RU2818664C2 - Drive motor, video camera module and electronic device - Google Patents

Abstract

FIELD: electronic devices.

SUBSTANCE: invention relates to the field of electronic devices technology and proposes a drive motor, a video camera module and an electronic device which is a type of electronic device having a photographing function. Drive motor comprises a carrier, a coil and a structure for dissipating heat from the coil. Lens mounting hole is created in the carrier, and this lens mounting hole is configured for mounting an optical lens. Said coil is located on the outer side of the carrier. Structure for dissipating heat from the coil is located between the coil and the carrier, this structure for dissipating heat from the coil is attached to the carrier, and the coil is attached to the heat dissipation structure from the coil and forms a heat-conducting connection with the structure. Drive motor disclosed in versions of the present application is configured to drive the optical lens to move relative to the image signal former.

EFFECT: longer stroke of the lens when focusing and/or stabilizing the image in the video camera module without increasing the volume of this video camera module and providing optical characteristics of the optical lens.

20 cl, 37 dwg, 1 tbl

Description

This application claims priority to China Patent Application No. 202110321005.4, which was filed with the National Intellectual Property Administration of China on March 25, 2021, entitled "DRIVE MOTOR, CAMERA MODULE, AND ELECTRONIC DEVICE" and China Patent Application No. 202110470559.0, which was filed with the National Intellectual Property Administration of China on April 28, 2021, entitled "DRIVE MOTOR, CAMERA MODULE, AND ELECTRONIC DEVICE", so that these applications are incorporated herein by links in their entirety.

Field of technology to which the invention relates

The present application relates to the field of electronic device technology, and in particular to a drive motor, a camera module and an electronic device.

State of the art

Today, all electronic devices such as mobile phones, tablet computers and Personal Computers (PCs) have their own video camera module. The video camera module is configured to capture image/video. An optical lens (lens) is an optical component of a video camera module, and the optical characteristics of this lens directly affect the quality of photography by the video camera module.

In some high-tech electronic devices, the drive motor is usually integrated into the camera module. The drive motor is configured to drive the optical lens to move relative to the image sensor to perform Automatic Focusing (AF) and/or Optical Image Stabilization (OIS). With the development of photography and electronic imaging technology, the camera module places ever greater demands on the maximum travel distance of the lens for focusing and/or image stabilization, and large lens travel for automatic focusing and/or optical image stabilization is being used in increasing numbers scenarios. For this type of camera module that is integrated with a drive motor, the problem of how to realize a large lens travel for automatic focusing and/or optical image stabilization without increasing the volume of the camera module and also ensure the optical performance of the optical lens is an important research direction for device manufacturers.

The essence of the invention

Embodiments of the present application provide a drive motor, a camera module, and an electronic device for increasing lens travel during focusing and/or image stabilization in the camera module without increasing the volume of the camera module while still providing the optical performance of the optical lens.

To achieve the above goals, versions of this application use the following technical solutions.

According to the first aspect, some embodiments of the present application provide a drive motor. This drive motor contains a carrier, a coil and a structure for dissipating heat from the coil. A lens mounting hole is provided in the carrier, and the lens mounting hole is configured to accept an optical lens. The spool is located on the outside of the media. The structure for dissipating heat from the coil is a structure with high thermal conductivity. This coil heat dissipation structure is positioned between the coil and the carrier, the coil heat dissipation structure is attached to the carrier, and the coil heat transfer structure is attached to the coil heat dissipation structure by thermal conduction.

According to the drive motor design proposed in the embodiments of the present application, when the volume of the drive motor does not change and at the same time, a large stroke of the lens is realized for automatic focusing and/or stabilization of the optical image, since the heat transfer from the coil is tied to the heat dissipation structure from the coil, the heat generated during operation of the coil can be transferred to the coil heat dissipation structure and dissipated using the coil heat dissipation structure. In this manner, it is possible to reduce the unwanted effect of heat generated during operation of the coil on the optical lens, thereby ensuring the optical performance of the optical lens.

In one possible embodiment of the first aspect, the orthogonal projection area of the coil onto the first surface of the carrier is smaller than the orthogonal projection area of the structure for dissipating heat from the coil onto the first surface of the carrier. This first surface is a media surface configured to receive a spool. In such a design, the coil heat dissipation structure can "spray" the heat from the coil over a large area of the side wall of the carrier to avoid heat concentration. With such a design, the undesirable effect of heat generated by the operation of the coil on the optical lens can be reduced.

In one possible embodiment of the first aspect, the material of the structure for dissipating heat from the coil comprises one or more of the following materials: metal, non-metal alloyed with metal powder, graphite, hotmelt adhesive, and/or thermally conductive silicone, wherein the metal may be one or more of the following metals - copper, iron, aluminum, copper alloy, ferroalloy, aluminum alloy and/or other similar material.

In one possible embodiment of the first aspect, the structure for dissipating heat from the coil comprises a metal layer and a graphite layer disposed one on top of the other. The metal layer and the coil are connected by a thermal conductive connection, and the graphite layer is located on the side of the metal layer close to the lens mounting hole, where the material of the metal layer may be one or more of the following list - copper, iron, aluminum, copper alloy, ferroalloy, aluminum alloy and/or other similar material. Both the metal layer and the graphite layer have high thermal conductivity coefficients. Therefore, the heat from the coil can be quickly absorbed. The difference is that the metal layer has good thermal conductivity in any direction, while the graphite layer has directional thermal conductivity. In particular, the graphite layer has good thermal conductivity in the plane in which the graphite layer is located, and has poor thermal conductivity in the direction perpendicular to the plane in which the layer is located. The reason is that the molecules in the graphite layer have a network structure in the plane where the graphite layer is located, the bonding density between the molecules is good, and the thermal conductivity performance is also good. However, the graphite molecules in the direction perpendicular to the plane in which these molecules lie are superimposed on each other layer by layer, and the bonding density between two adjacent layers of molecules is poor; and therefore the thermal conductivity performance is poor. In this design, the graphite layer can prevent the heat generated by the coil from being transferred to the side close to the lens mounting hole.

In one possible embodiment of the first aspect, the drive motor further includes a damping layer of adhesive and a seat ring. This damping adhesive layer is disposed on the carrier such that the carrier is in contact with the seat collar through the damping adhesive layer. With this approach, the structural compactness of the drive motor can be improved, and impact wear due to collisions between the carrier and the seat ring during the movement process can be reduced.

In one possible embodiment of the first aspect, the damping layer of adhesive is a structure with high thermal conductivity. In particular, the damping layer of the adhesive is a layer of at least one of silica gel and/or acrylate rubber. This damping layer of adhesive is in thermally conductive contact with the structure to dissipate heat from the coil. In such a design, heat from the coil can be transferred to the damping layer of adhesive and further transferred to the landing ring using this damping layer of glue. This avoids heat transfer from the coil to the optical lens to some extent. In this way, the unwanted effect of heat generated by the coil on the optical lens can be further reduced.

In one possible embodiment of the first aspect, the drive motor further includes a drive chip and a structure for dissipating heat from the chip. The drive chip is attached to the landing ring. The chip heat dissipation structure is a structure with high thermal conductivity, and the chip heat dissipation structure includes a first part and a second part. The first part is located on the carrier side of the drive chip, so that the first part is in thermally conductive contact with the drive chip. The second part is attached to the landing ring and has thermal contact with it. In such a structure, the first part can absorb heat from the drive chip, and the heat absorbed by the first part can be transferred to the landing ring using the second part to avoid heat transfer from the drive chip to the carrier.

In one possible embodiment of the first aspect, the projection of the drive chip onto the first part in the direction towards the carrier is located within the first part. In such a structure, the first part can shield the drive chip to absorb heat generated by the drive chip during operation to a large extent.

In one possible embodiment of the first aspect, a groove is created in the surface of the landing ring facing the carrier. The drive chip is placed in this groove and the first part covers the hole of this groove and is attached to the cage. In such a structure, the heat emitted by the drive chip towards the carrier is transferred to the said first part in a centralized manner according to the constraints of the groove. In such a structure, the first part can absorb heat from the drive chip to a large extent.

In one of the possible embodiments of the first aspect, the first part and the drive chip are located at some distance from each other, and the width of the gap between the first part and the drive chip is greater than 0 mm and not more than 1 mm. In such a structure, the distance between the first part and the driving chip is moderate, and the heat from the driving chip can be transferred to the first part in a large part. In addition, when the first part is made of an electrically conductive material such as a metal, the first part can be avoided from undesirably affecting the electrical characteristics of the drive chip, thereby ensuring the reliability of the drive chip.

In one possible embodiment of the first aspect, the material of the first part is one or more of the following metals, a non-metal alloyed with metal powder, graphite, hot melt adhesive, and/or thermally conductive silicone, where the metal is one or more of the following metals: copper, iron, aluminum, copper alloy, ferroalloy, aluminum alloy or other similar material.

In one possible embodiment of the first aspect, the first part comprises a metal layer and a graphite layer disposed one on top of the other. The metal layer is in thermally conductive contact with the drive chip, and on the proximal side of the metal layer is a graphite layer, where the material of the metal layer may be one or more of the following metals - copper, iron, aluminum, copper alloy, ferroalloy, aluminum alloy and /or other similar material. Both the metal layer and the graphite layer have high thermal conductivity coefficients. Therefore, the heat from the drive chip can be quickly absorbed. In addition, the graphite layer can prevent the heat generated by the drive chip from being transferred to the side close to the carrier, thereby further reducing the impact of the heat generated by the drive chip on the optical lens located in the carrier.

In one possible embodiment of the first aspect, said second part is located on a side of the seat ring remote from the carrier, and the second portion is in contact with and attached to a surface of the seat race remote from the carrier. In such a structure, the heat absorbed by the first part can be transferred, using the second part, to a surface of the base remote from the carrier, so as to avoid transfer of heat towards the carrier. With this design, the negative impact of heat generated by the drive chip on the optical lens is reduced.

According to a second aspect, some embodiments of the present application provide a drive motor. Such a drive motor includes a carrier, a housing, a drive chip, and a structure for dissipating heat from the chip. A lens mounting hole is provided in the carrier, where the lens mounting hole is configured to mount an optical lens therein. The drive chip is attached to the landing ring. The chip heat dissipation structure is a high thermal conductivity structure, wherein the chip heat dissipation structure includes a first portion and a second portion. The first part is located on the side of the drive chip close to the carrier, and the first part is connected by a thermal conductive connection to the drive chip. The second part is attached to the landing ring through a thermally conductive connection.

In the drive motor proposed in the embodiments of the present application, when the volume of the drive motor does not change and at the same time automatic focusing and/or optical image stabilization is realized with a large stroke of the lens, since the first part is located on the side of the drive chip close to the media, and this first part is connected by thermal conduction connection to the drive chip, the first part can absorb heat from the drive chip. In addition, since the second part is attached to the landing holder through a thermal conductive connection, the heat absorbed by the first part can be transferred to the landing holder using the second part to avoid heat transfer from the drive chip to the carrier. With such a structure, the unwanted effect of heat generated by the drive chip during operation on the optical lens can be reduced, thereby ensuring the optical performance of the optical lens.

In one possible embodiment of the second aspect, the projection of the drive chip onto the first part in the direction of the carrier is located within the first part. In such a structure, the first part can shield the drive chip to greatly absorb heat generated by the drive chip during operation.

In one possible embodiment of the second aspect, a groove is created in the surface of the landing ring facing the carrier. The drive chip is placed in this groove, and the first part covers the hole of the groove and is attached to this hole. In such a structure, heat emitted by the drive chip towards the carrier is transferred to the first part in a centralized manner according to the constraints of the groove. In such a structure, the first part can absorb heat from the drive chip to a large extent.

In one possible embodiment of the second aspect, the first part and the drive chip are separated by a space such that the width of the space between the first part and the drive chip is greater than 0 mm and not greater than 1 mm. In such a structure, the distance between the first part and the driving chip is kept moderate, and heat from the driving chip can be transferred to the first part to a large extent. In addition, when the first part is made of an electrically conductive material such as a metal, the first part can be avoided from undesirably affecting the electrical characteristics of the drive chip, thereby ensuring the reliability of the drive chip.

In one possible embodiment of the second aspect, the material of the first part comprises one or more of the following materials: metal, non-metal alloyed with metal powder, graphite, hot melt adhesive and/or thermally conductive silicone, where the metal is one or more of the following metals: copper, iron, aluminum, copper alloy, ferroalloy, aluminum alloy and/or other similar material.

In one possible embodiment of the second aspect, the first part comprises a metal layer and a graphite layer disposed one on top of the other. The metal layer has a thermally conductive contact with the drive chip, and the graphite layer is located on the side of the metal layer close to the carrier. The metal layer material is one or more of the following metals: copper, iron, aluminum, copper alloy, ferroalloy, aluminum alloy and/or other similar material. Both the metal layer and the graphite layer both have high thermal conductivities. Therefore, the heat from the drive chip can be quickly absorbed. In addition, the graphite layer can prevent the heat generated by the drive chip from being transferred to the side close to the carrier, thereby further reducing the impact of the heat generated by the drive chip on the optical lens located in the carrier.

In one possible embodiment of the second aspect, a second portion is located on a distal side of the seat race, and the second portion is in contact with and attached to a distal surface of the seat race. In such a structure, the heat absorbed by the first part can be transferred, using the second part, to a base surface remote from the carrier, so as to avoid transfer of heat towards the carrier. In such a design, the unwanted effect of heat generated by the drive chip on the optical lens is reduced.

According to a third aspect, some embodiments of the present application provide a video camera module. This video camera module contains an optical lens, a photosensitive component and a drive motor according to any one of the above technical solutions. The optical lens is installed in the lens mounting hole of the drive motor. The photosensitive component is located on the output side of the optical lens from which light comes out, and the photosensitive component and the driving motor are fixedly fixed.

The video camera module proposed in the embodiments of this application contains a drive motor described by any one of the above technical solutions. Therefore, such a camera module and such a drive motor can solve the same technical problem and achieve the same technical effect.

In one possible embodiment of the third aspect, the video camera module further includes an element for rotating the optical path. This element for rotating the optical path is located on the input side of the optical lens on which the light falls. This optical path rotating member is configured to rotate light incident on it in a first direction so as to emit that light in a second direction, where the first direction is perpendicular to the second direction. The input surface of the optical lens is located opposite the output surface of the element for rotating the optical path, and the second direction is parallel to the optical axis of the optical lens. In such a structure, the video camera module is a periscope video camera module. The automatic focusing direction of the periscopic camera module is perpendicular to the thickness direction of the electronic device. Therefore, a periscopic video camera module can be used in a long-focus video camera module.

In one possible embodiment of the third aspect, the video camera module further includes a video camera holder. An inner hole is provided in the camera holder so that the drive motor is located in the inner hole. A connector is located on an outer wall of the video camera holder, and the video camera holder is configured to be secured to an electronic device using the connector. In this design, the video camera module is conveniently mounted in the electronic device.

In one possible embodiment of the third aspect, the video camera holder is made of a metallic material. The video camera module further includes a structure for dissipating heat from the mounting frame. This seat holder heat dissipation structure is a high thermal conductivity structure, and the seat holder heat dissipation structure is fixed between the drive motor landing holder and the video camera holder and is in thermal conductive contact with both the holder and the holder. In such a structure, heat from the coil or heat from the drive chip can be further transferred to the video camera holder using a structure for dissipating heat from the mounting holder, and further transferred to the electronic device using the video camera holder.

In one possible embodiment of the third aspect, the housing heat dissipation structure is in contact with a second part of the chip heat dissipation structure. With this design, the heat from the drive chip can be quickly transferred to the camera holder, and the heat dissipation efficiency is high.

According to a fourth aspect, some embodiments of the present application provide an electronic device, where the electronic device includes a frame, a middle plate, and a video camera module according to any one of the above technical solutions. The middle plate is attached to the frame, and the video camera module is attached to the middle plate.

In the electronic device proposed in the embodiments of the present application, since the middle plate is attached to the frame and the video camera module is attached to the middle plate, heat from the video camera module can be transferred to the frame through the middle plate, and then can be transferred to the external environment through the frame. In this way, the optical performance of the optical lens can be further improved.

Brief description of drawings

Fig. 1 is a three-dimensional representation of an electronic device according to some embodiments of the present application;

Fig. 2 is an exploded view of the electronic device shown in FIG. 1;

Fig. 3 is an internal diagram of the electronic device shown in FIG. 1 and Fig. 2;

Fig. 4 is a three-dimensional view of a video camera module in the electronic device shown in FIG. 1 and Fig. 2;

Fig. 5 is an exploded view of the video camera module shown in FIG. 4;

Fig. 6 is a three-dimensional view of the video camera module shown in FIG. 4, in section along line A-A;

Fig. 7 is a three-dimensional view of a video camera holder in the video camera module shown in FIG. 4 and Fig. 6;

Fig. 8 is a simplified block diagram of the optical lens in the video camera module shown in FIG. 5;

Fig. 9 is a three-dimensional view of the drive motor in the video camera module shown in FIG. 5;

Fig. 10 is an exploded view of the drive motor shown in FIG. 9;

Fig. 11 is a simplified block diagram of a carrier in the drive motor shown in FIG. 10;

Fig. 12 is a simplified block diagram of the seat race in the drive motor shown in FIG. 10;

Fig. 13 is a diagram of the assembly of a carrier, a seating ring and an elastic component in the drive motor shown in FIG. 10;

Fig. 14 is a diagram of the assembly of a carrier, a seat collar, an elastic component, and a drive component in the drive motor shown in FIG. 10;

Fig. 15a is a simplified block diagram of an assembly of a carrier, a coil, and a structure for dissipating heat from a coil in the drive motor shown in FIG. 10;

Fig. 15b is an exploded view of the assembly shown in FIG. 15a;

Fig. 16 is an exploded view of the seat race in the drive motor shown in FIG. 10;

Fig. 17 is a diagram of the assembly of the seat housing, the elastic member and the coil in the drive motor shown in FIG. 10;

Fig. 18 is an exploded view of a carrier, a detector component, and a drive chip in the drive motor shown in FIG. 10;

Fig. 19 is a simplified block diagram of a structure for dissipating chip heat in the drive motor shown in FIG. 10;

Fig. 20 is a simplified block diagram of a structure for dissipating heat from a chip in accordance with several further embodiments of the present application;

Fig. 21 is a diagram of an assembly of a seat housing, a drive chip, and a structure for dissipating heat from the chip in the drive motor shown in FIG. 10;

Fig. 22 is a three-dimensional view of the assembly diagram shown in FIG. 21, in section along line B-B;

Fig. 23 is an enlarged view of region I in the sectional view shown in FIG. 22;

Fig. 24 45;

Fig. 25 is an exploded view of the photosensitive component shown in FIG. 24;

Fig. 26 is a three-dimensional view of a video camera module in accordance with several further embodiments of the present application;

Fig. 27 is an exploded view of the video camera module shown in FIG. 26;

Fig. 28 is a three-dimensional view of the video camera module shown in FIG. 26, in section along line C-C;

Fig. 29 is a three-dimensional view of the drive motor in the video camera module shown in FIG. 26 – Fig. 28;

Fig. 30 is an exploded view of the drive motor shown in FIG. 29;

Fig. 31 is a simplified diagram of an assembly of a carrier and a structure for dissipating heat from a coil in the drive motor shown in FIG. thirty;

Fig. 32 is a simplified block diagram of a structure for dissipating chip heat in the drive motor shown in FIG. thirty;

Fig. 33 is a diagram of an assembly of a housing, a printed circuit board, a drive chip, and a structure for dissipating heat from a chip in the drive motor shown in FIG. 30, and structures for dissipating heat from the landing collar shown in FIG. 27;

Fig. 34 is a three-dimensional view of the assembly diagram shown in FIG. 33, in section along line D-D;

Fig. 35 is an enlarged view of region II in the sectional view shown in FIG. 34;

Fig. 36 is a diagram of an assembly of a housing and a structure for dissipating heat from a chip in the drive motor shown in FIG. 30, structures for dissipating heat from the landing collar shown in FIG. 27, and a video camera holder; And

Fig. 37 is a three-dimensional view of the assembly diagram shown in FIG. 36, in section along the line E-E.

Description of options

The terms “first” and “second” in the embodiments of this application are merely for descriptive purposes, so they should not be understood as indicating or implying the relative importance or as implicitly indicating the number of specified technical features. Therefore, features restricted as "first" or "second" may explicitly or implicitly cover one or more features.

In embodiments of this application, the term “includes” or some other variation thereof is intended to cover a non-exclusive inclusion such that a procedure, method, article or apparatus that contains a number of elements contains not only those elements, but also contains others elements that are not explicitly listed, or additionally contains elements inherent in the nature of such procedure, method, product or apparatus. An element preceded by the word “contains (includes) ...” does not preclude the existence of additional identical elements in the procedure, method, article or apparatus containing that element.

The term “and/or” in embodiments of the present application describes only an association relationship to characterize associated objects and represents that three relationships may exist. For example, A and/or B may represent the following three cases: Only A exists, both A and B exist, and only B exists. In addition, the symbol "/" as used herein generally indicates an "or" relationship between associated objects.

This application proposes an electronic device. This electronic device is a type of electronic device that has a photography function. In particular, such an electronic device may be a portable electronic device or other suitable electronic device. For example, such an electronic device may be a mobile phone, a tablet personal computer, a laptop computer, a Personal Digital Assistant (PDA), a video camera, a personal computer, a laptop computer, or an on-board device, a wearable device. device, Augmented Reality (AR) glasses, AR helmet, Virtual Reality (VR) glasses, VR headset or other similar device.

In FIG. 1 and Fig. 2. Fig. 1 is a three-dimensional view of an electronic device 100 in accordance with some embodiments of the present application, and FIG. 2 is an exploded view of the electronic device 100 shown in FIG. 1. In these embodiments, the electronic device 100 is a mobile phone. This electronic device 100 includes a screen 10, a back cover 20, a video camera module 30, a main board 40, and a video camera decorative cover 50.

It is powerful to understand that in FIG. 1 and Fig. 2 shows schematically only some of the components included in the electronic device 100. The actual shapes, actual dimensions, actual positions and actual structures of these components are shown in FIG. 1 and Fig. 2 are not limited. In some other examples, the electronic device 100 may alternatively not include a video camera screen 10 and decorative cover 50.

The screen 10 is configured to display an image, video, or the like. The screen 10 includes a transparent cover 11 and a display 12. The transparent cover 11 and the display 12 are located on top of each other. The transparent cover 11 is configured primarily to protect the display 12 and prevent dust from entering the display 12. The material of the transparent cover 11 includes, but is not limited to, glass. The display 12 may be a flexible display or a rigid display. For example, the display 12 may be an Organic Light-Emitting Diode (OLED) display, an Active-Matrix Organic Light-Emitting Diode (AMOLED) display, a mini organic light -emitting diode), micro organic light-emitting diode display, quantum dot LED display (Quantum dot Light Emitting Diodes, QLED) or liquid crystal display (LCD).

The back cover 20 is configured to protect the internal electronic components of the electronic device 100. This back cover 20 includes a back wall 21 and a frame 22. The back wall 21 is located on the side of the display 12 farthest from the transparent cover 11, and is positioned such that the transparent cover 11, display 12 and the rear wall 21 are superimposed on one another. The frame 22 is located between the back wall 21 and the transparent cover 11. In addition, the frame 22 is attached to the back wall 21. For example, the frame 22 may be attached to the back wall 21 by means of adhesive. Alternatively, frame 22 and back wall 21 may be a complete integral structure, in other words, frame 22 and back wall 21 constitute an integral structure. The transparent cover 11 is attached to the frame 22 by means of glue. The transparent cover 11, back wall 21 and frame 22 cover the interior of the electronic device 100 for housing components of the device. The display 12 is located in this internal space.

To facilitate the description below, an XYZ coordinate system is established. The stacking direction of the transparent cover 11, the display 12 and the back wall 21 on top of each other in the electronic device 100 (in other words, the thickness direction of the electronic device 100) is defined as the Z-axis direction. The plane in which the transparent cover 11, the display 12 or the rear wall 21 are located lies in the XY plane. Specifically, the width direction of the electronic device 100 is the X-axis direction, and the length direction of the electronic device 100 is the Y-axis direction. It can be understood that the coordinate system in the electronic device 100 can be flexibly set based on actual requirements.

The video camera module 30 is configured to take photos/videos. The drive motor is integrated into the video camera module 30. This drive motor is configured to perform Automatic Focusing (AF) and/or Optical Image Stabilization (OIS). The video camera module 30 is fixed in the internal space of the electronic device 100.

In some embodiments, as shown in FIG. 2, the electronic device 100 further includes a middle plate 23. This middle plate 23 is attached to the inner surface of the frame 22 around its entire perimeter. For example, the middle plate 23 may be attached to the frame 22 by welding. The middle plate 23 and frame 22 may alternatively be an integrated structure. The middle plate 23 is used as the structural "frame" of the electronic device 100. The video camera module 30 may be supported by and attached to the middle plate 23 by threading, clamping, welding, or the like. On this basis, as an option, the materials of both the middle plate 23 and the frame 22 are materials with high thermal conductivity. For example, the materials of the middle plate 23 and frame 22 may be, but are not limited to, metals such as stainless steel, aluminum alloy, and magnesium aluminum alloy. The middle plate 23 forms contact with the frame 22 with high thermal conductivity. Heat from the video camera module 30 may be transferred to the middle plate 23, and further transferred by the middle plate 23 to the frame 22. The frame 22 is in contact with the external air environment surrounding the electronic device 100. Therefore, the heat from the frame 22 can be further dissipated into the external air environment around the electronic device 100. With such a structure, the video camera module 30 can quickly dissipate heat. In addition to this, the structural strength of the metal is generally good, which can ensure the load-bearing performance of the middle plate 23 and the structural strength of the frame 22.

In some other embodiments, the video camera module 30 may be attached to another thermally conductive structure of the electronic device 100 by threading, clamping, welding, or other similar methods. For example, when the material of the back wall 21 or frame 22 is a high thermal conductivity material such as metal, the video camera module 30 may be attached to the back wall 21 or frame 22 to transfer heat to the external air environment around the electronic device 100 using the back wall 21 or frames 22.

The video camera module 30 may be used as a rear video camera module, or may be used as a front video camera module.

In some embodiments, as shown in FIG. 2, the video camera module 30 is attached to the surface of the middle plate 23 close to the rear wall 21. The entrance surface of the video camera module 30, on which the light falls, faces the rear wall 21. An installation hole 60 is created in the rear wall 21. The decorative cover 50 of the video camera covers this installation hole hole 60 and attached to it. This decorative video camera cover 50 is configured to protect the video camera module 30. In some embodiments, the decorative video camera cover 50 protrudes onto the side of the rear wall 21 away from the transparent cover 11. In such a design, the decorative video camera cover 50 can increase the clearance for mounting the video camera module 30 in the electronic device 100 in the Z-axis direction. In some other embodiments, the decorative camera cover 50 may alternatively be flush with the back wall 21 or recessed into the interior space to accommodate components of the electronic device 100. A transparent window 51 is provided in the decorative camera cover 50. This transparent window 51 allows light from the scene pass through it and fall onto the input surface of the video camera module 30. In the exemplary embodiments, the video camera module 30 is used as a rear video camera module in the electronic device 100.

In some other embodiments, the camera module 30 is attached to a surface of the middle plate 23 proximal to the transparent cover 11. The entrance surface of the video camera module 30 on which light falls faces the transparent cover 11. An opening is provided in the display 12 to exclude the optical path. This optical path exclusion hole allows light from the scene to fall onto the input surface of the video camera module 30 after passing through the transparent cover 11. In such a structure, the video camera module 30 is used as a front video camera module in the electronic device 100.

The main board 40 is secured to the interior of the electronic device 100. For example, the main board 40 may be attached to the middle plate 23 by a threaded connection, a clamp, or the like. When the electronic device 100 does not include a middle plate 23, the main board 40 may alternatively be attached to the surface of the display 12 proximate the rear wall 21 by a threaded connection, a clamp, or the like.

In FIG. 3 is an internal diagram of the electronic device 100 shown in FIG. 1 and Fig. 2. This electronic device 100 further includes a computer control module 41. For example, the computer control module 41 may be located on the main board 40. This computer control module 41 may alternatively be located on another printed circuit board in the electronic device. For example, the computer control module 41 may be mounted on a printed circuit board on which a Universal Serial Bus (USB) component is located. In some embodiments, the computer control module 41 is an Application Processor (AP).

The computer control module 41 is electrically connected to the video camera module 30. This computer control module 41 is configured to receive and process an electrical signal containing image information from the video camera module 30. The computer control module 41 is further configured to control the driving motor of the motion camera module 30 to realize AF focusing movement and/or OIS stabilization movement.

The video camera module 30 may be a periscopic video camera module, or may be a vertical video camera module.

In FIG. 4 is a three-dimensional view of the video camera module 30 in the electronic device 100 shown in FIG. 1 and Fig. 2, in Fig. 5 is an exploded view of the video camera module 30 shown in FIG. 4, and in FIG. 6 is a three-dimensional view of the video camera module 30 shown in FIG. 4, in section along line A-A. In the embodiments under consideration, the video camera module 30 is a periscope video camera module. Specifically, the video camera module 30 includes a video camera holder 31, an optical path rotation member 32, an optical lens 33, a drive motor 34, a frame heat dissipation structure 35, and a photosensitive component 36.

It can be understood that in FIG. 4 – Fig. 6 shows only some of the components included in the video camera module 30 when the video camera module 30 is a periscopic video camera module. The actual shapes, actual dimensions, actual positions and actual structures of these components are not limited to those shown in FIG. 4 – Fig. 6. In some other examples, the video camera module 30 may alternatively not include a video camera holder 31 and a structure 35 for dissipating heat from the housing.

The video camera holder 31 is configured to connect the optical path rotation member 32, the optical lens 33, the drive motor 34, and the photosensitive component 36 into an integral unit, and secure the integral unit to the electronic device 100 shown in FIG. 1 and Fig. 2. The material of the video camera holder 31 includes, but is not limited to, metal and/or plastic. In some embodiments, the material of the video camera holder 31 is metal. For example, the material of the video camera holder 31 may be, but is not limited to, an aluminum alloy or a magnesium-aluminum alloy. The metal structure has good strength and can provide the required load-bearing strength of the video camera holder 31. In addition, the metal has good thermal conductivity and can effectively transfer the heat generated by the drive motor 34 and the photosensitive component 36 to a structure (for example, the middle plate 23) present in the electronic device 100 and configured to support the video camera module 30 .

In some embodiments, reference is made to FIG. 7, which is a three-dimensional view of the video camera holder 31 in the video camera module 30 shown in FIG. 4 – Fig. 6. A connector 31a is located on the outer wall of the video camera holder 31. In some embodiments, this connector 31a is a projection. In other embodiments, connector 31a is a clamping projection. The video camera holder 31 is fixed to the electronic device 100 shown in FIG. 1 and Fig. 2, using connector 31a.

An inner hole 311 is provided in the video camera holder 31. As shown in FIG. 4 – Fig. 6, in this inner hole 311, an optical path rotation member 32, an optical lens 33, a drive motor 34, and a photosensitive component 36 are mounted. An optical lens 33 is installed in the drive motor 34. An optical path rotation member 32, a drive motor 34, and a photosensitive component 36 are installed. may be attached to the video camera holder 31 by means of adhesive, clamp, screw connection or the like. In such a structure, the video camera holder 31 connects the optical path rotation member 32, the optical lens 33, the drive motor 34, and the photosensitive component 36 into a unit, and secures the unit into the electronic device 100 shown in FIG. 1 and Fig. 2 using projection 31a.

Let's continue to look at Fig. 4 – Fig. 6. The optical path rotation member 32, the drive motor 34 with the optical lens 33, and the photosensitive component 36 are located in the inner hole 311 of the video camera holder 31 in series one after another in a direction parallel to the XY plane. For example, the optical path rotation member 32, the drive motor 34 with the optical lens 33, and the photosensitive component 36 are arranged in series one after the other in the X-axis direction.

As shown in FIG. 6, stage light L is incident on the optical path rotation member 32 in the Z-axis direction (in other words, in the first direction) from the transparent window 51 shown in FIG. 2. Next, under the influence of the optical path rotation element 32, the light path L from the scene is rotated. Light L from the scene is transmitted in the direction in which the optical path rotation member 32, the drive motor 34 with the optical lens 33, and the photosensitive component 36 are located (in the X-axis direction, in other words, in the second direction), and sequentially falls on the optical lens 33 and the photosensitive component 36. The driving motor 34 drives the optical lens 33 to move in the direction in which the optical path rotating member 32, the driving motor 34 with the optical lens 33, and the photosensitive component 36 are located, so that the automatic focusing function can be realized in module 30 video cameras. The limiting focusing distance when performing the auto focusing function does not affect the thickness of the electronic device 100 in the Z-axis direction. Therefore, the maximum focusing distance can be selected large. In such a design, the video camera module 30 may be used as a long-focus video camera module to perform a long-focus photography function in the electronic device 100. Of course, in other embodiments, the video camera module 30 may alternatively be used as a main video camera module in the electronic device 100.

The optical path rotating member 32 is configured to change the path of light L from the scene, so that the light L from the scene incident in the Z-axis direction (first direction) is emitted in the X-axis direction (second direction). For example, element 32 for rotating the optical path may be a rectangular prism. The two right-angled surfaces of this rectangular prism are respectively used as the input surface on which light falls and the output surface from which light is emitted. The inclined surface of a rectangular prism is a reflective surface. This reflective surface is configured to change the path of light L from the scene by reflection. The element 32 for rotating the optical path may alternatively be a flat reflective mirror.

The optical lens 33 is configured to obtain an image of a scene to be photographed. This optical lens 33 is a periscope lens. The direction of the optical axis of the periscope lens is coordinated with the direction in which the element 32 for rotating the optical path, the motor drive 34 with the optical lens 33 and the photosensitive component 36 are located in succession one after the other.

In FIG. 8 is a simplified block diagram of the optical lens 33 in the video camera module 30 shown in FIG. 5. The optical lens 33 includes an objective lens tube 331 and an optical lens group 332. The lens tube 331 is configured to mount and protect the optical lens group 332 . The lens tube 331 has a cylindrical structure. In other words, both ends of the lens tube 331 are open in the optical axis direction. An optical lens group 332 is mounted in a lens tube 331. This optical lens group 332 contains at least one optical lens. When the optical lens group 332 includes multiple optical lenses, the multiple optical lenses are stacked one on top of the other in an optical axis direction.

Alternatively, the optical lens 33 may comprise only one optical lens group 332. This optical lens group 332 is installed in the drive motor 34. In such a structure, the optical lens group 332 is fixed and protected using the drive motor 34. In such a structure, the drive motor 34 is integrated with the optical lens 33. This helps reduce the volume of the video camera module 30.

An optical lens having various characteristics such as a standard focal length and a long focal length can be obtained by designing the structural composition of the optical lens group 332 and the shape and size of each optical lens.

We continue to look at Fig. 8. The optical lens 33 has an input surface 33a on which light is incident and an output surface 33b from which light is emitted. The input surface 33a is a surface facing the optical path rotation member 32 when the optical lens 33 is used. In other words, the optical path rotation member 32 is located on the input side of the optical lens 33. The input side of the optical lens 33 is the side of the input surface 33a away from the output surface 33b. The output surface of the optical path turning element 32 is positioned opposite the input surface 33a of the optical lens 33. After the scene light L is emitted from the optical path turning element 32, the object light L is incident on the input surface 33a of the optical lens 33. The output surface 33b The optical lens 33 is a surface opposite to the optical path rotation member 32 when the optical lens 33 is in use. The stage light L is emitted from the output surface 33b.

In FIG. 9 is a three-dimensional view of the drive motor 34 in the video camera module 30 shown in FIG. 5. In FIG. 10 is an exploded view of the drive motor 24 shown in FIG. 9. This drive motor 34 includes a carrier 341, a housing 342, a resilient component 343, a drive component 344, a drive chip 346, a housing 348, and an optical path isolation kit 349.

It can be understood that in FIG. 9 and Fig. 10 schematically shows only some of the components included in the drive motor 34. The actual shapes, actual sizes, actual positions and actual structures of these components are not limited to those shown in FIG. 9 and Fig. 10. In some embodiments, drive motor 34 may alternatively not include housing 348 and optical path isolation kit 349.

In FIG. 11 is a simplified block diagram of the carrier 341 in the drive motor 34 shown in FIG. 10. A hole 341a is provided in the carrier 341 for mounting a lens. Both ends of the lens mounting hole 341a are open in the axial direction of the hole. The optical lens 33 shown in FIG. 8 is installed in this lens mounting hole 341a. In some embodiments, the optical lens 33 is mounted in the lens mounting hole 341a such that it can be removed, for example, by a clamp or threaded connection, to facilitate replacement of the optical lens 33. In some other embodiments, the optical lens 33 may be in alternatively mounted in the lens mounting hole 341a so that it cannot be detached, such as fixed by gluing or welding. When the optical lens 33 is installed in the lens mounting hole 341a, the extension direction of the optical axis of the optical lens 33 is matched with the axial direction of the lens mounting hole 341a.

The material from which the carrier 341 is made can be, but is not limited to, metal and/or plastic. In some embodiments, the material from which the carrier 341 is made is plastic. For example, the carrier material 341 may be a Liquid Crystal Polymer (LCP).

In FIG. 12 is a simplified block diagram of the seat race 342 in the drive motor 34 shown in FIG. 10. The material from which the seat collar 342 is made can be, but is not limited to, metal and/or plastic. In some embodiments, the material from which the seat collar 342 is made is plastic. For example, the material of the seat collar 342 may be a Liquid Crystal Polymer (LCP). The seat collar 342 includes a base 3421 and a support member 3422. In some embodiments, there are two support members 3422. The two support members 3422 are respectively attached to two opposite edges of the base 3421. Optionally, the two support members 3422 are perpendicular or approximately perpendicular to the base 3421 The base 3421 and two support members 3422 form an installation channel A. The carrier 341 is placed in this installation channel A.

In FIG. 13 is a diagram of the assembly of the carrier 341, the seat holder 342, and the elastic component 343 in the drive motor 34 shown in FIG. 10. An elastic component 343 is coupled between the carrier 341 and the seat collar 342. The resilient component 343 is configured to resiliently support the carrier 341 on the seat collar 342. In some embodiments, the resilient component 343 includes a first resilient component 3431 and a second resilient component 3432. These the first elastic component 3431 and the second elastic component 3432 may be, but are not limited to, spring plates and coil springs. In the present application, only an example is used for description in which the first elastic component 3431 and the second elastic component 3432 are spring plates. This should not be construed as any special limitation to the present application.

The first elastic component 3431 is connected between the landing ring 342 and the end of the carrier 341 proximal to the element 32 for rotating the optical path. A second resilient component 3432 is coupled between the mounting collar 342 and the end of the carrier 341 remote from the optical path rotation member 32. In such a structure, the end of the carrier 341 proximal to the optical path rotation member 32 is resiliently supported on the landing collar 342 using the first elastic component 3431. In addition, the end of the carrier 341 remote from the optical path rotation member 32 is resiliently supported onto the landing collar 342 using the second resilient component 3432. This avoids the carrier 341 from tilting relative to the landing collar 342 under its own weight and load (including the weight of the optical lens 33). With such a structure, the stability of the support of the carrier 341 on the mounting clip 342 can be improved.

In FIG. 14 is a schematic diagram of the assembly of the carrier 341, the seat collar 342, the elastic component 343, and the drive component 344 in the drive motor 34 shown in FIG. 10. A drive component 344 is located between the carrier 341 and the mounting frame 342. Specifically, the drive component 344 is located between the carrier 341 and the support member 3422. This drive component 344 is configured to drive the carrier 341 in conjunction with the optical lens 33 in the direction of the optical axis of the optical lens 33 for automatic focusing.

In some embodiments, as shown in FIG. 14, the drive component 344 includes a coil 3441 and a magnet 3442. The coil 3441 is mounted on an outer surface of the carrier 341. This region of the outer surface of the carrier 341 is a portion of the outer surface of the carrier 341 axially parallel or approximately parallel to the lens mounting hole 341a. Magnet 3442 is mounted on seat holder 342. For example, magnet 3442 is attached to support member 3422. In other embodiments, coil 3441 may alternatively be mounted on seat holder 342, and magnet 3442 may alternatively be mounted on the outer surface of carrier 341. In the following, only an example in which the coil 3441 is mounted on the outer surface of the carrier 341 and the magnet 3442 is mounted on the seat holder 342 is used for description. This cannot be considered as any special limitation to the present application.

Coil 3441 is located opposite magnet 3442. In other words, the orthogonal projection of coil 3441 on magnet 3442 is superimposed on this magnet 3442. When energy is supplied to coil 3441, then, under the influence of the magnetic field of magnet 3442, interaction forces (Ampere forces) arise between coil 3441 and magnet 3442 F1 and F1' in the direction of the optical axis of the optical lens 33. Under the influence of these interaction forces, the carrier 341 and the optical lens 33 can be driven in the direction of the optical axis of the optical lens 33 relative to the housing 342 to achieve automatic focusing.

To ensure stability of drive by drive component 344, in some embodiments, as shown in FIG. 14, there are two coils 3441 and two magnets 3442. The two coils 3441 are respectively located on two opposite sides of the carrier 341. The two magnets 3442 are respectively located opposite the two coils 3441. In such a design, two pairs of forces occur between the two magnets 3442 and the two coils 3441 interactions F1 and F1'. These two pairs of interaction forces F1 and F1' are respectively located on two opposite sides of the carrier 341. Therefore, driving stability can be ensured by the drive component 344.

As photography and electronic imaging technologies evolve, the camera module 30 places increasingly greater demands on the focal length limit, and the number of scenarios in which the user uses a long lens stroke increases. The focal length for long lens travel is usually 2.5 cm or more. To achieve a large stroke of lens movement when focusing, increase the number of turns of wire in coil 3441 and increase the current through the coil. The volumes of the coil 3441 and magnet 3442 are large. In such a structure, the amount of heat generated by the coil 3441 is increased. In addition, the total volume of the video camera module 30 cannot be increased due to the limited clearance for installing such a video camera module 30 in an electronic device. Therefore, the wall thickness d of the carrier 341 can be reduced (see FIG. 14), so that part of the module mounting gap can be reserved for the drive component 344. However, in such a case, the distance between the coil 3441 and the lens mounting hole 341a is small. The heat generated by the coil 3441 is easily transferred to the optical lens 33 in the lens mounting hole 341a, which has an undesirable effect on the optical performance of the optical lens 33. In addition, Polyethylene Terephthalate (PET) is generally used as a lens material in the optical lens. ). This material is temperature sensitive. The linear expansion coefficient of this material is about 0.07‰/℃. Therefore, when heated, the optical lens tends to expand. In terms of the optical characteristics of an optical lens, the coefficient of variation of the effective focal length (EFL) is on the order of µm/°C. In addition to this, in the circumferential direction of the optical lens 33, the coil 3441 is distributed at local positions. Therefore, in the circumferential direction of the optical lens 33, the amounts of temperature rise at different positions of the optical lens are inconsistent, and the degree of thermal expansion is different. Consequently, the aberration of the optical lens 33 changes sharply, and the photographic quality of the video camera module 30 is seriously degraded.

To reduce the effect of heat generated by the coil 3441 on the optical lens 33, as shown in FIG. 10, the drive motor 34 further includes a structure 345 for dissipating heat from the coil. This coil heat dissipation structure 345 is a high thermal conductivity structure. It should be noted that in the embodiments already discussed and in subsequent embodiments, a structure with high thermal conductivity is understood to mean a structure made of a material whose thermal conductivity is 80 W/mK or more. In particular, the material of the structure 345 for dissipating heat from the coil may be one or more of metal, non-metal, metal powder alloy, graphite, hot melt adhesive, and/or thermally conductive silicone. The metal may be one or more of the following metals: copper, iron, aluminum, copper alloy, ferroalloy, aluminum alloy and/or other similar material.

In FIG. 15a is a simplified block diagram of an assembly of a carrier 341, a coil 3441, and a coil heat dissipation structure 345 in the drive motor 34 shown in FIG. 10. In FIG. 15b is an exploded view of the assembly shown in FIG. 15a. In exemplary embodiments, a coil heat dissipation structure 345 is located between the coil 3441 and the carrier 341. When there are two coils 3441, there are also two coil heat dissipation structures 345. Two structures 345 for dissipating heat from the coil are respectively located between the two coils 3441 and the carrier 341.

The coil heat dissipation structure 345 is attached to the carrier 341. Specifically, the coil heat dissipation structure 345 may be attached to the carrier 341 by means of adhesive or may be integrally formed with the carrier 341 using a technique such as insert molding. (insert molding), thermal spraying or electrochemical deposition. In other words, the structure 345 for dissipating heat from the coil and the carrier 341 are a single structure.

The coil 3441 is attached to the structure 345 to dissipate heat from the coil by a thermally conductive connection. It should be noted that in the embodiments already discussed and in subsequent embodiments, the phrase “attached by a thermally conductive connection” means that the two objects are attached to one another and have a thermally conductive connection to one another. The coil 3441 may be directly attached to the structure 345 to dissipate heat from the coil through adhesive or other similar means. Alternatively, coil 3441 may be attached to structure 345 to dissipate heat from the coil indirectly. For example, as shown in FIG. 15a and Fig. 15b, a structure 345 for dissipating heat from a coil is attached to the carrier 341, and a fastener (stand) 3411 is attached to the carrier 341. The coil 3441 is wound on and attached to the fastener 3411. Therefore, the coil 3441 is attached to the structure 345 to dissipate heat from the coil not directly, but using the fastener 3411 and the carrier 341.

The coil 3441 and the coil heat dissipation structure 345 may be in direct contact to transfer heat between them, or may transfer heat indirectly but through another intermediate structure. This is not specifically limited here. In some embodiments, as shown in FIG. 15a and Fig. 15b, a coil 3441 is in direct contact with a structure 345 to dissipate heat from the coil to transfer heat to the structure. The heat transfer efficiency through direct contact thermal conductivity is high, so that the coil heat dissipation structure 345 can quickly absorb the heat generated by the coil 3441.

In some embodiments, the structure 345 for dissipating heat from the coil comprises a metal layer and a graphite layer stacked one on top of the other. The metal layer is in contact with the coil 3441, and the graphite layer is located on the side of the metal layer close to the carrier 341. The metal layer and the graphite layer both have high thermal conductivities. Therefore, the heat generated by the coil 3441 can be quickly absorbed. The difference is that the metal layer has good thermal conductivity in any direction, while the graphite layer has directional thermal conductivity. In particular, the graphite layer has good thermal conductivity in the plane in which the graphite layer is located, and has poor thermal conductivity in the direction perpendicular to the plane in which the layer is located. The reason is that the molecules in the graphite layer have a network structure in the plane where the graphite layer is located, the bonding density between the molecules is good, and the thermal conductivity performance is also good. However, the graphite molecules in the direction perpendicular to the plane in which these molecules lie are superimposed on each other layer by layer, and the bonding density between two adjacent layers of molecules is poor; and therefore the thermal conductivity performance is poor. In such a structure, the graphite layer can prevent heat generated by the coil 3441 from being transferred to the side close to the lens mounting hole 341a.

The orthogonal projection area of the coil 3441 onto the first surface a of the carrier 341 is smaller than the orthogonal projection area of the structure 345 for dissipating heat from the coil onto the first surface a of the carrier 341. The first surface a is a surface of the carrier 341 configured to receive the coil 3441. In such a structure, the structure 345 to dissipate heat from the coil may "spray" the heat generated by coil 3441 over a large area of the sidewall of the media 341 to avoid heat concentration. With such a structure, the undesirable effect of heat generated when the coil 3441 is operated on the optical lens 33 can be reduced.

In order to move the optical lens 33 to realize a large focal length, a large volume of the drive component 344 is generally required, and the gap width between the carrier 341 and the housing 342 in the area of the drive component 344 is also large. As a result, the carrier 341 is easily tilted relative to the mounting cage 342 as it moves during the auto focusing (AF) process. To avoid this problem, as shown in FIG. 15a and Fig. 15b, an alignment post 3413 is located on the carrier 341. This alignment post 3413 is configured to hold the carrier 341 level to prevent the carrier 341 from tilting relative to the mounting cage 342 during movement during the auto focus (AF) process. In some embodiments, there are multiple such alignment posts 3413. For example, there are eight alignment posts 3413, and the eight alignment posts 3413 are distributed on two sides of the reel mounting carrier 341 3441.

Next, a damping adhesive layer 3412 is located on the leveling post 3413. The leveling post 3413 contacts two support members 3422 of the landing collar 342 shown in FIG. 12, using adhesive damping layer 3412. With such a structure, it is possible to reduce the undesirable effects of wear caused by collisions between the leveling post 3413 and the landing collar 342 during movement during the auto focusing (AF) process. In the exemplary embodiments, the damping adhesive layer 3412 may be considered to be positioned not directly on the carrier 341, but rather through the use of a leveling post 3413.

Based on the above embodiments, to further reduce the undesirable effect of heat generated by the coil 3441 on the optical performance of the optical lens 33, in some embodiments, the damping adhesive layer 3412 is a high thermal conductivity structure. Specifically, this damping adhesive layer 3412 is a layer of at least one of silica gel and/or acrylate rubber. The structure 345 for dissipating heat from the coil is in thermally conductive contact with the damping adhesive layer 3412. In other words, heat transfer can be effected between the coil heat dissipation structure 345 and the adhesive damping layer 3412. In such a design, heat from the coil 3441 can be transferred to the adhesive damping layer 3412 and further transferred to the seat collar 342 using the adhesive damping layer 3412. This allows heat transfer from the coil 3441 to the optical lens 33 to be avoided to some extent. Thus, the undesirable effect of the heat generated by the coil 3441 on the optical lens 33 can be further reduced.

In the above embodiments, in particular, the structure 345 for dissipating heat from the coil may extend to the position of the damping adhesive layer 3412 to come into direct contact with the damping adhesive layer 3412 to effect heat transfer to and from this layer, or may transfer heat to to and from the adhesive damping layer 3412 using another intermediate structure. For example, as shown in FIG. 15a and Fig. 15b, the coil heat dissipation structure 345 extends to the position of the leveling post 3413 and is in contact with the leveling post 3413 to transfer heat between them. The leveling post 3413 is in contact with the damping adhesive layer 3412 to transfer heat between the post and the adhesive layer. In such a design, the coil heat dissipation structure 345 carries out indirect heat exchange with the adhesive damping layer 3412 using the leveling post 3413.

As shown in FIG. 10, the drive chip 346 is attached to the seat holder 342. In particular, the drive chip 346 may be attached to the seat holder 342 by adhesive dispensing, welding or insert molding, or other similar method. The drive chip 346 is located against the bottom surface of the media 341.

Drive chip 346 is electrically coupled to coil 3441. Specifically, in FIG. 16 is an exploded view of the seat race 342 in the drive motor 34 shown in FIG. 10. This drive motor 34 further includes an electrically conductive connection structure 3423. In some embodiments, this electrically conductive connection structure 3423 includes multiple metal conductors located in the same plane. These multiple metal conductors are embedded in the base 3421. In another embodiment, the electrically conductive connection structure 3423 may alternatively be a Flexible Printed Circuit (FPC) attached to the base 3421. The drive chip 346 is electrically coupled to the electrically conductive connection structure 3423.

Based on the above options, FIGS. 17 is a schematic diagram of the assembly of the seat race 342, the resilient member 343, and the coil 3441 in the drive motor 34 shown in FIG. 10. The elastic component 343 is made of a metallic electrically conductive material. The drive chip 346 is electrically connected to the first elastic component 3431 and the second elastic component 3432 using an electrically conductive connection structure 3423. Further, the drive chip 346 is electrically connected to one electrode of the two coils 3441 using the first elastic component 3431 and two electrical conductors b, and is electrically connected with another electrode of two coils 3441 using a second elastic component 3432 and two electrical conductors c. In such a design, drive chip 346 is electrically coupled to coil 3441.

The drive chip 346 is further electrically connected to the circuit board 361 of the photosensitive component 36 shown in FIG. 6. Specifically, the drive chip 346 is electrically connected to the circuit board 361 of the photosensitive component 36 shown in FIG. 6 using a 3423 electrically conductive connection structure.

The circuit board 361 is configured to transmit a power signal and a control signal transmitted by the computer control module 41 shown in FIG. 3, drive chip 346. Drive chip 346 is configured to determine, based on the power signal and the control signal, the amount of output current supplied to the two coils 3441 and the timing of that output current. In addition, the drive component 344 is controlled to drive the carrier 341 based on the amount of the output current and the timing of the output current to effect auto focusing.

In some embodiments, drive motor 34 further includes a detector component. This detector component is electrically connected to the circuit board 361 of the photosensitive component 36 shown in FIG. 6. In some embodiments, the detector component is electrically coupled to the circuit board 361 of the photosensitive component 36 shown in FIG. 6, using an electrically conductive connection structure 3423. The detector component is configured to determine the distance of movement of the carrier 341 relative to the landing ring 342. The detection signal from the detector component is fed back to the computer control module 41 using the circuit board 361. This computer control module 41 is based on the detector The signal controls the drive chip 346 to drive the carrier 341 relative to the landing ring 342 to control the drive motor 34 in a closed loop with feedback.

For example, in FIG. 18 is an exploded view of the carrier 341, the detector component, and the drive chip 346 in the drive motor 34 shown in FIG. 10. The detector component includes a magnet 341b and a Hall effect sensor (not shown in the drawing). A magnet 341b is attached to a carrier 341. A Hall effect sensor is integrated with the drive chip 346. This Hall effect sensor is located opposite the magnet 341b. When the magnet 341b moves with the carrier 341, the Hall effect sensor can determine the distance of the carrier 341 by measuring the change in the magnetic field. In exemplary embodiments, the Hall effect sensor may communicate with circuit board 361 using a signal line from drive chip 346. In other embodiments, drive motor 34 may not include a detector component.

As the moving distance of the lens in the video camera module 30 increases during the focusing process, the amount of heat generated by the drive chip 346 also increases, so that the temperature of the drive chip 346 as a result of such heat generation can reach 140°C. Being limited by the total volume of the video camera module 30, the distance between the drive chip 346 and the optical lens 33 is small. Therefore, heat from the drive chip 346 can also be easily transferred to the optical lens 33, thereby undesirably affecting the optical performance of the optical lens 33.

To reduce the unwanted effect of heat generated by the drive chip 346 on the optical lens 33, the drive motor 34, as shown in FIG. 10 further includes a structure 347 for dissipating heat from the chip. This structure 347 for dissipating heat from the chip is a structure with high thermal conductivity. In particular, the material of the chip heat dissipation structure 347 may comprise one or more of a metal, a non-metal doped with metal powder, graphite, hot melt adhesive, and/or thermally conductive silicone. The metal may be one or more of the following metals: copper, iron, aluminum, copper alloy, ferroalloy, aluminum alloy and/or other similar material.

In FIG. 19 is a simplified block diagram of a structure 347 for dissipating chip heat in the drive motor 34 shown in FIG. 10. This chip heat dissipation structure 347 includes a first portion 3471 and a second portion 3472 attached to each other so that there is a thermal conductive contact therebetween. In particular, the first part 3471 and the second part 3472 may be directly attached to each other, or may be attached to each other indirectly using a different structure, or may be directly in contact with each other through a thermally conductive contact, or may not directly transmit heat using another intermediate structure. This is not specifically limited here. In some embodiments, the chip heat dissipation structure 347 further includes a third portion 3473. This third portion 3473 is coupled between the first portion 3471 and the second portion 3472. The first portion 3471 and the second portion 3472 are indirectly attached to each other using the third portion 3473. so that thermal conductivity is provided between these first and second parts. In some embodiments, the first portion 3471, the second portion 3472, and the third portion 3473 are integral. In other words, the first portion 3471, the second portion 3472, and the third portion 3473 constitute a single structural portion. In exemplary embodiments, the chip heat dissipation structure 347 is approximately C-shaped. In other embodiments, in FIGS. 20 is a simplified block diagram of a chip heat dissipation structure 347 in accordance with several further embodiments of the present application. In these embodiments, the structure 347 for dissipating heat from the chip is approximately S-shaped.

In FIG. 21 is a schematic diagram of the assembly of the seat housing 342, the drive chip 346, and the chip heat dissipation structure 347 in the drive motor 34 shown in FIG. 10. In FIG. 22 is a three-dimensional view of the assembly diagram shown in FIG. 21, in section along line B-B. In FIG. 23 is an enlarged view of region I in the sectional view shown in FIG. 22. The chip heat dissipation structure 347 is attached to the seat holder 342. Specifically, the chip heat dissipation structure 347 may be attached to the base 3421 of the seat holder 342 by adhesive distribution, insert molding, welding or other in a similar way. The first portion 3471 is located on the side of the drive chip 346 close to the carrier 341 shown in FIG. 10, and this first portion 3471 has a thermal conductive connection with the drive chip 346. In other words, heat may be transferred between the first portion 3471 and the drive chip 346. Therefore, the first portion 3471 may absorb heat from the drive chip 346. The first portion 3471 may be in the shape of a block, plate shape or other similar shape. This is not specifically limited here. In some embodiments, the first portion 3471 is plate-shaped. In such a design, the first portion 3471 occupies a small space in the drive motor 34. In some embodiments, the projection of the drive chip 346 onto the first portion 3471 toward the carrier 341 is located within the first portion 3471. In such a design, the first portion 3471 may shield the drive chip 346 for the purpose of absorbing to a large extent the heat generated by the drive chip 346 during operation.

Based on the above embodiments, the first portion 3471 may be made of a metal material entirely or may be made of a combination of a metal material and a non-metal material. This is not specifically limited here. In some embodiments, the first portion 3471 includes a metal layer and a graphite layer disposed one on top of the other. In the Z-axis direction, the first portion 3471 includes a metal layer and a graphite layer disposed one on top of the other, where the graphite layer is located close to the bottom surface of the carrier 341 shown in FIG. 10. Both the metal layer and the graphite layer both have high thermal conductivities. Therefore, it is possible to quickly absorb heat from the drive chip 346. In addition, the graphite layer can prevent the heat generated by the drive chip 346 from being transferred to the side close to the carrier 341, thereby further reducing the unwanted effect of the heat generated by the drive chip 346 on optical lens 33 in carrier 341. The metal layer material may comprise, but is not limited to, copper or a copper alloy. In addition, the graphite layer can be created on the metal layer by electrochemical deposition, sputtering or other similar methods. This is not specifically limited here.

In order for the first portion 3471 to largely absorb heat from the drive chip 346, in some embodiments, as shown in FIG. 23, in the base surface 3421 of the seat collar 342 proximal to the carrier 341 shown in FIG. 10, a groove B is created. The drive chip 346 is placed in this groove B. For example, the drive chip 346 is attached to the bottom surface of the groove B. The first part 3471 covers the hole of the groove B and is attached thereto. In such a structure, the heat emitted by the drive chip 346 towards the carrier 341 is transferred by this first part 3471 in a centralized manner under the constraints of groove B. In such a structure, the first part 3471 can absorb heat from the drive chip 346 to a large extent.

The first portion 3471 may be in direct contact with the drive chip 346 for heat transfer, or may be spaced apart from the drive chip 346 to effect heat transfer by thermal radiation. This is not specifically limited here. In some embodiments, as shown in FIG. 23, the first part 3471 and the drive chip 346 are separated by a space. The width h of the gap between the first part 3471 and the drive chip 346 is greater than 0 mm and not greater than 1 mm. Optionally, the gap width h between the first portion 3471 and the drive chip 346 is 0.05 mm/0.2 mm/0.5 mm. In such a structure, the distance between the first part 3471 and the drive chip 346 is moderate, so that heat from the drive chip 346 can be largely transferred to the first part 3471. In addition, when the first part 3471 is made of an electrically conductive material such as metal, undesirable influence of the first part 3471 on the electrical performance of the drive chip 346 can be avoided, thereby improving the reliability of the drive chip 346.

The second portion 3472 is attached to the landing ring 342 so that a thermally conductive contact is formed between them. In particular, the second portion 3472 and the landing collar 342 may be attached to each other directly, or they may be attached to each other indirectly using a different structure, or they may have direct thermal contact with each other, or they may transmit heat alone the other not directly, but through an intermediate structure. This is not specifically limited here. In such a design, the heat absorbed by the first portion 3471 can be transferred to the landing race 342 using the third portion 3473 and the second portion 3472 to avoid heat transfer from the drive chip 346 to the carrier 341.

In some embodiments, the second portion 3472 is located on the side of the base 3421 of the landing collar 342 remote from the carrier 341 shown in FIG. 10, and the second portion 3472 is in contact with and attached to a surface of the base 3421 remote from the carrier 341. In such a structure, heat absorbed by the first portion 3471 can be transferred using the third portion 3473 and the second portion 3472 to a surface of the base 3421 remote from the carrier 341 shown in FIG. 10 to avoid transfer of heat towards the medium 341. In such a structure, the unwanted effect of heat generated by the drive chip 346 on the optical lens 33 is reduced.

In some embodiments, second portion 3472 and third portion 3473 alternatively have plate shapes. In addition to this, the second portion 3472 and the third portion 3473 also each include a metal layer and a graphite layer disposed one on top of the other. The metal layer of the third portion 3473 is bonded between the metal layer of the first portion 3471 and the metal layer of the second portion 3472. In some embodiments, the metal layer of the first portion 3471, the metal layer of the second portion 3472, and the metal layer of the third portion 3473 are integral with each other. The graphite layer of the third part 3473 is attached between the graphite layer of the first part 3471 and the graphite layer of the second part 3472. In some embodiments, the graphite layer of the first part 3471, the graphite layer of the second part 3472 and the graphite layer of the third part 3473 are integral with each other. In such a structure, heat from the first part 3471 can be efficiently transferred to the second part 3472, and the chip heat dissipation structure 347 has a simple composition structure and is easy to manufacture.

As shown in FIG. 10, the housing 348 is attached to the base 3421 of the landing collar 342. This housing 348 houses the carrier 341, the elastic component 343, the drive component 344, the drive chip 346, the optical path isolation kit 349, and the support member 3422 of the landing collar 342. The housing 348 is configured to protecting the structure installed inside the housing 348 from dust. The materials of housing 348 include, but are not limited to, plastic and metal.

An optical path isolation kit 349 is located on the side of the media 341 close to the photosensitive component 36 shown in FIG. 5. The optical path isolation kit 349 is attached to the housing holder 342. The optical path isolation kit 349 is configured to isolate the optical path between the housing 348 and the photosensitive component 36 to prevent external noise from entering the optical image transmission path from the gap between the housing 348 and the photosensitive component. component 36. It should be noted that the structure of the optical path isolation kit 349 is the same as the structure of the optical path isolation kit in the video camera periscope module in the conventional technology. The details will not be described here.

In FIG. 24 is a simplified block diagram of the photosensitive component 36 in the video camera module 30 shown in FIG. 4 – Fig. 6. In FIG. 25 is an exploded view of the photosensitive component 36 shown in FIG. 24. The photosensitive component 36 includes a printed circuit board 361, an image driver 362, a light filter 363, and a holder 364.

It can be understood that in FIG. 24 and Fig. 25 shows in a simplified manner only some of the components included in the photosensitive component 36, and the actual shapes, actual sizes, actual positions and actual structures of these components are not limited to those shown in FIG. 24 and Fig. 25. In some other examples, photosensitive component 36 may alternatively not include filter 363 and holder 364.

The circuit board 361 may be a rigid circuit board, or may be a flex circuit board, or may be a rigid-flex circuit board. This circuit board 361 may be an FR-4 dielectric board, or may be a Rogers dielectric board, or may be a hybrid Rogers/FR-4 dielectric board, or the like.

In some embodiments, the seat race heat dissipation structure 35 shown in FIG. 5 is further in thermally conductive contact with the circuit board 361 to transfer heat. In such a structure, heat from the printed circuit board 361 can be transferred to the heat dissipation structure 35 from the landing cage, and further heat is transferred using the heat dissipation structure 35 from the landing cage to the video camera holder 31 and to the structure (for example, to the middle plate 23) located in the electronic device 100 and configured as a holder of the video camera module 30.

The video camera module 30 is electrically connected to the computer control module 41 shown in FIG. 3, using a circuit board 361 to communicate with this computer control module 41.

The image driver 362 may also be called a photosensitive integrated circuit or may also be called a photosensitive component. The image driver 362 is located on the printed circuit board 361. The photosensitive surface of the image driver 362 is located opposite the output surface 31b of the optical lens 31 shown in FIG. 8. The image signal driver 362 is configured to collect light from the scene passed through the optical lens 31 and convert information transmitted by the light from the scene into an electrical signal.

The light filter 363 is located between the photosensitive surface of the image sensor 362 and the output surface 31b of the optical lens 31. In addition, the light filter 363 is attached to the circuit board 361 using a holder 364. Specifically, the holder 364 is attached to the circuit board 361 through an adhesive, a clamp, threaded connection or other similar method, and the filter 363 is attached to the holder 364 also by means of adhesive, clamp, threaded connection or other similar method.

The light filter 363 may be configured to filter out stray light from the scene light transmitted through the optical lens 31 to provide good clarity to the image photographed by the video camera module 30. Filter 363 includes, but is not limited to, a blue glass filter. For example, filter 363 may alternatively be an infrared reflective filter or a dual band pass filter. This dual-band pass filter can pass visible light and the infrared component of the light from the scene, or pass visible light and light of another wavelength (such as ultraviolet light) from the light from the scene, or can pass both infrared light and light of a specified other wavelength (for example, ultraviolet light).

Shown in FIG. 4 – Fig. 6, the structure 35 for dissipating heat from the landing ring is a structure with high thermal conductivity. In particular, the material of the structure 35 for dissipating heat from the seat housing may be one or more of metal, non-metal, metal powder alloy, graphite, hot melt adhesive, and/or thermally conductive silicone. The metal may be one or more of the following metals: copper, iron, aluminum, copper alloy, ferroalloy, aluminum alloy and/or other similar material. The landing race heat dissipation structure 35 is fixed between the landing race 342 of the drive motor 34 and the video camera holder 31 and forms thermal conductive contact with them. In other words, the landing cage heat dissipation structure 35 is attached between the landing clip 342 and the video camera holder 31, the landing clip heat dissipation structure 35 has a thermal conductive contact with the landing clip 342, and the landing clip heat dissipation structure 35 has a thermal conductive contact. contact with the landing clip 342. In such a structure, the structure 35 for dissipating heat from the landing clip can transfer heat from the landing clip 342 to the video camera holder 31, and further use this video camera holder 31 to transfer heat to the structure (for example, to the middle plate 23), present in the electronic device 100 and configured as a support for the video camera module 30.

In some embodiments, as shown in FIG. 4 – Fig. 6, the seat ring heat dissipation structure 35 covers a window at one end of the inner hole 311. The seat race heat dissipation structure 35 and the base surface 3421 remote from the carrier 341 are attached to one another and form a thermal conductive contact with one another. At the edge of the structure 35, at least one flange 351 is located to dissipate heat from the mounting cage. This flange 351 is attached to the outer wall of the video camera holder 31 and has a thermally conductive contact with this wall. In such a structure, the landing ring 342 and the video camera holder 31 are attached to each other using a heat dissipation structure 35 from the landing clamp to transfer heat between the clamp and the holder.

In some embodiments, the structure 35 for dissipating heat from the landing collar is in thermally conductive contact with the second portion 3472 shown in FIG. 23. The heat transfer efficiency through this thermal conductive contact is high, so that heat from the drive chip 346 can be transferred to a large extent to the structure 35 for dissipating heat from the landing ring.

To check the heat dissipation performance of the video camera module 30 shown in FIG. 4 – Fig. 6, for a periscope camera module that does not have a chip heat dissipation structure 347, a coil heat dissipation structure 345, and a mounting cage heat dissipation structure 35 (in other words, the original design), the temperature of the optical lens 33, two coils 3441 (which are respectively coil 1 and coil 2, where the currents through the coils are 40 mA) of the drive chip 346 and the image signal driver 362 are obtained by measurement and recorded in the column for the original design in Table. 1. In addition, for the periscope camera module 30, which includes a chip heat dissipation structure 347, a coil heat dissipation structure 345, and a housing heat dissipation structure 35, and which is shown in FIG. 4, when the coil currents are 40 mA (corresponding to case 1 in Table 1), 50 mA (corresponding to case 2 in Table 1) and 60 mA (corresponding to case 3 in Table 1), the temperature of the optical lens 33, two coils 3441 (which are coil 1 and coil 2, respectively), the drive chip 346 and the image signal driver 362 are obtained through measurements and are recorded respectively in the columns for case 1, case 2 and case 3 in Table. 1. Temperature unit in Table. 1 is °C. As a result of comparing the data given in Table. 1, it can be determined that by gradually increasing the current in the coil 3441 from 40 mA to 60 mA, the temperature of the optical lens 33 decreases from 81.0°C for the original technical solution to 55.0°C/56.7°C/58.5°C. The temperature of the 346 drive chip decreases from 142°C to 72.6°C. Thus, it can be stated that the video camera module 30 provided in the embodiments of the present application has good heat dissipation performance.

Table 1

Initial design Case 1 Case 2 Case 3 Optical lens 81 55.0 56.7 58.5 Coil 1 77.4 55.8 58 60.6 Coil 2 67.1 53.3 55.4 57.8 Drive chip 142.0 72.6 75.1 76.5 Image signal conditioner 85.6 80.5 80.6 80.7

It should be noted that Table. 1 is just an example of a simulation result and is used to describe the heat dissipation characteristics of the video camera module 30 proposed in the embodiments of the present application. This does not constitute any special limitation to the present application.

In FIG. 26 is a three-dimensional view of a video camera module 30 in accordance with several further embodiments of the present application. In FIG. 27 is an exploded view of the video camera module 30 shown in FIG. 26. In FIG. 28 is a three-dimensional view of the video camera module 30 shown in FIG. 26, in section along line C-C. In the exemplary embodiments, the video camera module 30 is a vertical video camera module. Specifically, the video camera module 30 includes a video camera holder 31, an optical lens 33, a drive motor 34, and a photosensitive component 36. In FIG. 29 is a three-dimensional view of the drive motor 34 in the video camera module 30 shown in FIG. 26 – Fig. 28. In FIG. 30 is an exploded view of the drive motor 34 shown in FIG. 29. In exemplary embodiments, the drive motor 34 includes a carrier 341, a seat 342, a resilient component 343, a drive component 344, a drive chip 346, and a housing 348. The drive component 344 includes a coil 3441 and a magnet 3442, and the drive component 344 is configured to implement drive for focusing AF. In other embodiments, drive component 344 is configured to drive to stabilize the OIS.

The structures and structures of the video camera holder 31, optical lens 33, photosensitive component 36 and carrier 341, mounting cage 342, elastic component 343, driving component 344, driving chip 346 and housing 348 in the driving motor 34 are the same as those of the corresponding components of the known technology. , and the connection ratios between the corresponding components are also the same. Therefore, the details will not be described in the embodiments of the present application.

Similar to the above periscope camera module, as the maximum focal length and its adjustment range in the video camera module 30 increase, the amount of heat generated by the coil 3441 increases, and the wall thickness of the carrier 341 becomes small. The heat from the coil 3441 is easily transferred to the optical lens 33; and thereby has an undesirable effect on the optical characteristics of this optical lens 33, so that the photographic quality of the video camera module 30 is seriously degraded.

To reduce the effect of heat generated by the coil 3441 on the optical lens 33, as shown in FIG. 30, the drive motor 34 further includes a structure 345 for dissipating heat from the coil. This coil heat dissipation structure 345 is a high thermal conductivity structure. In particular, the material of the coil heat dissipation structure 345 may comprise one or more of metal, non-metal, metal powder alloy, graphite, hot melt adhesive, and/or thermally conductive silicone. The metal may be one or more of the following metals: copper, iron, aluminum, copper alloy, ferroalloy, aluminum alloy and/or other similar material.

In some embodiments, FIGS. 31 is a simplified diagram of the assembly of a carrier 341 and a structure 345 for dissipating heat from a coil in the drive motor 34 shown in FIG. 30. In exemplary embodiments, coil heat dissipation structure 345 is located between carrier 341 and coil 3441 shown in FIG. 30. When two coils 3441 are present, two structures 345 for dissipating heat from the coil are also present. These two structures 345 for dissipating heat from the coil are respectively located between the two coils 3441 and the carrier 341.

The coil heat dissipation structure 345 is attached to the carrier 341. In particular, the coil heat dissipation structure 345 may be attached to the carrier 341 by means of an adhesive, or may be integrally manufactured with the carrier 341 using a technique such as insert molding. elements (insert molding), thermal spraying or electrochemical deposition. In other words, the structure 345 for dissipating heat from the coil and the carrier 341 form a single structure.

The coil 3441 is attached to the structure 345 to dissipate heat from the coil and forms a thermally conductive contact with it. This coil 3441 may be directly attached to the structure 345 to dissipate heat from the coil through adhesive or the like. Alternatively, coil 3441 may be attached to structure 345 to dissipate heat from the coil indirectly. For example, as shown in FIG. 15a and Fig. 15b, a coil heat dissipation structure 345 is attached to a carrier 341, and a fastener 3411 is attached to the carrier 341. The coil 3441 is wound on and attached to the fastener 3411. Thus, the coil 3441 is attached to the structure 345 to dissipate heat from the coil not directly, but using the fastener 3411 and the carrier 341.

The coil 3441 and the coil heat dissipation structure 345 may contact each other directly to transfer heat between them, or may transfer heat indirectly using another intermediate structure. This is not specifically limited here. In some embodiments, as shown in FIG. 30, a circuit board 3441a is located between the coil 3441 and the structure 345 to dissipate heat from the coil. The circuit board 3441a is configured to supply current to the coil 3441. The coil 3441 contacts the circuit board 3441a to transfer heat between them, and the circuit board 3441a contacts the structure 345 to dissipate heat from the coil to transfer heat between them. In such a design, heat transfer between the coil 3441 and the structure 345 to dissipate heat from the coil is not carried out directly, but using a printed circuit board 3441a.

In the above embodiments, circuit board 3441a may be a rigid circuit board, or may be a flex circuit board, or may be a rigid-flex circuit board. The 3441a circuit board may be an FR-4 dielectric board, or may be a Rogers dielectric board, or may be a hybrid Rogers/FR-4 dielectric board, or the like.

In some embodiments, the structure 345 for dissipating heat from the coil comprises a metal layer and a graphite layer stacked one on top of the other. The metal layer is in contact with the circuit board 3441a, and the graphite layer is located on the side of the metal layer close to the carrier 341. The metal layer and the graphite layer both have high thermal conductivities. Therefore, the heat from the 3441 coil can be quickly absorbed. In addition to this, the graphite layer can prevent heat generated by the coil 3441 from being transferred to the side close to the lens mounting hole 341a.

The orthogonal projection area of the coil 3441 onto the first surface a of the carrier 341 is smaller than the orthogonal projection area of the structure 345 for dissipating heat from the coil onto the first surface a of the carrier 341. The first surface a is a surface of the carrier 341 configured to receive the coil 3441. In such a structure, the structure 345 for dissipating heat from the coil may dissipate heat from the coil 3441 to a large area of the side wall of the carrier 341 to avoid heat concentration. With such a structure, it is possible to reduce the unwanted effect of heat generated by the coil 3441 during operation on the optical lens 33.

As shown in FIG. 31, a damping adhesive layer 3412 is disposed on the carrier 341. There may be one or more areas of damping adhesive layer 3412 here. For example, there are four sections of damping adhesive layer 3412, and these four sections of damping adhesive layer 3412 are distributed over the first two surfaces a. The carrier 341 is in elastic contact with the support member 3422 of the landing collar 342 shown in FIG. 30, using a damping adhesive layer 3412. With such a structure, it is possible to reduce impact wear caused by collisions between the carrier 341 and the landing ring 342 during the movement process.

To further reduce the undesirable effect of heat generated by the coil 3441 on the optical performance of the optical lens 33, in some embodiments, the adhesive damping layer 3412 is a highly thermally conductive structure. In particular, the adhesive damping layer 3412 is made of at least one of silica gel and/or acrylate rubber. The structure 345 for dissipating heat from the coil is in thermally conductive contact with the damping adhesive layer 3412. In other words, heat can be transferred between the coil heat dissipation structure 345 and the adhesive damping layer 3412. In such a design, heat from the coil 3441 can be transferred to the adhesive damping layer 3412 and further transferred to the seat race 342 using the adhesive damping layer 3412. This allows heat transfer from the coil 3441 to the optical lens 33 to be avoided to some extent. Therefore, the heat generated by the coil 3441 is therefore undesirably exposed to the optical lens 33.

In the above embodiments, the coil heat dissipation structure 345 may protrude toward the position of the adhesive damping layer 3412 to make direct contact with the adhesive damping layer 3412 for heat transfer, or may transfer heat to the adhesive damping layer 3412 indirectly using another intermediate structure. In some embodiments, as shown in FIG. 31, the coil heat dissipation structure 345 projects to the position of the damping adhesive layer 3412 and is in direct contact with the damping heat transfer adhesive layer 3412. The heat transfer efficiency due to direct contact thermal conductivity is high, so that heat from the coil 3441 can be quickly transferred to the adhesive damping layer 3412.

As shown in FIG. 30, the drive chip 346 is attached to the seat holder 342. Specifically, the drive chip 346 may be directly attached to the seat holder 342, or may be attached to the seat holder 342 indirectly but using an intermediate structure. In some embodiments, the drive motor 34 further includes a circuit board 350. In particular, the circuit board 350 may be a rigid circuit board, or may be a flexible circuit board, or may be a rigid-flex circuit board. The printed circuit board 350 may be an FR-4 dielectric board, or may be a Rogers dielectric board, or may be a hybrid Rogers/FR-4 dielectric board, or the like. The circuit board 350 is attached to the carrier 342, and the drive chip 346 is attached to the circuit board 350. In this design, the drive chip 346 is attached to the carrier 342 not directly, but using the circuit board 350. The drive chip 346 is located against the outer surface of the carrier 341 .

As the maximum focal length and its adjustment range in the video camera module 30 increase, the amount of heat generated by the drive chip 346 also increases. Being limited by the total volume of the video camera module 30, the distance between the drive chip 346 and the optical lens 33 is small. Therefore, heat from the drive chip 346 can also be easily transferred to the optical lens 33, thereby undesirably affecting the optical performance of the optical lens 33.

To reduce the unwanted effect of heat generated by the drive chip 346 on the optical lens 33, the drive motor 34, as shown in FIG. 10 further includes a structure 347 for dissipating heat from the chip. This structure 347 for dissipating heat from the chip is a structure with high thermal conductivity. In particular, the material of the chip heat dissipation structure 347 may comprise one or more of a metal, a non-metal doped with metal powder, graphite, hot melt adhesive, and/or thermally conductive silicone. The metal may be one or more of the following metals: copper, iron, aluminum, copper alloy, ferroalloy, aluminum alloy and/or other similar material.

In FIG. 32 is a simplified block diagram of a structure 347 for dissipating chip heat in the drive motor 34 shown in FIG. 30. This chip heat dissipation structure 347 includes a first portion 3471 and a second portion 3472 attached to one another so that heat transfer occurs between them. In particular, the first part 3471 and the second part 3472 may be connected to each other directly, or they may be connected indirectly using another intermediate structure. This is not specifically limited here. In some embodiments, the structure 347 for dissipating heat from the chip further includes a third portion 3473. This third portion 3473 is coupled between the first portion 3471 and the second portion 3472. The first portion 3471 and the second portion 3472 are not attached to each other directly, but by use of the third portion. 3473 so that heat transfer can occur between these parts. In some embodiments, the first portion 3471, the second portion 3472, and the third portion 3473 are integral. In other words, the first portion 3471, the second portion 3472, and the third portion 3473 are a single structural portion.

In FIG. 33 is a schematic diagram of the assembly of the housing 342, the printed circuit board 350, the drive chip 346, and the chip heat dissipation structure 347 in the drive motor 34 shown in FIG. 30, and structures 35 for dissipating heat from the landing collar shown in FIG. 27. In FIG. 34 is a three-dimensional view of the assembly diagram shown in FIG. 33, in section along line D-D. In FIG. 35 is an enlarged view of region II in the sectional view shown in FIG. 34. The chip heat dissipation structure 347 is attached to the seat holder 342. In particular, the chip heat dissipation structure 347 may be attached to the seat holder 342 through a technique such as adhesive dispensing, insert molding, welding, or other similar technology. The first portion 3471 is located on the side of the drive chip 346 close to the carrier 341 shown in FIG. 30, and this first portion 3471 is in thermally conductive contact with the drive chip 346. In other words, heat may be transferred between the first portion 3471 and the drive chip 346. Therefore, the first portion 3471 may absorb heat from the drive chip 346. The first portion 3471 may have a block shape, a plate shape, or the like. This is not specifically limited here. In some embodiments, the first portion 3471 is plate-shaped. In such a design, the first portion 3471 occupies a small space in the drive motor 34. In some embodiments, the projection of the drive chip 346 onto the first portion 3471 toward the carrier 341 is located within the first portion 3471. In such a design, the first portion 3471 may shield the drive chip 346, and this first part 3471 can absorb to a large extent the heat generated by the drive chip 346 during operation.

Based on the above embodiments, the first portion 3471 may be made of a metal material entirely or may be made of a combination of a metal material and a non-metal material. This is not specifically limited here. In some embodiments, the first portion 3471 includes a metal layer and a graphite layer disposed one on top of the other. In the X-axis direction, the first part 3471 includes a metal layer and a graphite layer disposed one on top of the other. The graphite layer is located on the side of the metal layer close to the carrier 341 shown in FIG. 30. Both the metal layer and the graphite layer both have high thermal conductivities. Therefore, it is possible to quickly absorb heat from the drive chip 346. In addition, the graphite layer can prevent heat generated by the drive chip 346 from being transferred to a side close to the carrier 341. The material of the metal layer may include, but is not limited to, copper or a copper alloy. In addition, the graphite layer can be created on the metal layer by electrochemical deposition, sputtering or other similar method. This is not specifically limited here.

The first portion 3471 may be in direct contact with the drive chip 346 for heat transfer, or may be spaced apart from the drive chip 346 to effect heat transfer by thermal radiation. This is not specifically limited here. In some embodiments, as shown in FIG. 35, the first part 3471 and the drive chip 346 are separated by a space. The width h of the gap between the first part 3471 and the drive chip 346 is greater than 0 mm and not greater than 1 mm. Optionally, the gap width h between the first portion 3471 and the drive chip 346 is 0.05 mm/0.2 mm/0.5 mm. In such a structure, the distance between the first part 3471 and the drive chip 346 is moderate, so that heat from the drive chip 346 can be largely transferred to the first part 3471. In addition, when the first part 3471 is made of an electrically conductive material such as metal, undesirable influence of the first part 3471 on the electrical performance of the drive chip 346 can be avoided, thereby improving the reliability of the drive chip 346.

The second portion 3472 is attached to the landing ring 342 so that a thermally conductive contact is formed between them. In particular, the second portion 3472 and the landing collar 342 may be attached to each other directly, or they may be attached to each other indirectly using a different structure, or they may have direct thermal contact with each other, or they may transmit heat alone the other not directly, but using an intermediate structure. This is not specifically limited here. In such a design, the heat absorbed by the first portion 3471 can be transferred to the landing race 342 using the third portion 3473 and the second portion 3472 to avoid heat transfer from the drive chip 346 to the carrier 341.

In some embodiments, the second portion 3472 is located on the side of the base 3421 of the landing collar 342 remote from the carrier 341 shown in FIG. 10, and the second portion 3472 is in contact with and attached to a surface of the base 3421 remote from the carrier 341. In such a structure, heat absorbed by the first portion 3471 can be transferred using the third portion 3473 and the second portion 3472 to a surface of the base 3421 remote from the carrier 341 shown in FIG. 10 to avoid transfer of heat towards the medium 341. In such a structure, the unwanted effect of heat generated by the drive chip 346 on the optical lens 33 is reduced.

In some embodiments, second portion 3472 and third portion 3473 alternatively have plate shapes. In addition to this, the second portion 3472 and the third portion 3473 also each include a metal layer and a graphite layer disposed one on top of the other. The metal layer of the third portion 3473 is bonded between the metal layer of the first portion 3471 and the metal layer of the second portion 3472. In some embodiments, the metal layer of the first portion 3471, the metal layer of the second portion 3472, and the metal layer of the third portion 3473 are integral with each other. The graphite layer of the third part 3473 is attached between the graphite layer of the first part 3471 and the graphite layer of the second part 3472. In some embodiments, the graphite layer of the first part 3471, the graphite layer of the second part 3472 and the graphite layer of the third part 3473 are integral with each other. In such a structure, heat from the first part 3471 can be efficiently transferred to the second part 3472, and the chip heat dissipation structure 347 has a simple composition structure and is easy to manufacture.

As shown in FIG. 26 and Fig. 27, the video camera module 30 further includes a structure 35 for dissipating heat from the landing ring. This structure 35 for dissipating heat from the landing ring is a structure with high thermal conductivity. In particular, the material of the structure 35 for dissipating heat from the housing may comprise one or more of metal, non-metal, metal powder alloy, graphite, hot melt adhesive, and/or thermally conductive silicone. The metal may be one or more of the following metals: copper, iron, aluminum, copper alloy, ferroalloy, aluminum alloy and/or other similar material.

In FIG. 36 is a schematic diagram of an assembly of a housing housing 342 and a structure 347 for dissipating heat from a chip in the drive motor 34 shown in FIG. 30, structures 35 for dissipating heat from the landing ring and the video camera holder 31 shown in FIG. 27. In FIG. 37 is a three-dimensional view of the assembly diagram shown in FIG. 36, in section along the line E-E. A structure 35 for dissipating heat from the landing ring is attached between the landing ring 342 of the drive motor 34 and the video camera holder 31 for transferring heat between the clamp and the holder. In other words, the landing cage heat dissipation structure 35 is attached between the landing clip 342 and the video camera holder 31, the landing clip heat dissipation structure 35 has a thermal conductive contact with the landing clip 342, and the landing clip heat dissipation structure 35 has a thermal conductive contact. contact with the video camera holder 31. In such a structure, the seat holder heat dissipation structure 35 can transfer heat from the seat holder 342 to the video camera holder 31, and further use the video camera holder 31 to transfer heat to a structure (eg, the middle plate 23) provided in the electronic device 100 and configured as a support for the video camera module 30.

In some embodiments, the landing collar heat dissipation structure 35 is in thermally conductive contact with the landing collar 342. Specifically, as shown in FIG. 35, a structure 35 for dissipating heat from the seat ring is attached to a surface of the base 3421 remote from the carrier 341 and is in thermally conductive contact with that surface. As shown in FIG. 37, the structure 35 for dissipating heat from the landing ring is attached to the video camera holder 31 and has a thermal conductive contact with the holder. In such a structure, the seat holder 342 of the drive motor 34 and the video camera holder 31 are attached to each other using a heat dissipation structure 35 from the seat holder to transfer heat from the holder to the holder.

In some embodiments, as shown in FIG. 35, the seat race heat dissipation structure 35 is in thermally conductive contact with the second portion 3472. The heat transfer efficiency through direct contact thermal conductivity is high, so that heat from the drive chip 346 can be largely transferred to the seat race heat dissipation structure 35 . With such a design, it is possible to improve the heat dissipation efficiency of the drive chip 346.

From the above description, it can be understood that, similar to the periscopic video camera module, the improvement of the vertical video camera module proposed in the embodiments of the present application is that a coil heat dissipation structure 345, a chip heat dissipation structure 347, and a chip heat dissipation structure 35 are added. dissipating heat from the landing frame to transfer heat from the coil 3441 and the drive chip 346 outward to the video camera holder 31, from which further heat transfer occurs to the middle frame. Thus, the undesirable effect of heat on the optical lens 33 is reduced.

Specific features, structures, materials, or characteristics discussed herein may be suitably combined in any one or more embodiments or examples.

Finally, it should be noted that the above embodiments are intended only to describe the technical solutions of this application and not to limit this application. Although the present application has been described in detail with reference to the above embodiments, even those of ordinary skill in the art should understand that they can still make modifications to the technical solutions described in the above embodiments, or make equivalent substitutions of some of the technical features of these embodiments, without deviating on the meaning and scope of technical solutions to the variants of this application.

Claims (32)

1. A drive motor (34) comprising a carrier (341), a coil (3441), a coil heat dissipation structure (345), a drive chip (346) and a chip heat dissipation structure (347), in which a lens mounting hole (341a) is provided in the carrier (341), and the lens mounting hole (341a) is configured to install an optical lens; and a coil (3441) is located on the outside of the carrier (341); And a structure for dissipating heat from a coil (345) is located between the carrier (341) and a coil (3441), this structure for dissipating heat from a coil (345) is attached to the carrier (341), and a coil (3441) is attached to the structure for dissipating heat from coil (345) and has thermal contact with it; the drive chip (346) is attached to the landing ring (342); And a structure for dissipating heat from a chip (347) includes a first portion (3471) and a second portion (3472), wherein the first portion (3471) is located on a side of the drive chip (346) close to the carrier (341), the first portion (3471) is in thermal contact with the drive chip (346), and the second part (3472) is attached to the landing ring (342) and has thermal contact with it. 2. The drive motor (34) according to claim 1, wherein the material of the structure for dissipating heat from the coil (345) contains one or more of metal, non-metal alloyed with metal powder, graphite, hot melt adhesive and/or thermally conductive silicone, in wherein the metal is one or more of the following metals: copper, iron, aluminum, copper alloy, ferroalloy, aluminum alloy and/or other similar material. 3. The drive motor (34) according to claim 1 or 2, wherein the structure for dissipating heat from the coil (345) includes a metal layer and a graphite layer disposed one on top of the other; And the metal layer and the coil are attached to each other by a thermal conductive connection, and the graphite layer is located on the side of the metal layer close to the lens mounting hole (341a), in which the material of the metal layer is one or more of the following metals - copper, iron, aluminum, copper alloy, ferroalloy, aluminum alloy and/or other similar material. 4. Drive motor (34) according to any one of paragraphs. 1-3, additionally containing a damping layer of adhesive (3412) and a landing ring (342), in which a damping adhesive layer (3412) is disposed on the carrier (341), and the carrier (341) is in contact with the seat collar (342) through the damping adhesive layer (3412); And the adhesive damping layer (3412) is a high thermal conductivity structure, and the coil heat dissipation structure (345) is in thermally conductive contact with the adhesive damping layer (3412). 5. The drive motor (34) according to claim 1, in which a groove (B) is made in the surface of the landing ring (342) facing the carrier (341); And the drive chip (346) is placed in this groove (B), and the first part (3471) covers the hole of this groove (B) and is attached to it. 6. Drive motor (34) according to any one of paragraphs. 1-5, in which the first part (3471) and the drive chip (346) are separated by a gap, and the width of the gap between the first part (3471) and the drive chip (346) is greater than 0 mm and not more than 1 mm. 7. Drive motor (34) according to any one of paragraphs. 1-6, in which the material of the first part (3471) contains one or more of the following materials - metal, non-metal alloyed with metal powder, graphite, hot melt adhesive and/or thermally conductive silicone, in which the metal is one or more of the following metals - copper , iron, aluminum, copper alloy, ferroalloy, aluminum alloy and/or other similar material. 8. Drive motor (34) according to any one of paragraphs. 1-7, in which the first part (3471) includes a metal layer and a graphite layer disposed one on top of the other, the metal layer has a thermally conductive contact with the drive chip (346), and the graphite layer is located on the side of the metal layer close to the carrier (341) wherein the material of the metal layer is one or more of copper, iron, aluminum, copper alloy, ferroalloy, aluminum alloy and/or other similar material. 9. Drive motor (34) according to any one of paragraphs. 1-8, wherein a second portion (3472) is located on a side of the seat race (342) remote from the carrier (341), and the second portion (3472) is in contact with a surface of the seat race (342) remote from the carrier (341). ), and is attached to this surface. 10. A drive motor (34) comprising a carrier (341), a seat housing (342), a drive chip (346) and a structure for dissipating heat from the chip (347), in which a lens mounting hole (341a) is provided in the carrier (341), and the lens mounting hole (341a) is configured to install an optical lens; and the drive chip (346) is attached to the landing ring (342); And a structure for dissipating heat from a chip (347) includes a first portion (3471) and a second portion (3472), wherein the first portion (3471) is located on a side of the drive chip (346) close to the carrier (341), the first portion (3471) is in thermally conductive contact with the drive chip (346), and the second part (3472) is attached to and is in thermally conductive connection with the landing ring (342). 11. The drive motor (34) according to claim 10, in which a groove (B) is created in the surface of the landing ring (342) facing the carrier (341), a drive chip (346) is placed in this groove (B), and the first part (3471) covers the hole of this groove (B) and is attached to this hole. 12. The drive motor (34) according to claim 10 or 11, in which the first part (3471) and the drive chip (346) are separated by a gap, and the width of the gap between the first part (3471) and the drive chip (346) is greater than 0 mm and not more than 1 mm. 13. Drive motor (34) according to any one of claims. 10-12, in which the material of the first part (3471) contains one or more of the following materials - metal, non-metal alloyed with metal powder, graphite, hot melt adhesive and/or thermally conductive silicone, in which the metal is one or more of the following metals - copper , iron, aluminum, copper alloy, ferroalloy, aluminum alloy and/or other similar material. 14. Drive motor (34) according to any one of claims. 10-13, in which the first part (3471) includes a metal layer and a graphite layer disposed one on top of the other, the metal layer has a thermally conductive contact with the drive chip (346), and the graphite layer is located on the side of the metal layer close to the carrier (341) wherein the material of the metal layer is one or more of copper, iron, aluminum, copper alloy, ferroalloy, aluminum alloy and/or other similar material. 15. Drive motor (34) according to any one of claims. 10-14, wherein the second portion (3472) is located on a side of the seat race (342) remote from the carrier (341), and the second portion (3472) is in contact with a surface of the seat race (342) remote from the carrier (341). ), and attached to this surface. 16. A video camera module (30) comprising an optical lens (33), a photosensitive component (36) and a drive motor (34) according to any one of paragraphs. 1-15, in which the optical lens (33) is installed in the lens mounting hole (341a) in the driving motor (34), the photosensitive component (36) is located on the output side of the optical lens (33), and the photosensitive component (36) and the drive motor (34) is secured. 17. The video camera module (30) according to claim 16, further comprising an element for rotating the optical path (32), in which this element for rotating the optical path (32) is located on the input side of the optical lens (33); an optical path rotating member (32) is configured to rotate a light beam incident in a first direction to emit the beam in a second direction in which the first direction is perpendicular to the second direction; and the input surface of the optical lens (33) is located opposite the output surface of the element for rotating the optical path (32), and the second direction is parallel to the optical axis of the optical lens (33). 18. The video camera module (30) according to claim 16 or 17, further comprising a video camera holder (31), an internal hole (311) is created in this video camera holder (31), and a drive motor (34) is located in this internal hole (311), a connector (31a) is located on an outer wall of the video camera holder (31), and the video camera holder (31) is configured to be secured to the electronic device (100) using the connector (31a). 19. The video camera module (30) according to claim 18, wherein the video camera holder (31) is made of a metal material; And the video camera module (30) further includes a structure for dissipating heat from the landing frame (35), in which this structure for dissipating heat from the landing frame (35) is attached between the landing frame (342) of the drive motor (34) and the video camera holder (31) and forms a thermally conductive connection with the holder and holder. 20. An electronic device (100), which is a type of electronic device having a photographing function, and comprising a frame (22), a middle plate (23) and a video camera module (30) according to any one of claims. 16-19, in which the middle plate (23) is attached to the frame (22), and the video camera module (30) is attached to the middle plate (23).