JPH0526936Y2 - - Google Patents

Info

Publication number
JPH0526936Y2
JPH0526936Y2 JP1985049410U JP4941085U JPH0526936Y2 JP H0526936 Y2 JPH0526936 Y2 JP H0526936Y2 JP 1985049410 U JP1985049410 U JP 1985049410U JP 4941085 U JP4941085 U JP 4941085U JP H0526936 Y2 JPH0526936 Y2 JP H0526936Y2
Authority
JP
Japan
Prior art keywords
shield case
coil spring
circuit board
printed circuit
motor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP1985049410U
Other languages
Japanese (ja)
Other versions
JPS61165068U (en
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1985049410U priority Critical patent/JPH0526936Y2/ja
Priority to CN86101921A priority patent/CN1017852B/en
Priority to GB08607805A priority patent/GB2174253B/en
Priority to KR1019860002340A priority patent/KR860008638A/en
Publication of JPS61165068U publication Critical patent/JPS61165068U/ja
Priority to KR2019900002148U priority patent/KR900003398Y1/en
Priority to HK359/91A priority patent/HK35991A/en
Priority to SG807/91A priority patent/SG80791G/en
Application granted granted Critical
Publication of JPH0526936Y2 publication Critical patent/JPH0526936Y2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02K—DYNAMO-ELECTRIC MACHINES
    • H02K11/00—Structural association of dynamo-electric machines with electric components or with devices for shielding, monitoring or protection
    • H02K11/30—Structural association with control circuits or drive circuits
    • H02K11/33—Drive circuits, e.g. power electronics
    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02K—DYNAMO-ELECTRIC MACHINES
    • H02K9/00—Arrangements for cooling or ventilating
    • H02K9/22—Arrangements for cooling or ventilating by solid heat conducting material embedded in, or arranged in contact with, the stator or rotor, e.g. heat bridges
    • H02K9/223—Heat bridges
    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02K—DYNAMO-ELECTRIC MACHINES
    • H02K11/00—Structural association of dynamo-electric machines with electric components or with devices for shielding, monitoring or protection
    • H02K11/40—Structural association with grounding devices
    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02K—DYNAMO-ELECTRIC MACHINES
    • H02K5/00—Casings; Enclosures; Supports
    • H02K5/04—Casings or enclosures characterised by the shape, form or construction thereof
    • H02K5/22—Auxiliary parts of casings not covered by groups H02K5/06-H02K5/20, e.g. shaped to form connection boxes or terminal boxes
    • H02K5/225—Terminal boxes or connection arrangements
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H05K1/0204—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate
    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02K—DYNAMO-ELECTRIC MACHINES
    • H02K2211/00—Specific aspects not provided for in the other groups of this subclass relating to measuring or protective devices or electric components
    • H02K2211/03—Machines characterised by circuit boards, e.g. pcb
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0302—Properties and characteristics in general
    • H05K2201/0311—Metallic part with specific elastic properties, e.g. bent piece of metal as electrical contact
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10166—Transistor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10265—Metallic coils or springs, e.g. as part of a connection element
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10416—Metallic blocks or heatsinks completely inserted in a PCB

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Motor Or Generator Cooling System (AREA)
  • Motor Or Generator Frames (AREA)

Description

【考案の詳細な説明】 （産業上の利用分野） 本考案は、小型モータ、特にシールド・ケース
内にモータが設置され、前記シールド・ケース内
の空間に制御回路をそなえている小型モータにお
いて、少なくとも上記制御回路における集積回路
の放熱部と上記シールド・ケースとの双方に接触
するように熱伝導性を有するコイル・スプリング
を配設して上記集積回路の放熱を図るようにする
ことにより、コンパクトかつロー・コスト化を可
能ならしめるようにした小型モータに関するもの
である。[Detailed description of the invention] (Industrial application field) The present invention provides a small motor, particularly a small motor in which the motor is installed inside a shield case and a control circuit is provided in the space inside the shield case. By arranging a coil spring having thermal conductivity so as to contact at least both the heat dissipation part of the integrated circuit in the control circuit and the shield case, the heat dissipation of the integrated circuit is achieved. The present invention also relates to a small motor that can be manufactured at low cost.

（従来の技術と考案が解決しようとする問題点） 一般に、シールド・ケースにモータ本体を内蔵
すると共に例えば回転速度を制御するための制御
回路をそなえた例えばテープ・レコーダ等に用い
られる小型モータが知られている。そして、この
ような小型モータにおける上記制御回路は、小型
化を図るため当該制御回路の構成要素をプリント
基板に搭載しかつIC（集積回路）化が進められて
いる。このようにIC化を進める場合の問題点と
して、ICに発生する熱を如何に効果的に放熱さ
せるかということがある。(Problems to be solved by conventional technology and ideas) In general, small motors used in tape recorders, etc., have a motor body built into a shield case and are equipped with a control circuit for controlling the rotational speed. Are known. In order to reduce the size of the control circuit for such a small motor, components of the control circuit are mounted on a printed circuit board and integrated circuits (ICs) are being implemented. One of the problems in promoting the use of ICs in this way is how to effectively dissipate the heat generated in the ICs.

従来の小型モータにおいては、上記ICの放熱
効果を高める手段として、当該ICが搭載されて
いるプリント基板をシールド・ケースの外部に設
置するようにしたり、上記プリント基板を放熱効
果の高い金属基板にすること等が考慮されてい
る。しかしながら、上記ICをシールド・ケース
の外部に設置することは、モータの小型化に反す
ることになり、また金属製のプリント基板を用い
ることは、コスト上昇の要因になるという非所望
な問題がある。 In conventional small motors, as a means to increase the heat dissipation effect of the above-mentioned IC, the printed circuit board on which the IC is mounted is installed outside the shield case, or the above-mentioned printed circuit board is made of a metal board with high heat dissipation efficiency. The following are taken into consideration. However, installing the above-mentioned IC outside the shield case goes against the desire to miniaturize the motor, and using a metal printed circuit board has the undesirable problem of increasing costs. .

（問題点を解決するための手段） 本考案は、上記の如き問題点を解決することを
目的としており、そのため本考案の小型モータ
は、シールド・ケース内にモータ本体が設置され
かつ上記シールド・ケース内の空間にモータの制
御を行うための制御回路が搭載されたプリント基
板をそなえ、 当該プリント基板と上記シールド・ケースとの
間に板状の防振材を介在させた小型モータにおい
て、 上記制御回路における集積回路の放熱部が存在
する位置に対応して上記防振材を一部くり抜くと
共に、当該くり抜かれた部分をもつてコイル・ス
プリング収容部を構成し、当該放熱部と上記シー
ルド・ケースとの双方に接触するように上記コイ
ル・スプリング収容部に配設された熱伝導性を有
するコイル・スプリングをそなえ、 上記防振材で周辺を囲われた上記コイル・スプ
リングを介して上記集積回路の発生熱が上記シー
ルド・ケースに放熱されるように構成されている
ことを特徴としている。以下図面を参照しつつ説
明する。(Means for Solving the Problems) The present invention aims to solve the above-mentioned problems, and therefore, the small motor of the present invention has a motor main body installed in a shield case, and the above-mentioned shield case. A small motor is provided with a printed circuit board equipped with a control circuit for controlling the motor in the space inside the case, and a plate-shaped vibration isolating material is interposed between the printed circuit board and the above-mentioned shield case. A portion of the vibration isolating material is hollowed out corresponding to the position where the heat dissipation section of the integrated circuit in the control circuit is located, and the hollowed out portion constitutes a coil spring accommodating section, and the heat dissipation section and the shield A coil spring having thermal conductivity is provided in the coil spring accommodating part so as to be in contact with both the case and the coil spring, and the coil spring is surrounded by the vibration isolating material. It is characterized in that it is constructed so that the heat generated by the circuit is radiated to the shield case. This will be explained below with reference to the drawings.

（実施例） 第１図は本考案の小型モータの基本構成を説明
するための側断面図、第２図Ａ，Ｂは本考案の一
実施例説明図、第３図は本考案の他の一実施例説
明図を示している。そして、図中の符号１はモー
タ本体、２はシールド・ケース、２′はシール
ド・ケース蓋、３はプリント基板、４および４′
は防振ゴム、５は集積回路（IC）、６はIC５の放
熱部、７はICリード線、８および１０はコイ
ル・スプリング９はコイル・スプリング収容部を
表している。(Example) Fig. 1 is a side sectional view for explaining the basic configuration of the small motor of the present invention, Fig. 2 A and B are explanatory diagrams of one embodiment of the present invention, and Fig. 3 is an illustration of another embodiment of the present invention. An explanatory diagram of one embodiment is shown. In the figure, 1 is the motor body, 2 is the shield case, 2' is the shield case lid, 3 is the printed circuit board, 4 and 4'
5 is a vibration-proof rubber, 5 is an integrated circuit (IC), 6 is a heat dissipation part of the IC 5, 7 is an IC lead wire, 8 and 10 are coil springs, and 9 is a coil spring accommodating part.

本考案が適用される小型モータの基本構成が第
１図に図示されている。即ち、モータ本体１はシ
ールド・ケース２内に設置し、該シールド・ケー
ス２の開口部はシールド・ケース蓋２′でもつて
閉塞されるように構成されている。そして、コン
パクトな形状にするため、モータ本体１とシール
ド・ケース蓋２′との空間を利用して、例えばコ
ンデンサ、IC等によつて構成される制御回路が
搭載されたプリント基板３が設置さている。な
お、防振ゴム４，４′は上記モータ本体１および
プリント基板３の上記シールド・ケース２内での
移動を防止するためのものである。 The basic configuration of a small motor to which the present invention is applied is illustrated in FIG. That is, the motor body 1 is installed in a shield case 2, and the opening of the shield case 2 is closed with a shield case lid 2'. In order to make the shape compact, the space between the motor body 1 and the shield case lid 2' is used to install a printed circuit board 3 on which a control circuit composed of, for example, a capacitor, an IC, etc. is mounted. There is. The anti-vibration rubbers 4, 4' are for preventing the motor body 1 and the printed circuit board 3 from moving within the shield case 2.

第１図に図示されているように、プリント基板
３がシールド・ケース２とシールド・ケース蓋
２′とによつて密閉されているため、プリント基
板３に搭載されている上記制御回路構成要素特に
ICの放熱を効果的に行うことが必要となる。本
考案は、第１図図示の如く、プリント基板３をシ
ールド・ケース２内に設置しかつ上記ICの放熱
を効果的に行うことができるように構成されてい
る。 As shown in FIG. 1, since the printed circuit board 3 is hermetically sealed by the shield case 2 and the shield case lid 2', the above-mentioned control circuit components mounted on the printed circuit board 3 are
It is necessary to effectively dissipate heat from the IC. As shown in FIG. 1, the present invention is configured such that a printed circuit board 3 is installed within a shield case 2 and the heat of the IC can be effectively dissipated.

第２図は本考案の一実施例説明図であつて、第
２図Ａは第１図においてシールド・ケース蓋２′
および防振ゴム４′を取り除いた状態での第１図
図示矢印Ａ−Ａにおける正面図であり、第２図Ｂ
は第２図図示矢印Ｂ−Ｂにおける拡大断面図（防
振ゴム４′およびシールド・ケース蓋２′が取付け
られた状態）を示している。 FIG. 2 is an explanatory diagram of one embodiment of the present invention, and FIG. 2A is a diagram showing the shield case lid 2' in FIG.
FIG. 2 is a front view taken along the arrow A-A in FIG.
2 shows an enlarged sectional view taken along the arrow BB in FIG. 2 (with the vibration-proof rubber 4' and the shield case lid 2' attached).

第２図図示実施例において、コイル・スプリン
グ８が設置されるコイル・スプリング収容部９
が、上記プリント基板３および防振ゴム４′に貫
通孔を穿つたかたちでもうけられている。なお、
当該コイル・スプリング収容部９の設置位置は、
IC５における放熱部６の位置に対応している。
また、上記コイル・スプリング収容部９に設置さ
れるコイル・スプリングは熱伝導性の良い導電性
金属によつて形成されている。そして、該コイ
ル・スプリング８の非拘束時における外径は、少
なくとも上記シールド・ケース蓋２′と放熱部６
との対向間〓（図示矢印Ｐ）よりも大である。従
つて、コイル・スプリング８は上記シールド・ケ
ース蓋２′と放熱部６との双方に弾性的に接触し
たかたちで設置されることになる。その結果、
IC５の発生熱は、放熱部６からコイル・スプリ
ング８を介してシールド・ケース蓋２′、更にシ
ールド・ケース２へと伝達され、放熱面積の広い
該シールド・ケース２およびシールド・ケース蓋
２′によつて効果的に放熱される。なお、上記コ
イル・スプリング８は熱伝達の役目を果たすと共
に、導電性を有するためアースの役目も兼ねてい
る。まずコイル・スプリング８とシールド・ケー
ス蓋２′とを特に絶縁する必要がある場合には、
コイル・スプリング８とシールド・ケース蓋２′
との間にプラスチツクシート等の絶縁板を入れる
ようにしても良い。 In the embodiment shown in FIG. 2, a coil spring housing 9 in which a coil spring 8 is installed.
The printed circuit board 3 and the vibration isolating rubber 4' are provided with through holes. In addition,
The installation position of the coil spring housing section 9 is as follows:
This corresponds to the position of the heat dissipation section 6 in the IC 5.
Further, the coil spring installed in the coil spring accommodating portion 9 is made of a conductive metal with good thermal conductivity. The outer diameter of the coil spring 8 when not restrained is at least the same as that of the shield case lid 2' and the heat dissipating part 6.
It is larger than the opposing distance 〓 (arrow P in the figure). Therefore, the coil spring 8 is installed so as to be in elastic contact with both the shield case lid 2' and the heat radiation section 6. the result,
The heat generated by the IC 5 is transmitted from the heat dissipation part 6 via the coil spring 8 to the shield case lid 2' and further to the shield case 2, which has a large heat dissipation area and the shield case lid 2'. Heat is dissipated effectively. The coil spring 8 serves not only as a heat transfer but also as a ground because it is conductive. First, if it is necessary to insulate the coil spring 8 and the shield case lid 2',
Coil spring 8 and shield case lid 2'
An insulating plate such as a plastic sheet may be inserted between the two.

第３図に図示されている本考案の他の一実施例
は、基本的には第２図図示実施例と同様の構成を
有するものである。即ち、前述した第２図図示実
施例においては、コイル・スプリング８の外周が
上記シールド・ケース蓋２′と放熱部６とに接触
しているのに対して、第３図図示実施例はコイ
ル・スプリング１０の両端面が上記シールド・ケ
ース蓋２′と放熱部６とに弾性的に接触するよう
に構成されており、その効果は前述した第２図図
示実施例と同様である。 Another embodiment of the present invention shown in FIG. 3 has basically the same construction as the embodiment shown in FIG. That is, in the embodiment shown in FIG. 2 described above, the outer periphery of the coil spring 8 is in contact with the shield case lid 2' and the heat radiation part 6, whereas in the embodiment shown in FIG. - Both end surfaces of the spring 10 are configured to come into elastic contact with the shield case lid 2' and the heat radiating section 6, and the effect is similar to that of the embodiment shown in FIG. 2 described above.

（考案の効果） 以上説明した如く、本考案によれば、ICの発
生熱を導電性および熱伝導性を有するコイル・ス
プリングを介して放熱面積の広いシールド・ケー
スに伝達して放熱させることが可能となるため、
制御回路が搭載されたプリント基板がシールド・
ケース内に設置されたコンパクトな形状の小型モ
ータを提供することができる。また上記コイル・
スプリングはアースの効果を有するばかりでな
く、ICの発生熱をプリント基板自身によつて放
熱する必要がなくなるため、プリント基板に安価
なフエノール等の合成樹脂製基板を用いることが
可能となり、ロー・コスト化に大きく貢献するこ
とができる。またコイル・スプリングは押圧され
るとき適宜変形し、放熱部やシールド・ケースに
よく密着し、かつコイル・スプリング収容部に収
容するので、コイル・スプリングが非所望に他の
位置に移動することがなく上記変形が正しく生じ
ることになる。(Effects of the invention) As explained above, according to the invention, the heat generated by the IC can be transferred to the shield case with a large heat radiation area through the coil spring having electrical and thermal conductivity, and the heat can be radiated. Because it becomes possible,
The printed circuit board on which the control circuit is mounted is shielded and
It is possible to provide a compact motor installed in a case. In addition, the above coil
Not only does the spring have a grounding effect, but it also eliminates the need to dissipate the heat generated by the IC through the printed circuit board itself, making it possible to use inexpensive synthetic resin substrates such as phenol for the printed circuit board, resulting in low-cost This can greatly contribute to cost reduction. In addition, the coil spring deforms appropriately when pressed, closely contacts the heat dissipation part and shield case, and is housed in the coil spring housing, so the coil spring will not move undesirably to another position. Therefore, the above deformation will occur correctly.

【図面の簡単な説明】[Brief explanation of the drawing]

第１図は本考案の小型モータの基本構成を説明
するための側断面図、第２図Ａ，Ｂは本考案の一
実施例説明図、第３図は本考案の他の一実施例説
明図を示す。 図中、１はモータ本体、２はシールド・ケー
ス、２′はシールド・ケース蓋、３はプリント基
板、４および４′は防振ゴム、５は集積回路
（IC）、６はIC５の放熱部、７はICリード線、８
および１０はコイル・スプリング、９はコイル・
スプリング収容部を表す。 Fig. 1 is a side sectional view for explaining the basic configuration of the small motor of the present invention, Figs. 2 A and B are illustrations of an embodiment of the invention, and Fig. 3 is an illustration of another embodiment of the invention. Show the diagram. In the figure, 1 is the motor body, 2 is the shield case, 2' is the shield case lid, 3 is the printed circuit board, 4 and 4' are anti-vibration rubber, 5 is the integrated circuit (IC), and 6 is the heat dissipation part of IC5. , 7 is the IC lead wire, 8
and 10 is a coil spring, 9 is a coil spring,
Represents a spring housing part.

Claims (1)

【実用新案登録請求の範囲】 シールド・ケース内にモータ本体が設置されか
つ上記シールド・ケース内の空間にモータの制御
を行うための制御回路が搭載されたプリント基板
をそなえ、 当該プリント基板と上記シールド・ケースとの
間に板状の防振材を介在させた小型モータにおい
て、 上記制御回路における集積回路の放熱部が存在
する位置に対応して上記防振材を一部くり抜くと
共に、当該くり抜かれた部分をもつてコイル・ス
プリング収容部を構成し、当該放熱部と上記シー
ルド・ケースとの双方に接触するように上記コイ
ル・スプリング収容部に配設された熱伝導性を有
するコイル・スプリングをそなえ、 上記防振材で周辺を囲われた上記コイル・スプ
リングを介して上記集積回路の発生熱が上記シー
ルド・ケースに放熱されるように構成されている
ことを特徴とする小型モータ。[Scope of Claim for Utility Model Registration] A motor body is installed in a shield case, and a printed circuit board is provided in the space inside the shield case on which a control circuit for controlling the motor is mounted, and the printed circuit board and the above In a small motor with a plate-shaped vibration isolator interposed between it and the shield case, a part of the vibration isolator is hollowed out corresponding to the position where the heat dissipation part of the integrated circuit in the control circuit is located, and the hollow is A coil spring having thermal conductivity, the removed portion of which constitutes a coil spring accommodating part, and which is disposed in the coil spring accommodating part so as to be in contact with both the heat dissipation part and the shield case. A small motor, characterized in that the heat generated by the integrated circuit is radiated to the shield case via the coil spring surrounded by the vibration isolating material.
JP1985049410U 1985-04-03 1985-04-03 Expired - Lifetime JPH0526936Y2 (en)

Priority Applications (7)

Application Number Priority Date Filing Date Title
JP1985049410U JPH0526936Y2 (en) 1985-04-03 1985-04-03
CN86101921A CN1017852B (en) 1985-04-03 1986-03-22 Miniature motor
GB08607805A GB2174253B (en) 1985-04-03 1986-03-27 Electric motor assembly
KR1019860002340A KR860008638A (en) 1985-04-03 1986-03-28 Small motor
KR2019900002148U KR900003398Y1 (en) 1985-04-03 1990-02-27 Small sized motor
HK359/91A HK35991A (en) 1985-04-03 1991-05-09 Electric motor assembly
SG807/91A SG80791G (en) 1985-04-03 1991-10-05 Electric motor assembly

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1985049410U JPH0526936Y2 (en) 1985-04-03 1985-04-03

Publications (2)

Publication Number Publication Date
JPS61165068U JPS61165068U (en) 1986-10-13
JPH0526936Y2 true JPH0526936Y2 (en) 1993-07-08

Family

ID=12830282

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1985049410U Expired - Lifetime JPH0526936Y2 (en) 1985-04-03 1985-04-03

Country Status (6)

Country Link
JP (1) JPH0526936Y2 (en)
KR (2) KR860008638A (en)
CN (1) CN1017852B (en)
GB (1) GB2174253B (en)
HK (1) HK35991A (en)
SG (1) SG80791G (en)

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DE3642724A1 (en) * 1986-12-13 1988-06-23 Grundfos Int ELECTRIC MOTOR WITH A FREQUENCY CONVERTER TO CONTROL THE MOTOR OPERATING SIZES
DE3842588A1 (en) * 1988-12-17 1990-06-21 Mulfingen Elektrobau Ebm COLLECTORLESS OUTDOOR ROTOR MOTOR WITH SEMICONDUCTOR COOLING ARRANGEMENT
DE9006924U1 (en) * 1989-07-11 1990-08-23 Brose Fahrzeugteile Gmbh & Co Kg, 8630 Coburg, De
GB2251522A (en) * 1990-12-07 1992-07-08 Ist Lab Ltd An electric motor
DE4231784A1 (en) * 1991-06-22 1994-03-24 Teves Gmbh Alfred Electrically-driven hydraulic pump - cools control stage for collectorless electric motor by hydraulic fluid handled by pump
US5686769A (en) * 1995-05-26 1997-11-11 Eastman Kodak Company Method of coil mounting for maximum heat transfer in brushless DC motors
DE19624145A1 (en) * 1996-06-18 1998-01-08 Wilo Gmbh Electric motor
FR2821497B1 (en) * 2001-02-27 2004-07-16 Bosch Gmbh Robert ELECTRIC DRIVE, PARTICULARLY WINDSCREEN WIPER DRIVE
DE10130950A1 (en) * 2001-06-27 2003-01-23 Behr Gmbh & Co electric motor
JP4992287B2 (en) * 2006-04-28 2012-08-08 日本電産株式会社 motor
DE102006050067A1 (en) * 2006-10-24 2008-05-08 Siemens Ag Electromotive actuator
DE102009037985A1 (en) * 2009-08-20 2011-03-03 Siemens Aktiengesellschaft Intelligent drive unit
DE102009053472A1 (en) * 2009-11-16 2011-06-09 Siemens Aktiengesellschaft Electronic assembly and method of making the same
CN101783539A (en) * 2010-03-19 2010-07-21 南京远航车辆驱动技术发展有限公司 Coaxial centrally-mounted driving assembly for electric vehicle with built-in controller
JP6039887B2 (en) * 2011-04-14 2016-12-07 セイコーエプソン株式会社 robot
JP6346422B2 (en) * 2012-11-08 2018-06-20 日本電産サーボ株式会社 motor
ITBO20130063A1 (en) * 2013-02-14 2014-08-15 Spal Automotive Srl ELECTRIC MACHINE.
JP6320104B2 (en) * 2014-03-24 2018-05-09 Ｇｋｎドライブラインジャパン株式会社 Driving force transmission device and vehicle equipped with driving force transmission device
CN111283657B (en) * 2018-12-06 2021-12-24 台达电子工业股份有限公司 Robot mechanism

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5316109B2 (en) * 1973-09-13 1978-05-30

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5316109U (en) * 1976-07-22 1978-02-10

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5316109B2 (en) * 1973-09-13 1978-05-30

Also Published As

Publication number Publication date
SG80791G (en) 1991-11-15
HK35991A (en) 1991-05-17
GB8607805D0 (en) 1986-04-30
GB2174253B (en) 1988-10-12
CN1017852B (en) 1992-08-12
KR860008638A (en) 1986-11-17
JPS61165068U (en) 1986-10-13
KR900003398Y1 (en) 1990-04-23
GB2174253A (en) 1986-10-29
CN86101921A (en) 1986-10-08

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