CN110086723B

CN110086723B - Router

Info

Publication number: CN110086723B
Application number: CN201910339775.4A
Authority: CN
Inventors: 李琳
Original assignee: New H3C Technologies Co Ltd
Current assignee: New H3C Information Technologies Co Ltd
Priority date: 2019-04-25
Filing date: 2019-04-25
Publication date: 2022-01-25
Anticipated expiration: 2039-04-25
Also published as: CN110086723A

Abstract

The application provides a router. The router comprises a router body; and the phase change heat dissipation part comprises a phase change material and an outer packaging shell for packaging the phase change material, the phase change heat dissipation part is contacted with the router body, the phase change material absorbs heat emitted by the router body and changes phase when reaching a phase change temperature, and the phase change material exchanges heat with the outside after the phase change. In the scheme, heat exchange of the router body is realized by heat absorption and heat dissipation of the phase change heat dissipation piece, and the phase change material in the phase change heat dissipation piece can absorb and release a large amount of latent heat, so that the router body can actively and quickly dissipate heat.

Description

Router

Technical Field

The application relates to the technical field of communication equipment, in particular to a router.

Background

With the wide application of intelligent household equipment, the use frequency of an intelligent router is greatly increased, and the router is an important component of a computer network and mainly serves for connection among networks.

At present, people demand for high network speed is increasingly large, and the high calorific value problem of the device on the router mainboard is serious, wherein, the device with larger calorific value includes: CPU, WIFI chip, power chip etc. under the condition of high-speed operation, if can not distribute away the heat in time, cause phenomena such as machine operation unstability, crash or restart very easily, and then lead to defects such as user experience is felt poor, product life is short, consequently, the calorific capacity too big problem of router awaits a urgent need to be solved.

Disclosure of Invention

In view of this, the present application provides a router, which can realize rapid heat dissipation.

Specifically, the method is realized through the following technical scheme:

a router, comprising:

a router body; and

the phase change heat dissipation part comprises a phase change material and an outer packaging shell for packaging the phase change material, the phase change heat dissipation part is in contact with the router body, the phase change material absorbs heat emitted by the router body and changes phase when reaching phase change temperature, and the phase change material exchanges heat with the outside after the phase change.

Optionally, the router body includes a housing, the housing is provided with heat dissipation holes, and the phase change heat dissipation member is disposed in the housing and exchanges heat with the outside through the heat dissipation holes.

Optionally, the phase-change heat dissipation element further includes an outer packaging shell packaged in the phase-change material, the router body further includes a main board arranged in the outer shell, one end of the phase-change heat dissipation element is in contact with the main board, and the other end of the phase-change heat dissipation element is in contact with the outer shell.

Optionally, one end of the phase change heat dissipation member is in contact with the main board, and the other end of the phase change heat dissipation member extends towards the heat dissipation hole and is in contact with the housing.

Optionally, the phase change heat sink further includes a heat conduction connector connected to the outer package casing, and the heating region of the motherboard transfers heat to the phase change material through the heat conduction connector.

Optionally, the router further includes a flexible heat conduction member, one side of the flexible heat conduction member is attached to the heating area of the motherboard, and the other side of the flexible heat conduction member is attached to the heat conduction connection member.

Optionally, the phase-change heat sink further includes a capillary conduction structure disposed in the outer package shell, and the capillary conduction structure enables the phase-change material to be transferred from the condensation end to the heat source end when the phase-change material is lower than the phase-change temperature.

Optionally, the capillary conductive tissue is woven from metal wires.

Optionally, the outer package casing is formed into a low-pressure state by vacuum pumping.

Optionally, the outer package shell is a flexible outer package shell, and the phase-change heat dissipation member is a flexible member.

Optionally, the flexible outer enclosure is made of a metal film.

The technical scheme provided by the application can achieve the following beneficial effects:

the application provides a router, including the phase transition radiating part, the phase change material of phase transition radiating part can absorb the heat that the router body sent to take place the phase transition when reaching phase transition temperature, the phase change material after taking place the phase transition carries out the heat exchange with the external world, releases the heat. In the scheme, heat exchange of the router body is realized by heat absorption and heat dissipation of the phase change heat dissipation piece, and the phase change material in the phase change heat dissipation piece can absorb and release a large amount of latent heat, so that the router body can actively and quickly dissipate heat.

Drawings

FIG. 1 is an exploded view of a router shown in an exemplary embodiment of the present application;

fig. 2 is a cross-sectional view of a phase-change heat sink shown in an exemplary embodiment of the present application.

Detailed Description

Reference will now be made in detail to the exemplary embodiments, examples of which are illustrated in the accompanying drawings. When the following description refers to the accompanying drawings, like numbers in different drawings represent the same or similar elements unless otherwise indicated. The embodiments described in the following exemplary embodiments do not represent all embodiments consistent with the present application. Rather, they are merely examples of apparatus and methods consistent with certain aspects of the present application, as detailed in the appended claims.

The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the application. Unless defined otherwise, technical or scientific terms used herein shall have the ordinary meaning as understood by one of ordinary skill in the art to which this invention belongs. The use of "first," "second," and similar terms in the description and claims of this application do not denote any order, quantity, or importance, but rather the terms are used to distinguish one element from another. Also, the use of the terms "a" or "an" and the like do not denote a limitation of quantity, but rather denote the presence of at least one. "plurality" or "a number" means two or more. Unless otherwise specified, "front", "back", "lower" and/or "upper", "top", "bottom", and the like are for ease of description only and are not limited to one position or one spatial orientation. The word "comprising" or "comprises", and the like, means that the element or item listed as preceding "comprising" or "includes" covers the element or item listed as following "comprising" or "includes" and its equivalents, and does not exclude other elements or items. The terms "connected" or "coupled" and the like are not restricted to physical or mechanical connections, but may include electrical connections, whether direct or indirect.

Referring to fig. 1, the present application provides a router 10, which enables active and fast heat dissipation of the router 10.

Specifically, the router 10 includes a router body 11, the router body 11 includes a front shell 110, a rear shell 112, a main board 114, and the like, the front shell 110 and the rear shell 112 together form an outer shell of the router body 10, the front shell 110 and the rear shell 112 cover and form an accommodating cavity therein, and the main board 114 and the like are disposed in the accommodating cavity.

The main board 114 includes a power chip, a WIFI chip, a CPU, and the like, and the power chip, the WIFI chip, and the CPU are main heat sources of the router body 11. In one embodiment, the router body 11 may be provided with heat dissipation holes 116, and the heat dissipation holes 116 may allow heat exchange between heat generating components of the router body 11 and the outside. The heat dissipation apertures 116 may be disposed in a housing, such as the front housing 110 and/or the rear housing 112.

In particular, the router 10 provided herein further includes a phase change heat sink 12, where the phase change heat sink 12 may help the router body 11 to achieve rapid heat dissipation. Specifically, the phase-change heat sink 12 includes an outer packaging shell 120 (refer to fig. 2) and a phase-change material packaged in the outer packaging shell 120, wherein the phase-change heat sink 12 is in contact with the router body 11, the phase-change material can absorb heat emitted by the router body 11 and undergoes phase change when reaching a phase-change temperature, and the phase-change material after undergoing phase change exchanges heat with the outside to release the heat generated by the router body 11.

As can be seen from the above description, the phase-change heat sink 12 can transfer heat generated by the router body 11, and since the phase-change material can absorb and release a large amount of latent heat, active and rapid heat dissipation of the router body 11 is achieved.

The phase change material is not limited by the application, and in one embodiment, the phase change material may be a solid-liquid phase change material; in another embodiment, the phase change material may be a liquid-gas phase change material.

Taking the case that the phase-change material is a liquid-gas phase-change material, the phase-change material is in a liquid state when the temperature is lower than the phase-change temperature, the temperature of the liquid phase-change material rises after absorbing the heat of the router body 11, the liquid phase-change material is converted into a gas phase-change material when the temperature is higher than the phase-change temperature, at this time, the gas phase-change material releases the heat and the temperature drops through heat exchange with the outside, the gas phase-change material can be converted into the liquid phase-change material again when the temperature of the gas phase-change material drops below the phase-change temperature, and the above cycle is repeated, so that the active heat dissipation of the router body 11 is realized.

In alternative embodiments, the phase change heat sink 12 may be disposed outside the router body 11, for example, the phase change heat sink 12 is disposed outside the router body 11 in contact with an outer wall of the router body 11. As another example, the phase change heat sink 12 may also be disposed inside the router body 11, i.e., within the housing.

In this embodiment, the parts with large heat productivity are the power chip, the WIFI chip and the CPU of the motherboard 114, therefore, in the preferred embodiment, the phase change heat sink 12 is selectively disposed inside the router body 11, and the phase change heat sink 12 exchanges heat with the outside through the heat dissipation hole 116 disposed on the housing, so as to achieve rapid heat dissipation.

In a specific embodiment, the phase-change heat sink 12 is disposed inside the router body 11, one end of the phase-change heat sink is directly contacted with the heating area of the motherboard 114, and the other end of the phase-change heat sink is contacted with the housing, so that heat generated by the heating area of the motherboard 114 can be directly transferred to the phase-change heat sink 12, the phase-change heat sink 12 can reach the phase-change temperature quickly, the heat transfer efficiency is improved, and quick heat dissipation is realized. The "heat generation area" referred to herein refers to an area where the power supply chip, the WIFI chip, and the CPU are located.

Further, in order to realize rapid cooling after the phase change of the phase change heat sink 12, one end of the phase change heat sink 12 may be in contact with the main board 114, and the other end of the phase change heat sink 12 may extend toward the heat dissipation hole 116 to be in contact with the housing. After the arrangement, the air circulation rate at the heat dissipation holes 116 is high, which is beneficial to the rapid temperature reduction of the phase change material near the heat dissipation holes 116, thereby releasing heat rapidly and further improving the heat dissipation efficiency.

When a liquid-vapor phase change material is used, in this case, the phase-change heat sink 12 may further include capillary conductive structures 122 disposed inside the outer packaging shell 120, and the capillary conductive structures 122 may reduce the conductive impedance of the liquid phase change material to generate better capillary conductive suction force, so that the liquid phase change material is transmitted from the condensation end to the heat source end when the temperature of the liquid phase change material is lower than the phase change temperature. The "heat source side" herein refers to an end of the phase change heat sink in contact with the heat generating region, and the "condensation side" refers to an end of the phase change heat sink in contact with the case.

The specific structure of the capillary conductive tissue 122 can be selected according to actual requirements. In this embodiment, referring to fig. 2, the capillary conductive tissue 122 is woven by metal wires, and the dense and hemp capillary conductive tissue 122 is fully distributed inside the outer packaging shell 120. At the heat source end, the liquid phase change material in the phase change heat sink 12 absorbs heat and vaporizes (absorbs heat), and the gaseous phase change material diffuses through the gap 124 inside the outer package shell 120 in a direction away from the heat source end, bringing the heat away from the heat source end. When the temperature of the gas phase-change material far away from the heat source end is reduced, the gas phase-change material is liquefied (releases heat), and the liquid phase-change material far away from the heat source end is transferred to the heat source end under the action of the capillary conduction tissue 122 inside the outer packaging shell 120, so that the rapid release of the heat is cyclically and continuously realized.

Alternatively, the capillary conductive tissue 122 may be fixed within the outer packaging shell 120 by means of welding, but is not limited thereto.

In addition, when the phase change material is a liquid-gas phase change material, in order to reduce the boiling point of the liquid phase change material, the interior of the outer packaging shell 120 may be evacuated, so that the interior of the outer packaging shell 120 is in a low-pressure state, thereby reducing the boiling point of the liquid phase change material, realizing the transition of the phase change material from a liquid state to a gas state at a certain preset temperature, and avoiding the boiling of the liquid phase change material at the heat source end.

The outer packaging shell 120 is used for packaging the phase change material, and the outer packaging shell 120 may be configured as a flexible outer packaging shell, so that the flexible outer packaging shell may be bent or deformed appropriately according to actual needs, and at this time, the phase change heat sink 12 is a flexible element. In practical applications, the phase-change heat sink 12 may be bent into a desired shape according to a space environment, and it is also understood that the phase-change heat sink 12 may be bent to avoid interference with components in the router body 11. In this example, the phase-change heat sink 12 may be extended toward one side of the heat dissipation hole 116 by bending, and so on.

As an example, the outer package shell 120 may be made of a metal film, for example, a silver metal film with good heat conduction and dissipation effects may be used, and such outer package shell 120 may be bent into a desired shape according to the requirement, and may also maintain the desired shape, which is beneficial for achieving the shaping of the phase change heat sink 12.

In order to make the phase change heat sink 12 fully contact with the heat generating region of the main board 114, the phase change heat sink 12 may further include a heat conductive connector, the heat conductive connector is connected to the outer package cover 120, and heat of the heat generating region of the main board 114 may be rapidly transferred to the phase change material through the heat conductive connector.

On one hand, the area of the heat conducting connecting piece can be relatively large, so that the heat conducting connecting piece covers most of the heating area with large heating amount on the mainboard 114, and meanwhile, the heat conducting connecting piece can also have high heat conductivity coefficient and high heat transfer efficiency.

In practical application, the heat conducting connector can be made of a material with a high coefficient of heat conductivity of copper sheets and aluminum sheets, and in addition, the heat conducting connector and the outer packaging shell 120 can be fixed in a welding mode, a riveting mode and the like. However, it should be understood by those skilled in the art that the material of the thermal conductive connector and the manner of fixing the thermal conductive connector to the outer package housing 120 are not limited to the above-described embodiments, and other embodiments may be chosen.

Further, the router 10 may further include a flexible heat conduction member 13, and one side of the flexible heat conduction member 13 is attached to the heat generating region of the motherboard 114, and the other side is attached to the heat conduction connection member. The flexible heat conduction member can reduce the risk that the heat conduction connecting member and the main board 114 cannot be tightly attached due to manufacturing errors of the heat conduction connecting member and the main board 114, and further improve the efficiency of heat conduction.

In this embodiment, the flexible heat conduction member is made of heat conductive silica gel. The heat conduction silica gel has high heat conductivity coefficient and elasticity, and can be deformed by extrusion so as to increase the fitting degree of the heat conduction connecting piece and the mainboard 114 and reduce the contact gap, thereby ensuring effective heat transfer between the heating area of the heat conduction connecting piece and the mainboard 114.

The above description is only exemplary of the present application and should not be taken as limiting the present application, as any modification, equivalent replacement, or improvement made within the spirit and principle of the present application should be included in the scope of protection of the present application.

Claims

1. A router, comprising:

a router body (11); and

a housing provided with a heat dissipation aperture (116);

a phase change heat sink (12), the phase change heat sink (12) comprising a phase change material and an outer enclosure (120) enclosing the phase change material, and the outer packaging shell (120) comprises capillary conductive tissue (122) arranged in the outer packaging shell (120), when the phase-change material is lower than the phase-change temperature, the phase-change material is transmitted to a heat source end of the phase-change heat dissipation piece (12) which is in contact with the heating area from a condensation end of the phase-change heat dissipation piece (12) which is in contact with the shell, and the phase-change material which is far away from the heat source end and is subjected to phase change is transferred to the heat source end to realize the cyclic heat release, one end of the phase change heat dissipation member is kept in contact with the router body (11), the other end of the phase change heat dissipation member extends towards the heat dissipation hole (116), the phase-change material is contacted with the shell, absorbs heat emitted by the router body (11), and changes phase when reaching a phase-change temperature, and the phase-change material after phase change exchanges heat with the outside through the heat dissipation hole (116).

2. The router according to claim 1, wherein the router body (11) further comprises a main board (114) disposed within the housing, one end of the phase-change heat sink (12) being in contact with the main board (114).

3. The router of claim 2, wherein the phase change heat sink (12) further comprises a thermally conductive connector connected to the outer enclosure (120), the heat generating region of the motherboard (114) transferring heat to the phase change material through the thermally conductive connector.

4. A router according to claim 3, characterized in that the router (10) further comprises a flexible heat conducting member, one side of which is attached to the heat generating area of the motherboard (114) and the other side of which is attached to the heat conducting connector.

5. The router of claim 1, wherein the capillary conductive tissue (122) is woven from wire.

6. The router of claim 1, wherein the outer enclosure (120) is formed to a low pressure state by evacuation.

7. A router according to claim 1, wherein the outer package (120) is provided as a flexible outer package and the phase change heat sink is a flexible element.

8. The router of claim 7, wherein the flexible outer enclosure is made of a metal film.