JP5666318B2 - Halogen lamp type LED lighting fixture - Google Patents

Halogen lamp type LED lighting fixture Download PDF

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JP5666318B2
JP5666318B2 JP2011002581A JP2011002581A JP5666318B2 JP 5666318 B2 JP5666318 B2 JP 5666318B2 JP 2011002581 A JP2011002581 A JP 2011002581A JP 2011002581 A JP2011002581 A JP 2011002581A JP 5666318 B2 JP5666318 B2 JP 5666318B2
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halogen lamp
radiator
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lighting device
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JP2012146425A (en
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稲葉 博文
博文 稲葉
吉田 亘
亘 吉田
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株式会社稲葉電機
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    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K9/00Arc welding or cutting
    • B23K9/16Arc welding or cutting making use of shielding gas
    • B23K9/173Arc welding or cutting making use of shielding gas and of a consumable electrode
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K9/00Arc welding or cutting
    • B23K9/24Features related to electrodes
    • B23K9/28Supporting devices for electrodes
    • B23K9/29Supporting devices adapted for making use of shielding means
    • B23K9/291Supporting devices adapted for making use of shielding means the shielding means being a gas
    • B23K9/295Supporting devices adapted for making use of shielding means the shielding means being a gas using consumable electrode-wire

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Non-Portable Lighting Devices Or Systems Thereof (AREA)
  • Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)

Description

本願発明は既存の白熱電球、ミニ電球、クリプトン電球、ボール型電球、レフランプ型電球、ハロゲンランプ、ビームランプといった各種電球やランプと同様の形状で、それらに代えて使用できるLED照明具に関する。   The present invention relates to an LED illuminator that has the same shape as various light bulbs and lamps such as existing incandescent light bulbs, mini light bulbs, krypton light bulbs, ball type light bulbs, reflex lamp type light bulbs, halogen lamps, and beam lamps.

近年、既存の白熱電球、ハロゲンランプ、各種口金付き電球に代わって、省電力、長寿命といった長所を有するLEDを用いたLED電球が開発され普及し始めている。LEDは前記長所を有する一方で放熱量が多いという難点があるため、LEDを用いた照明具には放熱対策が施されている。放熱対策が施されたLED照明具として、LED光源及び電源回路等の周囲を筒状の放熱カバーで囲ったもの(特許文献1)や、口金の先にラッパ状に広がる金属製の放熱カバー(ヒートシンク)を設け、そのヒートシンク内にLED光源を設けたもの(特許文献2)等がある。   In recent years, instead of existing incandescent bulbs, halogen lamps, and bulbs with various caps, LED bulbs using LEDs having advantages such as power saving and long life have been developed and are beginning to spread. While LED has the above-mentioned advantages, it has a drawback that it has a large amount of heat dissipation, and therefore, a lighting tool using LED is provided with a heat dissipation measure. As LED lighting fixtures with heat dissipation measures, the LED light source and power supply circuit are surrounded by a cylindrical heat dissipation cover (Patent Document 1), or a metal heat dissipation cover that spreads in a trumpet shape at the end of the base ( A heat sink) and an LED light source provided in the heat sink (Patent Document 2).

特開2009−93926号公報JP 2009-93926 A 特開2001−243809号公報Japanese Patent Laid-Open No. 2001-243809

(1)特許文献1、2記載のLED照明具は、金属製のヒートシンクが口金とバルブの間に配置されているため、LEDからの照明光はヒートシンクの周囲には出射されず、バルブの先だけしか照明されない。このため照明エリアが狭い、ヒートシンクの形状が特殊であるため電球全体の形状が特殊になり、用途が限られるといった難点がある。これまでの白熱電球を見慣れた人にとっては形状に違和感があるといった難点がある。
(2)特許文献1、2のいずれに記載のLED照明具も、ヒートシンクの外面温度が高温になるため、手が触れると火傷をするおそれがある。また、ヒートシンクからの放熱で照明具の周囲が昇温し易い。
(3)特許文献1、2のいずれに記載のLED照明具もヒートシンクが大型であるため、電球が従来の電球に比して大型であり、ヒートシンクがアルミダイキャスト製であるため重い。
(1) In the LED lighting devices described in Patent Documents 1 and 2, since the metal heat sink is disposed between the base and the bulb, the illumination light from the LED is not emitted around the heat sink, and the tip of the bulb Only is illuminated. For this reason, since the illumination area is narrow and the shape of the heat sink is special, the shape of the entire bulb is special, and there is a problem that the application is limited. For those who are familiar with incandescent lamps, there is a problem that the shape is uncomfortable.
(2) The LED illuminator described in any of Patent Documents 1 and 2 may be burned when touched by a hand because the outer surface temperature of the heat sink becomes high. In addition, the temperature around the lighting fixture easily rises due to heat radiation from the heat sink.
(3) Since the LED illuminator described in Patent Documents 1 and 2 has a large heat sink, the light bulb is larger than a conventional light bulb and is heavy because the heat sink is made of aluminum die cast.

本願発明の課題は、前記諸問題を解決でき、省電力、長寿命というLEDの長所を生かしつつ、大型のヒートシンクを設けなくとも効率良く放熱でき、放熱体の外表面が昇温しにくく、火傷する危険が少なく、従来のLED照明具に比して照明エリアが広く、小型化できるLED照明具を提供することにある。   The object of the present invention is to solve the above problems, take advantage of LED power saving and long life, and efficiently dissipate without providing a large heat sink. It is an object of the present invention to provide an LED illuminator that can be reduced in size and has a smaller illumination area than conventional LED illuminators.

本願発明のLED照明具は、口金類と、光源用LEDと、放熱体と、LED用電源回路や電子部品が搭載された回路基板を備えたLED照明具において、回路基板が筒状の放熱体の内側に収容され、口金が前記放熱体に装備され、LEDが前記放熱体に搭載され、前記放熱体は高熱伝導率の炭素繊維を含む樹脂製であり、その放熱体の外周が熱伝導性のある絶縁塗料で被覆されたものである。高熱伝導率の炭素繊維としては、後述する黒鉛化炭素繊維が好ましい。絶縁塗料の被覆は電着塗装で行うことができる。   The LED illuminator of the present invention is an LED illuminator including a base, an LED for a light source, a radiator, and a circuit board on which an LED power supply circuit and electronic components are mounted. The base is mounted on the radiator, the LED is mounted on the radiator, the radiator is made of resin containing carbon fiber with high thermal conductivity, and the outer periphery of the radiator is thermally conductive. It is coated with some insulating paint. As the carbon fiber having high thermal conductivity, graphitized carbon fiber described later is preferable. The insulating coating can be applied by electrodeposition coating.

本願発明のLED照明具は、口金類と、光源用LEDと、放熱体と、LED用電源回路や電子部品が搭載された回路基板を備えたLED照明具において、回路基板が筒状の放熱体の内側に収容され、口金が前記放熱体に装備され、LEDが前記放熱体に搭載され、前記放熱体の内周面に吸熱用フィンを設けたものである。   The LED illuminator of the present invention is an LED illuminator including a base, an LED for a light source, a radiator, and a circuit board on which an LED power supply circuit and electronic components are mounted. The base is mounted on the radiator, the LED is mounted on the radiator, and an endothermic fin is provided on the inner peripheral surface of the radiator.

本願発明のLED照明具は、口金類と、光源用LEDと、放熱体と、LED用電源回路や電子部品が搭載された回路基板を備えたLED照明具において、前記放熱体の内周面に吸熱用フィンが設けられ、回路基板が筒状の放熱体の内側に収容され、口金が前記放熱体に装備され、LEDが前記放熱体に搭載され、前記放熱体は高熱伝導率の炭素繊維を含む樹脂製であり、その放熱体の外周が熱伝導性のある絶縁塗料で被覆されたものである。   The LED illuminator of the present invention is an LED illuminator including a base, an LED for a light source, a radiator, and a circuit board on which an LED power supply circuit and electronic components are mounted. An endothermic fin is provided, a circuit board is accommodated inside a cylindrical radiator, a base is mounted on the radiator, an LED is mounted on the radiator, and the radiator is made of high thermal conductivity carbon fiber. The outer periphery of the heat radiating body is covered with a thermally conductive insulating paint.

本願発明のLED照明具は、前記LED照明具において、放熱体の外周面に放熱用フィンを設けたものである。   The LED illuminator of the present invention is the LED illuminator provided with heat dissipating fins on the outer peripheral surface of the radiator.

本願発明のLED照明具は、前記LED照明具において、LED用電源回路に過電流切断器を設けたものである。   The LED lighting device of the present invention is an LED lighting device in which an overcurrent disconnector is provided in an LED power supply circuit.

本願発明のLED照明具は、前記LED照明具において、回路基板が放熱体の内側空間内に縦向きに配置されたものである。   The LED lighting device of the present invention is the LED lighting device in which the circuit board is arranged vertically in the inner space of the radiator.

本願発明のLED照明具は、前記LED照明具において、LEDの先方にLEDからの光を出射方向先方に導光するレンズを設けたものである。   The LED illuminator of the present invention is the LED illuminator provided with a lens that guides light from the LED to the front side of the LED in the emission direction.

本願発明のLED照明具は、前記LED照明具において、放熱体の先端側に、LEDからの光を反射させる反射ミラーが設けられ、その反射ミラーは略椀型のミラー本体の内面が内側反射面、外面が凹凸の外側反射面であり、底の部分にLEDを配置可能なLED配置孔があり、そのLED配置孔の周面がLEDからの光が入射可能な入射面であり、前記内側反射面は前記LED配置孔から進入するLEDからの光を反射させ、前記外側反射面は前記入射面から入射してミラー本体の肉厚内を進むLEDからの光が乱反射して外側反射面の外側に出射するようにしてある。 In the LED lighting device of the present invention, in the LED lighting device, a reflection mirror that reflects light from the LED is provided on the front end side of the radiator, and the inner surface of the substantially bowl-shaped mirror body is the inner reflection surface. The outer surface is an uneven outer reflection surface, and there is an LED arrangement hole in which the LED can be arranged at the bottom, and the peripheral surface of the LED arrangement hole is an incident surface on which light from the LED can enter, and the inner reflection The surface reflects light from the LED entering from the LED arrangement hole , and the outer reflective surface is incident on the incident surface and diffuses light from the LED that travels within the thickness of the mirror body, and is outside the outer reflective surface. It is made to radiate | emit to.

本願発明のLED照明具は次のような効果がある。
(1)放熱体が高熱伝導率の炭素繊維を含む樹脂製であるため放熱性に優れ、放熱体を小型化しても放熱ができ、従来のヒートシンクのような大型の放熱体を必要としないため、この放熱体を従来のハロゲンランプのベースの代用として、或いは既存のLED電球のヒートシンクの代用として使用すれば、照明具を小型化することができる。
(2)LEDからの光が放熱体で遮光されずバルブの側方も照明され、照射範囲が広角になる。火傷をするおそれがない。
(3)高熱伝導率の炭素繊維を含む樹脂製の放熱体の外周を、導電性絶縁材で被覆したため、放熱体が導電性であっても漏電の危険性がなく、しかも、放熱性も確保されるため、前記(2)記載の効果が確保される。
(4)放熱体の内周面に吸熱フィンを設けたので、放熱体の内表面積が広くなり、LEDや電源回路から発生する熱が吸熱され易くなり、吸熱された熱が放熱体を通して外部に放熱されるので、放熱体を小型化しても放熱性に優れ、照明具を小型化できる。
(5)回路基板が放熱体の内側空間内に収容されているので、LED照明具の形状もサイズも小型化でき、従来のフィラメント式の電球やハロゲンランプ等とほとんど同じにすることができ、大型化せず違和感もない。
(6)放熱体の外周面に放熱用フィンを設けたので、より一層放熱性が向上する。
(7)LED用電源回路に過電流切断器(例えばヒューズ)を設けたので、電源回路に定格以上の電流(過電流)が流れることがなく、電源回路やLEDが損傷せず長寿命になり、放熱体が異常に高熱になることもないので発火の危険を回避することもできる。
(8)回路基板が放熱体の内部空間内に縦向きに配置されているので、放熱体の内部空間を有効活用でき、回路基板を設けるスペースを別途設ける必要がないので小型化できる。
(9)バルブ内にLEDからの光を出射方向先方に導光する透光性レンズを設けたので、LEDからの光がレンズを通して効率よく先方に導光される。また、レンズ外周面からも出射されるのでLEDからの光が直進性であってもバルブの側方も照明され照射範囲が広がる。
(10)反射ミラーの内面が内側反射面、外面が凹凸の外側反射面であり、底の部分にLEDを配置可能なLED配置孔があり、そのLED配置孔の周面がLEDからの光が入射可能な入射面であり、前記内側反射面は前記LED配置孔から進入するLEDからの光を反射させ、前記外側反射面は前記入射面から入射してミラー本体の肉厚内を進むLEDからの光が乱反射して外側反射面の外側に出射するようにしてあるので、反射ミラーの内側が照明されるのみでなく、反射ミラーの外周面も照明されて明るくなる。LED光は直進性であるため従来の反射ミラーではその外周面を照明することはできなかった。
L ED lighting fixture of the present invention has the following effects.
(1) Since the radiator is made of resin containing carbon fiber with high thermal conductivity, it has excellent heat dissipation, and even if the radiator is reduced in size, it can dissipate heat and does not require a large radiator such as a conventional heat sink. If this heat radiator is used as a substitute for a conventional halogen lamp base or as a substitute for a heat sink of an existing LED bulb, the illuminator can be miniaturized.
(2) The light from the LED is not shielded by the heat radiating body, and the side of the bulb is illuminated, and the irradiation range becomes a wide angle. There is no risk of burns.
(3) Since the outer periphery of a resin heat sink containing carbon fiber with high thermal conductivity is covered with a conductive insulating material, there is no risk of leakage even if the heat sink is conductive, and heat dissipation is also ensured. Therefore, the effect described in (2) is ensured.
(4) Since the heat sink is provided on the inner peripheral surface of the radiator, the inner surface area of the radiator is increased, the heat generated from the LED and the power supply circuit is easily absorbed, and the absorbed heat is transferred to the outside through the radiator. Since the heat is radiated, even if the heat radiator is reduced in size, the heat dissipation is excellent, and the lighting fixture can be reduced in size.
(5) Since the circuit board is housed in the inner space of the radiator, the shape and size of the LED illuminator can be reduced, and it can be made almost the same as a conventional filament type bulb or halogen lamp, There is no sense of incongruity without upsizing.
(6) Since the heat dissipating fins are provided on the outer peripheral surface of the heat dissipating body, the heat dissipation is further improved.
(7) Since the LED power supply circuit is provided with an overcurrent disconnector (for example, a fuse), no current (overcurrent) exceeding the rated value will flow in the power supply circuit, and the power supply circuit and LED will not be damaged, resulting in a long service life. Since the heat radiator does not become abnormally hot, the risk of ignition can be avoided.
(8) Since the circuit board is disposed vertically in the internal space of the heat radiating body, the internal space of the heat radiating body can be used effectively, and it is not necessary to separately provide a space for providing the circuit board, thereby reducing the size.
(9) Since the translucent lens for guiding the light from the LED in the emission direction is provided in the bulb, the light from the LED is efficiently guided to the front through the lens. Moreover, since it is radiate | emitted also from a lens outer peripheral surface, even if the light from LED is a rectilinear advance, the side of a bulb | ball is illuminated and the irradiation range spreads.
(10) The inner surface of the reflection mirror is an inner reflection surface, the outer surface is an uneven outer reflection surface, and there is an LED arrangement hole in which the LED can be arranged at the bottom, and the peripheral surface of the LED arrangement hole receives light from the LED. The incident surface is an incident surface, the inner reflection surface reflects light from the LED entering from the LED arrangement hole , and the outer reflection surface is incident from the incident surface and travels within the thickness of the mirror body. Is diffusely reflected and emitted to the outside of the outer reflecting surface, so that not only the inner side of the reflecting mirror is illuminated, but also the outer peripheral surface of the reflecting mirror is illuminated and brightened. Since the LED light is straight, the conventional reflecting mirror cannot illuminate the outer peripheral surface.

本願発明のLED照明具であって、ハロゲンランプ型照明具の一例を示す斜視図。It is a perspective view which is an LED lighting fixture of this invention, Comprising: An example of a halogen lamp type lighting fixture. 図1に示すハロゲンランプ型LED照明具の分解図。The exploded view of the halogen lamp type | mold LED lighting fixture shown in FIG. 図1に示すハロゲンランプ型LED照明具の放熱体の斜視図。The perspective view of the heat radiator of the halogen lamp type | mold LED lighting fixture shown in FIG. 図1に示すハロゲンランプ型LED照明具の断面図。Sectional drawing of the halogen lamp type | mold LED lighting fixture shown in FIG. 本願発明の電球型LED照明具の一例を示す断面図。Sectional drawing which shows an example of the lightbulb type LED lighting fixture of this invention. (a)、(b)は本願発明の電球型LED照明具に使用されるレンズの異なる例を示す断面図。(A), (b) is sectional drawing which shows the example from which the lens used for the light bulb type LED lighting fixture of this invention differs. (a)、(b)は本願発明の電球型LED照明具の口金の異なる例を示す断面図。(A), (b) is sectional drawing which shows the example from which a nozzle | cap | die of the bulb-type LED lighting fixture of this invention differs. 本願発明のハロゲンランプ型LED照明具の反射ミラーの一例を示す断面図。Sectional drawing which shows an example of the reflective mirror of the halogen lamp type | mold LED lighting fixture of this invention.

(LED照明具1)
本願発明のLED照明具は、光源にLEDを使用し、既存の電球用ソケットに脱着可能なスクリュータイプの口金や、2ピンタイプの口金、ワンタッチタイプの口金といった各種形状、構造の口金、ライティングレール用ソケット、シーリング、ローゼット、アダプタ、コンセント等の受け具に脱着可能な電気接続具(以下これら口金、電気接続具をまとめて「口金類」という。)を備えたものであり、電球型、ランプ型の各種形状のものを含むが、実施形態の一例として図1に示すものはハロゲンランプ型のLED照明具である。
(LED lighting tool 1)
The LED illuminator of the present invention uses LEDs as a light source and has various shapes and structures such as a screw-type base, a two-pin type base, and a one-touch type base that can be attached to and detached from an existing light bulb socket. It is equipped with electrical connectors that can be attached to and detached from sockets, ceilings, rosettes, adapters, receptacles, etc. (hereinafter these bases and electrical connectors are collectively referred to as “bases”). Although the thing of the various shape of a type | mold is included, what is shown in FIG. 1 as an example of embodiment is a halogen lamp type LED lighting fixture.

図1に示すLED照明具は、放熱体1の下に、電球用ソケットに脱着可能な口金類2を備え、放熱体1の先端(図1では上)に反射ミラー3を備え、光源にLED4(図2)が使用され、そのLED4を搭載したLED用基板5が前記放熱体1の受部6の上に搭載され、放熱体1の内部空間7(図3)内にLED4の動作(発光)に必要な電源回路やその他の電気回路、電子部品等を備えた回路基板(プリント基板や積層基板等)8(図2)が縦向きに収容配置されている。前記回路基板8は上方開口の筒型の保持具9(図2)内に縦向きに収容され、その保持具9を図4のように放熱体1の内部空間7に収容することにより内部空間7に収容されている。   The LED illuminator shown in FIG. 1 includes a base 2 that can be attached to and detached from a socket for a light bulb under a radiator 1, a reflection mirror 3 at the tip of the radiator 1 (upper in FIG. 1), and an LED 4 as a light source. (FIG. 2) is used, the LED substrate 5 on which the LED 4 is mounted is mounted on the receiving portion 6 of the radiator 1, and the operation (light emission) of the LED 4 in the internal space 7 (FIG. 3) of the radiator 1 is used. A circuit board (printed board, laminated board or the like) 8 (FIG. 2) provided with a power supply circuit, other electric circuits, electronic parts, etc. necessary for the above is accommodated and arranged vertically. The circuit board 8 is accommodated vertically in a cylindrical holder 9 (FIG. 2) having an upper opening, and the internal space 7 is accommodated by accommodating the holder 9 in the internal space 7 of the radiator 1 as shown in FIG. 7 is housed.

図1の放熱体1は従前のハロゲンランプのベースの代用とすることができる。図1の口金類2は既存のハロゲンランプの口金と同様にJIS規格で定められているE11口金であり、従来のハロゲンランプが脱着されていたソケットに脱着可能なものである。本願発明の口金類2は図7(a)に示すような2ピンタイプのものとか、図7(b)に示すようなワンタッチ型のもの、その他の形状、構造のものであってもよい。   The heat radiator 1 of FIG. 1 can be used as a substitute for the base of a conventional halogen lamp. A base 2 shown in FIG. 1 is an E11 base defined by the JIS standard in the same manner as a base of an existing halogen lamp, and can be attached to and detached from a socket from which a conventional halogen lamp is attached and detached. The base 2 of the present invention may be a two-pin type as shown in FIG. 7 (a), a one-touch type as shown in FIG. 7 (b), or other shapes and structures.

前記放熱体1は放熱性(伝熱性)に優れた樹脂製であり、図2に示すように上方が受部(LED搭載部)6で閉塞され、図3に示すように下方が開口された円筒状であり、周壁1a(図3)の外周面に細長の凹溝10が多数本設けられ、それら凹溝10の間に多数本の突条の放熱フィン11が設けられている。また、周壁1aの内周面には細長突条の吸熱フィン12が突設されている。それら吸熱フィン12は周壁1aの内周面の対向位置に2本平行に設けられ、隣接する2本の吸熱フィン12の間に嵌合溝13が形成されている。前記受部6(図2)には回路基板8(図2)から導出されているリード線14を差込み可能な差込み孔15が開口されている。吸熱フィン12の本数や形状等は図示したものに限られず、放熱体1の内周面の面積を広くすることができれば、他の本数、形状等にすることができる。ここで吸熱とはLEDや電源回路等から放出される熱が放熱体1に伝達されることである。このように、放熱体1の内周面から伝達された熱(吸熱)が放熱体1の外周面に伝導されてその外周面から外部に放熱される。放熱フィン11、吸熱フィン12は他の形状、本数、間隔とすることができ、それらを設ける箇所も図示した放熱体1の外周面、内周面の所望箇所とすることができる。   The heat radiating body 1 is made of a resin excellent in heat dissipation (heat conductivity), and the upper part is closed by a receiving part (LED mounting part) 6 as shown in FIG. 2, and the lower part is opened as shown in FIG. A plurality of elongated grooves 10 are provided on the outer peripheral surface of the peripheral wall 1 a (FIG. 3), and a plurality of protruding radiating fins 11 are provided between the grooves 10. Further, an elongated heat absorbing fin 12 projects from the inner peripheral surface of the peripheral wall 1a. Two endothermic fins 12 are provided in parallel at opposite positions on the inner peripheral surface of the peripheral wall 1 a, and a fitting groove 13 is formed between two adjacent endothermic fins 12. The receiving portion 6 (FIG. 2) has an insertion hole 15 into which the lead wire 14 led out from the circuit board 8 (FIG. 2) can be inserted. The number, shape, and the like of the heat-absorbing fins 12 are not limited to those shown in the drawings, and other numbers, shapes, and the like can be used as long as the area of the inner peripheral surface of the radiator 1 can be increased. Here, the heat absorption means that heat released from the LED, the power supply circuit, or the like is transmitted to the radiator 1. Thus, the heat (heat absorption) transmitted from the inner peripheral surface of the radiator 1 is conducted to the outer peripheral surface of the radiator 1 and is radiated to the outside from the outer peripheral surface. The heat dissipating fins 11 and the heat absorbing fins 12 can have other shapes, numbers, and intervals, and the locations where they are provided can also be the desired locations on the outer peripheral surface and inner peripheral surface of the radiator 1 illustrated.

前記放熱体1の成型用樹脂には、熱伝導率を高めた放熱樹脂、例えば、成型用樹脂中に熱伝導性フィラー材料を適量分散混合した樹脂が適する。熱伝導性フィラーとしては、アルミナ、窒化ホウ素、窒化アルミニウム、シリカ等の無機フィラー、銀、金、銅などの金属フィラー、高熱伝導性の炭素系フィラーなどが好ましい。これらの中でも、樹脂の熱伝導率を最も効率的に高め、機械的強度や成形性にも高い性能が得られる高結晶性の黒鉛構造を有する黒鉛化炭素繊維が好ましく、特に、メソフェーズピッチを原料とし、平均繊維径が2〜20μm、平均繊維長が30〜1000μm、黒鉛結晶の六角網面の成長方向に由来する結晶子サイズが20nm以上である黒鉛化炭素短繊維が好ましい。平均繊維径はより好ましくは5〜15μm、平均繊維長はより好ましくは70〜300μm、結晶子サイズはより好ましくは40nm程度である。   As the molding resin of the heat radiating body 1, a heat radiating resin having an increased thermal conductivity, for example, a resin in which an appropriate amount of a heat conductive filler material is dispersed and mixed in the molding resin is suitable. As the heat conductive filler, inorganic fillers such as alumina, boron nitride, aluminum nitride and silica, metal fillers such as silver, gold and copper, carbon fillers having high heat conductivity and the like are preferable. Among these, graphitized carbon fibers having a highly crystalline graphite structure that can increase the thermal conductivity of the resin most efficiently and obtain high performance in mechanical strength and moldability are preferable, and mesophase pitch is particularly used as a raw material. Graphite carbon short fibers having an average fiber diameter of 2 to 20 μm, an average fiber length of 30 to 1000 μm, and a crystallite size derived from the growth direction of the hexagonal network surface of the graphite crystal are preferably 20 nm or more. The average fiber diameter is more preferably 5 to 15 μm, the average fiber length is more preferably 70 to 300 μm, and the crystallite size is more preferably about 40 nm.

黒鉛化炭素短繊維に関する商品としては、例えば帝人株式会社製のラヒーマ(登録商標:以下同じ)が挙げられる。これら黒鉛化炭素繊維を各種成形樹脂中に適量割合、例えば、10〜50wt%程度の割合で分散混合することが好ましい。   Examples of the products related to the graphitized carbon short fibers include Lahima (registered trademark: the same applies hereinafter) manufactured by Teijin Limited. These graphitized carbon fibers are preferably dispersed and mixed in various molding resins at an appropriate ratio, for example, about 10 to 50 wt%.

熱伝導性フィラーは複数種を組み合わせて利用することも可能であり、黒鉛化炭素繊維と無機フィラー及び/又は金属フィラーを組み合わせて利用する事も好ましく行われる。前記組み合わせは適量で行われるが、熱伝導フィラーをトータル30〜60wt%前後の割合で樹脂に混合した場合、放熱樹脂の熱伝導率として20W/m・K以上の高い値を得ることも可能である。マトリックスとする樹脂材料としては、各種の熱可塑性樹脂、熱硬化性樹脂が好ましく用いられ、射出成形、プレス成形、ブロー成形、真空成形、注型法などの成形法により、放熱性に優れた放熱体1を成型することができる。   It is also possible to use a combination of a plurality of heat conductive fillers, and it is also preferable to use a combination of graphitized carbon fiber and an inorganic filler and / or a metal filler. The above combination is performed in an appropriate amount, but when the heat conductive filler is mixed with the resin at a ratio of about 30 to 60 wt% in total, it is also possible to obtain a high value of 20 W / m · K or higher as the heat conductivity of the heat radiation resin. is there. As the resin material for the matrix, various thermoplastic resins and thermosetting resins are preferably used, and heat dissipation with excellent heat dissipation is achieved by molding methods such as injection molding, press molding, blow molding, vacuum molding, and casting. The body 1 can be molded.

熱可塑性樹脂としては、例えばポリエチレン、ポリプロピレン、ポリカーボネート、ポリブチレンテレフタレート、ポリフェニレンスルフィド、脂肪族ポリアミド(ナイロン)、ポリエーテルエーテルケトン、液晶ポリマー(LCP)等が挙げられ、これらのアロイ、変性体等も利用可能である。変性物としてはエラストマー成分を共重合してなる熱可塑性エラストマー等も好適に用いられる。   Examples of the thermoplastic resin include polyethylene, polypropylene, polycarbonate, polybutylene terephthalate, polyphenylene sulfide, aliphatic polyamide (nylon), polyether ether ketone, liquid crystal polymer (LCP), etc., and alloys and modified products thereof. Is available. As the modified product, a thermoplastic elastomer or the like obtained by copolymerizing an elastomer component is also preferably used.

熱硬化性樹脂としては例えばエポキシ、シリコーン、ウレタン、不飽和ポリエステル、メラミン等が挙げられる。   Examples of the thermosetting resin include epoxy, silicone, urethane, unsaturated polyester, and melamine.

本願発明の放熱体1は、その全面(外面、内周面、端面の全て)或いは外面又は外面と端面(外から手の触れる箇所)に絶縁被膜を施して絶縁性を確保することができる。ちなみに、放熱体1は、前記黒鉛化炭素繊維が混合された樹脂製の場合は導電性があるため、絶縁被膜を施さないと、放熱体1に手が触れると導通して感電するおそれがあるが、絶縁被膜を設けることにより、その危険性が解消される。絶縁被膜は電着塗装とか他の手法で施すことができる。絶縁被膜する絶縁塗料は絶縁性(耐電圧特性)があるだけでなく、放熱性のあるものが望ましく、更には、耐熱性のあるものがより一層望ましい。その一例としては株式会社シミズのエレコート(放熱/絶縁電着塗料)がある。エレコートにはポリイミドタイプ、フッ素系タイプ、フォトレジタイプ、装飾タイプ等各種のものがあるが、本願発明ではそれらのいずれも使用可能である。絶縁塗料は色彩のあるものでも良く、その場合は、放熱体1を着色することができる。   The heat dissipating body 1 of the present invention can ensure insulation by applying an insulating film to the entire surface (all of the outer surface, inner peripheral surface, and end surface), or the outer surface or the outer surface and the end surface (where the hand touches from the outside). Incidentally, since the heat radiator 1 is conductive when it is made of a resin mixed with the graphitized carbon fiber, there is a risk of electric conduction when the hand touches the heat radiator 1 unless an insulating film is applied. However, the danger is eliminated by providing the insulating coating. The insulating coating can be applied by electrodeposition coating or other methods. The insulating coating for the insulating coating is not only insulative (withstand voltage characteristics), but also preferably has heat dissipation properties, and more preferably has heat resistance properties. One example is Shimizu Corporation's Elecoat (heat dissipation / insulating electrodeposition paint). There are various types of Elecoat such as polyimide type, fluorine type, photoresist type, and decorative type, and any of them can be used in the present invention. The insulating paint may be colored, and in that case, the radiator 1 can be colored.

前記保持具9(図2)には、回路基板8を収容する収容筒部16が形成され、収容筒部16の外周面に突条のガイド17が形成され、そのガイド17は放熱体1の内周面の嵌合溝13(図3)内に嵌合可能なサイズ(横幅、長さ)にしてある。収容筒部16(図2)には鍔18が設けられている。その鍔18は、収容筒部16を保持具9の内部空間7(図3)内に嵌入すると放熱体1の底縁に当たって放熱体1への差込み位置を決めるものである。   In the holder 9 (FIG. 2), an accommodation cylinder portion 16 that accommodates the circuit board 8 is formed, and a protrusion guide 17 is formed on the outer peripheral surface of the accommodation cylinder portion 16. The size (lateral width, length) is such that it can be fitted in the fitting groove 13 (FIG. 3) on the inner peripheral surface. The housing cylinder 16 (FIG. 2) is provided with a flange 18. The flange 18 hits the bottom edge of the radiator 1 when the accommodating cylinder portion 16 is inserted into the internal space 7 (FIG. 3) of the holder 9 and determines the insertion position into the radiator 1.

前記鍔18の下には、口金類2が接着、カシメ、その他の固定手段で取り付けられている。固定に使用する接着剤や接着テープ等にも前記ラヒーマ等の黒鉛化炭素短繊維を含んだものを使用するのが放熱性の面から好ましい。   Under the collar 18, the cap 2 is attached by adhesion, caulking, or other fixing means. From the viewpoint of heat dissipation, it is preferable to use an adhesive, an adhesive tape, or the like used for fixing that contains graphitized carbon short fibers such as the above-mentioned Lahima.

前記LED4(図2)はその放熱面をLED用基板5側にしてLED用基板5の上に搭載固定されており、そのLED用基板5が受部6の上に搭載され、粘着シートや接着剤等で固定されている。この粘着シートや接着剤にも前記ラヒーマ等の黒鉛化炭素短繊維を含んだものを使用するのが放熱性の面から好ましい。LED4は回路基板8の電源回路に電気的に接続されて発光する。LED4には所望色を発光できるものを使用することができ、その数も必要に応じて選択することができる。   The LED 4 (FIG. 2) is mounted and fixed on the LED substrate 5 with its heat dissipation surface facing the LED substrate 5, and the LED substrate 5 is mounted on the receiving portion 6, and is an adhesive sheet or adhesive. It is fixed with agents. It is preferable from the viewpoint of heat dissipation that the pressure-sensitive adhesive sheet and the adhesive include those containing graphitic short carbon fibers such as the above-mentioned Lahima. The LED 4 is electrically connected to the power circuit of the circuit board 8 and emits light. As the LED 4, one capable of emitting a desired color can be used, and the number thereof can be selected as necessary.

前記回路基板8(図2)には、電源回路が表示され、LED4の動作や制御に必要な電子部品や電子機器E(図2、図4)が搭載されている。回路基板8は図2に示すように放熱体1の内部空間7(図3)内に縦向きに収容される。回路基板8には過電流切断器、例えばヒューズを取付けて、定格以上の電流が流れるとヒューズが自動的に切れて過電流が防止され、電源部の破損、発火等(損傷)を防止できるようにしてある。回路基板8の下方にはリード線19(図2)が導出され、それが口金類2に電気的に接続されている。回路基板8には前記ヒューズの他に温度スイッチをも設けることもできる。温度スイッチは回路基板の周辺温度が高温例えば150℃以上になると自動的に切れ100℃以下になると自動復帰するものであり、LEDや電源回路を高温から保護するものであり、IC内蔵型のものを使用することができる。   On the circuit board 8 (FIG. 2), a power supply circuit is displayed, and electronic components and electronic equipment E (FIGS. 2 and 4) necessary for the operation and control of the LED 4 are mounted. The circuit board 8 is accommodated vertically in the internal space 7 (FIG. 3) of the radiator 1 as shown in FIG. An overcurrent breaker, for example, a fuse, is attached to the circuit board 8 so that if a current exceeding the rating flows, the fuse is automatically blown to prevent the overcurrent, and the power supply unit can be prevented from being damaged or ignited (damaged). It is. A lead wire 19 (FIG. 2) is led out below the circuit board 8 and is electrically connected to the cap 2. The circuit board 8 can be provided with a temperature switch in addition to the fuse. The temperature switch automatically turns off when the ambient temperature of the circuit board reaches a high temperature, for example, 150 ° C or higher, and automatically recovers when the temperature drops to 100 ° C or lower. Can be used.

前記反射ミラー3(図1、図2)は、ガラス製、アクリルやポリカーボネート等の樹脂製、アルミ製、その他の材質製とすることができる。反射ミラー3の上周縁には受縁20(図2)が突設され、受縁20の上にカバー21が配置されて接着固定されている。反射ミラー3の下端側には2本の脚3aが設けられている。その脚3aはLED用基板5の貫通孔5a(図2)から放熱体1の貫通孔6a(図2)に図4のように差し込んで、反射ミラー3を放熱体1に係止できるようにしてある。   The reflection mirror 3 (FIGS. 1 and 2) can be made of glass, resin such as acrylic or polycarbonate, aluminum, or other material. A receiving edge 20 (FIG. 2) protrudes from the upper peripheral edge of the reflecting mirror 3, and a cover 21 is disposed on the receiving edge 20 and fixedly bonded thereto. Two legs 3 a are provided on the lower end side of the reflection mirror 3. The legs 3a are inserted from the through holes 5a (FIG. 2) of the LED substrate 5 into the through holes 6a (FIG. 2) of the radiator 1 as shown in FIG. 4, so that the reflection mirror 3 can be locked to the radiator 1. It is.

前記反射ミラー3には、既存のハロゲンランプ用反射ミラー3を使用することもできるが、新規なものを使用することもできる。新規な反射ミラー3の一例として図8に示すものは、樹脂成型されたミラー本体3bの内面は鏡面仕上げされた内側反射面3cとしてある。反射面3cは、例えば、ミラー本体3bの内面にアルミ蒸着によりアルミ被膜を設けるとか他の方法で鏡面化して成形することができる。反射ミラー3の外面はミラー本体3bの成型時に凹凸面にするとか、成型後にサンドブラストとか他の方法で粗面化するなどして凹凸の外側反射面3dにしてある。また、反射ミラー3の底面の中央部(略中央部を含む)LED配置孔3eを設けてその周面を入射面3fとしてある。この反射ミラー3では、図8に示すようにLED4を前記LED配置孔3e内に配置すると、LED4からの光が反射ミラー3の内側に直進して内側反射面3cで反射されると共に、入射面3fに入射してミラー本体3bの肉厚内を進行し、その進行中に外側反射面3dで乱反射して外側に出射し、反射ミラー3の外側をも照明することができる。 As the reflection mirror 3, an existing halogen lamp reflection mirror 3 can be used, or a new one can be used. As an example of the novel reflection mirror 3, the inner surface of the resin-molded mirror body 3b is a mirror-finished inner reflection surface 3c shown in FIG. The reflection surface 3c can be formed by, for example, providing an aluminum coating on the inner surface of the mirror main body 3b by aluminum vapor deposition or by using other methods to make a mirror surface. The outer surface of the reflecting mirror 3 is formed into an uneven outer reflecting surface 3d by forming an uneven surface when the mirror main body 3b is molded, or roughening by sandblasting or other methods after molding. In addition, an LED arrangement hole 3e is provided in the central portion (including the substantially central portion) of the bottom surface of the reflecting mirror 3, and the peripheral surface thereof is used as the incident surface 3f. In this reflection mirror 3, when the LED 4 is arranged in the LED arrangement hole 3e as shown in FIG. 8, the light from the LED 4 goes straight to the inside of the reflection mirror 3 and is reflected by the inner reflection surface 3c. It is incident on 3f and travels within the thickness of the mirror main body 3b. During the travel, it is irregularly reflected by the outer reflecting surface 3d and emitted to the outside, and the outside of the reflecting mirror 3 can also be illuminated.

図7(a)のLED照明具は口金類2を2ピンタイプとしたもの、図7(b)のLED照明具は口金類2を天井や壁などに取り付けられている受け具に所定方向から差し込んで回転させることにより受け具に嵌合可能なワンタッチタイプとしたものである。本願発明のLED照明具の口金類2は他の形状、構造であってもよく、ソケット以外の構造の電器接続具に接続可能なものであってもよい。   The LED illuminator shown in FIG. 7A has a two-pin base 2 and the LED illuminator shown in FIG. 7B has a base 2 attached to a ceiling or a wall from a predetermined direction. It is a one-touch type that can be fitted into a receiving tool by inserting and rotating. The base 2 of the LED lighting device of the present invention may have another shape and structure, or may be connectable to an electrical connector having a structure other than the socket.

本願発明のLED照明具における各種構成部材の接着には、前記ラヒーマ等の黒鉛化炭素短繊維を含んだ粘着シートや接着剤等も使用して、放熱性を良くするのが望ましい。   For adhesion of various components in the LED illuminator of the present invention, it is desirable to improve heat dissipation by using an adhesive sheet or an adhesive containing graphitized carbon short fibers such as lahima.

(LED照明具2)
本願発明のLED電球の一例として図5に示すものは、既存の豆電球形(ミニ球形)と略同じ形状の電球である。このLED電球は放熱体1、口金類2、回路基板8、LED4等は図1のLED照明具と同じであり、異なるのは、図1の反射ミラー3に代えてバルブ25(図5)を使用し、バルブ25内であって、LED4の先方にレンズ26(図5)を配置したことである。前記口金類2、バルブ25は既存の白熱電球に使用されているものと同様の形状、サイズ、規格のもの、或いは、それに類するものを使用することができる。
(LED lighting tool 2)
What is shown in FIG. 5 as an example of the LED bulb of the present invention is a bulb having substantially the same shape as an existing mini-bulb shape. In this LED bulb, the radiator 1, the base 2, the circuit board 8, the LED 4 and the like are the same as the LED illuminator in FIG. 1, except that a bulb 25 (FIG. 5) is used instead of the reflecting mirror 3 in FIG. In use, the lens 26 (FIG. 5) is disposed in the bulb 25 and ahead of the LED 4. The base 2 and the bulb 25 can be of the same shape, size, standard, or the like as those used in existing incandescent bulbs.

前記レンズ26は略半球状であり、LED4の先方に配置固定した細長い円筒状の台座24の先端に固定されている。レンズ26はこれ以外の形状のものであってもよく取付け箇所も台座24の先端ではなくLED4の直近であってもよい。レンズ26は図6(a)(b)に示すようなものであってもよい。図6(a)に示すレンズ26は丸棒状であり、先端内部に円錐状の窪んだ光溜まり空間27が形成され、底面28が円錐状のものである。図6(b)に示すレンズ26は丸棒状であり、先端内部に縦長円弧状に窪んだ光溜まり空間27が形成され、底面28が円弧状のものである。これらレンズ26は透光性を有する樹脂製であり、アクリル製が適するが、ガラス製とか他の材質製とすることもできる。   The lens 26 has a substantially hemispherical shape, and is fixed to the tip of an elongated cylindrical pedestal 24 disposed and fixed in front of the LED 4. The lens 26 may have a shape other than this, and the attachment location may be not the tip of the pedestal 24 but the immediate vicinity of the LED 4. The lens 26 may be as shown in FIGS. 6 (a) and 6 (b). The lens 26 shown in FIG. 6A has a round bar shape, a conical recessed light collecting space 27 is formed inside the tip, and the bottom surface 28 has a conical shape. The lens 26 shown in FIG. 6B has a round bar shape, a light reservoir space 27 that is recessed in a vertically long arc shape is formed inside the tip, and the bottom surface 28 has an arc shape. These lenses 26 are made of light-transmitting resin and are preferably made of acrylic, but may be made of glass or other materials.

レンズ26は長さ、太さ、形状、光溜まり空間27の形状や深さ、先端の口径(広さ)、底面28の形状等は用途に合わせて選択できる。レンズ26の底面外周には取付け縁29が形成されており、それをLED用基板5とかLED4の周囲の他の部材の上に配置して、接着剤や接着テープで固定することができるようにしてある。レンズ26や台座24には着色樹脂や着色ガラス等を使用することもできる。これによりLED4を代えることなく用途に適した様々な色の光を用意することができる。   The length, thickness and shape of the lens 26, the shape and depth of the light collecting space 27, the diameter (width) of the tip, the shape of the bottom surface 28, etc. can be selected according to the application. A mounting edge 29 is formed on the outer periphery of the bottom surface of the lens 26, which is arranged on the LED substrate 5 or other members around the LED 4 so that it can be fixed with an adhesive or an adhesive tape. It is. Colored resin, colored glass, or the like can be used for the lens 26 or the pedestal 24. As a result, various colors of light suitable for the application can be prepared without replacing the LED 4.

図5のバルブ25は放熱体1の先に取り付けられている。バルブ25はガラス製、アクリル製、その他の材質製とすることができ、放熱性に優れたものが特に好ましい。バルブ25における放熱体1寄りの箇所は曇りガラスにするとか他の手段で不透明或いは半透明にするなどして遮蔽部を設けて、台座24やレンズ26等が外部から透視できないように隠すこともできる。   The valve 25 shown in FIG. 5 is attached to the tip of the radiator 1. The bulb 25 can be made of glass, acrylic, or other material, and is particularly preferably excellent in heat dissipation. A portion of the bulb 25 near the radiator 1 may be made of frosted glass or made opaque or translucent by other means so as to hide the pedestal 24 and the lens 26 so that they cannot be seen through from the outside. it can.

図5のLED照明具では、放熱体1が既存のLED電球のヒートシンクに代えて使用することができる。   In the LED lighting device of FIG. 5, the radiator 1 can be used in place of the heat sink of an existing LED bulb.

本願発明の前記構成は他の形状や用途のLED照明具、例えば、屋内や屋外に設置される照明看板や店頭看板、LEDを用いたチャンネル文字といった各種用途のLED照明具にも利用することができる。   The said structure of this invention can be utilized also for LED lighting fixtures of other shapes and uses, for example, LED lighting fixtures of various uses, such as a lighting signboard and a shop front signboard installed indoors or outdoors, and a channel character using LED. it can.

1 放熱体
1a (放熱体の)周壁
2 口金類
3 反射ミラー(リフレクター)
3a 脚
3b ミラー本体
3c 内側反射面
3d 外側反射面
3e LED配置孔
3f 入射面
4 LED
5 LED用基板
5a 貫通孔
6 (LED搭載用の)受部
6a 貫通孔
7 内部空間
8 回路基板
9 保持具
10 凹溝
11 放熱フィン
12 吸熱フィン
13 嵌合溝
14 リード線
15 差込み孔
16 収容筒部
17 ガイド
18 (保持具の)鍔
19 リード線
20 (反射ミラーの)受縁
21 カバー
24 台座
25 バルブ
26 レンズ
27 光溜まり空間
28 (レンズの)底面
29 (レンズの)取付け縁
E 電気部品等
DESCRIPTION OF SYMBOLS 1 Heat radiator 1a Perimeter wall (of heat radiator) 2 Base 3 Reflecting mirror
3a Leg 3b Mirror body 3c Inner reflecting surface 3d Outer reflecting surface 3e LED arrangement hole 3f Incident surface 4 LED
DESCRIPTION OF SYMBOLS 5 Board | substrate for LED 5a Through-hole 6 Reception part (for LED mounting) 6a Through-hole 7 Internal space 8 Circuit board 9 Holder 10 Recessed groove 11 Radiation fin 12 Heat absorption fin 13 Fitting groove 14 Lead wire 15 Insertion hole 16 Housing cylinder Part 17 Guide 18 (Holding fixture) 19 19 Lead wire 20 (Reflecting mirror) receiving edge 21 Cover 24 Base 25 Valve 26 Lens 27 Light collecting space 28 (Lens) bottom surface 29 (Lens mounting) E Electrical parts, etc.

Claims (7)

ソケットに脱着可能な口金類と、光源用LEDと、LEDからの熱を外部に放出する放熱体と、LED用電源回路や電子部品が搭載された回路基板と、LEDの外周に配置された反射ミラーと、反射ミラーに平板状のカバーを備えたハロゲンランプ型LED照明具において、
前記放熱体が高熱伝導率の炭素繊維を含む樹脂製の筒状であり、
前記放熱体の内側に回路基板が収容され、
前記口金類が前記放熱体よりも下方に突設され、
前記反射ミラーは先方開口の略椀型であり、内面が鏡面仕上げされた内側反射面であり、外面が凹凸又は粗面化された外側反射面であり、底の中央部にLED配置孔が開口され、そのLED配置孔の外周面が光入射面であり、
前記LEDが前記放熱体の上部であって前記LED配置孔内に配置されて、LEDからの出射光が前記光入射面から反射ミラーの肉厚内に入射して当該肉厚内を進行し、その進行中に反射ミラーの内側反射面で反射ミラーの内側に反射され、外側反射面で反射ミラーの外側に反射して出射されるようにした、
ことを特徴とするハロゲンランプ型LED照明具。
A base that can be attached to and detached from a socket, an LED for a light source, a radiator that releases heat from the LED to the outside, a circuit board on which an LED power supply circuit and electronic components are mounted, and an outer periphery of the LED In a halogen lamp type LED illuminator provided with a reflecting mirror and a flat cover on the reflecting mirror ,
The radiator is a resin-made cylinder containing carbon fiber with high thermal conductivity,
A circuit board is accommodated inside the heat radiator,
The caps project downward from the radiator,
The reflection mirror has a substantially bowl shape with a front opening, an inner reflection surface whose inner surface is mirror-finished, an outer surface is an outer reflection surface which is uneven or roughened, and an LED arrangement hole is opened in the center of the bottom The outer peripheral surface of the LED arrangement hole is a light incident surface,
The LED is disposed in the LED arrangement hole at the top of the radiator and the light emitted from the LED enters the thickness of the reflection mirror from the light incident surface and travels through the thickness. During its progress, it was reflected inside the reflecting mirror by the inner reflecting surface of the reflecting mirror, and reflected and emitted by the outer reflecting surface to the outside of the reflecting mirror.
A halogen lamp type LED lighting device.
請求項1記載のハロゲンランプ型LED照明具において、
放熱体の外周面が熱伝導性のある絶縁塗料で被覆されている、
ことを特徴とするハロゲンランプ型LED照明具。
The halogen lamp type LED lighting device according to claim 1 ,
The outer peripheral surface of the radiator is covered with a thermally conductive insulating paint.
A halogen lamp type LED lighting device.
請求項1又は請求項2記載のハロゲンランプ型LED照明具において、
放熱体の内周面に吸熱用フィンを備えた、
ことを特徴とするハロゲンランプ型LED照明具。
The halogen lamp type LED lighting device according to claim 1 or 2 ,
With heat sink fins on the inner peripheral surface of the radiator ,
A halogen lamp type LED lighting device.
請求項1から請求項3のいずれか1項に記載のハロゲンランプ型LED照明具において、
放熱体の外周面に放熱用フィンを備えた、
ことを特徴とするハロゲンランプ型LED照明具。
In the halogen lamp type LED lighting device according to any one of claims 1 to 3,
A heat dissipating fin is provided on the outer peripheral surface of the heat dissipating body .
A halogen lamp type LED lighting device.
請求項1から請求項4のいずれか1項に記載のハロゲンランプ型LED照明具において、
放熱体の内側に、回路基板が収容された筒状収容体を備えた、
ことを特徴とするハロゲンランプ型LED照明具。
In the halogen lamp type LED lighting device according to any one of claims 1 to 4,
Provided inside the radiator is a cylindrical container in which the circuit board is accommodated,
A halogen lamp type LED lighting device.
請求項1から請求項5のいずれか1項に記載のハロゲンランプ型LED照明具において、
回路基板が放熱体又は筒状収容体の内側に縦向きに配置された、
ことを特徴とするハロゲンランプ型LED照明具。
In the halogen lamp type LED lighting device according to any one of claims 1 to 5,
The circuit board is arranged vertically inside the radiator or the cylindrical container ,
A halogen lamp type LED lighting device.
請求項1から請求項6のいずれか1項に記載のハロゲンランプ型LED照明具において、
LEDの光出射方向先方であって、反射ミラーの内側空間内に、LEDからの出射光を出射方向先方に導光するレンズを設けた、
ことを特徴とするハロゲンランプ型LED照明具。
In the halogen lamp type LED lighting device according to any one of claims 1 to 6,
Provided a lens that guides the emitted light from the LED in the direction of the emission direction of the LED , in the inner space of the reflection mirror .
A halogen lamp type LED lighting device.
JP2011002581A 2011-01-08 2011-01-08 Halogen lamp type LED lighting fixture Expired - Fee Related JP5666318B2 (en)

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