JP2014044968A - Led lamp - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an LED lamp in which heat radiation performance is improved without using a cooling fan.SOLUTION: An LED lamp 100 includes: a substrate 2 having a first surface 21 and a second surface 22 that is a rear surface of the first surface 21; an LED 1 provided on the first surface 21 of the substrate 2; a heat radiation part 3 which is provided so as to contact with the second surface 22 of the substrate 2; a housing 10 which houses the substrate 2, the LED 1, and the heat radiation part 3; and a mouthpiece 8 which is provided at an end part 16 in the housing 10 when viewed in a direction that leads from the first surface 21 of the substrate 2 to the second surface 22. The heat radiation part 3 includes: a first contact surface 32a contacting with the second surface 22 of the substrate 2; and a first extending part 310 which extends in a direction that comes closer to the mouthpiece 8 than the first contact surface 32a and is provided so as to contact with the housing 10.

Description

  The present invention relates to an LED lamp using an LED (Light Emitting Diode) as a light source.

  In recent years, LED bulbs using LEDs with excellent power saving as a light source have been actively used due to an increase in environmental awareness. In particular, recently, a bright LED bulb has been demanded, and therefore, an LED having a large output has been used. Along with this, heat generation of LEDs has become a problem, and it has become an important point how to efficiently dissipate heat for LEDs that are relatively weak against heat. Therefore, an LED bulb has been proposed in which a heat sink with a cooling fin having excellent heat dissipation is formed in the outer case, and this heat dissipation measure is taken. As this type of LED bulb, there has been a bulb-type lamp as disclosed in Japanese Patent Application Laid-Open No. 2010-40221.

  A light bulb shaped lamp described in Japanese Patent Application Laid-Open No. 2010-40221 has a substrate provided with a light emitting element on one surface and a surface on the other end of the substrate attached to one end, and is transmitted from the light emitting device on the substrate. A heat dissipating body provided with a plurality of heat dissipating fins for dissipating heat, a globe attached to one end of the heat dissipating body covering the substrate, a base provided at the other end of the heat dissipating body, a heat dissipating body and a base A lighting circuit that illuminates the light emitting element, and a fan that is rotatably provided on the other end side of the heat radiating body, and that ventilates the inside of the heat radiating body with at least a heat radiating fin as a part of the air passage. It is characterized by that.

JP 2010-40221 A

  However, the light bulb shaped lamp described in Japanese Patent Application Laid-Open No. 2010-40221 has to be equipped with a cooling fan, resulting in a complicated structure and high cost.

  The present invention has been made in view of the above problems, and according to some aspects of the present invention, it is possible to provide an LED lamp with improved heat dissipation without using a cooling fan. it can.

(1) The LED lamp according to the present invention is
A substrate having a first surface and a second surface which is the back surface of the first surface;
LEDs provided on the first surface of the substrate;
A heat dissipating part provided in contact with the second surface of the substrate;
A housing for housing the substrate, the LED, and the heat dissipation unit;
A base provided at an end of the housing in a direction from the first surface toward the second surface of the substrate;
Including
The heat dissipation part is
A first contact surface in contact with the second surface of the substrate;
A first extending portion that extends in a direction closer to the base than the first contact surface and is provided in contact with the housing;
Have

  In the present invention, “contacting” includes not only the case where the members are in direct contact but also the case where the members are bonded together with an adhesive or the like.

  According to the present invention, the heat generated by the LED can be diffused to the housing via the first extending portion, and therefore can be radiated to the outside via the housing. In particular, in a usage pattern in which the base side is on the upper side, the first extending portion extends in a direction in which heat easily moves, so that an LED lamp with high heat dissipation can be realized.

(2) In this LED lamp,
The heat dissipation part is
Even if it has the 2nd contact surface which touches the above-mentioned case in the back side of the 1st contact surface in the position farther from the center of the heat dissipation part than the 1st extension part seeing from the base side Good.

  According to the present invention, by having the second contact surface, the contact area between the heat radiating portion and the housing is increased, so that heat can be radiated more effectively. Moreover, it becomes a structure more suitable for the shape of a lightbulb-shaped lamp by a heat radiation part and a housing | casing contacting in the position far from the center of a heat radiation part rather than a 1st extension part.

(3) In this LED lamp,
The heat dissipation part is
You may have the 2nd extension part extended in the direction away from the said nozzle | cap | die from the said 2nd contact surface.

  According to the present invention, since the heat capacity of the heat dissipating part can be increased by having the second extending part, the heat generated by the LED can be stored in the second extending part. Therefore, it can suppress that the temperature of LED rises. Moreover, it becomes a structure more suitable for the shape of a lightbulb-shaped lamp by making the 2nd extension part into the structure extended in the direction away from a nozzle | cap | die.

(4) In this LED lamp,
The heat dissipation part is
A first heat dissipating part having a first plate-like part and the first extending part provided on at least a part of the outer periphery of the first plate-like part;
A second plate-like portion having the first contact surface and the second contact surface and provided to be in contact with the first plate-like portion; and provided on at least a part of an outer periphery of the second plate-like portion. A second heat dissipating part having the second extending part,
May be included.

  According to the present invention, the heat radiating portion can be easily formed by press working.

(5) In this LED lamp,
A power supply unit that is housed in the housing and supplies power to the LEDs;
The casing may be formed of a resin material.

  According to the present invention, since the housing formed of the resin material has low thermal conductivity, it is possible to suppress the heat generated by the LED from being transmitted to the power supply unit. Therefore, it can suppress that the temperature of a power supply part rises.

(6) In this LED lamp,
The heat radiating portion may be in contact with a portion where the thickness of the casing is minimized.

  According to the present invention, the heat of the heat radiating portion can be easily radiated to the outside through the housing, so that the heat dissipation can be further improved.

(7) In this LED lamp,
The heat dissipating part may be formed of a metal material.

  According to the present invention, since the heat radiating portion formed of a metal material has high thermal conductivity, heat generated from the LED can be quickly radiated.

(8) In this LED lamp,
The casing may have a plurality of fins formed on the outer surface.

  According to the present invention, since the surface area of the outer surface of the housing is increased by forming the plurality of fins, the heat dissipation can be further improved.

FIG. 1 is a cross-sectional view for explaining the configuration of an LED lamp 100 according to this embodiment. FIG. 2 is another cross-sectional view for explaining the configuration of the LED lamp 100 according to the present embodiment. FIG. 3 is an exploded perspective view for explaining the configuration of the LED lamp 100 according to the present embodiment. FIG. 4 is a perspective view for explaining the configuration of the housing 10 of the LED lamp 100 according to the present embodiment. FIG. 5 is a graph showing temporal changes in LED temperatures in Examples and Comparative Examples.

  DESCRIPTION OF EMBODIMENTS Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the drawings. The embodiments described below do not unduly limit the contents of the present invention described in the claims. Also, not all of the configurations described below are essential constituent requirements of the present invention.

1. Configuration of LED Lamp According to this Embodiment FIG. 1 is a cross-sectional view for explaining the configuration of an LED lamp 100 according to this embodiment. FIG. 2 is another cross-sectional view for explaining the configuration of the LED lamp 100 according to the present embodiment. FIG. 3 is an exploded perspective view for explaining the configuration of the LED lamp 100 according to the present embodiment. FIG. 4 is a perspective view for explaining the configuration of the housing 10 of the LED lamp 100 according to the present embodiment. In the present embodiment, the case where the LED lamp 100 is a light bulb shaped lamp will be described as an example.

  The LED lamp 100 according to the present embodiment includes a first surface 21 and a substrate 2 having a second surface 22 that is the back surface of the first surface 21, an LED 1 provided on the first surface 21 of the substrate 2, and the substrate 2. The heat dissipating part 3 provided so as to be in contact with the second surface 22, the housing 10 that accommodates the substrate 2, the LED 1, and the heat dissipating unit 3, and the housing 10 toward the second surface 22 from the first surface 21 of the substrate 2. The heat dissipating part 3 includes a first contact surface 32a in contact with the second surface 22 of the substrate 2 and a direction closer to the base 8 than the first contact surface 32a. And a first extension part 310 provided so as to be in contact with the housing 10.

  The substrate 2 has a first surface 21 and a second surface 22 that is the back surface of the first surface 21. From the viewpoint of improving heat dissipation, the substrate 2 is preferably formed of a material having high thermal conductivity (for example, a metal material or a metal oxide material). In the present embodiment, the substrate 2 is made of aluminum. An insulating material may be applied to the surface of the substrate 2. Thereby, even if the board | substrate 2 is formed with an electroconductive material, insulation with the wiring etc. to LED1 can be taken.

  The LED 1 is provided on the first surface 21 of the substrate 2. LED1 functions as a light emitting element. As the LED 1, various known LEDs can be used. For example, an LED that emits white light may be used as the LED 1. In the present embodiment, the LED 1 is a high-luminance type LED that emits white light for illumination.

  The LED lamp 100 may have a plurality of LEDs 1. In the example shown in FIG. 3, three LEDs 1 are provided on the first surface 21 of the substrate 2.

  The housing 10 accommodates the substrate 2, the LED 1, and the heat dissipation unit 3. In the present embodiment, the housing 10 is configured in a cylindrical shape, and the substrate 2, the LED 1, and the heat radiating unit 3 are arranged in the accommodating portion 11 inside the housing 10. In the present embodiment, since the LED lamp 100 is a light bulb shaped lamp, the cross section in the direction parallel to the substrate 2 of the housing 10 is directed from the first surface 21 of the substrate 2 toward the second surface. It has a substantially circular outer shape with a reduced diameter. Moreover, the accommodating part 11 is comprised by the substantially cylindrical shape.

  In addition, a base 8 is provided at the end portion 16 of the housing 10 in the direction from the first surface 21 to the second surface of the substrate 2. In the present embodiment, as shown in FIG. 4, a screw thread 15 is provided on the end 16 side of the housing 10, and the base 8 is screwed into the screw thread 15.

  In the example shown in FIGS. 1 to 3, the heat radiating portion 3 includes a first heat radiating portion 31 and a second heat radiating portion 32 provided so as to be in contact with each other. In addition, the heat radiating part 3 may have an integrated configuration. Since heat conduction becomes easy by making the heat radiating part 3 an integral structure, heat can be radiated more quickly.

  The heat radiating part 3 is provided so as to contact the second surface 22 of the substrate 2. Further, the heat radiating part 3 has a first contact surface 32 a that contacts the second surface 22 of the substrate 2. In this embodiment, it is comprised so that the 2nd surface 22 of the board | substrate 2 and the 1st contact surface 32a of the thermal radiation part 3 may closely_contact | adhere. Moreover, in this embodiment, the 2nd surface 22 of the board | substrate 2 and the 1st contact surface 32a of the thermal radiation part 3 are adhere | attached with the silicone type adhesive material. By bringing the second surface 22 of the substrate 2 and the first contact surface 32a of the heat radiating part 3 into close contact, the contact thermal resistance between the substrate 2 and the heat radiating part 3 can be lowered.

The heat radiating portion 3 has a first extending portion 310 that extends in a direction closer to the base 8 than the first contact surface 32 a and is provided so as to be in contact with the housing 10. In the example shown in FIGS. 1 to 3, the first extending portion 310 extends in a direction substantially perpendicular to the first contact surface 32 a. Note that the angle between the first extending portion 310 and the first contact surface 32a is not limited to being vertical, and can be set as appropriate. Moreover, in this embodiment, it is comprised so that the 1st extension part 310 and the housing | casing 10 may closely_contact | adhere. In the example illustrated in FIG. 1, the first extending portion 310 and the groove portion 10 a provided in the housing 10 are configured to be fitted. Moreover, in this embodiment, the 1st extension part 310 and the housing | casing 10 are adhere | attached with the silicone type adhesive material. By bringing the first extending portion 310 and the housing 10 into close contact, the contact thermal resistance between the heat radiating portion 3 and the housing 10 can be lowered.

  According to the LED lamp 100 according to the present embodiment, the heat generated in the LED 1 can be diffused to the housing 10 via the first extending portion 310, so that heat can be radiated to the outside via the housing 10. In particular, in the usage pattern in which the base 8 side is on, which is a normal usage pattern when the LED lamp 100 is used as illumination, the first extension portion 310 extends in a direction in which heat easily moves. An LED lamp with high heat dissipation can be realized.

  The heat dissipating part 3 is the back surface side of the first contact surface 32a and is in contact with the housing 10 at a position farther from the center of the heat dissipating part 3 than the first extending part 31 when viewed from the base 8 side. You may have. In the present embodiment, the second contact surface 32 b is configured to be in contact with the stepped portion 14 provided inside the housing 10. By having the 2nd contact surface 32b, since the contact area of the thermal radiation part 3 and the housing | casing 10 becomes large, it can thermally radiate more effectively. Moreover, when the heat radiation part 3 and the housing 10 are in contact with each other at a position farther from the center of the heat radiation part 3 than the first extension part 310, a structure more suitable for the shape of the light bulb shaped lamp is obtained.

  The heat dissipation part 3 may have a second extension part 320 that extends in a direction away from the base 8 relative to the second contact surface 32b. In the example shown in FIGS. 1 to 3, the second extending portion 320 extends in a direction substantially perpendicular to the second contact surface 32 b. Note that the angle between the second extending portion 320 and the second contact surface 32b is not limited to being vertical, and can be set as appropriate. By having the 2nd extension part 320, since the heat capacity of the thermal radiation part 3 can be enlarged, the heat which generate | occur | produced by LED1 can be stored in the 2nd extension part 320. FIG. Therefore, it can suppress that the temperature of LED1 rises. Further, by adopting a structure in which the second extending portion 320 is extended in the direction away from the base 8, the structure is more suitable for the shape of the light bulb shaped lamp.

  The second extension 320 of the heat radiating unit 3 may be configured to be in close contact with the housing 10. For example, the second extending part 320 of the heat radiating part 3 and the inner peripheral part 14a of the housing 10 may be configured to be fitted. For example, the 2nd extension part 320 of the thermal radiation part 3 and the inner peripheral part 14a of the housing | casing 10 may be adhere | attached with the silicone type adhesive material. By bringing the second extending portion 320 and the housing 10 into close contact, the contact thermal resistance between the heat radiating portion 3 and the housing 10 can be lowered. Therefore, the heat of the heat radiating part 3 can be radiated more quickly.

  In the example shown in FIGS. 1 to 3, the heat radiating part 3 includes a first plate-like part 312 and a first extending part 30 provided on at least a part of the outer periphery of the first plate-like part 312. A first heat dissipating part 31, a first contact surface 32 a, a second contact surface 32 b, a second plate part 322 provided so as to be in contact with the first plate part 312, and a second plate part 322. And a second heat dissipating part 32 having a second extending part 320 provided on at least a part of the outer periphery. According to such a configuration, since the first heat radiating portion 31 and the second heat radiating portion 32 can be easily formed by press working, the heat radiating portion 3 can be easily formed by press working.

  In the example shown in FIGS. 1 to 3, the first heat radiating portion 31 and the second heat radiating portion 32 are configured to be in close contact with each other. Moreover, in the example shown by FIGS. 1-3, the 1st thermal radiation part 31 and the 2nd thermal radiation part 32 are adhere | attached with the silicone type adhesive material. By bringing the first heat radiating part 31 and the second heat radiating part 32 into close contact, the contact thermal resistance between the first heat radiating part 31 and the second heat radiating part 32 can be lowered.

  In the example shown in FIG. 3, the shape of the heat radiating portion 3 viewed from the base 8 side is configured to be substantially circular. As a result, a structure suitable for the shape of the light bulb shaped lamp is obtained. Moreover, in the example shown by FIG. 3, the shape of the 1st thermal radiation part 31 and the 2nd thermal radiation part 32 seen from the nozzle | cap | die 8 side is comprised by substantially circle shape. As a result, a structure suitable for the shape of the light bulb shaped lamp is obtained.

  The heat radiation part 3 may be formed of a metal material. In the present embodiment, the heat radiating part 3 is made of aluminum. Since the thermal radiation part 3 formed with the metal material has high thermal conductivity, the heat generated from the LED 1 can be radiated quickly.

  The LED lamp 100 according to the present embodiment may be further included in the housing 10 and further include a power supply unit 6 that supplies power to the LED 1. Moreover, the housing | casing 10 may be formed with the resin material. From the viewpoint of heat resistance, for example, polybutylene terephthalate resin or polyphenylene sulfide resin can be used as the resin material. Moreover, from the viewpoint of heat dissipation, as the resin material, for example, a heat dissipating resin in which heat dissipation is improved by mixing a metal filler or a metal oxide filler can be used.

  In the present embodiment, the power supply unit 6 is configured by soldering electronic components constituting a power supply circuit such as a transformer, a rectifier, an electrolytic capacitor, and a noise filter to a substrate. The power supply unit 6 is electrically connected to the LED 1 via a wiring (not shown). Further, in the present embodiment, the power supply unit 6 is housed on the side closer to the base 8 than the heat radiating unit 3 in the housing part 11 of the housing 10. In the present embodiment, the end portion of the accommodating portion 11 on the side close to the end portion 16 of the housing 10 is configured to have a smaller diameter than the width of the power source portion 6. Thereby, it is possible to prevent the power supply unit 6 from falling off.

  According to this embodiment, since the housing 10 formed of a resin material has low thermal conductivity, heat generated in the LED 1 can be suppressed from being transmitted to the power supply unit 6. Therefore, it can suppress that the temperature of the power supply part 6 rises.

  Moreover, since the housing 10 made of a resin material has low conductivity, the withstand voltage between the housing 10 and the base 8 can be increased. For example, when an insulating plate of about 4 mm is inserted between the housing 10 and the base 8 made of aluminum, the current value of the current flowing between the housing 10 and the base 8 is 0.5 mA or less. In this range, the maximum voltage that can be applied between the casing 10 and the base 8 was about 2000V. However, in this embodiment, even if a voltage of 5000 V is applied between the casing 10 and the base 8 formed of polybutylene terephthalate resin, the current value of the current flowing between the casing 10 and the base 8 is It was significantly below 0.5 mA.

  In the present embodiment, the heat radiating unit 3 may be in contact with a portion where the thickness of the housing 10 is minimized. In the example shown in FIG. 2, the thickness A from the groove 10 a of the housing 10 to the outer surface of the housing 10 is configured to be the thinnest thickness in the housing 10. In the present embodiment, the minimum thickness A of the housing 10 is 1 mm. As a result, the heat of the heat radiating part 3 can be easily radiated to the outside through the outer peripheral wall 14b of the housing 10, so that the heat dissipation can be further enhanced. According to the experiment, it was possible to improve the heat dissipation particularly by setting the minimum thickness of the housing 10 to 2.5 mm or less. Moreover, the housing 10 can be reduced in weight by making the housing 10 thinner.

  In the present embodiment, as shown in FIG. 4, the housing 10 may have a plurality of fins 12 formed on the outer surface. Since the surface area of the outer surface of the housing 10 is increased by forming the plurality of fins 12 in the housing 10, heat dissipation can be further improved.

  The LED lamp 100 according to the present embodiment may further include a cap 5 formed of an insulating material. In the present embodiment, the cap 5 is provided between the heat dissipation unit 3 and the power supply unit 6. By providing the cap 5, it is possible to insulate the heat radiating unit 3 and the power supply unit 6.

  The LED lamp 100 according to the present embodiment may further include a cover 7. The cover 7 is provided so as to cover an end of the housing 10 opposite to the base 8 (an end opposite to the end 16 of the housing 10). Moreover, it is preferable that the cover 7 is formed of a material that is highly transmissive to the light emitted from the LED 1. By providing the cover 7, electronic components such as the LED 1 can be protected. In the present embodiment, it is provided on the side closer to the end portion on the opposite side to the base 8 of the housing 10 than the step portion 14 of the housing 10 (the end portion on the opposite side to the end portion 16 of the housing 10). The step portion 13 and the cover 7 are configured to be fitted.

2. Manufacturing Method of LED Lamp According to this Embodiment An example of a manufacturing method of the LED lamp 100 according to this embodiment will be described with reference to FIGS.

  First, the power supply unit 6 is inserted into the housing unit 11 of the housing 10. In the present embodiment, as shown in FIG. 1, a guide portion 17 formed in a tapered shape is provided inside the housing portion 11 of the housing 10, and the power source portion 6 and the guide portion 17 are fitted. By combining, the power supply unit 6 is locked in the housing unit 11 of the housing 10. Moreover, LED1 may be previously connected to the power supply part 6 via the wiring not shown.

  Next, the cap 5 is put on the power supply unit 6. In the present embodiment, the cap 5 is locked in the housing portion 11 of the housing 10 by fitting the cap 5 and the inner wall surface of the housing portion 11 of the housing 10.

  Next, the first heat radiating portion 31 is placed on the cap 5. In the present embodiment, the first extending portion 310 of the first heat radiating portion 31 is inserted into the groove portion 10 a provided in the housing 10 together with the silicone adhesive material and the first extending portion 310 of the first heat radiating portion 31 is inserted. And the housing 10 are brought into close contact with each other.

  Next, the second heat radiation part 32 is brought into close contact with the first heat radiation part 31. In the present embodiment, a silicone-based adhesive is applied to the upper surface 31 a of the first heat radiating portion 31 to bond the first heat radiating portion 31 and the second heat radiating portion 32.

  Next, the substrate 2 is placed on the second heat radiation part 32. In the present embodiment, the substrate 2 is fixed by screwing the substrate 2 to the second heat radiating portion 32 and the housing 10 with screws 9.

  Next, a silicone adhesive is applied between the second extending portion 320 of the second heat radiating portion 32 and the housing 10 to bring the second heat radiating portion 32 and the housing 10 into close contact, and the cover 7 is attached. The housing 10 is fixed.

  Next, the base 8 is fixed to the housing 10 by screwing the base 8 into the screw thread 15 of the housing 10.

  With these procedures, the LED lamp 100 according to the present embodiment can be easily assembled.

3. Experimental Example Next, an experimental example showing one of the effects of the LED lamp 100 according to the present embodiment will be described.

First, as an example, an LED lamp 100 according to the present embodiment was prepared. In the LED lamp 100 used for the experiment, the housing 10 is made of polybutylene terephthalate resin, and the heat radiating portion 3 is made of aluminum. Other configurations are the same as those described with reference to FIGS.

  Next, as a comparative example, in a light bulb shaped lamp disclosed in Japanese Patent Application Laid-Open No. 2010-40221, a radiator (a configuration corresponding to the housing 10 in the present embodiment) is formed of polybutylene terephthalate resin. ing. Moreover, the element of the specification same as the LED lamp 100 which concerns on an Example was used as LED. That is, the light bulb shaped lamp in the comparative example corresponds to a configuration in which the heat radiating unit 3 is omitted from the LED lamp 100 in the present embodiment.

  In this experiment, the time change of the temperature of the LED was measured in a state where the LED lamp according to the example and the light bulb shaped lamp according to the comparative example were respectively turned on.

  FIG. 5 is a graph showing temporal changes in LED temperatures in Examples and Comparative Examples. The horizontal axis represents time from the start of lighting, and the vertical axis represents temperature.

  In the examples, even after 60 minutes had elapsed since the start of lighting, the LED lifetime was below the temperature (use limit temperature) that is guaranteed to be 40,000 hours or more. On the other hand, in the comparative example, the temperature exceeded the use limit temperature after about 30 minutes from the start of lighting.

  From this experiment, it has been confirmed that the LED lamp 100 according to the present embodiment exhibits high heat dissipation compared to the comparative example.

  As described above, the LED lamp 100 according to the present embodiment has high heat dissipation even when the housing 10 is formed of a resin material having low thermal conductivity without providing a cooling fan. Therefore, an LED lamp that can be configured at low cost can be realized.

  In addition, embodiment mentioned above and a modification are examples, Comprising: It is not necessarily limited to these. For example, a plurality of embodiments and modifications can be combined as appropriate.

  The present invention is not limited to the above-described embodiments, and various modifications can be made. For example, the present invention includes substantially the same configuration (for example, a configuration having the same function, method and result, or a configuration having the same purpose and effect) as the configuration described in the embodiment. In addition, the invention includes a configuration in which a non-essential part of the configuration described in the embodiment is replaced. In addition, the present invention includes a configuration that exhibits the same operational effects as the configuration described in the embodiment or a configuration that can achieve the same object. In addition, the invention includes a configuration in which a known technique is added to the configuration described in the embodiment.

1 LED, 2 substrate, 3 heat radiation part, 4b 1st extension part, 5 cap, 6 power supply part, 7
Cover, 8 cap, 9 screw, 10 housing, 10a groove, 11 receiving portion, 12 fin, 13 step, 14 step, 14a inner periphery, 14b outer peripheral wall, 15 threads, 16 end, 21 1st Surface, 22 2nd surface, 31 1st heat radiation part, 31a upper surface, 32 2nd heat radiation part, 32a 1st contact surface, 32b 2nd contact surface, 100 LED lamp, 310 1st extension part, 312 1st plate shape Part, 320 second extension part, 322 second plate-like part

Claims (4)

A substrate having a first surface and a second surface which is the back surface of the first surface;
LEDs provided on the first surface of the substrate;
A heat dissipating part provided in contact with the second surface of the substrate;
A power supply for supplying power to the LED;
A housing for housing the power supply unit;
A base provided at an end of the housing in a direction from the first surface toward the second surface of the substrate;
Including
The heat dissipation part is
A first contact surface in contact with the second surface of the substrate;
A first extending portion that extends in a direction closer to the base than the first contact surface and is provided in contact with the housing;
Have
The 1st part of the said housing | casing is an LED lamp provided between the said 1st extension part and the said power supply part. The LED lamp according to claim 1, wherein
The second portion of the housing is an LED lamp provided outside the first extending portion. The LED lamp according to claim 1 or 2,
The heat dissipation part is
The LED lamp which has a 2nd extension part extended in the direction away from the said nozzle | cap | die from the said 1st extension part. The LED lamp according to any one of claims 1 to 3,
The heat radiation portion is an LED lamp formed of a metal material.

Images