located at the air outlet.

17. The movable platform of claim 16, wherein the fan is a centrifugal fan or an axial fan.

18. The movable platform of claim 17,

the movable platform includes at least one of an unmanned aerial vehicle, an unmanned transport vehicle, and an unmanned ship.

19. The movable platform of claim 18,

the movable platform is an unmanned aerial vehicle, and the heat dissipation element is fixed in a heat dissipation air duct of a central body of the unmanned aerial vehicle, or the heat dissipation element is fixed at the position of a blade motor of the unmanned aerial vehicle.

20. An electronic assembly, comprising a first heat source, a second heat source, and a heat sink;

the radiator comprises a first heat conduction surface and a second heat conduction surface, and the first heat conduction surface and the second heat conduction surface are different surfaces;

the first heat source is fixed on the first heat conduction surface, the second heat source is fixed on the second heat conduction surface, and the heat generated by the first heat source is larger than the heat generated by the second heat source.

21. The electronic assembly of claim 20,

the first and second heat transfer surfaces are contiguous.

22. The electronic assembly of claim 20,

the first heat conduction surface and the second heat conduction surface are respectively positioned at the upper side and the lower side of the radiator.

23. The electronic assembly of claim 20,

the heat sink further comprises a heat dissipation element, and the heat dissipation element is arranged on the other surface opposite to the first heat conduction surface and/or the other surface opposite to the second heat conduction surface.

24. The electronic assembly of claim 23,

the heat dissipation element comprises a plurality of heat dissipation fins arranged at intervals.

25. The electronic assembly of claim 20,

the voltage of the first heat source is greater than or equal to a threshold value, and the voltage of the second heat source is smaller than the threshold value.

26. An electronic assembly, comprising:

a first heat source connected to the first region of the heat sink,

a second heat source connected to a second region of the heat sink, the second region being located at a different location of the heat sink than the first region; and

the radiator is used for radiating heat of the first heat source and the second heat source;

wherein heat generated by the first heat source is conducted to the first region of the heat sink and heat generated by the second heat source is conducted to the second region of the heat sink; the first heat source generates more heat than the second heat source.

27. The electronic assembly of claim 26,

the first region and the second region are located on different planes.

28. The electronic assembly of claim 26,

the voltage of the first heat source is greater than or equal to a threshold value, and the voltage of the second heat source is smaller than the threshold value.

29. The electronic assembly of claim 28,

the first heat source and the second heat source share the same heat dissipation channel for heat dissipation.

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