JP2012047887A - Portable electronic device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a portable electronic device which can radiate heat from parts that users do not hold and suppress a temperature rise at parts that the users hold.SOLUTION: In a portable electronic device 1 of the present invention, a housing 2 or a surface of the housing 2 is metal. The portable electronic device 1 comprises at least one of a lens unit 9 and a display part. The portable electronic device 1 further comprises: a heat radiating ring (a heat radiating frame) 5 arranged at an opening of the housing 2 where the lens unit 9 or the display part is attached; a heat transmission plate (a high thermal conductivity member) 7 for connecting the heat radiating ring 5 and an integrated circuit 6 which is a heat source; and a resin ring (a low thermal conductivity member) 10 arranged between the heat radiating ring 5 and the surface of the housing 2. The heat transmission plate 7 includes an attachment surface 70 which is arranged at the opening to fix the heat radiating ring 5.

Description

  The present invention relates to a portable electronic device, and more particularly to a heat dissipation structure thereof.

  The image sensor receives light flux that passes through the lens, acquires image data based on the photoelectric conversion output, and outputs the still image or moving image data to a liquid crystal display panel, personal computer, or the like, or to a predetermined storage medium. As a recording device, there are portable electronic devices such as a digital camera, a mobile phone, a portable game machine, and a music player. These portable electronic devices include a lens unit, a CCD (Charge Coupled Devices) or a CMOS (Complementary Metal-Oxide Semiconductor) as an image sensor disposed in the vicinity of the lens unit, a liquid crystal display panel, an ASIC (Application Specific integrated circuit).

  In such portable electronic devices, the image pickup device and the integrated circuit become high temperature, resulting in a decrease in image quality and may cause discomfort to the user due to an increase in the surface temperature of the portable electronic device. In recent years, various proposals have been made for effective heat dissipation measures such as imaging elements and integrated circuits. For example, Japanese Patent Laid-Open No. 2010-141133 (Patent Document 1) proposes a case for an electronic device having a configuration in which an inner having a leaf spring to be brought into contact with a heat source is integrally attached to the inside of a metal case. Has been made. According to this proposal, the heat from the heat source is transmitted to the leaf spring, and the heat is transmitted to the metallic casing through the inside of the inner, and can be efficiently radiated from the surface of the casing to the air.

JP 2010-141133 A

  However, the invention described in the above patent document can dissipate heat efficiently by distributing heat from the heat source to the entire casing, but the temperature of the casing in the vicinity of the heat source is higher than other parts of the casing. Therefore, when this part is gripped by the user, there is a concern that the user may feel uncomfortable.

  The present invention has been made in view of the above-described problems of the prior art, and provides a portable electronic device that can radiate heat from a portion that is not gripped by the user and can suppress a temperature rise in the portion that is gripped by the user. It is aimed.

  The portable electronic device of the present invention is a portable electronic device in which the casing is made of metal or the surface of the casing is made of metal, and includes at least one of a lens unit and a display unit, and the lens unit or the display unit A heat dissipating frame disposed in an opening of a housing to which the heat dissipating member is attached, a high heat conductive member connecting the heat dissipating frame and a heat source, and a low heat conductive member disposed between the heat dissipating frame and the surface of the housing. And a mounting surface for fixing the heat radiating frame is formed on the high thermal conductivity member.

  And the portable electronic device of this invention can employ | adopt the structure by which the groove | channel was formed in the back surface of the said heat radiating frame, and the protrusion part which fits in the groove | channel on the back surface of the said heat radiating frame was formed in the said low heat conductive member. .

  Moreover, the portable electronic device of this invention WHEREIN: The surface of the said thermal radiation frame may be made uneven | corrugated shape.

  And it is preferable that the portable electronic device of this invention is provided with the lens unit and the display part, the image pick-up element, and the integrated circuit.

  In the portable electronic device of the present invention, the housing includes a front cover and a rear cover, the integrated circuit as a heat source is disposed in the vicinity of the back surface of the front cover, and the high thermal conductivity member is the front cover. The digital camera can be configured as a digital camera that is arranged in parallel with each other and thermally connected to the integrated circuit and a heat dissipating frame disposed in an opening of a housing to which the lens unit is attached.

  ADVANTAGE OF THE INVENTION According to this invention, the portable electronic device which can radiate heat from the part which a user does not hold | grip, and can suppress the temperature rise of the part which a user holds can be provided.

1 is a front view of a digital camera according to an embodiment of the present invention. It is a rear view of the digital camera which concerns on the Example of this invention. It is a perspective view which shows the structural member of the thermal radiation structure of the digital camera which concerns on the Example of this invention. It is a fragmentary sectional view of the digital camera which concerns on the Example of this invention. It is a schematic diagram showing the movement of heat in the digital camera which concerns on the Example of this invention.

  Hereinafter, modes for carrying out the present invention will be described. The digital camera 1 includes a metal housing 2, a lens unit 9, a display unit 31, an image sensor, and an integrated circuit 6. The housing 2 has a front cover 2a and a rear cover 2b.

  The front cover 2a is formed with an opening 22 through which the lens unit 9 can be inserted. The opening 22 to which the lens unit 9 is attached has a metal heat dissipation ring (heat dissipation frame) 5 as a heat dissipation member. Is arranged. The heat dissipation ring 5 and the integrated circuit 6 that is a heat source attached to the main body 3 are thermally connected by a heat transfer plate 7 that is a highly heat conductive member, and heat from the heat source is transferred from the heat dissipation ring 5 to the air. It is possible to dissipate heat.

  The integrated circuit 6 is disposed in the vicinity of the back surface of the front cover 2a, and serves as a heat source that generates heat when the digital camera 1 is in the ON state. The heat transfer plate 7 connected to the heat source is a flat metal plate, and is disposed substantially parallel to the front cover 2a. Further, the heat transfer plate 7 is formed with a mounting surface 70 for fixing the heat radiating ring 5, and the mounting surface 70 is disposed in the opening 22 of the front cover 2a. In addition, a resin ring 10 as a low thermal conductivity member is arranged between the heat dissipation ring 5 and the front cover 2a so that heat from the heat dissipation ring 5 is not directly transmitted to the front cover 2a. ing.

  In other words, the digital camera 1 includes a heat dissipation ring 5, a heat transfer plate (high thermal conductivity member) 7 connected to the heat dissipation ring 5 and the integrated circuit (heat source) 6, and the heat dissipation ring 5 and the housing 2. It has a heat dissipation structure consisting of a resin ring 10 (low thermal conductivity member) disposed between them, and heat from the integrated circuit 6 is transferred to the heat dissipation ring 5 via the heat transfer plate 7, and the heat dissipation ring Heat can be dissipated from 5 into the air. Further, this heat dissipation structure is configured such that heat is not easily transmitted from the heat dissipation ring 5 to the front cover 2a because the resin ring 10 is interposed between the heat dissipation ring 5 and the heat transfer plate 7.

  A groove 50 is formed on the back surface of the heat dissipation ring 5, and a protrusion 11 that fits into the groove 50 on the back surface of the heat dissipation ring 5 is formed on the resin ring 10. Therefore, the resin ring 10 can be easily attached to the heat dissipation ring 5 by fitting the protrusion 11 of the resin ring 10 into the groove 50 of the heat dissipation ring 5.

  Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings. 1 and 2 are a front view and a rear view of a digital camera 1 according to an embodiment of the present invention, and FIG. 3 is a perspective view showing components of a heat dissipation structure of the digital camera 1 according to an embodiment of the present invention. It is. In the present embodiment, the left and right in the digital camera 1 refers to the left and right direction relative to the direction seen from the user when the user takes a picture with the hand, and the subject side in the digital camera 1 is the front side. The user side is the back side.

  A digital camera 1 that is a portable electronic device has a substantially rectangular shape, and has a main body 3 that holds various components such as a lens unit 9, a display unit 31, an image sensor, and an integrated circuit 6 (see FIG. 3). A front cover 2a is disposed on the front side of the main body 3, and a rear cover 2b is disposed on the rear side of the main body 3.

  That is, the main body 3 is covered on the front side by the front cover 2 a that is the casing 2, and is covered on the back side by the rear cover 2 b that is the casing 2. The front cover 2a and the rear cover 2b are formed of a thin metal plate such as titanium or stainless steel. Note that the front surface of the housing 2 may be made of metal by molding the front cover 2a and the rear cover 2b with resin or the like and plating the surface.

  A lens unit 9 and a flash are disposed in front of the digital camera 1 (subject side). A circular opening 22 (see FIG. 3) is provided on the left side of the front cover 2a, and the lens unit 9 is attached to correspond to the opening 22. The lens unit 9 includes a lens barrel and a movable lens group and a fixed lens group incorporated in the lens barrel. Further, the right side of the front cover 2a is a grip portion 21.

  A display unit 31 such as a liquid crystal display panel is arranged on the left side of the back (user side) of the digital camera 1, and menu keys, operation keys for setting various functions, direction keys, and the like are arranged on the right side. ing. As described above, since the display unit 31 is arranged on the left side of the digital camera 1, when shooting, the user firmly grasps the right side of the digital camera 1 and displays the live view ( The subject can be photographed while looking at the through image. Therefore, during normal use, the user does not touch the display unit 31 and the lens unit 9 arranged on the left side.

  In addition, a power button, a shooting button, and the like are disposed on the upper surface of the digital camera 1, and a battery box cover (not shown) that houses a battery serving as a power source is disposed on the lower surface of the digital camera 1. .

  The main body 3 of the digital camera 1 includes a lens unit 9, an image sensor, a battery serving as a power source, a detachable memory for storing image data, and the like, and a substrate fixed to the main body 3 as shown in FIG. An integrated circuit 6 including a CPU as a control unit that performs various controls including image processing of signals obtained from the image sensor, a memory that stores image data, and the like is disposed. In the digital camera 1, when the power is turned on, the image pickup device and the integrated circuit 6 generate heat as a heat source and raise the temperature of surrounding air and components.

  The digital camera 1 according to the present embodiment is connected to a heat dissipation ring (heat dissipation frame) 5 as a heat dissipation member disposed in a portion that is not gripped during normal operation, and the heat dissipation ring 5 and an integrated circuit (heat source) 6. It has a heat dissipation structure including a heat transfer plate 7 (high thermal conductivity member) and a resin ring 10 (low thermal conductivity member) disposed between the heat dissipation ring 5 and the housing surface. Hereinafter, the structure of this heat dissipation structure will be described. FIG. 4 is a partial cross-sectional view of the digital camera 1 according to the embodiment of the present invention. FIG. 5 is a schematic diagram showing heat transfer in the digital camera 1 according to the embodiment of the present invention.

  As shown in FIGS. 3 to 5, in the digital camera 1, an integrated circuit 6 as a heat source is disposed on a substrate fixed to the main body 3 in the vicinity of the back surface of the front cover 2 a. The heat transfer plate 7 is disposed so as to contact the front surface of the integrated circuit 6. Note that a heat insulating sheet 8 is interposed between the heat transfer plate 7 and the front cover 2a so that heat from the heat transfer plate 7 is not directly transferred to the front cover 2a. The heat transfer plate 7 is a thin metal plate such as aluminum, titanium or stainless steel having high thermal conductivity, and includes a flat plate portion 71 in contact with the integrated circuit 6 and a mounting surface 70 connected to the flat plate portion 71. And is disposed substantially parallel to the front cover 2a.

  The mounting surface 70 is a surface to which the heat radiating ring 5 is attached, and is a portion extending in the center direction of the lens unit 9 from the end portion of the cylindrical plate protruding in the front direction with respect to the flat plate portion 71. The mounting surface 70 is disposed in the opening 22 provided in the front cover 2a. The opening 22 is formed in a size that allows the retractable lens unit 9 to be inserted. Note that the cylindrical plate between the mounting surface 70 and the flat plate portion 71 is formed to have a diameter slightly shorter than the opening 22 of the front cover 2a, and between the cylindrical plate and the opening 22 Is formed with an annular gap into which a convex portion 12 of a resin ring 10 described later is fitted.

  The heat dissipation ring 5 is made of a member having high thermal conductivity such as aluminum, titanium or stainless steel, and is fixed to the mounting surface 70 of the heat transfer plate 7 with screws 72 or the like. As shown in FIG. 4, a groove 50 is formed in an annular shape on the back surface of the heat dissipation ring 5 in accordance with the shape of the heat dissipation ring 5, and the inner peripheral plate 5a, the outer peripheral plate 5b, and the bottom plate 5c have a cross-sectional view. It is U-shaped. The inner peripheral plate 5a is a member having a screw hole (not shown) for attaching the screw 72, and the lens unit 9 moves in the front-rear direction inside the inner peripheral plate 5a by the zoom function. Further, the outer peripheral plate 5b is shorter in the front-rear direction than the inner peripheral plate 5a, and a gap in which a resin ring 10 described later is disposed is formed between the back surface portion of the outer peripheral plate 5b and the mounting surface 70. .

  A resin ring 10 made of a resin having low thermal conductivity is disposed between the heat dissipation ring 5 and the surface of the front cover 2a. The resin ring 10 has a protruding portion 11 that fits into the groove 50 on the back surface of the heat dissipation ring 5 and a convex portion 12 that fits between the cylindrical plate of the heat transfer plate 7 and the opening 22. Therefore, the resin ring 10 can be easily attached to the heat dissipation ring 5 by fitting the protrusion 11 of the resin ring 10 into the groove 50 of the heat dissipation ring 5. The resin ring 10 is sandwiched between the heat dissipation ring 5 and the mounting surface 70 when the heat dissipation ring 5 is attached to the mounting surface 70 of the heat transfer plate 7, and the cylindrical plate of the heat transfer plate 7 and the front cover 2a It fits between the openings 22 and is firmly fixed.

  Therefore, as shown in FIG. 5, heat from the integrated circuit 6 that is a heat source is transmitted from the heat transfer plate 7 to the heat dissipation ring 5 and is radiated from the heat dissipation ring 5 to the air. A resin ring 10 is fitted between the heat dissipation ring 5 and the front cover 2a and between the heat transfer plate 7 and the front cover 2a to firmly fix the heat dissipation ring 5. The resin ring 10 has an extremely low thermal conductivity with respect to the heat transfer plate 7 and the heat dissipation ring 5, and the heat from the heat dissipation ring 5 and the heat transfer plate 7 is difficult to transfer to the front cover 2a (gripping part 21). It is possible to effectively suppress the temperature rise of the grip portion 21 that is around 6.

  As described above, the digital camera 1 includes a heat dissipation ring 5 disposed in the opening 22 of the housing 2 and a heat transfer plate (high heat) thermally connected to the heat dissipation ring 5 and the integrated circuit (heat source) 6. Conductive member) 7 and a heat dissipation structure comprising a heat dissipation ring (heat dissipation frame) 5 and a resin ring 10 (low thermal conductivity member) disposed between the housing 2 and an integrated circuit (heat source) ) Heat from 6 is transmitted to the heat dissipation ring 5 via the heat transfer plate 7 so that heat can be efficiently radiated from the heat dissipation ring 5 into the air. In addition, by interposing the resin ring 10 between the heat dissipation ring 5 and the heat transfer plate 7, it is difficult to transfer the heat from the heat dissipation ring 5 to the front cover 2a, thereby effectively suppressing the temperature rise of the grip portion 21. Therefore, the user can comfortably perform the shooting operation. That is, according to the present invention, it is possible to provide the digital camera 1 that can dissipate heat from a portion that is not gripped by the user and can suppress an increase in temperature of the portion that is gripped by the user.

  And this invention is not limited to the above Example, A change and improvement are possible freely in the range which does not deviate from the summary of invention. For example, the heat dissipating member is not limited to the heat dissipating ring 5 described above, and various high heat conductive members arranged in a portion that is not gripped by the user during operation can be employed, as shown in FIG. The display part frame 15 disposed in the rectangular opening of the rear cover 2b provided at the part where the display part 31 is located is formed as a heat radiating member, and the display part frame (heat radiating frame) 15 and the heat source are formed as a high heat conductive member. It is also possible to adopt a heat dissipation structure that connects to the heat source and transfers heat from the heat source to the display unit frame 15 to dissipate heat into the air. In this case, it is possible to employ a configuration that dissipates heat from an image sensor disposed in the vicinity of the inner surface of the rear cover 2b and other heat sources. As described above, by disposing the heat dissipation frame in a portion that is not normally gripped by the user during operation, the temperature rise of the gripping portion 21 can be suppressed and heat can be effectively radiated from the heat dissipation frame.

  The digital camera 1 can perform more effective heat dissipation by, for example, performing knurling on the surface of the heat dissipation frame to expand the heat dissipation area by making the surface of the heat dissipation frame uneven.

  In addition, as described above, the high heat conductive member that connects the heat source and the heat radiating frame can be formed in various forms such as a metal pipe without being formed as the thin flat plate heat transfer plate 7.

  In the above embodiment, the description has been given of the digital camera 1 as a portable electronic device equipped with a heat dissipation structure, but the present invention is a cellular phone including a small lens unit 9 and a display unit 31 having a required size. The present invention can be used for various portable electronic devices that do not include the lens unit 9 such as a portable game machine and a music player, or that include the small lens unit 9 and the display unit 31 having a required size.

1 Digital camera 2 Enclosure
2a Front cover 2b Rear cover
3 Body 5 Heat dissipation ring
5a Inner peripheral plate 5b Outer peripheral plate
5c Bottom plate 6 Integrated circuit
7 Heat transfer plate 8 Insulation sheet
9 Lens unit 10 Resin ring
11 Projection 12 Projection
15 Display frame 21 Grip part
22 Opening 31 Display
50 groove 70 mounting surface
71 Flat part 72 Screw

Claims (5)

The housing is made of metal or the surface of the housing is made of metal, and is a portable electronic device including at least one of a lens unit and a display unit,
A heat dissipating frame disposed in an opening of a housing to which the lens unit or the display unit is attached;
A highly thermally conductive member connecting the heat radiating frame and a heat source;
A low thermal conductivity member disposed between the heat dissipation frame and the housing surface;
With
A portable electronic device, wherein the high thermal conductivity member is provided with an attachment surface that is disposed in the opening and fixes the heat dissipation frame. A groove is formed on the back surface of the heat dissipation frame,
The portable electronic device according to claim 1, wherein a protrusion that fits into a groove on a back surface of the heat dissipation frame is formed on the low thermal conductivity member.   The portable electronic device according to claim 1, wherein a surface of the heat dissipating frame has an uneven shape.   The portable electronic device according to any one of claims 1 to 3, further comprising a lens unit and a display unit, an image sensor, and an integrated circuit. The portable electronic device is:
The housing has a front cover and a rear cover;
The integrated circuit that is a heat source is disposed near the back surface of the front cover,
A digital camera in which the high thermal conductivity member is disposed substantially parallel to the front cover, and is thermally connected to the integrated circuit and a heat dissipating frame disposed in an opening of a housing to which the lens unit is attached. The portable electronic device according to claim 4, wherein:

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