JP5952111B2 - Imaging device - Google Patents

Description

  The present invention relates to an imaging apparatus capable of preventing an external appearance portion from being locally heated due to heat generated by an electronic element.

  In recent years, there has been an increasing need for higher performance and multi-functionality of digital cameras, and as a result, the number of pixels of an imager, the speed of driving and signal processing, and the speed of image processing are increasing. For this reason, the power consumption of the electronic elements responsible for these functions increases, and heat generation from the electronic elements increases. In digital cameras, if the temperature of an electronic element rises due to heat generation, a malfunction of the processing occurs, or in the appearance part of the digital camera, the temperature of the portion near the heat generating electronic element rises locally. .

  There is a demand for downsizing and thinning of digital cameras as well as higher performance and multi-functionality. As a result of further miniaturization and thinning of the camera, the heat generating electronic elements may come close to each other and heat each other. In particular, when heat is transmitted to the imager unit and the temperature of the imager and the imager circuit rises, noise in dark current, signal readout, and the like increases and image quality deteriorates. In addition, since the distance between the electronic element and the appearance portion is shortened, the amount of heat transmitted to the appearance portion is increased and the temperature rise is further increased.

  Various techniques for solving these problems have been proposed. For example, in the invention disclosed in Patent Document 1, an inner 12 of a high thermal conductive resin is integrally formed by insert molding inside a metal casing 11 press-formed from an aluminum alloy plate. The inner 12 includes a plate spring 12b that contacts the image sensor holding metal plate 21b and a plate spring 12c that contacts the IC 22a.

  Thereby, the heat generated in the image sensor 21a is transmitted to the plate spring 12b via the image sensor holding metal plate 21b, and the heat generated in the IC 22a is transmitted to the plate spring 12c. The heat transmitted to the leaf springs 12b and 12c is transmitted through the inner 12 to the metal casing 11, and is efficiently radiated from the surface of the metal casing 11 into the air.

  Further, in the invention disclosed in Patent Document 2, the heat storage member 9 is disposed inside the grip portion 8 of the camera body 1 and heat generated in the power supply circuit portion 17-1 serving as a heat source inside the camera body 1 is conducted. And a heat storage member 11 that is disposed inside the camera body 1 on the side of the strobe device 12 away from the grip portion 8 and that conducts heat generated by the image sensor 14 such as a CCD sensor that serves as a heat source inside the camera body 1. It is configured. The distance between the inner surface of the outer cover and the heat storage member 11 on the strobe device 12 side is shorter than the distance between the inner surface of the outer cover and the heat storage member 9 on the grip portion side.

  Thereby, the heat generated in the power supply circuit unit 17-1 is conducted and diffused through the heat transfer plate 10 to the heat storage member 9 having a large heat capacity, and as a result, the power supply circuit unit 17 disposed inside the grip unit 8. The local temperature rise at -1 can be suppressed. In addition, the heat generated in the image sensor 14 is conducted and diffused to the heat storage member 11 having a large heat capacity via the heat transfer plate 18 and the heat transfer plate 19, and as a result, a local temperature rise in the image sensor 14 is suppressed. You can do that.

  In the invention disclosed in Patent Document 3, the exothermic substrate 10 on which the exothermic electronic component 12 is mounted and at least one non-exothermic substrate 30 having a smaller calorific value than the exothermic substrate 10 are mutually connected. The heat conducting members 20 are arranged adjacent to each other so that the surfaces are opposed to each other, and the heat conducting member 20 is provided between the heat-generating substrate 10 and the non-heat-generating substrate 30 so as to be in close contact with both substrate surfaces. The exothermic substrate is, for example, a substrate on which at least an electronic component that generates a large amount of heat, such as an integrated circuit that controls a solid-state imaging device, is mounted. The entire substrate generates a large amount of heat and is likely to become hot during use. On the other hand, a non-heat-generating substrate is a substrate that, for example, is equipped with an electronic circuit that generates a small amount of heat. is there. Each substrate is configured to be connected to, for example, the exterior body 24 or the like.

  As a result, the heat generated by the exothermic substrate 10 is dissipated through the non-exothermic substrate 30, so that the exterior body 24 can be prevented from reaching a high temperature.

JP 2010-141133 A JP 2012-004780 A Japanese Patent No. 3536824

  By the way, in recent years, the need for a kind of digital camera called a so-called high-grade compact digital camera has been greatly increased. The high-end compact digital camera was planned and developed with an emphasis on obtaining image quality comparable to that of a single-lens reflex digital camera while achieving a reduction in size and thickness compared to a single-lens reflex digital camera with interchangeable lenses. It is a digital camera. In order to obtain a high image quality similar to that of a single-lens reflex digital camera, an imager having a size several times larger than that used in a general compact digital camera is used for a high-end compact digital camera.

  As imagers become larger, imagers and image processing control circuits become larger and more complex, and in order to maximize the performance of the imager, the imaging optical system mounted on the camera also becomes larger in diameter. Will be. Therefore, in a high-end compact digital camera, great efforts have been made to achieve the conflicting objectives of increasing the size and complexity of imagers and circuits and reducing the size and thickness of the camera body. In particular, as control circuits become larger and more complex, the heat generated by these circuits also increases, so heat countermeasures are an important factor in the development of high-end compact digital cameras.

  Therefore, when the above-mentioned patent document is applied to a high-end compact digital camera, there are various problems. That is, in the invention disclosed in Patent Document 1, since the resin inner 12 is insert-molded inside the metal casing 11, the strength of the camera appearance is increased when a large-diameter and heavy imaging optical system is mounted. It is difficult to attach a metal reinforcing member for the purpose, and there is a possibility that the appearance of the camera will be bent or the optical axis may be displaced.

  Further, in the invention disclosed in Patent Document 2, a space 23 is provided between the heat storage member 9 made of aluminum disposed inside the grip portion 8 and the exterior cover 20. For this reason, the heat stored in the heat storage member 9 is confined in the camera without being transmitted to the outside of the camera, but only stores all the large heat generated from a complicated control circuit such as that mounted on a high-end compact digital camera. It is difficult to secure heat capacity. Since there is no air convection in the camera, the heat storage member 9 cannot naturally dissipate heat and cannot store more heat at a certain temperature. As a result, since the heat generated in the power supply circuit unit 17-1 that is a heat source is not sufficiently diffused, the temperature of the power supply circuit unit 17-1 rises, and a failure or malfunction may occur.

  In the invention disclosed in Patent Document 3, two types of substrates having different calorific values are used in order to transfer heat to the appearance. For this reason, it is necessary to devise the type and arrangement of electronic components so that the amount of heat generated differs greatly between the two types of substrates, and the degree of design freedom of the circuit substrate is reduced. In a high-end compact digital camera, it is necessary to accommodate a circuit board that has been increased in size and complexity in the camera as compactly as possible.

  The present invention has been made in view of such a situation, while ensuring sufficient strength that can be supported even with a large-diameter optical system, while efficiently diffusing the heat generated from the electronic element, the appearance portion An object of the present invention is to provide an imaging device capable of suppressing a local temperature rise.

In order to achieve the above object, an imaging apparatus embodying the present invention is provided with a lens unit including an imaging optical system, a metal exterior cover, and a projection protruding from the exterior cover, and at least a part of the lens unit is provided. An imager unit having a lens barrel unit that is loosely inserted, an imager and an imager board, a metal base member that fixes the imager unit and adjusts the inclination of the imager, and a main board on which heat-generating electronic elements are mounted A battery chamber for housing the battery, a first heat radiating member made of metal, and a second heat radiating member having elasticity, and the imager unit and the main board are adjacent to each other in a direction substantially perpendicular to the optical axis. Disposed, the first heat dissipating member is disposed to face the main substrate, the second heat dissipating member is sandwiched between the first heat dissipating member and the electronic element,
The base member and the first heat radiating member are thermally connected.

  Furthermore, in the imaging device according to the present invention, the exterior cover is fixed to the base member, the lens unit is fixed to the base member, the lens barrel unit is fixed to the base member via the exterior cover, and the imager unit is The inclination is adjusted by holding a washer having thermal conductivity between the base member and the base member.

  Furthermore, in the image pickup apparatus embodying the present invention, in the above invention, the first heat radiating member and the side surface of the exterior cover are thermally connected via an elastic third heat radiating member, and the electronic element is changed to the base member. The heat conduction path is configured in a direction different from the heat transfer path.

  Furthermore, in the imaging device embodying the present invention, in the above invention, the battery chamber is disposed between the front surface of the outer cover and the first heat radiating member, and the battery is at least one of the front surface of the outer cover and the first heat radiating member. It is characterized by facing directly.

  According to the imaging apparatus embodying the present invention, the local temperature of the appearance portion can be efficiently diffused by efficiently diffusing the heat generated from the electronic element while ensuring sufficient strength to support even a large-diameter optical system. While the image processing IC and the imager having a large calorific value can be arranged adjacent to each other in a direction substantially orthogonal to the optical axis, the heat generated on one side can be prevented from being transferred to the other side, By heating the battery using the transmission path, it is possible to suppress a decrease in the capacity of the battery in a low temperature environment.

It is a perspective view which shows the back side external appearance of the digital camera which is one Embodiment of this invention. It is a disassembled perspective view which shows the main internal structures of the digital camera shown in FIG. It is a disassembled perspective view for demonstrating the decomposition | disassembly and attachment condition by the side of an optical axis. It is a disassembled perspective view for demonstrating the decomposition | disassembly and attachment condition by the side of a main board | substrate side. It is sectional drawing for demonstrating the heat flow in a digital camera.

  The best mode for carrying out the present invention will be described below with reference to the accompanying drawings. In addition, this invention is not limited by this embodiment.

  The perspective view shown in FIG. 1 shows the appearance of the back side of a digital camera 100 according to an embodiment of the present invention. As shown in FIG. 1, the digital camera 100 has a top cover 110 that forms an appearance on the upper surface of the camera, a release button 111, a command dial 112, a power button 113, a mode button 114, And a shoe 115.

  When the user presses the release button 111 halfway, a known AF function operates to focus on a desired subject. Subsequently, when the release button 111 is fully pressed, imaging is performed under preset imaging conditions, and image data captured on a recording medium (not shown) such as a memory card is recorded.

  The command dial 112 is configured by a rotatable dial switch. The user can change predetermined parameters and shooting modes by rotating the command dial 112.

  The mode button 114 switches parameters and functions that are changed by the rotation of the command dial 112 described above. Specifically, the exposure mode can be changed by the command dial 112 by pressing the mode button 114. The types of exposure modes include, for example, a mode for shooting a still image and a mode for shooting a moving image. As a still image mode, there are a manual mode, an aperture priority auto mode, a shutter speed priority auto mode, and the like, in addition to an auto mode in which shooting conditions are automatically determined.

  Camera accessories such as an external strobe and an external viewfinder can be attached to the hot shoe 115, so that photographing can be performed even under conditions where photographing is difficult due to lack of ambient light.

  The front surface of the digital camera 100 includes a front cover 120 that forms an external appearance part on the front side of the camera, and a lens barrel unit 130 that protrudes from the front cover 120. By this imaging optical system, light from the subject is imaged on an imaging element (not shown), and a subject image is captured and acquired as electronic data.

  On the back surface of the digital camera 100, a rear cover 140 that forms an appearance on the back side of the camera, an LCD display device 141, and a back operation member 142 are provided. In addition to the cross button and the OK button, the back operation member 142 includes a delete button, a QS button, a menu button, a playback button, and a display button. The cross button is composed of four direction keys, up, down, left, and right. By using these direction keys, the user can perform operations such as movement and selection between various menus displayed on the LCD display device 131.

  FIG. 2 is an exploded perspective view of the digital camera 100 of FIG. 1 with the unit constituting the top surface including the top cover 110 and the unit constituting the back side including the rear cover 140 removed.

  In the digital camera 100 embodying the present invention, as shown in FIG. 2, an imager unit 210 and a main substrate 220 are arranged adjacent to each other in a direction substantially orthogonal to the optical axis of the imaging optical system. The imager unit 210 and the main board 220 are electrically connected by a flexible printed board (not shown). Various electronic elements are mounted on the main board 220. In particular, as shown in the cross-sectional view of FIG. 5, a main CPU 221 that performs overall control of the digital camera 100 is acquired on the front side surface of the main board 220. An image processing CPU 222 that performs image processing on the image data is mounted.

  These electronic elements generate a particularly large amount of heat during driving of the digital camera 100, and correspond to the exothermic electronic elements described in the claims. Hereinafter, the main CPU 221 and the image processing CPU 222 are collectively referred to as exothermic electronic elements.

  A card module 223 for accommodating a memory card (not shown) is also mounted on the main board 220. In addition, a battery chamber 230 is provided on the front side of the main board 220 to accommodate a battery 231 that supplies power to the digital camera 100. On the bottom surface of the digital camera 100, a battery lid unit 240 is provided for the user to access the battery chamber 230 and the card module 223.

  3a to 3c are exploded perspective views for explaining the disassembly / attachment state of each unit on the optical axis side. As shown in FIG. 3A, the imager unit 210 is fixed to the metal base member 250 at three locations with screws from the rear side. These screws sandwich a metal washer 251 between the base member 250 and the imager unit 210. The inclination of the imager unit 210 relative to the base member 250 can be adjusted by appropriately adjusting the number or thickness of these washers 251.

  As shown in FIG. 3B, the lens unit 260 is inserted into the opening provided in the front cover 120 from the rear side, and is fixed to the metal base member 250 by screws from the rear side. In this state, a part of the front side of the lens unit 260 protrudes from the front cover 120 to the subject side. The lens unit 260 holds an imaging optical system, and advances and retracts a predetermined lens of the imaging optical system in the optical axis direction according to the focus operation or zoom operation of the digital camera 100.

  The actuator unit 261 functions as a drive source for the focus operation or zoom operation, and is electrically connected to predetermined electronic elements of the main board 220 by a flexible printed board (not shown). Since the imaging optical system mounted on the digital camera 100 embodying the present invention is a single focus lens, the actuator unit 261 functions as a focus motor.

  As shown in FIG. 3C, the lens barrel unit 130 protrudes from the front cover 120 of the digital camera 100 to the subject side, and is fixed to the metal base member 250 at three locations with screws from the rear side. At this time, the front cover 120 of the digital camera 100 is sandwiched between the lens barrel unit 130 and the base member 250. A portion of the lens unit 260 protruding toward the subject side is covered and hidden by the lens barrel unit 130.

  A focus operation ring 131 that is rotatably held is provided on the outer peripheral surface of the lens barrel unit 130. Further, a detection sensor (not shown) is provided in the lens barrel unit 130 and is electrically connected to a predetermined electronic element of the main board 220 by a flexible printed board (not shown). When the focus operation ring 131 is rotated by the rotation operation of the user, the rotation amount is detected by the detection sensor, and the drive amount of the actuator unit 261 is calculated by a predetermined electronic element on the main board 220. Thereby, the focus lens in the lens unit 260 is driven by an amount corresponding to the rotation amount of the focus operation ring 131, and the focus adjustment to the subject is performed.

  Further, the front cover 120 is fixed to the metal base member 250 with three screws from the front side. As described above, the front cover 120 is fixed so as to be sandwiched between the lens barrel unit 130 and the base member 250. However, in the digital camera 100 embodying the present invention, the front cover 120 is attached to the base member 250. It is also fixed directly.

  As described above, in the digital camera 100 embodying the present invention, the imager unit 210, the lens unit 260, the lens barrel unit 130, and the front cover 120 are directly fixed to the generally annular base member 250, respectively. Yes. As already mentioned, in so-called high-end compact digital cameras, the imager is enlarged, the imaging optical system is enlarged, and the main substrate is enlarged, but it is located on the optical axis of the imaging optical system. By adopting a configuration in which each unit is directly fixed to a strong metal base member 250, sufficient support strength can be secured to prevent the imaging optical system from falling due to its own weight. Further, since the inclination of the imager unit 210 is adjusted between the base member 250 and the imager unit 210, the alignment between the optical axis of the imaging optical system and the imager can be ensured with high accuracy.

  FIG. 4 is an exploded perspective view for explaining the disassembly / attachment state on the main board 220 side in the digital camera 100 shown in FIG. 3C. The main board 220 is fixed to the battery chamber 230 arranged on the front side of the main board 220 with three screws from the rear side.

  A copper plate 301 is disposed between the main substrate 220 and the battery chamber 230 as shown in FIG. The copper plate 301 is fixed to the base member 250 with screws at a mounting portion 301 a provided near the imager unit 210. Further, the positioning is performed with respect to the battery chamber 230 in a positioning portion 301 b provided near the camera side surface of the copper plate 301.

  Two heat conductive sheets 302 having elasticity are arranged on the rear surface of the copper plate 301. The heat conductive sheet 302 is disposed at a position corresponding to each of the main CPU 221 and the image processing CPU 222 which are heat generating electronic elements mounted on the front side surface of the main board 220. These heat generating electronic elements and the copper plate It is being fixed so that it may be pinched | interposed between 301. When fixing, a heat conductive sheet 302 having adhesiveness on the surface may be used, or a double-sided adhesive tape having heat conductivity may be used for adhesion.

  A pressing portion 301c is provided at the end of the copper plate 301 near the camera side surface. A heat conductive rubber 303 having elasticity is located between the pressing portion 301 c and the connecting plate 270, and the pressing portion 301 c presses the heat conductive rubber 303 against the connecting plate 270. A side surface portion of the front cover 120 and a side surface portion of the rear cover 140 are respectively fixed to the connecting plate 270 with screws, thereby forming the appearance of the digital camera 100. The pressing portion 301 c of the copper plate 301 is bent to the rear side, and has a shape that increases the contact area with the heat conductive rubber 303.

  In addition, the copper plate 301 corresponds to the 1st heat radiating member as described in a claim, and the heat conductive sheet 302 corresponds to the 2nd heat radiating member as described in a claim, and is heat conductive. The rubber 303 corresponds to the third heat radiating member described in the claims.

  In the digital camera 100 having the above-described configuration, a path through which heat generated by the heat-generating electronic element mounted on the main board 220 is transferred will be described with reference to FIG. FIG. 5 is a cross-sectional view of the digital camera 100, and an arrow schematically showing heat transfer is shown for explanation.

  The heat generated by the heat generating electronic elements (main CPU 221 and image processing CPU 222 in this embodiment) flows into the heat conductive sheet 302 that is in close contact with the front side of the heat generating electronic elements, and this heat conductive sheet. It flows into the copper plate 301 in close contact with 302. The copper plate 301 is a thin member formed by pressing or the like, but has a high thermal conductivity because it is made of copper. Therefore, although the heat capacity of the copper plate 301 itself is not so large, it is possible to efficiently diffuse the incoming heat.

  The copper plate 301 is directly fixed to the base member 250 by screws, and both members are in a thermally connected state. As described above, the base member 250 is made of metal and has a certain volume in order to obtain a strength for supporting and fixing a plurality of units such as the imager unit 210. Therefore, the heat capacity of the base member 250 itself is large, and a large amount of heat flowing from the copper plate 301 thermally connected by screws can be stored.

  Further, since the base member 250 is directly fixed to the front cover 120 of the digital camera 100 by screws and is thermally connected, a part of the heat accumulated in the base member 250 sequentially flows into the front cover 120. To do. The front cover 120 is a thin metal member formed by pressing or the like, but has a large heat capacity because it has a size covering almost the entire front surface of the digital camera 100. Moreover, since it has a large surface area, heat dissipation to the outside air is performed efficiently.

  On the other hand, a heat conductive rubber 303 is sandwiched between the copper plate 301 and the connecting plate 270, and the copper plate 301 is thermally connected to the metal connecting plate 270. The connecting plate 270 is fixed to the front cover 120 and the rear cover 140 with screws. Therefore, the heat of the heat-generating electronic element that has flowed into the copper plate 301 flows into the front cover 120 and the rear cover 140 from the side surface side of the digital camera 100, so that heat can be efficiently radiated to the outside air.

  That is, in the digital camera 100 embodying the present invention, the heat generated by the heat generating electronic element is transferred from the front cover 120 to the outside air via the metal base member 250 provided closer to the optical axis than the heat generating electronic element. At the same time as heat is dissipated, heat is dissipated from the front cover 120 and the rear cover 140 to the outside air via the heat conductive rubber 303 provided in the direction opposite to the optical axis, that is, on the side surface side of the digital camera 100. Thereby, more heat can be efficiently radiated to the outside air.

  As described above, the battery chamber 230 for storing the battery 231 is located between the copper plate 301 and the front cover 120, and is adjacent to the front cover 120. The battery 231 is housed in a direction parallel to the longitudinal direction of the digital camera 100 and is also parallel to the copper plate 301. The battery chamber 230 is a molded product made of resin. As shown in FIG. 4, the surfaces facing the front cover 120 and the copper plate 301 are open surfaces, and the battery 231 is connected to the front cover 120 and the copper plate. It is directly opposed to 301.

  The battery 231 used in the digital camera 100 generally has a property that the capacity decreases at a low temperature, which may cause a problem that the number of shots is significantly reduced when used at a ski resort or the like. is there. Therefore, by adopting the above-described configuration in the digital camera 100 according to the present invention, the radiant heat from the front cover 120 and the copper plate 301 reaches the battery 231 and it is possible to suppress the temperature drop of the battery 231. .

  As described above, the battery 231 is not heated directly by the heat generated by the heat-generating electronic element, but is heated by using the heat flowing into the copper plate 301 and the front cover 120 forming the heat transfer path. Thus, the local temperature rise of the battery 231 and the situation where the battery 231 is heated more than necessary do not occur.

  In a high-end compact digital camera equipped with a large imager, it is necessary to appropriately dissipate heat generated from the imager body. As described above, the imager unit 210 on which the imager body is mounted is fixed to the base member 250 with a screw through the metal washer 251. Therefore, the heat generated in the imager main body flows into the base member 250 through the imager unit 210, and then flows into the front cover 120 and is radiated to the outside air.

  As described above, since the base member 250 has a large heat capacity, the temperature of the base member 250 does not exceed the temperature of the imager body that has been driven and increased. That is, since the temperature gradient is such that heat always flows from the imager unit 210 to the base member 250, heat does not flow backward from the base member 250 to the imager unit 210. As a result, as in the digital camera 100 embodying the present invention, the main board 220 on which the heat generating electronic elements that are the main heat sources of the camera are mounted and the imager unit 210 on which the imager body is mounted are substantially orthogonal to the optical axis. In the configuration disposed adjacent to the heat source, the heat flowing into the base member 250 from one heat source does not flow into the other heat source and adversely affects it.

  In the embodiment described above, the heat generating electronic elements are the main CPU 221 and the image processing CPU 222, and the heat conductive sheet 302 (second heat radiating member) is in contact with each of these elements. The number of is not limited to this. However, the number of heat conductive sheets 302 is preferably equal to the number of heat-generating electronic elements mounted on the front side.

  In addition, the heat flowing into the copper plate 301 moves to the side surface portion of the front cover 120 via the heat conductive rubber 303 and the connecting plate 270. However, the heat conductive rubber 303 is not directly passed through the connecting plate 270. The heat path may be configured by being in close contact with the front cover 120.

  Moreover, it is good also as a structure which has arrange | positioned the member which has thermal conductivity between the battery chamber 230 and the copper plate 301 or between the battery chamber 230 and the front cover 120. As such a member, for example, a metal plate for the purpose of improving the strength of the camera body or taking measures against static electricity can be considered. If the member has thermal conductivity, the heat flowing into the copper plate 301 or the front cover 120 is transmitted to the battery 231, so that it is possible to prevent the performance of the battery 231 from degrading at low temperatures.

  As described above, according to the digital camera 100 embodying the present invention, heat generated from the electronic element is efficiently diffused while ensuring sufficient strength that can be supported even with a large-diameter optical system. The local temperature rise of the appearance part can be suppressed, and the image processing IC and imager having a large calorific value are arranged adjacent to each other in a direction substantially orthogonal to the optical axis, but the heat generated on one side is transferred to the other side. Further, by heating the battery using a heat transfer path, it is possible to suppress a decrease in capacity of the battery in a low temperature environment.

100 digital camera, 110 top cover, 111 release button, 112 command dial, 113 power button, 114 mode button, 115 hot shoe, 120 front cover, 130 lens barrel unit, 131 focus operation ring, 140 rear cover, 141 LCD display device, 142 Back operation member, 210 Imager unit, 220 Main board, 221 Main CPU, 222 Image processing CPU, 223 Card module, 230 Battery chamber, 231 Battery, 240 Battery cover unit, 250 Base member, 251 Washer, 260 Lens unit, 261 Actuator unit, 270 connecting plate, 301 copper plate, 301a mounting portion, 301b positioning portion, 301c pressing portion, 302 thermal conductive sheet

Claims (4)

A lens unit containing the imaging optical system;
A metal exterior cover,
A lens barrel unit provided so as to protrude from the exterior cover and at least a part of the lens unit is gently inserted,
An imager unit having an imager and an imager substrate;
A metal base member for fixing the imager unit and adjusting the inclination of the imager;
A main board on which heat-generating electronic elements are mounted;
A battery compartment for housing the battery;
A first heat dissipating member made of metal;
A second heat radiating member having elasticity;
In an imaging apparatus having
The imager unit and the main board are disposed adjacent to each other in a direction substantially orthogonal to the optical axis,
The first heat radiating member is disposed to face the main board,
The second heat radiating member is sandwiched between the first heat radiating member and the electronic element,
The image pickup apparatus, wherein the base member and the first heat radiating member are thermally connected. The exterior cover is fixed to the base member;
The lens unit is fixed to the base member,
The lens barrel unit is fixed to the base member via the exterior cover, and the imager unit is tilt-adjusted by sandwiching a washer having thermal conductivity with the base member. Item 2. The imaging device according to Item 1.   The first heat radiating member and the side surface of the exterior cover are thermally connected via an elastic third heat radiating member, and heat is transmitted in a direction different from the heat transfer path from the electronic element to the base member. The imaging apparatus according to claim 1, wherein a conduction path is configured.   The battery chamber is disposed between the front surface of the outer cover and the first heat radiating member, and the battery directly faces at least one of the front surface of the outer cover and the first heat radiating member. The imaging device according to claim 1.

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