GB2501525B - Heat dissipation structure for light bulb assembly - Google Patents

Heat dissipation structure for light bulb assembly

Info

Publication number
GB2501525B
GB2501525B GB1207399.5A GB201207399A GB2501525B GB 2501525 B GB2501525 B GB 2501525B GB 201207399 A GB201207399 A GB 201207399A GB 2501525 B GB2501525 B GB 2501525B
Authority
GB
United Kingdom
Prior art keywords
heat dissipation
light bulb
dissipation structure
bulb assembly
assembly
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
GB1207399.5A
Other versions
GB2501525A (en
GB201207399D0 (en
Inventor
Chen-Chun Lien
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Everspring Industry Co Ltd
Original Assignee
Everspring Industry Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Everspring Industry Co Ltd filed Critical Everspring Industry Co Ltd
Priority to GB1207399.5A priority Critical patent/GB2501525B/en
Publication of GB201207399D0 publication Critical patent/GB201207399D0/en
Publication of GB2501525A publication Critical patent/GB2501525A/en
Application granted granted Critical
Publication of GB2501525B publication Critical patent/GB2501525B/en
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50Cooling arrangements
    • F21V29/70Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/74Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades
    • F21V29/77Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical diverging planar fins or blades, e.g. with fan-like or star-like cross-section
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21KNON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/20Light sources comprising attachment means
    • F21K9/23Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21YINDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00Light-generating elements of semiconductor light sources
    • F21Y2115/10Light-emitting diodes [LED]

Landscapes

  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Optics & Photonics (AREA)
  • Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
  • Non-Portable Lighting Devices Or Systems Thereof (AREA)
  • Fastening Of Light Sources Or Lamp Holders (AREA)
GB1207399.5A 2012-04-27 2012-04-27 Heat dissipation structure for light bulb assembly Expired - Fee Related GB2501525B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
GB1207399.5A GB2501525B (en) 2012-04-27 2012-04-27 Heat dissipation structure for light bulb assembly

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB1207399.5A GB2501525B (en) 2012-04-27 2012-04-27 Heat dissipation structure for light bulb assembly

Publications (3)

Publication Number Publication Date
GB201207399D0 GB201207399D0 (en) 2012-06-13
GB2501525A GB2501525A (en) 2013-10-30
GB2501525B true GB2501525B (en) 2014-03-12

Family

ID=46330455

Family Applications (1)

Application Number Title Priority Date Filing Date
GB1207399.5A Expired - Fee Related GB2501525B (en) 2012-04-27 2012-04-27 Heat dissipation structure for light bulb assembly

Country Status (1)

Country Link
GB (1) GB2501525B (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103615674B (en) * 2013-11-16 2016-03-02 立达信绿色照明股份有限公司 Large-angle emission LED lamp

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7631987B2 (en) * 2008-01-28 2009-12-15 Neng Tyi Precision Industries Co., Ltd. Light emitting diode lamp
WO2011155432A1 (en) * 2010-06-07 2011-12-15 アイリスオーヤマ株式会社 Led lamp

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7631987B2 (en) * 2008-01-28 2009-12-15 Neng Tyi Precision Industries Co., Ltd. Light emitting diode lamp
WO2011155432A1 (en) * 2010-06-07 2011-12-15 アイリスオーヤマ株式会社 Led lamp

Also Published As

Publication number Publication date
GB2501525A (en) 2013-10-30
GB201207399D0 (en) 2012-06-13

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Legal Events

Date Code Title Description
PCNP Patent ceased through non-payment of renewal fee

Effective date: 20190427