JP2010033959A - Bulb type lamp - Google Patents

Bulb type lamp Download PDF

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JP2010033959A
JP2010033959A JP2008196678A JP2008196678A JP2010033959A JP 2010033959 A JP2010033959 A JP 2010033959A JP 2008196678 A JP2008196678 A JP 2008196678A JP 2008196678 A JP2008196678 A JP 2008196678A JP 2010033959 A JP2010033959 A JP 2010033959A
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main body
element substrate
portion
side
bulb
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JP5218751B2 (en )
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Takeshi Hisayasu
Toshiya Tanaka
武志 久安
敏也 田中
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Toshiba Lighting & Technology Corp
東芝ライテック株式会社
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    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V23/00Arrangement of electric circuit elements in or on lighting devices
    • F21V23/003Arrangement of electric circuit elements in or on lighting devices the elements being electronics drivers or controllers for operating the light source, e.g. for a LED array
    • F21V23/004Arrangement of electric circuit elements in or on lighting devices the elements being electronics drivers or controllers for operating the light source, e.g. for a LED array arranged on a substrate, e.g. a printed circuit board
    • F21V23/006Arrangement of electric circuit elements in or on lighting devices the elements being electronics drivers or controllers for operating the light source, e.g. for a LED array arranged on a substrate, e.g. a printed circuit board the substrate being distinct from the light source holder
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21KNON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/20Light sources comprising attachment means
    • F21K9/23Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings
    • F21K9/232Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings specially adapted for generating an essentially omnidirectional light distribution, e.g. with a glass bulb
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21KNON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/20Light sources comprising attachment means
    • F21K9/23Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings
    • F21K9/238Arrangement or mounting of circuit elements integrated in the light source
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V19/00Fastening of light sources or lamp holders
    • F21V19/001Fastening of light sources or lamp holders the light sources being semiconductors devices, e.g. LEDs
    • F21V19/003Fastening of light source holders, e.g. of circuit boards or substrates holding light sources
    • F21V19/0055Fastening of light source holders, e.g. of circuit boards or substrates holding light sources by screwing
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V23/00Arrangement of electric circuit elements in or on lighting devices
    • F21V23/001Arrangement of electric circuit elements in or on lighting devices the elements being electrical wires or cables
    • F21V23/002Arrangements of cables or conductors inside a lighting device, e.g. means for guiding along parts of the housing or in a pivoting arm
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V3/00Globes; Bowls; Cover glasses
    • F21V3/02Globes; Bowls; Cover glasses characterised by the shape
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V17/00Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages
    • F21V17/10Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages characterised by specific fastening means or way of fastening
    • F21V17/101Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages characterised by specific fastening means or way of fastening permanently, e.g. welding, gluing or riveting
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21YINDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00Light-generating elements of semiconductor light sources
    • F21Y2115/10Light-emitting diodes [LED]

Abstract

PROBLEM TO BE SOLVED: To provide a bulb type LED lamp suppressing reduction of uniformity of light distribution while ensuring assemblability.
SOLUTION: A plurality of LEDs 22 are disposed on an outer edge side of the center of one main surface 21a of an LED board body 21 to deviate from one another. A connector receptor 23 to which a connection part 46 connected to a leading end of a power supply line 45 from a lighting circuit board 15 is connected and a wiring part 25 having a wiring hole 24 into which a power supply part 47 of the lighting circuit board 15 can be inserted are disposed at positions superposing the central position on the one main surface 21a side of the LED board body 21. The connection part 46 can be readily connected to the connector receptor 23 by inserting the power supply part 47 into the wiring hole 24, so that the assemblability can be ensured. The connector receptor 23 is separated from the respective LEDs 22 almost equally such that light emission hardly shields to suppress reduction of uniformity in light distribution.
COPYRIGHT: (C)2010,JPO&INPIT

Description

本発明は、複数の発光素子を配置した素子基板を備えた電球型ランプに関する。 The present invention relates to a bulb-type lamp with an element substrate in which a plurality of light emitting elements.

従来、発光素子としてLEDを用いる電球型ランプは、LEDを外周縁部に均等に実装した素子基板であるLED基板が放熱部の一端側に取り付けられ、このLED基板を覆って放熱部の一端側にグローブが取り付けられている。 Conventional bulb-type lamp using an LED as a light emitting element, LED substrate which is an element substrate that is equally mounted on the outer peripheral edge portion of the LED is attached to one end of the radiating portion, one end side of the heat radiating portion to cover the LED substrate Globe is attached to. また、この放熱部の他端側には、LED基板を点灯制御する点灯装置を収容した収容ケースが挿入され、この収容ケースの放熱部と反対側に口金が取り付けられている(例えば、特許文献1参照。)。 Further, the other end of the radiator portion, the accommodating case accommodating the lighting device for lighting control of the LED substrate is inserted, the mouthpiece on the other side is mounted with the heat radiating portion of the housing case (e.g., Patent Documents 1 reference.).
特開2006−313718号公報(第4−6頁、図2) JP 2006-313718 JP (4-6 pages, Fig. 2)

点灯装置とLED基板とを接続する際には、組み立て性を考慮すると、点灯装置側から導出した給電線をLED基板側に接続するように構成することが好ましく、また、給電線の接続性を考慮すると、給電線の先端側にコネクタ部を設け、LED基板側のコネクタ台と接続することが好ましい。 When connecting the lighting device and an LED substrate, considering assembly property, a feed line derived from the lighting device side is preferably configured to connect to the LED substrate side, also, a connectivity of the feed line considering, the connector portion is provided on the distal end side of the feed line, it is preferably connected to the connector base of the LED substrate side.

しかしながら、このような電球型ランプでは、コネクタ台がLEDからの発光を遮り、配光の均一性が低下するおそれがあるという問題点を有している。 However, in such a bulb-type lamp, connector platform is block the light emission from the LED, the uniformity of light distribution is a problem that may be lowered.

本発明は、このような点に鑑みなされたもので、組み立て性を確保しつつ配光の均一性の低下を抑制した電球型ランプを提供することを目的とする。 The present invention has been made in view of the above problems, and an object thereof is to provide a bulb-type lamp that suppresses a decrease in uniformity of light distribution while ensuring the assembling property.

請求項1記載の電球型ランプは、素子基板本体と、この素子基板本体の一主面の中心位置から外縁側に偏位した位置にそれぞれ配置された複数の発光素子と、これら発光素子に電気的に接続された接続受部およびこの接続受部に隣接して形成され素子基板本体を貫通する配線孔を有し素子基板本体の一主面側の中心位置と少なくとも一部が重なって配置された配線部とを備えた素子基板と;素子基板の素子基板本体の他主面側が一端側に密着して取り付けられた放熱体と;放熱体の他端側に取り付けられた口金と;放熱体と口金との間に収容され、給電線およびこの給電線の先端に接続され接続受部と接続される接続部を有し配線孔に挿通可能な給電部を備え、発光素子を点灯制御する点灯装置と;を具備しているものである。 Bulb-type lamp of claim 1, wherein the element substrate main body, a plurality of light emitting elements which are disposed in a position offset to the outer edge side from a center position of one main surface of the element substrate main body, electric thereto the light emitting element to at least a portion the center position of the connected connection receiving part and the one principal surface of the element substrate main body having a wiring hole penetrating the element substrate main body is formed adjacent to the connection receiving part is arranged to overlap heat radiating body and the other main surface of the element the element substrate main body of the substrate is mounted in close contact with the one end; was the element substrate and having a wiring portion and a mouthpiece attached to the other end of the radiator; heat radiator lit and is accommodated between the cap feed line and this is connected to the front end of the feed line includes a can be inserted feeding portion to the wiring hole has a connection portion connected to the connection receiving part, to lighting control of the light emitting element those that include a; device and.

素子基板本体は、例えば放熱性の良好なアルミニウムなどの金属により平面視で略円形状に形成されている。 The element substrate main body is formed, for example, a substantially circular shape in a plan view of a metal such as heat dissipation of the good aluminum.

発光素子としては、例えばLED、あるいは有機ELなどの固体発光素子が好適に用いられる。 As the light-emitting element, for example LED, or solid-state light emitting elements such as organic EL is preferably used.

配線部の少なくとも一部が素子基板本体の一主面側の中心位置と重なって配置されているとは、例えば接続受部および配線孔のいずれか一方の一部が素子基板本体の一主面側の中心位置と重なる位置、あるいは接続受部と配線孔との間の領域の一部が素子基板本体の一主面側の中心位置と重なる位置などをいう。 At least part of the are arranged to overlap with the center position of one main surface side of the element substrate main body, for example, one main surface of the connection receiving part and one part is the element substrate main body of the wiring hole of the wiring portion position overlapping with the center position of the side, or a portion of the region between the connection receiving part and the wiring hole refers to such a position that overlaps the center position of one main surface side of the element substrate main body.

接続受部は、例えばコネクタ受部などの機械的保持手段を有するものの他、端子台のように給電線が挿入されて電気的に接続されるものでもよい。 Connection receiving part, for example, others with mechanical retention means such as connectors receiving may be one feed line is inserted as terminal blocks are electrically connected.

給電部は、例えば接続受部がコネクタ受部などの機械的保持手段を有する場合には、コネクタ受部に接続される接続部を給電線の先端に有するものとし、接続受部が端子台などである場合には、この端子台などに挿入される給電線の先端側を接続部としてもよい。 Feed section, for example, if the connection receiving part has a mechanical holding means such as a connector receiving portion, and having a connection portion to be connected to the connector receiving portion to the distal end of the feed line, connected receiving terminal block, etc. If it is, the distal end side of the feed line which is inserted into the terminal block or the like may be connection.

放熱体は、例えば放熱性の良好なアルミニウムなどの金属により形成されている。 Heat radiator is formed of, for example, a metal such as heat dissipation of the good aluminum.

口金は、例えばミニクリプトン電球用のE17型のものなどが用いられる。 Spinneret, such as those of E17 type mini krypton bulb is used.

点灯装置は、例えば定電流の直流電源などを有する点灯回路を備えている。 Lighting device includes, for example, a lighting circuit having such a DC power source of constant current.

請求項2記載の電球型ランプは、請求項1記載の電球型ランプにおいて、放熱体は、素子基板の素子基板本体を一端側に取り付けた状態でこの素子基板の配線孔に対応する位置に、点灯装置の給電部を挿通可能な挿通孔部を備えているものである。 Bulb-type lamp of claim 2, wherein, in the bulb-type lamp of claim 1, wherein, the heat dissipating body, a position corresponding to the wiring hole of the element substrate in a state of attaching the element substrate main body of the element substrate on one end side, feeding part of the lighting device is one that includes a can be inserted through hole portion.

挿通孔部は、例えば配線孔と略同一の径寸法を有する円形状に形成されている。 Insertion hole is formed in a circular shape having, for example, the wiring hole substantially the same diameter.

請求項3記載の電球型ランプは、請求項1または2記載の電球型ランプにおいて、放熱体と口金とを絶縁してこれら放熱体と口金との間に配置され、点灯装置を収容する収容ケースを具備しているものである。 Bulb-type lamp of claim 3, wherein, in claim 1 or 2 bulb-type lamp as claimed, is arranged between the heat radiator and the cap and insulates the heat radiator and the cap, the housing case for housing the lighting device it is one that is equipped with a.

収容ケースは、例えば絶縁性を有する合成樹脂などにより略円筒状に形成されている。 Housing case is formed in a substantially cylindrical shape by synthetic resin having, for example, insulation.

請求項1記載の電球型ランプによれば、複数の発光素子を素子基板本体の一主面の中心位置から外縁側にそれぞれ偏位して配置するとともに、点灯装置からの給電線の先端に接続された接続部を接続可能な接続受部およびこの接続受部に隣接して素子基板本体を貫通し点灯装置の給電部を挿通可能な配線孔を有する配線部の少なくとも一部を素子基板本体の一主面側の中心位置と重なる位置とすることにより、給電部を配線孔に挿通させて接続部を接続受部に容易に接続できるので、組み立て性を確保しつつ、接続受部を各発光素子から略均等に遠ざけて発光を遮りにくくし、配光の均一性の低下を抑制できる。 According to bulb-type lamp of claim 1, wherein connecting the plurality of light emitting elements from the center of one main surface of the element substrate main body while positioned respectively excursion to the outer edge, the tip of the feed line from the lighting device connection receiving connector which is adapted to connect and the element substrate main body at least a part of the wiring portion having an insertion possible wiring hole the power sources of penetrating lighting device the element substrate main body adjacent to the connection receiving part by the position overlapping with the center position of one main surface side, it is possible to easily connect to the connection receiving the connection portion by inserting the feeding portion to the wiring hole, while ensuring the assembling properties, each emitting a connection receiving part hardly blocks the emission away substantially uniformly from the device, it is possible to suppress the deterioration in the uniformity of light distribution.

請求項2記載の電球型ランプによれば、請求項1記載の電球型ランプの効果に加えて、素子基板の素子基板本体を放熱体の一端側に取り付けた状態でこの素子基板の配線孔に対応する位置に挿通孔部を設けることにより、この挿通孔部を介して点灯装置からの給電線を放熱体内に挿通できるとともに、素子基板本体と放熱体の一端側との接触面積を大きくすることができる。 According to bulb-type lamp of claim 2, wherein, in addition to the effects of the bulb-type lamp of claim 1, wherein, the wiring hole of the element substrate in a state of attaching the element substrate main body of the element substrate on one end side of the radiator by providing the insertion hole in corresponding positions, it is possible through the heat radiating body feed line from the lighting device through the insertion hole, increasing the contact area between the one end side of the element substrate main body and the heat radiating body can.

請求項3記載の電球型ランプによれば、請求項1または2記載の電球型ランプの効果に加えて、放熱体と口金との間に配置され放熱体と口金とを絶縁する収容ケースに点灯装置を収容することにより、点灯装置を放熱体に対して容易に絶縁できるとともに、点灯装置の配置が容易になる。 According to bulb-type lamp of claim 3, wherein, the lighting in the accommodating case in addition to the effect of claim 1 or 2, wherein the bulb-shaped lamp, is arranged between the heat radiator and the cap insulating the heat radiating body and the cap by housing the device, with a lighting device can be easily insulated from the heat radiating body, it facilitates placement of the lighting device.

以下、本発明の一実施の形態を図面を参照して説明する。 Hereinafter, an embodiment of the present invention with reference to the drawings.

図1ないし図3に第1の実施の形態を示し、図1は電球型ランプの縦断面図、図2は電球型ランプの素子基板の平面図、図3は電球型ランプの側面図である。 1 to 3 show a first embodiment, FIG. 1 is a longitudinal sectional view of a bulb-type lamp, Figure 2 is a plan view of the element substrate bulb lamp, FIG. 3 is a side view of a bulb-type lamp .

図1および図3において、11は電球型ランプである電球型LEDランプを示し、この電球型LEDランプ11は、素子基板であるLED基板12が放熱体13の一端側に取り付けられ、この放熱体13の一端側に、LED基板12を覆ってグローブ14が取り付けられ、放熱体13の他端側に、点灯装置である点灯回路基板15を収容した収容ケース16が取り付けられ、この収容ケース16に口金17が取り付けられて構成されている。 1 and 3, 11 denotes a bulb-type LED lamp is a bulb-type lamp, the bulb-type LED lamp 11, LED substrate 12 which is an element substrate is attached to one end of the radiator 13, the heat radiator at one end of the 13, the globe 14 is attached to cover the LED substrate 12, the other end of the radiator 13, the housing case 16 housing the lighting circuit board 15 is a lighting device is attached to the housing case 16 mouthpiece 17 is constructed attached. そして、この電球型LEDランプ11は、いわゆるミニクリプトン電球と同等の全長を有している。 Then, the bulb-type LED lamp 11 has a total length equivalent to the so-called mini-krypton bulb.

LED基板12は、平面視円形状の素子基板本体であるLED基板本体21と、このLED基板本体21の一主面21a側に実装された複数、例えば8つの発光素子であるLED22と、LED基板本体21の他主面21b側に実装された接続受部としてのコネクタ受部23およびLED基板本体21を貫通する丸孔状の配線孔24を備えた配線部25とを有している。 LED substrate 12 includes an LED substrate main body 21 is circular in plan view of the element substrate main body, a plurality mounted on one main surface 21a side of the LED substrate main body 21, and LED22 are eight light-emitting element for example, LED board and a wiring portion 25 provided with a round hole-shaped wiring hole 24 penetrating the connector receiving part 23 and the LED substrate main body 21 as a connection receiving part mounted on the other main surface 21b side of the main body 21.

LED基板本体21は、図1および図2に示すように、例えば放熱性が良好なアルミニウムなどの金属材料、あるいは絶縁材料などにより形成されたメタル基板であり、両側部に、固定手段としての熱的結合手段であるねじ27により放熱体13上に面接触するように密着固定するためのねじ切欠部28がそれぞれ切り欠き形成されている。 LED substrate main body 21, as shown in FIGS. 1 and 2, a metal substrate formed by, for example, a metal material such as heat dissipation is good aluminum or insulating material, on both sides, the heat of the fixing means threaded notch 28 for tightly fixed to surface contact on the heat dissipation member 13 are notches formed respectively by a screw 27 which is coupling means. なお、このLED基板本体21は、放熱体13に対して、例えば放熱性に優れたシリコーン系の接着剤などにより接着してもよい。 Incidentally, the LED substrate main body 21, to the heat radiator 13, for example may be bonded by such excellent silicone adhesive heat dissipation.

LED22は、例えば青色の光を発する図示しないベアチップと、このベアチップを覆うシリコーン樹脂などにより形成された図示しない樹脂部とを備え、この樹脂部内に、ベアチップが発する青色光の一部により励起されて青色の補色である黄色の光を主として放射する図示しない蛍光体が混入されており、各LED22が白色系の照明光を得られるように構成され、例えば0.5W程度の消費電力を有している。 LED22, for example a bare chip not shown emits blue light, and a resin portion (not shown) which is formed by a silicone resin covering the bare chip, in the resin portion, is excited by a part of the blue light bare chip emits blue phosphor (not shown) mainly emit yellow light are mixed and the complementary color, each LED22 is configured so as to obtain illumination light of white, for example, has a power consumption of about 0.5W there. また、これらLED22は、LED基板本体21の一主面21aの外縁部に、互いに略等間隔に離間された状態でLED基板本体21の中心位置Cを中心とする同一円周上に配置されている。 These LED22 is the outer edge of the one main surface 21a of the LED substrate main body 21, it is arranged on the same circumference around the center position C of the LED substrate main body 21 in a state of being spaced at approximately equal intervals from one another there.

コネクタ受部23は、各LED22に対して電気的に接続されているとともに、点灯回路基板15側と接続される受電端子となるコネクタウェハ(コネクタ台)であり、例えば合成樹脂などにより形成され、LED基板本体21の一主面21aの中心位置Cに対して中心位置を合わせて配置されている。 Connector receiving portion 23, together are electrically connected to each LED 22, a lighting circuit power receiving terminal and comprising connector wafers that are connected to the substrate 15 side (connector base), for example, be formed by a synthetic resin, It is arranged centered position with respect to the center position C of the one main surface 21a of the LED substrate main body 21. また、このコネクタ受部23は上方へと開口した縦型配置となっている。 Further, the connector receiving part 23 has a vertical arrangement that opens upward.

配線孔24は、コネクタ受部23に隣接して配置されており、例えばこのコネクタ受部23の最大外形よりも大きい径寸法を有している。 Wiring hole 24 is disposed adjacent to the connector receiving portion 23, for example has a diameter larger than the maximum outer shape of the connector receiving part 23. したがって、配線孔24は、LED基板本体21の中心位置Cの近傍で、かつ、この中心位置Cに対して径方向に若干ずれた(オフセットした)位置に配置されている。 Therefore, the wiring hole 24 is in the vicinity of the center position C of the LED substrate main body 21, and is disposed slightly displaced (offset) located radially with respect to the center position C.

また、図1および図3に示すように、放熱体13は、略円柱状の放熱体本体31と、この放熱体本体31の一端31a側に拡径状に連続する拡径部32と、これら放熱体本体31と拡径部32との外周面に亘って連続する複数の放熱フィン33とを有し、これら放熱体本体31、拡径部32および各放熱フィン33が、例えば熱伝導性が良好なアルミニウムなどの金属材料、あるいは樹脂材料などにより一体に成形されている。 Further, as shown in FIGS. 1 and 3, the heat radiating member 13 includes a substantially cylindrical heat radiating body 31, the enlarged diameter portion 32 continuous to the expanded shape on one end 31a side of the heat radiating body 31, these and a plurality of radiating fins 33 continuously extending over the outer peripheral surface of the heat radiating body 31 and the enlarged diameter portion 32, heat-radiating body 31, the enlarged diameter portion 32 and the heat radiation fins 33, for example, thermal conductivity It is integrally molded by such good metal material such as aluminum or a resin material. そして、放熱体本体31と拡径部32とを貫通して挿通孔部34が形成されている。 The insertion hole 34 through the heat radiating body 31 and the enlarged diameter portion 32 is formed.

放熱体本体31は、他端31b側に、収容ケース16の一端16a側を挿入する嵌合凹部37が中心軸に沿って設けられている。 Heat radiator body 31, the other end 31b side, the fitting recess 37 for inserting one end 16a side of the accommodating case 16 is provided along the central axis. この嵌合凹部37は、挿通孔部34と連通している。 The fitting recess 37 communicates with the insertion hole 34.

拡径部32は、放熱体本体31側から扁平な球体状に拡径して形成されており、上端側が、LED基板12のLED基板本体21を載置する平坦状の基板取付面32aとなっている。 Enlarged diameter portion 32, an enlarged diameter into a flat spherical shape from the heat radiating body 31 side are formed, the upper side, a flat substrate attachment surface 32a for mounting the LED substrate main body 21 of the LED substrate 12 ing. そして、この基板取付面32aには、挿通孔部34の上端部が臨んでいるとともに、LED基板12のねじ切欠部28に対応して、上記ねじ27をねじ止めするためのねじ止め孔32bが穿設されている。 Then, this substrate attachment surface 32a, with the upper end portion of the insertion hole portion 34 faces, in correspondence with the threaded notch 28 of the LED substrate 12, is screwed hole 32b for screwing the screw 27 They are bored. すなわち、挿通孔部34は、基板取付面32aの中心位置に対して径方向に若干ずれた(オフセットした)位置に形成されている。 That is, the insertion hole 34, slightly displaced radially with respect to the center position of the substrate attachment surface 32a (offset) is formed at the position. さらに、拡径部32の基板取付面32aの外縁部近傍には、グローブ14の一端14a側の端部が嵌着係止される凹溝部32cが周方向に沿って円形状に連続して形成されている。 Further, the outer edge near the substrate attachment surface 32a of the enlarged diameter portion 32, formed continuously in a circular concave groove portion 32c where an end of the one end 14a side of the globe 14 is locked fit Chakugakari along the circumferential direction It is.

放熱フィン33は、放熱体本体31から拡径部32側へと径方向への突出量が徐々に大きくなるように傾斜して形成されている。 Radiating fin 33, the protruding amount to the enlarged diameter portion 32 side in the radial direction from the radiator main body 31 is formed to be inclined so as to gradually increase. また、これら放熱フィン33は、放熱体13の周方向に互いに略等間隔で形成されている。 These heat dissipating fins 33 are formed at substantially equal intervals in the circumferential direction of the radiator 13.

挿通孔部34は、配線孔24と略等しい径寸法を有する丸孔状に形成されている。 Insertion hole 34 is formed in a round hole shape having substantially the same diameter as the wiring hole 24.

グローブ14は、光拡散性を有するガラスあるいは合成樹脂などにより扁平な球面状に形成されており、放熱体13の拡径部32の上端側と連続する形状となっている。 Glove 14 is formed in such a flat spherical glass or synthetic resin having a light diffusing property, it has a shape which is continuous with the upper end of the enlarged diameter portion 32 of the radiator 13. また、このグローブ14は、一端14a側から徐々に拡開するように形成され、最大径位置MDから他端14b側へと徐々に縮径されるように形成されており、最大径位置MDがLED基板12の各LED22よりも上方の位置となっている。 Moreover, the globe 14 is formed to gradually widening from one end 14a side is formed so as to gradually be reduced in diameter to the other end 14b side from the maximum diameter position MD, the maximum diameter position MD It has become a position above the LED22 of the LED substrate 12.

点灯回路基板15は、平板状の点灯装置本体である点灯回路基板本体41と、この点灯回路基板本体41に実装され点灯回路を構成する図示しない複数の回路素子と、点灯回路に基端側が電気的に接続された給電線45およびこの給電線45の先端側に電気的に接続された接続部46を備えた給電部47と有しており、収容ケース16内に軸方向に沿って収容されている。 Lighting circuit board 15 includes a lighting circuit substrate main body 41 is a plate-like lighting device body, a plurality of circuit elements (not shown) constituting the lighting circuit are mounted on the lighting circuit substrate main body 41, the base end side to the lighting circuit is electrically manner connected has a feeding portion 47 having an electrically connected connecting portion 46 on the distal end side of the feed line 45 and the feed line 45, it is housed along the axial direction into the housing case 16 ing.

点灯回路は、例えばLED22に対して定電流を供給する回路などである。 Lighting circuit, for example circuit and the like for supplying a constant current to LED 22.

給電線45は、点灯回路側からの電力をLED基板12側へと供給するためのものであり、LED基板12までの距離に対して遊びを持たせた長さに形成されている。 Feed line 45, the power from the lighting circuit side is intended to supply to the LED substrate 12 side, and is formed to a length which gave play with respect to the distance to the LED substrate 12. なお、この給電線45の余剰な長さ部分は、上記挿通孔部34内に収容可能となっている。 Incidentally, excess length portion of the feed line 45 is capable housed in the insertion hole 34.

接続部46は、給電線45の先端側が接続された給電端子となるコネクタハウジングであり、LED基板12側のコネクタ受部23に上方から下方へと、すなわちLED基板本体21に対して交差する(垂直な)方向に挿入固定されることで、コネクタ受部23を介して給電線45(点灯回路)をLED22側に電気的に接続するように構成されている。 Connection 46 is a connector housing which is a power supply terminal to which the distal end side of the feed line 45 is connected, from above downward to the LED substrate 12 side of the connector receiving portion 23, i.e. crossing the LED substrate main body 21 ( in vertical) it is inserted and fixed in the direction, and a feed line 45 via the connector receiving part 23 (lighting circuit) so as to be electrically connected to LED22 side. また、この接続部46は、配線孔24および挿通孔部34の径寸法よりも最大外形が小さく設定されている。 Further, the connecting portion 46, the maximum outer shape is set smaller than the diameter of the wiring hole 24 and the insertion hole 34. このため、給電線45および接続部46(給電部47)は、配線孔24および挿通孔部34に挿通可能となっている。 Thus, the feed line 45 and the connecting portion 46 (power feeding part 47) is capable of insertion into the wiring hole 24 and the insertion hole 34. なお、この接続部46は、本実施の形態において、給電線45と別体の部材としたが、例えば接続受部が端子台などである場合には、給電線45の先端側そのものとしてもよい。 Incidentally, the connecting portion 46, in this embodiment, although the feed line 45 and separate member, for example, when the connection receiving part is a terminal blocks may be distal side themselves of the feed line 45 .

収容ケース16は、例えばPBT樹脂などの絶縁性を有する材料により、嵌合凹部37内の形状に沿って略円筒状に形成されている。 Accommodating case 16 by, for example, an insulating material such as PBT resin, is formed in a substantially cylindrical shape along the shape of the fitting recess 37. また、この収容ケース16の一端16a側は、ケース閉塞部である閉塞板16bにより閉塞され、この閉塞板16bには、挿通孔部34と略等しい径寸法を有しこの挿通孔部34に連通する連通孔16cが開口形成されている。 One end 16a side of the housing case 16 is closed by the closing plate 16b is the case occlusion, this closing plate 16b, has a substantially equal diameter as the insertion hole 34 communicating with the insertion hole 34 communication hole 16c which is opened and formed. さらに、この収容ケース16の一端16a側と他端16d側との中間部の外周面には、放熱体13の放熱体本体31の他端31bと口金17との間を絶縁するための絶縁部であるフランジ部16eが径方向に突出して周方向全体に連続形成されている。 Further, on the outer peripheral surface of the intermediate portion between the one end 16a side and the other end 16d side of the housing case 16, the insulating portion for insulating between the other end 31b and the base 17 of the heat radiating body 31 of the radiator 13 flange portion 16e is continuously formed over the entire circumferential direction to protrude in the radial direction is. なお、収容ケース16の内部には、点灯回路基板15を埋没させるように放熱性および絶縁性を有する充填材であるシリコーン系の樹脂などを充填してもよい。 Incidentally, inside the housing case 16, such as a silicone resin may be filled is a filler having heat dissipation and insulating properties so as to bury the lighting circuit board 15.

口金17は、例えばE17型のものであり、点灯回路基板15側と図示しない配線により電気的に接続されており、図示しない照明器具のランプソケットにねじ込まれるねじ山を備えた筒状のシェル51と、このシェル51の一端側の頂部に絶縁部52を介して設けられたアイレット53とを備えている。 Mouthpiece 17 is, for example, those of E17 type, the lighting circuit board 15 side are electrically connected by wiring not shown, a cylindrical shell 51 having a screw thread screwed into a lamp socket (not shown) luminaire When, and a eyelet 53 which is provided via an insulating portion 52 to the top of one end of the shell 51.

シェル51は、図示しない電源側と電気的に接続されるもので、このシェル51の内部には、収容ケース16との間に、点灯回路基板15の点灯回路へと給電するための図示しない電源線が挟み込まれてシェル51に対して導通されている。 Shell 51 is intended to be connected to the power source side and the electrical, not shown, to the inside of the shell 51, between the housing case 16, not shown, for feeding to the lighting circuit of the lighting circuit board 15 power supply are conductively to the shell 51 by line is sandwiched.

アイレット53は、図示しないグランド電位と電気的に接続されるもので、このアイレット53には、点灯回路基板15の点灯回路のグランド電位と電気的に接続されたアース線Eが半田付けなどにより電気的に接続されている。 Eyelets 53 intended to be ground potential and electrically connected (not shown), electrical this eyelet 53, ground potential and electrically connected to the ground line E of the lighting circuit of the lighting circuit board 15 by soldering or the like They are connected to each other.

次に、上記第1の実施の形態の動作を説明する。 Next, the operation of the first embodiment.

電球型LEDランプ11の組み立ての際には、まず、放熱体13の基板取付面32a上に、LED22およびコネクタ受部23などを実装したLED基板12のLED基板本体21の他主面21b側を載置し、配線孔24と挿通孔部34とを位置合わせするとともに、LED基板本体21側の各ねじ切欠部28と放熱体13側の各ねじ止め孔32bとを位置合わせしつつ、ねじ27によりLED基板12を放熱体13に対して固定し、LED基板12と放熱体13とを熱的に結合する。 During assembly of the bulb-type LED lamp 11, first, on the substrate mounting surface 32a of the radiator 13, the other main surface 21b side of the LED substrate main body 21 of the LED substrate 12 mounted with such LED22 and connector receiving portion 23 mounted, with aligning the wiring hole 24 and the insertion hole 34 while aligning the the LED substrate main body 21 side of each screw notch 28 and the screwing hole 32b of the radiator 13 side, the screw 27 by the LED substrate 12 is fixed relative to the heat radiator 13, the the LED substrate 12 and the heat radiator 13 to bind thermally.

また、点灯回路基板15の点灯回路の出力端子に対して、先端側に接続部46を設けた給電線45の基端側を電気的に接続する。 Further, the output terminal of the lighting circuit of the lighting circuit board 15 to electrically connect the base end side of the feed line 45 provided with a connection 46 to the distal end side.

次いで、点灯回路基板15を収容した収容ケース16を、連通孔16cを挿通孔部34に連通するように放熱体13の嵌合凹部37内に挿入し、図示しない凹凸構造などにより収容ケース16を放熱体13に係止固定する。 Then, the housing case 16 housing the lighting circuit board 15, and inserted into the heat dissipating body 13 fitting recess 37 in the so as to communicate the communication hole 16c in the insertion hole 34, the housing case 16 due uneven structure not shown locking fixed to the heat radiating body 13. このとき、給電部47を挿通孔部34に通して、給電線45の先端側および接続部46をLED基板12のLED基板本体21の一主面21aから突出させ、コネクタ受部23に対して接続部46を上方から挿入してこれらコネクタ受部23と接続部46とを、電気的および機械的に接続する。 At this time, through the feed portion 47 in the insertion hole 34, the tip side and connecting portions 46 of the feed line 45 is protruded from the one main surface 21a of the LED substrate main body 21 of the LED substrate 12, the connector receiving part 23 and a connecting portion 46 between these connectors receiver 23 by inserting the connecting portion 46 from above, electrically and mechanically connected.

この後、点灯回路基板15とアース線Eを介してアイレット53を接続した口金17を、点灯回路基板15側に電気的に接続した電源線をシェル51の外側に導出した状態で、収容ケース16の他端16d側から挿入し、収容ケース16とシェル51との間で電源線を挟み込む。 Thereafter, the mouthpiece 17 which connects the eyelet 53 through the lighting circuit board 15 and the ground wire E, while deriving the power line electrically connected to the lighting circuit board 15 side to the outer shell 51, housing case 16 the insert from the other end 16d side, sandwiching the power supply line between the housing case 16 and the shell 51. このとき、収容ケース16と口金17とを、図示しない凹凸構造などにより係止固定する。 At this time, the housing case 16 and the cap 17 is locked and fixed by such uneven structure not shown.

そして、グローブ14の一端14a側を放熱体13の凹溝部32cに嵌め込んでグローブ14を放熱体13に固定し、シリコーン系の接着剤などにより固定補強し、電球型LEDランプ11を完成する。 Then, to secure the glove 14 is fitted one end 14a side of the globe 14 to the concave groove portion 32c of the radiator 13 to the heat radiating body 13, and fixed reinforced by an adhesive of silicone-based, to complete a bulb-type LED lamp 11.

このように完成した電球型LEDランプ11は、口金17を所定のソケットに装着して通電すると、点灯回路基板15の点灯回路が動作して、給電線45を介してLED基板12側に電力が供給され、各LED22が発光し、これら発光がコネクタ受部23などにより遮られることなくグローブ14を介して拡散照射される。 Bulb-type LED lamp 11 has been completed in this manner, when energized by mounting a die 17 to a predetermined socket operates the lighting circuit of the lighting circuit board 15, power to the LED substrate 12 side via the feed line 45 is supplied, the LED22 to emit light, it emits light is diffused irradiated through the globe 14 without being obstructed by such a connector receiving portion 23.

また、LED基板12にて各LED22から発生する熱は、基板取付面32aを介して放熱体13に伝達され、この放熱体13の各放熱フィン33、放熱体本体31および拡径部32を介して放熱される。 Also, heat generated from each LED22 at LED substrate 12 is transferred to the heat radiator 13 via the substrate attachment surface 32a, the heat radiation fins 33 of the heat radiator 13, the radiator body 31 and the enlarged diameter portion 32 through and it is radiated Te.

以上のように、複数のLED22をLED基板本体21の一主面21aの中心位置Cから外縁側にそれぞれ偏位して配置するとともに、点灯回路基板15からの給電線45の先端に接続した接続部46を接続可能なコネクタ受部23およびこのコネクタ受部23に隣接してLED基板本体21を貫通し点灯回路基板15の給電部47を挿通可能な配線孔24を有する配線部25を、LED基板本体21の一主面21a側の中心位置Cと重なる位置とすることにより、給電部47を配線孔24に挿通させて接続部46をコネクタ受部23に容易に接続できるので、組み立て性を確保しつつ、コネクタ受部23を各LED22から略均等に遠ざけて発光を遮りにくくし、配光の均一性の低下を抑制できる。 As described above connections, which connect a plurality of LED22 from the center position C of the one main surface 21a of the LED substrate main body 21 while disposed respectively excursion to the outer edge, the tip of the feed line 45 from the lighting circuit board 15 the wiring portion 25 having an insertion possible wiring hole 24 of the feeding portion 47 of penetrating the LED substrate main body 21 lighting circuit board 15 adjacent the part 46 to the connector receiving part 23 and the connector receiving part 23 can be connected, LED with one main 21a side center position C and position overlapping of the substrate main body 21, since the power sources 47 can be easily connected to connecting portion 46 is inserted into the wiring hole 24 in the connector receiving part 23, the assembling property while securing the connector receiving part 23 hardly blocks the substantially uniformly away with emission from each LED 22, it can suppress a decrease in uniformity of light distribution.

また、コネクタ受部23をLED基板12のLED基板本体21の一主面21aに縦型配置としたことにより、挿通孔部34および配線孔24に挿通させた給電部47の接続部46を、コネクタ受部23に対して容易に接続できるとともに、コネクタ受部23に接続部46を接続した状態で、給電線45と接続部46との接続位置近傍に荷重が加わりにくく、接続部46をコネクタ受部23に対して接続する際などに給電線45を傷めにくくなる。 Also, by a vertical arranged on one main surface 21a of the LED substrate main body 21 of the connector receiving portion 23 LED substrates 12, the connecting portion 46 of the insertion hole 34 and the power supply unit 47 is inserted into the wiring hole 24, connector with can be easily connected to the connector receiving portion 23, while connecting the connecting portion 46 to the connector receiving part 23, hardly stress to the vicinity connection position of the connecting portion 46 to the feed line 45, the connecting portion 46 difficult to damage the feed line 45 when, for example connected to the receiving portion 23.

さらに、LED基板12のLED基板本体21を放熱体13の一端側の基板取付面32aに取り付けた状態でこのLED基板12の配線孔24に対応する位置に挿通孔部34を設けることにより、この挿通孔部34を介して点灯回路基板15からの給電線45を放熱体13内に挿通できるとともに、LED基板本体21と放熱体13の一端側の基板取付面32aとの接触面積を最大限に大きくすることができる。 Further, by providing the insertion hole 34 at positions corresponding to the wiring hole 24 of the LED substrate 12 of the LED substrate main body 21 of the LED substrate 12 in a state attached to one side of the substrate attachment surface 32a of the radiator 13, this with a feed line 45 from the lighting circuit board 15 via the insertion hole 34 can be inserted into the heat dissipating body 13, to maximize the contact area between the one end side of the substrate attachment surface 32a of the LED substrate main body 21 and the heat radiating member 13 it can be increased.

そして、放熱体13と口金17との間に配置され放熱体13と口金17とを絶縁する収容ケース16に点灯回路基板15を収容することにより、点灯回路基板15を放熱体13に対して容易に絶縁できるとともに、点灯回路基板15の配置が容易になる。 By housing the heat radiator 13 and is disposed between the mouthpiece 17 heat radiator 13 and the cap 17 and the lighting circuit board 15 in the accommodating case 16 to insulate the lighting circuit substrate 15 easily with respect to the heat radiating body 13 it is possible insulation, facilitates placement of the lighting circuit board 15.

また、グローブ14の最大径位置MDよりも下側にLED基板12(LED22)を配置することにより、各LED22からの発光の一部が、グローブ14の一端14a側から最大径位置MDまでの湾曲形状によって、下側へも照射されるので、より広い範囲に光を照射することができる。 Further, by arranging the LED substrate 12 (LED 22) below the maximum diameter position MD of the globe 14, a portion of light emitted from each LED 22, curved from the one end 14a side of the globe 14 to the maximum diameter position MD the shape, so is also irradiated to the lower side, light can be irradiated to a wider range.

次に、図4に第2の実施の形態を示し、図4は電球型ランプの縦断面図である。 Next, shows a second embodiment in FIG. 4, FIG. 4 is a longitudinal sectional view of a bulb-type lamp. なお、上記第1の実施の形態と同様の構成および作用については、同一符号を付してその説明を省略する。 Incidentally, the same components and operation as the first embodiment will be omitted given the same reference numerals.

この第2の実施の形態は、上記第1の実施の形態において、コネクタ受部23を横型配置としたものである。 The second embodiment, in the above first embodiment, in which the connector receiving part 23 and lateral arrangement.

すなわち、コネクタ受部23は、LED基板12のLED基板本体21の一主面21a上に、この一主面21aに沿う横(水平)方向に向けて配線孔24側に開口しており、LED基板本体21に沿って接続部46を挿入固定可能となっている。 That is, the connector receiving portion 23, on the one main surface 21a of the LED substrate main body 21 of the LED substrate 12 has an opening in the wiring hole 24 side to the lateral (horizontal) direction along the one main surface 21a, LED the connecting portion 46 has a possible inserted and fixed along the substrate main body 21.

このように、コネクタ受部23を横型配置とすることにより、コネクタ受部23のLED基板本体21からの突出量を低減できるので、コネクタ受部23によってLED22からの光をより遮りにくくなり、配光の均一性の低下をより抑制できる。 Thus, by the connector receiving part 23 and horizontal arrangement, it is possible to reduce the amount of projection of the LED substrate main body 21 of the connector receiving portion 23, the connector receiving part 23 becomes less likely to block the light from the LED 22, distribution a reduction in the uniformity of light can be further suppressed.

なお、上記各実施の形態において、コネクタ受部23と配線孔24とは、互いに隣接し、かつ、配線部25全体としてLED基板12のLED基板本体21の中心位置と少なくとも一部が重なるように配置すれば、任意に設定できる。 In the above embodiments, the connector receiving part 23 and the wiring hole 24, adjacent to one another, and, as such that at least partially overlap the center position of the LED substrate main body 21 of the LED substrate 12 as a whole wiring portion 25 by arranging, it can be arbitrarily set. すなわち、コネクタ受部23と配線孔24とは、いずれか一方の一部がLED基板本体21の中心位置Cと重なって配置されている状態、あるいは、コネクタ受部23と配線孔24との間の領域の一部がLED基板本体21の中心位置Cと重なる近傍となる状態などとしても、同様の作用効果を奏することができる。 That is, between the connector receiving part 23 and the wiring hole 24, either partially disposed overlaps the center position C of the LED substrate main body 21 state, or the connector receiving part 23 and the wiring hole 24 even such a state that part of the area of ​​the neighboring overlapping the center position C of the LED substrate main body 21, it is possible to achieve the same effect.

本発明の第1の実施の形態を示す電球型ランプの縦断面図である。 It is a longitudinal sectional view of a bulb-type lamp showing a first embodiment of the present invention. 同上電球型ランプの素子基板の平面図である。 It is a plan view of an element substrate of the same bulb type lamps. 同上電球型ランプの側面図である。 It is a side view of the same bulb type lamps. 本発明の第2の実施の形態を示す電球型ランプの縦断面図である。 It is a longitudinal sectional view of a bulb-type lamp showing a second embodiment of the present invention.

符号の説明 DESCRIPTION OF SYMBOLS

11 電球型ランプである電球型LEDランプ 11 bulb-type LED lamp is a bulb-type lamp
12 素子基板としてのLED基板 12 device LED substrate as the substrate
13 放熱体 13 heat radiator
15 点灯装置である点灯回路基板 Lighting circuit board is a 15 lighting device
16 収容ケース 16 housing case
17 口金 17 cap
21 素子基板本体としてのLED基板本体 21 device LED substrate main body as the substrate body
22 発光素子であるLED 22 LED is a light emitting element
23 接続受部としてのコネクタ受部 Connector receptacle as 23 connected to the receiving part
24 配線孔 24 wiring hole
25 配線部 25 wiring portion
34 挿通孔部 34 insertion hole
45 給電線 45 feed line
46 接続部 46 connecting part
47 給電部 47 power supply section

Claims (3)

  1. 素子基板本体と、この素子基板本体の一主面の中心位置から外縁側に偏位した位置にそれぞれ配置された複数の発光素子と、これら発光素子に電気的に接続された接続受部およびこの接続受部に隣接して形成され素子基板本体を貫通する配線孔を有し素子基板本体の一主面側の中心位置と少なくとも一部が重なって配置された配線部とを備えた素子基板と; An element substrate main body, a plurality of light emitting elements which are disposed in a position offset to the outer edge side from a center position of one main surface of the element substrate main body, connected receiving and this is electrically connected to these light-emitting element an element substrate having a wiring portion center position with at least a portion of one main surface side is arranged to overlap the element substrate main body having a wiring hole penetrating the element substrate main body is formed adjacent to the connection receiving part ;
    素子基板の素子基板本体の他主面側が一端側に密着して取り付けられた放熱体と; Heat radiating body and the other main surface of the element substrate main body of the element substrate is attached in close contact with the one end;
    放熱体の他端側に取り付けられた口金と; And the other end attached to the side base of the radiator;
    放熱体と口金との間に収容され、給電線およびこの給電線の先端に接続され接続受部と接続される接続部を有し配線孔に挿通可能な給電部を備え、発光素子を点灯制御する点灯装置と; Is accommodated between the heat radiator and the cap, feeders and this is connected to the front end of the feed line includes a can be inserted feeding portion to the wiring hole has a connection portion connected to the connection receiving part, the lighting control a light emitting element lighting devices and that;
    を具備していることを特徴とする電球型ランプ。 Bulb-type lamp, characterized in that it comprises a.
  2. 放熱体は、素子基板の素子基板本体を一端側に取り付けた状態でこの素子基板の配線孔に対応する位置に、点灯装置の給電線を挿通可能な挿通孔部を備えている ことを特徴とする請求項1記載の電球型ランプ。 Heat radiator has a feature in that it comprises a position corresponding to the wiring hole of the element substrate in a state of attaching the element substrate main body of the element substrate on one end, an insertion hole portion capable inserted feed line of the lighting device bulb-type lamp of claim 1 wherein the.
  3. 放熱体と口金とを絶縁してこれら放熱体と口金との間に配置され、点灯装置を収容する収容ケース を具備していることを特徴とする請求項1または2記載の電球型ランプ。 A heat radiator and the cap and insulates disposed between the heat-radiating member and the cap, according to claim 1 or 2, wherein the bulb-type lamp, characterized in that it comprises a housing case for housing the lighting device.
JP2008196678A 2008-07-30 2008-07-30 Bulb-type lamp Active JP5218751B2 (en)

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CN 200910160870 CN101639170B (en) 2008-07-30 2009-07-28 Lamp and lighting equipment
CN 201110096838 CN102175000B (en) 2008-07-30 2009-07-28 Lamp and lighting equipment
US12511479 US20100026157A1 (en) 2008-07-30 2009-07-29 Lamp and lighting equipment
EP20090251906 EP2149742A3 (en) 2008-07-30 2009-07-29 Lamp and lighting equipment

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WO2011105292A1 (en) * 2010-02-25 2011-09-01 シャープ株式会社 Illumination device
WO2011105049A1 (en) 2010-02-23 2011-09-01 パナソニック株式会社 Light source device
JP2011222858A (en) * 2010-04-13 2011-11-04 Cirocomm Technology Corp Manufacturing method and structure of light core material of light-emitting diode (led) bulb
JP2011228117A (en) * 2010-04-20 2011-11-10 Cirocomm Technology Corp Light emitting diode (led) lamp structure which can exchange light emitting units
JP4838902B1 (en) * 2011-01-12 2011-12-14 イリソ電子工業株式会社 For electric connection terminals and connectors using the same
JP2011253637A (en) * 2010-05-31 2011-12-15 Sharp Corp Lighting system
JP2012113937A (en) * 2010-11-24 2012-06-14 Rohm Co Ltd Led bulb
WO2012096288A1 (en) * 2011-01-12 2012-07-19 イリソ電子工業株式会社 Connector
JP2012156029A (en) * 2011-01-27 2012-08-16 Osram-Melco Ltd Lighting system
JP5129411B1 (en) * 2011-08-02 2013-01-30 パナソニック株式会社 lamp
JP2013026198A (en) * 2011-07-26 2013-02-04 Toshiba Lighting & Technology Corp Bulb-type led lamp
JP2013048039A (en) * 2011-08-29 2013-03-07 Hitachi Appliances Inc Bulb type lighting device
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JP2013524441A (en) * 2010-04-02 2013-06-17 ジーイー ライティング ソリューションズ エルエルシー Lightweight heat sink and led lamps use this
JP2013161783A (en) * 2012-02-02 2013-08-19 Posco Led Co Ltd Heat sink and led lighting device having the same
US8613531B2 (en) 2010-06-14 2013-12-24 Nittoh Kogaku K.K. Light emitting device
US8657455B2 (en) 2011-03-04 2014-02-25 Koito Manufacturing Co., Ltd. LED lamp
JP2014038873A (en) * 2010-06-07 2014-02-27 Iris Ohyama Inc Led lamp
KR101412959B1 (en) 2013-07-05 2014-06-27 주식회사 포스코엘이디 Led illuminating apparatus
JP2014523086A (en) * 2011-07-08 2014-09-08 エルジー イノテック カンパニー リミテッド Lighting device
JP2014199825A (en) * 2014-07-30 2014-10-23 三菱電機照明株式会社 Lighting device and assembly method of the same
JP2015008163A (en) * 2014-10-15 2015-01-15 岩崎電気株式会社 Led lamp
JP2015015262A (en) * 2014-10-21 2015-01-22 岩崎電気株式会社 Lamp
JP2015201461A (en) * 2015-07-08 2015-11-12 ローム株式会社 Led lighting device
US9841175B2 (en) 2012-05-04 2017-12-12 GE Lighting Solutions, LLC Optics system for solid state lighting apparatus
US9951938B2 (en) 2009-10-02 2018-04-24 GE Lighting Solutions, LLC LED lamp

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5257622B2 (en) 2010-02-26 2013-08-07 東芝ライテック株式会社 The light bulb-shaped lamp and lighting equipment
US8596821B2 (en) 2010-06-08 2013-12-03 Cree, Inc. LED light bulbs
WO2012060103A1 (en) * 2010-11-04 2012-05-10 パナソニック株式会社 Lamp
EP2503218A1 (en) * 2011-01-14 2012-09-26 Panasonic Corporation Light source device
JP5671356B2 (en) * 2011-01-26 2015-02-18 ローム株式会社 Led light bulb
JP5275388B2 (en) * 2011-02-28 2013-08-28 株式会社東芝 Lighting device
CN102384382B (en) * 2011-05-09 2014-09-17 立达信绿色照明股份有限公司 LED (Light-Emitting Diode) illumination lamp
RU2631419C2 (en) * 2012-06-05 2017-09-22 Филипс Лайтинг Холдинг Б.В. Cap for electric bulb and method for electric bulb cap assembly
US9006997B2 (en) * 2013-06-28 2015-04-14 Dialog Semiconductor Inc. Intensity control of LEDs interfacing three-way sockets
CN103322532A (en) * 2013-07-04 2013-09-25 浙江和鸿进出口有限公司 LED lamp
CN103499034B (en) * 2013-10-10 2015-06-17 深圳市子元技术有限公司 LED device with reflection face capable of active deformation

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003059330A (en) * 2001-08-16 2003-02-28 Matsushita Electric Works Ltd Led luminaire
JP2006313717A (en) * 2005-04-08 2006-11-16 Toshiba Lighting & Technology Corp Bulb type lamp
JP2007317573A (en) * 2006-05-26 2007-12-06 Matsushita Electric Works Ltd Led lighting unit and luminaire using it

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003059330A (en) * 2001-08-16 2003-02-28 Matsushita Electric Works Ltd Led luminaire
JP2006313717A (en) * 2005-04-08 2006-11-16 Toshiba Lighting & Technology Corp Bulb type lamp
JP2007317573A (en) * 2006-05-26 2007-12-06 Matsushita Electric Works Ltd Led lighting unit and luminaire using it

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US8523411B2 (en) 2010-02-23 2013-09-03 Panasonic Corporation Light source device
WO2011105292A1 (en) * 2010-02-25 2011-09-01 シャープ株式会社 Illumination device
JP2011175932A (en) * 2010-02-25 2011-09-08 Sharp Corp Illumination device
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JP2011228117A (en) * 2010-04-20 2011-11-10 Cirocomm Technology Corp Light emitting diode (led) lamp structure which can exchange light emitting units
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US8613531B2 (en) 2010-06-14 2013-12-24 Nittoh Kogaku K.K. Light emitting device
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US9033742B2 (en) 2010-07-28 2015-05-19 Japan Aviation Electronics Industry, Limited Connector and illumination device
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US9054453B2 (en) 2011-01-12 2015-06-09 Iriso Electronics Co., Ltd. Connector
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US8808025B2 (en) 2011-01-12 2014-08-19 Iriso Electronics Co., Ltd. Electrical connection terminal and connector using same
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