CN212081759U - Mounting structure, cabinet body and refrigeration plant of semiconductor refrigeration device - Google Patents
Mounting structure, cabinet body and refrigeration plant of semiconductor refrigeration device Download PDFInfo
- Publication number
- CN212081759U CN212081759U CN202020518487.3U CN202020518487U CN212081759U CN 212081759 U CN212081759 U CN 212081759U CN 202020518487 U CN202020518487 U CN 202020518487U CN 212081759 U CN212081759 U CN 212081759U
- Authority
- CN
- China
- Prior art keywords
- semiconductor refrigeration
- refrigeration device
- cabinet
- cabinet body
- cold
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Images
Abstract
The utility model discloses a mounting structure, cabinet body and refrigeration plant of semiconductor refrigeration device, wherein the mounting structure of semiconductor refrigeration device includes the board subassembly, first concave yield has been seted up in the front of board subassembly, the second concave yield has been seted up at the back of board subassembly, first concave yield with the second concave yield is linked together with the through-hole, the through-hole is used for supplying the cold junction of semiconductor refrigeration device passes. The utility model provides a semiconductor refrigeration device's mounting structure makes the installation operation comparatively convenient and improved the installation effectiveness.
Description
Technical Field
The utility model relates to a refrigeration technology field especially relates to a mounting structure, cabinet body and refrigeration plant of semiconductor refrigeration device.
Background
Semiconductor refrigeration, also known as thermoelectric refrigeration, utilizes the thermo-electric effect of semiconductor materials to produce cold, and is another refrigeration mode different from compressor refrigeration.
Refrigeration equipment using semiconductor refrigeration technology requires installation of related semiconductor refrigeration devices. However, the mounting structure of the semiconductor cooling device at present makes the mounting operation difficult and inefficient, and improvement is needed.
SUMMERY OF THE UTILITY MODEL
The utility model discloses a main aim at provides a mounting structure, the cabinet body and refrigeration plant of semiconductor refrigeration device can make the installation operation of semiconductor refrigeration device comparatively convenient and improved the installation effectiveness.
The embodiment of the utility model provides a first aspect provides a semiconductor refrigeration device's mounting structure. The mounting structure of the semiconductor refrigeration device comprises a plate assembly, wherein a first concave portion is formed in the front face of the plate assembly, a second concave portion is formed in the back face of the plate assembly, the first concave portion is communicated with the second concave portion through a through hole, and the through hole is used for allowing the cold end of the semiconductor refrigeration device to penetrate through.
The first concave part and the second concave part enable the mounting process of the semiconductor refrigeration device to be capable of quickly finding the position, so that mounting operation is convenient, and mounting efficiency is improved. By virtue of the structure of the recessed portions, the cold end and the hot end of the semiconductor refrigeration device can sink into the first recessed portion and the second recessed portion, so that the size of the semiconductor refrigeration device is prevented from being too large due to installation. In addition, the through hole can keep apart the cold junction and the hot junction of semiconductor refrigeration device in the both sides of through hole each other to ensure that semiconductor refrigeration device's cold junction and hot junction can not take place heat transfer, and then ensure that refrigeration efficiency can not reduce.
A second aspect of the embodiments of the present invention provides a cabinet. The cabinet body includes:
the refrigerator comprises a cabinet body, wherein the back of the cabinet body is provided with a mounting structure of a semiconductor refrigeration device; and
the cold end of the semiconductor refrigeration device is at least partially arranged in the first concave portion, and the hot end of the semiconductor refrigeration device is at least partially arranged in the second concave portion.
As mentioned above, the cold end is disposed in the first recess and the hot end is disposed in the second recess, so that the installation operation is convenient and the installation efficiency is high.
In some embodiments, the semiconductor refrigeration device is a semiconductor refrigeration modular structure. And the installation operation of the semiconductor refrigeration device is further simpler by adopting a modular structure.
In some embodiments, the cabinet further comprises:
a first cover coupled to a front face of the plate assembly and covering the cold end; and
and the second cover is connected to the back surface of the plate assembly and covers the hot end.
The first cap covers the cold end and the second cap covers the hot end, so that the two caps also cover at least partial areas of the two recessed portions respectively. Set up two housing and make semiconductor refrigeration module's cold junction and hot junction all protected.
In some embodiments, the first cover is flush with the front face of the plate assembly and the second cover is flush with the back face of the plate assembly. The inner side surface and the outer side surface of the back of the cabinet body are both approximately flat surfaces, so that the appearance of the inner side and the outer side of the cabinet body is not influenced.
In some embodiments, a thermal insulation layer is arranged around the through hole. The through hole is the seam position, leads to cold volume to run off easily or heat flows in, causes the inside refrigeration effect variation of cabinet body. And the heat insulation layer is arranged around the through hole, so that the heat insulation performance of the seam can be improved.
In some embodiments, the thermal insulation layer is L-shaped in cross-section. The inner wall and the top surface/the bottom surface of the through hole can be tightly attached to the L-shaped heat insulation layer, so that the heat insulation performance of the joint is better.
In some embodiments, the semiconductor refrigeration modular structure includes a semiconductor refrigeration chip, a cold end fin, a hot end fin, and a fan, wherein the cold end fin is located at the cold end, the hot end fin is located at the hot end, the semiconductor refrigeration chip is located between the cold end and the hot end, and the fan is located on one side of the hot end fin away from the cold end.
The semiconductor refrigeration chip, the cold end fin, the hot end fin and the fan are integrated into a modular structure, so that the elements do not need to be installed independently one by one. The mounting process of the semiconductor cooling device is obviously simplified.
In some embodiments, the second cover has an air inlet and an air outlet. The second cover is positioned on the outer side surface of the back of the cabinet body, and an air inlet and an air outlet which are arranged on the second cover are respectively used for sucking outside air and discharging hot air to the outside so as to maintain the refrigeration cycle inside and outside the cabinet body.
A third aspect of the embodiments of the present invention provides a refrigeration apparatus. The refrigeration equipment comprises the cabinet body according to any one of the technical schemes.
Obviously, the refrigeration equipment has the beneficial effects corresponding to the cabinet body in any one of the above technical solutions, and details are not repeated herein.
Drawings
Fig. 1 is a schematic structural view of a cabinet body of a refrigeration apparatus according to some embodiments of the present invention;
FIG. 2 is a schematic structural view of the cabinet of FIG. 1 from another perspective;
fig. 3 is a front view of a cabinet of a refrigeration appliance in some embodiments of the present invention;
FIG. 4 is a sectional view taken along line A-A of FIG. 3;
FIG. 5 is a partial enlarged view of the position B in FIG. 4;
FIG. 6 is a schematic structural view of the semiconductor refrigeration module of FIG. 4 in a state where it is not installed;
fig. 7 is a schematic structural diagram of a semiconductor refrigeration module according to some embodiments of the present invention.
In the figure, 10-cabinet; 100-cabinet body, 110-first cover, 120-second cover; 200-plate assembly, 210-first groove, 220-second groove, 230-through hole, 231-insulating layer; 300-semiconductor refrigeration module, 310-cold side, 320-hot side.
Detailed Description
Reference will now be made in detail to embodiments of the present invention, examples of which are illustrated in the accompanying drawings, wherein like reference numerals refer to the same or similar elements or elements having the same or similar function throughout. The embodiments described below with reference to the accompanying drawings are exemplary only for the purpose of explaining the present invention, and should not be construed as limiting the present invention.
In the description of the present invention, it is to be understood that the terms "upper", "lower", "front", "rear" and "left", "right", etc. indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of description and simplification of description, but do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus, should not be construed as limiting the present invention.
In the description of the present invention, it is to be noted that, unless otherwise explicitly specified or limited, the term "connected" is to be interpreted broadly, and may be, for example, a fixed connection and a movable connection, a detachable connection and a non-detachable connection, or an integral connection; may be mechanically or electrically connected or may be in communication with each other. And "fixedly connected" includes detachably connected, non-detachably connected, integrally connected, and the like.
The use of terms like "first" or "second" in the present application is for descriptive purposes only and is not to be construed as indicating or implying any relative importance or implicit to the technical features indicated.
The technical solutions of the embodiments of the present invention can be combined with each other, but must be implemented by those skilled in the art. When the technical solutions are contradictory or impossible to be combined, the combination of the technical solutions should be considered to be absent and not be within the protection scope of the present invention.
It should be noted that, although the following description takes a refrigerator as an example, the technical solution of the present application is not limited to be applied only to the refrigerator, and other refrigeration equipment can also adopt the mounting structure of the semiconductor refrigeration device and the cabinet body in the embodiment of the present invention.
The following text will describe the mounting structure of the semiconductor refrigeration device and the manner in which the semiconductor refrigeration device is mounted in the cabinet body in some embodiments with reference to the drawings of the specification.
The embodiment of the first aspect of the utility model provides a mounting structure of semiconductor refrigeration device. The mounting structure of the semiconductor cooling device includes a board assembly. The meaning of plate package includes the case of a package composed of at least two layers of plates.
The front surface and the back surface of the plate assembly are respectively provided with a first concave part and a second concave part, the first concave part and the second concave part are communicated through a through hole 230, and the through hole 230 is used for allowing the cold end of the semiconductor refrigeration device to pass through. Referring to fig. 1 and 2, specifically, the first concave portion is a first groove 210, and the second concave portion is a second groove 220. The first groove 210 and the second groove 220 are rectangular. The first recess 210 is larger than the second recess 220, considering that the front side of the plate assembly where the first recess 210 is located may require more parts to be mounted.
It is understood that the shape of the first recess and the second recess may be different, and the size relationship between the two may be adjusted adaptively. The first and second recesses may each take a non-rectangular shape.
The board assembly is mounted to the cabinet body 100, and the board assembly forms the back of the cabinet body 100. The design of first recess and second recess is convenient for find the position fast when installing semiconductor refrigeration device for installation operation is comparatively convenient and installation effectiveness obtains improving. By means of the structure of the concave parts, the cold end and the hot end of the semiconductor refrigerating device can sink into the first concave part and the second concave part, and therefore the size of the semiconductor refrigerating device is prevented from being too large due to installation. In addition, the through hole 230 can isolate the cold end and the hot end of the semiconductor refrigeration device from each other at both sides of the through hole 230, thereby ensuring that the cold end and the hot end of the semiconductor refrigeration device cannot generate heat transfer and further ensuring that the refrigeration efficiency cannot be reduced.
Referring to fig. 1 and fig. 2, in particular, the through hole 230 is rectangular. The shape of the through-hole 230 is adapted to the cross-sectional shape of the surface of the semiconductor refrigeration device. It is understood that the shape of the through hole 230 may be adjusted and designed according to the overall shape of the semiconductor cooling device, for example, a non-rectangular shape such as a circle or a polygon with more than four sides.
The embodiment of the second aspect of the utility model provides a cabinet body. The cabinet 10 includes a cabinet body 100 and a semiconductor refrigeration device. With continued reference to fig. 1 and 2, in consideration of the fact that there are more semiconductor cooling devices, the back of the cabinet body 100 is easy to make room for installation, and therefore the back of the cabinet body 100 has the installation structure of the semiconductor cooling device according to the foregoing embodiment.
Semiconductor refrigeration technology is an application of the peltier effect. The principle of the peltier effect is: charge carriers move in the conductor to form a current. The charge carriers are at different energy levels in different materials, releasing excess energy as they move from high to low energy levels; conversely, when moving from a low level to a high level, energy is absorbed from the outside. Energy is absorbed or released as heat at the interface of the two materials. Compared with the compressor refrigeration technology, the semiconductor refrigeration technology has the advantage of low noise.
The semiconductor refrigeration device is a semiconductor refrigeration module 300 (not shown in fig. 1 and 2, please refer to fig. 7), which means a modular structure. Under the condition that the semiconductor refrigerating device is not modularized, the refrigerating chip, the hot end fin, the fan and the like need to be respectively installed on the cabinet body, so that the installation is difficult. The semiconductor refrigeration module in the embodiment is of a modular structure, so that the installation operation is simpler.
The semiconductor refrigeration module 300 has a cold side for absorbing heat and a hot side for releasing heat. In this embodiment, the cold end is at least partially disposed in the first recess, and the hot end is at least partially disposed in the second recess, so that the installation operation is more convenient and the installation efficiency is higher.
In some embodiments, referring to fig. 3 to 6, in order to protect the cold end and the hot end of the semiconductor refrigeration module, the cabinet 10 further includes a first cover 110 and a second cover 120, the first cover 110 is connected to the front surface of the board assembly 200 and covers the cold end, and the second cover 120 is connected to the back surface of the board assembly 200 and covers the hot end. It should be noted that the meaning of covering includes both contact covering and contactless covering.
In some embodiments, referring to fig. 5, the first cover 110 is flush with the front surface of the board assembly 200, and the second cover 120 is flush with the back surface of the board assembly 200. In other words, the first cover 110 does not protrude from the front surface of the board assembly 200, and the second cover 120 does not protrude from the back surface of the board assembly 200. Compared with the technical scheme that the semiconductor refrigeration module is directly installed on the back of the cabinet body and protrudes out of the back, the inner side surface and the outer side surface of the back of the cabinet body in the embodiment are both flat surfaces, and therefore the appearance of the inner side and the outer side of the cabinet body cannot be affected when the semiconductor refrigeration device is installed.
In some embodiments, referring to fig. 1 and 2, in order to improve the heat insulation performance at the joint, a heat insulation layer 231 is disposed around the through hole 230.
In some embodiments, the thermal insulation layer 231 has an L-shaped cross section so that the wall and the top/bottom surfaces of the through hole can be closely attached to the thermal insulation layer.
In some embodiments, referring to fig. 5 and 7, the semiconductor refrigeration module 300 includes a cold-side fin, a semiconductor refrigeration chip, a hot-side fin, and a fan, wherein the cold-side fin is installed at the cold side 310 of the semiconductor refrigeration module 300, the hot-side fin is installed at the hot side 320 of the semiconductor refrigeration module 300, the semiconductor refrigeration chip is located between the cold side 310 and the hot side 320, and the fan is located at a side of the hot-side fin away from the cold side. The cold end fins are used for transmitting cold to the inside of the cabinet body, and the hot end fins are used for dissipating heat to the outside of the cabinet body. Specifically, the cold end fins are cold aluminum fins, and the hot end fins are hot aluminum fins.
Specifically, a fixing plate and a sealing structure (such as sealing cotton) are arranged between the cold end fin and the hot end fin, the fixing plate is provided with a step surface, and the sealing structure is fixedly connected to the fixing plate. Referring to fig. 5, the L-shaped thermal insulation layer 231 (marked with black in fig. 5) can be seen as being composed of a horizontal bar-shaped thermal insulation structure and a vertical bar-shaped thermal insulation structure connected together. A heat insulating structure in a horizontal bar shape is disposed between the wall of the through hole 230 and one of the surfaces of the fixed plate step surface, and a heat insulating structure in a vertical bar shape is disposed between the other surface of the fixed plate step surface and the second groove 220. The L-shaped thermal insulation layer 231 is tightly filled around the through-hole 230.
The semiconductor refrigeration chip is used as a refrigeration source, is sealed by the sealing structure of the semiconductor refrigeration module 300, and is located in the middle of the sealing structure. The sealing structure is positioned between the cold end fin and the hot end fin, so that the semiconductor refrigeration chip is also positioned between the cold end fin and the hot end fin. The fan is used to dissipate heat from the hot-side fins, and thus the fan is located on the side of the hot-side fins remote from the cold end 310, i.e., between the hot-side fins and the second cover 120.
The semiconductor refrigeration chip, the cold end fin, the hot end fin and the fan are integrated into a modular structure, so that the elements do not need to be installed independently one by one. The mounting process of the semiconductor cooling device is obviously simplified.
In some embodiments, the second cover 120 is provided with an air inlet and an air outlet (not shown). The second cover 120 is located on the outer surface of the back of the cabinet, and an air inlet and an air outlet formed thereon are respectively used for sucking in outside air and discharging hot air to the outside, so as to maintain the refrigeration cycle inside and outside the cabinet.
A third aspect embodiment of the present invention provides a refrigeration apparatus having a cabinet body according to the previous embodiment. For the beneficial effects of the refrigeration equipment, please refer to the beneficial effects corresponding to the cabinet body of any of the foregoing embodiments, which are not described herein again.
While embodiments of the present invention have been shown and described, it will be understood by those of ordinary skill in the art that: various changes, modifications, substitutions and alterations can be made to the embodiments without departing from the principles and spirit of the invention, the scope of which is defined by the claims and their equivalents.
Claims (10)
1. The utility model provides a mounting structure of semiconductor refrigeration device, its characterized in that includes the board subassembly, first concave recess has been seted up on the front of board subassembly, second concave recess has been seted up on the back of board subassembly, first concave recess with the second concave recess is linked together with the through-hole, the through-hole is used for supplying the cold junction of semiconductor refrigeration device passes.
2. A cabinet, comprising:
a cabinet body having a back portion with the mounting structure for the semiconductor refrigeration device of claim 1; and
the cold end of the semiconductor refrigeration device is at least partially arranged in the first concave portion, and the hot end of the semiconductor refrigeration device is at least partially arranged in the second concave portion.
3. The cabinet according to claim 2, wherein the semiconductor refrigeration device is a semiconductor refrigeration modular structure.
4. The cabinet of claim 2, further comprising:
a first cover coupled to a front face of the plate assembly and covering the cold end; and
and the second cover is connected to the back surface of the plate assembly and covers the hot end.
5. The cabinet of claim 4, wherein the first cover is flush with a front face of the plate assembly and the second cover is flush with a back face of the plate assembly.
6. The cabinet according to claim 2, wherein a thermal insulation layer is provided around the through hole.
7. The cabinet according to claim 6, wherein the thermal insulation layer is L-shaped in cross section.
8. The cabinet of claim 3, wherein the semiconductor refrigeration modular structure comprises a semiconductor refrigeration chip, a cold end fin, a hot end fin, and a fan, wherein the cold end fin is located at the cold end, the hot end fin is located at the hot end, the semiconductor refrigeration chip is located between the cold end and the hot end, and the fan is located on a side of the hot end fin away from the cold end.
9. The cabinet according to claim 4, wherein the second cover has an air inlet and an air outlet.
10. Refrigeration device, characterized in that it comprises a cabinet according to any one of claims 2 to 9.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202020518487.3U CN212081759U (en) | 2020-04-09 | 2020-04-09 | Mounting structure, cabinet body and refrigeration plant of semiconductor refrigeration device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202020518487.3U CN212081759U (en) | 2020-04-09 | 2020-04-09 | Mounting structure, cabinet body and refrigeration plant of semiconductor refrigeration device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN212081759U true CN212081759U (en) | 2020-12-04 |
Family
ID=73594134
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202020518487.3U Active CN212081759U (en) | 2020-04-09 | 2020-04-09 | Mounting structure, cabinet body and refrigeration plant of semiconductor refrigeration device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN212081759U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113099667A (en) * | 2021-04-12 | 2021-07-09 | 铜陵市精方圆机械有限公司 | New energy automobile is with filling electric pile rack |
-
2020
- 2020-04-09 CN CN202020518487.3U patent/CN212081759U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113099667A (en) * | 2021-04-12 | 2021-07-09 | 铜陵市精方圆机械有限公司 | New energy automobile is with filling electric pile rack |
| CN113099667B (en) * | 2021-04-12 | 2022-08-09 | 铜陵市精方圆机械股份有限公司 | New energy automobile is with filling electric pile rack |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US7161803B1 (en) | Cooling system for an electronic display | |
| KR100689940B1 (en) | Drive device | |
| ES2253535T3 (en) | ELECTRICAL COOLING DEVICE. | |
| US7274569B2 (en) | Power conversion device | |
| WO2020034862A1 (en) | Camera | |
| KR101092396B1 (en) | Rergerrator for a vehicle | |
| CN212081759U (en) | Mounting structure, cabinet body and refrigeration plant of semiconductor refrigeration device | |
| WO2007054260A1 (en) | A refrigerator having an electronic display | |
| CN219320632U (en) | Infrared lens refrigeration structure | |
| KR200179768Y1 (en) | Cooling apparatus for a controller used thermoelectric cooling module | |
| CN115084683A (en) | Battery pack and power supply | |
| CN109425156B (en) | Liquid storage device assembly, compressor assembly and air conditioner | |
| CN208238320U (en) | Liquid storage device assembly, compressor assembly and air conditioner | |
| CN211429851U (en) | Waterproof heat radiation structure and ground station | |
| KR20020053838A (en) | Heat transfer apparatus using refrigerant and computer having the same | |
| KR102001029B1 (en) | Dissipation Module Using Peltier Devices With Diode Module On Connection Board For Solar Power Generation In Outer Case | |
| CN109362215B (en) | Air conditioner and heat dissipation electrical box thereof | |
| CN208425098U (en) | Processor radiator and electronic equipment | |
| KR20040061286A (en) | Hybrid heat exchanger having tec and heat pipe | |
| CN211044135U (en) | Server cooling system and server | |
| CN218417062U (en) | Heat conduction cold drawing, heat conduction integrated circuit board and quick-witted case | |
| CN219439664U (en) | Cold compress device | |
| CN220524328U (en) | Electric control part and air conditioner | |
| CN116406148B (en) | Energy storage equipment | |
| CN218764059U (en) | Heat radiation structure and semiconductor refrigeration system with same |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant |