CN213522893U

CN213522893U - High-temperature-resistant electronic device element for smart phone

Info

Publication number: CN213522893U
Application number: CN202022757462.1U
Authority: CN
Inventors: 徐洪波; 求忠江; 庞宏伟; 杨铖
Original assignee: Shenzhen Yike Times Technology Development Co ltd
Current assignee: Shenzhen Yike Times Technology Development Co ltd
Priority date: 2020-11-25
Filing date: 2020-11-25
Publication date: 2021-06-22
Anticipated expiration: 2030-11-25

Abstract

The utility model discloses a high temperature resistant electron device component for smart mobile phone, which comprises a circuit board, the upper end welding of circuit board has easy heating element, and easy heating element's lower extreme is provided with the welding foot, easy heating element's upper end is provided with heat conduction silica gel, and heat conduction silica gel's upper end is provided with the semicircle lug, the upper end of semicircle lug is provided with the heat conduction lid, and the upper end of heat conduction lid is connected with the heat conduction post, the upper end of heat conduction post is connected with logical coil pipe, and the outside of copper coil pipe is provided with the mount, the lower extreme of mount is provided with the conducting strip, and the outside of conducting strip is provided with heat conduction silicone grease, the outside of heat conduction silicone grease is provided with the fin, and the inside of. This a high temperature resistant electron device component for smart mobile phone through diversified, multi-level heat conduction device and heat abstractor for electric elements obtains good cooling effect, and then improves electric elements's heat resistance.

Description

High-temperature-resistant electronic device element for smart phone

Technical Field

The utility model relates to an electronic component technical field specifically is a high temperature resistant electron device component for smart mobile phone.

Background

Electronic components are basic elements in electronic circuits, usually individually packaged, and have two or more leads or metal contacts, and the electronic components are connected to each other to form an electronic circuit with a specific function, wherein the electronic components used for central processing are particularly important in computers or other intelligent devices, and the temperature of the components rises very fast during the operation of the device, and after a long time of operation, the performance of the components is obviously reduced due to the high temperature, and the service life of the components in a high-temperature environment for a long time is greatly reduced.

The best of the existing cooling system is a water cooling system device, but the device has the disadvantages of large installation space, high cost and complex structure, and cannot be installed on a frequently-moving notebook computer or smart phone equipment, so that a high-temperature resistant electronic device element for a smart phone is provided for solving the problems.

SUMMERY OF THE UTILITY MODEL

An object of the utility model is to provide a high temperature resistant electron device component for smart mobile phone to the current cooling system that proposes in solving above-mentioned background is the best water cooling system device, but this kind of device installation space is great, and the cost is higher, and the structure is complicated, to the problem of the unable installation of the notebook or the smart mobile phone equipment of frequent removal.

In order to achieve the above object, the utility model provides a following technical scheme: the utility model provides a high temperature resistant electron device component for smart mobile phone, includes the circuit board, the upper end welding of circuit board has easy heating element, and easy heating element's lower extreme is provided with the welding foot, easy heating element's upper end is provided with heat conduction silica gel, and heat conduction silica gel's upper end is provided with the semicircle lug, the upper end of semicircle lug is provided with the heat conduction lid, and the upper end of heat conduction lid is connected with the heat conduction post, the upper end of heat conduction post is connected with the copper coil pipe, and the outside of copper coil pipe is provided with the mount, the lower extreme of mount is provided with the conducting strip, and the outside of conducting strip is provided with heat conduction silicone grease, the outside of heat conduction silicone grease is provided with the fin, and the inside of fin is provided with the standing groove, the bottom of.

Preferably, the heat conducting cover is of a structure in a shape like a Chinese character 'men' made of copper-aluminum alloy, the semicircular lug is arranged at the upper end of the inside of the heat conducting cover, and the semicircular lug and the heat conducting cover are made of the same material and are of an integral structure.

Preferably, one end of the heat-conducting fin is connected to both sides of the heat-conducting cover, and the other end of the heat-conducting fin is placed inside the heat-radiating fin through the placing groove, and the contact gap between the heat-conducting fin and the heat-radiating fin is filled with heat-conducting silicone grease.

Preferably, the heat radiating fins are fixedly connected with the circuit board through the connecting bottom, the heat radiating fins are arranged at the upper end of the connecting bottom in an aluminum extrusion mode, and heat radiating holes are formed in the heat conducting fins in the gaps of the heat radiating fins.

Preferably, the fixing frame is fixed on the circuit board through screws, a part of the heat conducting fins is compressed by the fixing frame, and the fixing frame is a cuboid frame made of red copper.

Preferably, the heat conducting fins are provided with five heat conducting fins which are symmetrical about the heat conducting cover, the center of the copper coil pipe and the center of the heat conducting cover are in the same vertical line, and the copper coil pipe is provided with three circles which are internally and externally coiled.

Compared with the prior art, the beneficial effects of the utility model are that: the high-temperature-resistant electronic device element for the smart phone is reasonable in structural arrangement, and the electric element obtains a good cooling effect through the multi-directional and multi-layer heat conduction device and the heat dissipation device, so that the heat resistance of the electric element is improved;

1. the aluminum extruded type cooling device is provided with cooling fins, heat conducting fins and heat conducting silicone grease, heat generated by the heating element is conducted outwards through the heat conducting fins, the heat is transferred to the cooling fins through the viscosity and the heat conductivity of the heat conducting silicone grease, and the heat is dissipated out through the cooling fins arranged in an aluminum extruded mode, so that the effect of rapid cooling is achieved;

2. the heat of the heating element is dispersed to the copper coil through the heat conducting cover and the heat conducting column by the heat conduction of the heat conducting silica gel, and a larger contact area with air is obtained by utilizing the annular spiral structure of the copper coil, so that the heat exchange efficiency with the air is increased;

3. be equipped with insulating layer and semicircle lug, through the porous polyurethane foaming board of insulating layer, isolated heat is to the circuit board transmission for the heat is concentrated and is dispersed through the fin, through semicircle lug increase and heat conduction silica gel area of contact, increases heat transfer efficiency.

Drawings

Fig. 1 is a schematic top view of the present invention;

FIG. 2 is a schematic diagram of a side view of a circuit board according to the present invention;

fig. 3 is a schematic front view of the upper end of the heating element of the present invention.

In the figure: 1. a circuit board; 2. a heat sink; 3. a heat conductive sheet; 4. a fixed mount; 5. a copper coil pipe; 6. a heat conducting cover; 7. heat dissipation holes; 8. a placement groove; 9. heat-conducting silicone grease; 10. a connecting bottom; 11. a thermal insulation layer; 12. a heat-conducting column; 13. a semicircular bump; 14. heat conducting silica gel; 15. a readily heatable element; 16. and (6) welding the feet.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.

Referring to fig. 1-3, the present invention provides a technical solution: the utility model provides a high temperature resistant electron device component for smart mobile phone, includes circuit board 1, fin 2, conducting strip 3, mount 4, copper coil pipe 5, heat conduction lid 6, louvre 7, standing groove 8, heat conduction silicone grease 9, connects end 10, insulating layer 11, heat conduction post 12, semicircle lug 13, heat conduction silica gel 14, easily generate heat component 15 and welding foot 16, circuit board 1, its characterized in that: the upper end welding of circuit board 1 has easy heating element 15, and the lower extreme of easy heating element 15 is provided with welding foot 16, the upper end of easy heating element 15 is provided with heat conduction silica gel 14, and the upper end of heat conduction silica gel 14 is provided with semicircle lug 13, the upper end of semicircle lug 13 is provided with heat conduction lid 6, and the upper end of heat conduction lid 6 is connected with heat conduction post 12, the upper end of heat conduction post 12 is connected with copper coil pipe 5, and copper coil pipe 5's the outside is provided with mount 4, the lower extreme of mount 4 is provided with conducting strip 3, and the outside of conducting strip 3 is provided with heat conduction silicone grease 9, the outside of heat conduction silicone grease 9 is provided with fin 2, and the inside of fin 2 is provided with standing groove 8, the bottom of standing groove 8 is provided with insulating layer 11, and the.

As in fig. 3, the heat conducting cover 6 is a door-shaped structure made of copper-aluminum alloy material, so as to wrap the heat conducting silica gel 14 conveniently, and the semicircular bump 13 is arranged at the upper end of the inside of the heat conducting cover 6, and the semicircular bump 13 is made of the same material as the heat conducting cover 6 and is of an integral structure.

As shown in fig. 2 and 3, one end of the heat conduction sheet 3 is connected to both sides of the heat conduction cover 6, and the other end of the heat conduction sheet 3 is placed inside the heat dissipation sheet 2 through the placement groove 8, and the heat conduction silicone grease 9 is filled in the contact gap between the heat conduction sheet 3 and the heat dissipation sheet 2, and the heat is transferred to the heat dissipation sheet 2 by the viscosity and the heat conductivity of the heat conduction silicone grease 9.

As shown in fig. 2, the heat sink 2 is fixedly connected to the circuit board 1 through the connecting base 10, and the heat sink 2 is arranged at the upper end of the connecting base 10 in an aluminum extrusion manner, the heat sink 2 arranged in an aluminum extrusion manner is favorable for heat dissipation, and the heat conducting fins 3 inside the gaps of the heat sink 2 are provided with heat dissipating holes 7.

As in fig. 1, mount 4 passes through the fix with screw on circuit board 1, and a part of conducting strip 3 is compressed tightly by mount 4, and mount 4 sets up the cuboid frame that is the red copper material, conducting strip 3 sets up five symmetrical about the 6 effects of heat conduction lid, the outside conduction of heat that many conducting strips 3 produced heating element, and the center of copper coil 5 is in same perpendicular line with the center of heat conduction lid 6, and copper coil 5 is provided with the three circles that spiral inside and outside, the cyclic annular structure of spiraling of copper coil 5, make and obtain bigger area of contact with the air, increase the heat exchange efficiency with the air.

The working principle is as follows: when the high-temperature resistant electronic device element for the smart phone is used, firstly, as shown in fig. 1, fig. 2 and fig. 3, the high-temperature resistant electronic device element generates heat when working, the heat is transmitted to the heat conducting cover 6 through the heat conducting silica gel 14, then is transmitted to the heat conducting sheet 3 and the heat conducting column 12 through the heat conducting cover 6, the heat conducting column 12 then transmits the heat to the copper coil 5, a larger contact area with air is obtained by utilizing the annular spiral structure of the copper coil 5, the heat exchange efficiency with the air is increased, the heat conducting sheet 3 transmits the heat to the heat radiating sheet 2 through the placing groove 8 and the heat conducting silica gel 9, in the transmission process, a part of the heat is radiated by utilizing the heat radiating holes 7 on the heat conducting sheet 2, then the heat is radiated by the heat radiating sheet 2 arranged in an aluminum extruding manner, the effect of rapid cooling is achieved, and the heat insulation layer 11 at the lower end of the, it is advantageous to protect the circuit board 1, which is the entire process of use of the high temperature resistant electronic components for smart phones.

Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.

Claims

1. A high temperature resistant electronics component for smart phones, comprising a circuit board (1), characterized in that: the welding of the upper end of the circuit board (1) is provided with an easily heating element (15), the lower end of the easily heating element (15) is provided with a welding foot (16), the upper end of the easily heating element (15) is provided with a heat-conducting silica gel (14), the upper end of the heat-conducting silica gel (14) is provided with a semicircular lug (13), the upper end of the semicircular lug (13) is provided with a heat-conducting cover (6), the upper end of the heat-conducting cover (6) is connected with a heat-conducting column (12), the upper end of the heat-conducting column (12) is connected with a copper coil (5), the outer side of the copper coil (5) is provided with a fixing frame (4), the lower end of the fixing frame (4) is provided with a heat-conducting fin (3), the outer side of the heat-conducting silicone grease (9) is provided with a heat-conducting silicone grease (2), and the inner, the bottom of the placing groove (8) is provided with a heat insulation layer (11), and the lower end of the heat insulation layer (11) is provided with a connecting bottom (10).

2. A high temperature resistant electronics component for a smartphone according to claim 1, wherein: the heat conduction cover (6) is of a structure shaped like a Chinese character 'men' made of copper-aluminum alloy, the semicircular convex block (13) is arranged at the upper end of the inside of the heat conduction cover (6), and the semicircular convex block (13) is the same as the heat conduction cover (6) in material and is of an integral structure.

3. A high temperature resistant electronics component for a smartphone according to claim 1, wherein: one end of the heat conducting fin (3) is connected to two sides of the heat conducting cover (6), the other end of the heat conducting fin (3) is placed inside the radiating fin (2) through the placing groove (8), and the contact gap between the heat conducting fin (3) and the radiating fin (2) is filled with heat conducting silicone grease (9).

4. A high temperature resistant electronics component for a smartphone according to claim 1, wherein: the radiating fins (2) are fixedly connected with the circuit board (1) through the connecting bottom (10), the radiating fins (2) are arranged at the upper end of the connecting bottom (10) in an aluminum extrusion mode, and radiating holes (7) are formed in the heat conducting fins (3) inside gaps of the radiating fins (2).

5. A high temperature resistant electronics component for a smartphone according to claim 1, wherein: the fixing frame (4) is fixed on the circuit board (1) through screws, one part of the heat conducting fins (3) is compressed by the fixing frame (4), and the fixing frame (4) is a cuboid frame made of red copper.

6. A high temperature resistant electronics component for a smartphone according to claim 1, wherein: the heat conducting fins (3) are provided with five heat conducting covers (6) which are symmetrical in action, the centers of the copper coil pipes (5) and the centers of the heat conducting covers (6) are positioned on the same vertical line, and the copper coil pipes (5) are provided with three circles which are internally and externally coiled.