CN220122990U - Anti-fogging camera - Google Patents

Abstract

The utility model discloses an anti-fogging camera, and belongs to the technical field of monitoring equipment. The anti-fogging camera comprises a shell, a light-transmitting sheet, a camera, a circuit board and a first heat transfer element, wherein the camera, the circuit board and the first heat transfer element are arranged in the shell, the light-transmitting sheet is arranged in the shell, the camera is opposite to the light-transmitting sheet, the camera is electrically connected with the circuit board, the first end of the first heat transfer element is in heat conduction connection with the circuit board, and the second end of the first heat transfer element is in heat conduction connection with the light-transmitting sheet. By adopting the embodiment, the heat of the circuit board is transferred to the light-transmitting sheet through the first heat transfer element, so that the temperature of the environment where the light-transmitting sheet is positioned is increased, the temperature difference between the environment where the light-transmitting sheet is positioned and the temperature of the environment inside the shell (namely, the temperature of the environment where the circuit board is positioned) is avoided to be large, the temperature difference is reduced, the fog or condensation caused by the lower temperature of the light-transmitting sheet is prevented, the defogging effect is achieved, and the normal performance of the camera is not influenced.

Description

Anti-fogging camera

Technical Field

The utility model belongs to the technical field of monitoring equipment, and particularly relates to an anti-fogging camera.

Background

In the working process of the camera, the working device inside the camera generates heat, so that the internal temperature of the camera is higher, a larger temperature difference is generated between the inside of the camera and the light-transmitting sheet on the surface of the camera, the light-transmitting sheet is fogged, the condensation risk exists, and the normal working of the camera can be influenced for a long time.

In the related art, in order to avoid the lens of the camera from fogging, a drying agent or an anti-fogging coating is usually arranged in the camera, but the drying effect of the drying agent is affected by the sealing performance, and the drying time of the drying agent is shorter, so that the defogging effect is poorer; similarly, the anti-fogging coating can influence the light transmittance of the light-transmitting sheet, influence the imaging quality of the camera and be unfavorable for the normal operation of the camera. In addition, some cameras are internally provided with fans, and convection of air in the camera is enhanced through the fans, so that condensation risk is reduced, but in this way, the number of parts of the camera is increased, the miniaturization of the structure is not facilitated, and moreover, the running risk of the fans is uncontrollable, so that other problems are easy to occur.

Therefore, the existing defogging scheme cannot be used for guaranteeing the working performance and defogging effect of the camera.

Disclosure of Invention

The embodiment of the utility model aims to provide an anti-fogging camera, which can solve the problem that the working performance and the defogging effect of the camera cannot be guaranteed in the related art.

The embodiment of the utility model provides an anti-fogging camera, which comprises a shell, a transparent sheet, a camera, a circuit board and a first heat transfer element, wherein the camera, the circuit board and the first heat transfer element are arranged in the shell, the transparent sheet is arranged in the shell, the camera is opposite to the transparent sheet, the camera is electrically connected with the circuit board, a first end of the first heat transfer element is in heat conduction connection with the circuit board, and a second end of the first heat transfer element is in heat conduction connection with the transparent sheet.

In the embodiment of the utility model, the first heat transfer element is arranged in the camera, and heat generated in the working process of the circuit board is transferred to the light-transmitting sheet through the first heat transfer element, so that the temperature of the environment where the light-transmitting sheet is positioned is increased, the temperature difference between the environment where the light-transmitting sheet is positioned and the temperature of the environment inside the shell (namely, the temperature of the environment where the circuit board is positioned) is avoided to be large, the temperature difference is reduced, the fog or condensation caused by the lower temperature of the light-transmitting sheet is prevented, and the defogging effect is achieved. The circuit board is provided with the anti-fog coating, the anti-fog coating and the built-in fan, and the circuit board is provided with the anti-fog coating and the built-in fan.

Drawings

FIG. 1 is a schematic view of the appearance of an anti-fogging camera according to an embodiment of the disclosure;

FIG. 2 is a schematic view of the components within the housing of an anti-fogging camera according to an embodiment of the disclosure;

FIG. 3 is an exploded view of an anti-fogging camera according to an embodiment of the utility model;

FIG. 4 is a schematic view showing a part of the structure of an anti-fogging camera according to an embodiment of the utility model;

FIG. 5 is a schematic view of the components within the housing of an anti-fog camera as disclosed in another embodiment of the present utility model;

FIG. 6 is an exploded view of an anti-fogging camera according to another embodiment of the disclosure;

FIG. 7 is a schematic view showing a part of a structure of an anti-fogging camera according to another embodiment of the utility model;

fig. 8 is a schematic view showing the structure of a first heat transfer member according to an embodiment of the present utility model.

Reference numerals illustrate:

100-shell, 110-first shell, 120-second shell,

200-light-transmitting sheet,

300-camera,

400-circuit board,

500-a first heat transfer element, 501-a first heat conduction part, 502-a second heat conduction part,

511-a first temperature equalizing plate, 512-a second temperature equalizing plate, 513-a first connecting temperature equalizing plate,

521-first heat dissipation substrate, 522-second heat dissipation substrate, 523-first heat pipe,

600-a second heat transfer member,

611-a third temperature equalizing plate, 612-a fourth temperature equalizing plate, 613-a second connecting temperature equalizing plate,

621-third heat dissipation substrate, 622-fourth heat dissipation substrate, 623-second heat pipe,

700-an actuating mechanism,

810-first sheet-like heat conducting structure, 820-second sheet-like heat conducting structure, 830-third sheet-like heat conducting structure, 840-connector,

900-heat conducting fin.

Detailed Description

The technical solutions of the embodiments of the present utility model will be clearly described below with reference to the drawings in the embodiments of the present utility model, and it is apparent that the described embodiments are some embodiments of the present utility model, but not all embodiments. All other embodiments, which are obtained by a person skilled in the art based on the embodiments of the present utility model, fall within the scope of protection of the present utility model.

The terms first, second and the like in the description and in the claims, are used for distinguishing between similar elements and not necessarily for describing a particular sequential or chronological order. It is to be understood that the data so used may be interchanged, as appropriate, such that embodiments of the present utility model may be implemented in sequences other than those illustrated or described herein, and that the objects identified by "first," "second," etc. are generally of a type, and are not limited to the number of objects, such as the first object may be one or more. Furthermore, in the description and claims, "and/or" means at least one of the connected objects, and the character "/", generally means that the associated object is an "or" relationship.

The anti-fogging camera provided by the embodiment of the utility model is described in detail below through specific embodiments and application scenes thereof with reference to the accompanying drawings.

Referring to fig. 1 to 8, the anti-fogging camera disclosed in the embodiment of the utility model includes a housing 100, a light-transmitting sheet 200, a camera 300, a circuit board 400 and a first heat transfer element 500, wherein the housing 100 is used as a mounting base of the light-transmitting sheet 200, the camera 300, the circuit board 400 and the first heat transfer element 500, and the light-transmitting sheet 200 is used for transmitting external light so as to enable the light to enter the camera 300 and enable the camera 300 to perform a shooting function; the circuit board 400 is used for supplying power to the camera 300, so as to ensure the normal working process of the camera 300; the first heat transfer member 500 serves to transfer heat of the circuit board 400 to the light-transmitting sheet 200 to prevent the light-transmitting sheet 200 from fogging.

The camera 300, the circuit board 400 and the first heat transfer member 500 are all disposed in the housing 100, the light transmitting sheet 200 is disposed in the housing 100, the light transmitting sheet 200 may be, but is not limited to, transparent glass, and the camera 300 is opposite to the light transmitting sheet 200, optionally, as shown in fig. 1, the housing 100 includes a first housing portion 110 and a second housing portion 120, the first housing portion 110 is provided with a mounting hole, the light transmitting sheet 200 is disposed at the mounting hole, and the first housing portion 110 and the second housing portion 120 are detachably connected, so that the camera 300, the circuit board 400 and the first heat transfer member 500 are conveniently mounted in the housing 100. Further alternatively, the first and second shell portions 110 and 120 may be coupled by fasteners such as screws.

The camera 300 is electrically connected to the circuit board 400, the first end of the first heat transfer element 500 is thermally connected to the circuit board 400, and the second end of the first heat transfer element 500 is thermally connected to the light transmitting sheet 200, that is, the circuit board 400 is thermally connected to the light transmitting sheet 200 through the first heat transfer element 500, alternatively, the first heat transfer element 500 may be a thermal pad or other thermal conductive structure, and in this embodiment, the structure of the first heat transfer element 500 is not limited. In short, the first heat transfer element 500 has a heat conducting effect, and can transfer heat generated by the circuit board 400 in the working process to the light-transmitting sheet 200, so that the temperature of the environment where the light-transmitting sheet 200 is located is raised, the temperature difference between the environment where the light-transmitting sheet 200 is located and the temperature of the environment inside the casing 100 (i.e. the temperature of the environment where the circuit board 400 is located) is avoided to be large, the temperature difference is reduced, the fog or condensation caused by the lower temperature of the light-transmitting sheet 200 is prevented, and the defogging effect is achieved.

By the arrangement, the heat of the circuit board 400 is utilized to heat the light-transmitting sheet 200, a drying agent, an anti-fog coating or a built-in fan is not required to be arranged, the defects of arranging the drying agent, the anti-fog coating and the built-in fan are overcome, the light-transmitting sheet 200 can be heated for a long time to defog, and the normal performance of a camera is not influenced, so that the camera provided by the utility model can not only ensure the working performance, but also play a defogging effect.

In an alternative embodiment, the first heat transfer element 500 includes a first heat conductive portion 501 and a second heat conductive portion 502 that are in heat conductive connection, where the first heat conductive portion 501 is in heat conductive connection with the circuit board 400, the second heat conductive portion 502 is in a block structure, and the second heat conductive portion 502 is in heat conductive connection with a portion of the light transmitting sheet 200.

In another embodiment, as shown in fig. 2-3 and fig. 5-6, the second heat conducting portion 502 extends in a direction surrounding the camera 300, and since one side of the light-transmitting sheet 200 is outside the housing 100 and the other side of the light-transmitting sheet 200 is inside the housing 100, the first heat conducting element 500 is located in the housing 100, so the second heat conducting portion 502 is disposed on the side of the light-transmitting sheet 200 facing the inside of the housing 100, and the light-transmitting sheet 200 is opposite to the camera 300, and in order to avoid the second heat conducting portion 502 affecting the light entering the camera 300, the second heat conducting portion 502 needs to be disposed around the camera 300. Alternatively, the second heat conductive portion 502 may have a strip structure or a ring structure. By adopting the embodiment, the area of the heat conducting connection between the second heat conducting part 502 and the light transmitting sheet 200 is increased, so that the first heat transfer element 500 is convenient to heat different areas of the light transmitting sheet 200, the whole light transmitting sheet 200 is kept at a higher temperature, the situation that the local part of the light transmitting sheet 200 is still low in temperature and foggy is avoided, and the defogging effect is improved.

In an alternative embodiment, referring to fig. 2 and 3, the first heat transfer member 500 includes a first temperature equalizing plate 511 and a second temperature equalizing plate 512 that are in heat conduction connection, where a surface of the first temperature equalizing plate 511 is in heat conduction connection with a surface of the circuit board 400, and a surface of the second temperature equalizing plate 512 is in heat conduction connection with a surface of the light transmitting sheet 200, and at this time, the first temperature equalizing plate 511 serves as the first heat conduction portion 501, and the second temperature equalizing plate 512 serves as the second heat conduction portion 502. Specifically, the first temperature equalizing plate 511 and the second temperature equalizing plate 512 are both phase change structures, have high thermal conductivity, good thermal conductivity, and small planar diffusion thermal resistance. The first temperature-equalizing plate 511 and the second temperature-equalizing plate 512 may be in an integral structure or a split structure, and in any case, the first temperature-equalizing plate 511 and the second temperature-equalizing plate 512 can be in heat conduction connection; the second temperature uniformity plate 512 may be a ring-shaped temperature uniformity plate. With the present embodiment, the first temperature-equalizing plate 511 can rapidly absorb heat of the circuit board 400, the heat of the first temperature-equalizing plate 511 can be transferred to the second temperature-equalizing plate 512, and the second temperature-equalizing plate 512 rapidly transfers heat to the light-transmitting sheet 200, which is beneficial to rapidly heating the light-transmitting sheet 200 and timely preventing fogging.

Optionally, the first heat transfer element 500 further includes a first connection temperature equalizing plate 513, and two ends of the first connection temperature equalizing plate 513 are respectively in heat conduction connection with the first temperature equalizing plate 511 and the second temperature equalizing plate 512, so that the first temperature equalizing plate 511 and the second temperature equalizing plate 512 are prevented from being far from being directly connected in heat conduction.

In another embodiment, as shown in fig. 5 and 6, the first heat transfer element 500 includes a first heat dissipation substrate 521, a second heat dissipation substrate 522, and a first heat pipe 523, where the first heat dissipation substrate 521 and the second heat dissipation substrate 522 may be copper plates or other metal substrates, two opposite sides of the first heat dissipation substrate 521 are respectively in heat conduction connection with the surface of the circuit board 400 and the first end of the first heat pipe 523, two opposite sides of the second heat dissipation substrate 522 are respectively in heat conduction connection with the surface of the light transmission sheet 200 and the second end of the first heat pipe 523, the interior of the first heat pipe 523 is filled with a phase-change liquid, at this time, the first ends of the first heat dissipation substrate 521 and the first heat pipe 523 serve as the first heat conduction portion 501, and the second ends of the second heat dissipation substrate 522 and the first heat pipe 523 serve as the second heat conduction portion 502.

With the embodiment, the heat of the circuit board 400 is transferred to the first heat pipe 523 through the first heat dissipation substrate 521, and is continuously and circularly changed by the phase-change liquid in the first heat pipe 523, so that the heat is rapidly and uniformly distributed throughout the first heat pipe 523, and then the first heat pipe 523 rapidly transfers the heat to the second heat dissipation substrate 522, and finally the second heat dissipation substrate 522 transfers the heat to the light-transmitting sheet 200, so as to heat the light-transmitting sheet 200, and avoid fogging of the light-transmitting sheet 200.

Alternatively, the first end of the first heat pipe 523 may be flattened and then be bonded to the first heat dissipation substrate 521, so as to increase the contact area between the first heat pipe 523 and the first heat dissipation substrate 521, and the second end of the first heat pipe 523 may be flattened and then be bonded to the second heat dissipation substrate 522, so as to increase the contact area between the first heat pipe 523 and the second heat dissipation substrate 522, which is beneficial to improving the heat conduction efficiency.

The working principle of the temperature equalizing plate is basically the same as that of the heat pipe, the inside of the temperature equalizing plate is filled with phase change materials, under the condition that the temperature difference exists in all parts, the inside of the temperature equalizing plate or the heat pipe can continuously and circularly change, the phase change materials are switched between liquid and gas, the phase change materials are used as carriers, the heat of a high-temperature area is continuously and efficiently transported to a low-temperature area, and finally the temperature of all parts of the temperature equalizing plate or the heat pipe is the same.

Because the first heat transfer element 500 adopts the phase change material, the heat conduction performance of the first heat transfer element 500 is better than that of the common material such as a sheet metal and other structures, so that in order to ensure that the heat of the circuit board 400 is transferred to the first heat transfer element 500, the laying area of the first heat transfer element 500 can be set smaller, the number of fasteners used for connecting the circuit board 400 and the first heat transfer element 500 is reduced, the space of the circuit board 400 occupied by the fasteners is reduced, and other electronic devices can be arranged in the spare space of the circuit board 400, thereby improving the utilization rate of the circuit board 400 and simplifying the installation process; moreover, because the paving area of the first heat transfer element 500 is smaller, the first heat transfer element 500 can avoid the protruding position on the circuit board 400, and an avoidance structure such as an avoidance port is not required to be arranged on the first heat transfer element 500, so that the influence on the heat conducting performance and the heat radiating effect of the first heat transfer element 500 is avoided.

Moreover, the volume of the first heat transfer member 500 is reduced, and the occupied space of the housing 100 is reduced, which is advantageous in that the volume of the housing 100 is set smaller, the internal structure of the camera is made more compact, and miniaturization of the camera is achieved. Particularly, by adopting the scheme of the heat dissipation substrate and the heat pipe, the setting position of the heat pipe is more flexible, and the heat pipe can be flexibly set based on the internal space requirement of the shell 100, so that the internal structure of the camera is more compact, and the miniaturization development is satisfied.

In an alternative embodiment, the circuit board 400 may be in direct contact with the housing 100, i.e. the circuit board 400 is in thermally conductive connection with the housing 100 through air.

In another embodiment, the video camera further includes a second heat transfer member 600, the second heat transfer member 600 is disposed in the housing 100, a first end of the second heat transfer member 600 is thermally connected to the circuit board 400, and a second end of the second heat transfer member 600 is thermally connected to the housing 100, that is, the circuit board 400 is thermally connected to the housing 100 through the second heat transfer member 600. Alternatively, the second heat transfer member 600 may be a heat conductive pad or other heat conductive structure, and the structure of the second heat transfer member 600 is not particularly limited in this embodiment. With the present embodiment, the heat conductivity coefficient between the circuit board 400 and the housing 100 is increased through the second heat transfer element 600, so that the heat conduction efficiency is improved, which is beneficial to improving the heat dissipation effect, and enabling the circuit board 400 to dissipate heat as soon as possible.

It should be noted that the first heat transfer element 500 and the second heat transfer element 600 correspond to different electronic devices on the circuit board 400. Alternatively, the first heat transfer member 500 may be thermally connected to high temperature resistant electronic devices such as a control chip on the circuit board 400, and the second heat transfer member 600 may be thermally connected to electronic devices such as an image sensor on the circuit board 400.

In an alternative embodiment, as shown in fig. 1 to 3, the second heat transfer member 600 includes a third temperature equalizing plate 611 and a fourth temperature equalizing plate 612 that are thermally connected, wherein a surface of the third temperature equalizing plate 611 is thermally connected to a surface of the circuit board 400, and a surface of the fourth temperature equalizing plate 612 is thermally connected to an inner wall surface of the housing 100. Specifically, the third temperature equalizing plate 611 and the fourth temperature equalizing plate 612 are both phase-change structures, have high heat conductivity, good heat conductivity, and small planar diffusion thermal resistance. The third temperature-equalizing plate 611 and the fourth temperature-equalizing plate 612 may be in an integral structure or a split structure, and in any case, the third temperature-equalizing plate 611 and the fourth temperature-equalizing plate 612 may be in heat-conducting connection. With the present embodiment, the third temperature-equalizing plate 611 can quickly absorb the heat of the circuit board 400, the heat of the third temperature-equalizing plate 611 can be transferred to the fourth temperature-equalizing plate 612, and the fourth temperature-equalizing plate 612 quickly transfers the heat to the housing 100, which is beneficial to quick heat dissipation of the circuit board 400.

Optionally, the second heat transfer element 600 further includes a second connection temperature equalizing plate 613, and two ends of the second connection temperature equalizing plate 613 are respectively in heat conduction connection with the third temperature equalizing plate 611 and the fourth temperature equalizing plate 612, so that the third temperature equalizing plate 611 and the fourth temperature equalizing plate 612 are prevented from being far from being directly connected in heat conduction.

In another embodiment, as shown in fig. 4-6, the second heat transfer element 600 includes a third heat dissipation substrate 621, a fourth heat dissipation substrate 622 and a second heat pipe 623, wherein the third heat dissipation substrate 621 and the fourth heat dissipation substrate 622 may be copper plates or other metal substrates, two opposite sides of the third heat dissipation substrate 621 are respectively in heat conduction connection with the surface of the circuit board 400 and the first end of the second heat pipe 623, two opposite sides of the fourth heat dissipation substrate 622 are respectively in heat conduction connection with the inner wall surface of the housing 100 and the second end of the second heat pipe 623, and the interior of the second heat pipe 623 is filled with a phase-change liquid.

With the embodiment, the heat of the circuit board 400 is transferred to the second heat pipe 623 through the third heat dissipation substrate 621, and the phase-change liquid in the second heat pipe 623 continuously and circularly changes, so that the heat is rapidly and uniformly distributed in the whole second heat pipe 623, and the second heat pipe 623 rapidly transfers the heat to the fourth heat dissipation substrate 622, and finally the fourth heat dissipation substrate 622 transfers the heat to the housing 100, so that the housing 100 dissipates heat, thereby being beneficial to improving the heat dissipation effect.

Optionally, the first end of the second heat pipe 623 may be flattened and then be bonded to the third heat dissipation substrate 621, so as to increase the contact area between the second heat pipe 623 and the third heat dissipation substrate 621, and the second end of the second heat pipe 623 may also be flattened and then be bonded to the fourth heat dissipation substrate 622, so as to increase the contact area between the second heat pipe 623 and the fourth heat dissipation substrate 622, which is beneficial to improving the heat conduction efficiency.

Because the second heat transfer element 600 adopts the phase change material, the heat conduction performance of the second heat transfer element 600 is better than that of the common material, so that the laying area of the second heat transfer element 600 can be smaller to ensure that the heat of the circuit board 400 is transferred to the second heat transfer element 600, the number of fasteners for connecting the circuit board 400 and the second heat transfer element 600 is reduced, other electronic devices can be arranged in the spare space of the circuit board 400, and the utilization rate of the circuit board 400 is improved. Moreover, the second heat transfer member 600 has a reduced volume, and the occupied space of the housing 100 is reduced, which is advantageous in that the volume of the housing 100 is made smaller, the internal structure of the camera is made more compact, and miniaturization of the camera is achieved.

In an alternative embodiment, the second heat transfer element 600 may be in direct heat conductive connection with the housing 100, and the two may be in direct contact.

In another embodiment, the camera further comprises an actuating mechanism 700, the actuating mechanism 700 is disposed in the housing 100, and the actuating mechanism 700 is located between the second heat transfer element 600 and the housing 100, the actuating mechanism 700 is a heat conducting structure, and optionally, the heat conductivity coefficient of the actuating mechanism 700 is greater than 3; the actuation mechanism 700 is switchable between a first actuation state and a second actuation state. When the operation mechanism 700 is in the first operation state, the second heat transfer element 600 is in heat conduction connection with the casing 100 through the operation mechanism 700, at this time, the casing 100 radiates heat to the circuit board 400 through the second heat transfer element 600 and the operation mechanism 700, which means that the heat generated by the circuit board 400 is relatively large, a part of the heat of the circuit board 400 is used for heating the light transmitting sheet 200 through the first heat transfer element 500, and another part of the heat of the circuit board 400 is radiated through the second heat transfer element 600; when the operation mechanism 700 is in the second operation state, the second heat transfer member 600 is disconnected from the housing 100 by the operation mechanism 700, and at this time, the housing 100 cannot radiate heat from the circuit board 400, and most of the heat of the circuit board 400 is transferred to the light-transmitting sheet 200 by the first heat transfer member 500, so as to heat the light-transmitting sheet 200.

With the present embodiment, when the heat generated by the circuit board 400 is small, the second heat transfer element 600 is disconnected from the housing 100 by the action of the action mechanism 700, so that most of the heat of the circuit board 400 is used for heating the light-transmitting sheet 200, so as to avoid the poor anti-fogging effect caused by insufficient heating of the light-transmitting sheet 200; when the heat generated by the circuit board 400 is relatively large, the second heat transfer element 600 is in heat conduction connection with the housing 100 through the action of the action mechanism 700, so that not only a part of the heat of the circuit board 400 is used for heating the light-transmitting sheet 200, but also the rest of the heat of the circuit board 400 can be timely radiated, and the influence on the working performance of electronic devices arranged on the circuit board 400 due to relatively high temperature is avoided.

In an alternative embodiment, the first area of the circuit board 400 is thermally connected to the first end of the second heat transfer element 600, and the camera further includes a temperature detecting element, which may be a temperature sensor or the like capable of detecting a temperature, the temperature detecting element being configured to detect the temperature of the first area, and the temperature detecting element being in communication with the actuating mechanism 700. Alternatively, the actuating mechanism 700 may include a driving source and a rotating member, where the driving source may be a driving member that provides rotational power for a motor, a pneumatic motor, or the like, the temperature detecting element is in communication connection with the driving source, the driving source may drive the rotating member to rotate, two ends of the rotating member are respectively provided with a heat conducting structure, and in the case that the driving source drives the rotating member to rotate to the first position, the heat conducting structures at two ends of the rotating member are respectively in contact with the second heat transfer member 600 and the housing 100, which indicates that the actuating mechanism 700 is in the first actuating state; when the driving source drives the rotating member to rotate to the second position, the heat conducting structures at both ends of the rotating member are separated from the second heat transfer member 600 and the housing 100, respectively, which means that the actuating mechanism 700 is in the second actuating state.

When the temperature detected by the temperature detecting element is less than the first temperature threshold, it is indicated that the temperature of the first area of the circuit board 400 is low, and heat dissipation to the circuit board 400 by the second heat transfer element 600 is not required, and at this time, the actuating mechanism 700 is in the second actuating state, and the second heat transfer element 600 is disconnected from the housing 100 by the actuating mechanism 700; when the temperature detected by the temperature detecting element reaches the first temperature threshold, it is indicated that the temperature of the first area of the circuit board 400 is relatively high, and the circuit board 400 needs to be heated by the second heat transfer element 600 and the casing 100 in addition to the heating of the light transmitting sheet 200 by the first heat transfer element 500, and at this time, the operation mechanism 700 is in the first operation state, and the second heat transfer element 600 is thermally connected to the casing 100 by the operation mechanism 700.

The first temperature threshold may be set as needed.

With the present embodiment, the operation mechanism 700 is automatically operated to switch to the first operation state and the second operation state according to the environmental temperature without manual control of the operation mechanism 700 by a user, so that the degree of automation is improved.

Further alternatively, the camera may further include a controller, and the temperature detecting element and the driving source are respectively communicatively connected to the controller, so that the controller controls the driving source according to the temperature information detected by the temperature detecting element.

In another embodiment, motion mechanism 700 comprises a temperature-induced deformation element. Optionally, the temperature-induced deformation element may be a thermal expansion and contraction structure, and the specific structure of the thermal expansion and contraction structure is not limited in the embodiment of the present utility model, where the temperature-induced deformation element is disposed between the second heat transfer element 600 and the housing 100, when the temperature of the environment where the temperature-induced deformation element is located is higher, the temperature-induced deformation element is heated and expanded, and the volume is increased, so that the temperature-induced deformation element contacts with the second heat transfer element 600 and the housing 100, at this time, the actuating mechanism 700 is in a first actuating state, and the second heat transfer element 600 is thermally connected with the housing 100 through the temperature-induced deformation element, so that the circuit board 400 dissipates heat as soon as possible; when the temperature of the temperature-induced deformation element is lower, the temperature-induced deformation element is cooled and contracted, and the volume is reduced, so that the temperature-induced deformation element is separated from the second heat transfer element 600 and the casing 100, at this time, the actuating mechanism 700 is in the second actuating state, the second heat transfer element 600 is disconnected from the casing 100 for heat conduction, the heat dissipation of the circuit board 400 is slower, and most of the heat of the circuit board 400 is used for heating the light-transmitting sheet 200.

By adopting the embodiment, the action mechanism 700 automatically acts according to the environmental temperature to switch to the first action state and the second action state, so that the applicability is stronger. Moreover, the situation that the second heat transfer element 600 cannot be connected with or disconnected from the shell 100 in time due to power failure by adopting an electrical connection scheme is avoided, and the use reliability of the camera is improved.

In an alternative embodiment, the camera further comprises a connector 840, and the second heat transfer member 600 is connected to the circuit board 400 through the connector 840.

In another embodiment, as shown in fig. 4 and 7, the second heat transfer member 600 is fixedly coupled to the case 100 through a coupling 840. Alternatively, the connection member 840 may be a fastening member, which may be a screw, a bolt, or the like, and the second heat transfer member 600 is provided with an opening, and the case 100 is provided with a fastening hole, and the fastening member penetrates the opening and protrudes into the fastening hole to connect the second heat transfer member 600 and the case 100. By adopting the embodiment, the second heat transfer element 600 is prevented from being directly connected with the circuit board 400, so that the connecting element 840 is prevented from occupying the space of the circuit board 400, and other electronic devices can be arranged in the vacant space of the circuit board 400, thereby improving the utilization rate of the circuit board 400.

In an alternative embodiment, the first heat transfer member 500 and the light transmissive sheet 200 may be directly thermally connected, and may be directly contacted.

In another embodiment, the camera further comprises a first sheet-like heat conducting structure 810, the first sheet-like heat conducting structure 810 being arranged between the light transmitting sheet 200 and the first heat transfer member 500, the second end of the first heat transfer member 500 being in heat conducting connection with the light transmitting sheet 200 via the first sheet-like heat conducting structure 810. With the present embodiment, compared with air, the first sheet-shaped heat conducting structure 810 has a larger heat conductivity coefficient than that of the first sheet-shaped heat conducting structure 810, so that the first heat transfer element 500 and the light transmitting sheet 200 are in heat conducting connection through the first sheet-shaped heat conducting structure 810, thereby ensuring that heat of the first heat transfer element 500 can be quickly transferred to the light transmitting sheet 200 through the first sheet-shaped heat conducting structure 810, improving heat conducting efficiency, and being beneficial to improving heat dissipation effect.

In an alternative embodiment, the first heat transfer member 500 may be in direct thermal connection with the circuit board 400, and the two may be in direct contact.

In another embodiment, the camera further includes a second sheet-like heat conductive structure 820, the second sheet-like heat conductive structure 820 being disposed between the first end of the first heat transfer member 500 and the circuit board 400, the first heat transfer member 500 being thermally connected to the circuit board 400 through the second sheet-like heat conductive structure 820. With the present embodiment, compared with air, the second sheet-shaped heat conducting structure 820 has a larger heat conductivity coefficient, so that the heat conducting connection between the first heat transfer element 500 and the circuit board 400 is realized through the second sheet-shaped heat conducting structure 820, so that the heat of the circuit board 400 can be rapidly transferred to the first heat transfer element 500 through the second sheet-shaped heat conducting structure 820, the heat conducting efficiency is improved, and the heat dissipation effect is improved.

In an alternative embodiment, the circuit board 400 may be in direct thermal connection with the second heat transfer member 600, and the two may be in direct contact.

In another embodiment, the video camera further includes a third sheet-like heat conductive structure 830, the third sheet-like heat conductive structure 830 being disposed between the first end of the second heat transfer member 600 and the circuit board 400, the second heat transfer member 600 being thermally connected to the circuit board 400 through the third sheet-like heat conductive structure 830. With the present embodiment, compared with air, the third sheet-shaped heat conducting structure 830 has a larger heat conduction coefficient, so that the second heat transfer element 600 and the circuit board 400 are in heat conduction connection through the third sheet-shaped heat conducting structure 830, so that the heat of the circuit board 400 can be rapidly transferred to the second heat transfer element 600 through the third sheet-shaped heat conducting structure 830, the heat conduction efficiency is improved, and the heat dissipation effect is improved.

In an alternative embodiment, at least one of the first sheet-like heat conducting structure 810, the second sheet-like heat conducting structure 820, and the third sheet-like heat conducting structure 830 may be a heat conducting pad or a heat conducting gel or a metal foil or a metal plate or a graphite sheet, or the like.

Optionally, the first sheet-like heat conducting structure 810 is zero-clearance fit with the light-transmitting sheet 200 and the first heat transfer member 500, respectively, the second sheet-like heat conducting structure 820 is zero-clearance fit with the circuit board 400 and the first heat transfer member 500, respectively, and the third sheet-like heat conducting structure 830 is zero-clearance fit with the circuit board 400 and the second heat transfer member 600, respectively, to further reduce heat transfer resistance.

In another embodiment, at least one of the first sheet-like heat conductive structure 810, the second sheet-like heat conductive structure 820, and the third sheet-like heat conductive structure 830 is a phase change structure having a high heat conductivity, a small heat conduction resistance, and a constant temperature characteristic. Alternatively, the phase change structure may be a phase change thermal pad.

By adopting the embodiment, the phase change structure is utilized for conducting heat, heat can be rapidly transferred between the phase change structure and the adjacent phase change structure, and the heat conducting efficiency is improved. Specifically, in the case that the first sheet-shaped heat conducting structure 810 is a phase change structure, the first sheet-shaped heat conducting structure 810 rapidly absorbs heat of the first heat transfer member 500 and rapidly transfers the heat to the light-transmitting sheet 200, which is beneficial to timely heating the light-transmitting sheet 200 and enhancing anti-fogging effect; in the case that the second sheet-like heat conductive structure 820 is a phase change structure, the first sheet-like heat conductive structure 810 rapidly absorbs heat of the circuit board 400 and rapidly transfers the heat to the first heat transfer member 500; in the case that the third sheet-shaped heat conductive structure 830 is a phase change structure, the second sheet-shaped heat conductive structure 820 rapidly absorbs heat of the circuit board 400 and rapidly transfers the heat to the second heat transfer member 600, thereby facilitating rapid heat dissipation of the circuit board 400.

In an alternative embodiment, the camera further includes a heat conductive sheet 900, the heat conductive sheet 900 is disposed in the housing 100, and a surface of the heat conductive sheet 900 is attached to an inner wall surface of the housing 100, and a thermal conductivity of the heat conductive sheet 900 is greater than a thermal conductivity of the housing 100. Alternatively, the opposite sides of the thermally conductive sheet 900 are thermally connected to the actuating mechanism 700 and the housing 100, respectively, i.e., the actuating mechanism 700 is thermally connected to the housing 100 through the thermally conductive sheet 900. Further alternatively, the opposite sides of the heat conducting strip 900 are respectively attached to the actuating mechanism 700 and the inner wall surface of the housing 100, and the heat conducting strip 900 may be a sheet structure with good heat conducting properties such as a metal foil or a graphite sheet, and is suitable for the case that the housing 100 is a plastic housing with poor heat conducting properties.

By adopting the embodiment, the heat conducting fin 900 can spread the heat of the circuit board 400 in advance, and the spread heat is uniformly transferred to each position of the housing 100, so that the housing 100 dissipates heat, and the problem that the housing 100 cannot effectively dissipate heat when the thermal conductivity of the housing 100 is poor is avoided, thereby being beneficial to improving the heat dissipation effect.

In other embodiments, in the case where the case 100 is made of a material having a good heat conduction effect, such as metal, the camera may not be provided with the heat conduction sheet 900.

The embodiments of the present utility model have been described above with reference to the accompanying drawings, but the present utility model is not limited to the above-described embodiments, which are merely illustrative and not restrictive, and many forms may be made by those having ordinary skill in the art without departing from the spirit of the present utility model and the scope of the claims, which are to be protected by the present utility model.

Claims (12)

1. The utility model provides an antifog camera, its characterized in that includes casing (100), printing opacity piece (200), camera (300), circuit board (400) and first heat transfer piece (500), camera (300) circuit board (400) with first heat transfer piece (500) all set up in casing (100), printing opacity piece (200) set up in casing (100), just camera (300) with printing opacity piece (200) are relative, camera (300) with circuit board (400) electricity is connected, first end of first heat transfer piece (500) with circuit board (400) heat conduction connection, second end of first heat transfer piece (500) with printing opacity piece (200) heat conduction connection.

2. The camera according to claim 1, wherein the first heat transfer member (500) comprises a first heat transfer portion (501) and a second heat transfer portion (502) that are heat-conductively connected, the first heat transfer portion (501) is heat-conductively connected with the circuit board (400), the second heat transfer portion (502) is heat-conductively connected with the light-transmitting sheet (200), and the second heat transfer portion (502) extends in a direction surrounding the camera head (300).

3. The camera according to claim 1, wherein the first heat transfer member (500) comprises a first temperature equalizing plate (511) and a second temperature equalizing plate (512) which are thermally connected, a surface of the first temperature equalizing plate (511) is thermally connected with a surface of the circuit board (400), and a surface of the second temperature equalizing plate (512) is thermally connected with a surface of the light-transmitting sheet (200);

or, the first heat transfer element (500) comprises a first heat dissipation substrate (521), a second heat dissipation substrate (522) and a first heat pipe (523), two opposite surfaces of the first heat dissipation substrate (521) are respectively in heat conduction connection with the surface of the circuit board (400) and the first end of the first heat pipe (523), and two opposite surfaces of the second heat dissipation substrate (522) are respectively in heat conduction connection with the surface of the light transmission sheet (200) and the second end of the first heat pipe (523).

4. The camera of claim 1, further comprising a second heat transfer element (600), the second heat transfer element (600) disposed within the housing (100), a first end of the second heat transfer element (600) being in thermally conductive connection with the circuit board (400), a second end of the second heat transfer element (600) being in thermally conductive connection with the housing (100).

5. The camera according to claim 4, wherein the second heat transfer member (600) includes a third temperature equalizing plate (611) and a fourth temperature equalizing plate (612) that are thermally connected, a surface of the third temperature equalizing plate (611) is thermally connected with a surface of the circuit board (400), and a surface of the fourth temperature equalizing plate (612) is thermally connected with an inner wall surface of the housing (100);

or, the second heat transfer element (600) includes a third heat dissipation substrate (621), a fourth heat dissipation substrate (622) and a second heat pipe (623), wherein two opposite surfaces of the third heat dissipation substrate (621) are respectively in heat conduction connection with the surface of the circuit board (400) and the first end of the second heat pipe (623), and two opposite surfaces of the fourth heat dissipation substrate (622) are respectively in heat conduction connection with the inner wall surface of the shell (100) and the second end of the second heat pipe (623).

6. The camera of claim 4, further comprising an actuating mechanism (700), the actuating mechanism (700) being disposed within the housing (100) with the actuating mechanism (700) being located between the second heat transfer element (600) and the housing (100), the actuating mechanism (700) being a thermally conductive structure, the actuating mechanism (700) being switchable between a first actuating state and a second actuating state,

the second heat transfer element (600) is thermally conductively connected to the housing (100) via the actuating mechanism (700) when the actuating mechanism (700) is in the first actuating state;

when the actuating mechanism (700) is in the second actuating state, the second heat transfer element (600) is disconnected from the housing (100) by the actuating mechanism (700).

7. The camera of claim 6, wherein the actuation mechanism (700) comprises a temperature-dependent deformable element.

8. The camera of claim 6, wherein a first region of the circuit board (400) is in thermally conductive connection with a first end of the second heat transfer element (600), the camera further comprising a temperature detection element for detecting a temperature of the first region, the temperature detection element being in communicative connection with the action mechanism (700);

the operating mechanism (700) is in the second operating state when the temperature detected by the temperature detecting element is less than a first temperature threshold;

when the temperature detected by the temperature detection element reaches the first temperature threshold, the operation mechanism (700) is in the first operation state.

9. The camera according to claim 4, further comprising a connector (840), wherein the second heat transfer element (600) is fixedly connected to the housing (100) via the connector (840).

10. The camera of claim 4, further comprising a first sheet-like heat conducting structure (810), the first sheet-like heat conducting structure (810) being disposed between the light transmissive sheet (200) and the first heat transfer member (500), the second end of the first heat transfer member (500) being in heat conductive connection with the light transmissive sheet (200) through the first sheet-like heat conducting structure (810);

and/or the camera further comprises a second sheet-like heat conducting structure (820), wherein the second sheet-like heat conducting structure (820) is arranged between the first end of the first heat transfer element (500) and the circuit board (400), and the first heat transfer element (500) is in heat conducting connection with the circuit board (400) through the second sheet-like heat conducting structure (820);

and/or, the camera further comprises a third sheet-shaped heat conduction structure (830), the third sheet-shaped heat conduction structure (830) is arranged between the first end of the second heat transfer element (600) and the circuit board (400), and the second heat transfer element (600) is in heat conduction connection with the circuit board (400) through the third sheet-shaped heat conduction structure (830).

11. The camera of claim 10, wherein at least one of the first sheet-like thermally conductive structure (810), the second sheet-like thermally conductive structure (820), and the third sheet-like thermally conductive structure (830) is a phase change structure.

12. The camera according to claim 1, further comprising a heat conductive sheet (900), the heat conductive sheet (900) being disposed in the housing (100), and a surface of the heat conductive sheet (900) being bonded to an inner wall surface of the housing (100), a thermal conductivity of the heat conductive sheet (900) being greater than a thermal conductivity of the housing (100).