JPS608444Y2 - Printed circuit board heating element heat dissipation structure - Google Patents

Description

[Detailed description of the invention] The present invention relates to a heat dissipation structure for a heating element of a printed circuit board, and its purpose is to effectively utilize a flexible printed circuit board to dissipate heat from the heating element, and to improve the conductivity of the flexible printed circuit board. An object of the present invention is to provide a heat dissipation structure for a heat generating element of a printed circuit board in which insulation is achieved between the heat generating element and the heat generating element.

A conventional heat dissipation structure for a heat generating element of a printed circuit board, as shown in Japanese Utility Model Publication No. 55-11316, for example, involves inserting a terminal of a charging electronic component, which is a heating element, into a mounting hole of a printed circuit board.
The ends of the terminals were soldered to the printed circuit board, and the heat sink was fixed to the fins of the charging electronic component with screws, but if the charging electronic component came into contact with the synthetic resin material that makes up the casing, the synthetic resin There is a problem that the material deforms due to the heat, and if you try to reduce the heat generation of the charging electronic components by providing a heat sink on the charging electronic components to promote heat dissipation of the charging electronic components, Electronic parts become heavier,
If the charging electronic component is not firmly attached to the hard board, there is a problem that the fixing of the charging electronic component may become loose, resulting in poor contact or short circuit, which may damage the charging electronic component.

The present invention has been devised in view of the above-mentioned problems, and will be described below with reference to the drawings showing embodiments of the present invention.

1 to 5, a flexible printed circuit board 1 is formed by overlapping a flexible insulating film 2 and a conductive portion 3. As shown in FIG.

The conductive portion 3 is formed by patterning copper foil.

A rigid substrate 4 for reinforcement is placed on the conductive part 3 side of the flexible printed circuit board 1, leaving an end of the flexible printed circuit board 1.
are glued together.

The heating element 5 is made of an electronic component such as a resistor.

The terminals 7 of the heating element 5 inserted into the mounting holes 6 formed in the hard substrate 4 are fixed to the conductive part 3 by soldering.

By inserting and pushing the flexible printed circuit board 1 between the conductive part 3 and the hard substrate 4, the flexible printed circuit board 1 is brought into close contact with the outer periphery of the heating element 5. 1 is the conductive part 3
It is wrapped with the inner side.

As described above, the heating element heat dissipation structure of a printed circuit board according to the present invention forms a flexible printed circuit board by polymerizing a flexible insulating film and a conductive part, and forms a flexible printed circuit board in addition to a hard substrate having a heating element on one side. The flexible printed circuit board is arranged with the conductive portion interposed on the surface and an end portion of the flexible printed circuit board is left, and the heating element is wrapped around the end portion of the flexible printed circuit board. The heat generated by the heating element is transmitted to the conductive part superimposed on the hard substrate through the terminal of the heating element, and is radiated from the conductive plate, and is also transferred to the conductive part of the flexible printed circuit board wrapped around the circumferential body of the heating element. The heat is transmitted to the conductive plate and radiated from the conductive plate, and since the heat is radiated from the conductive plate with a large heat radiation area, the heat radiation effect is high, and further,
The heat generated in the heating element can be dissipated without increasing the weight of the heating element, and abnormal heat generation of the heating element can be prevented, and there is no need to strengthen the installation of the heating element. Furthermore, since the conductive part and the heating element can be insulated with an insulating film, the surface area of the flexible printed circuit board can be increased by stacking the conductive part over the heating element in multiple layers, increasing the heat dissipation effect. Furthermore, since the flexible printed circuit board pulls the heating element toward the hard substrate side, even if an impact force is applied to the heating element due to a fall, etc., the impact force is absorbed by the elastic force of the flexible printed circuit board, reducing the inertia of the heating element. This prevents the heating element from coming off the hard substrate, which has the effect of making the installation of the heating element more solid.

[Brief explanation of drawings]

The drawings show an embodiment of the heat dissipation structure for a heat generating element of a printed circuit board according to the present invention, and FIG. 1 is a perspective view of the external appearance before the flexible printed circuit board is wrapped around the heat generating element, and FIG. 2 is a plan view of the same. 3 is a side view of the same as above, FIG. 4 is a plan view of the flexible print base wrapped around a heating element, and FIG. 5 is a side view of the same. DESCRIPTION OF SYMBOLS 1... Flexible printed circuit board, 2... Curved edge film, 3... Conductive part, 4... Hard substrate, 5... Heat generating element.

Claims (1)

[Scope of utility model registration request] A flexible printed circuit board is formed by polymerizing a flexible insulating film and a conductive part, and the conductive part is interposed on the other side of a hard substrate having a heating element on one side, and the ends of the flexible printed circuit board are formed. 1. A heat dissipating structure for a heat generating element of a printed circuit board, characterized in that the flexible printed circuit board is disposed with the flexible printed circuit board left behind, and the heat generating element is wrapped around the end of the flexible printed circuit board.