JP6696636B2 - Camera device - Google Patents

Description

  The present invention relates to a camera device, and more particularly to a camera device having an outer case made of a resin material.

  In recent years, there is a camera device using a resin material for an outer case in order to reduce the weight and the cost.

  With the increase in the number of pixels of the camera device, the power consumption of each chip such as an ASIC (application-specific integrated circuit) including an A / D converter, an image processing processor, and an image processing engine arranged on a circuit board increases, Their heating value also increases. When each chip becomes hot due to heat generation, the reliability of each chip and other circuit components deteriorates, and the thermal noise also adversely affects the image. Therefore, it is necessary to provide a heat dissipation structure in the camera device to enhance heat dissipation of the chip and the circuit components. In particular, when the outer case is made of a resin material instead of metal, the improvement of the heat dissipation is extremely important.

  Therefore, in Patent Document 1 below, in a digital camera 10 having an image LCD (liquid crystal display) 2 on the exterior surface of the camera, a portion of the camera housing facing the back surface of the image LCD 2 is a metal plate (heat sink). It is composed of 7.

  Further, in Patent Document 2 below, one end is in thermal contact with the upper surface of the image pickup IC 45 via a heat conductive sheet 53 for the image pickup IC, and the other end passes above the image pickup element 44 and is imaged. An image pickup device is described that includes a heat sink 52 for the image pickup IC that extends in a region opposite to the IC 45.

JP 2001-189884 A JP, 2011-146856, A

  However, since the heat sink disclosed in Patent Document 1 is exposed when the image LCD is opened, it may be touched by a human hand, and the user may feel uncomfortable due to the heat.

  Further, the heat dissipation plate described in Patent Document 2 has one end thermally contacted with the image pickup IC, but most of the members are arranged in a region where the circuit board is not provided. Therefore, it is necessary to secure an extra space for disposing the heat dissipation plate, and there is a problem that the outer case cannot be sufficiently miniaturized.

  SUMMARY OF THE INVENTION It is an object of the present invention to solve the conventional problems described above and to improve the heat dissipation performance while reducing the size of the outer case made of a resin material.

  In order to achieve the above-mentioned object, the present invention has a configuration in which a heat dissipation plate that is thermally connected to an image processing IC that generates a relatively large amount of heat is provided in a cutout portion of a circuit board.

  Specifically, the present invention is directed to a camera device having a case made of a resin material, and has taken the following solving means.

  That is, a first aspect of the present invention is a camera device including an outer case made of a resin material, the image pickup device converting light input from the outside into an electric signal, and performing image processing on the electric signal. An image processing IC, a circuit board on which the image processing IC is mounted, and a heat dissipation plate in contact with the image processing IC are provided, the circuit board has a cutout portion, and the heat dissipation plate is provided in the cutout portion of the circuit board. It is characterized by having an extending portion that extends.

  According to this, since the circuit board has the cutout portion and the heat dissipation plate has the extension portion extending to the cutout portion of the circuit board, it is necessary to make the outer case larger than the heat dissipation plate. Absent. As a result, the heat dissipation of the image processing IC can be improved without enlarging the outer case.

  In a second aspect based on the first aspect, the extending portion may be flush with the circuit board.

  According to this, since the extending portion of the heat sink is flush with the circuit board, the thickness of the heat sink in the front and back direction of the circuit board can be reduced.

  In a third aspect based on the second aspect, the heat dissipation plate has a substrate facing portion which is a region facing the circuit board, and further includes a bent portion connecting the substrate facing portion and the extended portion. You may have.

  According to this, the circuit board and the extending portion of the heat sink can easily be flush with each other by the bent portion.

  In a fourth aspect based on the third aspect, the bent portion may have a width smaller than that of the substrate facing portion and the extended portion.

  According to this, usually, the bent portion can be easily formed with respect to the heat dissipation plate made of metal, and the area of the heat dissipation plate can be reduced, so that weight reduction and cost reduction can be achieved at the same time. it can.

  In a fifth aspect based on the first to fourth aspects, a metal chassis that holds the component may be further provided, and the heat dissipation plate may be provided with a heat dissipation path that is in contact with the metal chassis.

  According to this, the heat accumulated in the heat dissipation plate from the image processing IC or the like can be efficiently dissipated to the metal chassis by the heat dissipation path in contact with the metal chassis.

  In a sixth aspect based on the fifth aspect, the heat dissipation plate may be grounded to the metal chassis via a heat dissipation path.

  According to this, when the metal chassis is set to the ground potential, the circuit board can be set to the ground potential via the heat dissipation plate, so that the circuit board can be prevented from being charged.

  In a seventh aspect based on the first to sixth aspects, a heat conductive elastic member may be arranged in a contact portion of the heat sink with the image processing IC.

  According to this, it is possible to prevent the contact failure between the image processing IC and the heat sink during the assembly of the camera device.

  In an eighth aspect based on the first to seventh aspects, the extension portion of the heat dissipation plate may be provided with a positioning portion for performing positioning with respect to the circuit board.

  According to this, since the extending portion of the heat sink is positioned at the cutout portion of the circuit board, the heat sink can be stabilized with respect to the circuit board during assembly.

  According to the present invention, it is possible to improve the heat radiation performance while reducing the size of the outer case made of a resin material.

FIG. 1 is an exploded perspective view showing a camera device according to an embodiment of the present invention. FIG. 2 is a perspective view showing a control board and a heat dissipation plate held by the control board which constitute the camera device according to the embodiment of the present invention. FIG. 3 is a sectional view taken along line III-III in FIG. FIG. 4 is a sectional view taken along line IV-IV in FIG. FIG. 5 is an exploded perspective view showing a control board and a heat dissipation plate held by the control board which constitute the camera device according to the embodiment of the present invention. FIG. 6 is a cross-sectional view of the camera device according to the embodiment of the present invention in a direction parallel to the bottom surface and in a plane passing through the bent portion of the heat dissipation plate. FIG. 7 is a cross-sectional view in a plane parallel to the optical axis direction of the lens barrel and passing through the left side portion of the lens barrel in the camera device according to the embodiment of the present invention.

(One embodiment)
An embodiment of the present invention will be described with reference to the drawings. FIG. 1 shows an exploded perspective view from the back of a camera device according to an embodiment of the present invention.

  As shown in FIG. 1, a camera device 100 according to the present embodiment includes a lens barrel 110 that holds a lens group including a plurality of lenses, a case body 120, a case upper lid 121, a shutter holding plate 130, an imaging board 140, and a circuit board. A control board 150, a heat dissipation plate 160 held by the control board 150, and a case back cover 122.

  As described above, the camera device 100 according to the present embodiment is a so-called mirrorless single-lens digital camera in which the lens is interchangeable and a reflection mirror is not mounted.

  The lens barrel 110 may include a movable unit for autofocus (AF) that moves the lens group in the front-rear direction, such as a linear motor, an ultrasonic motor, or a step motor.

  The case body 120 is made of, for example, a resin material, and the case body 120 is provided with a mount 120a for holding the lens barrel 110. A hot shoe 120b to which an accessory such as a strobe can be attached is provided on an upper portion of the mount 120a in the case body 120. The grip portion on the right side of the case body 120 constitutes a lid portion that covers a slot of a memory card (for example, SD card) described later.

  A known shutter mechanism 130a such as a focal plane shutter is incorporated in the shutter holding plate 130.

  The image pickup substrate 140 is provided with an image pickup device 140a including, for example, a CMOS sensor. The center line of the image sensor 140a coincides with the optical axis of the lens group, and the shutter mechanism 130a is arranged between the image sensor 140a and the lens barrel 110 (mount 120a).

  On the control board 150, for example, an A / D converter that performs A / D conversion on the photoelectric conversion signal from the image sensor 140a, and an image that performs predetermined image processing on the image signal from the A / D converter. The image processing processor 150a, which is a processing IC, is mounted. Here, an ASIC (IC for a specific application) can be used as the image processor 150a. Further, the control board 150 is provided with a slot 150c as an external memory device for storing, for example, an SD card.

  The heat dissipation plate 160 is made of a metal having a high thermoelectric coefficient, for example, copper (Cu) or a copper alloy, and has a contact portion 160a that abuts a portion of the control board 150 facing the image processor 150a having a relatively large heat generation amount. Have

  The upper parts of the case body 120 and the case back cover 122 are fixed to each other by a case top cover 121 made of a resin material. A circuit that exposes a part of the hot shoe 120b and is electrically connected to a strobe is disposed on the upper surface of the case upper lid 121.

  A release button (shutter button) 121a, various dials 121b capable of changing shutter speed, aperture (F) value, shooting mode, and the like are provided on the grip portion of the case upper cover 121.

  A battery case 180 for accommodating a battery pack is arranged on the back side of the grip portion of the case body 120, and the battery case 180 has a lid portion at the bottom for detaching the battery.

  For example, a case back cover 122 made of a resin material exposes a liquid crystal panel (LCD) 170 from its back surface, and the liquid crystal panel 170 is formed by a metal chassis (reference numeral 190 in FIGS. 6 and 7) functioning as an LCD holder. The back side is held. A dial 122a for adjusting the display state of the liquid crystal panel 170 or changing the display mode, for example, is provided in the grip portion of the case back cover 122. Here, the case body 120, the case upper cover 121, and the case back cover 122 are examples of an exterior case. Further, the resin material constituting the outer case may have the same composition in the case body 120, the case upper lid 121 and the case back lid 122, and in consideration of the required strength and easiness of molding. Then, the composition may be appropriately changed depending on the site.

  A control board 150 and a heat sink 160 are arranged between the battery case 180 and the image pickup board 140, and the liquid crystal panel 170 (and the metal chassis).

  Next, detailed configurations of the control board 150 and the heat dissipation plate 160 will be described with reference to FIGS.

  FIG. 2 is a perspective view showing a state in which the heat dissipation plate 160 is held by the control board 150 that constitutes the camera device according to the present embodiment. 3 is a sectional view taken along line III-III in FIG. 2, and FIG. 4 is a sectional view taken along line IV-IV in FIG. FIG. 5 is an exploded perspective view of the control board 150 and the heat sink 160. Here, in FIG. 2, the depth direction in the drawing indicates the front of the camera device 100, and in FIG. 3, the lower part in the drawing indicates the front of the camera device 100. Further, in FIG. 5, the lower right direction in the drawing indicates the front of the camera device 100.

  As shown in FIGS. 2 and 5, a cutout portion 150b is provided on the left side and the upper side of the image processing processor 150a in the control board 150.

  The heat sink 160 is connected to the substrate facing portion 160A, which is a region facing the control substrate 160 and has the contact portion 160a, and is connected to the substrate facing portion 160A, and extends to the cutout portion 150b of the control substrate 150. It has an extending portion 160B to be installed. The contact portion 160a may be formed in a concave shape that is recessed toward the image processing processor 150a so as to contact substantially the entire upper surface of the image processing processor 150a. Further, although not shown, an elastic member having thermal conductivity, for example, a known thermal conductive elastic sheet is arranged in the contact portion 160a of the heat dissipation plate 160 with the upper surface of the image processor 150a. It may have been done. As a result, even when the height of the upper surface of the image processor 150a on the control board 150 varies, or even when the manufacturing dimensions of the heat sink 160 made of a metal plate vary, the camera device is not assembled. It is possible to prevent the contact failure between the image processor 150a and the heat sink 160 in FIG.

  Further, as shown in FIGS. 2 and 5, the board facing portion 160A of the heat dissipation plate 160 is provided with, for example, screw holes at corners facing each other with the abutting portion 160a interposed therebetween. It is held on the control board 150.

  Further, the board facing portion 160A and the extension portion 160B are connected by the bent portion 160b having a width smaller than that of the board facing portion 160A and the extension portion 160B. Here, the bent portion 160b is bent in two steps. However, the number of bending steps of the bending portion 160b is not limited to two, and the number of steps can be appropriately set according to the height difference between the substrate facing portion 160A and the extending portion 160B. As a result, as shown in FIGS. 3 and 4, the extension 160B of the heat dissipation plate 160 and the control board 150 are flush with each other. Therefore, the thickness of the heat dissipation plate 160 in the front-back direction of the control board 150 can be reliably reduced. This makes it possible to reduce the size of the outer case made of a resin material while improving the heat dissipation performance. The board facing portion 160A, the bent portion 160b, and the extending portion 160B of the heat dissipation plate 160 of this embodiment are integrally formed. However, at least one of these members may be separately formed and connected in a later step.

  Further, since the width of the bent portion 160b is set smaller than that of the board facing portion 160A and the extended portion 160B, the bent portion 160b can be easily formed on the heat dissipation plate 160 made of copper, for example. .. Moreover, since the area of the heat sink 160 can be reduced, the weight and cost of the heat sink 160 can be reduced at the same time.

  Further, as shown in FIG. 2 to FIG. 5, the extension portion 160B of the heat dissipation plate 160 has a claw-like positioning that projects toward the control board 150 and abuts against the control board 150 to perform positioning with respect to the control board 150. A section 160c is provided. As a result, the extension portion 160B of the heat dissipation plate 160 can be positioned at the notch portion 150b which is a space where the support portion of the control board 150 does not exist when the camera device 100 is assembled. Therefore, the heat dissipation plate 160 at the time of assembly can be stabilized at the assembled position with respect to the control board 150.

  Further, as shown in FIGS. 2, 3 and 5, the heat dissipation plate 160 may be provided with a claw-shaped heat dissipation path 160d that protrudes outward from the side surface of the heat dissipation plate 160 and contacts the metal chassis 190. .. At the same time, the heat radiation path 160d may be grounded to the metal chassis 190. Thus, the heat that is mainly conducted from the image processor 150a and accumulated in the heat dissipation plate 160 can be efficiently dissipated to the metal chassis 190 by the heat dissipation path 160d that is in contact with the metal chassis 190. Further, when the metal chassis 190 is set to the ground potential, the control board 150 can be set to the ground potential via the heat dissipation plate 160, so that the control board 150 can be prevented from being undesirably charged.

  6 and 7 show sectional configurations of the camera device 100 according to the present embodiment. FIG. 6 shows a sectional configuration in a direction parallel to the bottom surface of the camera device 100 and in a plane passing through the bent portion 160b of the heat dissipation plate 160. FIG. 7 shows a cross-sectional structure in a plane parallel to the optical axis direction of the lens barrel 110 of the camera device 100 and passing through the left side portion of the lens barrel 110. Here, the same components as those shown in FIGS. 2 to 5 are designated by the same reference numerals, and the description thereof will be omitted.

  As shown in FIGS. 5 and 6, inside the mount 120a, a terminal 130b made of, for example, a resin material, which is an electrical connection terminal with the lens barrel 110, is provided. Here, the terminal 130b is held on the mount 120a side of the imaging system holding member 135 made of, for example, a resin material. Further, the shutter holding plate 130 and the image pickup substrate 140 are sequentially held by the image pickup system holding member 135 behind the terminal 130b.

  In addition, as described above, the liquid crystal panel 170 is held by the metal chassis 190 on the back surface thereof. As shown in FIG. 6, the metal chassis 190 is substantially in close contact with the board facing portion 160A of the heat dissipation plate 160 held on the control board 150, and as described above, the metal chassis 190 includes the heat dissipation plate 160. It is thermally and electrically connected to the control board 150 via the.

  On the other hand, as shown in FIGS. 2 and 3, even in the extended portion 160B of the heat dissipation plate 160, although it is thermally and electrically connected to the metal chassis 190, as an example, the substrate facing portion. By bending the portion 160A forward, that is, by bending the image processing processor 150a rearward, as shown in FIG. 6, a space is created in the region of the extension 160B on the metal chassis 190 side. ..

  As described above, according to the camera device 100 of the present embodiment, the case main body 120 includes the imaging system holding member 135 that holds the terminal 130b, the shutter holding plate 130, and the imaging board 140, the battery case 180, and the control board 150. Also, the heat dissipation performance can be improved while the heat dissipation plate 160, the metal chassis 190, and the liquid crystal panel 170 are compactly housed in an outer case made of a resin material.

  The camera device 100 according to the present embodiment has been described by taking the interchangeable lens camera as an example, but the camera device 100 is not limited to the interchangeable lens camera and may be a fixed lens camera. Further, it may be a digital single-lens reflex camera with an interchangeable lens and a reflection mirror. Further, the present invention is not limited to a still camera, but may be a video camera, because it has a feature of the control board and its heat dissipation plate. Therefore, it may be a portable device as long as it has a camera function.

  That is, the above description of the preferred embodiments is merely exemplary in nature and is not intended to limit the present invention, its application, or its use. Further, various modifications are allowed without departing from the present invention.

  The camera device according to the present invention is useful as a digital camera, a video camera, a mobile phone with a camera function, or the like.

100 camera device 120 case body (exterior case)
121 Case upper lid (exterior case)
122 Case back (exterior case)
140a Image sensor 150 Control board (circuit board)
150a Image processing processor (image processing IC)
150b Notch 160 Heat sink 160A Substrate facing part 160B Extension part 160a Contact part 160b Bent part 160c Positioning part 160d Heat dissipation path 190 Metal chassis

Claims (7)

A camera device having an outer case made of a resin material,
An image sensor that converts light input from the outside into an electrical signal,
An image processing IC for performing image processing on the electric signal;
A circuit board on which the image processing IC is mounted,
A heat sink in contact with the image processing IC,
The circuit board has a notch,
The heat dissipation plate has an extending portion extending to the cutout portion of the circuit board ,
The camera device , wherein the extension portion is flush with the circuit board . The camera device according to claim 1 ,
The heat dissipation plate has a substrate facing portion which is a region facing the circuit board, and further has a bent portion connecting the substrate facing portion and the extended portion. apparatus. The camera device according to claim 2 ,
The camera device, wherein the bent portion has a width smaller than that of the substrate facing portion and the extended portion. The camera device according to any one of claims 1 to 5 ,
Further equipped with a metal chassis to hold the parts,
The camera device, wherein the heat dissipation plate is provided with a heat dissipation path that comes into contact with the metal chassis. The camera device according to claim 4 ,
The camera device, wherein the heat dissipation plate is grounded to the metal chassis via the heat dissipation path. A camera apparatus according to any one of claims 1 to 5
A camera device, wherein a heat conductive elastic member is disposed at a contact portion of the heat dissipation plate with the image processing IC. The camera device according to any one of claims 1 to 7 ,
The camera device, wherein the extension portion of the heat dissipation plate is provided with a positioning portion for positioning with respect to the circuit board.