WO2023000180A1

WO2023000180A1 - Photographing apparatus, photographing assembly, pan-tilt assembly, and mobile device

Info

Publication number: WO2023000180A1
Application number: PCT/CN2021/107459
Authority: WO
Inventors: 刘霁鑫; 张雅文; 才志伟
Original assignee: 深圳市大疆创新科技有限公司
Priority date: 2021-07-20
Filing date: 2021-07-20
Publication date: 2023-01-26

Abstract

A photographing apparatus (100) comprises a housing (10), an imaging sensing module (20) and a first circuit board (30), the imaging sensing module (20) being disposed within the housing (10); the first circuit board (30) is disposed within the housing (10) and is separated from the imaging sensing module (20); the imaging sensing module (20) and the first circuit board (30) are separately thermally conductively connected to different surfaces of the housing (10), so as to improve temperature uniformity of the housing (10). The present disclosure also relates to a photographing assembly (1000), a pan-tilt assembly (2000), and a mobile device.

Description

Shooting device, shooting component, pan/tilt component and movable equipment

technical field

The present application relates to the technical field of photographing equipment, in particular to a photographing device, a photographing component, a pan-tilt component and a movable device.

Background technique

During the use of the camera, components such as the image sensor and core board of the camera will generate a lot of heat, and if the heat is not discharged from the camera in time, these components will be damaged, thereby reducing the imaging quality of the camera and components service life. In order to ensure the stable imaging quality of the camera during the shooting process and ensure the sufficient service life of the components of the camera, it is necessary to dissipate heat from the image sensor and core board of the camera during the design process of the camera. However, in the process of dissipating heat from the image sensor and core board of the camera in the traditional camera, the heat transferred to the camera casing is relatively concentrated, resulting in poor temperature balance of the camera casing and affecting user experience.

Contents of the invention

The present application provides a shooting device, a shooting component, a pan-tilt component and a movable device, aiming at improving the temperature uniformity of the casing and prolonging the shooting time.

In the first aspect, the embodiment of the present application provides a photographing device, including:

shell;

an imaging sensing module set in the housing;

The first circuit board is arranged in the casing and is spaced apart from the imaging sensing module;

Wherein, the imaging sensing module and the first circuit board are thermally connected to different surfaces of the casing, so as to improve the temperature uniformity of the casing.

In the second aspect, the embodiment of the present application provides a camera assembly, including:

base; and

The photographing device described in any one of the above is mechanically coupled to the base.

In a third aspect, the embodiment of the present application provides a pan/tilt assembly, including:

gimbal; and

The photographing device described in any one of the above is mechanically coupled with the pan/tilt.

In a fourth aspect, the embodiment of the present application provides a mobile device, including:

fuselage; and

The imaging device described in any one of the above is mounted on the body.

The embodiment of the present application provides a photographing device, a photographing assembly, a pan/tilt assembly, and a mobile device. Since the imaging sensing module and the first circuit board are connected to different surfaces of the housing through heat conduction, the imaging sensing The heat on the module and the heat on the first circuit board can be conducted to different surfaces of the casing respectively, so that the heat distribution of the casing is more uniform, the temperature uniformity of the casing is improved, and the temperature of the whole shooting device is more balanced. Delay the temperature rise of the shooting device, thereby prolonging the shooting time, improving the hot feeling of the shell surface, and satisfying the user experience.

It should be understood that the above general description and the following detailed description are only exemplary and explanatory, and cannot limit the disclosure content of the embodiments of the present application.

Description of drawings

In order to more clearly illustrate the technical solutions of the embodiments of the present application, the following will briefly introduce the drawings that need to be used in the description of the embodiments. Obviously, the drawings in the following description are some embodiments of the present application. Those of ordinary skill in the art can also obtain other drawings based on these drawings without any creative effort.

FIG. 1 is a schematic structural diagram of a photographing device provided in an embodiment of the present application;

Fig. 2 (a) is a partial structural schematic diagram of a photographing device provided by an embodiment of the present application;

Fig. 2(b) is a partial structural schematic diagram of an imaging sensing module provided by an embodiment of the present application;

FIG. 3 is a partial structural schematic diagram of a photographing device provided in an embodiment of the present application;

Fig. 4 is a schematic structural diagram of a casing provided by an embodiment of the present application;

Fig. 5(a) is a partial structural schematic diagram of a photographing device provided by an embodiment of the present application;

Fig. 5(b) is a partial structural schematic diagram of a photographing device provided by an embodiment of the present application;

Fig. 6(a) is a structural schematic diagram of an angle of a front cover provided by the embodiment of the present application;

Fig. 6(b) is a structural schematic diagram of another angle of a front cover provided by the embodiment of the present application;

Fig. 7(a) is a partial structural schematic diagram of a photographing device provided by an embodiment of the present application;

Fig. 7(b) is a schematic structural diagram of a photographing device provided by an embodiment of the present application;

Fig. 8 is a schematic structural diagram of a camera assembly provided by an embodiment of the present application;

Fig. 9 is a schematic structural diagram of a base provided by an embodiment of the present application;

Fig. 10 is a schematic structural diagram of a pan/tilt assembly provided by an embodiment of the present application.

Explanation of reference signs:

1000. Shooting component;

100. Shooting device;

10. Shell; 11. Front cover; 111. Cover plate; 112. First bracket; 113. Second bracket; 12. Middle frame; 121. First wall; 122. Second wall; 123. Metal heat conducting layer; 124 , plastic layer; 125, magnetic attraction piece; 126, electrical connection interface; 127, third wall; 13, rear cover; 14, storage space; 15, engaging part;

20. Imaging sensing module; 21. Second circuit board; 211. First surface; 22. Imaging sensor; 23. Copper sheet; 24. Rigid-flex board;

30. The first circuit board;

41. First heat conduction element; 42. Second heat conduction element; 43. First shield; 44. Communication circuit board; 45. Second shield; 46. Motor;

50. Battery assembly; 51. First battery; 52. Second battery;

61. Protective parts; 62. Lens module; 70. Screen;

200, base; 201, matching part;

2000, PTZ components;

300, the cloud platform; 301, the bearing bracket; 3011, the first connecting arm; 3012, the second connecting arm.

detailed description

The following will clearly and completely describe the technical solutions in the embodiments of the present application with reference to the drawings in the embodiments of the present application. Obviously, the described embodiments are part of the embodiments of the present application, not all of them. Based on the embodiments in this application, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the scope of protection of this application.

In the description of the present application, it should be understood that the terms "center", "longitudinal", "transverse", "length", "width", "thickness", "upper", "lower", "front", " Orientation indicated by rear, left, right, vertical, horizontal, top, bottom, inside, outside, clockwise, counterclockwise, etc. The positional relationship is based on the orientation or positional relationship shown in the drawings, which is only for the convenience of describing the application and simplifying the description, and does not indicate or imply that the referred device or element must have a specific orientation, be constructed and operated in a specific orientation, Therefore, it should not be construed as limiting the application. In addition, the terms "first" and "second" are used for descriptive purposes only, and cannot be interpreted as indicating or implying relative importance or implicitly specifying the quantity of indicated technical features. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of said features. In the description of the present application, "plurality" means two or more, unless otherwise specifically defined.

It should also be understood that the terminology used in the specification of the present application is for the purpose of describing specific embodiments only and is not intended to limit the present application. As used in this specification and the appended claims, the singular forms "a", "an" and "the" are intended to include plural referents unless the context clearly dictates otherwise.

It should also be further understood that the term "and/or" used in the description of the present application and the appended claims refers to any combination and all possible combinations of one or more of the associated listed items, and includes these combinations .

Some implementations of the present application will be described in detail below in conjunction with the accompanying drawings. In the case of no conflict, the following embodiments and features in the embodiments can be combined with each other.

Please refer to FIG. 1 , which shows a photographing device 100 provided in an embodiment of the present application. Exemplarily, the photographing device 100 is used for photographing pictures and/or videos.

Please refer to FIG. 1 and FIG. 2( a ), in some embodiments, the photographing device 100 includes a casing 10 , an imaging sensing module 20 and a first circuit board 30 . The imaging sensing module 20 is disposed in the casing 10 . The first circuit board 30 is disposed in the casing 10 . The first circuit board 30 is spaced apart from the imaging sensing module 20 . Wherein, the imaging sensing module 20 and the first circuit board 30 are respectively thermally connected to different surfaces of the housing 10 to improve the temperature uniformity of the housing 10 .

In the photographing device 100 of the above-mentioned embodiment, since the imaging sensing module 20 and the first circuit board 30 are thermally connected to different surfaces of the housing 10 respectively, the heat on the imaging sensing module 20 and the heat on the first circuit board 30 It can be conducted to different surfaces of the housing 10, so that the heat distribution of the housing 10 is more uniform, the temperature uniformity of the housing 10 is improved, the temperature of the shooting device 100 is more balanced, the temperature rise of the shooting device 100 is delayed, and the shooting time is prolonged. time, improve the hot feeling on the surface of the casing 10, satisfy the user experience, and have a reasonable structural design and strong practicability.

Referring to FIG. 1 , FIG. 2( a ) and FIG. 3 , in some embodiments, the housing 10 includes a front cover 11 , a middle frame 12 and a rear cover 13 . The front cover 11 and the rear cover 13 are respectively mechanically coupled to opposite sides of the middle frame 12 to form a receiving space 14 for accommodating the imaging sensing module 20 and the first circuit board 30 .

In some embodiments, the front cover 11 and the middle frame 12 are provided separately, and the two are mechanically coupled through at least one of snap connection, adhesive connection, welding, screw locking connection and the like. The rear cover 13 and the middle frame 12 are arranged separately, and the two are mechanically coupled through at least one of snap connection, adhesive connection, welding, screw locking connection and the like. In this way, the machinability is strong.

In other embodiments, the front cover 11 and the middle frame 12 may also be manufactured through an integral molding process; and/or, the rear cover 13 and the middle frame 12 may be manufactured through an integral molding process.

In some embodiments, the front cover 11 is thermally connected to the middle frame 12 ; and/or, the rear cover 13 is thermally connected to the middle frame 12 . In this way, the heat from a certain part of the housing 10 can be transferred to another part of the housing 10, further improving the temperature uniformity of the housing 10, making the temperature of the shooting device 100 more balanced, further prolonging the shooting time, and improving the surface of the housing 10. The hot feeling satisfies the user experience.

In some embodiments, both the front cover 11 and the rear cover 13 are thermally connected to the middle frame 12 . In this way, one of the front cover 11, the rear cover 13, and the middle frame 12 with higher heat can transfer heat to at least one of the other two, thereby further improving the temperature uniformity of the casing 10, so that the shooting device 100 The temperature is more balanced, further prolonging the shooting time, improving the hot feeling of the surface of the casing 10, and satisfying the user experience.

Referring to FIG. 4 , in some embodiments, the middle frame 12 includes a metal heat conduction layer 123 and a plastic layer 124 mechanically coupled with the metal heat conduction layer 123 . The plastic layer 124 is disposed on a side of the metal heat conducting layer 123 away from the receiving space 14 . The inner metal heat conduction layer 123 plays the role of heat uniformity, and the outer plastic layer 124 plays the role of improving the hot feeling of the surface of the shell 10 .

Exemplarily, the metal heat conducting layer 123 and the plastic layer 124 are manufactured by insert molding. In other implementation manners, the metal heat conducting layer 123 and the plastic layer 124 may also be coupled through other mechanical coupling methods, such as adhesive connection between the two.

Exemplarily, the surface area of the metal heat conducting layer 123 facing the plastic layer 124 may be the same as or different from the surface area of the plastic layer 124 facing the metal heat conducting layer 123 , which is not limited here.

Exemplarily, the back cover 13 has a sheet structure, which can not only ensure an effective heat conduction area, but also reduce the mass of the back cover 13 . Exemplarily, the rear cover 13 is a sheet metal structure. The metal sheet structure has good thermal conductivity and good plasticity, and can be made into the thinnest possible sheets. Therefore, the sheet metal structure made of metal is light in weight and small in size, which facilitates the flexible heat conduction connection of the rear cover 13 to the middle frame 12 and/or the imaging sensor module 20 .

Please refer to FIG. 2( a ) and FIG. 2( b ), in some embodiments, the imaging sensing module 20 includes a second circuit board 21 and an imaging sensor 22 . The imaging sensor 22 is disposed on the second circuit board 21 . The second circuit board 21 and/or the imaging sensor 22 are thermally connected to the rear cover 13 , so that the heat on the second circuit board 21 and/or the imaging sensor 22 is transferred to the rear cover 13 for dissipation.

Exemplarily, the imaging sensor 22 includes a chip.

The relative position between the second circuit board 21 and the rear cover 13 can be designed according to actual requirements. Exemplarily, the second circuit board 21 is substantially parallel to the rear cover 13 . For example, the angle between the second circuit board 21 and the rear cover 13 is -5°-5°, such as -5°, 0°, 5° and any other suitable angle between -5°-5°.

Understandably, in other implementation manners, the second circuit board 21 and the rear cover 13 may also be arranged non-parallel, which is not limited here.

Please refer to FIG. 2( a ) and FIG. 3 , in some embodiments, the imaging sensing module 20 is thermally connected to the rear cover 13 through the first heat conducting member 41 .

In some implementations, the imaging sensing module 20 is in contact with the first heat conducting member 41 and is in thermally conductive connection.

It can be understood that the contact heat conduction connection between the A component and the B component may include surface contact, point contact or line contact heat conduction connection.

In some other embodiments, the imaging sensor module 20 and the first heat conduction member 41 may also be connected by non-contact heat conduction. For example, the two are connected by indirect thermal conduction through a thermally conductive adhesive layer. Exemplarily, the thermally conductive adhesive layer adopts a thin adhesive layer with high thermal conductivity to ensure efficient thermal conduction between the imaging sensing module 20 and the first heat conducting member 41 . Exemplarily, the heat-conducting adhesive layer adopts a double-sided heat-conducting adhesive layer, and the two sides of the double-sided heat-conducting adhesive layer are attached to the imaging sensing module 20 and the first heat-conducting member 41 respectively. The double-sided thermally conductive adhesive layer may include a tape structure with or without a substrate, which is not limited here.

Exemplarily, the thermally conductive adhesive layer includes a thermally conductive silicone layer.

It can be understood that in other embodiments of the present application, the thermally conductive adhesive layer used for thermally connecting the two components is similar, and will not be repeated here.

In some embodiments, the first heat conduction member 41 is in contact with the rear cover 13 and is in thermally conductive connection.

In other embodiments, the first heat conduction member 41 and the rear cover 13 may also be connected by non-contact heat conduction.

Please refer to FIG. 3 , in some embodiments, the first heat conducting member 41 is protruded on the rear cover 13 . Exemplarily, the first heat conducting member 41 is protrudingly disposed on the surface of the rear cover 13 facing the receiving space 14 .

Exemplarily, the material of the first heat conducting member 41 may be metal, such as at least one of copper, aluminum, silver and the like. For example, the first heat conducting member 41 includes a metal boss. In some other embodiments, the material of the first heat conducting member 41 may also be non-metal, such as at least one of carbon fiber, graphite, and the like.

Exemplarily, the shape of the first heat conducting member 41 can be designed according to actual needs, such as a block shape, a sheet shape, other regular shapes or irregular shapes, and the like.

Please refer to FIG. 2( a ), in some embodiments, the second circuit board 21 includes a first surface 211 and a second surface opposite to each other. The imaging sensor 22 is disposed on the second surface.

Exemplarily, the imaging sensor 22 may be in contact with the first heat conduction member 41 for heat conduction connection, or be indirect heat conduction connection with the first heat conduction member 41 through a heat conduction adhesive layer or the like.

In other embodiments, the imaging sensor 22 can also be disposed on the first surface 211 of the second circuit board 21 .

In some embodiments, the second circuit board 21 is provided with a through hole (not shown) opposite to the first heat conducting member 41 . The imaging sensing module 20 is thermally connected to the first heat conducting member 41 through a through hole.

Exemplarily, the imaging sensor 22 and/or the second circuit board 21 are thermally connected to the first heat conducting member 41 through a through hole.

Exemplarily, the through hole runs through the first surface 211 and the second surface.

In some implementations, the hole wall of the through hole is in contact with the first heat conduction member 41 and is thermally conductively connected. In other embodiments, the hole wall of the through hole is thermally connected to the first heat conduction member 41 through the first heat conduction adhesive layer. Exemplarily, the opposite sides of the first thermally conductive adhesive layer are attached to the wall of the through hole and the first heat conducting member 41 , so as to realize the thermal connection between the wall of the through hole and the first heat conducting member 41 .

Exemplarily, the surface of the hole wall of the through hole is provided with a copper layer. The heat of at least one of the imaging sensor 22, other components located on the side of the first surface 211, and the second circuit board 21 is transferred to the first heat conducting member 41 through the copper layer and/or the through hole, and then passed through the first heat conducting member 41. A heat conduction element 41 is transferred to the rear cover 13 to dissipate the heat of the imaging sensor module 20 .

Exemplarily, the copper layer is in direct contact with the first heat conduction member 41 and is connected by heat conduction. Exemplarily, opposite sides of the first thermally conductive adhesive layer are attached to the copper layer and the first thermally conductive member 41 , so as to realize the thermally conductive connection between the copper layer and the first thermally conductive member 41 .

Exemplarily, the imaging sensor 22 is disposed opposite to the through hole. Exemplarily, the imaging sensor 22 is disposed opposite to the through hole. In this way, the heat dissipation efficiency of the imaging sensor 22 can be improved, thereby improving the temperature balance of the whole camera 100 , delaying the temperature rise of the camera 100 , and prolonging the shooting time.

Please refer to FIG. 5( a ), in some embodiments, the imaging sensing module 20 includes a copper sheet 23 . The imaging sensor 22 and/or the second circuit board 21 are thermally connected to the copper sheet 23 .

Please refer to FIG. 2( b ), in some embodiments, the imaging sensor 22 and the copper sheet 23 are respectively disposed on the side where the second surface is located and the side where the first surface 211 is located.

Exemplarily, the second circuit board 21 is thermally connected to the copper sheet 23 .

Exemplarily, the second circuit board 21 is provided with through holes. The imaging sensor 22 is thermally connected to the copper sheet 23 through any suitable heat-conducting intermediate piece, and the imaging sensor 22 and/or the heat-conducting intermediate piece pass through the through hole.

In some embodiments, the second circuit board 21 is provided with a hollow groove (not shown). The imaging sensor 22 and/or the first heat-conducting element 41 pass through hollow grooves, so that the imaging sensor 22 is thermally connected to the first heat-conducting element 41 .

Exemplarily, the area of the copper sheet 23 matches the area of the imaging sensor 22 . Exemplarily, the area of the copper sheet 23 is approximately the same as the area of the imaging sensor 22 .

Please refer to FIG. 5( a ), exemplarily, the imaging sensing module 20 further includes a rigid-flex board 24 . The rigid-flex board 24 is mechanically coupled with the copper sheet 23 .

Exemplarily, the imaging sensor 22 is disposed on the second surface of the second circuit board 21 . The copper sheet 23 and the rigid-flex board 24 are disposed on the first surface 211 of the second circuit board 21 . The imaging sensor 22 and/or the second circuit board 21 are thermally connected to the copper sheet 23 and/or the rigid-flex board 24 . The imaging sensor 22 and/or the second circuit board 21 are thermally connected to the first heat conducting member 41 .

Exemplarily, the copper sheet 23 and the rigid-flex board 24 are thermally connected to the second circuit board 21 to increase the heat dissipation area, improve the heat dissipation efficiency of the imaging sensing module 20, and control the temperature of the imaging sensing module 20 It is of great help, thereby improving the temperature balance of the whole shooting device 100, delaying the temperature rise of the shooting device 100, and prolonging the shooting time.

Exemplarily, the copper sheet 23 and/or the rigid-flex board 24 are connected to the second circuit board 21 in contact with heat conduction.

Exemplarily, the copper sheet 23 and/or the rigid-flex board 24 are thermally connected to the second circuit board 21 through a thermally conductive adhesive layer.

Exemplarily, the copper sheet 23 is thermally connected to the rigid-flex board 24 .

Exemplarily, the imaging sensor 22 is thermally connected to the first heat conducting member 41 .

In some embodiments, the first heat conducting member 41 is located on the side where the second surface of the second circuit board 21 is located. The second surface is not provided or is not provided with other components other than the imaging sensor 22, which provides sufficient space for the first heat conducting member 41, which is conducive to increasing the second surface or the imaging sensor 22 and the second surface. The heat conduction area between a heat conduction member 41 can improve the heat dissipation efficiency of the imaging sensor module 20, improve the temperature balance of the whole camera 100, delay the temperature rise of the camera 100, and prolong the shooting time.

Exemplarily, the imaging sensor 22 is disposed on the second surface of the second circuit board 21 . The imaging sensor 22 can be substantially on the same plane as the surface of the second circuit board 21 , or can be protruded from the second surface of the second circuit board 21 .

In some embodiments, the imaging sensor 22 and the first heat conduction member 41 are respectively located on the side where the first surface 211 is located and the side where the second surface is located, and no components of the imaging sensor module 20 are protruded on the second surface. It can be understood that the components of the imaging sensing module 20 are not protruded on the second surface, and the components of the imaging sensing module 20 are arranged on other areas such as the first surface 211 of the second circuit board 21. The first heat conduction member 41 provides sufficient space, which is conducive to ensuring or increasing the heat conduction area between the second surface and the first heat conduction member 41, thereby improving the heat dissipation efficiency of the imaging sensing module 20, and improving the overall performance of the shooting device 100. The temperature balance can delay the temperature rise of the shooting device 100, thereby prolonging the shooting time.

In some embodiments, the first circuit board 30 includes a core board.

In some embodiments, the first circuit board 30 is thermally connected to the front cover 11 ; and/or, the first circuit board 30 is thermally connected to the middle frame 12 . In this way, the imaging sensing module 20 and the first circuit board 30 are respectively thermally connected to different positions of the housing 10, thereby making the heat distribution of the housing 10 more uniform, improving the temperature uniformity of the housing 10, and making the camera 100 complete. The temperature is more balanced, and the temperature rise of the shooting device 100 is delayed, thereby prolonging the shooting time and improving the hot feeling of the surface of the casing 10 .

Exemplarily, the imaging sensing module 20 is thermally connected to the rear cover 13, and the front cover 11 and the middle frame 12 are both thermally connected to the first circuit board 30, thereby further improving the temperature uniformity of the housing 10, so that the camera device 100 is integrated The temperature is more balanced, further prolonging the shooting time, improving the hot feeling of the surface of the casing 10, and satisfying the user experience.

Referring to FIG. 3 , in some embodiments, the middle frame 12 includes a first wall 121 and a second wall 122 that are spaced apart and opposite to each other. Both the front cover 11 and the rear cover 13 are connected to the first wall 121 and the second wall 122 . The first circuit board 30 is thermally connected to the first wall 121 , so that the heat on the first circuit board 30 is transferred to the first wall 121 for dissipation.

Exemplarily, the first wall 121 is substantially parallel to the second wall 122 . In other embodiments, the first wall 121 may also be non-parallel to the second wall 122 .

Exemplarily, the included angle between the first wall 121 and/or the second wall 122 and the rear cover 13 is an acute angle, an obtuse angle or a right angle. For example, the first wall 121 and/or the second wall 122 are substantially perpendicular to the rear cover 13 .

In some embodiments, the first circuit board 30 is substantially parallel to the first wall 121 . In this way, it is beneficial to ensure that the heat conduction area between the first circuit board 30 and the first wall 121 is as large as possible, thereby improving the heat dissipation efficiency of the first circuit board 30, improving the temperature balance of the whole camera device 100, and delaying the delay of the camera device. 100 temperature rise, which in turn prolongs the shooting time. In other embodiments, the first circuit board 30 and the first wall 121 may also be arranged non-parallel.

In some embodiments, the first circuit board 30 is connected to the first wall 121 in contact with heat conduction.

In some embodiments, the first circuit board 30 is connected to the first wall 121 through non-contact heat conduction, that is, the first circuit board 30 is connected to the first wall 121 through an intermediate heat conduction member. The intermediate heat conduction element may include at least one of a metal heat conduction element, a non-metal heat conduction element, and the like. For example, the intermediate heat conducting member may include at least one of a heat conducting adhesive layer, a magnet, an aluminum block, a metal sheet, and the like.

Please refer to FIG. 5( b ), in some embodiments, the photographing device 100 further includes a second heat conducting element 42 . The second heat conducting member 42 is thermally connected to the first circuit board 30 and the middle frame 12 .

In some embodiments, the first circuit board 30 is thermally connected to the second heat conducting member 42 . Exemplarily, the first circuit board 30 is connected to the second heat conducting member 42 in contact and heat conduction. Exemplarily, the first circuit board 30 is thermally connected to the second heat-conducting member 42 through a heat-conducting glue layer or the like.

In some embodiments, the second heat conduction member 42 is thermally connected to the first wall 121 of the middle frame 12 . Exemplarily, the second heat conduction member 42 is in contact with the first wall 121 and is in thermal conduction connection.

Exemplarily, the second heat conduction element 42 may include at least one of a metal heat conduction element, a non-metal heat conduction element, and the like. For example, the second heat conduction member 42 may include at least one of a heat conduction adhesive layer, a magnet, an aluminum block, a metal sheet, and the like. Exemplarily, the second heat conducting member 42 includes an aluminum block.

Referring to FIGS. 2( a ) and 5 ( b ), in some embodiments, the photographing device 100 further includes a first shield 43 . The first circuit board 30 is disposed in the first shielding case 43 . The second heat conducting element 42 is disposed outside the first shielding case 43 . Both the first circuit board 30 and the second heat conducting member 42 are thermally connected to the first shielding case 43 . The first shielding case 43 can function as electromagnetic shielding for the first circuit board 30 , reducing or preventing the first circuit board 30 from being interfered by external signals.

Exemplarily, the first circuit board 30 is connected to the first shielding case 43 in contact with heat conduction. Exemplarily, the first circuit board 30 is thermally connected to the first shielding case 43 through a thermally conductive adhesive layer or the like.

Exemplarily, the first shielding case 43 is connected to the second heat conducting member 42 in contact with heat conduction. Exemplarily, the first shielding case 43 is thermally connected to the second heat-conducting member 42 through a heat-conducting glue layer or the like.

Referring to FIG. 2( a ) and FIG. 5( b ), in some embodiments, the middle frame 12 includes a magnetic attraction 125 . The magnetic attractor 125 is disposed on the first wall 121 for mechanical coupling with the external components, so as to realize the mechanical coupling between the photographing device 100 and the external components. The second heat conduction element 42 is thermally connected to the magnetic attraction element 125 . The external component may be the base 200 in FIG. 8 or the like.

Exemplarily, the magnetic attraction part 125 and the first wall 121 may be integrally formed. The magnetic attraction part 125 can also be mechanically coupled with the first wall 121 in the following manners: snap connection, adhesive connection, screw locking connection and the like.

Exemplarily, the second heat conduction member 42 may be connected to the magnetic attraction member 125 in contact with heat conduction. Exemplarily, the second heat conduction member 42 may also be thermally connected to the magnetic attraction member 125 through a heat conduction adhesive layer or other intermediate heat conduction structures.

In some embodiments, the magnetic attractor 125 is thermally connected to the first wall 121 . Exemplarily, the magnetic attractor 125 is thermally connected to the metal heat conduction layer 123 of the first wall 121 .

Exemplarily, the magnetic attraction 125 is directly thermally connected to the first wall 121 . Exemplarily, the magnetic attractor 125 is thermally connected to the first wall 121 through a thermally conductive glue layer or the like.

Please refer to FIG. 2( a ), in some embodiments, the middle frame 12 includes an electrical connection interface 126 . The magnetic attraction part 125 and/or the second heat conduction part 42 are thermally connected to the electrical connection interface 126 . The electrical connection interface 126 is used for electrical connection with corresponding interfaces of external components (such as the base 200 in FIG. 8 or the pan/tilt 300 in FIG. 10 ).

Exemplarily, the electrical connection interface 126 includes a spring type connector.

Exemplarily, electrical connection interface 126 includes pogo pins.

Exemplarily, the magnetic attraction part 125 and/or the second heat conduction part 42 are connected to the electrical connection interface 126 in contact with heat conduction. Exemplarily, the magnetic attraction part 125 and/or the second heat conduction part 42 are thermally connected to the electrical connection interface 126 through a thermally conductive adhesive layer or the like.

Exemplarily, the electrical connection interface 126 is thermally connected to the first wall 121 .

Exemplarily, at least part of the heat on the first circuit board 30 is transferred to the base 200 in FIG. 8 or the supporting bracket 301 in FIG. 10 via the first shield 43 , the second heat conducting member 42 , and the magnetic attraction member 125 in sequence.

Exemplarily, at least part of the heat on the first circuit board 30 is sequentially transferred to the base 200 in FIG. 8 or to the base 200 in FIG. Bearing bracket 301 .

Exemplarily, at least part of the heat on the first circuit board 30 is sequentially transferred to the base 200 in FIG. 8 or the supporting bracket 301 in FIG. 10 through the first shielding cover 43 , the second heat conducting member 42 , and the electrical connection interface 126 .

Exemplarily, the magnetic attractor 125 includes a magnet.

Exemplarily, the number of magnetic attractors 125 can be designed according to actual needs, such as one, two, three or more, which is not limited here.

It should be noted that the schematic diagram of the first circuit board 30, the first shielding case 43, the second heat conducting member 42 and the magnetic attraction member 125 in FIG. The quantity, shape and/or structure of the first shielding case 43 , the second heat conducting member 42 and the magnetic attraction member 125 are limited. During actual application, the quantity, shape and/or structure of the first circuit board 30 , the first shield 43 , the second heat conduction member 42 and the magnetic attraction member 125 can be changed according to the actual application scenario.

Please refer to FIG. 2( a ), in some embodiments, the first circuit board 30 is thermally connected to the front cover 11 . In this way, the first circuit board 30 and the imaging sensor module 20 are connected to different parts of the housing 10 through heat conduction, which improves the temperature uniformity of the housing 10, delays the temperature rise of the shooting device 100, thereby prolonging the shooting time and improving the surface of the housing 10. The hot feeling satisfies the user experience.

Exemplarily, both the front cover 11 and the middle frame 12 are thermally connected to the first circuit board 30, so as to further make the heat distribution of the casing 10 more uniform, improve the temperature uniformity of the casing 10, delay the temperature rise of the shooting device 100, and make the shooting The temperature of the whole device 100 is more balanced, the temperature rise of the shooting device 100 is delayed, the shooting time is extended, the surface of the casing 10 is improved, and the user experience is satisfied.

Referring to FIG. 2( a ), FIG. 6( a ) and FIG. 6( b ), in some embodiments, the front cover 11 includes a cover plate 111 and a first bracket 112 protruding from the cover plate 111 . The first bracket 112 is disposed on a side of the cover plate 111 facing the receiving space 14 . The first circuit board 30 is thermally connected to the first bracket 112 .

Exemplarily, the cover plate 111 is substantially parallel to the rear cover 13 . In other embodiments, the cover plate 111 and the rear cover 13 may also be non-parallel.

Exemplarily, the first circuit board 30 is connected to the first bracket 112 in contact with heat conduction. Exemplarily, the first circuit board 30 is thermally connected to the first bracket 112 through a thermally conductive adhesive layer.

In some implementations, the first circuit board 30 is thermally connected to the first shield 43, and the first shield 43 is thermally connected to the first bracket 112. Exemplarily, the first shielding cover 43 is in contact with the first bracket 112 and connected through heat conduction. Exemplarily, the first shielding case 43 is thermally connected to the first bracket 112 through a thermally conductive adhesive layer.

Exemplarily, the first bracket 112 is substantially perpendicular to the cover plate 111 . In other embodiments, the first bracket 112 and the cover plate 111 may also be arranged non-perpendicularly.

Exemplarily, the first bracket 112 and the cover plate 111 are integrally formed. Exemplarily, the first bracket 112 is mechanically coupled to the cover plate 111 through adhesive connection, snap connection and the like.

Exemplarily, the first bracket 112 is thermally connected to the cover plate 111 . The heat on the first circuit board 30 and/or the first shield 43 can be transferred to the first bracket 112 and then transferred to the cover plate 111 for dissipation.

The shape or structure of the first bracket 112 can be designed according to actual needs, such as adapting to the shape of the first circuit board 30 or the first shielding case 43 , etc., which is not limited here.

Please refer to FIG. 2( a ), in some embodiments, the photographing device 100 further includes a communication circuit board 44 . The communication circuit board 44 is disposed inside the casing 10 . The communication circuit board 44 is thermally connected to the front cover 11, so that the heat distribution of the casing 10 is more uniform, the temperature uniformity of the casing 10 is improved, the temperature of the shooting device 100 is more balanced, the temperature rise of the shooting device 100 is delayed, and the Shooting time, improve the hot feeling on the surface of the casing 10, and satisfy the user experience.

Exemplarily, the communication circuit board 44 , the second circuit board 21 and the first circuit board 30 are arranged in sequence.

Exemplarily, the communication circuit board 44 , the second circuit board 21 and the first circuit board 30 are arranged at intervals to reduce mutual interference.

Please refer to FIG. 2( a ), exemplarily, the communication circuit board 44 is disposed adjacent to the top of the housing 10 . The first circuit board 30 is disposed adjacent to the bottom of the housing 10 .

Please refer to FIG. 2( a ), exemplarily, the communication circuit board 44 is substantially parallel to the first wall 121 and/or the second wall 122 . In other implementation manners, the communication circuit board 44 may also be non-parallel to the first wall 121 and/or the second wall 122 .

Please refer to FIG. 2( a ), exemplarily, the communication circuit board 44 is substantially parallel to the first circuit board 30 . In other implementation manners, the communication circuit board 44 and the first circuit board 30 may also be non-parallel.

Exemplarily, the communication circuit board 44 is substantially perpendicular to the second circuit board 21 . In other implementation manners, the communication circuit board 44 may also be non-perpendicular to the second circuit board 21 .

Please refer to FIG. 2( a ), in some embodiments, the photographing device 100 further includes a second shield 45 . The second shielding case 45 is disposed inside the housing 10 . The communication circuit board 44 is disposed in the second shielding case 45 . The front cover 11 and the communication circuit board 44 are respectively thermally connected to the second shielding case 45, thereby transferring the heat of the communication circuit board 44 to the front cover 11. The second shielding case 45 can play the role of electromagnetic shielding for the communication circuit board 44, reducing or preventing the communication circuit board 44 from being interfered by external signals.

Exemplarily, the communication circuit board 44 includes a wifi circuit board.

Exemplarily, the communication circuit board 44 is used for communicating with external devices. The external device may include a pan/tilt 300 (see FIG. 10 ), a mobile phone, a remote controller, a main body of a mobile device, and the like.

Exemplarily, the communication circuit board 44 is connected to the second shielding case 45 in contact with heat conduction. Exemplarily, the communication circuit board 44 is thermally connected to the second shielding case 45 through a thermally conductive adhesive layer or the like.

Exemplarily, the second shielding case 45 is in contact with the front cover 11 and is thermally conductively connected. Exemplarily, the second shielding cover 45 is thermally connected to the front cover 11 through a thermally conductive adhesive layer or the like.

Please refer to FIG. 2( a ) and FIG. 6( b ), in some embodiments, the front cover 11 includes a second bracket 113 . The second bracket 113 protrudes from the cover plate 111 . Exemplarily, the second bracket 113 is thermally connected to the cover plate 111 . The heat on the communication circuit board 44 and/or the second shield 45 can be transferred to the second bracket 113 and then transferred to the cover plate 111 for dissipation.

Referring to FIG. 2( a ) and FIG. 6( b ), for example, the second bracket 113 and the first bracket 112 are protruded from the same side of the cover plate 111 . The second bracket 113 is spaced apart from the first bracket 112 .

In some implementations, the communication circuit board 44 is thermally connected to the second shield 45 , and the second shield 45 is thermally connected to the second bracket 113 .

Exemplarily, the communication circuit board 44 is connected to the second bracket 113 in contact with heat conduction. Exemplarily, the communication circuit board 44 is thermally connected to the second bracket 113 through a thermally conductive adhesive layer.

Exemplarily, the second shielding cover 45 is connected to the second bracket 113 in contact with heat conduction. Exemplarily, the second shielding cover 45 is thermally connected to the second bracket 113 through a thermally conductive adhesive layer.

Exemplarily, the second bracket 113 is substantially perpendicular to the cover plate 111 . In other embodiments, the second bracket 113 and the cover plate 111 may also be arranged non-perpendicularly.

Exemplarily, the second bracket 113 and the cover plate 111 are integrally formed. Exemplarily, the second bracket 113 is mechanically coupled to the cover plate 111 through adhesive connection, snap connection and the like.

The shape or structure of the second bracket 113 can be designed according to actual needs, such as adapting to the shape of the communication circuit board 44 or the second shield 45 , etc., which is not limited here.

Please refer to FIG. 2( a ), in some embodiments, the photographing device 100 further includes a battery assembly 50 . The battery assembly 50 is disposed inside the casing 10 . Both the imaging sensing module 20 and the first circuit board 30 are spaced apart from the battery assembly 50 to prevent the battery assembly 50 from affecting the operation of the imaging sensing module 20 and the first circuit board 30 .

Please refer to FIG. 2( a ), exemplarily, the battery assembly 50 is spaced apart from the communication circuit board 44 so as to avoid the battery assembly 50 from affecting the operation of the communication circuit board 44 as much as possible.

Please refer to FIG. 2( a ), exemplarily, the battery assembly 50 includes a first battery 51 and a second battery 52 . Both the communication circuit board 44 and the imaging sensing module 20 are disposed between the first battery 51 and the second battery 52 .

Please refer to FIG. 2( a ), exemplarily, the first circuit board 30 is disposed at the bottom of the battery assembly 50 .

Please refer to FIG. 1 and FIG. 7( a ), exemplarily, the photographing device 100 further includes a protection member 61 and a lens module 62 . The protection member 61 is disposed on the front cover 11 for protecting the lens module 62 . The lens module 62 is disposed in the receiving space 14 . Exemplarily, the protector 61 includes a glass protector.

Referring to FIG. 7( b ), exemplarily, the photographing device 100 further includes a screen 70 disposed at the rear cover 13 for displaying the working status and/or photographing information of the photographing device 100 . The working state includes the power of the battery pack 50 and the like.

Please refer to FIG. 2( a ), in some embodiments, the photographing device 100 further includes a motor 46 for causing the photographing device 100 to produce a vibration effect.

Referring to FIG. 8 , the embodiment of the present application further provides a photographing assembly 1000 , including a base 200 and the photographing device 100 of any of the above-mentioned embodiments. The photographing device 100 is mechanically coupled with the base 200 .

In the photographing assembly 1000 of the above-mentioned embodiment, since the imaging sensing module 20 and the first circuit board 30 are thermally connected to different surfaces of the casing 10 respectively, the heat on the imaging sensing module 20 and the heat on the first circuit board 30 It can be conducted to different surfaces of the housing 10 respectively, so that the heat distribution of the housing 10 is more uniform, the temperature uniformity of the housing 10 is improved, the temperature of the shooting device 100 is more balanced, the temperature rise of the shooting device 100 is delayed, and the shooting time is prolonged. time, improve the hot feeling on the surface of the casing 10, satisfy the user experience, and have a reasonable structural design and strong practicability.

In some embodiments, the housing 10 is thermally connected to the base 200 . In this way, it is beneficial to dissipate the heat of the shooting device 100 in time, improve the temperature balance of the shooting device 100 , delay the temperature rise of the shooting device 100 , extend the shooting time, and improve the hot feeling on the surface of the casing 10 .

Exemplarily, the shell of the base 200 includes at least one of a metal heat conduction structure or a non-metal heat conduction structure.

Exemplarily, the housing of the base 200 includes a metal heat-conducting housing. The heat on the casing 10 of the photographing device 100 can be transferred to the metal heat-conducting shell, and the metal heat-conducting shell can evenly distribute the heat to the entire shell, improving the temperature balance of the photographing assembly 1000 .

Exemplarily, the shell of the base 200 includes a plastic shell body, a heat-conducting graphite sheet, and a copper foil structure. The thermally conductive graphite sheet and copper foil structure are arranged on the plastic shell body. The heat on the casing 10 of the camera 100 can be transferred to the heat-conducting graphite sheet and the copper foil structure, and then the heat is evenly distributed to the entire base 200 or the housing through the heat-conducting graphite sheet and the copper foil structure, so as to improve the temperature balance of the camera assembly 1000 .

In some implementations, the first wall 121 of the housing 10 is connected to the base 200 in contact with heat conduction. In other embodiments, the first wall 121 of the housing 10 is thermally connected to the base 200 through a thermally conductive adhesive layer.

Referring to FIG. 8 and FIG. 9 , in some embodiments, the housing 10 is provided with an engaging portion 15 , and the base 200 is provided with a mating portion 201 . The engaging part 15 is engaged with the matching part 201 , so as to realize the mechanical coupling between the photographing device 100 and the base 200 . The engaging part 15 is thermally connected to the matching part 201 , so that the heat on the housing 10 can be transferred to the base 200 through the engaging part 15 and the matching part 201 , thereby dissipating the heat of the camera 100 in time.

Exemplarily, one of the engaging portion 15 and the matching portion 201 includes a slot, and the other includes a buckle matched with the slot.

In other embodiments, the housing 10 may also be mechanically coupled to the base 200 through other mechanical coupling methods such as adhesive connection.

Exemplarily, the engaging part 15 is connected to the mating part 201 in contact and heat conduction or non-contact heat conduction connection. No limitation is imposed here.

Referring to FIG. 10 , the embodiment of the present application further provides a pan/tilt assembly 2000 , including a pan/tilt 300 and the photographing device 100 of any one of the above-mentioned embodiments. The photographing device 100 is mechanically coupled with the pan/tilt 300 .

In the pan/tilt assembly 2000 of the above-mentioned embodiment, since the imaging sensing module 20 and the first circuit board 30 are thermally connected to different surfaces of the casing 10 respectively, the heat on the imaging sensing module 20 and the heat on the first circuit board 30 The heat can be conducted to different surfaces of the casing 10, so that the heat distribution of the casing 10 is more uniform, the temperature uniformity of the casing 10 is improved, the temperature of the shooting device 100 is more balanced, the temperature rise of the shooting device 100 is delayed, and the Shooting time, improve the hot feeling on the surface of the shell 10, satisfy the user experience, reasonable structural design, and strong practicability.

Exemplarily, the pan/tilt 300 includes at least one rotating shaft mechanism for adjusting the attitude angle of the photographing device 100 . The rotating shaft mechanism includes a bracket and a motor coupled to the bracket, and the motor drives the bracket to move so as to drive the camera device 100 to rotate.

Exemplarily, the gimbal 300 includes a one-axis gimbal, a two-axis gimbal 3 or a three-axis gimbal.

Exemplarily, the at least one rotating axis mechanism includes at least one of a pitch axis (Pitch axis) mechanism, a translation axis (YAW axis) mechanism, and a roll axis (Roll axis) mechanism.

Exemplarily, the gimbal 300 is a three-axis gimbal. The at least one rotating axis mechanism includes a pitch axis (Pitch axis) mechanism, a translation axis (YAW axis) mechanism and a roll axis (Roll axis) mechanism.

Exemplarily, the gimbal 300 is a three-axis gimbal. The tilt axis mechanism can be used to install the photographing device 100 . The motor of the pitch axis mechanism drives the photographing device 100 to perform a pitch motion around the pitch axis. The pitch axis mechanism is installed on the roll axis mechanism. The motor of the roll axis mechanism drives the photographing device 100 to perform a roll motion around the roll axis. The roll axis mechanism is installed on the translation axis mechanism. The camera 100 is controlled by the motor of the translation axis mechanism to perform a translation movement around the translation axis. It can be understood that in other implementation manners, the mechanical coupling manner among the pitch axis mechanism, the translation axis mechanism and the roll axis mechanism may also be in other manners, which is not limited here.

Exemplarily, the platform 300 includes a supporting bracket 301 . The photographing device 100 is carried on the supporting bracket 301 , and the housing 10 is thermally connected to the supporting bracket 301 .

Exemplarily, the bracket includes a bearing bracket 301 .

Exemplarily, the supporting bracket 301 includes a metal bracket or a non-metallic heat-conducting bracket.

Referring to FIG. 10 , in some embodiments, the bearing bracket 301 includes a first connecting arm 3011 and a second connecting arm 3012 . The photographing device 100 is carried on the first connecting arm 3011 . The second connecting arm 3012 is bent and extended from one end of the first connecting arm 3011 . The first wall 121 and the third wall 127 of the casing 10 are connected to the first connecting arm 3011 and the second connecting arm 3012 respectively, so as to transfer the heat of the shooting device 100 to the pan/tilt 300, which is conducive to the timely dissipation of the heat of the shooting device 100 It can be seen that the temperature balance of the shooting device 100 is improved, the temperature rise of the shooting device 100 is delayed, the shooting time is prolonged, and the hot feeling of the surface of the casing 10 is improved.

In other embodiments, the first wall 121 of the housing 10 is thermally connected to the first connecting arm 3011 ; or, the third wall 127 of the housing 10 is thermally connected to the second connecting arm 3012 .

Exemplarily, the first wall 121 of the housing 10 is connected to the first connecting arm 3011 in contact or non-contact heat conduction.

Exemplarily, the third wall 127 of the housing 10 is connected to the second connecting arm 3012 in contact or non-contact heat conduction.

Exemplarily, the first wall 121 of the housing 10 is connected to the third wall 127 .

Please refer to FIG. 10 , in some embodiments, the angle between the first connecting arm 3011 and the second connecting arm 3012 is substantially vertical. In other embodiments, the first connecting arm 3011 and the second connecting arm 3012 may also be non-perpendicular.

Exemplarily, the first connecting arm 3011 and the second connecting arm 3012 are integrally formed. In other implementation manners, the first connecting arm 3011 and the second connecting arm 3012 are mechanically coupled through adhesive connection, screw locking connection and the like.

Exemplarily, the first connecting arm 3011 and/or the second connecting arm 3012 are magnetically connected to the magnetic member 125 of the photographing device 100 .

The embodiment of the present application also provides a mobile device, including a body and the photographing device 100 of any one of the above embodiments. The imaging device 100 is mounted on a body.

In the mobile device of the above embodiment, since the imaging sensing module 20 and the first circuit board 30 are connected to different surfaces of the casing 10 through heat conduction, the heat on the imaging sensing module 20 and the heat on the first circuit board 30 It can be conducted to different surfaces of the housing 10 respectively, so that the heat distribution of the housing 10 is more uniform, the temperature uniformity of the housing 10 is improved, the temperature of the shooting device 100 is more balanced, the temperature rise of the shooting device 100 is delayed, and the shooting time is prolonged. time, improve the hot feeling on the surface of the casing 10, satisfy the user experience, and have a reasonable structural design and strong practicability.

Illustratively, a mobile device may be used in any suitable environment, such as in the air (e.g., a rotary-wing aircraft, a fixed-wing aircraft, or a hybrid fixed-wing aircraft, etc.), in water (e.g., a ship or submarine), on the ground (e.g., For example, motorcycles, automobiles, trucks, buses, trains, etc.), in space (eg, space shuttles, satellites, or probes), or underground (eg, subways), or any combination of the above. In some embodiments, the mobile device includes at least one of a drone, a mobile vehicle, a robot, a mobile ship, and the like.

Exemplarily, the mobile device is a rotorcraft, wherein the rotors may be single rotors, dual rotors, triple rotors, quadrotors, hexa rotors, octarotors and the like.

In the description of this application, it should be noted that unless otherwise specified and limited, the terms "installation", "connection", and "connection" should be understood in a broad sense, for example, it can be a fixed connection or a detachable connection. connected, or integrally connected. It can be a mechanical connection or an electrical connection. It can be directly connected or indirectly connected through an intermediary, and it can be the internal communication of two elements or the interaction relationship between two elements. Those of ordinary skill in the art can understand the specific meanings of the above terms in this application according to specific situations.

In this application, unless otherwise expressly specified and limited, a first feature being "on" or "under" a second feature may include direct contact between the first and second features, and may also include the first and second features Not in direct contact but through another characteristic contact between them. Moreover, "above", "above" and "above" the first feature on the second feature include that the first feature is directly above and obliquely above the second feature, or simply means that the first feature is horizontally higher than the second feature. "Below", "beneath" and "under" the first feature to the second feature include that the first feature is directly below and obliquely below the second feature, or simply means that the first feature has a lower level than the second feature.

The above disclosure provides many different implementations or examples for implementing different structures of the present application. To simplify the disclosure of the present application, the components and arrangements of specific examples are described above. Of course, they are examples only and are not intended to limit the application. Furthermore, the present application may repeat reference numerals and/or reference letters in various instances, such repetition is for simplicity and clarity and does not in itself indicate a relationship between the various embodiments and/or arrangements discussed. In addition, various specific process and material examples are provided herein, but one of ordinary skill in the art may recognize the use of other processes and/or the use of other materials.

In the description of this specification, descriptions referring to the terms "one embodiment", "some embodiments", "exemplary embodiments", "examples", "specific examples", or "some examples" etc. mean that the embodiments are combined Specific method steps, features, structures, materials or features described in or examples are included in at least one implementation or example of the present application. In this specification, schematic representations of the above terms do not necessarily refer to the same embodiment or example. Moreover, the specific method steps, features, structures, materials or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.

The above is only a specific embodiment of the application, but the scope of protection of the application is not limited thereto. Any person familiar with the technical field can easily think of various equivalents within the scope of the technology disclosed in the application. Modifications or replacements, these modifications or replacements shall be covered within the scope of protection of this application. Therefore, the protection scope of the present application should be based on the protection scope of the claims.

Claims

A photographing device, characterized in that it comprises:

shell;

an imaging sensing module set in the housing;

The first circuit board is arranged in the casing and is spaced apart from the imaging sensing module;

Wherein, the imaging sensing module and the first circuit board are thermally connected to different surfaces of the casing, so as to improve the temperature uniformity of the casing.
The photographing device according to claim 1, wherein the housing includes a front cover, a middle frame and a rear cover, and the front cover and the rear cover are respectively mechanically coupled to opposite sides of the middle frame to form a The accommodating space for accommodating the imaging sensing module and the first circuit board.
The photographing device according to claim 2, wherein both the front cover and the rear cover are thermally connected to the middle frame.
The photographing device according to claim 2, wherein the middle frame includes a metal heat-conducting layer and a plastic layer mechanically coupled with the metal heat-conducting layer, and the plastic layer is provided at a position where the metal heat-conducting layer faces away from the housing side of the space.
The photographing device according to claim 2, wherein the imaging sensing module comprises:

a second circuit board;

The imaging sensor is arranged on the second circuit board, and the second circuit board and/or the imaging sensor is thermally connected to the rear cover.
The photographing device according to claim 5, wherein the second circuit board is substantially parallel to the rear cover.
The photographing device according to claim 5, wherein the imaging sensing module is thermally connected to the rear cover through a first heat conducting member.
The photographing device according to claim 7, wherein the first heat conduction member is protruded from the rear cover; and/or, the first heat conduction member includes a metal boss.
The photographing device according to claim 7, wherein the second circuit board is provided with a through hole opposite to the first heat conduction member, and the imaging sensing module communicates with the through hole through the through hole. The heat conduction connection of the first heat conduction member.
The photographing device according to claim 9, characterized in that, the hole wall of the through hole is in contact with the first heat conduction member for thermal conduction connection; or, the hole wall of the through hole is connected to the said first heat conducting adhesive layer. The first heat conducting element is connected in heat conduction.
The photographing device according to claim 7, wherein the imaging sensing module further includes a copper sheet, hollowed grooves are provided on the second circuit board, and the imaging sensor and/or the The first heat conduction element passes through the hollowed groove, so that the imaging sensor is thermally connected to the first heat conduction element.
The photographing device according to claim 7, wherein the second circuit board includes a first surface and a second surface oppositely disposed, the first heat conduction member is located on the side where the second surface is located, and the first Other components other than the imaging sensor are not provided or protruded on the two sides.
The photographing device according to claim 2, wherein the first circuit board is thermally connected to the front cover; and/or, the first circuit board is thermally connected to the middle frame.
The photographing device according to claim 2, wherein the imaging sensing module is thermally connected to the rear cover, and both the front cover and the middle frame are thermally connected to the first circuit board.
The photographing device according to claim 2, wherein the middle frame includes a first wall and a second wall that are spaced apart and opposite to each other, and the front cover and the rear cover are both connected to the first wall and the second wall. The second wall and the first circuit board are thermally connected to the first wall.
The photographing device according to claim 15, wherein the first circuit board is substantially parallel to the first wall.
The photographing device according to claim 15, wherein the photographing device further comprises:

The second heat conduction member is thermally connected to the first circuit board and the middle frame.
The photographing device according to claim 17, wherein the photographing device further comprises:

The first shielding case, the first circuit board is arranged in the first shielding case, and the first circuit board and the second heat conduction member are thermally connected to the first shielding case.
The photographing device according to claim 17, wherein the middle frame comprises:

The magnetic attraction part is arranged on the first wall, and is used for mechanically coupling with the external component; the second heat conduction part is thermally connected to the magnetic attraction part.
The photographing device according to claim 19, wherein the magnetic attraction member is thermally connected to the first wall; and/or,

The middle frame includes an electrical connection interface, and the magnetic attraction member and/or the second heat conduction member are thermally connected to the electrical connection interface.
The photographing device according to any one of claims 2-20, wherein the photographing device further comprises:

The communication circuit board is arranged in the casing, and the communication circuit board is connected to the front cover through heat conduction.
The photographing device according to claim 21, wherein the photographing device further comprises:

The second shielding case is arranged in the housing, the communication circuit board is arranged in the second shielding case, and the front cover and the communication circuit board are respectively connected to the second shielding case through heat conduction.
The photographing device according to any one of claims 1-20, wherein the photographing device further comprises:

The battery assembly is arranged in the casing, and the imaging sensing module and the first circuit board are both spaced apart from the battery assembly.
A camera assembly, characterized in that it comprises:

base; and

The photographing device according to any one of claims 1-23, which is mechanically coupled with the base.
The photographing assembly according to claim 24, wherein the housing is thermally connected to the base.
The camera assembly according to claim 24, characterized in that, the first wall of the housing is connected to the base in contact with heat conduction.
The photographing assembly according to claim 24, wherein an engaging portion is provided on the housing, and a matching portion is provided on the base, and the engaging portion is engaged with the matching portion and connected through heat conduction.
A kind of cloud platform assembly is characterized in that, comprises:

gimbal; and

The photographing device according to any one of claims 1-23, which is mechanically coupled with the pan/tilt.
The cloud platform assembly according to claim 28, wherein the cloud platform comprises:

A bearing bracket, the photographing device is carried on the bearing bracket, and the housing is thermally connected to the bearing bracket.
The cloud platform assembly according to claim 29, wherein the bearing bracket comprises:

a first connecting arm, the photographing device is carried on the first connecting arm;

The second connecting arm is bent and extended from one end of the first connecting arm, and the first wall and the third wall of the housing are respectively thermally connected to the first connecting arm and the second connecting arm.
The pan/tilt assembly according to claim 30, wherein the angle between the first connecting arm and the second connecting arm is substantially vertical.
A mobile device, characterized in that it comprises:

fuselage; and

The photographing device according to any one of claims 1-23, mounted on the fuselage.
The mobile device according to claim 32, wherein the mobile device comprises at least one of a drone, a mobile vehicle, a robot, and a mobile ship.