CN208425098U - Processor radiator and electronic equipment - Google Patents
Processor radiator and electronic equipment Download PDFInfo
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- CN208425098U CN208425098U CN201821039138.2U CN201821039138U CN208425098U CN 208425098 U CN208425098 U CN 208425098U CN 201821039138 U CN201821039138 U CN 201821039138U CN 208425098 U CN208425098 U CN 208425098U
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Abstract
The utility model provides a kind of processor radiator and electronic equipment.Processor radiator provided by the utility model, it include: heat dissipation base, wherein, at least one contact radiating part is provided on heat dissipation base, contact radiating part protrudes the upper surface of heat dissipation base, is provided with interconnecting piece on heat dissipation base, interconnecting piece is for connecting processor circuit board, so that contact radiating part offsets with the heat-generating units on processor circuit board, hot cell is transferred heat to after contact radiating part, is distributed outward through heat dissipation base.Processor radiator provided by the utility model, by by heat transfer caused by heat-generating units to contacting radiating part, then heat dissipation base is transferred to by contact radiating part again, finally by the air flowing outside heat dissipation base and to external radiation, to realize effective heat dissipation to processor.
Description
Technical field
The utility model relates to electronic equipment dissipating heat hardware technology field more particularly to a kind of processor radiators and electricity
Sub- equipment.
Background technique
With the fast development of artificial intelligence, intelligent camera system will be used wider and wider in society, such as nobody
Driving, unmanned retail shop, monitoring security protection, intelligence wearing etc. all use intelligent camera system, running intelligent camera
System will do it high-speed computation, and processor can be also brought rapidly up, can extreme influence processor unit if carrying out heat dissipation not in time
Performance and service life.
Currently, intelligent camera system in the prior art, mostly using all fan coolings, water-cooling either half
The mode of conductor refrigerator heat dissipation carries out radiating and cooling to the processor being wherein equipped with.Specifically, for above-mentioned fan cooling
Mode installs small fan near heat generating member, drive the air near heat generating member to flow by the rotation of fan, to take away
The heat that heat generating member distributes, and then reduce the temperature of processor；For above-mentioned water cooling method, i.e., make cold water using water pump
It is circulated in inbuilt water pipe around heat generating member, to take away the heat that heat generating member distributes, and then reduces the temperature of processor
Degree；And for above-mentioned semiconductor cooler radiating mode, i.e., heat dissipation is realized using the Peltier effect of semiconductor material,
In, Peltier effect refers to that when the galvanic couple that DC current is made up of two kinds of semiconductor materials, one end heat absorption, one end is put
Heat generates " heat " side and " cold " side, by contacting " cold " side with heat generating member, to take away heat generating member on semiconductor cooler
The heat distributed, and then reduce the temperature of processor.
But for fan cooling mode, big, noise and vibration application scenarios of less demanding can only make in structure space
With, and can not apply on lesser product structure；And for water cooling method, although heat dissipation effect is preferable, need
Larger space and power, volume are larger inconvenient to carry；In addition, for semiconductor cooler radiating mode, although can be relatively accurate
The temperature of ground control processor, but the power of required offer is larger, it is also necessary to solve the heat dissipation of its own heating surface, Wu Fayou
Effect meets the requirement of low-power consumption miniaturization.
Utility model content
The utility model provides a kind of processor radiator and electronic equipment, to solve heat dissipation side in the prior art
The structure of formula needs occupied space larger, and the energy consumption needed also universal higher technical problem.
In a first aspect, a kind of processor radiator provided by the utility model, comprising: heat dissipation base；
At least one contact radiating part is provided on the heat dissipation base, the contact radiating part protrudes the heat dissipation base
Upper surface；
Interconnecting piece is provided on the heat dissipation base, the interconnecting piece is for connecting processor circuit board, so that described connect
Touching radiating part offsets with the heat-generating units on the processor circuit board；
Wherein, the heat-generating units transfer heat to after the contact radiating part, dissipate outward through the heat dissipation base
Hair.
In a kind of possible design, the processor radiator, further includes: heat-dissipating casing；
The heat-dissipating casing is located on the heat dissipation base, with the shape between the heat-dissipating casing and the heat dissipation base
At the accommodating space for accommodating the processor circuit board；
Wherein, the heat transfer on the heat dissipation base is to the heat-dissipating casing, externally to be dissipated by the heat-dissipating casing
Heat.
In a kind of possible design, stage portion is formed on the heat dissipation base；
The heat-dissipating casing is located at the outside of the stage portion, so that the inner wall of the heat-dissipating casing and the stage portion
Side wall contact.
In a kind of possible design, plug receptacle is additionally provided on the side wall on the heat-dissipating casing, the plug receptacle is used
In the connector being pierced by the processor circuit board.
In a kind of possible design, the heat-dissipating casing surface is set as rough surface, to increase the heat-dissipating casing
Cooling surface area.
In a kind of possible design, it is provided with black coating on the heat-dissipating casing surface, to improve outside the heat dissipation
The ability of the external heat radiation of shell.
In a kind of possible design, when the processor circuit board is connected on the heat dissipation base, the contact
The first surface of the heat-generating units is completely covered in the upper surface of radiating part, wherein the first surface is the heat-generating units
The surface to offset with the contact radiating part.
In a kind of possible design, the heat dissipation base is rectangle, is respectively set on four angles of the heat dissipation base
There is the interconnecting piece；
The interconnecting piece is the boss structure for protruding the upper surface of the heat dissipation base, and the interconnecting piece is far from the heat dissipation
One end of pedestal is connected with the processor circuit board.
In a kind of possible design, the one end of the interconnecting piece far from the heat dissipation base and the processor circuit board
Between be provided with heat insulating mattress.
In a kind of possible design, radiating fin is provided on the heat dissipation base side wall.
In a kind of possible design, the radiating fin surface is set as rough surface, to increase the radiating fin
Cooling surface area.
In a kind of possible design, it is provided with black coating on the radiating fin surface, to improve the heat radiating fin
The ability of the external heat radiation of piece.
Second aspect, the utility model also provide a kind of electronic equipment, comprising: processor circuit board and such as first aspect
In any one possible processor radiator；
The processor circuit board is connected with the processor radiator, the contact on the processor radiator
Radiating part offsets with the heat-generating units on the processor circuit board, so that the heat that the heat-generating units distribute is through the processing
Device radiator distributes outward.
A kind of processor radiator and electronic equipment provided by the utility model are protruded by being arranged on heat dissipation base
Contact radiating part so that when processor circuit board to be connected on the interconnecting piece of heat dissipation base, the contact of protrusion is radiated
Heat-generating units on the upper surface and processor circuit board in portion offset, so that heat caused by heat-generating units can pass through
The mode of heat transmitting is transferred to contact radiating part, is then transferred to heat dissipation base by contact radiating part again, finally by heat dissipation bottom
Air outside seat flows and to external radiation, to realize effective heat dissipation to processor.
Detailed description of the invention
In order to illustrate the embodiment of the utility model or the technical proposal in the existing technology more clearly, below will be to embodiment
Or attached drawing needed to be used in the description of the prior art is briefly described, it should be apparent that, the accompanying drawings in the following description is only
It is some embodiments of the utility model, for those of ordinary skill in the art, before not making the creative labor property
It puts, is also possible to obtain other drawings based on these drawings.
Fig. 1 is the utility model processor construction for heat radiating device schematic diagram shown according to an exemplary embodiment.
Description of symbols:
1: heat-dissipating casing；
2: contact radiating part；
3: interconnecting piece；
4: third spiral groove mould；
5: radiating fin；
6: interface；
7: gasket.
Specific embodiment
The following will be combined with the drawings in the embodiments of the present invention, carries out the technical scheme in the embodiment of the utility model
Clearly and completely describe, it is clear that the described embodiments are only a part of the embodiments of the utility model, rather than whole
Embodiment.Based on the embodiments of the present invention, those of ordinary skill in the art are without making creative work
Every other embodiment obtained, belongs to the utility model scope of the claimed.
The specification and claims of the utility model and term " first ", " second ", " third " in above-mentioned attached drawing
(if present)s such as " the 4 " are to be used to distinguish similar objects, without being used to describe a particular order or precedence order.It answers
The data that the understanding uses in this way are interchangeable under appropriate circumstances, for example so as to the embodiments of the present invention described herein
It can be performed in other sequences than those illustrated or described herein.In addition, term " includes " and " having " and he
Any deformation, it is intended that cover it is non-exclusive include, for example, contain the process, method of a series of steps or units,
System, product or equipment those of are not necessarily limited to be clearly listed step or unit, but may include being not clearly listed
Or the other step or units intrinsic for these process, methods, product or equipment.
The technical solution of the utility model is described in detail with specifically embodiment below.These are specific below
Embodiment can be combined with each other, and the same or similar concept or process may be repeated no more in some embodiments.
Fig. 1 is the utility model processor construction for heat radiating device schematic diagram shown according to an exemplary embodiment.Such as Fig. 1
Shown, processor radiator provided in this embodiment includes: heat dissipation base 8.
Specifically, at least one contact radiating part 2 is provided on heat dissipation base 8, wherein the contact protrusion of radiating part 2 dissipates
The upper surface of hot pedestal 8, contact radiating part 2 can be integrally formed with heat dissipation base 8, be also possible in heat dissipation base 8
What is formed is latter linked, does not carry out in the present embodiment to the connection type between contact radiating part 2 and heat dissipation base 8 specific
Ground limits, and only need to guarantee to can be realized efficient geothermal transfer therebetween.
And heat dissipation base 8 and contact radiating part 2 can be, non-metallic material is led using high-thermal conductive metal either height
Material is made, and is worth explanatorily, for the material of heat dissipation base 8 and contact radiating part 2, can be according to provided in this embodiment
Specific operating condition applied by processor radiator is selected, for example, lesser when being applied to the more and heat dissipation area of fever
When processor circuit board heat dissipation operating condition, the higher material of thermal coefficient can choose, and, when applied to the less or radiating surface that generates heat
When long-pending biggish processor circuit board heat dissipation operating condition, the lower material of thermal coefficient can choose.
And can be rectangle, circle, prismatic or other shapes for heat dissipation base 8, it is being worth explanatorily, in this implementation
The specific structure shape of heat dissipation base 8 is not defined in example, planform can be the processing according to required installation
The associated mounting structure of device circuit board and electronic equipment applied by itself determines jointly.
In order to which effectively processor circuit board is connected on processor radiator provided in this embodiment, dissipating
Interconnecting piece 3 is provided on hot pedestal 8.Wherein, the interconnecting piece 3 is for connecting processor circuit board, so as to work as processor circuit
Fever list when plate is connected on processor radiator provided in this embodiment, on contact radiating part 2 and processor circuit board
Member offsets.Heat-generating units on processor circuit board in the process of running, generate a large amount of heat, due to contact radiating part 2 with
Heat-generating units on processor circuit board abut, and the heat transfer given out will extremely be contacted radiating part 2 by heat-generating units,
Then through the air flowing outside heat dissipation base 8 and to external radiation, to achieve the effect that entirety passively radiates.
In the present embodiment, by the way that the contact radiating part of protrusion is arranged on heat dissipation base, so that processor is electric
Fever when road plate is connected on the interconnecting piece of heat dissipation base, on the upper surface and processor circuit board of the contact radiating part of protrusion
Unit offsets, so that the mode that heat caused by heat-generating units can lead to heat transfer is transferred to contact radiating part, so
Heat dissipation base is transferred to by contact radiating part again afterwards, finally by the air flowing outside heat dissipation base and to external radiation, from
And realize effective heat dissipation to processor.
In addition, can be unmanned vapour for the concrete application scene of processor radiator provided in this embodiment
Vehicle, unmanned retail shop monitor intelligent camera system used by security protection, intelligence wearing etc., running intelligent camera system meeting
Carry out high-speed computation, processor can also be brought rapidly up, if carry out not in time heat dissipation can extreme influence processor unit performance and
Service life.Also, with the miniaturization trend of smart machine, the intelligent video camera head configured thereon also tends to minimize, because
This, provides a kind of heat dissipation effectively, and structure is simple, is easily worked, the processor heat dissipation dress that use cost is low, highly reliable
It sets, the normal work of the intelligent video camera head of miniaturization can be effectively guaranteed.
On the basis of the above embodiments, in order to be effectively protected the processor circuit board being connected on heat dissipation base 8, with
And processor radiator is further improved to the heat dissipation effect of the heat-generating units on processor circuit board, another embodiment mentions
In the processor radiator of confession, can also include: heat-dissipating casing 1.
Specifically, heat-dissipating casing 1 is located on heat dissipation base 8, to be formed between heat-dissipating casing 1 and heat dissipation base 8
For accommodating the accommodating space of processor circuit board.Wherein, the concrete shape of heat-dissipating casing 1 and volume can be according to heat dissipation bases
8 and the outer dimension of processor circuit board be determined, in the present embodiment and without specifically defined.For example, for
The heat dissipation base 8 of rectangle, can use the cuboid heat-dissipating casing 1 of a side opening, and cuboid heat-dissipating casing 1 is just located at square
On the heat dissipation base 8 of shape, and regular accommodating space is formed, for accommodating rectangular-shaped connection processor circuit
Plate.
In the present embodiment, by the way that the contact radiating part of protrusion is arranged on heat dissipation base, so that processor is electric
Fever when road plate is connected on the interconnecting piece of heat dissipation base, on the upper surface and processor circuit board of the contact radiating part of protrusion
Unit offsets, so that the mode that heat caused by heat-generating units can lead to heat transfer is transferred to contact radiating part, so
Heat dissipation base is transferred to by contact radiating part again afterwards, partial heat is further then transferred to by heat-dissipating casing by heat dissipation base
On, finally by the air flowing outside heat dissipation base and heat-dissipating casing and to external radiation, to realize to processor
Effectively heat dissipation.
In view of realizing reliable connection between heat-dissipating casing 1 and heat dissipation base 8, it can be and formed on heat dissipation base 8
There is stage portion 4, wherein heat-dissipating casing 1 is located at the outside of stage portion 4, so that the side of the inner wall of heat-dissipating casing 1 and stage portion 4
Wall is in contact.Wherein, it can be between heat-dissipating casing 1 and heat dissipation base 8 and be attached by way of interference fit, it can also be with
It is the stage portion 4 and then both utilization glue or connector realization phase by the way that heat-dissipating casing 1 to be located to heat dissipation base 8
Fixation to position.
By the way that the stage portion to raise upward is arranged on heat dissipation base, and heat-dissipating casing is located to the outside of stage portion,
So that heat-dissipating casing when being connected on heat dissipation base, is that its inner wall is in contact with the side wall of stage portion, and then significantly
Ground increases contact area between heat-dissipating casing and heat dissipation base, so that processor radiator provided in this embodiment is integrally tied
The temperature difference of structure is more uniform, to reach better heat dissipation effect.
In addition, being also provided with plug receptacle 6 on the side wall on heat-dissipating casing 1, wherein the plug receptacle 6 is for being pierced by
Connector on processor circuit board, so that processor circuit board can be connected with external devices.
It, can also be outer by heat dissipation in order to further improve the heat dissipation performance of processor radiator provided in this embodiment
The surface of shell 1 is set as rough surface, to greatly increase the cooling surface area of heat-dissipating casing 1.
Further, it is also possible to black coating is provided on 1 surface of heat-dissipating casing, to improve the externally hot spoke of heat-dissipating casing 1
The ability penetrated.
Also, due to the fever list on the contact radiating part 2 and processor circuit board of protrusion set on heat dissipation base 8
Member one-to-one correspondence is in contact, and so as to realize that contact radiating part 2 accurately radiates for heat-generating units, effectively prevents
Stop influencing each other between heat-generating units, and influences other devices of surrounding.
Optionally, when processor circuit board is connected on heat dissipation base 8, the upper surface of contact radiating part 2 is completely covered
The first surface of heat-generating units, wherein first surface is the surface that heat-generating units and contact radiating part 2 offset.By that will contact
The area of the upper surface of radiating part 2 is set greater than the area of the first surface of heat-generating units, to ensure that heat-generating units institute
The heat of generation can be transferred to the maximum extent on contact radiating part 2.
In a specific embodiment, it when heat dissipation base 1 is rectangle, can be on four angles of heat dissipation base 8
It is respectively arranged with interconnecting piece 3, and interconnecting piece 3 can be specifically the boss structure of protrusion 8 upper surface of heat dissipation base, and interconnecting piece
3 one end far from heat dissipation base 8 are connected with processor circuit board.Interconnecting piece 3 can be it is integrally formed with heat dissipation base 8,
It is also possible to by the connections such as welding or splicing after the molding of heat dissipation base 8, in the present embodiment not to connection
Connection type progress between portion 3 and heat dissipation base 8 is specifically defined, only need to guarantee to can be realized reliable physics therebetween
Connection.
The heat being transmitted on heat dissipation base 8 in order to prevent is back to processor circuit board by interconnecting piece 3 again, also
Heat insulating mattress 7 can be provided in the one end of interconnecting piece 3 far from heat dissipation base 8 and between processor circuit board, wherein heat insulating mattress
Piece 7 is made using heat-insulated material, such as glass fibre, asbestos, rock wool, silicate, aerogel blanket etc., is worth explanatorily,
The specific material of heat insulating mattress is not defined in the present embodiment.
In addition to it is above-mentioned the one end of interconnecting piece 3 far from heat dissipation base 8 and between processor circuit board be arranged heat insulating mattress 7
Mode prevent the heat being transmitted on heat dissipation base 8 to be back to except processor circuit board again by interconnecting piece 3, also
Insulation material directly can be set by interconnecting piece 3, to effectively prevent the reflux of heat.
On the basis of the above embodiments, 8 side wall of heat dissipation base of the processor radiator provided in another embodiment
On be provided with radiating fin 5.Wherein, radiating fin 5 is fallen heat dissipation with the form of convection current, after absorbing heat right
Heat dissipation area is mainly determined that surface area is bigger by the size of the surface area of radiating fin 5 during flow heat dissipation, heat dissipation effect
Better；Surface area is smaller, and heat dissipation effect is poorer.The means generallyd use in the industry specifically include that the number for increasing radiating fin 5
Amount, two kinds of length for increasing radiating fin 5, the data embodied are exactly " thickness high ratio ", i.e. 5 thickness of radiating fin and height
Ratio, this, which is worth the smaller radiating fin 5 for meaning unit volume, can do closeer, and quantity is more, effectively radiates
Surface area is bigger, and heat dissipation performance is also better.
In order to further improve the heat dissipation performance of processor radiator provided in this embodiment, above-mentioned can be dissipated
Hot 5 surface of fin is set as rough surface, thus to increase the cooling surface area of radiating fin 5.
In a kind of possible design, it can also be provided with black coating on 5 surface of radiating fin, to improve heat dissipation
The ability of the external heat radiation of fin 5.
In addition, the utility model also provides a kind of electronic equipment, comprising: the possible processing of any one in above-described embodiment
Device radiator and processor circuit board.
Above-mentioned processor radiator includes: heat dissipation base 8.At least one contact is provided on heat dissipation base 8 to dissipate
Hot portion 2, wherein contact radiating part 2 protrudes the upper surface of heat dissipation base 8, and contact radiating part 2 can be and 8 one of heat dissipation base
It is molding, be also possible to heat dissipation base 8 molding it is latter linked, in the present embodiment not to contact radiating part 2 and dissipate
Connection type progress between hot pedestal 8 is specifically defined, only need to guarantee to can be realized efficient geothermal transfer therebetween.
And heat dissipation base 8 and contact radiating part 2 can be, non-metallic material is led using high-thermal conductive metal either height
Material is made, and is worth explanatorily, for the material of heat dissipation base 8 and contact radiating part 2, can be according to provided in this embodiment
Specific operating condition applied by processor radiator is selected, for example, lesser when being applied to the more and heat dissipation area of fever
When processor circuit board heat dissipation operating condition, the higher material of thermal coefficient can choose, and, when applied to the less or radiating surface that generates heat
When long-pending biggish processor circuit board heat dissipation operating condition, the lower material of thermal coefficient can choose.
And can be rectangle, circle, prismatic or other shapes for heat dissipation base 8, it is being worth explanatorily, in this implementation
The specific structure shape of heat dissipation base 8 is not defined in example, planform can be the processing according to required installation
The associated mounting structure of device circuit board and electronic equipment applied by itself determines jointly.
In order to which effectively processor circuit board is connected on processor radiator provided in this embodiment, dissipating
Interconnecting piece 3 is provided on hot pedestal 8.Wherein, the interconnecting piece 3 is for connecting above-mentioned processor circuit board, so as to work as processor
Hair when circuit board is connected on processor radiator provided in this embodiment, on contact radiating part 2 and processor circuit board
Hot cell offsets.Heat-generating units on processor circuit board in the process of running, generate a large amount of heat, due to contacting radiating part
2 abut with the heat-generating units on processor circuit board, heat-generating units will by the heat transfer given out to contact heat dissipation
Portion 2, then through the air flowing outside heat dissipation base 8 and to external radiation, to achieve the effect that entirety passively radiates.
In the present embodiment, it is connected by processor circuit board with processor radiator, on processor radiator
Contact radiating part offset with the heat-generating units on processor circuit board so that the heat-generating units institute on processor circuit board
The mode that the heat of generation can lead to heat transfer is transferred to contact radiating part, is then transferred to heat dissipation bottom by contact radiating part again
Seat, finally by the air flowing outside heat dissipation base and to external radiation, to realize effective heat dissipation to processor.
Specifically, above-mentioned electronic equipment can be pilotless automobile, unmanned retail shop, monitoring security protection, intelligence wearing
Intelligent video camera head in the intelligent camera system Deng used by, the present embodiment is effective by providing a kind of heat dissipation, and structure letter
List is easily worked, the processor radiator that use cost is low, highly reliable, so as to be effectively guaranteed miniaturization
The normal work of intelligent video camera head.
In the description of the present invention, it should be understood that used term " center ", " length ", " width ",
" thickness ", " top ", " bottom end ", "upper", "lower", "left", "right", "front", "rear", "vertical", "horizontal", "inner", "outside" " axis
To ", the indicating positions such as " circumferential direction " or positional relationship all can be based on the orientation or positional relationship shown in the drawings, merely to just
In description the utility model and simplify description, rather than the position of indication or suggestion meaning or original part there must be specific side
Position, specifically to construct and operate, therefore should not be understood as limiting the present invention.
In the present invention unless specifically defined or limited otherwise, term " installation ", " connected ", " connection ", " Gu
It is fixed " etc. shall be understood in a broad sense, such as may be a fixed connection, may be a detachable connection, or be integrally formed；It can be machinery
Connection is also possible to be electrically connected or can communicate with each other；It can be directly connected, the indirect phase of intermediary can also be passed through
Even, the connection inside two elements or the interaction relationship of two elements can be made.For those of ordinary skill in the art
For, the concrete meaning of above-mentioned term in the present invention can be understood as the case may be.Unless otherwise specific regulation
And restriction, fisrt feature second feature "upper" or "lower" may include that the first and second features directly contact, can also be with
It is not direct contact including the first and second features but passes through the other characterisation contact between them.Moreover, fisrt feature
It above the second feature " above ", " above " and " above " include fisrt feature right above second feature and oblique upper, or only table
Show that first feature horizontal height is higher than second feature.Fisrt feature includes under the second feature " below ", " below " and " below "
One feature is directly below and diagonally below the second feature, or is merely representative of first feature horizontal height less than second feature.
Finally, it should be noted that the above various embodiments is only to illustrate the technical solution of the utility model, rather than it is limited
System；Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art should
Understand: it is still possible to modify the technical solutions described in the foregoing embodiments, or to some or all of
Technical characteristic is equivalently replaced；And these are modified or replaceed, it does not separate the essence of the corresponding technical solution, and this is practical new
The range of each embodiment technical solution of type.
Claims (13)
1. a kind of processor radiator characterized by comprising heat dissipation base；
At least one contact radiating part is provided on the heat dissipation base, the contact radiating part protrudes the upper of the heat dissipation base
Surface；
Interconnecting piece is provided on the heat dissipation base, the interconnecting piece is for connecting processor circuit board, so that the contact dissipates
Hot portion offsets with the heat-generating units on the processor circuit board；
Wherein, the heat-generating units transfer heat to after the contact radiating part, distribute outward through the heat dissipation base.
2. processor radiator according to claim 1, which is characterized in that further include: heat-dissipating casing；
The heat-dissipating casing is located on the heat dissipation base, is used with being formed between the heat-dissipating casing and the heat dissipation base
In the accommodating space for accommodating the processor circuit board；
Wherein, the heat transfer on the heat dissipation base is to the heat-dissipating casing, externally to be radiated by the heat-dissipating casing.
3. processor radiator according to claim 2, which is characterized in that form step on the heat dissipation base
Portion；
The heat-dissipating casing is located at the outside of the stage portion, so that the side of the inner wall of the heat-dissipating casing and the stage portion
Wall contact.
4. processor radiator according to claim 3, which is characterized in that also set on the side wall on the heat-dissipating casing
It is equipped with plug receptacle, the plug receptacle is used for the connector being pierced by the processor circuit board.
5. processor radiator according to claim 4, which is characterized in that the heat-dissipating casing surface is set as coarse
Surface, to increase the cooling surface area of the heat-dissipating casing.
6. processor radiator according to claim 5, which is characterized in that be provided on the heat-dissipating casing surface black
Color coating, to improve the ability of the external heat radiation of the heat-dissipating casing.
7. processor radiator according to claim 1, which is characterized in that when the processor circuit board is connected to institute
When stating on heat dissipation base, the first surface of the heat-generating units is completely covered in the upper surface of the contact radiating part, wherein described
First surface is the surface that the heat-generating units and the contact radiating part offset.
8. processor radiator according to claim 1, which is characterized in that the heat dissipation base is rectangle, described to dissipate
The interconnecting piece is respectively arranged on four angles of hot pedestal；
The interconnecting piece is the boss structure for protruding the upper surface of the heat dissipation base, and the interconnecting piece is far from the heat dissipation base
One end be connected with the processor circuit board.
9. processor radiator according to claim 8, which is characterized in that the interconnecting piece is far from the heat dissipation base
One end and the processor circuit board between be provided with heat insulating mattress.
10. processor radiator described in -9 any one according to claim 1, which is characterized in that the heat dissipation base side
Radiating fin is provided on wall.
11. processor radiator according to claim 10, which is characterized in that the radiating fin surface is set as thick
Rough surface, to increase the cooling surface area of the radiating fin.
12. processor radiator according to claim 11, which is characterized in that be provided on the radiating fin surface
Black coating, to improve the ability of the external heat radiation of the radiating fin.
13. a kind of electronic equipment characterized by comprising processor circuit board and any one of such as claim 1-12
The processor radiator；
The processor circuit board is connected with the processor radiator, the contact heat dissipation on the processor radiator
Portion offsets with the heat-generating units on the processor circuit board, so that the heat that the heat-generating units distribute is dissipated through the processor
Thermal distributes outward.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821039138.2U CN208425098U (en) | 2018-06-29 | 2018-06-29 | Processor radiator and electronic equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821039138.2U CN208425098U (en) | 2018-06-29 | 2018-06-29 | Processor radiator and electronic equipment |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN208425098U true CN208425098U (en) | 2019-01-22 |
Family
ID=65107387
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201821039138.2U Active CN208425098U (en) | 2018-06-29 | 2018-06-29 | Processor radiator and electronic equipment |
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| Country | Link |
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| CN (1) | CN208425098U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110022668A (en) * | 2019-05-27 | 2019-07-16 | 重庆力华自动化技术有限责任公司 | A kind of power-type electronic product with multi-panel heat sinking function |
-
2018
- 2018-06-29 CN CN201821039138.2U patent/CN208425098U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110022668A (en) * | 2019-05-27 | 2019-07-16 | 重庆力华自动化技术有限责任公司 | A kind of power-type electronic product with multi-panel heat sinking function |
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