JP6192422B2 - Car electronics - Google Patents

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JP6192422B2
JP6192422B2 JP2013166392A JP2013166392A JP6192422B2 JP 6192422 B2 JP6192422 B2 JP 6192422B2 JP 2013166392 A JP2013166392 A JP 2013166392A JP 2013166392 A JP2013166392 A JP 2013166392A JP 6192422 B2 JP6192422 B2 JP 6192422B2
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vehicle
metal
circuit board
bracket
electronic device
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JP2015033950A (en
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雄二郎 阿部
雄二郎 阿部
正寛 金丸
正寛 金丸
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Mitsubishi Electric Corp
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Mitsubishi Electric Corp
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この発明は、車両に搭載されるメディアドライブ装置、オーディオ装置などの車載電子機器に関するものである。   The present invention relates to an in-vehicle electronic device such as a media drive device and an audio device mounted on a vehicle.

車載電子機器は、車両走行の振動に対する強度および電磁シールド性能を確保しつつ、塵、水、および車両への取り付けハンドリングなどから電子部品を保護するために、外装を金属製の筐体で構成している場合が多く、重量化を招いていた。   In-vehicle electronic devices have a metal casing on the exterior to protect the electronic components from dust, water, and attachment to the vehicle while ensuring the strength against vibration and electromagnetic shielding performance of the vehicle. In many cases, the weight was increased.

近年、車両の燃費改善の要望により、車載電子機器の重量軽減が求められている。そこで、例えば特許文献1〜3では、筐体を樹脂部材で構成して軽量化を図っていた。   In recent years, weight reduction of in-vehicle electronic devices has been demanded due to demands for improving fuel consumption of vehicles. Thus, for example, in Patent Documents 1 to 3, the casing is made of a resin member to reduce the weight.

実開平3−66088号公報Japanese Utility Model Publication No. 3-66088 特開2008−174124号公報JP 2008-174124 A 特開2008−174129号公報JP 2008-174129 A

しかしながら、上記特許文献1では、回路基板を保持する金属ホルダを樹脂製筐体内に固定し、この樹脂製筐体を挟んで金属ホルダを車両側へねじ止めするよう構成されているので、車両走行により発生する振動負荷に対する強度が弱いという課題があった。   However, in Patent Document 1, the metal holder that holds the circuit board is fixed in the resin casing, and the metal holder is screwed to the vehicle with the resin casing interposed therebetween. There is a problem that the strength against the vibration load generated by the is weak.

これに対し、上記特許文献2,3の樹脂製筐体には長方形状の切欠きが形成され、樹脂製筐体内に固定された金属ホルダを切欠き部分に露出させて車両側へ直接ねじ止めすることができ、振動負荷に対する強度を高めることができる。その一方で、樹脂製筐体を筐体本体部と筐体天板部とに分割して筐体本体部の縁部に切欠きを形成したことにより、筐体としての強度が確保しにくいという課題があった。また、筐体に2部品を要するので、組立性および経済性の面で効率的でなかった。   In contrast, the resin casings of Patent Documents 2 and 3 have a rectangular cutout, and a metal holder fixed in the resin casing is exposed to the cutout portion and screwed directly to the vehicle side. The strength against vibration load can be increased. On the other hand, it is difficult to ensure the strength of the housing by dividing the resin housing into a housing body and a housing top plate and forming notches at the edges of the housing body. There was a problem. Moreover, since two parts are required for the housing, it is not efficient in terms of assemblability and economy.

この発明は、上記のような課題を解決するためになされたもので、耐振性能および電磁シールド性能などの車載性能を満たしつつ軽量化を実現した車載電子機器を提供することを目的とする。   The present invention has been made to solve the above-described problems, and an object of the present invention is to provide a vehicle-mounted electronic device that achieves weight reduction while satisfying vehicle-mounted performance such as vibration proof performance and electromagnetic shielding performance.

この発明に係る車載電子機器は、デバイスと、デバイスに電気的に接続された回路基板と、デバイスおよび回路基板を保持すると共に、車両に設けられた金属製の固定部に取り付けられる金属製のブラケットと、1部品からなり、デバイス、回路基板およびブラケットを収納する樹脂製の筐体と、ブラケットに固定される金属製の放熱部材を備え、筐体は、ブラケットと車両の固定部との取り付け部分に穴を有し、ブラケットは、筐体の穴から車両の固定部に露出して当該固定部に直接取り付けられ、回路基板の発熱部品を収納する位置に開口部を有し、当該開口部が前記放熱部材で塞がれているようにしたものである。 An in-vehicle electronic device according to the present invention includes a device, a circuit board electrically connected to the device, a metal bracket that holds the device and the circuit board, and is attached to a metal fixing portion provided in the vehicle. And a resin casing that houses the device, the circuit board, and the bracket, and a metal heat dissipating member that is fixed to the bracket. The casing is an attachment portion between the bracket and the vehicle fixing portion. has a hole in the bracket is exposed from the hole of the casing to the fixed part of the vehicle directly attached, et al is to the fixing portion has an opening at a position for accommodating the heat generating components of the circuit board, the opening Is closed by the heat dissipating member .

この発明によれば、樹脂製の筐体を用いることにより重量を軽減でき、かつ、内部部品を塵、水、車両への取り付けハンドリングから保護できる。また、筐体に穴をあけてブラケットを車両の固定部に直接取り付けることにより、筐体としての強度を確保しながらデバイスと回路基板の振動を抑制でき、耐振性能が向上する。さらに、デバイスおよび回路基板がブラケットを介して車両の固定部に電気的に接続されることにより電磁シールド性能が向上する。従って、耐振性能および電磁シールド性能などの車載性能を満たしつつ軽量化を実現した車載電子機器を提供することができる。   According to the present invention, the weight can be reduced by using the resin casing, and the internal parts can be protected from dust, water, and mounting on the vehicle. Further, by drilling a hole in the housing and directly attaching the bracket to the fixed portion of the vehicle, vibration of the device and the circuit board can be suppressed while securing the strength as the housing, and the vibration resistance performance is improved. Furthermore, the electromagnetic shielding performance is improved by electrically connecting the device and the circuit board to the fixed portion of the vehicle via the bracket. Therefore, it is possible to provide an in-vehicle electronic device that achieves weight reduction while satisfying in-vehicle performance such as vibration resistance and electromagnetic shielding performance.

この発明の実施の形態1に係る車載電子機器の基本構造を示す斜視図である。It is a perspective view which shows the basic structure of the vehicle-mounted electronic device which concerns on Embodiment 1 of this invention. 図1の車載電子機器を組み立てた状態を示す斜視図である。It is a perspective view which shows the state which assembled the vehicle-mounted electronic device of FIG. 図1の枠線A内の断面構造を示す拡大図である。It is an enlarged view which shows the cross-section in the frame line A of FIG. 実施の形態1に係る車載電子機器の具体例を示す斜視図である。FIG. 3 is a perspective view showing a specific example of the in-vehicle electronic device according to the first embodiment. 図4の車載電子機器の組み立て手順を説明する図である。It is a figure explaining the assembly procedure of the vehicle-mounted electronic device of FIG. 図4の車載電子機器の組み立て手順を説明する図であり、図5の続きを示す。FIG. 6 is a diagram for explaining an assembly procedure of the on-vehicle electronic device in FIG. 4 and shows a continuation of FIG. 5. 図4の車載電子機器の組み立て手順を説明する図であり、図6の続きを示す。FIG. 7 is a diagram for explaining an assembly procedure of the on-vehicle electronic device of FIG. 4 and shows a continuation of FIG. 6. 図4の車載電子機器の組み立て手順を説明する図であり、図7の続きを示す。FIG. 8 is a diagram for explaining an assembly procedure of the on-vehicle electronic device of FIG. 4 and shows a continuation of FIG. 7. 図4の車載電子機器を後側から見た斜視図である。It is the perspective view which looked at the vehicle-mounted electronic device of FIG. 4 from the rear side. 図9の車載電子機器のうち、樹脂筐体の穴から露出した金属ブラケットの取り付け部を拡大した図である。It is the figure which expanded the attachment part of the metal bracket exposed from the hole of the resin housing | casing among the vehicle-mounted electronic devices of FIG.

実施の形態1.
図1および図2に示すように、本実施の形態1に係る車載電子機器1は、機械構造を有するデバイス10と、デバイス10を制御する回路基板20と、デバイス10と回路基板20を保持する金属ブラケット30,40と、外装となる樹脂筐体50とを備えている。例えば、車載電子機器1をオーディオ装置に適用した場合はディスク再生装置がデバイス10に相当する。
この車載電子機器1は、車両に設けられた金属固定部(不図示)に取り付けられる。
Embodiment 1 FIG.
As shown in FIGS. 1 and 2, the in-vehicle electronic device 1 according to the first embodiment holds a device 10 having a mechanical structure, a circuit board 20 that controls the device 10, and the device 10 and the circuit board 20. Metal brackets 30 and 40 and a resin casing 50 as an exterior are provided. For example, when the in-vehicle electronic device 1 is applied to an audio device, the disk reproducing device corresponds to the device 10.
The in-vehicle electronic device 1 is attached to a metal fixing part (not shown) provided in the vehicle.

デバイス10および回路基板20は金属ブラケット30,40に直接固定される。図示例では、重量部品であるデバイス10が金属ブラケット30,40で挟まれ、金属ブラケット30,40それぞれから2箇所、計4箇所程度をねじ101〜104で固定されている。回路基板20は、図3の拡大図に示すように金属ブラケット30の折曲がった下端部から2箇所程度をねじ105で固定されている。金属ブラケット40側も同様に回路基板20にねじ止めされている。   The device 10 and the circuit board 20 are directly fixed to the metal brackets 30 and 40. In the illustrated example, the device 10 which is a heavy component is sandwiched between metal brackets 30 and 40, and two places from each of the metal brackets 30 and 40 are fixed by screws 101 to 104. As shown in the enlarged view of FIG. 3, the circuit board 20 is fixed with screws 105 at about two places from the bent lower end of the metal bracket 30. The metal bracket 40 side is similarly screwed to the circuit board 20.

樹脂筐体50は、塵、水、および車両への取り付けハンドリングなどからデバイス10および回路基板20を保護するための外装である。樹脂筐体50の前側にはデバイス10等を挿入する前面開口部51が設けられている。また、樹脂筐体50の両側には、金属ブラケット30,40の取り付け部31,41を露出させるための穴52,53が形成されている。   The resin casing 50 is an exterior for protecting the device 10 and the circuit board 20 from dust, water, and handling attachment to a vehicle. A front opening 51 into which the device 10 or the like is inserted is provided on the front side of the resin casing 50. Further, holes 52 and 53 for exposing the attachment portions 31 and 41 of the metal brackets 30 and 40 are formed on both sides of the resin casing 50.

図1において、金属ブラケット30,40と一体化したデバイス10および回路基板20は、樹脂筐体50の前側に開口した前面開口部51からスロットインされて、樹脂筐体50の内部に収納され、図2の状態になる。このとき、樹脂筐体50の両側面に開口した穴52,53から、金属ブラケット30,40の取り付け部31,41が外部に露出した状態になる。取り付け部31,41にはねじ穴32,33,42,43が設けられており、ねじ(不図示)を使用して、取り付け部31,41と車両の金属固定部とが直締めされる。   In FIG. 1, the device 10 and the circuit board 20 integrated with the metal brackets 30 and 40 are slotted in from the front opening 51 opened to the front side of the resin casing 50, and are accommodated in the resin casing 50. It will be in the state of FIG. At this time, the mounting portions 31 and 41 of the metal brackets 30 and 40 are exposed to the outside through the holes 52 and 53 opened on both side surfaces of the resin casing 50. Screw holes 32, 33, 42, and 43 are provided in the attachment portions 31 and 41, and the attachment portions 31 and 41 and the metal fixing portion of the vehicle are directly tightened using screws (not shown).

先立って説明した特許文献1の場合、金属ブラケットと車両の金属固定部との間に樹脂筐体を挟んだ状態で共締めするため、樹脂筐体のへたりによるガタの発生が懸念され、車両走行の振動に対する強度を十分に確保できない恐れがあった。
これに対し、図1〜図3の構成では、金属ブラケット30,40の取り付け部31,41を車両の金属固定部に直締めするため、耐振性能が向上する。よって、車両走行により発生する振動負荷に対して重量部品であるデバイス10の振れを抑制することが可能である。
In the case of Patent Document 1 described in advance, since the resin casing is fastened together with the metal bracket sandwiched between the metal bracket and the vehicle's metal fixing portion, there is a concern about the occurrence of looseness due to the sag of the resin casing. There was a risk that the strength against vibration during running could not be secured sufficiently.
On the other hand, in the structure of FIGS. 1-3, since the attachment parts 31 and 41 of the metal brackets 30 and 40 are directly fastened to the metal fixing part of a vehicle, vibration proof performance improves. Therefore, it is possible to suppress the shake of the device 10 which is a heavy component with respect to the vibration load generated by the vehicle traveling.

また、先立って説明した特許文献2,3の場合、金属ブラケットの取り付け部を車両の金属固定部側に露出させるために樹脂筐体の縁を切り欠くので、筐体としての強度を確保しにくかった。
これに対し、図1〜図3の構成では、樹脂筐体50の縁を切り欠かず穴52,53にしたので、筐体としての強度を確保できる。加えて、外装となる樹脂筐体50が1部品なので組立性および経済性の面で効率的である。
In the case of Patent Documents 2 and 3 described in advance, the edge of the resin casing is notched to expose the mounting portion of the metal bracket to the metal fixing portion side of the vehicle, so it is difficult to ensure the strength as the casing. It was.
In contrast, in the configuration of FIGS. 1 to 3, the edge of the resin casing 50 is not cut out, and the holes 52 and 53 are formed, so that the strength as the casing can be secured. In addition, since the resin casing 50 serving as the exterior is one component, it is efficient in terms of assembly and economy.

また、図1〜図3の構成では、デバイス10、およびデバイス10へ電気的に接続された回路基板20は、金属ブラケット30,40に電気的に接続されるようになっており、金属ブラケット30,40を介して車両の金属固定部(車両グラウンド)に電気的に接続される。よって、回路基板20から発生する電磁ノイズの放射を抑制することが可能である。   1 to 3, the device 10 and the circuit board 20 electrically connected to the device 10 are electrically connected to the metal brackets 30 and 40. , 40 are electrically connected to a metal fixing part (vehicle ground) of the vehicle. Therefore, the emission of electromagnetic noise generated from the circuit board 20 can be suppressed.

さらに、図1〜図3の構成では、樹脂筐体50にデバイス10および回路基板20を収納することによって、塵、水、および車両への取り付けハンドリングなどから保護する。なお、樹脂筐体50の両側面に開口した穴52,53は金属ブラケット30,40の取り付け部31,41により塞がれ、前面開口部51も意匠パネルなどにより塞がれる。   Further, in the configuration of FIGS. 1 to 3, the device 10 and the circuit board 20 are housed in the resin casing 50 to protect from dust, water, and handling attachment to the vehicle. The holes 52 and 53 opened on both side surfaces of the resin casing 50 are closed by the attachment portions 31 and 41 of the metal brackets 30 and 40, and the front opening 51 is also closed by a design panel or the like.

このように、従来一般の金属製の筐体に代えて樹脂筐体50を用いたとしても耐振性能、電磁シールド性能、および保護性能を確保することができるので、車載性能を十分に確保しつつ重量を軽減した車載電子機器1を実現可能である。   Thus, even if the resin casing 50 is used instead of the conventional general metal casing, the vibration resistance performance, the electromagnetic shielding performance, and the protection performance can be ensured. The on-vehicle electronic device 1 with reduced weight can be realized.

なお、図1〜図3の例では、車載電子機器1の各部材をねじで締結したが、爪の嵌合など他の方法で固定してもよい。   In addition, in the example of FIGS. 1-3, although each member of the vehicle-mounted electronic device 1 was fastened with the screw | thread, you may fix by other methods, such as fitting of a nail | claw.

次に、図4〜図10を参照しながら、車載電子機器1の具体例を説明する。
図4の斜視図に示すように、この例では車載電子機器1の前側に、デバイス10を操作するボタンおよびディスプレイなどを配した意匠パネル90を設置し、ボタンの押し込み荷重などに対して強度を確保するために金属ホルダ60(図5に示す)を使用する。すると金属ホルダ60の重量が増すので、金属ブラケット30,40は、意匠パネル90、金属ホルダ60、デバイス10の重量物を保持する必要があり、構造が複雑化する可能性がある。そのため、この例では金属ブラケット30,40と金属ホルダ60を固定し、この金属ホルダ60にデバイス10と意匠パネル90を固定する構造にして、構造および組み立て作業を簡素化する。
Next, a specific example of the in-vehicle electronic device 1 will be described with reference to FIGS.
As shown in the perspective view of FIG. 4, in this example, a design panel 90 provided with a button for operating the device 10 and a display is installed on the front side of the in-vehicle electronic device 1, and the strength against the pushing load of the button is increased. A metal holder 60 (shown in FIG. 5) is used to ensure. Then, since the weight of the metal holder 60 increases, it is necessary for the metal brackets 30 and 40 to hold the heavy objects of the design panel 90, the metal holder 60, and the device 10, and the structure may be complicated. Therefore, in this example, the metal brackets 30 and 40 and the metal holder 60 are fixed, and the device 10 and the design panel 90 are fixed to the metal holder 60, thereby simplifying the structure and assembling work.

また、この例では、回路基板20に実装されている高発熱部品21(図9に示す)の放熱のために金属製の放熱部材80(例えば、アルミ製のヒートシンク)を設置し、この放熱部材80を保持するために金属ホルダ70(図5に示す)を使用する。   In this example, a metal heat dissipating member 80 (for example, an aluminum heat sink) is installed for heat dissipation of the high heat generating component 21 (shown in FIG. 9) mounted on the circuit board 20, and this heat dissipating member is provided. A metal holder 70 (shown in FIG. 5) is used to hold 80.

車載電子機器1の組み立て手順は、図5〜図8、図4の順番である。図中の矢印は部品の組み立て方向を示す。
図5(a)において、ねじ106,107を使用してデバイス10の前側に金属ホルダ60を固定すると共に、ねじ108,109を使用してデバイス10の後側に金属ホルダ70を固定する。また、図5(a)およびその一部を拡大した図5(b)に示すように、金属ホルダ70の端部に突設した爪部71,72を回路基板20の貫通穴22,23に差し込んでひねることにより、図5(c)および図5(d)のB矢視図のように爪部71,72を貫通穴22,23の周縁部に掛止させて金属ホルダ70と回路基板20を固定する。
The assembly procedure of the in-vehicle electronic device 1 is the order shown in FIGS. The arrows in the figure indicate the assembly direction of the parts.
5A, the metal holder 60 is fixed to the front side of the device 10 using screws 106 and 107, and the metal holder 70 is fixed to the rear side of the device 10 using screws 108 and 109. Further, as shown in FIG. 5A and an enlarged view of FIG. 5B, the claw portions 71 and 72 projecting from the end of the metal holder 70 are formed in the through holes 22 and 23 of the circuit board 20. By inserting and twisting the metal holder 70 and the circuit board, the claw portions 71 and 72 are hooked on the peripheral portions of the through holes 22 and 23 as shown in FIG. 5C and FIG. 20 is fixed.

図6において、ねじ110,111を使用して金属ブラケット30,40を金属ホルダ60に固定する。また、後述の図8において、金属ホルダ70と金属ブラケット30,40と放熱部材80がねじ112,113で固定されることになる。   In FIG. 6, the metal brackets 30 and 40 are fixed to the metal holder 60 using screws 110 and 111. Further, in FIG. 8 described later, the metal holder 70, the metal brackets 30 and 40, and the heat radiating member 80 are fixed by screws 112 and 113.

図7において、樹脂筐体50の前面開口部51から内部へデバイス10等をスロットインする。この樹脂筐体50では、前面開口部51および穴52,53(穴53は隠れて見えない)に加えて、後ろ側に後面開口部54が設けてある。
樹脂筐体50は、必要に応じて外側から金属ブラケット30,40へねじ止めするか、前面開口部51に爪部を形成して前側の金属ホルダ60に嵌合する。
In FIG. 7, the device 10 or the like is slotted in from the front opening 51 of the resin housing 50. In the resin casing 50, in addition to the front opening 51 and the holes 52 and 53 (the hole 53 is hidden and cannot be seen), a rear opening 54 is provided on the rear side.
The resin casing 50 is screwed from the outside to the metal brackets 30 and 40 as necessary, or a claw portion is formed in the front opening 51 and fitted to the front metal holder 60.

図8において、樹脂筐体50の後面開口部54を塞ぐように放熱部材80を設置し、ねじ112を使用して放熱部材80と金属ブラケット30と金属ホルダ70を共締めすると共に、ねじ113を使用して放熱部材80と金属ブラケット40と金属ホルダ70を共締めする。これにより、樹脂筐体50の後側の放熱部材80と左右一対の金属ブラケット30,40とが電気的に接続され、電磁シールド性能が向上する。
最後に、図4に示したように前側の金属ホルダ60に意匠パネル90を取り付けて、車載電子機器1の完成である。
In FIG. 8, the heat radiating member 80 is installed so as to close the rear opening 54 of the resin housing 50, and the heat radiating member 80, the metal bracket 30, and the metal holder 70 are fastened together using screws 112, and the screws 113 are attached. The heat radiating member 80, the metal bracket 40, and the metal holder 70 are fastened together. Thereby, the heat radiating member 80 on the rear side of the resin casing 50 and the pair of left and right metal brackets 30 and 40 are electrically connected, and the electromagnetic shielding performance is improved.
Finally, as shown in FIG. 4, the design panel 90 is attached to the front metal holder 60 to complete the in-vehicle electronic device 1.

ここで、図9に車載電子機器1を後側から見た斜視図を示す。放熱部材80を樹脂筐体50の外側に設置することにより、効率的な放熱が可能である。また、樹脂筐体50の後側において、回路基板20に実装された高発熱部品21と放熱部材80をねじ114,115で固定し、高発熱部品21を放熱部材80に接触させて放熱性能を確保している。   Here, the perspective view which looked at the vehicle-mounted electronic device 1 from the rear side in FIG. 9 is shown. By disposing the heat radiating member 80 outside the resin casing 50, efficient heat dissipation is possible. Further, on the rear side of the resin casing 50, the high heat generating component 21 mounted on the circuit board 20 and the heat radiating member 80 are fixed with screws 114 and 115, and the high heat generating component 21 is brought into contact with the heat radiating member 80 to improve heat dissipation performance. Secured.

図9の車載電子機器1のうち、樹脂筐体50の穴52から露出した金属ブラケット30の取り付け部31を拡大して、図10に示す。穴52に露出した取り付け部31を車両の金属固定部に当接させて直締めすることにより、車載電子機器1を車両へ取り付ける。
この例では、金属ブラケット30から取り付け部31を突出させて車両の金属固定部に当接させる構造にしたので、金属ブラケット30を樹脂筐体50にスロットインする際にこの取り付け部31が引っ掛からないよう、穴52の縁部に逃げ部55を設けている。穴52の縁部を切り欠かずに逃げ部55を設けることにより、金属ブラケット30の組付け性を損なうことなく、樹脂筐体50の強度が確保される。
In the in-vehicle electronic device 1 of FIG. 9, the attachment portion 31 of the metal bracket 30 exposed from the hole 52 of the resin casing 50 is enlarged and shown in FIG. 10. The in-vehicle electronic device 1 is attached to the vehicle by bringing the attachment portion 31 exposed in the hole 52 into contact with the metal fixing portion of the vehicle and directly tightening.
In this example, since the attachment portion 31 is protruded from the metal bracket 30 and is brought into contact with the metal fixing portion of the vehicle, the attachment portion 31 is not caught when the metal bracket 30 is slotted into the resin casing 50. The relief portion 55 is provided at the edge of the hole 52. By providing the relief portion 55 without cutting out the edge portion of the hole 52, the strength of the resin casing 50 is ensured without impairing the assembling property of the metal bracket 30.

以上より、実施の形態1によれば、車載電子機器1は、デバイス10と、デバイス10に電気的に接続された回路基板20と、デバイス10および回路基板20を保持すると共に、車両に設けられた金属固定部に取り付けられる金属ブラケット30,40と、デバイス10、回路基板20および金属ブラケット30,40を収納する樹脂筐体50とを備え、樹脂筐体50が、金属ブラケット30,40と車両の金属固定部との取り付け部分に穴52,53を有し、金属ブラケット30,40が、樹脂筐体50の穴52,53から車両の金属固定部に露出して当該金属固定部に直接取り付けられる構成にした。従来のような重量のある金属製の筐体ではなく、軽量な樹脂筐体50を使用することにより、車載電子機器1を軽量化できる。また、樹脂筐体50に穴52,53をあけて金属ブラケット30,40の取り付け部31,41を車両の金属固定部に直接取り付けることにより、筐体としての強度を確保しながらデバイス10と回路基板20の振動を抑制でき、耐振性能が向上する。また、デバイス10および回路基板20が金属ブラケット30,40を介して車両の金属固定部に電気的に接続されることにより、電磁シールド性能が向上する。さらに、デバイス10および回路基板20を樹脂筐体50で覆うことにより、塵、水、および車両への取り付けハンドリングなどから保護できる。従って、耐振性能および電磁シールド性能などの車載性能を満たしつつ軽量化を実現した車載電子機器1を提供できる。   As described above, according to the first embodiment, the in-vehicle electronic device 1 holds the device 10, the circuit board 20 electrically connected to the device 10, the device 10 and the circuit board 20, and is provided in the vehicle. The metal brackets 30 and 40 attached to the metal fixing part, and the resin casing 50 that houses the device 10, the circuit board 20, and the metal brackets 30 and 40, and the resin casing 50 includes the metal brackets 30 and 40 and the vehicle. There are holes 52, 53 in the mounting portion with the metal fixing portion of the metal bracket, and the metal brackets 30, 40 are exposed to the metal fixing portion of the vehicle through the holes 52, 53 of the resin casing 50 and are directly attached to the metal fixing portion It was made a configuration. The vehicle-mounted electronic device 1 can be reduced in weight by using a lightweight resin casing 50 instead of a conventional heavy metal casing. Further, by making holes 52 and 53 in the resin housing 50 and directly attaching the mounting portions 31 and 41 of the metal brackets 30 and 40 to the metal fixing portion of the vehicle, the device 10 and the circuit are secured while ensuring the strength as the housing. The vibration of the substrate 20 can be suppressed, and the vibration resistance performance is improved. In addition, since the device 10 and the circuit board 20 are electrically connected to the metal fixing portion of the vehicle via the metal brackets 30 and 40, the electromagnetic shielding performance is improved. Furthermore, by covering the device 10 and the circuit board 20 with the resin casing 50, it is possible to protect from dust, water, and vehicle mounting handling. Therefore, it is possible to provide the in-vehicle electronic device 1 that achieves weight reduction while satisfying the in-vehicle performance such as the vibration resistance performance and the electromagnetic shielding performance.

また、実施の形態1によれば、車載電子機器1は、デバイス10を金属ブラケット30,40に固定する金属ホルダ60を備える構成にした。このため、重量物である意匠パネル90を保持する金属ホルダ60を追加した場合でも、この金属ホルダ60を介してデバイス10と金属ブラケット30,40を固定することができ、構造および組み立て作業の簡素化が可能である。   Moreover, according to Embodiment 1, the vehicle-mounted electronic device 1 is configured to include the metal holder 60 that fixes the device 10 to the metal brackets 30 and 40. For this reason, even when the metal holder 60 holding the design panel 90 which is a heavy object is added, the device 10 and the metal brackets 30 and 40 can be fixed via the metal holder 60, and the structure and the assembly work are simplified. Is possible.

また、実施の形態1によれば、車載電子機器1は、金属ブラケット30,40に固定される金属製の放熱部材80を備え、樹脂筐体50は、回路基板20の高発熱部品21を収納する位置に後面開口部54を有し、当該後面開口部54が放熱部材80で塞がれる構成にした。このため、高発熱部品21の放熱性が向上する。また、放熱部材80と金属ブラケット30,40を電気的に接続することにより、車載電子機器1の後側が金属部材で覆われ、電磁シールド性能がさらに向上する。加えて、放熱部材80の重量を金属ブラケット30,40で保持することにもなり、耐振性能が向上する。   Further, according to the first embodiment, the in-vehicle electronic device 1 includes the metal heat radiating member 80 fixed to the metal brackets 30 and 40, and the resin casing 50 accommodates the high heat generating component 21 of the circuit board 20. The rear surface opening 54 is provided at a position where the rear surface opening 54 is closed by the heat radiating member 80. For this reason, the heat dissipation of the high heat-generating component 21 is improved. Moreover, by electrically connecting the heat radiating member 80 and the metal brackets 30 and 40, the rear side of the in-vehicle electronic device 1 is covered with the metal member, and the electromagnetic shielding performance is further improved. In addition, the weight of the heat radiating member 80 is held by the metal brackets 30 and 40, and the vibration resistance is improved.

なお、本願発明はその発明の範囲内において、実施の形態の任意の構成要素の変形、もしくは実施の形態の任意の構成要素の省略が可能である。   In the present invention, any constituent element of the embodiment can be modified or any constituent element of the embodiment can be omitted within the scope of the invention.

1 車載電子機器、10 デバイス、20 回路基板、21 高発熱部品、22,23 貫通穴 30,40 金属ブラケット、31,41 取り付け部、32,33,42,43 ねじ穴、50 樹脂筐体、51 前面開口部、52,53 穴、54 後面開口部、55 逃げ部、60,70 金属ホルダ、71,72 爪部、80 放熱部材、90 意匠パネル、101〜115 ねじ。   DESCRIPTION OF SYMBOLS 1 In-vehicle electronic device, 10 device, 20 Circuit board, 21 High heat generation component, 22, 23 Through hole 30, 40 Metal bracket, 31, 41 Attaching part, 32, 33, 42, 43 Screw hole, 50 Resin housing, 51 Front opening, 52, 53 holes, 54 Rear opening, 55 Escape, 60, 70 Metal holder, 71, 72 Claw, 80 Heat dissipation member, 90 Design panel, 101-115 screw.

Claims (2)

デバイスと、
前記デバイスに電気的に接続された回路基板と、
前記デバイスおよび前記回路基板を保持すると共に、車両に設けられた金属製の固定部に取り付けられる金属製のブラケットと、
1部品からなり、前記デバイス、前記回路基板および前記ブラケットを収納する樹脂製の筐体と、
前記ブラケットに固定される金属製の放熱部材を備え、
前記筐体は、前記ブラケットと前記車両の固定部との取り付け部分に穴を有し、
前記ブラケットは、前記筐体の穴から前記車両の固定部に露出して当該固定部に直接取り付けられ、
前記回路基板の発熱部品を収納する位置に開口部を有し、当該開口部が前記放熱部材で塞がれていることを特徴とする車載電子機器。
The device,
A circuit board electrically connected to the device;
A metal bracket that holds the device and the circuit board and is attached to a metal fixing portion provided in a vehicle,
A resin housing that houses the device, the circuit board, and the bracket ;
A metal heat dissipating member fixed to the bracket ;
The housing has a hole in a mounting portion between the bracket and the fixed portion of the vehicle,
Said bracket, said exposed from the hole of the casing to the fixed part of the vehicle directly attached, et al is to the fixed portion,
An in-vehicle electronic device having an opening at a position where the heat generating component of the circuit board is accommodated, and the opening is closed by the heat radiating member .
前記デバイスを前記ブラケットに固定する金属製のホルダを備えることを特徴とする請求項1記載の車載電子機器。   The vehicle-mounted electronic device according to claim 1, further comprising a metal holder that fixes the device to the bracket.
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