CN215453093U

CN215453093U - Camera module

Info

Publication number: CN215453093U
Application number: CN202121976386.1U
Authority: CN
Inventors: 邓彬全; 陈情; 熊鑫煜
Original assignee: Hefei Zhixing Photoelectric Co ltd
Current assignee: Hefei Zhixing Photoelectric Co ltd
Priority date: 2021-08-20
Filing date: 2021-08-20
Publication date: 2022-01-07
Anticipated expiration: 2031-08-20

Abstract

The utility model belongs to the technical field of electronics, and particularly relates to a camera module which comprises a lens, a lens base, an image sensor and a PCB (printed Circuit Board), wherein the lens, the lens base, the image sensor and the PCB are sequentially arranged from top to bottom, the camera module further comprises a heat dissipation plate, the heat dissipation plate is arranged between the image sensor and the PCB, two surfaces of the heat dissipation plate are respectively attached to the surfaces of the image sensor and the PCB, and the lens base is directly attached to the heat dissipation plate or the lens base is indirectly attached to the heat dissipation plate through a support. According to the utility model, by arranging the heat dissipation plate, the heat generated by the image sensor is taken away by utilizing the heat dissipation plate, the phenomenon that the chip of the image sensor is warped due to the thermal deformation of the PCB is avoided, the lens base (or the bracket) is attached to the heat dissipation plate, the size of the front end part of the camera module is reduced, and the installation is convenient.

Description

Camera module

Technical Field

The utility model belongs to the technical field of electronics, and particularly relates to a camera module.

Background

Along with communication technology's development, electronic equipment for example smart mobile phone, intelligence dress wrist-watch etc. use more and more extensively to the parameter of the camera module in the electronic equipment is also higher and higher, and the functional requirement is more and more powerful. Because the camera module can produce very big heat in the short time at the operation in-process, probably lead to influencing the normal work of camera module, probably influence electronic equipment's life even.

At present, a camera module generally includes an image sensor, a PCB, a bracket, a filter, and a lens assembly having a lens. The image sensor is arranged on the PCB circuit board through a Wire Bond (W/B) process, the bracket is arranged on the PCB circuit board and covers the image sensor, the lens component is arranged on the bracket, and the optical filter is positioned between the lens component and the image sensor and arranged in the middle of the bracket. However, in the Bonding process, due to the influence of temperature, the PCB is easily deformed, and the image sensor chip is warped, and in addition, the heat dissipation efficiency of the high-pixel image sensor loaded on the camera module is not high, so that the imaging quality of the camera is easily reduced. Meanwhile, the existing camera module body is large in size towards the front end part and inconvenient to install.

SUMMERY OF THE UTILITY MODEL

In order to solve the technical problems, the utility model provides a camera module to solve the problems that the volume of the front end part of the existing camera module is too large, the image sensor chip is warped due to the thermal deformation of a PCB (printed circuit board) in the assembling process of the existing camera module, and the heat dissipation efficiency of an image sensor loaded on the camera module is not high.

The utility model provides the following technical scheme, which comprises a lens, a lens base, an image sensor and a PCB circuit board, wherein the lens, the lens base, the image sensor and the PCB circuit board are sequentially arranged from top to bottom; the camera module is characterized by further comprising a heating panel, wherein the heating panel is arranged between the image sensor and the PCB, two surfaces of the heating panel are respectively attached to the image sensor and the surface of the PCB, and the lens holder is directly attached to the heating panel or indirectly attached to the heating panel through a support.

Compared with the prior art, the utility model has the beneficial effects that: through setting up the heating panel, utilize heating panel heat dispersion is good, will a large amount of heats that image sensor produced are taken away, play radiating effect, in addition the heating panel has higher roughness, can guarantee leveling when image sensor is attached, avoided because of PCB circuit board thermal deformation arouses image sensor warpage, compare in traditional camera module simultaneously, microscope base (or the support) laminating can reduce the volume of camera module front end portion on the heating panel, the installation of being convenient for.

Preferably, the bracket is provided with a first through hole, an accommodating space is formed between the first through hole and the heat dissipation plate, and the image sensor is accommodated in the accommodating space.

Preferably, the camera module further comprises a first locking mechanism, and the PCB, the heat dissipation plate and the bracket are locked by the first locking mechanism.

Preferably, the first locking mechanism comprises a bolt, a bolt through hole arranged on the heat dissipation plate, a bolt through hole arranged on the PCB and a threaded hole arranged on the lens base.

Preferably, the camera module comprises a second locking mechanism, and the PCB, the heat dissipation plate and the lens holder are locked by the second locking mechanism.

Preferably, the second locking mechanism comprises a bolt, a bolt through hole arranged on the heat dissipation plate, a bolt through hole arranged on the PCB and a threaded hole arranged on the lens base.

Preferably, the camera module further comprises an upper sealing ring, the lens holder is provided with a second through hole, and the lens penetrates through the second through hole through the upper sealing ring and is sleeved with the lens holder.

Preferably, the camera module further comprises a lower sealing ring, the upper end of the lower sealing ring is sleeved at the bottom of the lens base, and the lower end of the lower sealing ring is in contact with the upper surface of the image sensor.

Preferably, a third through hole is formed in the PCB, and the third through hole corresponds to the heat dissipation plate.

Drawings

In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings needed to be used in the embodiments or the prior art descriptions will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and it is obvious for those skilled in the art to obtain other drawings based on these drawings without inventive exercise.

Fig. 1 is a perspective view of a camera module according to a first embodiment of the present invention;

fig. 2 is an exploded view of a camera module according to a first embodiment of the present invention;

fig. 3 is a perspective view of a camera module according to a second embodiment of the present invention;

fig. 4 is an exploded view of a camera module according to a second embodiment of the present invention;

description of reference numerals:

the camera lens comprises a lens-1, a lens base-2, a second through hole-21, a support-3, a first through hole-31, an image sensor-4, a heat dissipation plate-5, a PCB circuit board-6, a third through hole-61, an upper sealing ring-7, a lower sealing ring-8, a first locking mechanism-9 and a second locking mechanism-10.

Detailed Description

Reference will now be made in detail to embodiments of the present invention, examples of which are illustrated in the accompanying drawings, wherein like or similar reference numerals refer to the same or similar elements or elements having the same or similar function throughout. The embodiments described below with reference to the drawings are exemplary and intended to be illustrative of the embodiments of the present invention, and should not be construed as limiting the utility model.

In the description of the embodiments of the present invention, it should be understood that the terms "length", "width", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc. indicate orientations or positional relationships based on those shown in the drawings, and are only for convenience in describing the embodiments of the present invention and simplifying the description, but do not indicate or imply that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, and thus, should not be construed as limiting the present invention.

Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of the embodiments of the present invention, "a plurality" means two or more unless specifically limited otherwise.

In the embodiments of the present invention, unless otherwise explicitly specified or limited, the terms "mounted," "connected," "fixed," and the like are to be construed broadly, e.g., as being fixedly connected, detachably connected, or integrated; can be mechanically or electrically connected; either directly or indirectly through intervening media, either internally or in any other relationship. Specific meanings of the above terms in the embodiments of the present invention can be understood by those of ordinary skill in the art according to specific situations.

In a first embodiment of the present invention, as shown in fig. 1 and 2, a camera module includes a lens 1, a lens holder 2, an image sensor 4, and a PCB 6, where the lens 1, the lens holder 2, the image sensor 4, and the PCB 6 are sequentially disposed from top to bottom, the camera module further includes a heat dissipation plate 5, the heat dissipation plate 5 is disposed between the image sensor 4 and the PCB 6, an upper surface of the heat dissipation plate 5 is attached to a lower surface of the image sensor 4 through a thermal conductive glue, and a lower surface of the heat dissipation plate 5 is attached to an upper surface of the PCB 6. According to the utility model, by arranging the heat dissipation plate 5, the heat generated by the image sensor 4 is taken away by utilizing the good heat dissipation and high flatness of the heat dissipation plate 5, and the flatness of the image sensor 4 during attachment is ensured, so that the problems of warping of the chip of the image sensor 4 and heat dissipation of the image sensor 4 caused by thermal deformation of the PCB 6 are solved.

The camera module further comprises a support 3, the support 3 is arranged on the upper surface of the heat dissipation plate 5, the support 3 is arranged between the lens base 2 and the heat dissipation plate 5, the upper surface of the support 3 is adhered to the lower surface of the lens base 2 through AA focusing, the lower surface of the support 3 is attached to the upper surface of the heat dissipation plate 5, the support 3 is provided with a first through hole 31, an accommodating space is formed between the first through hole 31 and the heat dissipation plate 5, and the image sensor 4 is accommodated in the accommodating space and attached to the heat dissipation plate 5. Compared with the traditional camera module, the bracket 3 is attached to the heat dissipation plate 5, so that the size of the front end part of the camera module can be reduced, and the installation is convenient.

Preferably, the camera module further comprises an upper sealing ring 7 and a lower sealing ring 8, the lens holder 2 is provided with a second through hole 21, a gap exists between the bottom of the lens 1 and the image sensor 4, the upper sealing ring 7 is arranged at an interface of the lens 1 and the lens holder 2, and the lens 1 penetrates through the second through hole 21 through the upper sealing ring 7 and is sleeved with the lens holder 2; the upper seal ring 7 is used for sealing the lens 1 and the lens base 2, plays the purpose of waterproof relaxation, the first through hole 31 with the second through hole 21 communicates with each other, the lower seal ring is arranged in between the first through hole 31 and the second through hole 21, the 8 upper ends of the lower seal ring are sleeved at the 2 bottom of the lens base, the lower end and the upper surface of the image sensor 4 are contacted. The bottom of the lens 1 is sleeved on the lower sealing ring 8 and is connected with the image sensor 4 through the lower sealing ring 8, and a gap is reserved between the bottom of the lens 1 and the image sensor 4.

Preferably, the heat dissipation plate 5 may be made of one of various kinds of plates with good heat dissipation performance, such as a steel plate, an aluminum plate, and the like, but the heat dissipation plate 5 is made of a steel plate in the present invention.

Preferably, the PCB 6 is provided with a third through hole 61, and the third through hole 61 is located below the heat dissipation plate 5, so as to perform ventilation and heat dissipation functions on the image sensor 4.

Preferably, the camera module further comprises a first locking mechanism 9, the first locking mechanism 9 comprises a bolt, a bolt through hole formed in the heat dissipation plate 5 and the PCB 6 and a threaded hole formed in the bracket 3, the first locking mechanism 9 penetrates through the bolt through hole and is connected with the threaded hole through the bolt, and the PCB 6 and the heat dissipation plate 5 are locked and attached to the bracket 3.

In the second embodiment of the present invention, as shown in fig. 3 and 4, the present embodiment is different from the first embodiment in that the mirror base 2 and the heat dissipation plate 5 are not provided with the bracket 3, and the mirror base 2 is directly attached to the heat dissipation plate 5. The camera module comprises a second locking mechanism 10, wherein the second locking mechanism 10 comprises a bolt, a bolt through hole formed in the heat dissipation plate, a bolt through hole formed in the PCB and a threaded hole formed in the lens base. The PCB 6, the heat dissipation plate 5 and the mirror base 2 are locked by the second locking mechanism 10.

The above description is only for the purpose of illustrating the preferred embodiments of the present invention and is not to be construed as limiting the utility model, and any modifications, equivalents and improvements made within the spirit and principle of the present invention are intended to be included within the scope of the present invention.

Claims

1. A camera module comprises a lens, a lens base, an image sensor and a PCB (printed circuit board), wherein the lens, the lens base, the image sensor and the PCB are sequentially arranged from top to bottom; the camera module is characterized by further comprising a heating panel, wherein the heating panel is arranged between the image sensor and the PCB, two surfaces of the heating panel are respectively attached to the image sensor and the surface of the PCB, and the lens holder is directly attached to the heating panel or indirectly attached to the heating panel through a support.

2. The camera module according to claim 1, wherein the bracket defines a first through hole, an accommodating space is formed between the first through hole and the heat dissipation plate, and the image sensor is accommodated in the accommodating space.

3. The camera module of claim 2, further comprising a first locking mechanism, wherein the PCB, the heat dissipation plate and the bracket are locked together by the first locking mechanism.

4. The camera module according to claim 3, wherein the first locking mechanism comprises a bolt, a bolt through hole formed in the heat dissipation plate, a bolt through hole formed in the PCB, and a threaded hole formed in the lens holder.

5. The camera module of claim 1, further comprising a second locking mechanism, wherein the PCB, the heat dissipation plate and the lens holder are locked by the second locking mechanism.

6. The camera module according to claim 5, wherein the second locking mechanism comprises a bolt, a bolt through hole formed in the heat dissipation plate, a bolt through hole formed in the PCB, and a threaded hole formed in the lens holder.

7. The camera module according to any one of claims 1 to 6, further comprising an upper seal ring, wherein the lens holder is provided with a second through hole, and the lens passes through the second through hole via the upper seal ring and is sleeved with the lens holder.

8. The camera module according to any one of claims 1 to 6, further comprising a lower sealing ring, wherein an upper end of the lower sealing ring is sleeved on the bottom of the lens holder, and a lower end of the lower sealing ring is in contact with an upper surface of the image sensor.

9. The camera module according to any one of claims 1 to 6, wherein a third through hole is formed in the PCB, and the third through hole is disposed corresponding to the heat dissipation plate.