CN109195402B

CN109195402B - Heat abstractor and check out test set

Info

Publication number: CN109195402B
Application number: CN201810933117.3A
Authority: CN
Inventors: 郭明坤
Original assignee: Vinno Technology Suzhou Co Ltd
Current assignee: Feiyinuo Technology Co ltd
Priority date: 2018-08-16
Filing date: 2018-08-16
Publication date: 2020-08-04
Anticipated expiration: 2038-08-16
Also published as: CN109195402A

Abstract

The application relates to a heat dissipation device and detection equipment. The detection device comprises a shell, a chip and a heat dissipation device. The housing is sealed. The chip is arranged in the shell. The heat dissipation device comprises a heat dissipation piece, and the heat dissipation piece is provided with a heat receiving part and a heat dissipation part which are mutually connected. The heat receiving part is connected with the chip, and the heat radiating part is arranged outside the shell. According to the heat dissipation device, the chip of the detection equipment can be connected through the heat receiving part of the heat dissipation piece, and therefore heat on the chip is directly conducted to the heat receiving part of the heat dissipation piece; then, the heat is conducted to the heat radiating part connected with the heat receiving part through the heat receiving part; finally, the heat dissipation part arranged outside the detection equipment dissipates heat to the outside of the detection equipment, so that the temperature of a chip of the detection equipment is reduced, and the service life of the detection equipment is prolonged.

Description

Heat abstractor and check out test set

Technical Field

The application relates to the technical field of detection, in particular to a heat dissipation device and detection equipment.

Background

With the development of detection technology, various detection settings are applied to various industries, so that people can conveniently judge various information.

Some of the related art inspection apparatuses employ a chip with high power consumption for high quality requirements. The high power consumption introduced when these detection devices are operating can generate a significant amount of heat. Meanwhile, the above devices often need to arrange the chip in a sealed housing, so that the device has waterproof and dustproof functions.

But the sealed enclosure cannot be vented to dissipate heat. The detection equipment can cause the chip load to be too large and even damage the chip due to the fact that the temperature of the chip is too high. The service life of the detection device is thus reduced.

Disclosure of Invention

In view of the above, it is necessary to provide a heat dissipation device capable of effectively dissipating heat from a detection device in order to solve the technical problem that the sealed housing cannot dissipate heat.

Simultaneously, this application still provides a check out test set that can effectively dispel the heat.

The heat dissipation device comprises a heat dissipation piece, wherein the heat dissipation piece is provided with a heat receiving portion and a heat dissipation portion which are connected with each other, the heat receiving portion is used for being connected with a chip of the detection equipment, and the heat dissipation portion is used for dissipating heat outside the detection equipment.

In one embodiment, the heat receiving part comprises a first shell, the heat radiating part comprises a second shell, the first shell is communicated with the interior of the second shell and encloses a liquid storage cavity, working liquid is contained in the liquid storage cavity, and the working liquid is sealed in the liquid storage cavity.

In one embodiment, the heat dissipating device further comprises a cooling assembly facing at least a portion of the heat dissipating portion.

In one embodiment, the cooling assembly includes a fan facing the heat sink.

In one embodiment, the cooling assembly further includes a heat dissipation case having an opening and a printed circuit board, the heat dissipation case wraps at least a portion of the heat dissipation portion, the printed circuit board and the fan are located in the heat dissipation case, and the printed circuit board is electrically connected to the fan.

In one embodiment, the cooling assembly includes a diffuser member that connects the heat sink members.

In one embodiment, the heat dissipation part comprises at least one fin and is connected to the heat dissipation part in a surrounding manner.

In one embodiment, the heat dissipation device further includes a wire for electrically connecting the chip, and the wire and the heat dissipation member are wrapped together.

In one embodiment, the conductive line includes a conductive line and an insulating layer covering the conductive line.

A detection device comprises a shell, a chip and any one of the heat dissipation devices, wherein the shell is sealed, the chip is arranged in the shell, the heat receiving part is connected with the chip, and the heat dissipation part is arranged outside the shell.

The heat dissipation device can be connected with a chip of the detection equipment through the heat receiving part of the heat dissipation part, so that the heat on the chip is directly conducted to the heat receiving part of the heat dissipation part; then, the heat is conducted to the heat radiating part connected with the heat receiving part through the heat receiving part; finally, the heat dissipation part arranged outside the detection equipment dissipates heat to the outside of the detection equipment, so that the temperature of a chip of the detection equipment is reduced, and the service life of the detection equipment is prolonged.

Drawings

FIG. 1 is a perspective view of a detection apparatus in one embodiment;

FIG. 2 is an exploded view of the inspection apparatus shown in FIG. 1 from another angle;

FIG. 3 is a cross-sectional view of the detection apparatus shown in FIG. 1.

Reference numerals:

1-chip; 2-a housing; 21-upper shell; 22-a lower shell; 3-a heat sink; 31-a heat sink; 311-a heat-transfer part; 312-a heat sink; 32-a cooling assembly; 321-a fan; 322-heat dissipation chassis; 3221-inlet hole; 3222-air outlet; 323-printed circuit board; 324-a diffuser; 3241-Qi pian.

Detailed Description

In order to make the objects, technical solutions and advantages of the present application more apparent, the present application is described in further detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the present application and are not intended to limit the present application.

The heat dissipation device provided by the application can be applied to various detection devices. Various inspection apparatuses include an inspection apparatus in which a chip is disposed in a sealed housing so as to have a waterproof and dustproof function, such as a medical ultrasonic diagnostic apparatus. Due to the demand for high-quality images, medical ultrasonic diagnostic apparatuses employ high-channel, high-power-consumption chips. A chip with high power consumption generates a large amount of heat. Meanwhile, the medical ultrasonic diagnostic apparatus also needs to be disinfected and cleaned regularly. Therefore, the chip of the medical ultrasonic diagnostic apparatus needs to be disposed in a sealed housing so as to have waterproof and dustproof functions.

In one embodiment, as shown in fig. 1-2, the detection apparatus includes a chip 1, a housing 2, and a heat sink 3.

Referring to fig. 3, a chip 1 is disposed within a housing 2. The housing 2 may specifically include an upper case 21 and a lower case 22, and the housing 2 is sealed after the upper case 21 and the lower case 22 are assembled. Of course, the sealed housing 2 may take other forms.

Referring to fig. 1, the heat sink 3 includes a heat sink 31. The heat sink 31 has a heat receiving portion 311 and a heat radiating portion 312 connected to each other. Heat-connecting portion 311 is for connecting chip 1. The heat dissipation portion 312 is used to dissipate heat to the outside of the detection apparatus. When the heat sink 3 is assembled to the inspection apparatus, referring to fig. 3, the heat receiving portion 311 is connected to the chip 1. The heat dissipation portion 312 is disposed outside the housing 2, and further dissipates heat to the outside of the detection apparatus. The specific connection method of the heat-connecting portion 311 and the chip 1 may be various methods such as screw locking, soldering, etc., which is not limited in this application.

When the detection device is in operation, since the heat-receiving portion 311 is connected to the chip 1, the heat on the chip 1 can be directly conducted to the heat-receiving portion 311. Then, since heat radiating portion 312 and heat receiving portion 311 are connected to each other, heat on heat receiving portion 311 is conducted to heat radiating portion 312. Finally, since the heat dissipation portion 312 is disposed outside the housing 2, the heat is dissipated to the environment outside the detection device after being heated, so as to reduce the temperature of the chip 1 of the detection device and prolong the service life of the detection device.

The heat sink 31 may be configured like a heat pipe, which may have a reservoir (not shown) and a working fluid (not shown) sealed inside the reservoir. Specifically, the heat receiving portion 311 of the heat sink 31 includes a first housing, and the heat dissipating portion 312 includes a second housing. The first shell and the second shell are communicated with each other and enclose a liquid storage cavity, and working liquid is arranged in the liquid storage cavity. When the detection device is operated, the chip 1 continuously generates heat, and the working liquid in the shell of the heat dissipation member 31 connected with the chip is heated. The heated working liquid is vaporized and flows toward the cold end of the heat sink 31 (i.e., the end of the heat sink 312). According to the condensation and liquefaction principle, the vaporized working liquid is condensed into liquid after being cooled at the cold end, and heat is released at the same time. The re-condensed working fluid returns to the hot end of the heat sink 31 (i.e. one end of the connection portion 311) to continue to absorb heat and vaporize, and then circulates in turn, and the temperature of the chip of the device is continuously reduced. The heat sink 31 is heated by the working fluid in the heat sink, and then condensed, liquefied and released heat, so that the heat dissipation speed of the heat sink 31 is effectively increased, and the heat dissipation efficiency is improved.

The working fluid may be, but is not limited to, purified water. Heat sink 31 may also include a wick. Before the heat sink 31 is used, the casing may be pumped to negative pressure, and then the casing may be filled with a proper amount of working fluid. The working liquid fills the liquid absorption core (capillary porous material) close to the inner wall of the shell body with the liquid, and then the shell body is sealed. When the working liquid reaches the cold end after being heated, the working liquid flows back to the hot end along the porous material under the action of capillary force. The heat sink 31 may not include a wick therein. When the detection device works, if the heat dissipation member 31 is placed in the vertical direction, the backflow of the working liquid can be satisfied by gravity, and a wick with a capillary porous structure is not needed.

Of course, the form of the heat sink 31 of the present application is not limited to the above form, and it may be a hollow housing, or even a solid housing. Since the heat dissipation portion 312 of the heat dissipation member 31 extends beyond the outer case 2, the heat dissipation member 31 can improve heat dissipation to some extent even if it includes only a hollow or solid case.

In one embodiment, referring to fig. 1 and 2, the heat sink 3 may further include a cooling assembly 32. The cooling member 32 faces at least a part of the heat dissipating part 3, and can rapidly reduce the temperature of the part of the heat dissipating part 3, thereby increasing the speed of transferring heat on the chip 1 to the part of the heat dissipating part 3. Therefore, the cooling assembly 32 can accelerate the heat dissipation of the chip 1, and improve the heat dissipation efficiency.

In one embodiment, the cooling assembly 32 may specifically include a fan 321. The fan 321 blows air to the heat dissipating portion 3, so that heat exchange between the cold air flow in the air and the corresponding heat dissipating portion 3 can be accelerated, and the heat dissipating speed can be increased.

In one embodiment, to facilitate placement and driving of the fan 321, the cooling assembly 32 may also include an open-celled heat sink chassis 322 and a printed circuit board 323. When the printed circuit board 323 and the fan 321 are both located in the heat dissipation case 322. The printed circuit board 323 is electrically connected to the fan 321, and provides a driving signal thereto.

The opening of the heat dissipation case 322 is used to provide cool air to the fan 321 and to exhaust the hot air exchanged with the cool air. Specifically, the openings on the heat dissipation case 322 may include an air inlet aperture 3221 and an air outlet aperture 3222, which are disposed opposite to each other. The air inlet holes 3221 are used for flowing cold air into the heat dissipation case 322, and the air outlet holes 3222 are used for discharging hot air from the heat dissipation case 322. Of course, the opening pattern of the heat sink housing 322 may be different.

The heat sink chassis 322 may cover a portion of the heat sink 312. Specifically, the heat sink 312 may penetrate the heat sink case 322. At this time, a portion of the heat dissipating part 312 inside the heat dissipating case 322 may be located between the fan 321 and the air outlet 3222, and the fan 321 faces the portion of the heat dissipating part 312 inside the heat dissipating case 322. Alternatively, the end of the heat sink 312 may be located inside the heat sink case 322 without passing through. Of course, the heat sink housing 322 may cover the entire heat sink portion 312.

In the embodiment of the present application, the fan 321 and the pcb 323 driving the fan 321 may be disposed on another other component instead of the heat dissipation case 322. The fan 321 may be driven by a power supply to directly control a switch of the fan 321 without providing the printed circuit board 323. This is not to be unduly limited by this application.

In the embodiment of the present application, the cooling module 32 may also adopt other cooling methods besides the cooling by the fan 321. For example, ice cubes or cooling water are placed in the heat sink case 322. The ice cubes or the cooling water directly or through other components contact the heat dissipating part 312, and thus cool the corresponding part of the heat dissipating part 312 by means of heat conduction.

In one embodiment, the cooling assembly 32 may also include a diffuser 324. The diffuser 324 is connected to the heat dissipation portion 312, so that heat of the heat dissipation portion 312 is dissipated to the whole diffuser 324, thereby facilitating rapid heat dissipation. When the fan 321 and the diffusion member 324 coexist, the heat dissipation part 312 may be located between the fan 321 and the diffusion member 324.

In one embodiment, the diffuser 324 includes at least one Qi-tab 3241. The diffuser 324 may be attached to the outer surface of the heat sink 31 in a surrounding manner such that the contact area of the diffuser 324 with the heat sink 31 is relatively large. The diffuser 324 and the heat sink 31 may be connected by welding, which is not limited in this application. The at least one convex fin 3241 can further increase the heat diffusion area, and is more favorable for rapid heat dissipation. The specific number of the Qi-slices 3241 can be set according to actual needs.

When the detection equipment works normally, the chip 1 needs to provide electric signal input for the detection equipment through a lead. Therefore, in one embodiment, the heat dissipation device 3 may further include a wire electrically connected to the chip 1. The lead and the heat sink 31 are coated together, so that the structure of the detection device is simplified, and the application of the detection device is facilitated. When the detection device works, the heat dissipation member 31 has a relatively high temperature due to contact with the chip 1, so that in practical application, the heat dissipation member 31 and the lead are coated by using a heat-resistant material, and the heat dissipation member 31 is prevented from being damaged due to high temperature. Of course, when the temperature of the heat sink 31 is not too high during the operation of the detection device, the heat sink 31 and the wire coating material may be made of common materials.

In one embodiment, the conductive line includes a conductive line and an insulating layer covering the conductive line. The insulating layer effectively insulates the conductor wire on the one hand, and safety accidents are avoided. On the other hand, the insulating layer can also effectively isolate the conductive wires from the heat dissipation member 31, so as to prevent the conductive wires from being aged due to relatively high temperature on the heat dissipation member 31.

In the embodiment of the present application, the detection apparatus may include the heat dissipation device 3 during manufacturing, or the heat dissipation device 3 may be assembled at a later stage. The lead wires may not be coated with the heat sink 31 during the manufacturing process of the detection apparatus, i.e. when the heat sink 3 is included. The heat sink 3 later assembled to the inspection apparatus may not include a wire; alternatively, when the heat dissipation device 3 includes a wire electrically connected to the chip 1, the wire may not be covered with the heat dissipation member 31.

To sum up, the heat dissipation device that this application provided includes the radiating piece, and the radiating piece has interconnect's heat-receiving portion and radiating part. The heat receiving part is connected with a chip of the detection equipment, and then heat on the chip is directly absorbed. The heat dissipation part is connected with the heat receiving part and is located outside the shell of the detection equipment, so that heat on the absorbed chip can be dissipated outside the detection equipment, and the chip is effectively cooled.

The technical features of the above embodiments can be arbitrarily combined, and for the sake of brevity, all possible combinations of the technical features in the above embodiments are not described, but should be considered as the scope of the present specification as long as there is no contradiction between the combinations of the technical features.

The above-mentioned embodiments only express several embodiments of the present application, and the description thereof is more specific and detailed, but not construed as limiting the scope of the invention. It should be noted that, for a person skilled in the art, several variations and modifications can be made without departing from the concept of the present application, which falls within the scope of protection of the present application. Therefore, the protection scope of the present patent shall be subject to the appended claims.

Claims

1. A heat dissipation device is applied to detection equipment and is characterized by comprising a heat dissipation piece, wherein the heat dissipation piece is provided with a heat receiving part and a heat dissipation part which are connected with each other, the heat receiving part is used for being connected with a chip of the detection equipment, and the heat dissipation part is used for dissipating heat to the outside of the detection equipment;

the heat radiation part is an integrated structural part with a liquid storage cavity, and the heat receiving part and the heat radiation part are two connected components of the heat radiation part at different positions;

the heat receiving part comprises a first shell, the heat radiating part comprises a second shell, the first shell is communicated with the interior of the second shell and surrounds a liquid storage cavity, working liquid is arranged in the liquid storage cavity, and the working liquid is sealed in the liquid storage cavity;

the heat dissipation device further includes a cooling assembly facing the heat dissipation portion, and the cooling assembly further includes a heat dissipation case having an opening.

2. The heat dissipating device of claim 1, wherein the cooling assembly faces at least a portion of the heat dissipating portion.

3. The heat dissipating device of claim 2, wherein the cooling assembly comprises a fan facing the heat dissipating portion.

4. The heat dissipating device of claim 3, wherein the cooling assembly further comprises a printed circuit board, the heat dissipating housing encloses at least a portion of the heat dissipating portion, the printed circuit board and the fan are located within the heat dissipating housing, and the printed circuit board is electrically connected to the fan.

5. The heat dissipating device of claim 2, wherein the cooling assembly comprises a diffuser member, the diffuser member connecting the heat dissipating portion.

6. The heat sink of claim 5, wherein the diffuser comprises at least one fin and is circumferentially attached to the heat sink portion.

7. The heat dissipating device of claim 1, further comprising a wire for electrically connecting to the chip, the wire being encapsulated with the heat dissipating member.

8. The heat dissipating device of claim 7, wherein the wire comprises a conductive wire and an insulating layer, the insulating layer covering the conductive wire.

9. An inspection apparatus comprising a housing, a chip, and the heat dissipation device of any one of claims 1 to 8, wherein the housing is sealed, the chip is disposed in the housing, the heat receiving portion is connected to the chip, and the heat dissipation portion is disposed outside the housing.