CN208754387U - A kind of camera - Google Patents

Abstract

The utility model discloses a kind of camera, it includes imaging sensor (100), TEC module (200), master control borad component (700) and shell, the shell has inner cavity, the TEC module (200) is arranged in the inner cavity and the inner cavity is divided into refrigerating chamber (B) and heat dissipation cavity, described image sensor (100) is arranged in the refrigerating chamber (B), and the master control borad component (700) is arranged in the heat dissipation cavity.The refrigerating plant that above scheme can solve in current camera has that refrigerating efficiency is lower.

Description

A kind of camera

Technical field

The utility model relates to camera technique field more particularly to a kind of cameras.

Background technique

In order to improve shooting quality, current camera is commonly equipped with refrigerating plant, and refrigerating plant enables to camera Imaging sensor works in a lower temperature environment, so as to reduce the generation of dark current, and then when can improve long Between dim light shooting image signal-to-noise ratio, can finally shoot ideal fluorescence or chemiluminescence pattern.

For current refrigerating plant during to phase mechanism cold, refrigeration object is that camera is whole, this causes to share figure As the refrigerating capacity on sensor is insufficient.It will be apparent that current complete machine refrigeration modes have that refrigerating efficiency is lower, finally not But it will lead to energy consumption increase, it is most important that, the picture quality for also resulting in imaging sensor acquisition is poor, is unable to satisfy and wants It asks.

Utility model content

The utility model discloses a kind of camera, and it is lower that there are refrigerating efficiencies to solve the problems, such as current camera.

To solve the above-mentioned problems, the utility model adopts the following technical solutions:

A kind of camera, including imaging sensor, TEC module, master control borad component and shell, the shell have inner cavity, institute It states TEC module to be arranged in the inner cavity and the inner cavity is divided into refrigerating chamber and heat dissipation cavity, described image sensor setting exists In the refrigerating chamber, the master control borad component is arranged in the heat dissipation cavity and is electrically connected with described image sensor.

The technical solution adopted in the utility model can reach it is following the utility model has the advantages that

In camera disclosed by the utility model, TEC module is magazine refrigeration module, and TEC module is by the inner cavity of shell It is divided into refrigerating chamber and heat dissipation cavity, imaging sensor setting specially freezes to it in refrigerating chamber, and then by TEC module, phase The master control borad component of machine is then arranged in heat dissipation cavity.Under such assembling structure, TEC module can be pointedly in refrigerating chamber Imaging sensor carries out separate refrigeration, and without freezing for the complete machine of camera, the refrigerating capacity of TEC module can be more concentratedly Apply on the image sensor, therefore the refrigerating efficiency of the refrigerating plant of camera can be improved.

Detailed description of the invention

Attached drawing described herein is used to provide a further understanding of the present invention, and constitutes one of the utility model Point, the exemplary embodiment of the utility model and the description thereof are used to explain the utility model, does not constitute to the utility model Improper restriction.In the accompanying drawings:

Fig. 1 is the structural schematic diagram of camera disclosed in the utility model embodiment；

Fig. 2 is the cross-sectional view of camera shown in Fig. 1, and radiation tooth is not shown in Fig. 2；

Fig. 3 is the configuration schematic diagram of camera disclosed in the utility model embodiment；

Fig. 4 is the structural schematic diagram of first circuit board disclosed in the utility model embodiment；

Fig. 5 is the connection schematic diagram of first circuit board and second circuit board disclosed in the utility model embodiment；

Fig. 6 is the cross-sectional view of the part-structure of camera disclosed in the utility model embodiment；

Fig. 7 and Fig. 8 be respectively in Fig. 2 schematic diagram of the part-structure under different perspectives, Fig. 7 radiation tooth is not shown；

Fig. 9 is the cross-sectional view of the part-structure of camera；

Figure 10 is the structural schematic diagram of rear cover；

Figure 11 is the cooperation schematic diagram of cable and cover board.

Description of symbols:

100- imaging sensor, 110- support plate, 200-TEC module, 210-TEC ontology, the hot end 220- component, 221- dissipate Hot tooth, 230- cold end component, 300- rear case component, 310- rear cover, 311- radiating boss, 312- light-guiding pillar, 313- interface through-hole, 314- aviation plug through-hole, 320- cover board, 330- groove, 331- inclination air inducing face, 340- fan guard, 341- screw, 400- front cover, 410- adapter ring, 420- optical filter, 500- radiator fan, 600- first circuit board, 610- inside casing, 620- outline border, 630- flexible circuit board, 700- master control borad component, 710- interface board, 711- avoid holes, 720- second circuit board, 721- chip, 730- interface, 740- cooling fin, 750- heat conductive pad, 800 electric adapters, 810 first board to board connector, the second plate of 820- are to plate Connector, 900- cable, 910- sealing ring, 911- barb, 912- baffle ring, 1000- aviation plug；

A- heat dissipation wind channel, B- refrigerating chamber, C- accommodating chamber, the dust-proof chamber of D-, a- sealing ring, b- sealing ring.

Specific embodiment

It is specific below in conjunction with the utility model to keep the purpose of this utility model, technical solution and advantage clearer Technical solutions of the utility model are clearly and completely described in embodiment and corresponding attached drawing.Obviously, described embodiment It is only the utility model a part of the embodiment, instead of all the embodiments.Based on the embodiments of the present invention, this field Those of ordinary skill's every other embodiment obtained without making creative work, belongs to the utility model The range of protection.

Below in conjunction with attached drawing, technical solution disclosed in each embodiment of the utility model is described in detail.

Fig. 1-Figure 11 is please referred to, the utility model embodiment discloses a kind of camera, and disclosed camera includes image sensing Device 100, TEC module 200, master control borad component 700 and shell.

Shell has inner cavity, and TEC module 200 is arranged in the inner cavity of shell and inner cavity is divided into refrigerating chamber B and heat dissipation Chamber.TEC module 200 is the refrigerating plant of camera, and TEC (Thermo Electric Cooler) module 200 is a kind of using partly Semiconductor cooler made of the Peltier effect of conductor material.TEC module 200 is known device.TEC module 200 is working During, one end heat absorption, other end heat release.In the present embodiment, one end that TEC module 200 is absorbed heat is for realizing refrigerating chamber B Refrigeration, the exothermic one end of TEC module 200 then to heat dissipation cavity heat release, finally by heat dissipation cavity realize radiate.

Imaging sensor 100 is the device that needs to work in low temperature environment in the image acquisition component and camera of camera Part, imaging sensor 100 are arranged in refrigerating chamber B.Master control borad component 700 is the main control part of camera, and master control borad component 700 exists More heat can be generated during work.Master control borad component 700 is arranged in heat dissipation cavity and is electrically connected with imaging sensor 100 It connects, and then realizes and power and control to imaging sensor 100.

The inner cavity of shell is separated into refrigerating chamber B by TEC module 200 and dissipated by camera disclosed in the utility model embodiment Imaging sensor 100 is arranged in refrigerating chamber B, freezes exclusively for it by hot chamber, the master control borad component that will radiate more 700 are laid in heat dissipation cavity, the influence for avoiding it from freezing imaging sensor 100.In such cases, the TEC module of camera 200 refrigerating capacitys generated can be concentrated for freezing to imaging sensor 100, avoid freezing to camera complete machine, It is just avoided that and freezes to some components without cooling, this can undoubtedly improve refrigerating efficiency.

In order to be further reduced heat exchange, refrigerating chamber B is usually seal chamber.Inert gas, example can be filled in refrigerating chamber B The heat exchange action of such as nitrogen, helium, inert gas is poor, and then can preferably keep the low temperature environment in refrigerating chamber B.

Imaging sensor 100 can be electrically connected by first circuit board 600 with master control borad component 700, first circuit board 600 It is arranged in refrigerating chamber B, imaging sensor 100 is mounted on first circuit board 600.First circuit board 600 not only passes for image Sensor 100 provides installation foundation, but also the electrical connection being able to achieve between imaging sensor 100 and master control borad component 700.

TEC module 200 generally includes TEC ontology 210 and 220 He of hot end component for being separately positioned on 210 both ends of TEC ontology Cold end component 230.TEC ontology 210 is the main element of TEC module 200, and TEC ontology 210 is made of two kinds of semiconductor materials Galvanic couple.Hot end component 220 is to be arranged in the exothermic one end of TEC ontology 210, to carry out heat release.Cold end component 230 is that setting exists One end that TEC ontology 210 absorbs heat, to absorb heat.In order to improve heat exchange efficiency, hot end component 220 and cold end component 230 Using the higher structure of heat exchange efficiency or material molding.

In the process of work, the meeting of hot end component 220 heat release, cold end component 230 can absorb heat.Under normal conditions, image passes The side of sensor 100 is induction side, and the other side is installation side.As described above, imaging sensor 100 may be mounted at the first electricity On road plate 600, the installation side of imaging sensor 100 is connected on first circuit board 600, and first circuit board 600 is image sensing Device 100 is powered.In the process of work, cold end component 230 absorbs heat meeting so that the temperature of refrigerating chamber B declines, and then realizes to figure As the refrigeration of sensor 100.

In order to further increase refrigeration and heat dissipation effect, in preferred scheme, TEC ontology 210 and cold end component 230 and The good heat-conducting piece of heating conduction can be set between TEC ontology 210 and hot end component 220.A kind of specific embodiment party In formula, heat-conducting piece can be printed and formed thermal grease layer.

In actual assembling process, the volume of cold end component 230 and hot end component 220 is larger, in order to enable the two is more Well with the connection of TEC ontology 210, in preferred scheme, screw can be passed through between cold end component 230 and hot end component 220 Locking, i.e., TEC ontology 210 is clamped and fixed between cold end component 230 and hot end component 220.

Specifically, can be connected using the insulation screw made of heat-insulating material between cold end component 230 and hot end component 220 It connects, insulation screw can be reduced the heat interaction between cold end component 230 and hot end component 220.In a kind of specific embodiment, absolutely Hot material can be nylon material.It is insulated between the connecting hole of screw and cold end component 230 and the connecting hole of hot end component 220 Heat-insulating material can be set, to be further reduced heat exchange.

In order to further increase the refrigerating efficiency to imaging sensor 100, in preferred scheme, first circuit board 600 can To offer perforation, the cold end component 230 of TEC module 200 can pass through perforation and contact with imaging sensor 100.Such feelings Under condition, cold end component 230 does not influence to can be realized cold end under the premise of first circuit board 600 is electrically connected with imaging sensor 100 Component 230 is directly contacted with imaging sensor 100, this can undoubtedly improve the refrigerating efficiency to imaging sensor 100.

There are many specific structures that can satisfy the first circuit board 600 of requirement described above.Referring to FIG. 4, a kind of tool In the embodiment of body, first circuit board 600 may include inside casing 610 and be arranged and be electrically connected around inside casing 610 and be outer Frame 620.Imaging sensor 100 is mounted on inside casing 610, and cold end component 230 passes through the centre bore of inside casing 610 and passes with image Sensor 100 contacts.The centre bore of inside casing 610 is perforation described above.Inside casing 610 is electrically connected with outline border 620, outline border 620 It is electrically connected with master control borad component 700, imaging sensor 100 is mounted on inside casing 610, can pass sequentially through inside casing 610 and outline border 620 realize and being electrically connected between master control borad component 700.

During installing electronic component, imaging sensor 100 and some necessary and function is can be set in inside casing 610 Rate lesser electronic component can lay some necessary and biggish electronic components of power on outline border 620.Such setting Mode enables to cold end component 230 that refrigerating capacity is conveyed to inside casing 610, avoids being conveyed to unnecessary outline border 620, very aobvious So, this refrigerating efficiency that undoubtedly can be further improved TEC module 200.Certainly, in such cases, in the system of imaging sensor 100 Under the premise of refrigeration requirement determines, the power consumption of TEC module 200 can be reduced, and designer can be lower-powered for camera configuration TEC module 200 implements refrigeration.Certainly, under such structure, freeze according to the TEC module 200 of relatively high power, then can Reach lower cryogenic temperature, and then meets the special applications of user or the design requirement of the higher imaging sensor 100 of power.

As it can be seen that the first circuit board 600 of above structure can provide condition for the laying of electronic component, and then can make The cooling loss of TEC module 200 further decreases, and correspondingly, largely improves refrigerating efficiency.

In order to pursue more ultimate attainment refrigeration effect, on inside casing 610 can setting imaging sensor 100, and be not provided with Other electronic components.In order to improve the stability of setting, imaging sensor 100 can be arranged by support plate 110 in inside casing On 610, support plate 110 can be used as major mechanical support, and inside casing 610 is fixedly connected with support plate 110, imaging sensor 100 Installation over the carrier plate 110, while being electrically connected with inside casing 610.Certainly, it is also required to be arranged in support plate 110 for cold end component 230 The perforation passed through, to facilitate cold end component 230 directly to contact with imaging sensor 100.

In order to preferably adapt to installation environment, in preferred scheme, flexibility can be passed through between inside casing 610 and outline border 620 Circuit board 630 or flexible cable electrical connection.Flexible circuit board 630 or flexible cable have preferable deformation performance, can be preferable Ground makes the deformation between inside casing 610 and outline border 620 achieve the purpose that flexible adaptation installation environment.Inside casing 610 and outline border 620 it Between heat-barrier material can be set, heat-barrier material can reduce heat affecting of the outline border 620 to inside casing 610.

Master control borad component 700 may include second circuit board 720, and the electronic device of some relatively high powers of camera can be with cloth It is located at second circuit board 720, since second circuit board 720 is located at except refrigerating chamber B, can be avoided these relatively high power devices Influence of the part to refrigeration work also avoids TEC module 200 and freezes to some unnecessary electronic devices certainly, this nothing Refrigeration power consumption can be reduced by doubting.Camera disclosed in the present embodiment on the circuit board of different spaces using electronic device is laid, favorably In the layout for more having planning for raising refrigerating efficiency implementation.

Second circuit board 720 can by penetrated from refrigerating chamber B heat dissipation cavity electric adapter 800 and first circuit board 600 Electrical connection.Electric adapter 800 can be realized the master control borad component 700 and first circuit board for being located at refrigerating chamber B and heat dissipation cavity Electrical connection between 600.In a kind of specific embodiment, electric adapter 800 can be switching circuit board.

In a kind of specific embodiment, plate is connected by the first plate between electric adapter 800 and first circuit board 600 Device 810 is connected, and electric adapter 800 can be connected with second circuit board 720 by the second board to board connector 820.First plate pair Connector for substrate 810 and the second board to board connector 820 can be realized the electricity between first circuit board 600 and second circuit board 720 Connection and signal connection, while can be improved the stability connected between first circuit board 600 and second circuit board 720.

In preferred scheme, the first board to board connector 810 and the second board to board connector 820 can be shifted to install in electricity The two sides of adapter 800.First board to board connector 810 and the second board to board connector 820 are dislocatedly distributed, and are conducive to electricity and turn The sealing of fitting 800, and then be easier to realize the seal isolation between refrigerating chamber B and heat dissipation cavity.

In the utility model embodiment, shell may include rear cover 310 and dock the front cover to form inner cavity with rear cover 310 400.Master control borad component 700 can also include interface board 710, and interface board 710 can be set in second circuit board 720 and rear cover Between bottom wall in 310.The interface 730 being electrically connected with interface board 710 is offered on rear cover 310.Camera can pass through interface 730 It realizes and is connect with extraneous control.

Second circuit board 720 is usually provided with chip 721, and chip 721 is the control core of camera, in the process of work More heat can be generated, implementing preferably to radiate to chip 721 is undoubtedly more advantageous to the work of camera.Based on this, preferred side In case, interface board 710 can offer avoid holes 711 and contact with chip 721.Interface board 710 is by the way of aperture, energy Enough so that radiating boss 311 is directly contacted with chip 721, the radiating efficiency to chip 721 finally can be further improved.

In actual design process, it is contemplated that the linking between the transmission path length and electronic component of signal, after Interface 730 has can be set in position on lid 310 with 721 face of chip.It will be apparent that radiating boss 311 can not be in relatively large area Contact heat dissipation is carried out with chip 721.Based on this, in preferred scheme, can be folded between radiating boss 311 and chip 721 Cooling fin 740.One end of cooling fin 740 is sticked on the surface of chip 721, and the other end connects after passing through avoid holes 711 with rear cover 310 Touching.Cooling fin 740 can play the role of increasing contact heat dissipation area, and then can improve the heat dissipation effect to chip 721.Consider To rear cover 310 inner wall and chip 721 surface not in the same plane, therefore, cooling fin 740 is usually Special-shaped sheet, such as z Font cooling fin.

In order to further increase radiating efficiency, between cooling fin 740 and chip 721 and cooling fin 740 and rear cover 310 it Between heat conductive pad 750 can be set.Heat conductive pad 750 generallys use the better material of heating conduction and is made, and then leads to improve The thermal efficiency.

In order to improve the heat dissipation performance of heat dissipation cavity, in preferred scheme, heat dissipation wind channel A, shell can be set in heat dissipation cavity Radiator fan 500 is provided on body, the air outlet of radiator fan 500 is connected to the air inlet of heat dissipation wind channel A, heat dissipation wind channel A's Air outlet with external environment for being connected to.In the process of work, 500 certain driving air-flow of radiator fan enters in heat dissipation wind channel A, It is discharged to external environment from the air outlet of heat dissipation wind channel A after finally exchanging heat in heat dissipation wind channel, and then completes heat dissipation.This active The mode of heat dissipation undoubtedly can be further improved the heat dissipation performance of camera.

In the actual working process, the radiating efficiency of the hot end component 220 of TEC module 200 directly affects TEC module 200 refrigerating efficiency.If component 220 radiating efficiency in hot end is poor, heat can be accumulated and then offset the refrigeration of cold end component 230 Amount can even damage TEC module 200 when serious.Based on this, in preferred scheme, shell may include rear case component 300, after Cap assemblies 300 include rear cover 310 described above.TEC module 200 includes hot end component 220, hot end component 220 and rear cover group Heat dissipation wind channel A can be formed between part 300.Hot end component 220 directly constitutes heat dissipation wind channel A, this can undoubtedly make hot end component 220 are more efficiently sufficiently exchanged heat with the air-flow flowed through, achieve the purpose that improve heat exchange efficiency.

Hot end component 220 can use the good shape of heat dissipation performance, in a kind of specific embodiment, hot end component 220 may include radiation tooth 221, and radiation tooth 221 can be improved the heat exchange area of hot end component 220 Yu air-flow, and then can improve The radiating efficiency of hot end component 220.

In the present embodiment, rear case component 300 may include rear cover 310 and cover board 320, and rear cover 310 has towards hot end structure The opening of part 220.Cover board 320 is sealed in the opening of rear cover 310 and forms accommodating chamber C, master control board group with rear cover 310 Part 700 can be set in accommodating chamber C.Specifically, cover board 320 and hot end component 220 form heat dissipation wind channel A.Accommodating chamber C can Closed installation space is provided for main control board assembly 700, and then is avoided that master control borad component 700 is affected by.

There are many modes for realizing the opening sealing cooperation of cover board 320 and rear cover 310, for example, the surface of cover board 320 is with after The end face of the opening of lid 310 can pass through face and face gluing, sealing.In such cases, the end on the surface of cover board 320 and rear cover 310 Face is high-precision machined surface.In such cases, the accommodating chamber C that cover board 320 and rear cover 310 are formed has preferable leakproofness Can, and then waterproof and dustproof can be played the role of.It will be apparent that this is more advantageous to the protection to master control borad component 700.

In order to improve the overall appearance of camera, while making the small volume of camera, in preferred scheme, shell is offered Groove 330, groove 330 are connected to heat dissipation wind channel A, and radiator fan 500 is mounted in groove 330.The notch of groove 330 can be set It is equipped with fan guard 340, fan guard 340 can be fixed on rear case component 300 by screw 341, and then realized and dissipated Fixed installation of the Hot-air fan 500 in groove 330.

In further preferred scheme, radiator fan 500 is at least partially disposed at the air inlet of heat dissipation wind channel A, and then can So that the air-flow that radiator fan 500 is discharged enters directly into heat dissipation wind channel A.Specifically, a part of radiator fan 500 can be with Opposite with rear cover 310, another part can be opposite with heat dissipation wind channel A, and such arrangement can not only dissipate hot end component 220 Heat, moreover it is possible to which the heat generated when radiating for rear cover 310, and then working indirectly master control borad component 700 removes.

The bottom surface opposite with radiator fan 500 can be inclination air inducing face 331 in above-mentioned groove 330, tilt air inducing face 331 For the air-flow in groove 330 to be oriented in heat dissipation wind channel A.Inclination air inducing face 331 is conducive to will to blow to the air-flow of rear cover 310 most It is more flowed in heat dissipation wind channel A under its guidance eventually.Certainly, the tilt angle in above-mentioned inclination air inducing face 331 decides receiving The shape of chamber C, and then will affect the normal laying of its internal master control borad component 700.In the present embodiment, air inducing face 331 is tilted Tilt angle should not influence the installation of master control borad component 700.Under the premise of herein, tilt air inducing face 331 tilt angle and Distance away from radiator fan 500 can be determined with fluid emulation, so that reaching maximum by the air quantity of heat dissipation wind channel A.

Radiator fan 500 is mounted in groove 330, and heat dissipation wind channel A passes through the middle part of camera, therefore above-mentioned assembly side Formula can also promote the appearance property of camera to a certain extent.

Master control borad component 700 can power for the other component of camera, such as indicator light.In general, indicator light is for showing The energized state of camera.Under normal circumstances, then illustrate that camera is in energized state or working condition when indicator light shines, it is no Then, then illustrate that camera is in off working state or non-power status.Indicator light is usually laid in accommodating chamber C, and indicator light passes through Light-guiding pillar exports light except rear cover 310 for display.In a kind of specific embodiment, it can be set in rear cover 310 Light-guiding pillar 312, one end of light-guiding pillar 312 pass through the side wall of rear cover 310, and the other end of light-guiding pillar 312 can pass through rear cover 310 Bottom wall.Certainly, at least part is located within accommodating chamber C between 312 both ends of light-guiding pillar, with the light of codan lamp.Instruction The light of lamp can project after the conduction of over-light-transferring pole 312 from the bottom wall and side wall of rear cover 310.In such cases, Yong Huke With in the bottom wall direction towards rear cover 310 and the sidewall direction towards rear cover 310 it is observed that the light of indicator light.Such knot Structure can facilitate the observation of user, while it is also possible that camera adapts to more installation environments, have preferable Installation Flexibility. In a kind of specific embodiment, light-guiding pillar 312 is L shape light-guiding pillar.Certainly, light-guiding pillar 312 also uses other shapes, this is practical The specific structure of the unlimited light-guiding pillar 312 processed of new embodiment.

Radiator fan 500 is usually powered by master control borad component 700.Due to radiator fan 500 be usually laid in accommodating chamber C it Outside, and master control borad component 700 is then laid within accommodating chamber C.Therefore, radiator fan 500 usually passes through cable 900 and master control borad Component 700 is electrically connected.Under normal conditions, cable 900 realizes wiring after passing through cover board 320.In order to realize accommodating chamber C it is dust-proof, Waterproof can be arranged with sealing ring 910 on cable 900, and sealing ring 910 can be fixed on cover board 320.Specifically, sealing Circle 910 can be silica gel sealing ring.Sealing ring 910 is opening silica gel ring, and sealing ring includes barb 911 and baffle ring 912, and be open silicon Cushion rubber can be socketed on online cable 900 by opening, and barb 911 and baffle ring 912 are respectively positioned at the surface of the two sides of cover board 320 On, reach preferable sealing effect, while being also beneficial to preferably position cable 900.

In the utility model embodiment, specifically, being equipped with adapter ring 410 on front cover 400, adapter ring 410 and image are passed Optical filter 420 is installed in the opposite lens barrel of sensor 100.Optical filter 420, adapter ring 410, first circuit board 600, front cover 400 Refrigerating chamber B can be surrounded with TEC module 200.It can be close by sealing ring and sealant between above-mentioned two to be connected component Envelope connection, and then ensure the sealing of refrigerating chamber B.Certainly, there are many modes of camera formation refrigerating chamber B, each camera is not being influenced Under the premise of each component works normally, refrigerating chamber B can also be formed using more or less components.

In order to further alleviate condensation, in preferred scheme, molecular sieve, molecular sieve can be set in refrigerating chamber B There are preferable water absorbing properties.Molecular sieve is able to solve condensation problem caused by the micro-leakage being difficult to avoid that in long term seal.Tool Body, can be in refrigerating chamber B using the fixed a certain amount of molecular sieve of pressing plate, this can make the Sealing period of refrigerating chamber B be able to Extend.

The cleannes requirement of camera, especially industrial camera to the protection glass surface of imaging surface and imaging sensor 100 It is very high, even if the protection glass surface of conventional imaging sensor has the micron-sized ash that falls that can also have an impact to imaging.For Meet such demand, needs dust-proof device can be using the electronic component for facilitating dedusting and convenient dust-proofing, tool in camera Body, imaging sensor 100 and optical filter 420 can use optical device dedusting method commonly used in the trade, for example, by using dustless The mode of paper or ultrasonic cleaning.

In a kind of specific embodiment, optical filter 420, adapter ring 410, front cover 400 and imaging sensor 100 can enclose It is a part of refrigerating chamber B at dust-proof chamber D, dust-proof chamber D.Above-mentioned component can will be affected with dust biggish component surround it is dust-proof Chamber D, above-mentioned component are relatively easy to dedusting.Specifically, can be sealed using dispensing between imaging sensor 100 and front cover 400, point It glue position can be on the periphery one week of the protection glass of imaging sensor 100.

In the present embodiment, refrigerating chamber B is preferably seal chamber, and the sealing of refrigerating chamber B is the key that one of design, once sealing Failure, the droplet of condensation may result in the internal short circuits of camera, or even can burn valuable imaging sensor 100, this Camera disclosed in embodiment can use sealing ring and dot encapsulation in key position using vacuum sealing standard as sealing criterion Glue dual sealing manner realizes sealing.

Optical filter 420 can be sealed during being assembled to adapter ring 410 with dot encapsulation glue between the two.Electric adapter 800 can be fixed by screws on hot end component 220, respectively in the first board to board connector 810 of electric 800 two sides of adapter And sealant is filled in the second point glue groove around board to board connector 820.

It can be sealed using encapsulating mode between hot end component 220 and front cover 400, it can between adapter ring 410 and front cover 400 Sealing is realized in such a way that use is for dispensing glue.Certainly, adapter ring 410 can also be realized close between front cover 400 by sealing ring a Envelope.It can also be realized and be sealed by sealing ring b between front cover 400 and TEC module 200.

Light-guiding pillar 312 needs to stretch out except rear case component 300, therefore offers on rear cover 310 and be pierced by for light-guiding pillar 312 Through hole can carry out dot encapsulation glue be sealed it is dust-proof.The interface through-hole 313 passed through on rear cover 310 for interface 730 can be with It is dust-proof that overlap joint realization is carried out by the conductive sponge between interface 730 and rear cover 310.

Camera generally includes aviation plug 1000.Between aviation plug through-hole 314 on aviation plug 1000 and rear cover 310 It can realize that sealing is dust-proof to carry out by the structure of aviation plug 1000 itself.

Emphasis describes the difference between each embodiment in the utility model foregoing embodiments, between each embodiment As long as different optimization feature non-contradiction, can combine to form more preferably embodiment, it is contemplated that style of writing is succinct, this then no longer It repeats.

The above description is only the embodiments of the present invention, is not intended to limit the utility model.For this field For technical staff, various modifications and changes may be made to the present invention.All institutes within the spirit and principle of the utility model Any modification, equivalent substitution, improvement and etc. of work, should be included within the scope of the claims of the utility model.

Claims (15)

1. a kind of camera, which is characterized in that including imaging sensor (100), TEC module (200), master control borad component (700) and Shell, the shell have inner cavity, and the TEC module (200) is arranged in the inner cavity and the inner cavity is divided into refrigerating chamber (B) it is arranged in the refrigerating chamber (B) with heat dissipation cavity, described image sensor (100), master control borad component (700) setting It is electrically connected in the heat dissipation cavity and with described image sensor (100).

2. camera according to claim 1, which is characterized in that described image sensor (100) passes through first circuit board (600) it is electrically connected with the master control borad component (700), the first circuit board (600) is arranged in the refrigerating chamber (B), institute Imaging sensor (100) is stated to be mounted on the first circuit board (600).

3. camera according to claim 2, which is characterized in that the TEC module (200) includes cold end component (230), institute Cold end component (230) are stated across the perforation of the first circuit board (600) and are contacted with described image sensor (100).

4. camera according to claim 3, which is characterized in that the first circuit board (600) includes inside casing (610) and encloses The outline border (620) for being arranged and being electrically connected around the inside casing (610), described image sensor (100) are mounted on the inside casing (610) on, the cold end component (230) passes through the centre bore of the inside casing (610) and connects with described image sensor (100) Touching, the centre bore are the perforation.

5. camera according to claim 4, which is characterized in that pass through between the inside casing (610) and the outline border (620) Flexible circuit board (630) is electrically connected and is filled with heat-barrier material between the inside casing (610) and the outline border (620).

6. camera according to claim 2, which is characterized in that the master control borad component (700) includes second circuit board (720), the second circuit board (720) is by penetrating electric adapter (800) and the institute of the heat dissipation cavity from the refrigerating chamber (B) State first circuit board (600) electrical connection.

7. camera according to claim 6, which is characterized in that the shell includes rear cover (310) and right with rear cover (310) The front cover (400) to form the inner cavity is connect, the master control borad component (700) further includes interface board (710), the interface board (710) it is arranged between the bottom wall in the second circuit board (720) and the rear cover (310), the rear cover (310) offers The interface (730) being electrically connected with the interface board (710).

8. camera according to claim 7, which is characterized in that be provided with chip on the second circuit board (720) (721), the interface board (710) is provided with avoid holes (711), and the bottom wall in the rear cover (310) is provided through described keep away It allows the radiating boss (311) of hole (711), is folded with cooling fin between the radiating boss (311) and the chip (721) (740), one end of the cooling fin (740) is attached to the surface of the chip (721), the other end pass through the avoid holes (711), And it is contacted with the rear cover (310).

9. camera according to claim 6, which is characterized in that the electricity adapter (800) and the first circuit board (600) it is electrically connected by the first board to board connector (810), the electricity adapter (800) and the second circuit board (720) is logical Cross the second board to board connector (820) electrical connection, first board to board connector (810) and second board to board connector (820) it shifts to install respectively in the two sides of the electric adapter (800).

10. camera according to claim 1, which is characterized in that it is provided in the heat dissipation cavity heat dissipation wind channel (A), it is described It is provided on shell radiator fan (500), the air outlet of the radiator fan (500) and the air inlet of the heat dissipation wind channel (A) Connection, the air outlet of the heat dissipation wind channel (A) with external environment for being connected to.

11. camera according to claim 10, which is characterized in that the shell includes rear case component (300), the TEC Module (200) includes hot end component (220), and described dissipate is formed between the hot end component (220) and the rear case component (300) Hot-flow flue (A).

12. camera according to claim 11, which is characterized in that the hot end component (220) includes radiation tooth (221), The radiation tooth (221) is located in the heat dissipation wind channel (A).

13. camera according to claim 11, which is characterized in that the rear case component (300) includes rear cover (310) and lid Plate (320), the rear cover (310) have the opening towards the hot end component (220), and the cover board (320) is sealed on Accommodating chamber (C) is formed in the opening of the rear cover (310) and with the rear cover (310), master control borad component (700) setting In the accommodating chamber (C), the cover board (320) and the hot end component (220) form the heat dissipation wind channel (A).

14. camera according to claim 10, which is characterized in that open up fluted (330), the heat dissipation on the shell Fan (500) is mounted in the groove (330), and the groove (330) is connected to the heat dissipation wind channel (A).

15. camera according to claim 14, which is characterized in that the radiator fan (500) is at least partially disposed at described The air inlet of heat dissipation wind channel (A), the groove (330) is interior and the radiator fan (500) opposite bottom surface is inclination air inducing face, Air-flow in the groove (330) can be oriented in the heat dissipation wind channel (A) by the inclination air inducing face.