JP2019114893A - Imaging apparatus - Google Patents

Abstract

To provide an imaging apparatus with a mechanism that balances natural heat radiation when a cooling accessory is not installed and heat transfer to the accessory when the cooling accessory is installed.SOLUTION: An element serving as a heat source, a Peltier element, and a heat sink interposed between the element serving as the heat source and the Peltier element and connected to an accessory mounting surface are included in a first housing having an accessory mounting surface on one surface of the appearance. A heat absorbing surface of the Peltier element is in contact with the heat sink. The accessory mounting surface has an opening that overlaps with at least a portion of the Peltier element when viewed from the normal direction of the accessory mounting surface. A second housing that has cooling means and is attachable to the accessory mounting surface can cool the heat generating surface of the Peltier element.SELECTED DRAWING: Figure 9

Description

  BACKGROUND OF THE INVENTION Field of the Invention The present invention relates to an imaging apparatus which can be mounted with an accessory having a cooling mechanism.

  In image pickup apparatuses such as digital video cameras and digital still cameras, power consumption of the image pickup element is increased and heat generation amount is also increased as the image quality is improved. On the other hand, in imaging devices such as digital video cameras and digital still cameras, a circuit board on which an imaging device is mounted and a main circuit board on which electronic components for processing control signals and image signals are mounted in response to a recent demand for miniaturization. The placement space of has become smaller. Therefore, the density of these substrates is also increasing.

  An image pickup element used in an image pickup apparatus such as a digital video camera or a digital still camera generally needs to dissipate heat generated by the image pickup element because the performance thereof is lowered as the temperature becomes higher. In addition, it is necessary to suppress an increase in the temperature of the imaging device due to the heat generated by the electronic component mounted on the main circuit board being transmitted to the imaging device. In addition, during operation in a high temperature environment, the heat generated by the electronic components mounted on the main circuit board causes the element overheat temperature of the main circuit board to be exceeded, which causes a thermal runaway, and the temperature of the exterior becomes high. Have the problem of giving discomfort to people.

  Then, the structure which cools an imaging device is proposed by mounting the accessory which has a cooling part (patent document 1).

JP, 2006-33031, A

  By mounting the cooling accessory, it is necessary to transfer much heat from the imaging device to the cooling accessory in order to effectively cool the imaging device. For that purpose, it is necessary to transfer the internal heat as much as possible to the cooling accessory mounting surface of the imaging device, which is the boundary between the imaging device and the cooling accessory. The device described in Patent Document 1 is provided so that the heat sink of the imaging sensor, which is a heat source, is exposed to the outside, and the exposed heat sink is used as a mounting surface of the cooling accessory directly.

  However, in the configuration of Patent Document 1, the heat sink is exposed to the outside. Therefore, the configuration of Patent Document 1 may cause the photographer to feel uncomfortable when the cooling accessory is not mounted.

  Further, in order to give priority to the cooling accessory non-mounting state and to lower the temperature of the cooling accessory mounting surface of the imaging device, it is necessary to dissipate the heat inside the imaging device to the appearance as wide as possible. As a result of dissipating heat to the appearance, the temperature of the cooling accessory mounting surface, which is part of the appearance, is also lower. Thus, the internal heat can not be sufficiently transferred to the cooling accessory in the cooling accessory mounted state, and the imaging device can not be effectively cooled even if the cooling accessory is used.

  Thus, in the configuration in which the imaging device is effectively cooled by the attachment of the cooling accessory, it is necessary to satisfy different requirements in the cooling accessory attached state and the cooling accessory unattached state. That is, when the cooling accessory is not attached, the heat is effectively dissipated, and when the cooling accessory is attached, the heat is not dissipated, and a mechanism for delivering the heat to the cooling accessory in a high heat density state is required.

  Therefore, an object of the present invention is to provide an imaging device having a mechanism for achieving both natural heat radiation when the cooling accessory is not attached and delivery of heat to the accessory when the cooling accessory is attached.

  In order to achieve the above object, an imaging device according to the present invention comprises an element serving as a heat source, a Peltier element, an element serving as the heat source, and the Peltier element in a first housing having an accessory mounting surface on one surface And a heat dissipation plate connected to the accessory mounting surface, the heat absorbing surface of the Peltier element is in contact with the heat dissipation plate, and the accessory mounting surface is normal to the accessory mounting surface. The heat generating surface of the Peltier element is cooled by a second housing which has an opening in which at least a part of the Peltier element overlaps and which can be attached to the accessory mounting surface in projection viewed from a direction. It is characterized in that it is possible.

  According to the present invention, it is possible to provide an imaging device provided with a mechanism for achieving both natural heat radiation when the cooling accessory is not attached and delivery of heat to the accessory when the cooling accessory is attached.

An external perspective view of a main body according to an embodiment of the present invention The perspective view showing the mounting method of the accessory which concerns on embodiment of this invention The perspective view showing the state where equipped with the accessory concerning the embodiment of the present invention Side view showing a state in which the accessory according to the embodiment of the present invention is mounted Cross section showing internal structure according to an embodiment of the present invention An exploded perspective view showing an internal structure according to an embodiment of the present invention The perspective view showing the structure of the accessory concerning the embodiment of the present invention Flow chart representing the operation of the main body according to the embodiment of the present invention Schematic diagram showing the operation of the main body according to the embodiment of the present invention

  Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the drawings. In the description of the present embodiment, the surface viewed from the lens (front lens) side is front and front, the surface facing the front is back, and the rear surface viewed from the front, the right surface is viewed from the right The left side is referred to as the left side, the upper side as viewed from the front as the top, and the lower side as viewed from the front as the bottom.

  FIG. 1 is an external perspective view of the imaging apparatus main body 101, and FIG. 1 (a) is a perspective view mainly showing a front configuration, and FIG. 1 (b) is a perspective view mainly showing a rear configuration of the imaging apparatus main body 101. FIG. First, the function of each element of appearance will be described using this figure.

  A lens 102 is disposed on the front side of the imaging apparatus main body 101 shown in FIG. In the lens 102, there are a zoom ring 103 that optically enlarges and reduces a captured image when the photographer rotates, and a focus ring 104 in which the in-focus position of the captured image changes when the photographer rotates. It is provided.

  The image pickup apparatus main body 101 is not equipped with a monitor for confirming a photographed image. The imaging apparatus main body 101 is configured to confirm a photographed image by outputting a photographed image to an external monitor via a wire (not shown) connected to the external monitor output terminal 105. On the right side of the imaging apparatus main body 101, a power dial 106 for turning on / off the power of the device is provided. Further, on the front surface of the imaging apparatus main body 101, a recording start control button 107 for controlling start / stop of recording is provided.

  On the rear side of the imaging apparatus main body 101 shown in FIG. 1B, a power supply terminal 201 for supplying power to the device, voice microphone input terminals 202a and 202b for inputting voice from a microphone (not shown) to the device, voice confirmation And an external recording device connection terminal 205 for outputting an image to the external recording device. Further, in addition to the connection terminal 206 for connection to the network, a USB terminal 207 for connection to a PC is provided, and operation of various applications is possible.

  The imaging apparatus main body 101 mounts an accessory on the accessory mounting portion 210 on the back surface, and can make the accessory and the imaging apparatus main body 101 cooperate with each other. Therefore, most of the rear surface of the imaging apparatus main body 101 is an accessory mounting portion 210 for mounting accessories such as a cooling unit to be described later, a large battery (not shown), a large external recording device (not shown) on the rear of the device. ing.

  The accessory mounting portion 210 is formed of an aluminum alloy or the like having a high thermal conductivity. The accessory mounting portion 210 is formed in a flat surface to facilitate mounting of a general-purpose accessory, and mounting female screws 213a to 213d are provided at four corners. In the accessory mounting portion 210, an accessory connection terminal 212 for performing signal communication with the accessory and power supply distribution with the accessory is provided in an inner area surrounded by mounting female screws 213a to 213d provided at four corners.

  At the center of the accessory mounting portion 210, a mesh 220 formed of a punch material having a high opening ratio is provided so as to cover the opening 215 of the accessory mounting portion 210. Further, in the area outside the accessory mounting unit 210, an insertion port of a removable recording medium 214 used to record a photographed image is provided.

  FIG. 2 is a perspective view showing a state in which the cooling unit 301 is attached as an accessory to the imaging apparatus main body 101. FIG. 3 is a perspective view showing a state in which the cooling unit 301 is attached to the imaging apparatus main body 101. It is.

  As shown in FIG. 2, the cooling unit 301 mounted on the imaging apparatus main body 101 is also provided with a terminal 310 having the same shape as the imaging apparatus main body 101 and capable of performing signal communication and power distribution. Further, an accessory terminal 305 connected to the accessory connection terminal 212 of the main body is provided on the surface of the cooling unit 301 in contact with the imaging device main body 101. The terminal 310 and the accessory terminal 305 are connected in the cooling unit 301, and are also branched and connected to the air cooling fan 800 built in the cooling unit 301.

  The cooling unit 301 is attached by sandwiching the attachment parts 315a-d, which are through holes provided at the four corners of the unit, and fastening the accessory attachment screws 320a-d to the attachment female screws 213a-d on the main body side, respectively.

  FIG. 4 is a side view showing a state in which the accessory is mounted on the imaging apparatus main body 101. As shown in FIG. FIG. 4A is a diagram illustrating a state in which the cooling unit 301 is attached as an accessory to the imaging apparatus main body 101. FIG. 4B is a diagram showing a state in which the battery unit 302 is attached to the imaging apparatus main body 101. FIG. 4C is an attachment of the battery unit 302 to the imaging apparatus main body 101 with the cooling unit 301 interposed therebetween. FIG.

  The imaging device main body 101 of the present embodiment is configured such that electrical connection between the imaging device main body 101 and the plurality of accessories can be performed even when the plurality of accessories are coupled on the optical axis. As shown in FIG. 4A, when the cooling unit 301 is attached to the accessory attachment portion 210, the accessory connection terminal 212 on the main body side shown in FIG. 2 and the terminal 310 of the cooling unit 301 are connected, and the imaging device It is identified that the cooling unit 301 is attached to the main body 101. Thereafter, the cooling unit 301 can be driven by exchanging power supply from the imaging apparatus main body 101 to the cooling unit 301 and a rotation control signal of a fan provided in the cooling unit 301.

  As shown in FIG. 4B, when the battery unit 302 is attached, it is similarly identified that the battery unit 302 is attached. The battery unit 302 is an accessory configured of a battery 3020 and a fixed plate 3021 of the battery 3020. The mounting method of the battery unit 302 is performed in the same manner as the mounting method of the cooling unit 301. That is, by using accessory mounting screws 320a to 320d as shown in FIG. 2, the fixing plate 3021 is penetrated and fastened to the mounting female screws 213a to 213d on the main body side.

  The fixed plate 3021 is provided with a rail (not shown) engaged with the battery unit 302, and the battery 3020 is slid from the upper side with respect to the fixed plate 3021 to prevent the not shown removal. Since the non-retained stopper can be easily released by the user operation, the fixed plate 3021 can be left in the imaging apparatus main body 101, and only the battery 3020 can be easily replaced.

  When attachment of the battery unit 302 to the imaging apparatus main body 101 is identified, power is supplied from the battery unit 302 to the main body via the accessory connection terminal 212. By using the battery unit 302, it is possible to operate the imaging apparatus main body 101 in an external environment without a power outlet or the like without connecting a power cable (not shown) to the power supply terminal 201 shown in FIG.

  Further, as shown in FIG. 4C, the imaging apparatus main body 101 according to the present embodiment can also be equipped with the cooling unit 301 on the back and further with the battery unit 302. That is, it is possible to identify that the cooling unit 301 is attached to the back of the imaging apparatus main body 101 and the battery unit 302 is attached to the rear of the imaging apparatus main body 101. It is possible to simultaneously drive and supply power from the battery unit 302.

  FIG. 5 is a partial cross-sectional view showing the internal structure of the imaging device according to the embodiment of the present invention. The rear of the lens 102 is shown in cross section. In the imaging apparatus main body 101 according to the present embodiment, an imaging element 501 is disposed on a focal plane behind the lens 102. An imaging element 501 converts an object image formed on a light receiving surface into electronic data. On the subject imaging surface of the imaging device 501, color filters that transmit only the colors of R, G, and B (not shown) are provided, and the light incident on the imaging device 501 is R, G It can be converted to electronic data of color and B.

  The imaging element 501 is mounted on the sensor substrate 303, and is electrically connected to the main substrate 50 via a connection wire (not shown). As a result, electronic data output from the imaging device 501 can be transmitted to the main substrate 50. A control IC 502 is mounted on the back side of the main substrate 50. In the control IC 502, a CPU (Central Processing Unit) and a program memory are integrally packaged.

  Further, a work memory 503 is mounted on the main substrate 50. The control IC 502 stores various data necessary for control of the imaging apparatus main body 101 and the accessory. The work memory 503 is a volatile memory used as a work area when performing various arithmetic processing by the control IC 502.

  The control IC 502 can perform various calculation processing such as automatic exposure calculation, automatic focusing calculation, white balance adjustment calculation by loading a predetermined control program into the work memory 503 and executing calculation. Thus, a subject image can be generated from the electronic data formed on the light receiving surface of the imaging device 501, and the generated subject image can be sent to and recorded on the recording medium 214 disposed on the bottom of the device. When performing such electrical processing, the control IC 502 consumes a large amount of power, and at the same time, a large amount of heat is generated.

  In order to dissipate heat of the control IC 502, as shown in FIG. 5, in the present embodiment, a heat dissipation plate 60 formed of a copper plate with high thermal conductivity and a Peltier element 650 in the rear of the control IC 502 All the components 607 are disposed inside the imaging apparatus main body 101.

  FIG. 6 is an exploded perspective view showing the internal structure of the imaging device according to the embodiment of the present invention. FIG. 6 shows the internal structure of the rear portion of the imaging device main body 101, which relates to heat radiation of the imaging device.

  The main substrate 50 on which the control IC 502 is mounted is attached to an exterior member 600 formed of a resin having a low thermal conductivity. The heat dissipation plate 60 disposed behind the main substrate 50 is also attached to the exterior member 600, and the main plane 601 of the heat dissipation plate 60 is a control IC 502 of the main substrate 50 and a heat dissipation rubber 604 attached to the top surface of the control IC 502. Through and in close contact.

  The heat sink 60 has a step-like shape having bent portions 602 and 603 extending from the main plane 601 toward the rear accessory mounting portion 210. Further, the end portions 605 and 606 of the upper and lower heat radiation plates penetrate the holes 608ab of the exterior member 600 and are fastened with screws (not shown) from the front to the accessory mounting portion 210 disposed at the rear of the device. Be done.

  The accessory attachment unit 210 is attached to the exterior member 600. The accessory mounting portion 210 is a plate-like member made of an aluminum alloy or the like whose thermal conductivity is high and an alumite treatment is applied to enhance the design. The alumite is peeled off at the connecting portion with the heat sink 60, and not only the heat transfer with the heat sink 60 but also the electrical conduction is secured. The accessory mounting portion 210 has an opening 215 at the center, and has a through hole into which the accessory connection terminal 212 is inserted on the bottom side.

  The accessory connection terminal 212 penetrates the accessory mounting portion 210 and the exterior member 600, and is electrically connected to the main substrate 50. Further, the mesh 220 is disposed so as to cover the central opening 215 of the accessory mounting portion 210. The mesh 220 is formed of a material such as stainless steel having a relatively low dielectric conductivity, and is fastened to the exterior member 600 with a screw (not shown) from the rear. The mesh 220 does not make direct contact with the accessory mounting portion 210, and is disposed with a slight space.

  Further, since the back surface of the imaging device main body 101 configured by the mesh 220 and the accessory mounting portion 210 is flat, as shown in FIG. 4, the accessory attached to the imaging device main body 101 can also be flat.

  A Peltier element 650 is disposed in close contact with the rear of the main flat surface 601 of the heat sink 60 via a heat release rubber 612. The Peltier device 650 is electrically connected to the main substrate 50 inside the imaging device main body 101 by a wire (not shown), and power can be applied from the main substrate 50 to the Peltier device 650. The Peltier element 650 is an element which absorbs heat on one side by power application, and in return generates heat on the back side.

  In the Peltier element 650 of the present embodiment, the heat absorption surface is in close contact with the main flat surface 601 of the heat sink 60 via the heat release rubber 612, and the heat generation surface is in close contact with the heat release fin 607 via the heat release rubber 613. In addition, a heat insulating material 614 is disposed on the heat absorbing surface of the Peltier element 650 and the outer periphery other than the heat generating surface, and the heat insulating material 614 is provided on the exterior member 600 formed of a material having low thermal conductivity. It is held down by 6001. As a result, the heat absorption surface and the heat generation surface of the Peltier element 650 are thermally separated, and a large temperature gradient can be obtained.

  FIG. 7 is a perspective view showing the structure of the cooling unit 301. As shown in FIG. In particular, FIG. 7a is a diagram showing the connecting surface side of the image pickup apparatus main body 101 of the cooling unit 301, and FIG.

  The cooling unit 301 is mounted with the air cooling fan 800, and is one of the accessories for the main body that operates the air cooling fan 800 by the power supplied from the imaging device main body 101 via the accessory terminal 305 and the control signal. The air cooling fan 800 is an axial flow fan, and in the cooling unit 301 of the present embodiment, the exhaust side of the air cooling fan is exposed from the cooling unit 301. In the upper part of the cooling unit 301, there is provided an intake port 803 which forms an inlet of a flow passage connected to the air cooling fan 800, and on both side surfaces a concave portion 804ab which forms a part of the flow passage when the main body is mounted is disposed. There is.

  Next, the operation of the imaging device of the present embodiment will be described. FIG. 8 is a flowchart showing the operation of the imaging apparatus main body 101. First, the imaging apparatus main body 101 detects whether an accessory is attached (S103). When the accessory is not attached to the imaging apparatus main body 101, the flow is terminated without driving the Peltier element 650 built in the imaging apparatus main body 101 (S110).

  When the accessory is attached to the imaging apparatus main body 101 and the control IC 502 in the imaging apparatus main body 101 detects that the cooling unit 301 is attached (S 105), the accessory connection terminal 212 from the imaging apparatus main body 101 is detected. , The power supply to the cooling unit 301 is performed (S106). By supplying power to the cooling unit 301, when the built-in air cooling fan 800 is started, the number of rotations of the air cooling fan 800 is sent to the control IC 502 of the imaging apparatus main body 101 via the accessory connection terminal 212. When the rotation of the air cooling fan 800 reaches a predetermined number of rotations, it is determined that the air cooling fan 800 has started (S107), and predetermined power is supplied to the Peltier element 650 built in the imaging device main body 101 (S108). End (S110).

  If it is detected in S105 that the attached accessory is an accessory other than the cooling unit 301, exchange of control signals and power according to the attached accessory from the imaging apparatus main body 101 via the accessory connection terminal 212. I do. For example, when the attached accessory is the battery unit 302, power is supplied to the imaging apparatus main body 101 via the accessory connection terminal 212. At this time, the Peltier element 650 built in the imaging apparatus main body 101 is not driven. In this case, as described later, since the control IC 502 can not be sufficiently cooled, the imaging apparatus main body 101 shifts to an operation mode having a restriction such as providing a restriction on continuous photographing time when operating in a high temperature environment. (S109), the flow ends (S110).

  FIG. 9 is a schematic view showing the flow of heat of the imaging device main body 101. As shown in FIG. In particular, FIG. 9 b is a schematic view showing a state in which the cooling unit 301 is attached to the imaging apparatus main body 101, and FIG. 9 a shows a state in which the back of the device is exposed to the outside without attaching accessories. There is.

  In the state in which the back of the device shown in FIG. 9A is exposed to the outside, the heat generated from the control IC 502 mounted on the main substrate 50 is transmitted to the heat sink 60 on the back. The heat transferred to the heat dissipation plate 60 is thermally conducted while spreading from the main flat surface 601 to the end portions 605 and 606 of the heat dissipation plate through the bent portions 602 and 603, and accessory attachment from the end portions 605 and 606 of the heat dissipation plate It is transmitted to the part 210.

  Since the accessory mounting portion 210 is formed of a material having a high thermal conductivity, the heat is further diffused in the accessory mounting portion 210 and is finally dissipated to the outside air. Thus, the heat generated by the control IC 502 is dissipated to the outside air from the wide surface of the appearance. For this reason, the accessory mounting portion 210 has a relatively low and flat temperature distribution on a flat surface, and does not give the user a sense of discomfort due to a heat spot or the like. In addition, the control IC 502 can be sufficiently cooled.

  In the state where the cooling unit 301 is attached to the imaging device main body 101 shown in FIG. 9 b, power is applied to the Peltier element 650 incorporated in the imaging device main body 101. When power is applied to the Peltier device 650, the temperature of the heat absorption surface of the front surface of the Peltier device 650 decreases. Since the heat absorption surface of Peltier element 650 is in close contact with main plane 601 of heat dissipation plate 60, the heat generated from control IC 502 arranged on the front of main plane 601 passes through main plane 601 and The heat is absorbed by the element 650. Furthermore, since the heat generating surface which is the rear surface of the Peltier element 650 is in close contact with the radiation fin 607 provided behind the Peltier element 650, heat is transferred from the Peltier element 650 heat generating surface to the heat dissipating fin 607.

  In the state shown in FIG. 9 b, the cooling unit 301 is attached to the imaging device main body 101. Here, the flow of air by the cooling unit 301 will be described. The cooling unit 301 incorporates an air cooling fan 800, and sucks in external air from an air intake port 803 (shown in FIG. 7) provided on the upper surface. The cooled air flowing into the cooling unit 301 passes through the mesh 220 of the imaging device main body 101 and is blown toward the radiation fin 607 disposed in front of the mesh 220 as shown by the dotted arrow.

As described above, the heat of the radiation fin 607 is transmitted to the air flowing from the cooling unit 301 by the cooling unit 301. The warmed air passes through the openings of the mesh 220 again, and is exhausted to the outside air from recesses 804 (shown in FIG. 7) provided on both sides of the cooling unit 301.
Thus, unlike the state in which the rear surface of the device shown in FIG. 9A is exposed to the outside, the heat generated by the control IC 502 is transmitted to the wind sent from the cooling unit 301 by the heat dissipating fins 607 and dissipated to the outside air.

  Here, since the cooling capacity by the Peltier element 650 is very high compared to natural cooling, heat is conducted to the heat sink 60 and heat is transferred to the outside air before heat is transferred to the accessory mounting portion 210 which is a fixing destination. Heat is dissipated. Therefore, the heat conduction to the accessory mounting portion 210 is not actively performed, and the control IC 502 can be sufficiently cooled even without the heat transmission from the accessory mounting portion 210. Thereby, even when the accessory is mounted on the back surface, cooling can be performed without any problem. That is, when the cooling unit 301 is attached, heat can be effectively delivered to the accessory by the Peltier element 650 and the radiation fin 607 without diffusing the heat to the accessory attachment portion 210.

  Further, as shown in FIG. 4B, it is possible to attach another accessory other than the cooling unit 301 to the back of the imaging apparatus main body 101 according to the present embodiment. For example, when the battery unit 302 is directly mounted on the back surface, the accessory mounting portion 210 is covered by the battery unit 302 on the back surface, so it is difficult to dissipate the heat to the outside air. Therefore, the heat dissipation is not performed sufficiently for the control IC 502, and the temperature of the control IC 502 is increased.

  Therefore, when another accessory other than the cooling unit 301 is attached to the back of the imaging apparatus main body 101 of the present embodiment, restrictions such as shortening the recordable time are performed. In order to avoid this, in the device according to the present embodiment, as shown in FIG. 4c, it is possible to sandwich the cooling unit 301 in the imaging device main body 101 and attach another different accessory such as the battery unit 302 behind it. It has become. As a result, the same cooling as in the state where the cooling unit 301 is attached to the image pickup apparatus main body 101 described above is performed, and it becomes possible to operate without limitation such as shortening the recordable time.

  As described above, in the configuration for effectively cooling the imaging device by mounting the cooling unit 301, different requirements can be satisfied when the cooling unit 301 is mounted and when the cooling unit 301 is not mounted. That is, when the cooling unit 301 is not attached, natural heat radiation can be effectively performed, and when the cooling unit 301 is attached, heat can be effectively delivered to the accessory.

  Thus, natural heat radiation when the cooling unit 301 is not mounted and transfer of heat to the accessory when the cooling unit 301 is mounted can be compatible by switching the exhaust heat path of the main body depending on whether or not the cooling unit 301 is mounted.

  As described above, according to the present embodiment, the exhaust heat path can be changed depending on the presence or absence of the cooling accessory, whereby natural heat radiation is effectively performed when the cooling accessory is not attached, and the accessory is attached when the cooling accessory is attached. Heat transfer can be performed effectively.

  Although the present invention has been described in detail based on its preferred embodiments, the present invention is not limited to these specific embodiments, and various embodiments within the scope of the present invention are also included in the present invention. included. Some of the embodiments described above may be combined as appropriate.

101 · · · · · Imaging device body 102 · · · · Lens 201 · · · Power supply terminal 210 · · · · Accessory mounting portion 212 · · · · · · · Accessory connection terminal 213 · · · · mounting female screw 214 · · · · · Medium 220: Mesh 301: Cooling unit 302: Battery unit 303: Sensor substrate 305: Accessory terminal 50: Main substrate 501: Imaging element 502 .... Control IC
60 · · · · Heat dissipation plate 600 · · · · Exterior member 601 · · · · · · · · · · · · · · · · · · bent portion 605, 606 · · · · · · · · · 放熱 · · · · heat radiation fins 614 · · ... Heat insulator 650 ..... Peltier element 800 ..... Air cooling fan 803 ..... Intake port

Claims (2)

In the first housing with the accessory mounting surface on one side of the appearance,
An element to be a heat source,
Peltier element,
A heat sink interposed between the element serving as the heat source and the Peltier element and connected to the accessory mounting surface;
Have
The heat absorbing surface of the Peltier element is in contact with the heat sink,
The accessory mounting surface has an opening in which at least a portion of the Peltier element overlaps in projection as viewed from the normal direction of the accessory mounting surface,
A second housing mountable to the accessory mounting surface and having cooling means;
An image pickup apparatus characterized in that it is possible to cool a heat generating surface of the Peltier element. The attachment of the second casing having the cooling means can be detected,
The imaging device according to claim 1, wherein the Peltier element is driven according to the mounting of the second housing.