JP3185809U - Light-emitting diode encapsulation structure - Google Patents

Abstract

A light-emitting diode encapsulating structure for dissipating heat generated by a chip to the outside by a heat conductive circuit board is provided.
A heat conductive circuit board includes at least one chip and a case body. An electrical connection device 4 is installed on the circuit layer 5 on the surface of the heat conducting circuit board, and at least one chip is installed on the circuit layer to form an electrical connection with the electrical connection device. Thereby, the case body provided with the light reflection effect covers and fixes the heat conductive circuit board, and the depression 21 is installed on the case body, and the light emitted from the chip is projected to the outside. The light transmitting gel 1 is injected into the recessed portion of the case body to form protection around the chip. Due to the structure of the heat conducting circuit board, the heat generated by the chip is effectively dissipated through the heat conducting circuit board.
[Selection] Figure 4

Description

  The present invention relates to an encapsulating structure, and more particularly to an encapsulating structure of a light emitting diode that dissipates heat generated by a chip to the outside by a heat conducting circuit board.

With the development of science and technology, various light emitting units are developing toward low energy consumption and high luminous efficiency. In various new light-emitting lighting components, light-emitting diodes (LEDs) have low power consumption and high luminous efficiency, so they will gradually replace CCFL (Cold Cathode Fluorescent Lamp) and other existing lighting sources. It is said.
However, the light emitting diode (LED) must solve the problem of heat generation during its operation. Optimum heat dissipation design can improve luminous efficiency and extend the service life of light emitting diodes (LEDs), so overcoming the heat dissipation problem is an important point in the development of light emitting diodes.
In a known heat-dissipating method for power light-emitting diodes, a chip is fixed on a heat-dissipating body (piece), and the chip forms an electrical connection through a connection between a conductor and a support frame. The heat generated by the chip during operation is directly dissipated using the heat dissipating body.
However, this type of structure in which a separate heat dissipating body (piece) is installed not only increases the parts cost and assembly cost, but also is limited in space, so that the area and heat dissipating efficiency of the heat dissipating body (piece) are generally long. The heat dissipation requirement of time cannot be satisfied. For this reason, it will have a bad influence with respect to the luminous efficiency and service life of this light emitting diode.

Conventional power light emitting diodes (LEDs) have the disadvantages of the heat dissipation mechanism described above, which greatly reduces their utility, and the industry and consumers are eager to overcome this.
The present inventors proceeded with creation in consideration of this point, and finally the heat generated by the chip by the heat conductive circuit board was dissipated to the outside, the heat dissipation efficiency was good, the simple structure and assembly were simple, and the production cost could be reduced. , To improve the luminous efficiency of light emitting diodes and extend their service life, and to match the practicality with the needs of users and advance.
In order to solve the above-described deficiencies of the existing technologies, a light emitting diode encapsulating structure is provided as a main object of the present invention.
It dissipates the heat generated by the chip to the outside by the heat-conducting circuit board and overcomes the problems of the existing technology.
The next object of the present invention is to provide a light-emitting diode encapsulating structure, which has good heat dissipation efficiency, simple structure, simple assembly, and low production cost.
It is a further object of the present invention to provide a light emitting diode encapsulating structure, thereby improving the light emitting efficiency of the light emitting diode and extending its service life.
The problem to be solved by the present invention is that with the development of science and technology, the development of various light-emitting units has mostly been directed to lower energy consumption and higher efficiency. The low power consumption and excellent luminous efficiency of diodes (LEDs) are already gradually surpassing CCFLs (Cold Cathode Fluorescent Lamps) and other existing illumination sources.
However, an inevitable problem for light-emitting diodes (LEDs) is how to overcome the problem of heat generation during operation, and the optimal heat dissipation mechanism improves the luminous efficiency and extends the service life of the light-emitting diodes (LEDs). .
Therefore, overcoming the heat dissipation problem is an important point in the development of light emitting diodes (LEDs).
The conventional heat dissipation method for power light emitting diodes (LEDs) is that the chip is fixed on a heat dissipating body (piece), and further, the chip forms an electrical connection through the connection between the conductor and the support frame, and uses the heat dissipating body. The chip directly dissipates heat generated during operation. However, this type of structure in which a separate heat dissipating body (piece) is installed not only increases the parts cost and assembly cost, but also is limited in space, so that the area and heat dissipating efficiency of the heat dissipating body (piece) are generally long. The heat dissipation requirement of time cannot be satisfied. For this reason, it will have a bad influence with respect to the luminous efficiency and service life of this light emitting diode.
Conventional power light emitting diodes (LEDs) have the disadvantages of the heat dissipation mechanism described above, which impairs their practicality.

To achieve the above object, the present invention provides a light emitting diode encapsulating structure.
It includes a heat conductive circuit board, the heat conductive circuit board includes a first surface and a second surface, at least a portion of the first surface is in contact with air, the second surface includes a circuit layer, and further on the circuit layer Includes an electrical connection device.
At least one chip, a heat conductive circuit board, and an electrical connection device for the circuit layer are formed.
The case body covers and fixes the heat conductive circuit board, the case body is made of a high temperature resistant material, and a depression is provided thereon, and the surface inside the depression is made of a light reflecting material.
The light-transmitting gel is located in the depressed portion of the case body, protects the periphery of the chip, emits light, and passes through the light-transmitting gel in the depressed portion and is projected to the outside.
The heat conductive circuit board of the present invention further has at least one concave tank, at least one hole, or at least one concave tank and at least one hole, and further covers and encloses the case body.
The material of the light transmitting gel of the present invention is silicon, epoxy resin, or a combination of both.
The heat conducting circuit board of the present invention is a metal circuit board or a ceramic circuit board.
The electrical connecting device of the present invention is a plurality of circuit wirings, a flexible circuit board, or a combination of both.

  From this mechanism, the heat generated by the chip is dissipated outside by the heat conduction circuit board, the heat dissipation efficiency can be optimized, simple structure, simple assembly, lower production cost, and extend the light emitting efficiency and service life of the light emitting diode And make practicality and user needs consistent and advance.

It is sectional drawing of this invention 1st Example. It is a front three-dimensional view of the first embodiment of the present invention. It is a back three-dimensional view of the first embodiment of the present invention. It is a three-dimensional exploded view of the first embodiment of the present invention. It is a three-dimensional view of the second embodiment of the present invention.

  Please refer to FIG. 1, FIG. 2, FIG. 3, FIG. 4 and FIG. Sectional view of the first embodiment of the present invention, front three-dimensional view of the first embodiment of the present invention, rear three-dimensional view of the first embodiment of the present invention, three-dimensional exploded view of the first embodiment of the present invention, and second embodiment of the present invention FIG. A preferred embodiment of the light emitting diode encapsulating structure of the present invention includes a heat conductive circuit board 6, at least one chip 3, a case body 2, and a light transmitting gel 1.

The heat-conducting circuit board 6 includes a first surface 61 and a second surface 62, and at least a part of the first surface 61 is in contact with air and is used for heat dissipation.
The second surface 62 includes the circuit layer 5, and the electrical connection device 4 is installed on the circuit layer 5. Further, the heat conductive circuit board 6 is covered with at least one concave tub 8 or hole 7 or a structure including both.
The heat conductive circuit board 6 of the present invention is a metal circuit board, but is not limited to this, and a ceramic circuit board or other various heat conductive materials are all within the protection scope of the present invention.
The electrical connection device 4 of the present invention includes a plurality of circuit wirings 41 (see FIGS. 1 to 4), a flexible circuit board 40 (see FIG. 5), or a combination of both the circuit wiring 41 and the flexible circuit board 40. It shall be within the scope of protection. The heat conductive circuit board 6 of the present invention includes a plurality of circuit wires 41 of the electrical connection device 4 and at least a pair of circuit contacts 42.

  The at least one chip 3 described above is placed on the circuit layer 5 of the heat conducting circuit board 6 so as to cover the chip or by soldering wiring, and form an electrical connection with the electrical connection device 4.

The case body 2 covers and fixes the heat conducting circuit board 6, and a depressed portion 21 is installed on the case body 2. The surface inside the depression 21 is made of a light reflecting material that reflects light, and projects the light emitted from the chip 3 to the outside.
The case body 2 of the present invention tightly covers and fixes the heat conductive circuit board 6 by a method such as injection molding, casting, caulking bonding or adhesive bonding.
The chip 3 is placed outside by the depression 21, and the case body 2 of the present embodiment is made of a high temperature resistant material. The heat conducting circuit board 6 includes at least one concave tank 8 and a hole 7. Or the structure provided with both is located in the case body 2, and is covered.

The aforementioned light transmitting gel 1 is located in the depressed portion 21 of the case body 2 and forms a protection around the chip 3. The light emitted from the chip 3 passes through the light transmitting gel 1 in the depressed portion 21 and is projected outward.
The material of the light transmitting gel 1 of the present invention is silicon, epoxy resin, or a combination of both, but this does not limit the present invention, and all other materials are within the protection scope of the present invention.
The light transmitting gel 1 is disposed in the depressed portion 21 of the case body 2 by using a method such as pouring or casting, but is disposed in the depressed portion 21 of the case body 2 by using various other methods. Are all within the scope of protection of the present invention.

  When the present invention is used, the chip 3 is connected to external equipment via the electrical connection device 4 of the circuit layer 5, and the light emitted from the chip 3 is transmitted through the depressed portion 21 of the case body 2 to the light transmitting gel body 1. Is projected outside to form a light source necessary for illumination or display. The heat generated by the chip 3 is dissipated by the first surface 61 that comes into contact with the air together with the heat-conducting circuit board 6 to reduce the temperature of the chip 3. Thus, the luminous efficiency of the light emitting diode can be effectively improved and the service life can be extended.

As shown in FIG. 5, which is a three-dimensional exploded view of the second embodiment of the present invention, the structure of the second embodiment of the present invention appropriately shrinks the heat conducting circuit board 60 and completely covers it with the case body 2. Further, the light-transmitting gel 1 and the chip 3 are placed on the case body 2, and the chip 3 forms an electrical connection outward through the flexible circuit board 40.
Such a combination structure can effectively reduce the entire volume, and can improve the convenience of installation and handling according to the downsizing of the product.

  From this mechanism, the heat generated by the chip 3 is effectively dissipated by the first surface in contact with air via the heat conducting circuit board, and the temperature of the chip can be lowered. Therefore, the luminous efficiency of the light emitting diode can be effectively improved and the service life can be extended.

DESCRIPTION OF SYMBOLS 1 Light transmission gel 2 Case body 21 Depression part 3 Chip 4 Electrical connection apparatus 40 Flexible circuit board 41 Circuit wiring 42 Circuit contact 5 Circuit layer 6, 60 Heat conduction circuit board 61 1st surface 62 2nd surface 7 Hole 8 Recessed tank

Claims (5)

The encapsulating structure of the light emitting diode includes a heat conductive circuit board, at least one chip, a case body, a light transmitting gel,
The heat conducting circuit board includes a first surface and a second surface, at least a portion of the first surface is in contact with air, the second surface includes a circuit layer, and an electrical connection device is installed on the circuit layer;
The at least one chip is disposed on the heat conductive circuit board and forms an electrical connection with the electrical connection device of the circuit layer;
The case body covers and fixes the heat conductive circuit board, the case body is made of a high temperature resistant material, and a concave portion is installed on the top, and a light reflecting material is installed on the surface inside the concave portion,
The light transmitting gel is located in the depressed portion of the case body and forms a protection around the chip, and light emitted from the chip is transmitted through the gel body of the depressed portion and projected to the outside. A light-emitting diode encapsulating structure.   2. The heat conducting circuit board includes at least one concave tub structure, at least one hole structure, and a structure including both of at least one concave tub and a hole at a covering position of the case body. A light-emitting diode encapsulating structure as described.   3. The light emitting diode encapsulating structure according to claim 1, wherein the light transmitting gel is made of silicon, epoxy resin, or a combination of both.   3. The light emitting diode encapsulating structure according to claim 1, wherein the heat conducting circuit board is a metal circuit board or a ceramic circuit board.   3. The light emitting diode encapsulating structure according to claim 1, wherein the electrical connection device is a plurality of circuit wirings, a flexible circuit board, or a combination of both.

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