CN109841052B - Infrared emitter with composite material cover body - Google Patents
Infrared emitter with composite material cover body Download PDFInfo
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- CN109841052B CN109841052B CN201711217576.3A CN201711217576A CN109841052B CN 109841052 B CN109841052 B CN 109841052B CN 201711217576 A CN201711217576 A CN 201711217576A CN 109841052 B CN109841052 B CN 109841052B
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Abstract
The application discloses an infrared emitting device with a composite material cover body, which comprises a shell, an infrared light emitting module and the composite material cover body, wherein the shell is provided with a containing cavity and an opening; the infrared light-emitting module is arranged in the accommodating cavity and emits light towards the opening direction; the composite material cover body is sealed in the opening and connected with the shell, the composite material cover body comprises an outer cover layer and an inner cover layer, and the heat conductivity of the outer cover layer is smaller than that of the inner cover layer. The invention can ensure each component to operate at lower working temperature through the composite material cover body formed by the outer cover layer and the inner cover layer.
Description
Technical Field
The present invention relates to an infrared emitting device, and more particularly, to an infrared emitting device with a composite cover.
Background
An infrared emitter (IR L ED) is an indispensable component for a camera to provide night vision, but the infrared emitter has a life-span affected by the temperature rise of its body under high power consumption, and grows in proportion to the increase of the power consumption, and IEC60950-1 specifies that the plastic housing temperature needs to be less than 60 ℃ and the glass housing temperature needs to be less than 50 ℃ at an ambient temperature of 25 ℃.
The known infrared emitting device mainly uses an outer cover made of plastic material, and the outer cover made of plastic material can make the temperature of the infrared light emitting module and the shell higher. In order to solve the problem, the outer cover body is made of plastic and is changed into glass with good thermal conductivity, and after the outer cover body is simply changed into the glass material, although the temperature of the infrared light-emitting module, the shell and the outer cover body is reduced, the outer cover body made of glass still cannot meet the requirement of the safety standard.
In view of the above, the present inventors have made extensive studies and studies to solve the above problems in combination with the application of the above prior art, and as a result, the present inventors have improved the present invention.
Disclosure of Invention
An object of the present invention is to provide an infrared emitting device having a cover made of composite material, which can ensure that each constituent member can operate at a low operating temperature.
In order to achieve the above object, the present invention provides an infrared emitting device with a composite material cover, comprising a housing, an infrared light emitting module and a composite material cover, wherein the housing has a cavity and an opening; the infrared light-emitting module is arranged in the accommodating cavity and emits light towards the opening direction; the composite material cover body is covered on the opening and connected with the shell, the composite material cover body comprises an outer cover layer and an inner cover layer formed on the inner side of the outer cover layer, and the thermal conductivity of the outer cover layer is smaller than that of the inner cover layer.
The inner side of the outer cover layer is provided with a groove, and the inner cover layer is closely mounted corresponding to the groove.
The outer cover layer is a transparent plastic sheet, and the inner cover layer is a transparent glass sheet.
The inner side of the outer cover layer is provided with a groove, the inner cover layer is arranged corresponding to the groove, and a spacing space is formed between the outer cover layer and the inner cover layer.
The outer cover layer is a transparent plastic sheet, and the inner cover layer is a transparent glass sheet.
The outer cover layer is a transparent plastic sheet, the inner cover layer is a transparent graphene coating, and the inner cover layer is formed on the inner surface of the outer cover layer in a coating mode.
Further, the lens module is arranged inside the accommodating cavity and views towards the opening.
The shell comprises a bottom plate and a surrounding plate which is bent and extended from the periphery of the bottom plate, so that the cavity is formed between the bottom plate and the surrounding plate, and the opening is formed at one end of the surrounding plate, which is far away from the bottom plate.
The infrared light-emitting module comprises a printed circuit board and an infrared light-emitting body which is arranged on the printed circuit board and electrically connected with the printed circuit board.
The present invention also has an effect of reducing the temperature of the corresponding place by forming a space between the outer cover layer and the inner cover layer so as to achieve a heat insulating effect.
Drawings
Other features, objects and advantages of the present application will become more apparent upon reading of the following detailed description of non-limiting embodiments thereof, made with reference to the accompanying drawings in which:
fig. 1 is an exploded perspective view of a first embodiment of the present invention.
Fig. 2 is a combined sectional view of the first embodiment of the present invention.
Fig. 3 is a combined sectional view of a second embodiment of the present invention.
Fig. 4 is an exploded perspective view of a third embodiment of the present invention.
Fig. 5 is a combined sectional view of a third embodiment of the present invention.
Fig. 6 is a combined sectional view of a fourth embodiment of the present invention.
[ notation ] to show
10 … casing
11 … bottom plate
12 … coaming
13 … cavity
14 … opening
20 … infrared light emitting module
21 … printed circuit board
22 … infrared illuminator
30. 30A, 30B … composite material cover
31. 31A, 31B … cover layer
311 … groove
32. 32A, 32B … inner cover
A … space
40 … lens module.
Detailed Description
The present application will be described in further detail with reference to the following drawings and examples. It is to be understood that the specific embodiments described herein are merely illustrative of the relevant invention and not restrictive of the invention. It should be noted that, for convenience of description, only the portions related to the present invention are shown in the drawings.
It should be noted that the embodiments and features of the embodiments in the present application may be combined with each other without conflict. The present application will be described in detail below with reference to the embodiments with reference to the attached drawings.
Referring to fig. 1 and 2, the present invention provides an infrared emitting device with a composite material cover, which mainly includes a housing 10, an infrared light emitting module 20 and a composite material cover 30.
The housing 10 is generally rectangular, but not limited to this shape, the housing 10 of this embodiment is composed of a bottom plate 11 and a surrounding plate 12 bent and extended from the periphery of the bottom plate 11, so that a cavity 13 is formed between the bottom plate 11 and the surrounding plate 12, and an opening 14 is formed at one end of the surrounding plate 12 far from the bottom plate 11.
The infrared light emitting module 20 mainly includes a printed circuit board 21 and an infrared light emitting device 22 mounted on the printed circuit board 21 and electrically connected to the printed circuit board 21, wherein the printed circuit board 21 is disposed inside the cavity 13 through a supporting structure (not shown) and the infrared light emitting device 22 emits light toward the opening 14, and the infrared light emitting device 22 may be an infrared light emitting diode (IR L ED).
The composite material cover 30 is covered on the opening 14 and connected to the end face of the enclosure 12 of the housing 10, the composite material cover 30 mainly includes an outer cover 31 and an inner cover 32, the outer cover 31 and the inner cover 32 are both a plate, a groove 311 is formed on the inner side of the outer cover 31, and the inner cover 32 is closely attached to the bottom of the groove 311 of the outer cover 31 corresponding to the position of the groove 311, so that the inner cover 32 is formed on the inner side of the outer cover 31.
Further, the thermal conductivity of the outer cover 31 is smaller than that of the inner cover 32, wherein the outer cover 31 may be a transparent plastic sheet, and the inner cover 32 may be a transparent glass sheet, so as to ensure that the components of the infrared light emitting module 20 can operate at a lower operating temperature. Thus, the test results of the material object can obtain that the temperature of the composite material cover body 30 is about 53.8 ℃, which is obviously lower than the IEC60950-1 standard temperature by 60 ℃ or lower.
Referring to fig. 3, the infrared emitting device with the composite mask body of the present invention can be obtained in the above embodiment, wherein the composite mask body 30A includes an outer mask layer 31A and an inner mask layer 32A, a groove 311A is formed on the inner side of the outer mask layer 31A, the inner mask layer 32A is installed corresponding to the groove 311A, and a space a is formed between the outer mask layer 31A and the inner mask layer 32A, so that the thermal insulation effect is achieved and the corresponding temperature is reduced.
Referring to fig. 4 and 5, the present embodiment further includes a lens module 40 under the main body structure of the first embodiment, and the lens module 40 is also disposed inside the cavity 13 and views toward the opening 14.
Referring to fig. 6, the composite mask body 30B of the present embodiment mainly includes an outer mask layer 31B and an inner mask layer 32B, wherein the outer mask layer 31B may be a transparent plastic sheet, and the inner mask layer 32B is a transparent Graphene (Graphene) coating formed on an inner surface of the outer mask layer 31B by coating, so that the same effects as the above embodiments are also obtained.
The above description is only a preferred embodiment of the application and is illustrative of the principles of the technology employed. It will be appreciated by a person skilled in the art that the scope of the invention as referred to in the present application is not limited to the embodiments with a specific combination of the above-mentioned features, but also covers other embodiments with any combination of the above-mentioned features or their equivalents without departing from the inventive concept. For example, the above features are interchangeable with technical features disclosed in this application (but not limited to) having similar functions.
Claims (9)
1. An infrared emitting device having a composite cover, comprising:
a shell, which is provided with a cavity and an opening;
the infrared light-emitting module is arranged in the accommodating cavity and emits light towards the opening direction; and
a composite material cover body which is sealed in the opening and connected with the shell, wherein the composite material cover body comprises an outer cover layer and an inner cover layer, and the thermal conductivity of the outer cover layer is less than that of the inner cover layer;
the outer cover layer is at least partially positioned at the outer side of the inner cover layer, and the inner cover layer and the outer cover layer are arranged in parallel in the light emitting direction of the infrared light emitting module so as to allow infrared rays of the infrared light emitting module to pass through.
2. The infrared transmitter with a composite cover as claimed in claim 1, wherein the inner cover has a groove on its inner side, and the inner cover is closely fitted in the groove.
3. The infrared radiation device having a composite cover as set forth in claim 2, wherein said outer cover is a sheet of transparent plastic and said inner cover is a sheet of transparent glass.
4. The infrared ray radiation device with a composite mask as set forth in claim 1, wherein said outer mask has a recess formed on an inner side thereof, said inner mask is installed corresponding to said recess, and a space is formed between said outer mask and said inner mask.
5. The infrared radiation device having a composite cover as set forth in claim 4, wherein said outer cover is a sheet of transparent plastic and said inner cover is a sheet of transparent glass.
6. The infrared ray transmitting device having a composite cover as set forth in claim 1, wherein the outer cover is a sheet of transparent plastic, the inner cover is a transparent graphene coating, and the inner cover is formed on an inner surface of the outer cover by coating.
7. The infrared emitting device with a composite covering of claim 1, further comprising a lens module disposed inside the cavity and viewing toward the opening.
8. The infrared emitting device with a composite cover as set forth in claim 1, wherein the housing includes a base and a skirt extending from a periphery of the base so as to define the cavity therebetween, and the opening is formed at an end of the skirt remote from the base.
9. The infrared emitting device with the composite material cover as claimed in claim 1, wherein the infrared light emitting module includes a printed circuit board and an infrared light emitter mounted on the printed circuit board and electrically connected to the printed circuit board.
Priority Applications (1)
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CN201711217576.3A CN109841052B (en) | 2017-11-28 | 2017-11-28 | Infrared emitter with composite material cover body |
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CN201711217576.3A CN109841052B (en) | 2017-11-28 | 2017-11-28 | Infrared emitter with composite material cover body |
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CN109841052A CN109841052A (en) | 2019-06-04 |
CN109841052B true CN109841052B (en) | 2020-07-14 |
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Family Cites Families (19)
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DE102004028022B4 (en) * | 2004-06-09 | 2006-11-16 | Perkinelmer Optoelectronics Gmbh & Co.Kg | sensor |
KR101333355B1 (en) * | 2007-01-30 | 2013-11-28 | 덴끼 가가꾸 고교 가부시키가이샤 | Led light source unit |
JP4871344B2 (en) * | 2008-11-25 | 2012-02-08 | 株式会社東芝 | Light emitting device and manufacturing method thereof |
KR20120002575A (en) * | 2009-02-27 | 2012-01-06 | 코닌클리즈케 필립스 일렉트로닉스 엔.브이. | Led-based lamps and thermal management systems therefor |
CN201396724Y (en) * | 2009-05-13 | 2010-02-03 | 南京工业大学 | Heat pipe radiating device of automobile LED headlamp |
JP5842118B2 (en) * | 2010-06-24 | 2016-01-13 | パナソニックIpマネジメント株式会社 | Infrared sensor |
DE102011118330A1 (en) * | 2011-11-11 | 2013-05-16 | Gm Global Technology Operations, Llc | Vehicle lamp with light emitting diode as the light source |
TWI483433B (en) * | 2012-07-30 | 2015-05-01 | Huga Optotech Inc | Light emitting module |
CN202750156U (en) * | 2012-09-06 | 2013-02-20 | 步宏伟 | Infrared video monitoring camera |
US9063305B2 (en) * | 2012-11-26 | 2015-06-23 | Avago Technologies General Ip (Singapore) Pte. Ltd. | Methods and systems for dissipating heat in optical communications modules |
TWM462821U (en) * | 2012-12-10 | 2013-10-01 | Cai-Ru Liao | Infrared projector low-temperature heat dissipation structure |
WO2014159894A1 (en) * | 2013-03-14 | 2014-10-02 | Corning Incorporated | Led lighting devices |
CN203242159U (en) * | 2013-05-15 | 2013-10-16 | 江苏翔盟精密铸造有限公司 | Intelligent infrared flaw detecting system |
CN203351657U (en) * | 2013-07-23 | 2013-12-18 | 上海美情电子科技有限公司 | Aluminum base plate achieving high thermal conductivity |
EP3032594A4 (en) * | 2013-08-09 | 2017-01-25 | Koha Co., Ltd. | Light emitting device |
CN203521460U (en) * | 2013-09-30 | 2014-04-02 | 东莞勤上光电股份有限公司 | LED packaging structure with high heat conduction performance |
CN204831553U (en) * | 2015-06-30 | 2015-12-02 | 青岛海尔股份有限公司 | Refrigerator and infrared sensing device thereof |
CN205053725U (en) * | 2015-09-16 | 2016-03-02 | 应敏 | Cooking pot |
TWI602010B (en) * | 2016-10-27 | 2017-10-11 | 晶睿通訊股份有限公司 | Image surveillance device and light emitting module thereof |
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