JP2013157488A

JP2013157488A - Led lamp

Info

Publication number: JP2013157488A
Application number: JP2012017491A
Authority: JP
Inventors: Tsutomu Totani; 勉戸谷
Original assignee: Beat Sonic Co Ltd
Current assignee: Beat Sonic Co Ltd
Priority date: 2012-01-31
Filing date: 2012-01-31
Publication date: 2013-08-15

Abstract

PROBLEM TO BE SOLVED: To provide LED lamps 10, 20, 30 which prevent a light-on circuit from being deteriorated by heating even while continuously lighted on for a long time.SOLUTION: Through an air hole 11d of a radiator 11 or an air hole 15a of a mouthpiece 15, heated air within the radiator 11 and the mouthpiece 15 is exhausted to the outside of the radiator 11 and the mouthpiece 15. In cooperation with heat radiating effects by exhaustion action of the air holes 11d, 15a and heat radiating effects by heat conduction action of the radiator 11, a light-on circuit 16 disposed within the radiator 11 and the mouthpiece 15 can be cooled and even when the LED lamp 10 is lighted on continuously for a long time, the light-on circuit 16 can be prevented from being deteriorated by heat.

Description

本発明は、ＬＥＤチップを光源として内蔵するＬＥＤランプに関する。 The present invention relates to an LED lamp incorporating an LED chip as a light source.

近時、消費電力の大きい白熱電球に代えて、消費電力の少ないＬＥＤを光源として用いるＬＥＤランプの需要が高まっている。
一般に、この種のＬＥＤランプはＬＥＤチップを実装したモジュール基板を熱伝導性と放熱性に優れたアルミニウムなどの金属性放熱体の一端に固定し、モジュール基板を覆うように透明又は半透明のグローブを放熱体に取付け、放熱体の他端側に口金を取り付け、ＬＥＤチップに電力を供給する点灯回路を放熱体に内蔵し、点灯回路と口金を電気的に接続した構成を備えている。 Recently, there is an increasing demand for LED lamps that use LEDs with low power consumption as light sources instead of incandescent bulbs with high power consumption.
In general, this type of LED lamp is a transparent or translucent globe that covers a module substrate by fixing the module substrate on which the LED chip is mounted to one end of a metal radiator such as aluminum having excellent thermal conductivity and heat dissipation. Is attached to the radiator, a base is attached to the other end of the radiator, a lighting circuit for supplying power to the LED chip is built in the radiator, and the lighting circuit and the base are electrically connected.

特開２０１１−７０９７２号公報JP 2011-70972 A 特開２０１１−８２１３２号公報JP 2011-82132 A 特開２０１１−９０８２８号公報JP 2011-90828 A 特開２０１１−９１０３３号公報JP 2011-91033 A

ＬＥＤチップを光源とするＬＥＤランプでは、点灯時に発生する熱が放熱体を伝って外部に発散され、放熱体内部の点灯回路の熱による劣化を防止している。しかし、長期間、連続点灯した場合、放熱体の伝熱作用による放熱だけでは冷却効果が不十分であり、放熱体内部に配置されている点灯回路が発熱により劣化するおそれがある。 In an LED lamp using an LED chip as a light source, heat generated during lighting is transmitted to the outside through the heat radiating body to prevent deterioration of the lighting circuit inside the heat radiating body due to heat. However, when the lamp is continuously lit for a long period of time, the cooling effect is insufficient only by the heat radiation by the heat transfer action of the radiator, and the lighting circuit arranged inside the radiator may be deteriorated by heat generation.

本発明はかかる問題点に鑑み、長期間の連続点灯でも点灯回路の発熱による劣化を防止できるＬＥＤランプを提供することを目的とする。 The present invention has been made in view of the above problems, and an object of the present invention is to provide an LED lamp that can prevent deterioration of a lighting circuit due to heat generation even during long-term continuous lighting.

請求項１に記載の発明は、ＬＥＤチップを実装したモジュール基板を放熱体の一端に固定し、放熱体の他端側に口金を取り付け、ＬＥＤチップに電力を供給する点灯回路を放熱体及び／又は口金の内部に配置し、点灯回路と口金を電気的に接続したＬＥＤランプであって、
放熱体に、放熱体の内外を連通する空気孔を形成したことを特徴とする。 According to the first aspect of the present invention, the module substrate on which the LED chip is mounted is fixed to one end of the heat radiating body, a base is attached to the other end of the heat radiating body, and the lighting circuit for supplying power to the LED chip is provided with the heat radiating body and / or Or an LED lamp that is placed inside the base and electrically connected to the lighting circuit and the base,
The present invention is characterized in that an air hole communicating with the inside and outside of the radiator is formed in the radiator.

請求項２に記載の発明は、ＬＥＤチップを実装したモジュール基板を放熱体の一端に固定し、放熱体の他端側に口金を取り付け、ＬＥＤチップに電力を供給する点灯回路を放熱体及び／又は口金の内部に配置し、点灯回路と口金を電気的に接続したＬＥＤランプであって、
口金に、口金の内外を連通する空気孔を形成したことを特徴とする。 According to the second aspect of the present invention, the module substrate on which the LED chip is mounted is fixed to one end of the heat radiating body, a base is attached to the other end of the heat radiating body, and the lighting circuit for supplying power to the LED chip is provided with the heat radiating body and / or Or an LED lamp that is placed inside the base and electrically connected to the lighting circuit and the base,
An air hole communicating with the inside and outside of the base is formed in the base.

請求項１に記載の発明によれば、空気孔を通して放熱体内部の加熱された空気が放熱体外部へ排気される。このため、空気孔の排気作用による放熱効果と、放熱体の伝熱作用による放熱効果とが相俟って、放熱体及び／又は口金の内部に配置されている点灯回路が冷却されるので、ＬＥＤランプを長期間、連続点灯しても熱による点灯回路の劣化を防止できる。 According to the first aspect of the present invention, the heated air inside the radiator is exhausted to the outside of the radiator through the air holes. For this reason, since the heat radiation effect by the exhaust action of the air holes and the heat radiation effect by the heat transfer action of the heat radiator are combined, the lighting circuit arranged inside the heat radiator and / or the base is cooled. Even if the LED lamp is continuously lit for a long period of time, deterioration of the lighting circuit due to heat can be prevented.

請求項２に記載の発明によれば、空気孔を通して口金内部の加熱された空気が口金外部へ排気される。このため、空気孔の排気作用による放熱効果と、放熱体の伝熱作用による放熱効果とが相俟って、放熱体及び／又は口金の内部に配置されている点灯回路が冷却されるので、ＬＥＤランプを長期間、連続点灯しても熱による点灯回路の劣化を防止できる。 According to the second aspect of the present invention, the heated air inside the base is exhausted outside the base through the air hole. For this reason, since the heat radiation effect by the exhaust action of the air holes and the heat radiation effect by the heat transfer action of the heat radiator are combined, the lighting circuit arranged inside the heat radiator and / or the base is cooled. Even if the LED lamp is continuously lit for a long period of time, deterioration of the lighting circuit due to heat can be prevented.

本発明の第１実施例に係るＬＥＤランプを示す断面図である。It is sectional drawing which shows the LED lamp which concerns on 1st Example of this invention. 本発明の第２実施例に係るＬＥＤランプを示す断面図である。It is sectional drawing which shows the LED lamp which concerns on 2nd Example of this invention. 本発明の第３実施例に係るＬＥＤランプを示す断面図である。It is sectional drawing which shows the LED lamp which concerns on 3rd Example of this invention.

以下に本発明を図面に基づき説明するに、図１には本発明の第１実施例に係るＬＥＤランプ１０が示されている。当該ＬＥＤランプ１０はアルミニウム製の放熱体１１、ＬＥＤチップ１２を実装したモジュール基板１３、半透明のガラス製または樹脂製のドーム形グローブ１４、口金１５、ＬＥＤチップ１２に電力を供給する点灯回路１６及び導光部材１７を備えている。 The present invention will be described below with reference to the drawings. FIG. 1 shows an LED lamp 10 according to a first embodiment of the present invention. The LED lamp 10 includes a heat sink 11 made of aluminum, a module substrate 13 on which the LED chip 12 is mounted, a dome-shaped globe 14 made of translucent glass or resin, a base 15, and a lighting circuit 16 that supplies power to the LED chip 12. And a light guide member 17.

放熱体１１は逆円錐台形の外観を有し、外周部には表面積を増加して放熱効果を高めるため多数のフィン１１ａが形成されている。放熱体１１の上端面１１ｂには、モジュール基板１３が固定されている。放熱体１１の下端の開口端面に口金１５が装着され、放熱体１１の内部空間と口金１５の内部空間が連通している。そして、放熱体１１及び口金１５の内部空間に点灯回路１６が配置され、モジュール基板１３と点灯回路１６がリード線１８で接続されて、点灯回路１６と口金１５がリード線１９で電気的に接続されている。 The radiator 11 has an inverted frustoconical appearance, and a large number of fins 11a are formed on the outer peripheral portion in order to increase the surface area and enhance the heat dissipation effect. A module substrate 13 is fixed to the upper end surface 11 b of the radiator 11. A base 15 is attached to the opening end surface of the lower end of the radiator 11, and the internal space of the radiator 11 and the internal space of the base 15 communicate with each other. The lighting circuit 16 is disposed in the internal space of the radiator 11 and the base 15, the module substrate 13 and the lighting circuit 16 are connected by the lead wire 18, and the lighting circuit 16 and the base 15 are electrically connected by the lead wire 19. Has been.

放熱体１１の上端面１１ｂにはモジュール基板１３を取り囲むようにリング溝１１ｃが形成されている。このリング溝１１ｃにグローブ１４の下端開口端部が嵌合し、接着剤によって放熱体１１に固着されている。このグローブ１４はモジュール基板１３を覆うように放熱体１１に取り付けられている。 A ring groove 11 c is formed on the upper end surface 11 b of the radiator 11 so as to surround the module substrate 13. The lower end opening end of the globe 14 is fitted into the ring groove 11c, and is fixed to the radiator 11 with an adhesive. The globe 14 is attached to the radiator 11 so as to cover the module substrate 13.

放熱体１１の上端部１１ｂに固定したモジュール基板１５には柱状の導光部材１７が立設され固定されている。導光部材１７はプラスチック成形品で先端部に反射部１７ａを有し、反射部１７の内面に四角錐の形状を有する反射面１７ｂが形成されている。一方、導光部材１７の基端部には凹部１７ｃが形成され、この凹部１７ｃをＬＥＤチップ１２に被せるようにして導光部材１７がモジュール基板１３に取付けられている。凹部１７ｃに対向配置したＬＥＤチップ１２が発する光は凹部１７ｃから導光部材１７中に入射し、反射面１７ｂで反射されて、反射部１７ａの周囲に拡散する。 A columnar light guide member 17 is erected and fixed to the module substrate 15 fixed to the upper end portion 11 b of the radiator 11. The light guide member 17 is a plastic molded product having a reflecting portion 17a at the tip, and a reflecting surface 17b having a quadrangular pyramid shape is formed on the inner surface of the reflecting portion 17. On the other hand, a concave portion 17 c is formed at the base end portion of the light guide member 17, and the light guide member 17 is attached to the module substrate 13 so as to cover the concave portion 17 c on the LED chip 12. The light emitted from the LED chip 12 disposed opposite to the concave portion 17c enters the light guide member 17 from the concave portion 17c, is reflected by the reflecting surface 17b, and diffuses around the reflecting portion 17a.

放熱体１１の上部には放熱体の内外を連通する１個の空気孔１１ｄが形成されている。また、口金１５の底部には口金の内外を連通する１個の空気孔１５ａが形成されている。 A single air hole 11d is formed in the upper portion of the heat dissipating body 11 to communicate the inside and outside of the heat dissipating body. In addition, a single air hole 15 a that communicates the inside and outside of the base is formed at the bottom of the base 15.

第１実施例に係るＬＥＤランプ１０の構造は以上の通りであって、空気孔１１ｄ，１５ａを通して放熱体１１及び口金１５の内部の加熱された空気が放熱体１１及び口金１５の外部へ排気される。このため、これら空気孔１１ｄ，１５ａの排気作用による放熱効果と、放熱体１１の伝熱作用による放熱効果とが相俟って、放熱体１１及び口金１５の内部に配置されている点灯回路１６が冷却されるので、ＬＥＤランプ１０を長期間、連続点灯しても熱による点灯回路１６の劣化を防止できる。 The structure of the LED lamp 10 according to the first embodiment is as described above, and the heated air inside the radiator 11 and the base 15 is exhausted to the outside of the radiator 11 and the base 15 through the air holes 11d and 15a. The For this reason, the lighting circuit 16 arranged in the radiator 11 and the base 15 is combined with the heat radiation effect by the exhaust action of the air holes 11 d and 15 a and the heat radiation effect by the heat transfer action of the heat radiator 11. Therefore, even if the LED lamp 10 is continuously lit for a long time, it is possible to prevent the lighting circuit 16 from being deteriorated due to heat.

本発明の第２実施例に係るＬＥＤランプ２０を図２に示す。当該ＬＥＤランプ２０の口金１５の底部には左右一対の空気孔１５ａ，１５ｂが形成されている。
なお、第２実施例に係るＬＥＤランプ２０の他の構造は第１実施例に係るＬＥＤランプ１０と同じであるので、同一の構成要素に同一の符号を付して説明を省略する。 FIG. 2 shows an LED lamp 20 according to a second embodiment of the present invention. A pair of left and right air holes 15 a and 15 b are formed at the bottom of the base 15 of the LED lamp 20.
In addition, since the other structure of the LED lamp 20 which concerns on 2nd Example is the same as the LED lamp 10 which concerns on 1st Example, the same code | symbol is attached | subjected to the same component and description is abbreviate | omitted.

本実施例に係るＬＥＤランプ２０では、空気孔１５ａ，１５ｂを通して放熱体１１及び口金１５内部の加熱された空気が排気され、また外気を放熱体１１及び口金１５の内部に導入できる。
しかして、本実施例に係るＬＥＤランプ２０は口金１５だけに空気孔１５ａ，１５ｂを形成するので、加工コストを低減できる。 In the LED lamp 20 according to the present embodiment, the heated air inside the radiator 11 and the base 15 is exhausted through the air holes 15 a and 15 b, and the outside air can be introduced into the radiator 11 and the base 15.
Thus, since the LED lamp 20 according to the present embodiment forms the air holes 15a and 15b only in the base 15, the processing cost can be reduced.

本発明の第３実施例に係るＬＥＤランプ３０を図３に示す。当該ＬＥＤランプ３０の口金１５には、底部に１個の空気孔１５ａが形成されている。また、口金１５における放熱体１１との接続端部１５ｃに１個の空気孔１５ｄが形成されている。 FIG. 3 shows an LED lamp 30 according to a third embodiment of the present invention. The base 15 of the LED lamp 30 has one air hole 15a at the bottom. In addition, one air hole 15 d is formed in the connection end 15 c of the base 15 with the radiator 11.

第３実施例に係るＬＥＤランプでは、口金１５だけに空気孔１５ａ，１５ｄを形成しているものの、そのうち１個の空気孔１５ｄを口金１５における放熱体１１との接続端部１５ｃに形成したので、放熱体１１内部の加熱された空気を効果的に排気できる。 In the LED lamp according to the third embodiment, although the air holes 15a and 15d are formed only in the base 15, one of the air holes 15d is formed in the connection end 15c of the base 15 with the radiator 11. The heated air inside the radiator 11 can be effectively exhausted.

１０，２０，３０…ＬＥＤランプ
１１…放熱体
１１ｄ…空気孔
１２…ＬＥＤチップ
１３…モジュール基板
１４…グローブ
１５…口金
１５ａ，１５ｂ，１５ｄ…空気孔
１６…点灯回路
１７…導光部材
１８，１９…リード線
DESCRIPTION OF SYMBOLS 10, 20, 30 ... LED lamp 11 ... Radiator 11d ... Air hole 12 ... LED chip 13 ... Module substrate 14 ... Globe 15 ... Base 15a, 15b, 15d ... Air hole 16 ... Lighting circuit 17 ... Light guide member 18, 19 …Lead

Claims

The module substrate with the LED chip mounted is fixed to one end of the radiator, a base is attached to the other end of the radiator, and a lighting circuit that supplies power to the LED chip is placed inside the radiator and / or base. An LED lamp in which a circuit and a base are electrically connected,
An LED lamp characterized in that an air hole is formed in the heat radiating body to communicate the inside and outside of the heat radiating body.

The module substrate with the LED chip mounted is fixed to one end of the radiator, a base is attached to the other end of the radiator, and a lighting circuit that supplies power to the LED chip is placed inside the radiator and / or base. An LED lamp in which a circuit and a base are electrically connected,
An LED lamp characterized in that an air hole communicating with the inside and outside of the base is formed in the base.