JP5986854B2 - Insulation mounting structure of semiconductor elements - Google Patents

Description

  The present invention relates to an insulating mounting structure for a semiconductor element in which a semiconductor element such as a power transistor to which a high voltage and a large current are applied is mounted with a certain spatial distance or creeping distance secured.

  When mounting a semiconductor element such as a power transistor to which a high voltage and a large current are applied, an insulating mounting structure corresponding to various standards such as JIS is required. As an insulating mounting structure that satisfies these standards, for example, Patent Document 1 discloses a structure that is solid-insulated with an insulating member composed of an AIN sintered body or the like interposed between a semiconductor element and a heat radiating fin. . Further, in Patent Document 2, a cap that covers an electrode terminal of a semiconductor element is attached and solid insulation is performed by the cap, or a convex processing is applied to a radiation fin, and a spatial distance or creepage distance from the electrode terminal to the radiation fin is determined. What is secured and insulated is disclosed.

  Further, Patent Document 3 discloses that a mold resin portion is provided with a convex portion, a concave portion, a terminal surrounding portion, a stepped step portion, and the like so as to ensure insulation and ensure a creepage distance. In this type, the heat radiation fin on which the semiconductor element is fixedly installed is fastened and fixed to the grounded sheet metal chassis with screws through an insulating sheet, an insulating spacer and an insulating washer, and the heat radiation fin is insulated and supported. It is disclosed.

Japanese Patent No. 2598236 Japanese Patent No. 4688751 JP-A-8-97333 Japanese Examined Patent Publication No. 7-45956

  However, in the case of solid insulation with an insulating member sandwiched between the semiconductor element and the heat radiating fin, a decrease in heat conduction from the semiconductor element side to the heat radiating fin side is unavoidable. was there. Furthermore, when the heat radiation fin has a special shape or the semiconductor resin mold resin part is specially processed, there are problems such as an inevitable increase in the number of processing steps and an increase in manufacturing cost.

  In addition, since the sheet disclosed in Patent Document 4 requires an insulating sheet, an insulating spacer and an insulating washer, and a screw, the number of components increases, and between the radiation fin and the sheet metal chassis, and between the sheet metal chassis and the screw. Since there is a need to secure a spatial distance between each of the two locations, the installation space becomes large, and there are problems such as a hindrance to miniaturization and simplification of the configuration.

  The present invention has been made in view of such circumstances, and it is possible to obtain an insulation performance that satisfies the standard without deteriorating the heat dissipation performance, while suppressing an increase in cost and processing man-hours, and a simplified structure and a compact structure. An object of the present invention is to provide an insulating mounting structure of a semiconductor device that can be realized.

In order to solve the above-described problems, the semiconductor element insulation mounting structure of the present invention employs the following means.
That is, the insulating mounting structure of a semiconductor element according to the present invention includes a radiation fin on which the semiconductor element is directly installed, a sheet metal part to which the radiation fin is mounted, and the sheet metal part to which the semiconductor element is mounted. A sheet metal chassis that is grounded, and the sheet metal component and the sheet metal chassis ensure a certain spatial distance between them, and are attached to one of them as a solid insulation part It is characterized by being coupled to each other through an insulating member.

  According to the present invention, the semiconductor element is directly installed on the heat radiating fin, and the sheet metal part to which the heat radiating fin is attached is fixed between the two with respect to the sheet metal chassis which is electrically grounded. The power transistor that generates heat when a high voltage and a large current are applied to the other is secured through a resin insulating member attached to one of them as a solid insulating part. Since the heat from the semiconductor element can be directly transferred to the heat dissipation fin and dissipated, the heat dissipation performance of the semiconductor element is not impaired at all. Sheet metal parts that are electrically grounded (earthed) without any special contrivances or configurations to ensure creepage distances. The chassis, as well as ensure a constant spatial distance through the resin insulating member, solid insulation to be able to insulate the support. Therefore, it is possible to provide an insulating structure that satisfies various standards while ensuring sufficient heat dissipation performance. In addition, there is no need to change the structure or special measures on the semiconductor element or the heat radiating fin itself, and an increase in manufacturing cost and processing man-hours can be suppressed. Further, by making the sheet metal part to which the heat radiating fins are attached function as heat radiating fins and improving the heat radiating performance, it is possible to reduce the size of the heat radiating fins. Furthermore, even if the insulation between the electrode terminal of the semiconductor element that is fundamentally insulated by a resin mold or the like and the radiation fin is broken for some reason, the insulation between the sheet metal part and the sheet metal chassis Since it has a heavy insulating structure, the protection function against electric shock or the like can be increased approximately twice.

  Furthermore, the insulating mounting structure for a semiconductor device according to the present invention is characterized in that, in the insulating mounting structure for a semiconductor device, the radiating fin is directly coupled to the sheet metal part via a screw.

  According to the present invention, since the radiating fin is directly coupled to the sheet metal part via a screw, the heat transferred from the semiconductor element to the radiating fin is not limited to the radiating fin but via the screw. Heat can also be radiated from a sheet metal part that is directly coupled and has a large area. Therefore, it is possible to improve the heat dissipation performance of the semiconductor element, thereby reducing the size of the heat dissipation fins, and reducing the size and size of the circuit board and control box including them.

  Furthermore, the insulating mounting structure for a semiconductor element of the present invention is the above-described insulating mounting structure for a semiconductor element, wherein the sheet metal part is a control box for accommodating and installing a circuit board including the semiconductor element. It is characterized by that.

  According to the present invention, since the sheet metal part is a control box that accommodates and installs the circuit board provided with the semiconductor element, the circuit board provided with the semiconductor element without adding a special part as the sheet metal part. The above-described insulation mounting structure can be realized by using a control box that accommodates and installs the housing. Accordingly, it is possible to provide a simple and inexpensive semiconductor element insulation mounting structure having high insulation performance and heat dissipation performance without incurring an increase in the number of parts, costs, and the like.

  Furthermore, the insulating mounting structure for a semiconductor element of the present invention is the insulating mounting structure for any one of the semiconductor elements described above, wherein the resin insulating member has a certain spatial distance between the sheet metal part and the sheet metal chassis. And the other of the sheet metal part or the sheet metal chassis and the other one of the sheet metal part and the sheet metal chassis. The screw coupling portion to which a screw that penetrates the spacer portion is fastened and fixed is integrally formed with resin.

  According to the present invention, the resin insulating member is provided in the spacer hole that secures a certain spatial distance between the sheet metal part and the sheet metal chassis, and the mounting hole provided in one of the sheet metal part or the sheet metal chassis. Because it is configured to be integrally resin-molded with a screw coupling part to which a screw that penetrates the other of the sheet metal part or the sheet metal chassis and the spacer part and is fixed while being fitted through the retaining part, By interposing the resin insulating member between the sheet metal part and the sheet metal chassis and coupling the sheet metal part and the sheet metal chassis to each other, the sheet metal part on which the semiconductor element and the heat radiation fin are installed is obtained. In addition to ensuring a certain spatial distance, it can be insulated and supported by the sheet metal chassis via the solid insulating portion. Accordingly, it is possible to secure a certain spatial distance through a single resin insulating member to insulate and support the sheet metal part with the sheet metal chassis, and to achieve a simple and compact configuration without securing extra space. An insulating mounting structure for a semiconductor element can be obtained.

  Further, the insulating mounting structure of the semiconductor element of the present invention is the above-described insulating mounting structure of the semiconductor element, wherein the screw coupling portion of the resin insulating member is the sheet metal part to which the screw coupling portion is fitted or the It is characterized by comprising the solid insulating part that insulates between one of the sheet metal chassis and the screw fastened and fixed to the screw coupling part.

  According to the present invention, the screw coupling portion of the resin insulating member is between the one of the sheet metal part or the sheet metal chassis to which the screw coupling portion is fitted and the screw fastened and fixed to the screw coupling portion. Since it is configured to have a solid insulating part to insulate, a certain spatial distance can be secured between the sheet metal part and the sheet metal chassis via the spacer part of the resin insulating member, and the screw coupling part Through the solid insulating portion, it is possible to perform solid insulation between one of the sheet metal part or the sheet metal chassis to which the screw coupling portion is fitted and the screw that fastens and fixes the other to the resin insulating member. Therefore, it is possible to reliably insulate between the sheet metal part to which the heat radiating fin is attached and the sheet metal chassis to which the sheet metal part is attached via the resin insulating member.

  According to the present invention, heat from a semiconductor element such as a power transistor, which generates heat when a high voltage and a large current are applied, can be directly transferred to the radiation fin to dissipate heat, so that the heat dissipation performance of the semiconductor element may be impaired at all. In addition, the sheet metal parts to which the radiation fins are attached can be electrically connected without any special devices or configurations to ensure the clearance and creepage distances that satisfy the insulation performance corresponding to the standards for the semiconductor elements and the radiation fins themselves. While ensuring a certain spatial distance through a resin insulation member and supporting insulation by solid insulation with respect to a sheet metal chassis that is grounded (grounded), while ensuring sufficient heat dissipation performance Insulating structures that satisfy various standards can be provided. In addition, there is no need to change the structure or special measures on the semiconductor element or the heat radiating fin itself, and an increase in manufacturing cost and processing man-hours can be suppressed. Further, by making the sheet metal part to which the heat radiating fins are attached function as heat radiating fins and improving the heat radiating performance, it is possible to reduce the size of the heat radiating fins. Furthermore, even if the insulation between the electrode terminal of the semiconductor element that is fundamentally insulated by a resin mold or the like and the radiation fin is broken for some reason, the insulation between the sheet metal part and the sheet metal chassis Since it has a heavy insulating structure, the protection function against electric shock or the like can be increased approximately twice.

It is a schematic block diagram which shows the insulation attachment structure of the semiconductor element which concerns on one Embodiment of this invention. It is an enlarged view of the A section in FIG.

Hereinafter, an embodiment of the present invention will be described with reference to FIGS. 1 and 2.
FIG. 1 shows a schematic configuration diagram of an insulating mounting structure for a semiconductor device according to an embodiment of the present invention, and FIG. 2 shows an enlarged view of a portion A thereof.
For example, a semiconductor element 1 such as a power transistor to which a high voltage is applied is incorporated in a fan motor driver that drives a fan motor of an air conditioner. The semiconductor element 1 here is resin-molded, and electrode terminals 2 are extended upward in an L shape from both ends thereof.

  The semiconductor element 1 has a plurality of electrode terminals 2 connected to a circuit board 4 installed in a sheet metal part 3 constituting a control box, and constitutes a drive circuit for a fan motor. The sheet metal part (control box) 3 is a rectangular box body having a predetermined depth, and is sized to accommodate and install the semiconductor element 1 and the circuit board 4 constituting the drive circuit of the fan motor. It is.

  An opening 5 is provided on the bottom surface of the sheet metal part (control box) 3, and an aluminum alloy radiating fin 6 is directly clamped to the outer surface of the sheet metal part (control box) 3 with screws 7 so as to cover the opening 5. It is fixed. One surface of the semiconductor element 1 is disposed in contact with the surface of the base surface of the heat radiating fin 6, and heat generated in the semiconductor element 1 due to application of a high voltage and large current is directly conducted to the heat radiating fin 6. Heat is dissipated to the outside air through the heat dissipating fins 6 and the sheet metal parts 3 to which the heat dissipating fins 6 are directly coupled.

  Further, the sheet metal part (control box) 3 has flange portions 8 provided on the periphery thereof, which are tightened to the sheet metal chassis 9 with screws 11 via resin insulating members 10 at a plurality of positions (for example, four positions). It is fixed. The sheet metal chassis 9 constitutes a casing or the like of the air conditioner, and is configured to be electrically grounded.

  As shown in FIG. 2, the resin insulating member 10 is interposed between a sheet metal part (control box) 3 and a sheet metal chassis 9, and a spacer portion 10 </ b> A that secures a certain spatial distance S therebetween. The spacer portion 10A extends from one surface and is attached to a mounting hole 12 provided in one of the sheet metal part 3 or the sheet metal chassis 9 (in this embodiment, the sheet metal chassis 9 side) via a retaining portion 10C. And the screw coupling portion 10B to be fitted together are integrally molded with resin.

  The resin insulating member 10 can be made of, for example, PPS resin, has a configuration in which a screw hole 10D is formed from the other surface side of the spacer portion 10A toward the screw coupling portion 10B, and the screw 11 can be screwed. Has been. A solid insulating portion 10E having a certain thickness T is formed between the screw hole 10D and the outer periphery of the screw coupling portion 10B, and the screw 11 and the sheet metal chassis 9 are solidly insulated by the solid insulating portion 10E. It is comprised so that.

With the configuration described above, according to the present embodiment, the following operational effects can be obtained.
The semiconductor element 1 such as a power transistor used for interrupting the current flowing through the motor at high speed generates heat due to power loss at that time, and needs to be cooled in order to prevent overheating. For this cooling, a power transistor is generally installed on the radiation fin and heat is transferred to the radiation fin to dissipate the heat, but in this embodiment, the semiconductor element 1 is installed directly on the radiation fin 6. At the same time, the sheet metal part (control box) 3 to which the radiating fins 6 are attached is secured to the sheet metal chassis 9 which is electrically grounded with a certain spatial distance S therebetween. In addition, it is configured such that it is coupled to one side via a resin insulating member 10 attached as a solid insulating portion 10E and insulated and supported.

  For this reason, since the heat generated in the semiconductor element 1 can be directly transferred to the heat radiation fin 6 and radiated, the heat radiation performance of the semiconductor element 1 is not impaired at all. The sheet metal part (control box) 3 to which the heat radiating fins 6 are attached is electrically grounded (grounded) without any special device or configuration for ensuring the space distance and the creepage distance satisfying the insulation performance corresponding to A certain spatial distance S can be ensured with respect to the sheet metal chassis 9 via the resin insulating member 10 and can be reliably insulated and supported via the solid insulating portion 10E.

  Therefore, it is possible to provide an insulating structure that can satisfy various standards while ensuring sufficient heat dissipation performance. In addition, there is no need to change the structure or special device on the semiconductor element 1 or the radiating fin 6 itself, and the increase in manufacturing cost and processing man-hour can be suppressed. Further, by making the sheet metal part (control box) 3 to which the radiating fins 6 are attached function as radiating fins and improving the radiating performance, it is possible to reduce the size of the radiating fins 6 and the like. Furthermore, even if the insulation between the electrode terminal 2 of the semiconductor element 1 and the heat radiating fin 6 that is fundamentally insulated by a resin mold or the like is broken down for some reason, the sheet metal part (control box) 3 and the sheet metal chassis 9 As a result of the double insulation structure, the protection function against electric shock or the like can be increased approximately twice.

  The radiating fin 6 is directly coupled to a sheet metal part (control box) 3 via a screw 7. For this reason, the heat transmitted from the semiconductor element 1 to the heat radiating fins 6 can be radiated not only from the heat radiating fins 6 but also from the sheet metal part 3 having a large area directly coupled thereto via the screws 7. Thereby, the heat dissipation performance of the semiconductor element 1 can be improved, and as a result, the heat dissipation fins 6 can be downsized, and the circuit board 4 and the control box 3 including them can be downsized and compact.

  In the present embodiment, the sheet metal part 3 is a control box that houses and installs the circuit board 4 including the semiconductor element 1 as described above, and therefore, a special part is added as the sheet metal part 3. In addition, the above-described insulating mounting structure can be realized by using a control box that houses and installs the circuit board 4 including the semiconductor element 1. Therefore, it is possible to provide a simple and inexpensive insulation mounting structure for the semiconductor element 1 having high insulation performance and heat dissipation performance without causing an increase in the number of parts, cost, and the like.

  Further, the resin insulating member 10 includes a spacer portion 10 </ b> A that secures a certain spatial distance S between the sheet metal part (control box) 3 and the sheet metal chassis 9, and the sheet metal part 3 or the sheet metal chassis 9. A screw that fits into a mounting hole 12 provided in one (here, the sheet metal chassis 9) via a retaining portion 10C and penetrates the other of the sheet metal part 3 or the sheet metal chassis 9 and the spacer section 10A. The screw coupling portion 10B to which 11 is fastened and fixed is integrally molded with resin.

  For this reason, by interposing the resin insulating member 10 between the sheet metal part 3 and the sheet metal chassis 9 and coupling the sheet metal part 3 and the sheet metal chassis 9 to each other, the semiconductor element 1 and the radiation fins 6 are formed. The installed sheet metal part 3 can be insulated and supported by the sheet metal chassis 9 through the solid insulating portion 10E while ensuring a certain spatial distance S. Therefore, the sheet metal part 3 can be insulated and supported by the sheet metal chassis 9 by securing a certain spatial distance S through the single resin insulating member 10, and it is simple without securing an extra space. An insulating mounting structure of the semiconductor element 1 having a compact configuration can be obtained.

  Further, the screw coupling portion 10B of the resin insulating member 10 includes one of the sheet metal part 3 or the sheet metal chassis 9 (here, the sheet metal chassis 9) to which the screw coupling portion 10B is fitted, and the screw coupling portion 10B. It is set as the structure provided with the solid-insulation part 10E which insulates between the screws 11 fastened and fixed to.

  Therefore, a certain spatial distance S can be secured between the sheet metal part 3 and the sheet metal chassis 9 via the spacer part 10A of the resin insulating member 10, and the solid insulating part of the screw coupling part 10B. Solid insulation is provided between one of the sheet metal part 3 or the sheet metal chassis 9 to which the screw coupling portion 10B is fitted and the screw 11 for fastening the other side to the resin insulating member 10 via 10E. Therefore, the sheet metal part 3 to which the radiation fin 6 is attached and the sheet metal chassis 9 to which the sheet metal part 3 is attached can be reliably insulated via the resin insulating member 10.

  In addition, this invention is not limited to the invention concerning the said embodiment, In the range which does not deviate from the summary, it can change suitably. For example, in the above-described embodiment, the resin insulating member 10 is fitted into the mounting hole 12 on the sheet metal chassis 9 side, and the sheet metal part (control box) 3 is screwed by the screw 11 with the spacer portion 10A interposed therebetween. However, the resin insulating member 10 may be fitted on the sheet metal part (control box) 3 side and tightened and fixed with the screw 11 from the sheet metal chassis 9 side. In this case, a mounting hole 12 for the resin insulating member 10 is provided on the sheet metal part 3 side.

  Further, the resin insulating member 10 is not limited to PPS, and other resin materials may be used. Further, the cross-sectional shapes of the spacer portion 10A and the screw coupling portion 10B are not limited to a circular cross-section, and may be a square cross-sectional shape. Various shapes can be selected.

1 Semiconductor element 3 Sheet metal parts (control box)
4 Circuit board 6 Radiation fin 7 Screw 9 Sheet metal chassis 10 Resin insulating member 10A Spacer portion 10B Screw coupling portion 10C Detachment portion 10E Solid insulation portion 11 Screw 12 Mounting hole S Spatial distance

Claims (5)

Radiating fins on which semiconductor elements are installed directly;
A sheet metal part to which the radiating fin is attached;
The sheet metal part is mounted, and the sheet metal chassis itself is electrically grounded,
The sheet metal component and the sheet metal chassis are secured to each other via a resin insulating member that secures a certain spatial distance therebetween and is attached to one of them as a solid insulating portion. Insulating mounting structure for semiconductor elements.   2. The insulating mounting structure for a semiconductor device according to claim 1, wherein the radiating fin is directly coupled to the sheet metal part via a screw.   The insulating mounting structure for a semiconductor element according to claim 1, wherein the sheet metal part is a control box for accommodating and installing a circuit board including the semiconductor element.   The resin insulating member passes through a spacer portion that secures a certain spatial distance between the sheet metal part and the sheet metal chassis, and an attachment hole provided in one of the sheet metal part or the sheet metal chassis. The sheet metal part or the sheet metal chassis and the screw coupling part to which a screw passing through the spacer part is fastened and fixed are integrally molded with a resin while being fitted through a stopper. 4. The insulating mounting structure for a semiconductor device according to claim 1, wherein the insulating mounting structure is a semiconductor device. The screw coupling portion of the resin insulating member insulates between one of the sheet metal part or the sheet metal chassis to which the screw coupling portion is fitted and a screw fastened and fixed to the screw coupling portion. 5. The insulating mounting structure for a semiconductor device according to claim 4, wherein the solid insulating portion is provided.

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