CN210007922U - defogging device and camera - Google Patents
defogging device and camera Download PDFInfo
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- CN210007922U CN210007922U CN201920191284.5U CN201920191284U CN210007922U CN 210007922 U CN210007922 U CN 210007922U CN 201920191284 U CN201920191284 U CN 201920191284U CN 210007922 U CN210007922 U CN 210007922U
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Abstract
The utility model relates to a camera technical field, especially, relate to defogging device and camera, defogging device includes casing, have the installation cavity, the 1 end of 0 casing sets up the 2 window hole of intercommunication installation cavity, the window piece, shape and 3 window hole adaptation, the window piece is connected the casing and is closed window hole, the heating member sets up in the installation cavity, heating member and window piece are relative in space, heat-conducting member, make by the heat conduction material and be located between window piece and the heating member, the end butt heating member of heat-conducting member, the other end butt window piece of heat-conducting member, the utility model discloses make the heat direct transmission of heating member to the window piece through heat-conducting member, improved the temperature of window piece, make the temperature of window piece keep at the predetermined value, thereby prevent that vapor from condensing into the water smoke on the window piece, reach the purpose of defogging.
Description
Technical Field
The utility model relates to a camera technical field especially relates to kinds of defogging devices and camera.
Background
At present, when a camera works, an optical sensor and a main chip of the camera are main heating sources. Traditionally, heat is transferred to the radiating fins through the heat-conducting silica gel pad, and then the heat is transferred to the front cover and the rear cover of the camera through the radiating fins to be radiated. Meanwhile, partial heat is conducted to the window sheet of the lens through the front cover.
Because the window is made of glass, the heat conductivity coefficient of the glass is much smaller than that of metal, the temperature of each part is roughly distributed as the optical sensor is approximately equal to the main chip, the heat-conducting silica gel pad, the radiating fin, the front cover, the rear cover and the window, thus the temperature of the window can not reach the temperature required by demisting, and the water vapor is easy to condense on the window.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to provide an kinds of defogging devices, aim at solving the problem that how to improve the temperature of window piece.
The utility model discloses a realize like this, kinds of defogging devices, include:
the th casing, have installation cavity, the end of the th casing offers the st viewing window hole that communicates with said installation cavity;
the window sheet is made of transparent materials and is matched with the th window hole in shape, and the window sheet is connected with the th shell and covers the th window hole;
the heating piece generates heat in a conductive state and is arranged in the mounting cavity, and the heating piece and the window sheet are arranged in a spatially opposite mode;
heat conduction member made of heat conduction material and located between the window sheet and the heat generating member, end of the heat conduction member is abutted against the heat generating member to transfer the heat of the heat generating member to the heat conduction member, and the other end of the heat conduction member is abutted against the window sheet to transfer the received heat to the window sheet by the heat generating member.
In embodiments, the defogging device further includes a th thermal pad for improving the thermal transfer performance between the th thermal element and the heat generating element, the th thermal pad is located between the th thermal element and the heat generating element, and the th thermal element presses the th thermal pad toward the heat generating element.
In embodiments, the defogging device further includes a second thermal pad for enhancing heat transfer between the th thermal element and the window plate, the second thermal pad being positioned between the th thermal element and the window plate, the th thermal element pressing the second thermal pad toward the window plate.
In embodiments, the th thermal conductor member is a thermally conductive sleeve having an outer diameter that fits within the aperture of the th viewing window.
In embodiments, the heat generating element is an imaging component for realizing optical imaging, and includes a main board, an optical sensor disposed on the main board and generating heat in an electrically conductive state, and a lens for refracting light to the optical sensor, the lens and the optical sensor are both disposed in the heat conductive sleeve, the lens is disposed between the window sheet and the optical sensor, and the end of the th heat conductive element abuts against the main board.
In embodiments, the heat generating element further includes a chip connected to the motherboard and generating heat in an electrically conductive state, the optical sensor is located at the end of the motherboard, the chip is located at the other end of the motherboard, the defogging device further includes a second heat conducting element located in the mounting cavity, both ends of the second heat conducting element are connected to the cavity wall of the mounting cavity, and the second heat conducting element is disposed opposite to and abutted against the motherboard to transfer heat of the motherboard to the th housing.
In embodiments, the chip and the optical sensor are respectively located on two side surfaces of the main board, and the second heat conduction member presses the chip toward the main board.
In embodiments, the defogging device further includes a third thermal pad made of a thermal conductive material and configured to improve thermal conductivity between the heat generating member and the second thermal member, wherein the third thermal pad is located between the main board and the second thermal member.
In embodiments, the third thermal pad is spaced apart from the chip by a plurality of gaps, and at least of the third thermal pad is located between the chip and the second thermal conductive member.
In embodiments, the defogging device further includes a third thermal conductive member, the third thermal conductive member is plate-shaped and attached to the other end of the main board and disposed opposite to the chip, and the end of the third thermal conductive member is connected to the th thermal conductive member.
In embodiments, the defogging device further includes a fourth thermal pad located between the third thermal conductive member and the main board for improving the thermal conductivity between the main board and the third thermal conductive member.
Another aim at providing kinds of cameras, it include the second casing and the defogging device, the second casing is connected ends in addition of casing.
The utility model has the technical effects that the th heat-conducting piece is arranged between the window piece and the heating piece, the end butt heating piece of the th heat-conducting piece, so that the heat generated by the heating piece in the working state is transferred to the th heat-conducting piece, the other end butt window piece of the th heat-conducting piece, the th heat-conducting piece transfers the received heat to the window piece, thus, the heat of the heating piece is directly transferred to the window piece through the th heat-conducting piece, the temperature of the window piece is improved, the temperature of the window piece is kept at a preset value, thereby the water vapor is prevented from condensing into water mist on the window piece, and the demisting purpose is achieved.
Drawings
Fig. 1 is a cross-sectional view of a defogging device according to an embodiment of the present invention along a central symmetry plane;
FIG. 2 is a cross-sectional view of the th shell of FIG. 1;
fig. 3 is a sectional view of the second housing of fig. 1.
The correspondence between reference numbers and names in the drawings is as follows:
100. the defogging device comprises a defogging device, a defogging device 11, a shell, a defogging device 12, a second shell, a window sheet 13, a window sheet 14, a second heat conduction pad 15, a heat conduction piece 16, a lens 17, a main board 18, an optical sensor 19, a third heat conduction pad 20, a second heat conduction piece 21, a chip 22, a fourth heat conduction pad 10, a heat conduction pad 23, a third heat conduction piece 24, an infrared glass sheet 25, an infrared lamp cup 26, an infrared lamp panel 111, a mounting cavity 112, a window hole 113, a second window hole 30 and a heating piece;
Detailed Description
Reference will now be made in detail to embodiments of the present invention, examples of which are illustrated in the accompanying drawings, wherein like reference numerals refer to the same or similar elements or elements having the same or similar function throughout. The embodiments described below with reference to the drawings are exemplary and intended to be used for explaining the present invention, and should not be construed as limiting the present invention.
In the description of the present invention, it is to be understood that the terms "thickness", "upper", "lower", "vertical", "parallel", "bottom", "angle", and the like, indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of description and simplicity of description, and do not indicate or imply that the device or element being referred to must have a particular orientation, be constructed and operated in a particular orientation, and thus, should not be construed as limiting the present invention.
In the present disclosure, unless otherwise expressly stated or limited, the terms "mounted" and "connected" are intended to be , and include, for example, a fixed connection, a removable connection, or a body, a mechanical connection, an electrical connection, a direct connection, an indirect connection via an intermediary, a connection between two elements, or an interaction between two elements.
Referring to fig. 1 to 3, an embodiment of the invention provides defogging devices 100 and a camera having the same.
The defogging device 100 comprises a th shell 11, a window sheet 13, a th heat conducting member 15 and a heat generating member 30, wherein the th shell 11 is provided with a mounting cavity 111, optionally, the th shell 11 is made of plastic materials, so that the th shell 11 can be molded by an injection molding process 3, referring to fig. 2, the th window hole 112 communicating with the mounting cavity 111 is formed in the shell surface of the 7375 th shell 11 th shell 11 6, optionally, the th window hole 112 can be shaped like in a circle, an ellipse or a square, the window sheet 13 is made of transparent materials and is matched with the th window hole 112, specifically, the window sheet 13 is made of glass, the glass has the characteristics of good performance, rich resources, easy processing and the like, the window sheet 13 is connected with the th shell 11 and covers the th window hole 112, optionally, the window sheet 13 is connected with the th shell 11, is embedded into the 462 th window hole 112, the heat conducting window sheet 112 is detachably arranged between the heat conducting window sheet 111 and the heat generating member 5915, and the heat conducting member 5915 is made of heat conducting material, the heat generating heat conducting member 5930, the heat conducting member 5915 is made of heat conducting material, the heat conducting heat generating member 5930, the heat conducting member 5915 is made of heat conducting material, such as a heat conducting component 5930, the heat conducting component 5915, the heat generating heat conducting component 5930, the heat conducting component 5915 is made of heat conducting component 5930, the heat conducting window sheet 5930, the heat conducting component 5915 is made of the heat conducting component 5915.
The th heat conducting piece 15 is arranged between the window sheet 13 and the heating piece 30, the end of the th heat conducting piece 15 is connected with the heating piece 30 in an abutting mode, so that heat generated by the heating piece 30 in a working state is transferred to the th heat conducting piece 15, the end of the th heat conducting piece 15 is connected with the window sheet 13 in an abutting mode, and the th heat conducting piece 15 transfers the received heat to the window sheet 13.
Referring to fig. 1 to 3, the defogging device 100 further includes a heat conduction pad for improving the heat transfer performance between the th heat conduction member 15 and the heat generating member 30, the th heat conduction pad 10 is located between the th heat conduction member 15 and the heat generating member 30, and the th heat conduction member 15 presses the th heat conduction pad 10 toward the heat generating member 30. optionally, the th heat conduction pad 10 may be made of silica gel, silicone grease, silicon carbide, or other materials with heat conduction performance, the heat conduction pad 10 may make the th heat conduction member 15 and the heat generating member 30 fully contact with each other, so that the heat is effectively transferred to the th heat conduction member 15.
The defogging device 100 further includes a second thermal pad 14 for improving the heat transfer performance between the th thermal conductive member 15 and the window sheet 13, wherein the second thermal pad 14 is located between the th thermal conductive member 15 and the window sheet 13, and the th thermal conductive member 15 presses the second thermal pad 14 toward the window sheet 13. optionally, the second thermal pad 14 may be made of silica gel, silicone grease, silicon carbide, or other materials with thermal conductivity.
The th heat conduction piece 15 is a heat conduction sleeve, the outer diameter of the heat conduction sleeve is matched with the aperture of the th window 112, the ring surfaces at the two ends of the th heat conduction piece 15 are respectively abutted against the window sheet 13 and the heating piece 30, so that the heat transfer contact area between the th heat conduction piece 15 and the window sheet 13 or between the th heat conduction piece 15 and the heating piece 30 is enlarged.
The heat generating component 30 is an imaging component for realizing optical imaging, and includes a main board 17, an optical sensor 18 disposed on the main board 17 and generating heat in an electrically conductive state, and a lens 16 for refracting light to the optical sensor 18, wherein the lens 16 and the optical sensor 18 are both disposed in a heat conducting sleeve, and the lens 16 is disposed between the window sheet 13 and the optical sensor 18, the optical sensor 18 is a main heat generating source in the camera, and the heat generated by the optical sensor 18 can be transmitted to the th heat conducting component 15 through the main board 17.
Referring to fig. 1 to 3, in embodiments, the heat generating element 30 further includes a chip 21 connected to the motherboard 17 and generating heat in an electrically conductive state, the chip 21 and the optical sensor 18 are respectively located on two side surfaces of the motherboard 17, the optical sensor 18 is located at end of the motherboard 17, the chip 21 is located at the other end of the motherboard 17, the defogging device 100 further includes a second heat conducting element 20 disposed in the mounting cavity 111, the second heat conducting element 20 is used for transferring heat of the heat generating element 30 to the th housing 11, specifically, the second heat conducting element 20 is in a plate shape and presses the chip 21 against the motherboard 17, both ends of the second heat conducting element 20 are connected to a cavity wall of the mounting cavity 111, the chip 21 is also a main heat generating source in the camera, specifically, the chip 21 in this embodiment is the main chip 21 in the camera, the heat generated by the main chip 21 is transferred to the second heat conducting element 20, and then transferred to the th housing 11 through the second heat conducting element 20, it is understood that the housing 11 can also transfer received heat to the window and the second heat conducting material can also be copper material.
In another embodiments, the optical sensor 18 and the chip 21 are both located on the same side of the motherboard 17.
The defogging device 100 further includes a third thermal pad 19 made of a thermal conductive material and configured to improve thermal conductivity between the heat generating member 30 and the second thermal conductive member 20, wherein the third thermal pad 19 is located between the main board 17 and the second thermal conductive member 20. Alternatively, the material of the third thermal pad 19 may be silicon gel, silicon grease, silicon carbide, or other material having thermal conductivity.
The third thermal pads 19 are spaced apart from each other by at least , and the third thermal pads 19 are located between the chip 21 and the second thermal conductive member 20. the plurality of third thermal pads 19 can improve the thermal conduction between the heat generating member 30 and the second thermal conductive member 20.
Referring to fig. 1 to 3, the defogging device 100 further includes a third thermal conductive member 23, the third thermal conductive member 23 is plate-shaped and attached to another end of the main board 17 and disposed opposite to the chip 21, a end of the third thermal conductive member 23 is connected to the thermal conductive member 15 to transfer heat to the thermal conductive member 15, the defogging device 100 further includes a fourth thermal conductive pad 22 located between the third thermal conductive member 23 and the main board 17 and configured to improve thermal conductivity between the main board 17 and the third thermal conductive member 23, optionally, the third thermal conductive member 23 may be molded with the thermal conductive member 15 , the fourth thermal conductive pad 22 may be made of silicon gel, silicon grease, silicon carbide, or other materials with thermal conductivity, and accordingly, the fourth thermal conductive pad 22 may be molded with the thermal conductive pad 10 .
Optionally, the camera further includes a second housing 12, an infrared lamp panel 26 emitting infrared light, an infrared lamp cup 25, and an infrared slide 24, the second housing 12 is detachably connected to another end of the -th housing 11, the infrared lamp panel 26 and the infrared lamp cup 25 are both located in the mounting cavity 111, a second viewing window hole 113 communicating with the mounting cavity 111 is further formed in the end of the -th housing 11, the -th viewing window hole 112 and the second viewing window hole 113 are arranged at an interval, the second viewing window hole 113 is close to another end of the main board 17, the infrared slide 24 is covered on the second viewing window hole 113, and the infrared lamp cup 25 is located between the infrared slide 24 and the infrared lamp panel 26.
The defogging device 100 provided by the embodiment can effectively prevent water fog from condensing at the window piece 13, improve the imaging quality of the camera and improve the monitoring effect of the camera, under the condition of high internal humidity, the environmental temperature is reduced by 40 ℃, the water fog cannot be generated on the window piece 13, the whole power consumption of the camera is not required to be increased, the defogging device is energy-saving and environment-friendly, simple in structure and low in material cost, and meanwhile, the heat dissipation effect of the camera and the temperature distribution in the shell 11 and the second shell 12 are improved by .
The utility model discloses a with the self heat of camera during operation, including but not limited to main heat sources such as main chip 21, optical sensor 18, infrared lamp plate 26, transmit to window piece 13 to prevent that the vapor in the air from producing the water smoke on window piece 13.
In the embodiment of the utility model, the th heat conducting piece 15 is adopted to directly transfer the heat from the heating piece 30 to the window piece 13, thereby reducing the thermal resistance from the heat source to the window piece 13;
preferably, in order to prevent the th heat conduction member 15 from leaving a shadow at the window sheet 13, the utility model discloses do the black silk screen printing around the edge of window sheet 13, improve the appearance effect of window sheet 13.
The above description is only exemplary of the present invention and should not be construed as limiting the present invention, and any modifications, equivalents and improvements made within the spirit and principles of the present invention are intended to be included within the scope of the present invention.
Claims (12)
- A defogging device of the type , comprising:the th casing, have installation cavity, the end of the th casing offers the st viewing window hole that communicates with said installation cavity;the window sheet is made of transparent materials and is matched with the th window hole in shape, and the window sheet is connected with the th shell and covers the th window hole;the heating piece generates heat in a conductive state and is arranged in the mounting cavity, and the heating piece and the window sheet are arranged in a spatially opposite mode;heat conduction member made of heat conduction material and located between the window sheet and the heat generating member, end of the heat conduction member is abutted against the heat generating member to transfer the heat of the heat generating member to the heat conduction member, and the other end of the heat conduction member is abutted against the window sheet to transfer the received heat to the window sheet by the heat conduction member.
- 2. The defogging device as recited in claim 1, wherein said defogging device further comprises a th thermal pad for improving heat transfer performance between said th thermal pad and said heat generating member, said th thermal pad being disposed between said th thermal pad and said heat generating member, said th thermal pad pressing said th thermal pad toward said heat generating member.
- 3. The defogging device recited in claim 1 further comprising a second thermal pad for enhancing heat transfer between said th thermal element and said window pane, said second thermal pad being positioned between said th thermal element and said window pane, said th thermal element pressing said second thermal pad toward said window pane.
- 4. The defogging device as claimed in claim 1, wherein said th thermal conductive member is a thermal conductive sleeve having an outer diameter adapted to the aperture of said th viewing aperture.
- 5. A defogging device as recited in claim 4 wherein said heat generating member is an imaging element for realizing light imaging, and including a main board, an optical sensor disposed on said main board and generating heat in an electrically conductive state, and a lens for refracting light toward said optical sensor, said lens and said optical sensor being disposed within said heat conductive sleeve, said lens being disposed between said window sheet and said optical sensor, said end of said heat conductive member abutting said main board.
- 6. A defogging device as recited in claim 5, wherein said heat generating element further comprises a chip connected to said motherboard for generating heat in an electrically conductive state, said optical sensor is located at end of said motherboard, said chip is located at another end of said motherboard, said defogging device further comprises a second heat conducting element located in said mounting cavity, both ends of said second heat conducting element are connected to a wall of said mounting cavity, said second heat conducting element is disposed opposite to and abutting against said motherboard for transferring heat of said motherboard to said housing.
- 7. A defogging device as recited in claim 6 wherein: the chip and the optical sensor are respectively positioned on two side plate surfaces of the mainboard, and the second heat conducting piece compresses the chip towards the mainboard.
- 8. A defogging device as recited in claim 6 wherein: the defogging device further comprises a third heat conduction pad which is made of a heat conduction material and used for improving the heat conduction performance between the heating member and the second heat conduction member, and the third heat conduction pad is located between the mainboard and the second heat conduction member.
- 9. A defogging device as recited in claim 8 wherein said third thermal pads are spaced apart and at least are disposed between said chip and said second thermal element.
- 10. A defogging device as recited in any one of claims 6-9 and , wherein said defogging device further comprises a third thermal conductive member, said third thermal conductive member is in the form of a plate and is attached to the other end of said main plate and is disposed opposite to said chip, and the end of said third thermal conductive member is connected to said thermal conductive member.
- 11. A defogging device as recited in claim 10 wherein: the defogging device further comprises a fourth heat conduction pad which is positioned between the third heat conduction piece and the main board and is used for improving the heat conduction performance between the main board and the third heat conduction piece.
- A camera of the type , comprising a second housing and a defogging device as recited in any one of claims 1-11 through wherein said second housing is attached to an opposite end of said housing.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920191284.5U CN210007922U (en) | 2019-02-11 | 2019-02-11 | defogging device and camera |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920191284.5U CN210007922U (en) | 2019-02-11 | 2019-02-11 | defogging device and camera |
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| Publication Number | Publication Date |
|---|---|
| CN210007922U true CN210007922U (en) | 2020-01-31 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201920191284.5U Active CN210007922U (en) | 2019-02-11 | 2019-02-11 | defogging device and camera |
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| Country | Link |
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| CN (1) | CN210007922U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113259562A (en) * | 2021-05-12 | 2021-08-13 | 杭州华橙软件技术有限公司 | Demisting device and demisting method |
| CN114355709A (en) * | 2022-01-07 | 2022-04-15 | 杭州海康威视数字技术股份有限公司 | Surgical field camera |
-
2019
- 2019-02-11 CN CN201920191284.5U patent/CN210007922U/en active Active
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113259562A (en) * | 2021-05-12 | 2021-08-13 | 杭州华橙软件技术有限公司 | Demisting device and demisting method |
| CN114355709A (en) * | 2022-01-07 | 2022-04-15 | 杭州海康威视数字技术股份有限公司 | Surgical field camera |
| CN114355709B (en) * | 2022-01-07 | 2024-03-29 | 杭州海康威视数字技术股份有限公司 | Surgical field camera |
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