WO2022213384A1

WO2022213384A1 - Lens module, aircraft, handheld gimbal, and camera

Info

Publication number: WO2022213384A1
Application number: PCT/CN2021/086257
Authority: WO
Inventors: 王平; 王雨浓; 高志浩
Original assignee: 深圳市大疆创新科技有限公司
Priority date: 2021-04-09
Filing date: 2021-04-09
Publication date: 2022-10-13

Abstract

A lens module (100), comprising a housing (10), at least one optical element (21), at least one member to undergo heat dissipation, and a heat-conducting member (50). The at least one optical element (21) is disposed inside of the housing (10), and the housing (10) is provided with a light-transmitting part (30). The light-transmitting part (30) is used for light to pass through, thereby reaching the at least one optical element (21). The at least one member to undergo heat dissipation is spaced apart from the light-transmitting part (30). The light-transmitting part (30) and the at least one member to undergo heat dissipation are both heat conductingly connected to the heat-conducting member (50), thereby heating the light-transmitting part (30), and relieving the phenomenon of the light-transmitting part (30) fogging up or freezing. The present invention further relates to an aircraft (1000), a handheld gimbal, and a camera.

Description

Lens module, aircraft, handheld gimbal and camera

technical field

The present application relates to the technical field of electronic equipment, and in particular, to a lens module, an aircraft, a handheld gimbal and a camera.

Background technique

Shooting equipment has been widely used in people's daily life, which provides convenience for recording every bit of people's life. The photographing device includes a lens and a casing for protecting the lens, the casing is provided with a light-transmitting part, and light can pass through the light-transmitting part to reach the lens. However, when the temperature difference between the inside and outside of the photographing device is large, especially in a scene where the weather is cold outside, the light-transmitting part is prone to fogging or freezing, which will affect the imaging quality of the photographing device.

SUMMARY OF THE INVENTION

The present application provides a lens module, an aircraft, a handheld gimbal and a camera, which are intended to heat the light-transmitting part, so as to alleviate the phenomenon of fogging or freezing in the light-transmitting part, thereby improving the imaging quality of the lens module.

In a first aspect, an embodiment of the present application provides a lens module, including:

a casing and at least one optical element, the at least one optical element is provided inside the casing, and the casing is provided with a light-transmitting part, the light-transmitting part is used for passing the light to reach the at least one optical element;

at least one piece to be radiated, arranged spaced apart from the light-transmitting part;

A heat-conducting member, the light-transmitting portion and the at least one heat-dissipating member are both thermally connected to the heat-conducting member.

In the lens module of the embodiment of the present application, the component to be dissipated includes an imaging element, the imaging element is arranged inside the housing, and at least part of the light passing through the optical element can reach the imaging element, so as to causing the imaging element to sense the light and generate image information; and/or,

The optical element includes a lens.

In the lens module of the embodiment of the present application, the light-transmitting portion and the imaging element are arranged at intervals along the optical axis of the optical element.

In the lens module of the embodiment of the present application, the imaging element includes:

substrate;

An imaging sensor is provided on the substrate; the substrate and/or the imaging sensor are thermally connected to the thermally conductive member.

In the lens module of the embodiment of the present application, the component to be radiated includes a controller, and the controller includes a control chip or a control circuit board.

In the lens module of the embodiment of the present application, at least one of the components to be radiated includes an imaging element and the controller, and both the imaging element and the controller are thermally connected to the heat-conducting component.

In the lens module of the embodiment of the present application, the light-transmitting portion and the controller are arranged at intervals; and/or,

The controller is used to control at least one of focusing, shutter and aperture adjustment of the optical element.

In the lens module of the embodiment of the present application, at least one of the components to be radiated further includes at least one of the optical elements.

In the lens module of the embodiment of the present application, the component to be radiated includes an imaging element, and the imaging element is configured to receive at least part of the light transmitted through the at least one optical element and generate image information; the lens module The group also includes:

A temperature detection element for detecting the temperature of the optical element, and the temperature of the optical element is used to obtain the distance between the optical element and the imaging element.

In the lens module of the embodiment of the present application, the lens module further includes:

The carrier is arranged in the casing, and the temperature detection element is carried on the carrier.

In the lens module of the embodiment of the present application, the temperature detection element is disposed on a side surface of the carrier facing the optical element; or,

The temperature detection element is disposed on a side surface of the carrier away from the optical element.

In the lens module of the embodiment of the present application, the carrier is wound around the optical element; and/or,

The carrier forms a non-closed structure.

In the lens module of the embodiment of the present application, the carrier includes:

a carrying part, on which the temperature detection element is carried;

The first bending extension part is bent and extended from one end of the bearing part, and the controller of the lens module is arranged on the first bending extension part.

In the lens module of the embodiment of the present application, the bearing portion and the temperature detection element are disposed on the left or right side of the optical element; or,

The bearing portion and the temperature detection element are provided on the upper side or the lower side of the optical element.

In the lens module of the embodiment of the present application, the carrier further includes:

The second bending extension portion, the first bending extension portion and the second bending extension portion are respectively bent and extended from both ends of the bearing portion toward the same side.

a driving member, connected with the optical element, for driving the optical element to move; or,

The lens module further includes a driving member and an imaging element, and the driving member is connected with the imaging element for driving the imaging element to move.

In the lens module of the embodiment of the present application, the driving member is configured to control the movement of the optical element relative to the imaging element according to the temperature of the optical element; or,

The driving member is used for controlling the movement of the imaging element relative to the optical element according to the temperature of the optical element.

In the lens module of the embodiment of the present application, there is a one-to-one correspondence between the temperature of the optical element and the relative distance between the optical element and the imaging element.

In the lens module of the embodiment of the present application, the driving member includes a driving motor.

In the lens module of the embodiment of the present application, the driving motor includes a stepping motor.

In the lens module of the embodiment of the present application, the movement amount of the optical element or the imaging element is adjusted by adjusting the pulse signal sent to the stepping motor.

The position detection element is used for detecting the position information of the optical element, and sending the position information to the driving motor or the controller, so as to control the driving motor to work according to the position information.

In the lens module of the embodiment of the present application, the driving motor includes at least one of a voice coil motor, a piezoelectric motor, and an ultrasonic motor.

In the lens module of the embodiment of the present application, the heat conducting member includes a sheet-like structure.

In the lens module of the embodiment of the present application, the thermally conductive member is thermally connected to a surface of the light-transmitting portion facing the member to be radiated; and/or, the thermally conductive member is thermally connected to the member to be radiated one side surface away from the light-transmitting part.

In the lens module of the embodiment of the present application, the middle portion of the thermally conductive member is thermally connected to the controller of the lens module.

In the lens module of the embodiment of the present application, the thermally conductive member includes a graphite thermally conductive sheet; and/or,

The light-transmitting portion and/or the member to be radiated are thermally connected to the thermally conductive member through a thermally conductive adhesive layer.

In a second aspect, an embodiment of the present application provides an aircraft, including:

body;

A gimbal connected to the body; and

The lens module described in any one of the above is connected to the pan/tilt.

In a third aspect, an embodiment of the present application provides a handheld cloud platform, including:

at least one of a pitch axis assembly, a roll axis assembly, and a pan axis assembly; and

The lens module described in any one of the above, the lens module is connected to the pitch axis assembly, the roll axis assembly or the pan axis assembly.

In a fourth aspect, an embodiment of the present application provides a camera, including:

The lens module described in any one of the above; and

A focus function key, the focus function key is arranged on the casing and is used to control the movement of the at least one optical element.

Embodiments of the present application provide a lens module, an aircraft, a handheld gimbal, and a camera. The light-transmitting portion of the lens module and at least one component to be radiated are thermally connected to the thermally conductive component, so that the heat on the component to be radiated can pass through The heat-conducting member is conducted to the light-transmitting portion, so that, on the one hand, the heat on the member to be radiated can be dissipated in time. On the other hand, it can heat the light-transmitting part, reduce the temperature difference between different parts of the light-transmitting part, and alleviate the fogging or freezing of the lens module under cold environment, high temperature and humidity, or cold and heat shock and other working conditions, which are difficult to dissipate. problems, thereby improving the imaging quality of the lens module.

It should be understood that the above general description and the following detailed description are only exemplary and explanatory, and do not limit the disclosure of the embodiments of the present application.

Description of drawings

In order to explain the technical solutions of the embodiments of the present application more clearly, the following briefly introduces the accompanying drawings used in the description of the embodiments. Obviously, the drawings in the following description are some embodiments of the present application. For those of ordinary skill in the art, other drawings can also be obtained from these drawings without any creative effort.

1 is a cross-sectional view of a lens module provided by an embodiment of the present application;

2 is a partial cross-sectional view of a lens module provided by an embodiment of the present application;

3 is an exploded schematic view of a lens module provided by an embodiment of the present application;

4 is a partial structural schematic diagram of a lens module provided by an embodiment of the present application;

5 is a partial structural schematic diagram of a lens module provided by an embodiment of the present application;

6 is a partial structural schematic diagram of a lens module provided by an embodiment of the present application;

7 is an exploded schematic view of a lens module provided by an embodiment of the present application;

8 is a partial structural schematic diagram of a lens module provided by an embodiment of the present application;

9 is a partial structural schematic diagram of a lens module provided by an embodiment of the present application;

FIG. 10 is a schematic diagram showing the relationship between the position and the temperature of the optical element provided by the embodiment of the present application.

11 is a partial structural schematic diagram of a lens module provided by an embodiment of the present application;

12 is a partial structural schematic diagram of a lens module provided by an embodiment of the present application;

13 is a partial structural schematic diagram of a lens module provided by an embodiment of the present application;

FIG. 14 is a schematic structural diagram of an aircraft provided by an embodiment of the present application.

Description of reference numbers:

100. Lens module;

10. Outer shell; 11. First shell part; 111. Light transmission hole; 12. Second shell part; 13. Receiving space;

21. Optical element; 22. Housing;

30. Translucent part;

41, imaging element; 411, substrate; 412, imaging sensor; 42, controller;

50. Thermal components; 60. Temperature detection components;

70, a carrier; 71, a carrier; 72, a first bending extension; 73, a second bending extension;

80. Drive parts;

1000, aircraft; 200, fuselage; 201, center frame; 202, arm; 300, gimbal; 400, propeller; 500, power motor.

Detailed ways

The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present application. Obviously, the described embodiments are part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present application.

In the description of this application, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", " rear, left, right, vertical, horizontal, top, bottom, inside, outside, clockwise, counterclockwise, etc., or The positional relationship is based on the orientation or positional relationship shown in the accompanying drawings, which is only for the convenience of describing the present application and simplifying the description, rather than indicating or implying that the referred device or element must have a specific orientation, be constructed and operated in a specific orientation, Therefore, it should not be construed as a limitation on this application. In addition, the terms "first" and "second" are only used for descriptive purposes, and should not be construed as indicating or implying relative importance or implying the number of indicated technical features. Thus, features defined as "first", "second" may expressly or implicitly include one or more of said features. In the description of the present application, "plurality" means two or more, unless otherwise expressly and specifically defined.

It should also be understood that the terms used in the specification of the present application are for the purpose of describing particular embodiments only and are not intended to limit the present application. As used in this specification and the appended claims, the singular forms "a," "an," and "the" are intended to include the plural unless the context clearly dictates otherwise.

It should also be further understood that, as used in this specification and the appended claims, the term "and/or" refers to and including any and all possible combinations of one or more of the associated listed items .

Some embodiments of the present application will be described in detail below with reference to the accompanying drawings. The embodiments described below and features in the embodiments may be combined with each other without conflict.

Referring to FIG. 1 , a lens module 100 provided by an embodiment of the present application includes a housing 10 , an optical element 21 , a heat-dissipating member 40 (not shown in the figure) and a heat-conducting member 50 . The number of optical elements 21 includes at least one. At least one optical element 21 is provided inside the housing 10 . The housing 10 is provided with a light-transmitting portion 30 , and the light-transmitting portion 30 is used for passing light to reach at least one optical element 21 . The number of the members 40 to be radiated includes at least one. At least one member to be radiated 40 is spaced apart from the light-transmitting portion 30 . The light-transmitting portion 30 and the at least one component to be radiated 40 are both thermally connected to the heat-conducting component 50 . Optionally, the member to be dissipated 40 may include one or more of the imaging element 41 , the controller 42 , or other elements that need dissipating heat.

In the lens module 100 of the above-mentioned embodiment, the light-transmitting portion 30 and at least one component to be radiated are thermally connected to the heat-conducting component 50, so the heat on the component to be radiated can be conducted to the light-transmitting portion 30 through the heat-conducting component 50. In this way, a In one aspect, the heat on the part to be radiated can be dissipated in time, the risk of thermal deformation or damage of the part to be radiated due to excessive temperature and affecting the imaging quality can be reduced, thereby improving the imaging quality. On the other hand, the light-transmitting portion 30 can be heated, the temperature difference between different parts of the light-transmitting portion 30 can be reduced, and the lens module 100 can be relieved from fogging or freezing under conditions such as cold environment, high temperature and high humidity, or thermal shock. It is difficult to dissipate the problem, thereby further improving the imaging quality of the lens module 100 .

Exemplarily, the number of optical elements 21 can be set according to actual requirements, such as one, two, three, four or more.

Exemplarily, the number of parts to be radiated can be set according to actual requirements, such as one, two, three, four or more.

It can be understood that the parts to be radiated and the light-transmitting part 30 are arranged at intervals, including any situation in which the part to be radiated and the light-transmitting part 30 are not in direct contact. For example, it includes: the part to be radiated and the light-transmitting part 30 are spaced parallel to each other, and another example includes: the part to be radiated and the light-transmitting part 30 are spaced apart and perpendicular. Of course, it may also include: the angle between the part to be radiated and the light-transmitting part 30 is an obtuse angle or an acute angle, and the two are separated by a preset distance, and the preset distance is greater than zero.

Exemplarily, the light-transmitting part 30 is in contact and thermally connected with the heat-conducting member 50 . For example, the light-transmitting portion 30 and the heat-conducting member 50 are thermally connected through surface contact, point contact, or line contact. Of course, the light-transmitting portion 30 may also be indirectly thermally connected to the thermally conductive member 50 through a thermally conductive adhesive layer or the like.

Exemplarily, the part to be dissipated and the heat conducting part 50 are in contact and thermally connected. For example, the heat-dissipating member and the heat-conducting member 50 are thermally connected through surface contact, point contact or line contact. Of course, in other embodiments, the heat-dissipating member may also be indirectly thermally connected to the heat-conducting member 50 through a heat-conducting adhesive layer or the like.

Exemplarily, the above-mentioned thermally conductive adhesive layer adopts an adhesive layer with high thermal conductivity and thin thickness to ensure efficient heat conduction between the component to be radiated (or the light-transmitting portion 30 ) and the thermally conductive component 50 . Exemplarily, the thermally conductive adhesive layer is a double-sided thermally conductive adhesive layer, and both sides of the double-sided thermally conductive adhesive layer are respectively attached to the component to be radiated (or the light-transmitting portion 30 ) and the thermally conductive component 50 . The double-sided thermally conductive adhesive layer may include a substrate-containing or non-substrate adhesive tape structure, which is not limited herein.

Exemplarily, the lens module 100 includes one camera assembly, two camera assemblies, three camera assemblies, or more camera assemblies. Each camera assembly includes at least one optical element 21 as described above.

Exemplarily, the lens module 100 can be mounted on a movable platform such as an unmanned aerial vehicle or a movable vehicle, and is used to obtain environmental image information of the environment in which the movable platform is located, so as to realize obstacle avoidance tasks or shooting tasks.

Exemplarily, the camera assembly includes at least one optical element 21 in any of the embodiments of the present application. When one camera assembly can meet the application scenario requirements of the lens module 100, the lens module 100 may only be provided with one camera assembly, and the camera assembly may include one of a telephoto lens, a wide-angle lens, and the like.

When the lens module 100 needs multiple camera assemblies to meet the shooting requirements, the lens module 100 can be configured as a structure including at least two camera assemblies. The structures or parameters of each of the at least two camera assemblies may be the same or different, and may be partially the same and different in other parts.

Exemplarily, the lens module 100 includes at least two camera assemblies, and each camera assembly is equipped with different numbers or different parameters (such as focal lengths) of optical elements. For example, when the lens module 100 needs both telephoto shooting and wide-angle shooting, the lens module 100 includes a camera assembly with a long focal length and a camera assembly with a wide angle, so that the lens module 100 can achieve telephoto Shooting and wide-angle shooting.

Exemplarily, each camera assembly is correspondingly provided with one imaging element 41 .

Exemplarily, the lens module 100 includes at least two camera assemblies, and the at least two camera assemblies share one imaging element 41 .

Exemplarily, each camera assembly is correspondingly provided with one of the above-mentioned light-transmitting parts 30 .

Exemplarily, the lens module 100 includes a plurality of camera assemblies, and at least two camera assemblies share a light-transmitting portion 30 .

Exemplarily, when the lens module 100 includes at least two camera assemblies, the at least two camera assemblies may share one thermally conductive member 50 . In other embodiments, when the lens module 100 includes at least two camera assemblies, each of the at least two camera assemblies may be provided with a heat conducting member 50 correspondingly. In still other embodiments, when the lens module 100 includes at least three camera assemblies, at least two of the at least three camera assemblies share one thermally conductive member 50, and at least another of the at least three camera assemblies is designed with another one Thermally conductive member 50 .

Exemplarily, when the lens module 100 includes at least three camera assemblies, the at least three camera assemblies share one thermally conductive member 50 . That is, all the camera assemblies share one heat conducting member 50 .

Exemplarily, at least one element to be dissipated is provided in the housing 10 .

Referring to FIGS. 2 and 3 , in some embodiments, the housing 10 includes a first shell portion 11 and a second shell portion 12 . The first shell portion 11 is connected with the second shell portion 12 and cooperates to form an accommodation space 13 for accommodating the optical element 21, the heat-dissipating member and the heat-conducting member 50.

Referring to FIG. 2 , by way of example, opposite sides of the light-transmitting portion 30 face the inside and outside of the receiving space 13 , respectively. The heat on the heat-dissipating member can be conducted to the light-transmitting portion 30 through the heat-conducting member 50, thereby heating the light-transmitting portion 30, reducing the temperature difference between the inner and outer surfaces of the light-transmitting portion 30, and relieving the lens module 100 in a cold environment, high temperature and high temperature. It is difficult to dissipate fog or ice under working conditions such as wet or thermal shock.

Exemplarily, the first shell portion 11 and the second shell portion 12 are combined and connected by at least one of snap-fitting, screwing, adhesive connection, and the like.

The first shell portion 11 and the second shell portion 12 can be designed in any suitable shape according to actual requirements, as long as they are connected and cooperated to form the accommodation space 13 for accommodating the optical element 21 , the heat-dissipating member and the heat-conducting member 50 .

It can be understood that the schematic diagrams of the optical elements 21 in FIGS. 1 to 3 are only exemplary, but do not limit the number, shape and/or structure of the optical elements 21 . In the actual application process, the number, shape and/or structure of the optical elements 21 may be changed according to the actual application scenario.

Illustratively, the optical element 21 includes a lens. The optical element 21 includes a lens group.

Referring to FIG. 2 , for example, the light-transmitting portion 30 is provided on the first housing portion 11 to protect the optical element 21 from contamination. For example, the light-transmitting portion 30 is used to reduce dust and liquid outside the lens module 100 from entering the housing 10 to contaminate the optical element 21 and affect the normal operation of the optical element 21; and/or the light-transmitting portion 30 is used to reduce external air or The operator's touch affects the shooting effect.

Exemplarily, the light-transmitting portion 30 is made of a transparent or translucent material, so as to ensure that light can pass through the light-transmitting portion 30 to reach at least one optical element 21 . For example, the light-transmitting portion 30 is made of glass.

Illustratively, the light-transmitting portion 30 has thermal conductivity. Optionally, the thermal conductivity of the light-transmitting portion 30 is smaller than that of the thermally conductive member 50 .

Referring to FIG. 2 , for example, the light-transmitting portion 30 is disposed opposite to the at least one optical element 21 . In other embodiments, the light-transmitting portion 30 may also be disposed not directly opposite to the at least one optical element 21 . For example, the included angle between the light-transmitting portion 30 and the at least one optical element 21 is an acute angle, a right angle or an obtuse angle.

Exemplarily, the light-transmitting part 30 may be integrally formed with the housing 10 .

Exemplarily, the light-transmitting portion 30 may also be provided separately from the first shell portion 11, and the two are connected by at least one of magnetic connection, plug connection, snap connection, fastener connection, screw connection, and adhesive connection. A way to combine connections. Referring to FIGS. 2 and 3 , for example, the first shell portion 11 is provided with a light-transmitting hole 111 , and the light-transmitting portion 30 is provided at the light-transmitting hole 111 . The light can pass through the light-transmitting hole 111 and the light-transmitting portion 30 to reach at least one optical element 21.

Exemplarily, the size of the light-transmitting portion 30 is larger than the size of the light-transmitting hole 111 .

The shape of the light-transmitting portion 30 is adapted to the shape of the at least one optical element 21 , so that light can normally pass through the light-transmitting portion 30 to reach the at least one optical element 21 , and can effectively protect the optical element 21 from contamination. Exemplarily, the light-transmitting portion 30 is in the shape of a sheet, so that on the premise of protecting the optical element 21 from contamination, the mass of the light-transmitting portion 30 can be reduced as much as possible so as to realize the lightening of the lens module 100 , and The influence of the light-transmitting portion 30 on the propagation direction of the light is reduced as much as possible.

The thermally conductive member 50 is made of thermally conductive material. Exemplarily, the thermally conductive material of the thermally conductive member 50 may be metal, such as at least one of copper, aluminum, silver, and the like. Of course, the thermally conductive material of the thermally conductive member 50 may also be a non-metal, such as at least one of carbon fiber, graphite, and the like.

The heat-conducting member 50 can be designed into any suitable structure according to actual requirements. Referring to FIG. 3 , for example, the heat-conducting member 50 includes a sheet-like structure, which can not only ensure an effective heat-conducting area, but also reduce the mass of the heat-conducting member 50 . Illustratively, the thermally conductive member 50 includes a graphite thermally conductive sheet. Graphite has good thermal conductivity and good plasticity, and can be made into thin sheets as thin as possible. Therefore, the graphite heat-conducting sheet made of graphite is light in weight and small in volume, which facilitates the heat-conducting connection of the heat-conducting member 50 to the heat-dissipating member flexibly.

The heat-conducting member 50 can be designed into any suitable shape according to actual requirements, for example, a bending shape as shown in FIG. 3 . Of course, the thermally conductive member 50 is not limited to the shape in FIG. 3 .

Exemplarily, the at least one component to be dissipated includes at least one of the imaging element 41 , the controller 42 , the optical element 21 , other electronic components, optical components and the like provided in the housing 10 .

Illustratively, the member to be dissipated may be the imaging element 41 . The element to be dissipated may also be the controller 42 . Of course, the component to be radiated may also be the optical element 21 or other components in the housing 10 .

1 and 3, in some embodiments, the member to be dissipated includes an imaging element 41. The imaging element 41 is provided inside the housing 10 . At least part of the light transmitted from the optical element 21 can reach the imaging element 41 so that the imaging element 41 senses the light and generates image information.

In this embodiment, the heat-conducting member 50 can conduct the heat on the imaging element 41 to the light-transmitting part 30 , so as to dissipate the heat generated by the imaging element 41 in time, and heat the light-transmitting part 30 to reduce the light-transmitting part 30 . 30 The temperature difference between different parts alleviates the problem that the lens module 100 is difficult to dissipate due to fogging or freezing under cold environment, high temperature and humidity, or cold and thermal shock, thereby further improving the imaging quality of the lens module 100.

Please refer to FIG. 4 to FIG. 6 , in conjunction with FIG. 1 and FIG. 2 , in some embodiments, the light-transmitting portion 30 and the imaging element 41 are arranged at intervals along the optical axis of the optical element 21. In other embodiments, the light-transmitting portion 30 and the imaging element 41 may not be disposed along the optical axis of the optical element 21 , for example, the light-transmitting portion 30 is perpendicular to the optical axis of the optical element 21 , and the imaging element 41 is perpendicular to the optical axis of the optical element 21 . parallel etc.

Referring to FIGS. 6 and 7 , in some embodiments, the imaging element 41 includes a substrate 411 and an imaging sensor 412 . The imaging sensor 412 is provided on the substrate 411 . The substrate 411 and/or the imaging sensor 412 are thermally connected to the thermally conductive member 50 , so as to dissipate the heat on the substrate 411 and/or the imaging sensor 412 and heat the light-transmitting portion 30 .

Exemplarily, the substrate 411 is thermally connected to the thermally conductive member 50 . The imaging sensor 412 is thermally connected to the substrate 411 . The heat on the imaging sensor 412 can be conducted to the substrate 411 , and the heat on the substrate 411 is conducted to the light-transmitting part 30 through the heat conducting member 50 .

In some embodiments, the heat-conducting member 50 is directly or indirectly attached to the imaging sensor 412 , and the heat generated by the imaging sensor 412 can be conducted to the light-transmitting portion 30 through the heat-conducting member 50 . Exemplarily, the thermally conductive member 50 is directly or indirectly attached to the substrate 411 , and the heat on the substrate 411 can be conducted to the light-transmitting portion 30 through the thermally conductive member 50 .

Exemplarily, the imaging sensor 412 utilizes the photoelectric conversion function of the photoelectric device to convert the optical signal received on the photosensitive surface thereof into an electrical signal corresponding to the optical signal.

Referring to FIG. 4 to FIG. 6 , in some embodiments, the thermally conductive member 50 is thermally connected to a surface of the light-transmitting portion 30 facing the heat-dissipating member, so that the arrangement design of the light-transmitting portion 30 and the thermally conductive member 50 is simple. Exemplarily, the heat-conducting member 50 is heat-conductively connected to a side surface of the light-transmitting portion 30 facing the imaging element 41 . In other embodiments, the heat-conducting member 50 may also be thermally connected to other parts of the light-transmitting portion 30 , for example, the heat-conducting member 50 is thermally connected to a surface of the light-transmitting portion 30 away from the imaging element 41 .

Referring to FIG. 4 to FIG. 6 , in some embodiments, the thermally conductive member 50 is thermally connected to a surface of the to-be-dissipated member away from the light-transmitting portion 30 . Exemplarily, the thermally conductive member 50 is thermally connected to a surface of the imaging element 41 on one side away from the light-transmitting portion 30 . In other embodiments, the thermally conductive member 50 is thermally connected to other components in the imaging element 41 that generate relatively large heat.

In other embodiments, the thermally conductive member 50 may also be thermally connected to other parts of the imaging element 41 , for example, the thermally conductive member 50 is thermally connected to a surface of the imaging element 41 facing the light-transmitting portion.

Referring to FIG. 1 , in some embodiments, the component to be dissipated includes a controller 42 . The controller 42 includes a control chip or a control circuit board. The controller 42 is installed in the accommodating space 13 . Exemplarily, the controller 42 is used to control at least one of focusing, shuttering, adjusting aperture and the like of the optical element 21 .

Referring to FIGS. 1 and 9 , at least one component to be dissipated includes an imaging element 41 and a controller 42 , and both the imaging element 41 and the controller 42 are thermally connected to the thermally conductive member 50 .

Referring to FIGS. 1 and 9 , in some embodiments, the middle portion of the heat-conducting member 50 is thermally connected to the controller 42 of the lens module 100 , so that the heat generated by the controller 42 can be conducted to the light-transmitting portion through the heat-conducting member 50 30. In this way, on the one hand, the heat on the controller 42 can be dissipated in time, thereby reducing the risk of thermal deformation or damage to the controller 42 due to excessive temperature and affecting the imaging quality, thereby improving the imaging quality. On the other hand, the light-transmitting portion 30 can be heated, the temperature difference between different parts of the light-transmitting portion 30 can be reduced, and the lens module 100 can be relieved from fogging or freezing under conditions such as cold environment, high temperature and high humidity, or thermal shock. It is difficult to dissipate the problem, thereby further improving the imaging quality of the lens module 100 .

Referring to FIG. 1 and FIG. 9 , by way of example, the light-transmitting part 30 and the controller 42 are arranged at intervals.

In some embodiments, at least one member to be dissipated further includes at least one optical element 21 . It can be understood that the housing space 13 is provided with components such as the imaging element 41 and the controller 42, and the heat generated by these components during operation may be conducted to other components in the housing space 13, such as optical elements, by means of thermal radiation or heat conduction. twenty one. The optical element 21 is relatively sensitive to temperature. If the optical element 21 is thermally deformed due to temperature changes, the image quality of the lens module 100 will be degraded. In this embodiment, the thermally conductive member 50 is thermally connected to at least one optical element 21 , so as to dissipate heat from the optical element 21 in time to reduce thermal deformation of the optical element 21 and improve the imaging quality of the lens module 100 . In addition, the light-transmitting portion 30 can also be heated, thereby reducing the temperature difference between different parts of the light-transmitting portion 30, and alleviating the difficulty of fogging or freezing of the lens module 100 under cold environment, high temperature, high humidity, or thermal shock and other working conditions. dissipated problem.

Referring to FIG. 1 , in some embodiments, the component to be dissipated includes an imaging element 41 . The imaging element 41 is used to receive at least part of the light transmitted from the at least one optical element 21 and generate image information. Please refer to FIG. 9 , the lens module 100 further includes a temperature detection element 60 for detecting the temperature of the optical element 21 . The temperature of the optical element 21 is used to obtain the distance of the optical element 21 relative to the imaging element 41 .

Understandably, in the lens module 100 of the above embodiment, the temperature of the optical element 21 is detected by the temperature detection element 60 , and the temperature of the optical element 21 can be used to obtain the distance between the optical element 21 and the imaging element 41 . By controlling the movement of the optical element 21 relative to the imaging element 41, or controlling the movement of the imaging element 41 relative to the optical element 21, the distance between the optical element 21 and the imaging element 41 is adjusted, thereby compensating for the degradation of the imaging quality caused by the temperature change of the optical element 21, Thus, the imaging quality of the lens module 100 is improved. The following takes controlling the movement of the optical element 21 relative to the imaging element 41 as an example for introduction. It should be noted that the principle of controlling the movement of the imaging element 41 relative to the optical element 21 is similar to that, and will not be repeated here.

Controlling the movement of the optical element 21 relative to the imaging element 41 exemplarily includes controlling the movement of at least one of the at least one optical element 21 to adjust the relative distance or relative position between the optical element 21 and the imaging element 41 .

Controlling the movement of the optical element 21 relative to the imaging element 41 exemplarily includes controlling the movement of each optical element 21 in at least one optical element 21 , thereby adjusting the relative distance or relative position between the optical element 21 and the imaging element 41 .

Exemplarily, there is a preset corresponding relationship between the relative position of the optical element 21 and the imaging element 41 and the temperature of the optical element 21 . In some embodiments, there is a one-to-one correspondence between the temperature of the optical element 21 and the relative distance between the optical element 21 and the imaging element 41 . Exemplarily, when the temperature of the optical element 21 is determined, the relative distance between the optical element 21 and the imaging element 41 can be determined according to the corresponding relationship, thereby controlling the movement of at least one of the at least one optical element 21 relative to the imaging element 41 .

Exemplarily, when the temperature of the optical element 21 is determined, the relative distance between the optical element 21 and the imaging element 41 can be determined according to a preset corresponding relationship, so as to control each optical element 21 in the at least one optical element 21 relative to the imaging element. 41 Movement.

For example, the number of optical elements 21 includes at least two. When the temperature of the optical element 21 closest to the imaging element 41 is determined, the relative distance between the imaging element 41 and the optical element 21 closest to the imaging element 41 can be determined according to the preset distance-temperature correspondence, so as to control each optical element 21 . Element 21 moves relative to imaging element 41 .

Illustratively, please refer to FIG. 10 , which shows a schematic diagram of the relationship between the position and temperature of the optical element 21 according to an embodiment of the present application. It can be seen from FIG. 10 that there is a one-to-one correspondence between the temperature of the optical element 21 and the relative position between the optical element 21 and the imaging element 41 . When the temperature of the optical element 21 is detected, the relative distance between the optical element 21 and the imaging element 41 can be determined from the corresponding relationship in FIG.

Exemplarily, the abscissa in FIG. 10 represents the temperature of the optical element 21 , and the ordinate d represents the distance between the optical element 21 and the imaging element 41 . The optical element 21 may be an optical element detected by the temperature detection element 60 . The optical elements detected by the temperature detection element 60 may be one, a plurality, or all of all the optical elements. Exemplarily, when there is only one optical element detected by the temperature detection element 60 , it may be the one optical element that is closest to the imaging element 41 .

Taking the optical element 21 as an optical element closest to the imaging element as an example below, the control principle of the embodiment of the present application will be described with reference to FIG. 10 . It should be noted that this does not limit the protection scope of the present application. The embodiments that follow the principles of the embodiments of the present application will fall within the protection scope of the present application. Exemplarily, when the lens module 100 is in the initial state or the factory state, there is an initial relative distance d0 between the center of the optical element 21 closest to the imaging element 41 and the imaging element 41 . Exemplarily, the ordinate d=0 in FIG. 10 indicates that in the actual application process of the lens module 100, if the optical element 21 is not affected by the temperature or the optical element 32 is not thermally deformed, an optical element closest to the imaging element 41 is not affected by the temperature. The distance between the center of the element 21 and the imaging element 41 is d0, and there is no need to control the movement of the optical element 21 relative to the imaging element 41 . When the optical element 21 undergoes thermal deformation due to temperature change, after detecting the temperature of the optical element 21 closest to the imaging element 41 , the distance d1 corresponding to the temperature of the optical element 21 is determined from the correspondence in FIG. 10 . The lens module 100 controls at least one optical element 21 to move relative to the imaging element 41 , so that the distance between the optical element 21 and the imaging element 41 is d1 , thereby compensating for thermal deformation of the optical element 21 and improving the imaging quality of the lens module 100 .

Referring to FIG. 10 , for example, when the temperature T of the optical element 21 closest to the imaging element 41 is -10° C., the distance d corresponding to the temperature of the optical element 21 is 20 μm. The lens module 100 controls at least one optical element 21 to move relative to the imaging element 41 so that the distance between the optical element 21 and the imaging element 41 is 20 μm, thereby compensating for thermal deformation of the optical element 21 and improving the imaging quality of the lens module 100 .

Referring to FIG. 10 , for example, when the temperature T of the optical element 21 closest to the imaging element 41 is 25° C., the distance d corresponding to the temperature of the optical element 21 is 0 μm. The optical element 21 is controlled to move relative to the imaging element 41 so that the distance between the optical element 21 and the imaging element 41 is 0 μm. Referring to FIG. 10 , for example, when the temperature T of the optical element 21 closest to the imaging element 41 is 60° C., the distance d corresponding to the temperature of the optical element 21 is −30 μm. The lens module 100 controls at least one optical element 21 to move relative to the imaging element 41 so that the distance between the optical element 21 and the imaging element 41 is -30 μm, thereby compensating for thermal deformation of the optical element 21 and improving the imaging quality of the lens module 100 .

Optionally, the distance that the optical element 21 should move can be calculated according to the current distance of the optical element 21 relative to the imaging element 41 and the distance corresponding to the temperature of the optical element 21, so as to control the movement of the optical element 21. If the current distance of the element 21 relative to the imaging element 41 is the same as the distance corresponding to the temperature of the optical element 21 , there is no need to control the movement of the optical element 21 .

It should be noted that the schematic diagram of the relationship between the position and the temperature of the optical element 21 shown in FIG. 10 is only an example. In the actual application process, the relationship between the position and the temperature can be changed according to the actual application scene, and does not constitute a limit.

Referring to FIG. 9 , FIG. 11 and FIG. 12 , in some embodiments, the lens module 100 further includes a carrier 70 . The carrier 70 is disposed in the casing 10 . The temperature detection element 60 is carried on the carrier 70 .

Illustratively, please refer to FIG. 3 , FIG. 9 and FIG. 11 , the lens module 100 further includes a housing 22 disposed in the receiving space 13 . At least one optical element 21 is provided on the housing 22 .

Exemplarily, the casing 22 is fixedly connected to the first casing part 11 or the outer casing 10 by means of gluing or the like. The carrier 70 is fixedly connected to the housing 22 through fasteners (such as screws) or the like. The optical element 21 is fixed on the housing 22 by means of adhesive connection or the like. The imaging element 41 is fixed on the housing 22 by means of adhesive bonding or the like.

Referring to FIG. 9 , for example, the temperature detection element 60 is disposed on the side surface of the carrier 70 away from the optical element 21 , so that the layout design of the temperature detection element 60 is simple and the temperature of the optical element 21 can be accurately detected. For another example, the temperature detection element 60 is disposed on the side surface of the carrier 70 facing the optical element 21 .

Of course, the temperature detection element 60 can also be arranged at any other suitable position according to actual requirements, such as being arranged on the imaging element 41 , the optical element 21 or the housing 22 , etc., which is not limited here.

Referring to FIG. 8 , in some embodiments, the carrier 70 is wound around the optical element 21 . Exemplarily, the carrier 70 is wound around the outside of the housing 22 , and at least one optical element 21 is at least partially arranged inside the housing 22 , so that the carrier 70 and the housing 22 are easily assembled.

Referring to FIG. 12 , the carrier 70 forms a non-closed structure, so as to reduce the weight of the carrier 70 ; and/or to avoid at least one component on the housing 22 .

Referring to FIG. 12 , the carrier 70 includes a carrier portion 71 and a first bending extension portion 72 . The temperature detection element 60 is carried on the carrying portion 71 . The first bending extension portion 72 is bent and extended from one end of the bearing portion 71 . The controller 42 of the lens module 100 is disposed on the first bending extension portion 72 . In this way, on the premise of ensuring that the carrier 70 carries the controller 42 and the temperature detection element 60 , the occupied space of the lens module 100 can be reduced as much as possible.

Illustratively, the carrier portion 71 is located between the temperature detection element 60 and the optical element 21 . In other embodiments, the temperature detection element 60 may also be located between the bearing portion 71 and the optical element 21 .

Referring to FIG. 9 , in some embodiments, the bearing portion 71 and the temperature detection element 60 are disposed on the left or right side of the optical element 21 . Exemplarily, the X direction in FIG. 9 is the left and right direction. The left and right sides of the optical element 21 are opposite sides in the left-right direction of the optical element 21 . Exemplarily, the bearing portion 71 and the temperature detection element 60 are provided on the left or right side of the housing 22 .

In some embodiments, the bearing portion 71 and the temperature detection element 60 are disposed on the upper side or the lower side of the optical element 21 . Exemplarily, the Y direction in FIG. 9 is the up-down direction. The upper side and the lower side of the optical element 21 are opposite sides of the optical element 21 in the up-down direction. Exemplarily, the bearing portion 71 and the temperature detection element 60 are provided on the upper side or the lower side of the housing 22 .

Referring to FIG. 12 , in some embodiments, the carrier 70 further includes a second bending extension portion 73 . The first bending extension portion 72 and the second bending extension portion 73 are respectively bent and extended from both ends of the bearing portion 71 toward the same side. In this way, the first bending extension portion 72 and the second bending extension portion 73 can be located on opposite sides of the housing 22 respectively, thereby reducing the volume of the carrier 70 and the housing 22 after assembly.

Exemplarily, the second bending extension portion 73 can carry other components of the lens module 100 , such as chips and the like.

Referring to FIG. 13 , in some embodiments, the lens module 100 further includes a driving member 80 . Optionally, the driving member 80 is connected to the optical element 21 for driving the optical element 21 to move. Optionally, the lens module 100 further includes a driver 80 and an imaging element 41 , and the driver 80 is connected to the imaging element 41 for driving the imaging element 41 to move.

In some embodiments, the number of optical elements 21 may include a plurality. Exemplarily, each optical element 21 is correspondingly provided with one driving member 50 . A drive member 50 drives an optical element 21 to move. Exemplarily, one driving member 50 can also drive at least two optical elements 21 to move at the same time.

Illustratively, the driver 80 is in communication with the controller 42 . The driving element 80 can receive the driving control signal sent by the controller 42 and control the movement of the optical element 21 according to the driving control signal, so as to adjust the relative position between the optical element 21 and the imaging element 41 to improve the imaging quality of the lens module 100 .

In some embodiments, optionally, the driving member 80 is configured to control the movement of the optical element 21 relative to the imaging element 41 according to the temperature of the optical element 21 to compensate for thermal deformation of the optical element 21 , thereby improving the imaging quality of the lens module 100 . Optionally, the driving member 80 is configured to control the movement of the imaging element 41 relative to the optical element 21 according to the temperature of the optical element 21 to compensate for thermal deformation of the optical element 21 , thereby improving the imaging quality of the lens module 100 .

Illustratively, the temperature detection element 60 is communicatively connected to the driver 80 . The temperature of the optical element 21 detected by the temperature detection element 60 may be sent to the driving member 80 . The driver 80 can receive the temperature of the optical element 21 and determine the relative position between the optical element 21 and the imaging element 41 according to the temperature of the optical element 21 , thereby controlling the movement of the optical element 21 relative to the imaging element 41 .

Illustratively, the temperature detection element 60 and the driver 80 are respectively connected in communication with the controller 42 . The temperature of the optical element 21 detected by the temperature detection element 60 can be sent to the controller 42 . The controller 42 can receive the temperature of the optical element 21 sent by the temperature detection element 60, and determine the relative position between the optical element 21 and the imaging element 41 according to the temperature of the optical element 21, so as to generate a driving control signal and transmit the driving control signal. Sent to the driver 80 . After receiving the driving control signal, the driving element 80 can control the optical element 21 to move relative to the imaging element 41 .

In some embodiments, the drive member 80 includes a drive motor. In other embodiments, the driving member 80 may also be a motor or the like.

In some embodiments, the drive motor includes a stepper motor. Illustratively, by adjusting the pulse signal sent to the stepping motor, the amount of movement of the optical element 21 or the imaging element 41 is adjusted. In this way, the optical element 21 can be moved relative to the imaging element 41 by controlling the number of pulses of the stepping motor, so that the distance between the optical element 21 and the imaging element 41 is a preset distance, thereby compensating for the thermal deformation of the optical element 21 and improving the lens module. 100 image quality.

It can be understood that the driving member 80 adopts a stepping motor, which is low in cost, does not need to design a position sensor for detecting the optical element 21, and has a simple structure design.

In some embodiments, the lens module 100 further includes a position detection element (not shown) for detecting the position information of the optical element 21, and sending the position information to the driving motor or the controller 42, so as to detect the position information according to the position information Control the drive motor to work. In this way, in the process of controlling the movement of the optical element 21 relative to the imaging element 41 according to the temperature of the optical element 21, the relative position between the optical element 21 and the imaging element 41 can be obtained, so as to precisely control the movement of the optical element 21 to the preset position, thereby The thermal deformation of the optical element 21 is accurately compensated to ensure the imaging quality of the lens module 100 .

Exemplarily, the driving motor includes at least one of a voice coil motor, a piezoelectric motor, an ultrasonic motor, and the like.

Referring to FIG. 14 , the present application also provides an aircraft 1000 , which may be a rotary-wing unmanned aerial vehicle, a fixed-wing unmanned aerial vehicle, an unmanned helicopter, or a hybrid fixed-wing-rotor-wing unmanned aerial vehicle. The rotor unmanned aerial vehicle may be a single-rotor unmanned aerial vehicle or a multi-rotor unmanned aerial vehicle. Multi-rotor UAVs include dual-rotor, tri-rotor, quad-rotor, hexa-rotor, octa-rotor, ten-rotor, twelve-rotor, etc.

Referring to FIG. 14 , in some embodiments, the aircraft 1000 includes a body 200 , a gimbal 300 and a lens module 100 . The gimbal 300 is connected to the body 200 . The lens module 100 is connected to the gimbal 300 .

Exemplarily, the aircraft 1000 can control the orientation of the lens module 100 through the gimbal 300 . The lens module 100 is used for taking pictures and/or videos.

Referring to FIG. 14 , the fuselage 200 may include a center frame 201 and one or more arms 202 connected to the center frame 201 , and the one or more arms 202 extend radially from the center frame 201 .

Exemplarily, the gimbal 300 is fixedly or detachably connected to the body 200 .

Exemplarily, the gimbal 300 includes at least one of a pitch axis assembly, a roll axis assembly, and a pan axis assembly for driving the lens module 100 to move. When the lens module 100 is connected to the gimbal 300 , the lens module 100 is connected to any one of the pitch axis assembly, the roll axis assembly, and the pan axis assembly.

Exemplarily, the gimbal 300 may include only one of a pitch axis assembly, a roll axis assembly, and a pan axis assembly. The gimbal 300 may also include any two of a pitch axis assembly, a roll axis assembly, and a pan axis assembly. The gimbal 300 may also include a pitch axis assembly, a roll axis assembly, and a pan axis assembly.

Exemplarily, the lens module 100 includes the lens module 100 of any of the foregoing embodiments.

In some embodiments, the aircraft 1000 further includes a propeller 400 and a power motor 500 , and the power motor 500 is used to drive the propeller 400 to rotate, thereby providing the aircraft 1000 with flight power. The power motor 500 and the propeller 400 are arranged on the arm 202 .

In the aircraft 1000 of the above-mentioned embodiment, the light-transmitting part 30 of the lens module 100 and at least one part to be radiated are thermally connected to the heat-conducting part 50, so the heat on the part to be radiated can be conducted to the light-transmitting part 30 through the heat-conducting part 50, In this way, on the one hand, the heat on the part to be radiated can be dissipated in time, and the risk of thermal deformation or damage of the part to be radiated due to excessive temperature, which affects the imaging quality, thereby improving the imaging quality. On the other hand, the light-transmitting portion 30 can be heated, the temperature difference between different parts of the light-transmitting portion 30 can be reduced, and the lens module 100 can be relieved from fogging or freezing under conditions such as cold environment, high temperature and high humidity, or thermal shock. It is difficult to dissipate the problem, thereby further improving the imaging quality of the lens module 100 .

Embodiments of the present application further provide a handheld pan/tilt head, including at least one of a pitch axis assembly, a roll axis assembly, and a pan axis assembly; and the lens module 100 of any of the foregoing embodiments. The lens module 100 is connected to the pitch axis assembly, the roll axis assembly or the pan axis assembly.

It can be understood that the hand-held pan/tilt head may only include one of the pitch axis assembly, the roll axis assembly and the pan axis assembly. The handheld gimbal can also include any two of the pitch axis assembly, roll axis assembly, and pan axis assembly. The handheld gimbal may also include a pitch axis assembly, a roll axis assembly, and a pan axis assembly.

The lens module 100 is connected to any one of the pitch axis assembly, the roll axis assembly and the pan axis assembly.

Exemplarily, the lens module 100 may be fixedly connected to the pitch axis assembly, the roll axis assembly or the pan axis assembly. Of course, the lens module 100 can also be detachably connected to the pitch axis assembly, the roll axis assembly or the pan axis assembly.

In the handheld gimbal of the above-mentioned embodiment, the light-transmitting part 30 of the lens module 100 and at least one part to be radiated are thermally connected to the heat-conducting part 50 , so the heat on the part to be radiated can be conducted to the light-transmitting part 30 through the heat-conducting part 50 . In this way, on the one hand, the heat on the part to be radiated can be dissipated in time, and the risk of thermal deformation or damage of the part to be radiated due to excessive temperature, which affects the imaging quality, thereby improving the imaging quality. On the other hand, the light-transmitting portion 30 can be heated, the temperature difference between different parts of the light-transmitting portion 30 can be reduced, and the lens module 100 can be relieved from fogging or freezing under conditions such as cold environment, high temperature and high humidity, or thermal shock. It is difficult to dissipate the problem, thereby further improving the imaging quality of the lens module 100 .

An embodiment of the present application further provides a camera, including the lens module 100 of any of the above embodiments and a focus function key. The focus function key is arranged on the casing 10 and is used to control the movement of at least one optical element 21 .

In the camera of the above-mentioned embodiment, the light-transmitting portion 30 of the lens module 100 and at least one component to be radiated are thermally connected to the heat-conducting component 50 , so the heat on the component to be radiated can be conducted to the light-transmitting portion 30 through the heat-conducting component 50 . On the one hand, the heat on the part to be radiated can be dissipated in time, reducing the risk of thermal deformation or damage of the part to be radiated due to excessive temperature, which affects the imaging quality, thereby improving the imaging quality. On the other hand, the light-transmitting portion 30 can be heated, the temperature difference between different parts of the light-transmitting portion 30 can be reduced, and the lens module 100 can be relieved from fogging or freezing under conditions such as cold environment, high temperature and high humidity, or thermal shock. It is difficult to dissipate the problem, thereby further improving the imaging quality of the lens module 100 .

In the description of this application, it should be noted that, unless otherwise expressly specified and limited, the terms "installed", "connected" and "connected" should be understood in a broad sense, for example, it may be a fixed connection or a detachable connection connected, or integrally connected. It can be a mechanical connection or an electrical connection. It can be directly connected, or indirectly connected through an intermediate medium, and it can be the internal communication between two elements or the interaction relationship between the two elements. For those of ordinary skill in the art, the specific meanings of the above terms in this application can be understood according to specific situations.

In this application, unless otherwise expressly specified and defined, a first feature "on" or "under" a second feature may include direct contact between the first and second features, or may include the first and second features Not directly but through additional features between them. Also, the first feature being "above", "over" and "above" the second feature includes the first feature being directly above and diagonally above the second feature, or simply means that the first feature is level higher than the second feature. The first feature is "below", "below" and "below" the second feature includes the first feature being directly below and diagonally below the second feature, or simply means that the first feature has a lower level than the second feature.

The above disclosure provides many different implementations or examples for implementing different structures of the present application. To simplify the disclosure of the present application, the components and arrangements of specific examples are described above. Of course, they are only examples and are not intended to limit the application. Furthermore, this application may repeat reference numerals and/or reference letters in different instances for the purpose of simplicity and clarity, and does not in itself indicate a relationship between the various embodiments and/or arrangements discussed. In addition, this application provides examples of various specific processes and materials, but one of ordinary skill in the art will recognize the application of other processes and/or the use of other materials.

In the description of this specification, reference to the terms "one embodiment," "some embodiments," "exemplary embodiment," "example," "specific example," or "some examples", etc., is meant to incorporate the embodiments The specific method steps, features, structures, materials or characteristics described by way of example or are included in at least one embodiment or example of the present application. In this specification, schematic representations of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the particular method steps, features, structures, materials or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.

The above are only specific embodiments of the present application, but the protection scope of the present application is not limited thereto. Any person skilled in the art can easily think of various equivalents within the technical scope disclosed in the present application. Modifications or substitutions shall be covered by the protection scope of this application. Therefore, the protection scope of the present application shall be subject to the protection scope of the claims.

Claims

A lens module, comprising:

a casing and at least one optical element, the at least one optical element is provided inside the casing, and the casing is provided with a light-transmitting part, the light-transmitting part is used for passing the light to reach the at least one optical element;

at least one piece to be radiated, arranged spaced apart from the light-transmitting part;

A heat-conducting member, the light-transmitting portion and the at least one heat-dissipating member are both thermally connected to the heat-conducting member.
The lens module according to claim 1, wherein the component to be radiated comprises an imaging element, the imaging element is arranged inside the housing, and at least part of the light transmitted from the optical element can reach the an imaging element such that the imaging element senses the light and generates image information; and/or,

The optical element includes a lens.
The lens module according to claim 2, wherein the light-transmitting part and the imaging element are arranged at intervals along the optical axis of the optical element.
The lens module according to claim 2, wherein the imaging element comprises:

substrate;

An imaging sensor is provided on the substrate; the substrate and/or the imaging sensor are thermally connected to the thermally conductive member.
The lens module according to claim 1, wherein the component to be radiated comprises a controller, and the controller comprises a control chip or a control circuit board.
The lens module according to claim 5, wherein at least one of the components to be radiated includes an imaging element and the controller, and both the imaging element and the controller are thermally connected to the heat-conducting component.
The lens module according to claim 5, wherein the light-transmitting part and the controller are arranged at intervals; and/or,

The controller is used to control at least one of focusing, shutter and aperture adjustment of the optical element.
The lens module according to any one of claims 1-7, wherein at least one of the components to be radiated further includes at least one of the optical elements.
The lens module according to any one of claims 1-8, wherein the component to be dissipated comprises an imaging element, and the imaging element is configured to receive at least part of the light transmitted through the at least one optical element, and generate image information; the lens module further includes:

A temperature detection element for detecting the temperature of the optical element, and the temperature of the optical element is used to obtain the distance between the optical element and the imaging element.
The lens module according to claim 9, wherein the lens module further comprises:

The carrier is arranged in the casing, and the temperature detection element is carried on the carrier.
The lens module according to claim 10, wherein the temperature detection element is disposed on a side surface of the carrier facing the optical element; or,

The temperature detection element is disposed on a side surface of the carrier away from the optical element.
The lens module according to claim 10, wherein the carrier is wound around the optical element; and/or,

The carrier forms a non-closed structure.
The lens module according to claim 10, wherein the carrier comprises:

a carrying part, on which the temperature detection element is carried;

The first bending extension part is bent and extended from one end of the bearing part, and the controller of the lens module is arranged on the first bending extension part.
The lens module according to claim 13, wherein the bearing portion and the temperature detection element are arranged on the left or right side of the optical element; or,

The bearing portion and the temperature detection element are provided on the upper side or the lower side of the optical element.
The lens module according to claim 13, wherein the carrier further comprises:

The second bending extension portion, the first bending extension portion and the second bending extension portion are respectively bent and extended from both ends of the bearing portion toward the same side.
The lens module according to claim 9, wherein the lens module further comprises:

a driving member, connected with the optical element, for driving the optical element to move; or,

The lens module further includes a driving member and an imaging element, and the driving member is connected with the imaging element for driving the imaging element to move.
The lens module according to claim 16, wherein the driving member is configured to control the movement of the optical element relative to the imaging element according to the temperature of the optical element; or,

The driving member is used for controlling the movement of the imaging element relative to the optical element according to the temperature of the optical element.
The lens module according to claim 17, wherein there is a one-to-one correspondence between the temperature of the optical element and the relative distance between the optical element and the imaging element.
The lens module according to claim 16, wherein the driving member comprises a driving motor.
The lens module according to claim 19, wherein the driving motor comprises a stepping motor.
The lens module according to claim 20, wherein the movement amount of the optical element or the imaging element is adjusted by adjusting the pulse signal sent to the stepping motor.
The lens module according to claim 19, wherein the lens module further comprises:

The position detection element is used for detecting the position information of the optical element, and sending the position information to the driving motor or the controller, so as to control the driving motor to work according to the position information.
The lens module according to claim 22, wherein the driving motor comprises at least one of a voice coil motor, a piezoelectric motor, and an ultrasonic motor.
The lens module according to any one of claims 1-7, wherein the thermally conductive member comprises a sheet-like structure.
The lens module according to any one of claims 1-7, wherein the thermally conductive member is thermally connected to a side surface of the light-transmitting portion facing the member to be radiated; and/or, the thermally conductive member is The component is thermally connected to the surface of the side of the component to be dissipated away from the light-transmitting portion.
The lens module according to any one of claims 1-7, wherein the middle part of the heat-conducting member is thermally connected to the controller of the lens module.
The lens module according to any one of claims 1-7, wherein the thermally conductive member comprises a graphite thermally conductive sheet; and/or,

The light-transmitting portion and/or the member to be radiated are thermally connected to the thermally conductive member through a thermally conductive adhesive layer.
An aircraft, characterized in that, comprising:

body;

A gimbal connected to the body; and

The lens module according to any one of claims 1-27, which is connected to the head.
A hand-held PTZ is characterized in that, comprising:

at least one of a pitch axis assembly, a roll axis assembly, and a pan axis assembly; and

The lens module according to any one of claims 1-27, wherein the lens module is connected to the pitch axis assembly, the roll axis assembly or the pan axis assembly.
A camera, characterized in that it includes:

The lens module of any one of claims 1-27; and

A focus function key, the focus function key is arranged on the casing and is used to control the movement of the at least one optical element.