JP2002247594A - Image pickup device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To efficiently ease the temperature rise of image pickup elements by surely preventing the temperature rise of an image pickup element in driving, while easily carrying out highly accurate assembly and making each image pickup element contact a cooling element. SOLUTION: An image pickup device 1 that is fixed on a camera casing 2 is provided with a plurality of color separation prisms 3 for separating incident light to prescribed color components, image pickup elements 4 fixed to the color component light projection sides 3aa, 3b, 3c of respective prisms 3, an image pickup element substrate 6 for processing image pickup element signals, cooling elements 8 whose cooling faces are arranged on the elements 4, heat conduction plates 7 attached to the heating faces of the elements 8. The image pickup element cooling means for cooling the image pickup elements 4 is constituted of the cooling elements 8, the heat conduction plates 7, a radiation plate 9, and the camera casing 2. The plates 7 to which the elements 8 are attached are fixed detachably to the radiation plate 9.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an image pickup apparatus, and more particularly to an image pickup apparatus having an image pickup device having a heat radiating mechanism arranged on a component light exit surface of a plurality of color separation prisms.

[0002]

2. Description of the Related Art Conventionally, in a solid-state image pickup device such as a CCD (hereinafter simply referred to as an image pickup device), a dark current increases as the temperature of the device itself increases during operation. The quality of the resulting image is degraded. for that reason,
In an image pickup apparatus having an image pickup device, a fixing member having good heat conductivity is provided on the back surface of the image pickup device in order to prevent deterioration of image quality, for example, through a heat conductive member formed by laminating metal foils. There is an image sensor provided with a cooling mechanism of an image sensor that radiates heat to a camera housing to cool the image sensor.

For example, Japanese Patent Application Laid-Open No. 9-65348 discloses a technique for efficiently cooling a solid-state image sensor and for absorbing heat from the solid-state image sensor in order to provide a solid-state image sensor cooling structure with good assemblability. A solid-state imaging device having a heat conduction member and a spring fixed to the solid-state imaging device, wherein the heat conduction member is brought into close contact with the solid-state imaging device at a predetermined pressure using the elastic force of the spring. It is shown.

In this solid-state imaging device, the first heat conductive member is pressed in the direction of the imaging element attached to the metal fitting by the pressure of a leaf spring screwed and fixed to the support column by an attachment screw. In order to make the element and the Peltier cooling element and the Peltier cooling element and the first heat conductive member adhere to each other, the Peltier cooling element is closely attached to the solid-state imaging element through a through hole formed in the sensor substrate.

[0005]

As described above, in the solid-state imaging device disclosed in Japanese Patent Laid-Open No. 9-65348, a through hole is formed in the sensor substrate so that the Peltier cooling element is brought into close contact with the solid-state imaging element. . However, as the density and speed of the imaging device increase and the circuit configuration becomes complicated,
A through hole cannot be provided in the imaging element substrate, so that the Peltier cooling element cannot be brought into close contact with the solid-state imaging element, and the temperature of the imaging element during driving may increase.

SUMMARY OF THE INVENTION The present invention has been made in view of the above circumstances, and reliably prevents the temperature of an image pickup device during driving from rising. It is easy to assemble with high accuracy. It is an object of the present invention to provide an image pickup apparatus which is in close contact with the image pickup device to efficiently reduce the temperature rise of the image pickup element.

[0007]

In order to achieve the above object, an image pickup apparatus according to a first aspect of the present invention is fixed to a camera housing and includes a plurality of color separation units for separating incident light into predetermined color components. An image sensor fixed to each component light exit surface of the prism; an image sensor substrate for processing an image sensor signal output from the image sensor; a heat sink attached to the camera housing; a cooling surface and a heating surface A cooling element having: a mounting portion to be attached to the radiator plate; and a fixing portion to which a heat generating surface of the cooling element is fixed so as to be able to conduct heat, and the mounting portion is attached to the radiator plate. When
Since the fixing portion has a heat conducting plate formed with an attachment portion and a fixing portion so as to generate stress in a direction in which the cooling surface of the cooling element is brought into close contact with the image pickup device, the cooling element is The heat generated by the image sensor is transferred from the cooling device to the heat conducting plate, heat radiating plate, and the camera housing to dissipate the heat, thereby improving the cooling effect. , The rise in temperature is alleviated, the generated dark current is reduced, and the deterioration of the image is prevented.

[0008] In the imaging apparatus according to a second aspect of the present invention, in the imaging apparatus according to the first aspect, the heat conduction plate may include:
It has attachment parts at both ends of a parallel plane part substantially parallel to the cooling surface of the cooling element, and since the bending angle formed by this attachment part and the parallel plane part is an acute angle, when attaching a heat sink, The cooling element can be pressed against the imaging element without using a special jig.

Further, according to a third aspect of the present invention, in the imaging device according to the first aspect, the heat conductive plate includes a parallel plane portion substantially parallel to a cooling surface of the cooling element and both ends of the parallel plane portion. Part has a mounting portion, the thickness of the heat conductive plate is continuously changing from the vicinity of the cooling element to the bent portion, so a special jig is required when mounting the heat sink. The cooling element can be pressed against the imaging element without using it.

According to a fourth aspect of the present invention, in the imaging apparatus according to the first aspect, the heat conductive plate is provided on a parallel plane portion substantially parallel to a cooling surface of the cooling element and at both ends of the parallel plane portion. It has a mounting part, and has at least one bent part between the parallel plane part and the mounting part, so the cooling element is imaged without using a special jig when mounting the heat sink. Pressed against the element.

According to a fifth aspect of the present invention, there is provided an imaging device fixed to a camera housing and fixed to each component light exit surface of a plurality of color separation prisms for separating incident light into predetermined color components; An image sensor substrate for processing an image sensor signal output from the image sensor; a heat sink attached to the camera housing; a cooling element having a cooling surface and a heat generating surface; and a mounting part attached to the heat sink. And a holding portion for holding the heat generating surface of the cooling element so as to conduct heat in an integrated manner, and in the holding portion, the cooling surface of the cooling element is heated by the heat from the heat generating surface of the cooling element. A heat conduction plate on which a cooling element pressing plate for generating a stress in a direction in which the cooling element is brought into close contact with the imaging element is used. When The time it takes the stress is reduced to paste part of the rhythm.

An image pickup device according to a sixth aspect of the present invention is an image pickup device fixed to a camera housing and fixed to each component light exit surface of a plurality of color separation prisms for separating incident light into predetermined color components; An image sensor substrate for processing an image sensor signal output from the image sensor; a heat sink attached to the camera housing; a cooling element having a cooling surface and a heat generating surface; A fixing portion that is conductively fixed, and at least two mounting portions provided at an end of the fixing portion and mounted on the heat sink, and a mounting width for adjusting an interval between one of the mounting portions and the other; In addition to the provision of the adjustment mechanism, the heat conduction plate integrally formed with the mounting width adjustment mechanism includes a member that generates a stress in a direction in which the cooling surface of the cooling element is brought into close contact with the imaging element with respect to the fixed portion. Cooling element is good adhesion to the heat transfer at a moderate force to the image pickup element, heat conducting plate the heat generated by the image sensor from the cooling element, heat sink dissipating is transmitted to the camera housing.

The imaging device according to a seventh aspect of the present invention is the imaging device according to the sixth aspect, wherein the mounting width adjusting mechanism includes a cooling element integrally provided with a mounting portion at one end,
A first heat conductive plate having a screw hole at the other end, a second heat source having a mounting portion at one end, and a long hole corresponding to the screw hole of the first heat conductive plate at the other end; Since there is provided a conductive plate, and a leaf spring that makes the second heat conductive plate and the first heat conductive plate adhere to each other and enables a slider, it is possible to adjust variations in processing and assembling parts. Without this, a high thermal conductivity can be obtained by assembling.

An imaging apparatus according to an eighth aspect of the present invention is the imaging apparatus according to the first aspect, wherein the heat radiating plate is added to the camera housing, and a side camera housing arranged at both ends of the camera housing. , The heat generated in the image sensor is radiated more efficiently.

The imaging apparatus according to a ninth aspect is the imaging apparatus according to the eighth aspect, wherein the side camera housing includes:
Since the cooling element is disposed between the heat radiating plate and the heat radiating plate, the cooling effect is increased by increasing the number of the cooling elements, and more effective heat radiation can be performed.

According to a tenth aspect of the present invention, there is provided the imaging apparatus according to the first aspect.
In the imaging device according to the invention, since a plurality of comb-shaped thin plates made of a good heat transfer metal are thermally coupled to the heat sink, the plurality of comb-shaped thin plates made of a good heat conductive metal are in close contact with the heat sink, Heat can be efficiently dissipated, and when a fan is provided inside to allow the outside air to pass through the inside of the housing, it functions as a heat sink and has good heat dissipation efficiency.

An imaging apparatus according to an eleventh aspect of the present invention is the imaging apparatus according to the first aspect.
In the imaging apparatus according to the present invention, since a heat sink is provided on the color separation prism side of the heat radiating plate, the amount of heat radiated is increased. Can be performed.

According to a twelfth aspect of the present invention, there is provided the imaging apparatus according to the first aspect.
In the imaging apparatus according to the invention, since the outer surfaces of the heat conduction plate and the heat sink are covered with a heat insulating material, heat is prevented from being conducted to the imaging device even when the temperature inside the housing increases. You.

According to a thirteenth aspect of the present invention, in the imaging device according to the first, fifth, or sixth aspect, a liquid circulating heat conductor and a heat sink are provided on the radiator plate. Since the heat is dissipated to the housing, the temperature inside the housing is prevented from rising and the cooling efficiency is prevented from lowering, and also has a dustproof effect.

In the imaging apparatus according to the fourteenth aspect, since the imaging device terminal extending from the imaging device is disposed on the imaging substrate via the heat conductor on which the heat radiating element is disposed, the imaging device formed of metal is used. Since the element terminals are cooled simultaneously with the package by the heat conductor, greater cooling efficiency can be obtained.

[0021]

Embodiments of the present invention will be described below with reference to the drawings. FIG. 1 is a diagram illustrating a configuration of an imaging apparatus according to a first embodiment of the imaging apparatus of the present invention.
1A is a cross-sectional view specifically illustrating an image sensor cooling unit of the image pickup apparatus, and FIG. 1B is a cross-sectional view of the image pickup apparatus of FIG.

As shown in FIGS. 1 (a) and 1 (b), an image pickup apparatus 1 according to the present embodiment is fixed to a camera housing 2, separates incident light into predetermined color components, and performs CC (color correction). A color separation prism 3 for separating into, for example, three color components provided with an ND filter, and an imaging surface arranged and fixed on the color component light exit sides 3a, 3b, 3c having respective component light exit surfaces. Solid-state imaging devices (hereinafter abbreviated as imaging devices) 4a, 4b, and 4c;
b, 4 c, which are electrically connected to the base ends of the image sensor terminals 5 extending from the image sensors 4 a, 4 b, 4 c, respectively, and process the electric signals output from the image sensors 4 a, 4 b, 4 c.
b and 6c.

On the back surface opposite to the image pickup surface of the image pickup devices 4a, 4b, 4c, a cooling surface of a Peltier element or the like having a heat generating surface fixed to a heat conductive plate 7 having good heat conductivity by, for example, soldering. The cooling surface of the element 8 is arranged.

As shown in FIG. 1A, the heat conducting plate 7 having the cooling element 8 integrated therein is arranged in a positional relationship parallel to the color separation prism 3 and is screwed to the camera housing 2 by a screw 13. It is screwed and fixed to the end of the heat radiation plate 9 screwed and fixed by the fixing screw 14. At this time, the cooling surface of the cooling element 8 is in close contact with the back surface of the imaging element 4a. And FIG.
As shown in (b), the cooling surface of the cooling element 8 is similarly arranged closely on the back surfaces of the other imaging elements 4b and 4c.

Therefore, the heat generated in the image pickup elements 4a, 4b, 4c is radiated through the cooling element 8, the heat conductive plate 7, the heat radiating plate 9, and the camera housing 2, so that the image pickup elements 4a, 4b, 4c
The rise of the temperatures b and 4c is alleviated, and the generation of dark current is reduced.

As described above, the heat generated by the image sensor is fixed by screwing the heat conductive plate to the heat sink so that the cooling surface of the cooling element integrated with the heat conductive plate is in close contact with the back surface of the image sensor. The heat can be quickly dissipated and transmitted to the cooling element, the heat conducting plate, the heat radiating plate, and the camera housing. As a result, the occurrence of dark current due to a rise in the temperature of the image sensor is reduced, and image deterioration is prevented.

By forming the heat conducting plate 7 with a member having a predetermined elasticity and a good thermal conductivity, the cooling element 8 integrated with the heat conducting plate 7 can be moved by the elastic force of the heat conducting plate 7. The heat generated in the imaging elements 4a, 4b, and 4c can be more efficiently conducted to the cooling element 8 by being pressed against the back surfaces of the imaging elements 4a, 4b, and 4c with an appropriate force.
This prevents the image from deteriorating due to a rise in the temperature of the imaging elements 4a, 4b, 4c.

FIG. 2 is a view for explaining an example of the configuration of a heat conducting plate constituting an imaging apparatus according to a second embodiment of the present invention.
As shown in the figure, in the present embodiment, the bending angle θ of the mounting portion 7a to the heat radiating plate 9 provided at both ends of the heat conducting plate 7 in which the cooling element 8 is integrated is set to the cooling surface of the cooling element 8. It is bent so as to be at an acute angle with respect to the cooling element fixing surface 71 which is a substantially parallel plane portion, that is, the mounting portion 7a is inclined inward.

Thus, when the heat conductive plate 7 is screwed and fixed to the heat radiating plate 9, the cooling element fixing surface 7 of the heat conductive plate 7
1 is bent toward the image sensor side, and the cooling surface of the cooling element 8 is pressed against the back surface of the image sensor 4a, 4b, 4c with an appropriate force and is generated by the image sensor 4a, 4b, 4c. Heat can be more efficiently conducted to the cooling element 8. This prevents the image from deteriorating due to a rise in the temperature of the imaging elements 4a, 4b, 4c. By appropriately setting the bending angle θ, the force of pressing the cooling surface of the cooling element against the back surface of the imaging element can be changed to a desired amount.

FIG. 3 is a view for explaining another example of the structure of the heat conducting plate constituting the image pickup apparatus according to the third embodiment of the present invention. FIG. FIG. 3B is a view showing a heat conductive plate having a thickness change portion in which the thickness continuously increases as the thickness increases. FIG. 3B shows that the thickness continuously increases from the mounting portion toward the cooling element fixing surface side. FIG. 4 is a view showing a heat conductive plate on which a variable thickness portion is formed.

In this embodiment, the mounting portion 7a of the heat conducting plate 7 is bent so as to be inclined inward,
The thickness between the mounting portion 7a and the cooling element fixing surface 71 is made to increase continuously from the cooling element fixing surface 71 to the mounting portion 7a as shown in FIG. Thickness changing portion 7 formed and given predetermined elasticity
b, or as shown in FIG.
To the cooling element fixing surface 71 side, the thickness is continuously increased, and a thickness changing portion 7c having a predetermined elastic force is formed. When screw fixing is performed, the cooling element fixing surface 71 of the heat conductive plate 7 is fixed.
Is bent toward the image sensor side, and the cooling surface of the cooling element 8 is pressed against the back surface of the image sensor 4a, 4b, 4c with an appropriate force by the elastic force of the thickness change portions 7b, 7c. Is done.

As a result, the cooling surface of the cooling element 8 is pressed against the back surface of the imaging elements 4a, 4b, 4c with an appropriate force, so that the heat generated by the imaging elements 4a, 4b, 4c is more efficiently cooled. Conduction to the element 8 and the imaging element 4
It is possible to prevent the image from deteriorating due to the temperature rises of a, 4b, and 4c.

FIG. 4 is a view for explaining another example of the structure of the heat conducting plate constituting the image pickup apparatus according to the fourth embodiment of the present invention. In this embodiment, the mounting portion 7a of the heat conductive plate 7 is bent so as to be inclined inward, and is fixed to the heat conductive plate 7 between the mounting portion 7a and the cooling element fixing surface 71 as shown in FIG. There is provided a tapered portion 7d which is an elastically bent portion formed by bending the cooled cooling element 8 so as to be positioned on the image sensor side.

Thus, when the heat conductive plate 7 is screwed and fixed to the heat radiating plate 9, the cooling element fixing surface 7 of the heat conductive plate 7 is fixed.
1 is bent toward the image pickup element side, and the cooling surface of the cooling element 8 is pressed against the back surfaces of the image pickup elements 4a, 4b, 4c with an appropriate force by the elastic force of the tapered portion 7d. In addition, the heat generated in the imaging elements 4a, 4b, and 4c can be more efficiently conducted to the cooling element 8, and the deterioration of the image due to the temperature rise of the imaging elements 4a, 4b, and 4c can be prevented.

FIG. 5 is a view for explaining another example of the structure of the heat conducting plate of the imaging apparatus according to the fifth embodiment of the present invention.
5A is a diagram illustrating a configuration of a heat conduction plate, FIG. 5B is a diagram illustrating a first heat conduction plate, and FIG. 5C is a diagram illustrating a second heat conduction plate.

As shown in FIG. 5A, in the present embodiment, the heat conducting plate is a first heat conducting plate 71 with which the cooling element 8 is integrated.
And the second heat conducting plate 72, and the first heat conducting plate 7
1. Attachment part 71 which is one end of the second heat conduction plate 72
a and 72a are screwed to the heat radiating plate 9, respectively. The other end portions of the first heat conductive plate 71 and the second heat conductive plate 72 partially overlap each other.
As shown in FIGS. 5B and 5C in which a leaf spring 15 for urging the first heat conductive plate 1 with a predetermined urging force is disposed at the other end of the first heat conductive plate 71, for example. Is the fixing screw 1
4 is formed in a screw hole 71b through which the fixing screw 14 is inserted.
b is formed. As a result, the first heat conducting plate 7
1 mounting portion 71a and mounting portion 72 of second heat conductive plate 72
The distance between the mounting portion and the hole a can be adjusted by the length of the elongated hole 72b.

As described above, by disposing the leaf spring between the first and second heat conducting plates, the fixing of the first and second heat conducting plates to the heat radiating plate can be prevented. By rotating the screw, the state of contact of the cooling surface of the cooling element with the back surface of the imaging device is changed, and the cooling surface of the cooling device can be pressed against the back surface of the imaging device with an appropriate force.

Further, since the elongated hole is formed in the second heat conductive plate, even if there is a slight dimensional error in the interval between the heat radiating plates, the mounting portion of the first heat conductive plate and the second heat conductive plate can be separated by the length of the elongated hole. (2) Adjustment of the interval between the heat conductive plate and the mounting portion can be performed, so that the heat conductive plate can be reliably mounted on the heat radiating plate.

FIG. 6 is a view for explaining another configuration example of the image pickup device cooling means of the image pickup apparatus according to the sixth embodiment of the present invention. FIG. 6A is a view for explaining a cooling element pressing plate. 6
FIG. 6B is a diagram illustrating a configuration example in which a cooling element pressing plate is arranged, and FIG. 6C is a diagram illustrating an operation of the cooling element pressing plate.

In this embodiment, a cooling element pressing plate 10 shown in FIG. 6A is prepared. The cooling element pressing plate 10 has two types of plate members 11, 1 having different coefficients of thermal expansion.
The cooling element pressing plate 10 is configured to bend when heated to a predetermined temperature.

As shown in FIG. 6B, the cooling element pressing plate 10 is provided between the heat conducting plate 7 and the heat generating surface of the cooling element 8.
The plate member 11 is disposed so as to face the heat generating surface of the cooling element 8. Specifically, the heat generating surface side of the cooling element 8 is fixed to the inner surface side of, for example, a box-shaped cooling element base 16 formed of a member having good thermal conductivity by soldering, and the cooling element 8 to which the cooling element 8 is fixed is fixed. The cooling element pressing plate 10 is disposed between the element base 16 and the heat conductive plate 7 via, for example, heat conductive grease.

As a result, the heat of the image pickup devices 4a, 4b, 4c is transmitted to the cooling element pressing plate 10, and the temperature of the cooling element pressing plate 10 rises and is thermally deformed.
As shown in (c), when the cooling element base 16 moves to the imaging element side and rises to a predetermined temperature, the cooling surface of the cooling element 8 is applied with an appropriate force to the back surfaces of the imaging elements 4a, 4b, and 4c. Since it is pressed and arranged, the heat generated in the image pickup devices 4a, 4b, and 4c is more efficiently conducted to the cooling device 8, and the temperature rise of the image pickup devices 4a, 4b, and 4c is promptly alleviated to prevent image deterioration. be able to.

FIG. 7 is a view for explaining another example of the structure of the image pickup device cooling means of the image pickup apparatus according to the seventh embodiment of the present invention. As shown in the figure, in the present embodiment, a pair of side camera housings 2 arranged on the side of the camera housing 2 are provided.
1, the heat radiating plate 9 is thermally coupled via a block-shaped heat conductor 22 having good heat conductivity. As a result, the heat generated by the imaging elements 4a, 4b, and 4c and transmitted to the heat radiating plate 9 through the cooling element 8 and the heat conducting plate 7 is
The heat is radiated by conducting to the side camera housing 21 via the heat conductor 22.

As described above, by thermally connecting the side camera housing provided on the side of the camera housing and the heat radiating plate via the heat conductor, the cooling element generated by the image pickup device,
The heat conducted to the heat radiating plate via the heat conducting plate can be efficiently radiated from the side camera housing, and the temperature rise of the image pickup device can be quickly mitigated to prevent image deterioration.

Instead of thermally connecting the heat radiating plate 9 and the side camera housing 21 with a heat conductor 22, the heat generating surface of the second cooling element 23 is connected to the heat conductor 24 as shown in FIG.
May be thermally coupled to each other via a heat conducting member integrally fixed thereto. As a result, the heat radiating plate 9 is actively cooled by the cooling element 23.

Further, instead of thermally connecting the heat radiating plate 9 and the side camera housing 21 with the block-shaped heat conductor 22, for example, as shown in FIG. A configuration may be adopted in which the heat conductive plate 31 in the form of a thin plate having high conductivity is fixed to the heat radiating plate 9, and the comb teeth 32 are brought into contact with the side camera housing 21. In this way, the heat conducted to the heat radiating plate 9 may be conducted to the side camera housing 21 to radiate the heat, and may be radiated from the comb teeth 32 of the heat conducting plate 31 to the air. Further, as shown in FIG. 10, a heat radiating element 33 may be arranged on the image pickup element side, which is the inner surface side of the heat radiating plate 9, to radiate the heat conducted to the heat radiating plate 9.

FIG. 11 is a view for explaining still another example of the structure of the image pickup device cooling means of the image pickup apparatus according to the eighth embodiment of the present invention. FIG. 11 (a) is provided with a liquid circulation type heat conductor. FIG. 11B is a diagram illustrating a configuration example, FIG. 11B is a diagram illustrating a configuration example of a liquid circulation type heat conductor, and FIG. 11C is a diagram illustrating another configuration example of a liquid circulation type heat conductor.

As shown in FIG. 11A, in this embodiment, in order to dissipate the heat generated by the image pickup devices 4a, 4b, 4c to the outside of the housing, a liquid circulating heat conductor 40 is provided on the outer surface of the radiator plate 9. And the liquid circulation type heat conductor 4
A part of the liquid-circulating heat conductor 40 disposed outside the camera housing 35 constituting the camera is provided with a heat sink 43 as a heat radiation element. As a result, the heat generated in the image sensors 4a, 4b, 4c is radiated to the outside of the camera, and the temperature rise of the image sensors can be quickly mitigated to prevent image deterioration.

The structure of the liquid circulation type heat conductor 40 and the heat sink 43 is not limited to the structure shown in FIG.
As shown in FIGS. 11 (b) and 11 (c), even when the first liquid circulation type heat conductor 41 and the second liquid circulation type heat conductor 42 are provided and the heat sink 43 is arranged, the same operation and effect can be obtained. The effect can be obtained.

FIG. 12 is a view for explaining another example of the structure of the image sensor cooling means of the image pickup apparatus according to the ninth embodiment of the present invention.

In this embodiment, the heat radiating plate 9 and the heat conducting plate 7 are surrounded by a heat insulating material 45 as shown by broken lines in the figure. Thus, the heat insulating material 45 surrounding the heat radiating plate 9 and the heat conducting plate 7 prevents heat from outside the heat radiating plate 9 and the heat conducting plate 7 from entering the imaging elements 4a, 4b, 4c. As a result, the deterioration of the image due to the temperature rise can be more reliably prevented.

By the way, as shown in FIG. 13, in the conventional image pickup apparatus, a cover glass 51 for protecting the image pickup element is arranged on the front surface of the image pickup element for performing photoelectric conversion, and a package 50 with small dimensional change due to heat is formed. An image sensor terminal 52 for extracting an electric signal converted by the image sensor to the outside of the package 50 is electrically connected to an image pickup board 55.
A heat sink 56 is disposed on the back of the package 50 via a heat conductor 53 to prevent the temperature of the image sensor 50 from rising. However, with the recent increase in the density of the image sensor, a further improvement in the cooling effect has been desired.

For this reason, in the present embodiment, not only the package 50 having low thermal conductivity is cooled, but also the image sensor terminal 52 is cooled to improve the cooling effect of the image sensor.

Therefore, as shown in FIG. 14, the image pickup apparatus according to the present embodiment transmits electric signals extending from the image pickup element surface of the package 50 formed by disposing the cover glass 51 on the front surface of the image pickup element that performs photoelectric conversion. The imaging element terminal 52 for transmission is electrically connected to the imaging substrate 55 via the thermal conductor 58, and the cooling surface of the cooling element 54 is brought into close contact with the back surface of the package 50 via the thermal conductor 58, and A heat sink 56 for preventing a rise in temperature is arranged on the heat generating surface of the cooling element 54.

That is, the image pickup device terminal 52 is
As shown in the figure, the heat conductor 58 is disposed on the imaging board 55 through a cutout 58a formed in the heat conductor 58. Therefore, the heat of the image sensor, which has been thermally conducted through the image sensor terminal 52 having high thermal conductivity, is conducted by the heat conductor 58 and then cooled by the cooling element 54, so that efficient cooling is performed. be able to.

The cross-sectional shape of the heat conductor 58 may be a flat plate shape or a shape in which the notch 58a is formed thicker than the other surface, giving priority to heat conductivity. As shown in FIG. 16, a pair of cutouts 58 a are formed at both ends of the heat conductor 58, and the ends are bent to form heat of the image sensor that is thermally conducted through the image sensor terminal 52. As shown in FIG.
As shown in FIG. 5, a bending elastic portion is formed on the heat conductor 58 so as to be in close contact with the image sensor terminal 52 so that the heat of the image sensor thermally conducted through the image sensor terminal 52 is conducted to the heat conductor 58. Is also good.

In this embodiment, three image sensors are used.
Although the configuration of one imaging device is shown, the number of imaging elements may be three or more or less. Further, the present invention is not limited to only the above-described embodiments, and various modifications can be made without departing from the spirit of the invention.

[0058]

As described above, according to the image pickup apparatus of the present invention, it is possible to reliably prevent the temperature of the image pickup element being driven from rising, and to assemble it with high accuracy. , The rise in the temperature of the image sensor can be efficiently reduced.

[Brief description of the drawings]

FIG. 1 is a diagram illustrating a configuration of an imaging apparatus according to a first embodiment of the imaging apparatus of the present invention.

FIG. 2 is a view for explaining a configuration example of a heat conductive plate constituting an imaging device according to a second embodiment of the present invention.

FIG. 3 is a view for explaining another configuration example of the heat conduction plate constituting the imaging device according to the third embodiment of the present invention.

FIG. 4 is a view for explaining another configuration example of a heat conductive plate constituting an imaging device according to a fourth embodiment of the present invention.

FIG. 5 is a view for explaining another configuration example of the heat conductive plate of the imaging device according to the fifth embodiment of the present invention.

FIG. 6 is a diagram illustrating another configuration example of an image sensor cooling unit of an image capturing apparatus according to a sixth embodiment of the present invention.

FIG. 7 is a view for explaining another configuration example of the image sensor cooling means of the image pickup apparatus according to the seventh embodiment of the present invention.

FIG. 8 is a view for explaining an application example of an image sensor cooling means of an image pickup apparatus according to a seventh embodiment of the present invention.

FIG. 9 is a view for explaining another application example of the imaging device cooling means of the imaging device according to the seventh embodiment of the present invention.

FIG. 10 is a view for explaining another application example of the imaging device cooling means of the imaging device according to the seventh embodiment of the present invention.

FIG. 11 is a view for explaining still another configuration example of the image sensor cooling means of the image pickup apparatus according to the eighth embodiment of the present invention.

FIG. 12 is a view for explaining another example of the arrangement of the image sensor cooling means of the image pickup apparatus according to the ninth embodiment of the present invention.

FIG. 13 is a view for explaining an image sensor terminal extending from a conventional image sensor, a heat sink disposed on a heat conductor, and the like.

FIG. 14 is a view for explaining an image sensor terminal extending from the image sensor of the present embodiment, a heat sink disposed on a heat conductor, and the like.

FIG. 15 is a diagram illustrating a configuration example of a heat conductor.

FIG. 16 is a diagram illustrating another configuration example of the heat conductor.

FIG. 17 is a diagram illustrating another configuration example of the heat conductor.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 ... Image pick-up device 2 ... Camera housing 3 ... Color separation prism 4a, 4b, 4c ... Image pick-up element 6a, 6b, 6c ... Image pick-up element board 7 ... Heat conduction plate 8 ... Cooling element 9 ... Heat sink

Claims (14)

[Claims] 1. An image sensor fixed to a camera housing and fixed to each component light emission surface of a plurality of color separation prisms for separating incident light into predetermined color components, and output from the image sensor. An image sensor substrate for processing an image sensor signal; a radiator plate attached to the camera housing; a cooling element having a cooling surface and a heat generating surface; a mounting portion attached to the radiator plate; A fixed portion whose surface is fixed to be heat conductive is integrally formed, and when the mounting portion is attached to the heat sink, the cooling surface of the cooling element is in close contact with the fixed portion with respect to the imaging element. An image pickup device comprising: a heat conductive plate having a mounting portion and a fixing portion formed so as to generate a stress in a direction in which the stress is generated. 2. The heat conduction plate has attachment portions at both ends of a parallel plane portion substantially parallel to a cooling surface of the cooling element, and a bending angle formed by the attachment portion and the parallel plane portion is set to be equal. The imaging device according to claim 1, wherein the imaging device has an acute angle. 3. The heat conduction plate has a parallel plane portion substantially parallel to a cooling surface of the cooling element and attachment portions at both ends of the parallel plane portion. 2. The image pickup apparatus according to claim 1, wherein the change is continuous between the vicinity of the element and the bent portion. 4. The heat conduction plate has a parallel plane portion substantially parallel to a cooling surface of the cooling element, and attachment portions at both ends of the parallel plane portion, between the parallel plane portion and the attachment portion. At least one
The imaging device according to claim 1, wherein the imaging device has two bent portions. 5. An image sensor fixed to a camera housing and fixed to each component light exit surface of a plurality of color separation prisms for separating incident light into predetermined color components, and output from the image sensor. An image sensor substrate for processing an image sensor signal; a radiator plate attached to the camera housing; a cooling element having a cooling surface and a heat generating surface; a mounting portion attached to the radiator plate; A surface is formed integrally with a holding portion that holds the surface so as to be able to conduct heat, and stress is generated in the holding portion in a direction in which the cooling surface of the cooling element is brought into close contact with the imaging element by heat from the heating surface of the cooling element. An imaging device comprising: a heat conduction plate on which a cooling element pressing plate to be generated is arranged. 6. An image sensor fixed to a camera housing and fixed to each component light emission surface of a plurality of color separation prisms for separating incident light into predetermined color components, and output from the image sensor. An image sensor substrate for processing an image sensor signal; a heat radiating plate attached to the camera housing; a cooling element having a cooling surface and a heat generating surface; and a fixing wherein the heat generating surface of the cooling element is fixed so as to conduct heat. And at least two mounting portions provided at the end of the fixing portion and mounted on the heat sink. A mounting width adjusting mechanism for adjusting a gap between one of the mounting portions and the other is provided, and A heat-generating plate integrally formed with a mounting width adjusting mechanism, wherein a member that generates stress in a direction in which a cooling surface of the cooling element is brought into close contact with the image-capturing element with respect to the unit is provided. . 7. The mounting width adjusting mechanism, wherein the cooling element is integrally provided with a first heat conductive plate having a mounting portion at one end and a screw hole at the other end, and a mounting portion at one end. A second heat conductive plate having an elongated hole at the other end corresponding to the screw hole of the first heat conductive plate; and bringing the second heat conductive plate and the first heat conductive plate into close contact with each other; The imaging device according to claim 6, further comprising: a leaf spring that enables a slider. 8. The camera according to claim 8, wherein the heat radiating plate is added to the camera housing.
2. The imaging device according to claim 1, wherein the camera housing is thermally coupled to side camera housings arranged at both ends of the camera housing. 9. The imaging device according to claim 8, wherein a cooling element is disposed between the side camera housing and the heat sink. 10. A heat-dissipating plate, wherein a plurality of comb-shaped thin plates formed of a good heat transfer metal are thermally coupled.
An imaging device according to any one of the preceding claims. 11. The image pickup apparatus according to claim 1, wherein a heat sink is provided on the color separation prism side of the heat sink. 12. The imaging device according to claim 1, wherein the outer surfaces of the heat conductive plate and the heat radiating plate are covered with a heat insulating material. 13. The imaging apparatus according to claim 1, wherein the heat radiating plate is provided with a liquid circulation type heat conductor and a heat sink to radiate heat to the outside of the housing. 14. An imaging apparatus, wherein an imaging element terminal extending from the imaging element is arranged on an imaging board via a heat conductor on which a heat radiating element is arranged.