JP3503221B2 - Electronic control unit - Google Patents
Electronic control unitInfo
- Publication number
- JP3503221B2 JP3503221B2 JP29745094A JP29745094A JP3503221B2 JP 3503221 B2 JP3503221 B2 JP 3503221B2 JP 29745094 A JP29745094 A JP 29745094A JP 29745094 A JP29745094 A JP 29745094A JP 3503221 B2 JP3503221 B2 JP 3503221B2
- Authority
- JP
- Japan
- Prior art keywords
- lead
- substrate
- component
- control unit
- coating portion
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Landscapes
- Casings For Electric Apparatus (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Mounting Of Printed Circuit Boards And The Like (AREA)
Description
【０００１】[0001]
【産業上の利用分野】本発明は、電子部品を実装すると
ともに片面に放熱のための金属板を形成する基板、およ
びその基板を収容するケーシングからなる電子制御ユニ
ットに関するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electronic control unit including a substrate on which electronic parts are mounted and a metal plate for heat dissipation is formed on one surface, and a casing for housing the substrate.
【０００２】[0002]
【従来の技術】従来の技術として、特表平５−５０８９
７２号公報に開示されている電子制御ユニットがある。
図３に上記従来技術の基板及びケーシングを含む電子制
御ユニットを組付けを模式的に描いたものを示す。この
電子制御ユニットは、図３に示されるように、金属貼付
基板を収容する場合のための特殊な形状のコネクタプラ
グを用いることによって、簡単な構造のケーシングを提
供するとともに、コネクタプラグの端子の露出部が他の
部分と干渉しないような構造になっている。2. Description of the Related Art As a conventional technique, Japanese Patent Laid-Open No. 5-5089
There is an electronic control unit disclosed in Japanese Patent Publication No. 72/72.
FIG. 3 shows a schematic drawing of the assembly of the electronic control unit including the above-mentioned conventional substrate and casing. This electronic control unit, as shown in FIG. 3, provides a casing having a simple structure by using a connector plug having a special shape for accommodating a metal-clad substrate, and at the same time, the terminal of the connector plug is The structure is such that the exposed part does not interfere with other parts.
【０００３】[0003]
【発明が解決しようとする課題】しかし、上記公報に開
示される電子制御ユニットでは、専用の特殊なコネクタ
を用いることによってコネクタピンの露出部を保護して
いるので、汎用タイプのコネクタを用いることはできず
に、これによって電子制御ユニットのコストが高くなっ
てしまう、という問題がある。また、コネクタ以外の電
子部品についても基板の一方の面に全て表面実装するこ
とが可能とは限らず、端子が基板の他方の面から露出す
ることがある。汎用コネクタを基板上に形成する場合に
おいて、コネクタのピン数が多くなるにつれて基板の表
面実装が困難となり、基板の他方の面にコネクタピンが
露出せざるを得ない。更に、コネクタプラグの実装面と
それ以外の電子部品の実装面とが異なっているために、
片面のみにコネクタプラグと電子部品とを実装するのに
較べてコストが高くなってしまう。However, in the electronic control unit disclosed in the above publication, since the exposed portion of the connector pin is protected by using the special connector for exclusive use, a general-purpose type connector is used. However, there is a problem in that the cost of the electronic control unit becomes high. In addition, not all electronic components other than the connector can be surface-mounted on one surface of the board, and terminals may be exposed from the other surface of the board. When a general-purpose connector is formed on a board, surface mounting of the board becomes difficult as the number of pins of the connector increases, and the connector pins are forced to be exposed on the other surface of the board. Furthermore, because the mounting surface of the connector plug and the mounting surface of other electronic components are different,
The cost is higher than when the connector plug and the electronic component are mounted on only one side.
【０００４】そこで、本発明では、低コストで、更に特
殊な形状のコネクタを用いることなく、汎用タイプのコ
ネクタの使用も可能となるような安価な電子制御ユニッ
トを提供することを技術的課題とする。Therefore, it is a technical object of the present invention to provide an inexpensive electronic control unit which is low in cost and allows the use of a general-purpose type connector without using a connector having a special shape. To do.
【０００５】[0005]
【課題を解決するための手段】上記課題を解決するため
に請求項１の発明は、一方の面に表面実装用電子部品お
よび基板の他方の面に突出するリード部を有するリード
部品を実装する基板と、前記基板の他方の面に前記リー
ド部を除く範囲内で固着され、前記電子部品の発熱を放
熱する金属板と、前記基板の一方の面側に配置され、実
装部品を覆う部品被覆部と、前記基板の他方の面側に配
置され、前記金属板が直接外気に触れた状態のもとで前
記リード部品のリード部を覆うリード被覆部と、を備え
るようにした。In order to solve the above problems, the invention of claim 1 mounts a surface mounting electronic component on one surface and a lead component having a lead portion protruding on the other surface of the substrate. a substrate, is fixed in a range excluding the Lee <br/> de portion on the other surface of the substrate, release the heat generation of the electronic component
A metal plate that heats, a component covering portion that is arranged on one surface side of the substrate and covers mounted components, and a component covering portion that is arranged on the other surface side of the substrate, and the metal plate is directly exposed to the outside air. In front
And a lead coating portion that covers the lead portion of the lead component.
【０００６】請求項２の発明は、請求項１において、前
記部品被覆部は、前記リード被覆部とは別体で形成さ
れ、前記リード被覆部と前記部品被覆部との間に少なく
とも前記基板あるいは金属板の一方を挟み込んで固定す
るようにした。According to a second aspect of the present invention, in the first aspect, the component coating portion is formed separately from the lead coating portion, and at least the substrate or the space is provided between the lead coating portion and the component coating portion. One side of the metal plate was sandwiched and fixed.
【０００７】請求項３の発明は、基板と、該基板の一方
の面に実装される表面実装用電子部品と、前記基板の一
方の面に実装され、前記基板を貫通して前記基板に固定
されるリード部を有するコネクタと、前記基板の他方の
面に前記リード部を除く範囲内で固着され、前記電子部
品の発熱を放熱する金属板と、前記基板の一方の面側に
配置され、実装部品を覆う部品被覆部と、前記基板の他
方の面側に配置され、前記金属板が直接外気に触れた状
態のもとで前記リード部を覆うリード被覆部と、を備え
るようにした。According to a third aspect of the present invention, a board, a surface-mounting electronic component mounted on one surface of the board, and a surface mounted electronic component mounted on one surface of the board are fixed to the board by penetrating the board. a connector having a lead portion to be, secured within range excluding the lead portion on the other surface of the substrate, the electronics
A metal plate that dissipates the heat generated by the product, a component covering portion that is arranged on one surface side of the board and covers mounted components, and a metal plate that is arranged on the other surface side of the board, and the metal plate directly touches the outside air. Condition
And a lead coating portion that covers the lead portion under a state .
【０００８】請求項４の発明は、請求項３において、前
記部品被覆部は、前記リード被覆部とは別体で形成さ
れ、前記リード被覆部と前記部品被覆部との間に前記基
板あるいは金属板を挟み込んで固定するようにした。According to a fourth aspect of the present invention, in the third aspect, the component coating portion is formed separately from the lead coating portion, and the substrate or the metal is provided between the lead coating portion and the component coating portion. The board was sandwiched and fixed.
【０００９】請求項５の発明は、請求項３において、前
記部品被覆部は前記コネクタの接続側の面が切り取られ
た形状をしており、前記コネクタの接続側の面に前記コ
ネクタを保持する蓋を備えるようにした。According to a fifth aspect of the present invention, in the third aspect, the component covering portion has a shape in which the surface on the connection side of the connector is cut off, and the connector is held on the surface on the connection side of the connector. It was equipped with a lid.
【００１０】ここで、本発明におけるリード部品とは、
基板に実装する際にリード部が基板の裏側に露出する電
子部品を総称したものである。また、本発明では、コン
ピュータのみではなく、センシング部分を含むセンサ内
蔵コンピュータや、駆動部分を含むアクチュエータ一体
型のコンピュータ等の、電子部品を含む装置を総称して
電子制御ユニットとする。Here, the lead component in the present invention means
This is a general term for electronic components whose lead portions are exposed on the back side of the substrate when mounted on the substrate. Further, in the present invention, not only a computer but also a device including electronic parts such as a computer with a built-in sensor including a sensing part and a computer with an actuator including a driving part are collectively referred to as an electronic control unit.
【００１１】[0011]
【作用】請求項１の発明によると、基板に固着する金属
板はリード部品のリード部を除く範囲内で電子部品が発
生する熱を、直接外気に触れた金属板より外部に放熱し
ている。本発明では基板の一方の面を覆う部品被覆部の
他に、リード部品のリード部を覆うリード被覆部を設け
たことにより、リード部を保護することが可能になる。According to the first aspect of the invention, the metal plate fixed to the substrate radiates the heat generated by the electronic component to the outside from the metal plate which is in direct contact with the outside air within the range excluding the lead portion of the lead component. . In the present invention, in addition to the component coating portion that covers one surface of the substrate, the lead coating portion that covers the lead portion of the lead component is provided, so that the lead portion can be protected.
【００１２】請求項２の発明によると、部品被覆部とリ
ード被覆部とを別体にして、部品被覆部とリード被覆部
の間に金属板を固着した基板を挟み込んで両者が係合す
ることにより基板を固定している。According to the second aspect of the present invention, the component coating portion and the lead coating portion are separated from each other, and the substrate to which the metal plate is fixed is sandwiched between the component coating portion and the lead coating portion so that they are engaged with each other. The substrate is fixed by.
【００１３】請求項３の発明によると、基板に固着する
金属板はコネクタのリード部を除く範囲内で電子部品が
発生する熱を、直接外気に触れた金属板より外部に放熱
する。また、部品被覆部の他にリード部品のリード部を
覆うリード被覆部を設けたことにより、リード部を保護
することが可能になる。従って、汎用のコネクタを用い
ることが可能になる。[0013] radiator according to the invention of claim 3, metal plate fixed to the substrate a heat electronic components within are <br/> occur except the lead portion of the connector, outside from the metal plate touches the outside air directly To do. Further, by providing the lead coating portion that covers the lead portion of the lead component in addition to the component coating portion, the lead portion can be protected. Therefore, a general-purpose connector can be used.
【００１４】請求項４の発明によると、部品被覆部とリ
ード被覆部とを別体にして、部品被覆部とリード被覆部
の間に金属板を固着した基板を挟み込んで両者が係合す
ることにより基板を固定している。According to the fourth aspect of the present invention, the component coating portion and the lead coating portion are separated from each other, and the substrate to which the metal plate is fixed is sandwiched between the component coating portion and the lead coating portion so that they are engaged with each other. The substrate is fixed by.
【００１５】請求項５の発明によると、部品被覆部とリ
ード被覆部とを一体に形成したことで、電子制御ユニッ
トを組付ける際に、部品被覆部に対してリード被覆部を
位置決めする必要がなくなる。According to the fifth aspect of the present invention, since the component coating portion and the lead coating portion are integrally formed, it is necessary to position the lead coating portion with respect to the component coating portion when the electronic control unit is assembled. Disappear.
【００１６】[0016]
【実施例】本発明の実施例を図面を参照して説明する。
図１は本発明の第１実施例の電子制御ユニットの組付け
るときの斜視図である。Embodiments of the present invention will be described with reference to the drawings.
FIG. 1 is a perspective view of the electronic control unit according to the first embodiment of the present invention when it is assembled.
【００１７】第１実施例で説明する電子制御ユニット
は、車載コンピュータとして自動車のエンジンルーム内
に搭載されるものである。The electronic control unit described in the first embodiment is installed as an in-vehicle computer in the engine room of an automobile.
【００１８】第１実施例の構成について説明する。電子
制御ユニット１０に含まれる基板１１は一方の面１１ａ
に表面実装用電子部品１２およびリード部品であるコネ
クタ１３を実装するとともに、基板１１の他方の面１１
ｂにコネクタ１３のリード部１４が突出し、リード部１
４が形成される部分を除いて他方の面１１ｂに金属板１
５を形成している。また、この電子制御ユニット１０
は、基板１１以外に基板の一方の面１１ａを収容する部
品被覆部１６と、他方の面１１ｂのリード部１４の露出
部１４ａを覆うリード被覆部１７とから構成されてい
る。The configuration of the first embodiment will be described. The substrate 11 included in the electronic control unit 10 has one surface 11a.
The surface-mounting electronic component 12 and the connector 13, which is a lead component, are mounted on the other surface 11 of the substrate 11.
The lead portion 14 of the connector 13 projects into the
The metal plate 1 is formed on the other surface 11b except the part where the metal plate 4 is formed.
5 is formed. Also, this electronic control unit 10
In addition to the substrate 11, the component coating portion 16 accommodates one surface 11a of the substrate and a lead coating portion 17 that covers the exposed portion 14a of the lead portion 14 on the other surface 11b.
【００１９】本実施例では、部品被覆部１６とリード被
覆部１７に樹脂を、金属板１５には放熱性に優れたアル
ミニウムをそれぞれ好適な材料として用いた。また、コ
ネクタ１３は、本実施例では日本ＡＭＰ製コネクタ（品
番２−１７７５４２−１、４２ピン）を用いた。In this embodiment, resin is used for the component coating portion 16 and the lead coating portion 17, and aluminum, which is excellent in heat dissipation, is used for the metal plate 15, respectively. Further, as the connector 13, a connector manufactured by Japan AMP (product number 2-177542-1, 42 pins) is used in this embodiment.
【００２０】次に、第１実施例の電子制御ユニット１０
の組付けについて図１を参照して説明する。Next, the electronic control unit 10 of the first embodiment
Assembling will be described with reference to FIG.
【００２１】図１における矢印は、基板１１と部品被覆
部１６、リード被覆部１７の組付けの方向を示してい
る。電子制御ユニット１０の組付けについて簡単に説明
する。The arrow in FIG. 1 indicates the direction of assembling the substrate 11, the component coating portion 16 and the lead coating portion 17. The assembly of the electronic control unit 10 will be briefly described.
【００２２】先ず、基板１１の一片に形成される凸部
を、図１に示す矢印の如く、部品被覆部１６に設けられ
た凹部１６ａに入れて、次に基板１１の端を部品被覆部
１６の内周に沿って嵌め込む。そして、基板１１の金属
板１５側からリード部１４を覆うようにリード部１４の
露出部１４ａを覆うリード被覆部１７を、部品被覆部１
６に形成される係合部１６ｂとリード被覆部１７に形成
される係合部１７ａとを係合させて基板１１を部品被覆
部１６とリード被覆部１７の間に挟み込んで固定する。First, the convex portion formed on one piece of the substrate 11 is put into the concave portion 16a provided in the component covering portion 16 as shown by the arrow in FIG. Fit along the inner circumference of. Then, the lead coating portion 17 that covers the exposed portion 14a of the lead portion 14 so as to cover the lead portion 14 from the metal plate 15 side of the substrate 11 is attached to the component coating portion 1
The engagement portion 16b formed in 6 and the engagement portion 17a formed in the lead coating portion 17 are engaged with each other to sandwich and fix the substrate 11 between the component coating portion 16 and the lead coating portion 17.
【００２３】第１実施例によると、汎用のコネクタを用
いても基板１１を収容する電子制御ユニット１０が複雑
は形状になることなく、更に、リード被覆部１７はリー
ド部１４を収容するとともに、電子制御ユニット１０は
基板１１を固定することができる。According to the first embodiment, even if a general-purpose connector is used, the electronic control unit 10 for accommodating the board 11 does not have a complicated shape, and the lead coating portion 17 accommodates the lead portion 14, and The electronic control unit 10 can fix the substrate 11.
【００２４】次に本発明の第２実施例について説明す
る。図２は本発明の第２実施例の電子制御ユニット２０
を組付けるときの斜視図である。Next, a second embodiment of the present invention will be described. FIG. 2 shows an electronic control unit 20 according to the second embodiment of the present invention.
It is a perspective view when assembling.
【００２５】第２実施例の構成について説明する。第２
実施例の電子制御ユニット２０は、部品被覆部２１とリ
ード被覆部２２を一体に形成した場合の実施例である。
基板２３及びコネクタ２４は第１実施例と同じものを用
いることとして、説明は省略する。The configuration of the second embodiment will be described. Second
The electronic control unit 20 of the embodiment is an embodiment in which the component coating portion 21 and the lead coating portion 22 are integrally formed.
Since the board 23 and the connector 24 are the same as those in the first embodiment, the description thereof will be omitted.
【００２６】次に、第２実施例の電子制御ユニット２０
の組付け方法について説明する。図２の矢印は、第１実
施例と同様に基板２３を部品被覆部２１およびリード被
覆部２２に収容する際の組付けの方向を示している。金
属板を固着する基板２３の他方の面２３ａを部品被覆部
２１の開口面２０ａとなるようにして基板２３の端を部
品被覆部２１の内周面に形成された溝２１ａに沿ってス
ライドさせて嵌め込んでいく。本実施例では基板２３を
溝２１ａに嵌め込んだ後、コネクタ２４における接続、
取り外しにより基板２３が抜け落ちるのを防止するため
に蓋２５を部品被覆部２１に取り付けている。リード被
覆部２２は部品被覆部２１の開口面２０ａ側に一体成形
にて形成されているので、両者を組付ける工数がかから
ない。また、基板２３を部品被覆部２１に嵌め込むこと
によってコネクタ２４のリード部２６の露出部２６ａを
覆うことができる。Next, the electronic control unit 20 of the second embodiment.
The assembling method will be described. The arrow in FIG. 2 indicates the direction of assembly when the substrate 23 is housed in the component coating portion 21 and the lead coating portion 22 as in the first embodiment. The other surface 23a of the substrate 23 to which the metal plate is fixed becomes the opening surface 20a of the component covering portion 21, and the end of the substrate 23 is slid along the groove 21a formed on the inner peripheral surface of the component covering portion 21. Fit in. In this embodiment, after the board 23 is fitted into the groove 21a, the connection at the connector 24 is made,
A lid 25 is attached to the component covering portion 21 in order to prevent the substrate 23 from falling off due to removal. Since the lead coating portion 22 is integrally formed on the opening surface 20a side of the component coating portion 21, the man-hour for assembling the both is not required. Further, by fitting the board 23 into the component covering portion 21, the exposed portion 26a of the lead portion 26 of the connector 24 can be covered.
【００２７】上記第１及び第２実施例において、コネク
タのリード部を表面実装用電子部品と同様に基板に表面
実装することが考えられるが、現在のコネクタではピン
数が多くなるにつれて表面実装が困難になるため、基板
の他方の面にリード部が突出せざるを得ない。また、コ
ネクタは車輌に搭載されるバッテリーやアクチュエー
タ、センサ（図示せず）等に接続されるものとする。In the first and second embodiments described above, it is conceivable that the lead portion of the connector is surface-mounted on the substrate in the same manner as the surface-mounting electronic component. However, in the current connector, the surface-mounting is performed as the number of pins increases. Since it becomes difficult, the lead portion has to be projected on the other surface of the substrate. Further, the connector is connected to a battery, an actuator, a sensor (not shown), etc. mounted on the vehicle.
【００２８】本発明は、本実施例のコネクタのリード部
以外に、それ以外の電子部品のリード部が基板の他方の
面に突出してしまうときにも適用することができる。The present invention can be applied to the case where the lead portion of the electronic component other than the lead portion of the connector of this embodiment projects to the other surface of the substrate.
【００２９】[0029]
【発明の効果】請求項１の電子制御ユニットは、基板の
一方の面のみに表面実装用電子部品やコネクタを含む電
子部品を実装することができるので、基板の両面に電子
部品を実装するものに較べて部品の実装が容易、且つ低
コストでできる。また、基板の一方の面およびリード部
は部品被覆部及びリード被覆部に覆われるので、電子制
御ユニットとしての信頼性が向上する。また、表面実装
用電子部品の下部が基板を介して金属板から直接外気に
触れるので、放熱性がよい。According to the electronic control unit of the present invention, the electronic components including the surface mounting electronic component and the connector can be mounted on only one surface of the substrate, so that the electronic components are mounted on both surfaces of the substrate. Compared with the above, it is possible to mount components easily and at low cost. Moreover, since the one surface of the substrate and the lead portion are covered with the component coating portion and the lead coating portion, the reliability of the electronic control unit is improved. Further, since the lower portion of the surface-mounting electronic component comes into direct contact with the outside air from the metal plate via the substrate, heat dissipation is good.
【００３０】請求項２の電子制御ユニットは、請求項１
に加え、リード被覆部がリード部を保護するとともに部
品被覆部とリード被覆部が基板および金属板を挟み込む
ことによって基板および金属板を確実に固定することが
可能になる。The electronic control unit according to a second aspect of the present invention is the electronic control unit according to the first aspect.
In addition, the lead coating portion protects the lead portion, and the component coating portion and the lead coating portion sandwich the substrate and the metal plate, so that the substrate and the metal plate can be reliably fixed.
【００３１】請求項３の電子制御ユニットは、コネクタ
のリード部が基板の他方の面から突出するような場合に
おいても、リード被覆部が確実に覆っているので、特殊
な形状のコネクタを用いることなく、汎用のコネクタを
用いてもコネクタのリード部を容易に保護することがで
きるので、低コストな電子制御ユニットを提供すること
ができる。In the electronic control unit according to a third aspect of the present invention, even if the lead portion of the connector projects from the other surface of the substrate, the lead coating portion surely covers the connector. Therefore, a connector having a special shape should be used. Even if a general-purpose connector is used, the lead portion of the connector can be easily protected, so that a low-cost electronic control unit can be provided.
【００３２】請求項４の電子制御ユニットは、請求項３
に加え、リード被覆部がリード部を保護するとともに部
品被覆部とリード被覆部が基板および金属板を挟み込む
ことによって基板および金属板を確実に固定することが
可能になる。The electronic control unit of claim 4 is the same as that of claim 3.
In addition, the lead coating portion protects the lead portion, and the component coating portion and the lead coating portion sandwich the substrate and the metal plate, so that the substrate and the metal plate can be reliably fixed.
【００３３】請求項５の電子制御ユニットは、請求項３
に加え、部品被覆部とリード被覆部とを一体に形成した
ことで、電子制御ユニットを組付ける際に部品被覆部に
対してリード被覆部を位置決めする必要がなくなり、組
付け工数が減少する。The electronic control unit of claim 5 is the electronic control unit of claim 3.
In addition, since the component coating portion and the lead coating portion are integrally formed, it is not necessary to position the lead coating portion with respect to the component coating portion when assembling the electronic control unit, and the number of assembling steps is reduced.
【図１】本発明の第１実施例の電子制御ユニットの斜視
図である。FIG. 1 is a perspective view of an electronic control unit according to a first embodiment of the present invention.
【図２】本発明の第２実施例の電子制御ユニットの斜視
図である。FIG. 2 is a perspective view of an electronic control unit according to a second embodiment of the present invention.
【図３】従来の電子制御ユニットの模式図である。FIG. 3 is a schematic diagram of a conventional electronic control unit.
１０、２０・・・電子制御ユニット １１、２３・・・基板 １２・・・電子部品 １３、２４・・・コネクタ １４、２６・・・リード部 １５・・・金属板 １６、２１・・・部品被覆部 １７、２２・・・リード被覆部 ２５・・・蓋 10, 20 ... Electronic control unit 11, 23 ... Substrate 12 ... Electronic parts 13, 24 ... Connector 14, 26 ... Lead part 15 ... Metal plate 16, 21 ... Parts coating 17, 22 ... Lead coating 25 ... Lid
フロントページの続き (56)参考文献 特開 平４−219996（ＪＰ，Ａ) 特開 平７−86773（ＪＰ，Ａ) 実開 平６−62579（ＪＰ，Ｕ) 実開 平２−98694（ＪＰ，Ｕ) 実開 昭56−106499（ＪＰ，Ｕ) 実開 昭53−161252（ＪＰ，Ｕ) 実開 昭63−65296（ＪＰ，Ｕ) 実開 昭63−24876（ＪＰ，Ｕ) 特表 平５−508972（ＪＰ，Ａ) (58)調査した分野(Int.Cl.7，ＤＢ名) H05K 7/20 H05K 7/14 H05K 5/00 - 5/06 Continuation of the front page (56) Reference JP-A-4-219996 (JP, A) JP-A-7-86773 (JP, A) Actually open 6-62579 (JP, U) Actually open 2-98694 (JP , U) Actual opening 56-106499 (JP, U) Actual opening Sho 53-161252 (JP, U) Actual opening Sho 63-65296 (JP, U) Actual opening Sho 63-24876 (JP, U) Special table flat 5-508972 (JP, A) (58) Fields investigated (Int.Cl. 7 , DB name) H05K 7/20 H05K 7/14 H05K 5/00-5/06
Claims (5)
板の他方の面に突出するリード部を有するリード部品を
実装する基板と、 前記基板の他方の面に前記リード部を除く範囲内で固着
され、前記電子部品の発熱を放熱する金属板と、 前記基板の一方の面側に配置され、実装部品を覆う部品
被覆部と、 前記基板の他方の面側に配置され、前記金属板が直接外
気に触れた状態のもとで前記リード部品のリード部を覆
うリード被覆部と、を備える電子制御ユニット。1. A surface-mounting electronic component and a substrate on one surface.
Is fixed within a range excluding a substrate for mounting a lead component having a lead portion protruding to the other surface of the plate, the lead portion on the other surface of the substrate, a metal plate for radiating heat generated in the electronic component, The component covering portion is disposed on one surface side of the board and covers the mounted components, and is disposed on the other surface side of the board , and the metal plate is directly outside.
An electronic control unit comprising: a lead coating portion that covers a lead portion of the lead component under a condition of being touched .
れ、 前記リード被覆部と前記部品被覆部との間に少なくとも
前記基板あるいは金属板の一方を挟み込んで固定するこ
とを特徴とする電子制御ユニット。2. The electronic control unit according to claim 1, wherein the component coating portion is formed separately from the lead coating portion, and at least the substrate or the metal is provided between the lead coating portion and the component coating portion. An electronic control unit characterized by sandwiching and fixing one side of the plate.
記基板に固定されるリード部を有するコネクタと、 前記基板の他方の面に前記リード部を除く範囲内で固着
され、前記電子部品の発熱を放熱する金属板と、 前記基板の一方の面側に配置され、実装部品を覆う部品
被覆部と、 前記基板の他方の面側に配置され、前記金属板が直接外
気に触れた状態のもとで前記リード部を覆うリード被覆
部と、を備える電子制御ユニット。3. A substrate, a surface-mounting electronic component mounted on one surface of the substrate, and a front surface mounting electronic component mounted on one surface of the substrate, penetrating the substrate.
A connector having a lead portion fixed to serial board, is fixed within a range excluding the lead portion on the other surface of the substrate, a metal plate for radiating heat generated in the electronic component, one side of the substrate Is placed on the other side of the board, and the metal plate is directly exposed to the outside.
An electronic control unit , comprising: a lead coating portion that covers the lead portion in a state of being touched .
れ、 前記リード被覆部と前記部品被覆部との間に前記基板あ
るいは金属板を挟み込んで固定することを特徴とする電
子制御ユニット。4. The electronic control unit according to claim 3, wherein the component coating portion is formed separately from the lead coating portion, and the substrate or the metal plate is provided between the lead coating portion and the component coating portion. An electronic control unit characterized by sandwiching and fixing.
れた形状をしており、 前記コネクタの接続側の面に前記コネクタを保持する蓋
を備えることを特徴とする電子制御ユニット。5. The electronic control unit according to claim 3, wherein the component covering portion has a shape in which a surface on the connection side of the connector is cut off, and a lid for holding the connector on the surface on the connection side of the connector. An electronic control unit comprising:
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP29745094A JP3503221B2 (en) | 1994-11-30 | 1994-11-30 | Electronic control unit |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP29745094A JP3503221B2 (en) | 1994-11-30 | 1994-11-30 | Electronic control unit |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH08162779A JPH08162779A (en) | 1996-06-21 |
| JP3503221B2 true JP3503221B2 (en) | 2004-03-02 |
Family
ID=17846672
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP29745094A Expired - Fee Related JP3503221B2 (en) | 1994-11-30 | 1994-11-30 | Electronic control unit |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP3503221B2 (en) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5173668B2 (en) * | 2008-08-18 | 2013-04-03 | 株式会社ミツバ | Motor with reduction mechanism |
| JP5413443B2 (en) * | 2011-12-12 | 2014-02-12 | 株式会社デンソー | Electronic equipment |
| JP2015160482A (en) * | 2014-02-26 | 2015-09-07 | 株式会社デンソー | Actuator for brake fluid pressure control |
-
1994
- 1994-11-30 JP JP29745094A patent/JP3503221B2/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JPH08162779A (en) | 1996-06-21 |
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