TWI628390B - Infrared emitter with composite material cover - Google Patents
Infrared emitter with composite material cover Download PDFInfo
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- TWI628390B TWI628390B TW106139203A TW106139203A TWI628390B TW I628390 B TWI628390 B TW I628390B TW 106139203 A TW106139203 A TW 106139203A TW 106139203 A TW106139203 A TW 106139203A TW I628390 B TWI628390 B TW I628390B
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Abstract
本發明係為一種具有複合材罩體的紅外線發射裝置,包括殼體、紅外線發光模組及複合材罩體,殼體具有容腔及開口;紅外線發光模組設置在容腔內且朝著開口方向發光;複合材罩體封罩在開口並且連接殼體,複合材罩體包括外罩層及內罩層,外罩層的熱傳導率小於內罩層的熱傳導率。藉此,可確保各組成構件能夠處於較低的工作溫度運作。 The invention is an infrared emitting device with a composite material cover, which comprises a housing, an infrared light emitting module and a composite material cover. The housing has a cavity and an opening; the infrared light emitting module is arranged in the cavity and faces the opening. The composite material cover body is sealed at the opening and connected to the shell. The composite material cover body includes an outer cover layer and an inner cover layer, and the thermal conductivity of the outer cover layer is smaller than that of the inner cover layer. This can ensure that each component can operate at a lower operating temperature.
Description
本發明係關於一種紅外線發射裝置,尤指一種具有複合材罩體的紅外線發射裝置。 The invention relates to an infrared emitting device, in particular to an infrared emitting device with a composite material cover.
紅外線發射裝置(IR LED)對於攝影機提供夜視功能為不可或缺的零部件,但紅外線發射裝置在高功率的消耗下其本體溫度升高後將影響壽命,且對於外罩體溫度會因消耗功率的增加呈正比成長,IEC60950-1規範若在環境溫度25℃下,塑膠外罩體溫度需小於60℃,玻璃外罩體溫度需小於50℃。 The infrared emitting device (IR LED) is an indispensable part for the camera to provide night vision function, but the infrared emitting device will affect the life after the body temperature rises under the consumption of high power, and it will consume power due to the outer cover temperature The increase is proportional to the growth rate. If the ambient temperature is 25 ℃, the temperature of the plastic casing must be less than 60 ℃, and the temperature of the glass casing must be less than 50 ℃.
習知的紅外線發射裝置,主要係採用塑膠材料所製成的外罩體,惟此塑膠製外罩體將使紅外線發光模組和殼體的溫度偏高。業界為解決此一問題,於是將外罩體由塑膠改為熱傳導率較好的玻璃,此種單純改變外罩體為玻璃材質後,雖然在紅外線發光模組、殼體和外罩體的溫度獲得降低,但是玻璃製外罩體仍然達不到前述安全規範之要求。 The conventional infrared emitting device is mainly an outer cover body made of plastic materials, but the plastic outer cover body will make the temperature of the infrared light emitting module and the case higher. In order to solve this problem, the industry changed the cover body from plastic to glass with better thermal conductivity. After this simple change of the cover body to glass material, although the temperature of the infrared light emitting module, the housing and the cover body was reduced, However, the glass enclosure does not meet the requirements of the aforementioned safety regulations.
有鑑於此,本發明人遂針對上述現有技術,特潛心研究並配合學理的運用,盡力解決上述之問題點,即成為本發明人改良之目標。 In view of this, the present inventors have devoted themselves to the above-mentioned prior art, researched intensively and cooperated with the application of science to try to solve the above-mentioned problems, which has become the goal of the inventors' improvement.
本發明之一目的,在於提供一種具有複合材罩體的紅外線發射裝置,其係可確保各組成構件能夠處於較低的工作溫度運作。 An object of the present invention is to provide an infrared emitting device with a composite material cover, which can ensure that each component can operate at a lower working temperature.
為了達成上述之目的,本發明提供一種具有複合材罩體的紅外線發射裝置,包括一殼體、一紅外線發光模組及一複合材罩體,該殼體具有一容腔及一開口;該紅外線發光模組設置在該容腔內且朝著該開口方向發光;該複合材罩體封罩在該開口並且連接該殼體,該複合材罩體包括一外罩層及形成在該外罩層內側的一內罩層,該外罩層的熱傳導率小於該內罩層的熱傳導率。 In order to achieve the above object, the present invention provides an infrared emitting device with a composite material cover, which includes a housing, an infrared light emitting module, and a composite material cover. The housing has a cavity and an opening. The light emitting module is disposed in the cavity and emits light toward the opening direction; the composite material cover body is sealed in the opening and connected to the shell, and the composite material cover body includes an outer cover layer and an inner cover layer formed inside the outer cover layer. An inner cover layer, the thermal conductivity of the outer cover layer is smaller than the thermal conductivity of the inner cover layer.
本發明還具有以下功效,藉由在外罩層和內罩層之間形成有一間隔空間,如此可起到隔熱效果進而降低其對應處溫度。 The present invention also has the following effects. By forming a space between the outer cover layer and the inner cover layer, the heat insulation effect can be achieved and the temperature at the corresponding place can be reduced.
10‧‧‧殼體 10‧‧‧shell
11‧‧‧底板 11‧‧‧ floor
12‧‧‧圍板 12‧‧‧ fence
13‧‧‧容腔 13‧‧‧capacity
14‧‧‧開口 14‧‧‧ opening
20‧‧‧紅外線發光模組 20‧‧‧Infrared light emitting module
21‧‧‧印刷電路板 21‧‧‧printed circuit board
22‧‧‧紅外線發光體 22‧‧‧ Infrared emitter
30、30A、30B‧‧‧複合材罩體 30, 30A, 30B‧‧‧ composite material cover
31、31A、31B‧‧‧外罩層 31, 31A, 31B‧‧‧ Cover
311‧‧‧凹槽 311‧‧‧groove
32、32A、32B‧‧‧內罩層 32, 32A, 32B‧‧‧Inner cover
A‧‧‧間隔空間 A‧‧‧ Space
40‧‧‧鏡頭模組 40‧‧‧ lens module
圖1係本發明之第一實施例的立體分解圖。 FIG. 1 is an exploded perspective view of a first embodiment of the present invention.
圖2係本發明之第一實施例的組合剖視圖。 Fig. 2 is an assembled sectional view of the first embodiment of the present invention.
圖3係本發明之第二實施例的組合剖視圖。 Fig. 3 is an assembled sectional view of a second embodiment of the present invention.
圖4係本發明之第三實施例的立體分解圖。 FIG. 4 is an exploded perspective view of a third embodiment of the present invention.
圖5係本發明之第三實施例的組合剖視圖。 Fig. 5 is an assembled sectional view of a third embodiment of the present invention.
圖6係本發明之第四實施例的組合剖視圖。 Fig. 6 is an assembled sectional view of a fourth embodiment of the present invention.
有關本發明之詳細說明及技術內容,配合圖式說明如下,然而所附圖式僅提供參考與說明用,並非用來對本發明加以限制者。 The detailed description and technical contents of the present invention are described below with reference to the drawings, but the drawings are provided for reference and description only, and are not intended to limit the present invention.
請參閱圖1及圖2所示,本發明提供一種具有複合材罩體的紅外線發射裝置,其主要包括一殼體10、一紅外線發光模組20及一複合材罩體30。 Please refer to FIG. 1 and FIG. 2. The present invention provides an infrared emitting device with a composite material cover, which mainly includes a housing 10, an infrared light emitting module 20 and a composite material cover 30.
殼體10大致呈一矩形狀,但不以此種形狀為限,本實施例的殼體10由一底板11和自底板11周緣彎折延伸的一圍板12所構成,從而在底板11和圍板12之間形成有一容腔13,並在圍板12遠離底板11的一端形成有一開口14。 The casing 10 is substantially rectangular, but is not limited to this shape. The casing 10 of this embodiment is composed of a bottom plate 11 and a surrounding plate 12 bent and extended from the periphery of the bottom plate 11. A receiving cavity 13 is formed between the enclosure boards 12, and an opening 14 is formed at an end of the enclosure board 12 away from the bottom plate 11.
紅外線發光模組20主要包括一印刷電路板21及安裝在印刷電路板21且與印刷電路板21彼此電性連接的一紅外線發光體22,其中印刷電路板21是透過一支撐結構(圖未示出)設置在前述容腔13內部,並令紅外線發光體22朝著開口14方向發光;又,紅外線發光體22可為一紅外線發光二極體(IR LED)。 The infrared light emitting module 20 mainly includes a printed circuit board 21 and an infrared light emitting body 22 mounted on the printed circuit board 21 and electrically connected to the printed circuit board 21, wherein the printed circuit board 21 is transmitted through a supporting structure (not shown) (Out) is disposed inside the aforementioned cavity 13 and makes the infrared light emitting body 22 emit light toward the opening 14; the infrared light emitting body 22 may be an infrared light emitting diode (IR LED).
複合材罩體30封罩在開口14並且連接在殼體10的圍板12端面,複合材罩體30主要包括一外罩層31及一內罩層32,本實施例的外罩層31和內罩層32皆為一板片,在外罩層31的內側開設有一凹槽311,內罩層32是對應於凹槽311位置密貼在外罩層31的凹槽311底面,從而使內罩層32形成在外罩層31內側,換言之,亦可以“外罩層31至少局部位於內罩層32的外側”謂之。 The composite cover 30 is sealed at the opening 14 and connected to the end face of the enclosure 12 of the housing 10. The composite cover 30 mainly includes an outer cover layer 31 and an inner cover layer 32. The outer cover layer 31 and the inner cover of this embodiment The layer 32 is a plate, and a groove 311 is opened inside the outer cover layer 31. The inner cover layer 32 is closely adhered to the bottom surface of the groove 311 of the outer cover layer 31 corresponding to the position of the groove 311, so that the inner cover layer 32 is formed. On the inside of the outer cover layer 31, in other words, "the outer cover layer 31 is located at least partially outside the inner cover layer 32".
進一步地,外罩層31的熱傳導率小於內罩層32的熱傳導率,其中的外罩層31可為一透明塑膠之板片,而內罩層32則可為一透明玻璃之板片。如此,在經由實物的測試結果可以得到複合材罩體30的溫度大約為53.8℃,明顯低於IEC60950-1規範溫度60℃以下。 Further, the thermal conductivity of the outer cover layer 31 is smaller than that of the inner cover layer 32. The outer cover layer 31 may be a transparent plastic plate, and the inner cover layer 32 may be a transparent glass plate. In this way, the temperature of the composite material cover 30 can be obtained from the actual test results to be about 53.8 ° C, which is significantly lower than the IEC60950-1 standard temperature of 60 ° C or less.
請參閱圖3所示,本發明具有複合材罩體的紅外線發射裝置,除了可以如上述實施例外,其中複合材罩體30A包括一外罩層31A及一內罩層32A,在外罩層31A的內側開設有一凹槽311A,內罩層32A是對應於凹槽311A位置 安裝,並在外罩層31A和內罩層32A之間形成有一間隔空間A,如此可起到隔熱效果進而降低其對應處溫度。 Please refer to FIG. 3, the infrared emitting device with a composite material cover according to the present invention may be the same as the above embodiment except that the composite material cover 30A includes an outer cover layer 31A and an inner cover layer 32A on the inner side of the outer cover layer 31A. A groove 311A is provided, and the inner cover layer 32A corresponds to the position of the groove 311A. It is installed, and a space A is formed between the outer cover layer 31A and the inner cover layer 32A, so that the insulation effect can be achieved and the temperature at the corresponding place can be reduced.
請參閱圖4及圖5所示,本實施例是在第一實施例的主體架構下,進一步包括一鏡頭模組40,此鏡頭模組40亦是設置在前述容腔13內部並且朝著開口14方向取景。 Please refer to FIG. 4 and FIG. 5. This embodiment further includes a lens module 40 under the main body structure of the first embodiment. The lens module 40 is also disposed inside the cavity 13 and faces the opening. Viewfinder in 14 directions.
請參閱圖6所示,本實施例的複合材罩體30B主要包括一外罩層31B及一內罩層32B,其中外罩層31B可為一透明塑膠之板片,內罩層32B則為一透明石墨烯(Graphene)塗層,其係以塗佈方式形成在外罩層31B的內表面,如此亦具有前述各實施例的等同效果。 Please refer to FIG. 6, the composite material cover 30B of this embodiment mainly includes an outer cover layer 31B and an inner cover layer 32B, wherein the outer cover layer 31B may be a transparent plastic plate, and the inner cover layer 32B is a transparent The graphene coating is formed on the inner surface of the outer cover layer 31B by a coating method, and thus has the equivalent effect of the foregoing embodiments.
綜上所述,本發明之具有複合材罩體的紅外線發射裝置,確可達到預期之使用目的,而解決習知之缺失,又因極具新穎性及進步性,完全符合發明專利申請要件,爰依專利法提出申請,敬請詳查並賜准本案專利,以保障發明人之權利。 In summary, the infrared emitting device with a composite material cover of the present invention can indeed achieve the intended purpose of use, and solve the lack of knowledge. Because of its novelty and progress, it fully meets the requirements for invention patent applications. To file an application in accordance with the Patent Law, please check and grant the patent in this case to protect the rights of the inventor.
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Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN202091952U (en) * | 2011-06-25 | 2011-12-28 | 惠州市莱斯特科技发展有限公司 | Led down lamp |
TWM462821U (en) * | 2012-12-10 | 2013-10-01 | Cai-Ru Liao | Infrared projector low-temperature heat dissipation structure |
TW201405877A (en) * | 2012-07-30 | 2014-02-01 | Huga Optotech Inc | Light emitting module |
CN204187345U (en) * | 2015-01-15 | 2015-03-04 | 深圳市北澳照明实业有限公司 | There is the LED of video monitoring camera and infrared induction detectors |
TWI602010B (en) * | 2016-10-27 | 2017-10-11 | 晶睿通訊股份有限公司 | Image surveillance device and light emitting module thereof |
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2017
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Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN202091952U (en) * | 2011-06-25 | 2011-12-28 | 惠州市莱斯特科技发展有限公司 | Led down lamp |
TW201405877A (en) * | 2012-07-30 | 2014-02-01 | Huga Optotech Inc | Light emitting module |
TWM462821U (en) * | 2012-12-10 | 2013-10-01 | Cai-Ru Liao | Infrared projector low-temperature heat dissipation structure |
CN204187345U (en) * | 2015-01-15 | 2015-03-04 | 深圳市北澳照明实业有限公司 | There is the LED of video monitoring camera and infrared induction detectors |
TWI602010B (en) * | 2016-10-27 | 2017-10-11 | 晶睿通訊股份有限公司 | Image surveillance device and light emitting module thereof |
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