CN107979948B - Heat dissipation system and network communication equipment - Google Patents
Heat dissipation system and network communication equipment Download PDFInfo
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- CN107979948B CN107979948B CN201711091602.2A CN201711091602A CN107979948B CN 107979948 B CN107979948 B CN 107979948B CN 201711091602 A CN201711091602 A CN 201711091602A CN 107979948 B CN107979948 B CN 107979948B
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- heat
- storage device
- heat dissipation
- liquid storage
- plastic
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20218—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant without phase change in electronic enclosures
- H05K7/20272—Accessories for moving fluid, for expanding fluid, for connecting fluid conduits, for distributing fluid, for removing gas or for preventing leakage, e.g. pumps, tanks or manifolds
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
- H05K7/20336—Heat pipes, e.g. wicks or capillary pumps
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
Abstract
The invention relates to a heat dissipation system and network communication equipment, which are used for dissipating heat of electronic elements to be dissipated in the equipment and comprise a heat dissipation unit, a plastic liquid storage device, heat conduction liquid and a heat conduction film; the heat dissipation unit is solid in appearance, is connected between the surface of the electronic element to be dissipated and the plastic liquid storage device, and is used for receiving heat from the electronic element to be dissipated and transmitting the heat to the plastic liquid storage device; the plastic liquid storage device is filled with heat conduction liquid, and the heat conduction liquid is used for receiving heat and transmitting the heat to the heat conduction film; the upper part of the heat conducting film is abutted against the shell of the connecting device, the lower part of the heat conducting film is abutted against the plastic liquid storage device, and the heat conducting film is used for receiving heat and transmitting the heat to the shell. According to the heat dissipation system, heat transfer is carried out through the heat conduction liquid and the heat conduction film in the plastic liquid storage device, the heat dissipation area is increased, the heat dissipation efficiency is improved, and the production cost is reduced.
Description
Technical Field
The present invention relates to the field of heat dissipation technologies, and in particular, to a heat dissipation system and a network communication device using the same.
Background
With the progress of the WIFI protocol, the performance of the network communication devices (wireless routers, wireless APs, etc.) is stronger and stronger, and the power consumption is larger and larger due to high power, high speed and intellectualization, meanwhile, the market demands for the network communication devices are more and more exquisite, and the size demands are smaller and smaller, so that the heat dissipation problem is more and more prominent, and many network communication devices derive more quality problems due to the heat problem.
Traditional cooling system mainly dispels the heat through the mode of solid fin and air convection, this kind of cooling system relies on the external environment seriously, thereby the through-hole that relies on the network communication equipment shell carries out the air convection with the external environment and reaches radiating purpose, nevertheless under network communication equipment shell miniaturization and exquisite condition, the air convection can become unobvious, the radiating efficiency is low, and the solid fin can become the irregularity because of matcing with the product shell, cause solid fin processing more and more complicated, thereby manufacturing cost has been increased.
Disclosure of Invention
Accordingly, there is a need for a heat dissipation system that can reduce the production cost and improve the heat dissipation efficiency.
In addition, the network communication equipment comprising the heat dissipation system is also provided.
A heat dissipation system is used for dissipating heat of an electronic element to be dissipated in equipment and comprises a heat dissipation unit, a plastic liquid storage device, heat conduction liquid and a heat conduction film;
the heat dissipation unit is solid in appearance, is connected between the surface of the electronic element to be dissipated and the plastic liquid storage device, and is used for receiving heat from the electronic element to be dissipated and transmitting the heat to the plastic liquid storage device;
the plastic liquid storage device is filled with the heat-conducting liquid, and the heat-conducting liquid is used for receiving the heat and transmitting the heat to the heat-conducting film;
the upper part of the heat-conducting film is in butt joint with a shell of the equipment, the lower part of the heat-conducting film is in butt joint with the plastic liquid storage device, and the heat-conducting film is used for receiving the heat and transmitting the heat to the shell.
In one embodiment, the plastic reservoir device includes a heat absorbing portion closely attached to the heat dissipating unit, a heat dissipating portion closely attached to the heat conductive film, and a flow guide portion communicating the heat absorbing portion and the heat dissipating portion to allow the heat absorbing portion and the heat dissipating portion to exchange liquid; the surface area of the heat dissipating part is larger than that of the heat absorbing part.
In one embodiment, the surface area of the heat absorbing part is matched with one surface of the heat dissipating unit contacting with the heat absorbing part.
In one embodiment, the device further comprises a heat conduction driving device, wherein the heat conduction driving device is connected with the plastic liquid storage device and can drive the heat conduction liquid to flow.
In one embodiment, the system further comprises a detection device, wherein the detection device is used for controlling whether the heat conduction driving device works or not according to a control signal.
In one embodiment, the thermally conductive drive comprises a drive liquid pump.
In one embodiment, the heat dissipation unit comprises a heat pipe.
In one embodiment, the plastic reservoir device comprises a plastic water bag and the thermally conductive liquid is high purity water.
On the other hand, the invention also provides network communication equipment, which comprises a shell, an electronic element to be radiated and the radiating system, wherein the electronic element to be radiated is arranged in the shell, and the radiating system is used for radiating the electronic element to be radiated through the shell.
In one embodiment, the network communication device is a router.
The heat dissipation system is used for dissipating heat of an electronic element to be dissipated in equipment and comprises a heat dissipation unit, a plastic liquid storage device, heat conducting liquid and a heat conducting film, wherein the heat dissipation unit receives heat from the electronic element to be dissipated and transmits the heat to the heat conducting liquid in the plastic liquid storage device; heat exchange is directly carried out between the shell and the external environment, so that the heat dissipation efficiency is further improved; the heat transfer is carried out through the heat conducting liquid in the plastic liquid storage device, the heat conducting liquid has natural flexibility, the structure of the shell can be well adapted without additional processing, and therefore the production cost is reduced.
Drawings
Fig. 1 is a schematic structural diagram of a heat dissipation system in an embodiment.
Detailed Description
To facilitate an understanding of the invention, the invention will now be described more fully with reference to the accompanying drawings. Preferred embodiments of the present invention are shown in the drawings. This invention may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete.
Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. The terminology used in the description of the invention herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. As used herein, the term "and/or" includes any and all combinations of one or more of the associated listed items.
Referring to fig. 1, fig. 1 is a schematic structural diagram of a heat dissipation system in an embodiment.
In the present embodiment, the heat dissipation system is used for dissipating heat of an electronic component 20 to be dissipated inside an apparatus, and includes a heat dissipation unit 30, a plastic liquid storage device 40, a heat conductive liquid 50, and a heat conductive film 60.
The heat dissipating unit 30 is solid in appearance, and the heat dissipating unit 30 is connected between the surface of the electronic component 20 to be dissipated and the plastic liquid storage device 40, and is configured to receive heat from the electronic component 20 to be dissipated and transfer the heat to the plastic liquid storage device 40.
In one embodiment, the heat dissipation unit 30 may be a heat pipe, a semiconductor cooler, a heat sink, or the like. The heat pipe has good thermal conductivity, is a connection junction between the surface of the electronic element 20 to be radiated and the plastic liquid storage device 40, on one hand, the heat pipe can be customized according to the electronic element 20 to be radiated, can be adjusted in size and length, and is convenient to be in good contact with the surface of the electronic element 20 to be radiated; on the other hand, the liquid in the heat pipe is impermeable, i.e. liquid-tight.
The plastic reservoir 40 is filled with a thermally conductive liquid 50, and the thermally conductive liquid 50 is configured to receive heat and transfer the heat from a higher level to a lower level and finally to the thermally conductive film 60. The plastic reservoir 40 has good flexibility to allow for shape retention according to the housing 70 of the device, while providing durability and complete sealing to prevent leakage.
The upper portion of the thermally conductive membrane 60 abuts the housing 70 of the connection device, the lower portion of the thermally conductive membrane 60 abuts the plastic reservoir 40, and the thermally conductive membrane 60 is adapted to receive heat and transfer the heat to the housing 70. The thermally conductive film 60 allows for better heat transfer to the housing 70, facilitating heat exchange between the housing 70 and the external environment.
The heat dissipation system is used for dissipating heat of an electronic component 20 to be dissipated inside equipment and comprises a heat dissipation unit 30, a plastic liquid storage device 40, heat conducting liquid 50 and a heat conducting film 60, wherein the heat dissipation unit 30 receives heat from the electronic component 20 to be dissipated and transmits the heat to the heat conducting liquid 50 in the plastic liquid storage device 40, the heat conducting liquid 50 transmits the heat to a shell 70 of the equipment through the heat conducting film 60 for heat dissipation, the upper part of the heat conducting film 60 of the heat dissipation system is in contact with the shell 70, and the lower part of the heat conducting film 60 is in contact with the plastic liquid storage device 40, so that the heat dissipation area is increased, and the heat dissipation efficiency is improved; the heat exchange is directly carried out between the shell 70 and the external environment, so that the air convection speed is increased, and the heat dissipation efficiency is further improved; the heat transfer is performed by the thermally conductive liquid 50 in the plastic reservoir device 40, and the natural flexibility of the thermally conductive liquid 50 is well adapted to the configuration of the housing 70 without additional processing, thereby reducing manufacturing costs.
In one embodiment, the plastic reservoir device 40 includes a heat absorbing portion closely attached to the heat dissipating unit 30, a heat dissipating portion closely attached to the heat conductive film 60, and a flow guide portion communicating the heat absorbing portion and the heat dissipating portion to allow liquid exchange between the heat absorbing portion and the heat dissipating portion; the surface area of the heat dissipating part is larger than that of the heat absorbing part. In one embodiment, the surface area of the heat sink portion matches the side of the heat dissipating unit 30 contacting the heat sink portion.
With continued reference to fig. 1, in an embodiment, the heat dissipation system further includes a heat conduction driving device 80, where the heat conduction driving device 80 is connected to the plastic liquid storage device 40, and is capable of driving the heat conduction liquid 50 in the plastic liquid storage device 40 to flow, so that heat can be transferred more quickly and more under the condition that the electronic component 20 to be dissipated generates heat, thereby increasing the heat conduction speed, quickly reducing the operating temperature of the electronic component 20 to be dissipated, and improving the heat dissipation efficiency under the condition that the small and delicate structure of the housing 70 is not changed.
In one embodiment, the thermal conduction driving device 80 can drive the thermal conduction liquid 50 to directionally flow in a clockwise or counterclockwise direction.
In one embodiment, the thermally conductive drive 80 includes a drive liquid pump.
In one embodiment, the electronic component 20 to be dissipated includes a CPU. In other embodiments, the electronic component 20 to be cooled comprises an integrated circuit, a chipset, or the like.
In one embodiment, the heat dissipation system further comprises a detection device (not shown) for controlling whether the thermal conduction driving device 80 is operated or not according to the control signal, and if the thermal conduction driving device 80 is operated, the thermal conduction liquid 50 in the plastic reservoir device 40 is driven to flow, otherwise, the thermal conduction driving device 80 cannot drive the thermal conduction liquid 50 in the plastic reservoir device 40 to flow.
In one embodiment, the plastic reservoir 40 includes a plastic water bag for storing liquid, which is flexible and can be shaped to fit the housing 70, while providing durability and complete sealing to prevent leakage.
In one embodiment, the thermally conductive liquid 50 comprises liquid water, such as high purity liquid water, and in other embodiments, the thermally conductive liquid 50 may be a liquid with a higher specific heat capacity, such as a nano-fluid, or a metal liquid mixed into high purity water to make the specific heat capacity higher, depending on the actual needs.
The plastic liquid storage device 40 filled with the heat conducting liquid 50 has strong shape plasticity, can shape according to an external structure, does not need strict requirements on an internal space like a solid radiating fin, and has natural flexibility of the heat conducting liquid 50, so that a radiating system can easily adapt to the original product structure without changing too much or even any change, and the product structure can be more exquisite and more miniaturized and meets the market requirements. The good mobility of heat conduction liquid 50 for the performance than the solid fin is more superior in the aspect of heat exchange, and the specific heat capacity itself of the liquid of heat conduction liquid 50 can be accomplished not poor than the solid fin according to actual need, under the condition that wait to dispel the heat electronic component 20 and generate heat, can walk the more fast more transfer of heat, thereby increase heat conduction speed, reduce the operating temperature of waiting to dispel the heat electronic component 20 fast, improve the radiating efficiency.
Referring to fig. 1, in another aspect, the present invention further provides a network communication device, which includes a housing 70, an electronic component 20 to be cooled disposed in the housing 70, and the cooling system of any of the above embodiments, which is configured to cool the electronic component 20 to be cooled through the housing 70.
In one embodiment, the network communication device further comprises a circuit board 10 and a heat-conducting driving control line 90, and the electronic component 20 to be cooled and the heat-conducting driving control line 90 are both mounted on the circuit board 10 and electrically connected to the circuit board 10. In one embodiment, the circuit board 10 is a Printed Circuit Board (PCB).
In one embodiment, the network communication device is a router. In one embodiment, the detection device can detect the operating state of the router, and control whether the heat conduction driving device 80 operates according to the operating state of the router, if the detection device detects that the router is in the operating state, the detection device controls the heat conduction driving device 80 to be in an open state, and then the heat conduction driving device 80 drives the heat conduction liquid 50 in the plastic liquid storage device 40 to flow; if the detection device detects that the router is in the closed state, the heat conduction driving device 80 is controlled to be in the closed state, so that the router enters a low power consumption state, and the power consumption of the router is further effectively reduced.
Because the network communication equipment uses the heat dissipation system to dissipate heat of the electronic element 20 to be dissipated through the shell 70, the heat exchange is directly carried out with the external environment through the shell 70, the air convection speed is increased, and the heat dissipation efficiency is improved; the heat transfer is performed by the thermally conductive liquid 50 in the plastic reservoir device 40, and the natural flexibility of the thermally conductive liquid 50 is well adapted to the configuration of the housing 70 without additional processing, thereby reducing manufacturing costs.
The technical features of the embodiments described above may be arbitrarily combined, and for the sake of brevity, all possible combinations of the technical features in the embodiments described above are not described, but should be considered as being within the scope of the present specification as long as there is no contradiction between the combinations of the technical features.
The above-mentioned embodiments only express several embodiments of the present invention, and the description thereof is more specific and detailed, but not construed as limiting the scope of the invention. It should be noted that, for a person skilled in the art, several variations and modifications can be made without departing from the inventive concept, which falls within the scope of the present invention. Therefore, the protection scope of the present patent shall be subject to the appended claims.
Claims (9)
1. A heat dissipation system is used for dissipating heat of an electronic element to be dissipated in equipment and is characterized by comprising a heat dissipation unit, a plastic liquid storage device, heat conduction liquid and a heat conduction film;
the heat dissipation unit is solid in appearance, is connected between the surface of the electronic element to be dissipated and the plastic liquid storage device, and is used for receiving heat from the electronic element to be dissipated and transmitting the heat to the plastic liquid storage device;
the plastic liquid storage device is good in flexibility, the plastic liquid storage device is filled with the heat conduction liquid, and the heat conduction liquid is used for receiving the heat and transmitting the heat to the heat conduction film;
the upper part of the heat conducting film is in butt joint with a shell of the equipment, the lower part of the heat conducting film is in butt joint with the plastic liquid storage device, and the heat conducting film is used for receiving the heat and transmitting the heat to the shell;
the heat dissipation system further comprises a heat conduction driving device, the heat conduction driving device is connected with the plastic liquid storage device and can drive the heat conduction liquid to flow, the plastic liquid storage device comprises a heat absorption part tightly attached to the heat dissipation unit, a heat dissipation part tightly attached to the heat conduction film, and a flow guide part which is communicated with the heat absorption part and the heat dissipation part to enable the heat absorption part and the heat dissipation part to exchange liquid.
2. The heat dissipating system of claim 1, wherein the surface area of the heat dissipating portion is greater than the surface area of the heat absorbing portion.
3. The heat dissipating system of claim 1, wherein the surface area of the heat absorbing portion matches a face of the heat dissipating unit contacting the heat absorbing portion.
4. The heat dissipation system of claim 1, further comprising a detection device for controlling whether the thermally conductive driver is operating based on a control signal.
5. The heat dissipating system of claim 1 or 4, wherein the thermally conductive actuator comprises an actuator pump.
6. The heat dissipating system of claim 1, wherein the heat dissipating unit comprises a heat pipe.
7. The heat dissipating system of claim 1, wherein the plastic reservoir comprises a plastic water bag and the thermally conductive liquid is high purity water.
8. A network communication device, comprising a housing and an electronic component to be heat-dissipated, wherein the electronic component is disposed in the housing, and further comprising the heat dissipation system according to any one of claims 1 to 7, the heat dissipation system being configured to dissipate heat from the electronic component to be heat-dissipated through the housing.
9. The network communication device of claim 8, wherein the network communication device is a router.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711091602.2A CN107979948B (en) | 2017-11-08 | 2017-11-08 | Heat dissipation system and network communication equipment |
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| Application Number | Priority Date | Filing Date | Title |
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| CN201711091602.2A CN107979948B (en) | 2017-11-08 | 2017-11-08 | Heat dissipation system and network communication equipment |
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| CN107979948A CN107979948A (en) | 2018-05-01 |
| CN107979948B true CN107979948B (en) | 2021-06-11 |
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| CN201711091602.2A Active CN107979948B (en) | 2017-11-08 | 2017-11-08 | Heat dissipation system and network communication equipment |
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Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN110086723B (en) * | 2019-04-25 | 2022-01-25 | 新华三技术有限公司 | Router |
| CN111615299B (en) * | 2020-05-15 | 2022-11-01 | 维沃移动通信有限公司 | Wireless charging seat |
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| US5411077A (en) * | 1994-04-11 | 1995-05-02 | Minnesota Mining And Manufacturing Company | Flexible thermal transfer apparatus for cooling electronic components |
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| CN204259347U (en) * | 2014-12-15 | 2015-04-08 | 刘婧妍 | A kind of Vehicular charger liquid metal self adaptation thermal drivers heat abstractor |
| CN204948617U (en) * | 2015-10-08 | 2016-01-06 | 奇鋐科技股份有限公司 | Water cooling plant |
| CN106255365A (en) * | 2016-08-22 | 2016-12-21 | 维沃移动通信有限公司 | A kind of shell structure and mobile terminal |
| CN206042666U (en) * | 2016-09-27 | 2017-03-22 | 北京态金科技有限公司 | Integral liquid metal heat transfer plate |
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