CN220823564U - Mainboard and display device - Google Patents

Abstract

The utility model discloses a main board and a display device, wherein the main board comprises a board body, a processor, a heat radiation module and a strengthening component, and the board body comprises a board main body and a connecting column fixed on the board main body; the processor is arranged on one surface of the plate main body; the heat dissipation module comprises a heat dissipation component and a connecting piece which are connected, the connecting piece is connected to one end of the connecting column, the heat dissipation component is abutted with the processor, and the heat dissipation component is used for dissipating heat of the processor; the reinforcement component is connected to the other end of the connecting column and is positioned on the other surface of the plate main body. Through foretell heat dissipation module, can dispel the heat to the treater, reduce the risk that causes the temperature to rise too high because of the treater generates heat, be favorable to improving the stability of mainboard to heat dissipation module and reinforce the subassembly and all be connected to the plate body through the spliced pole, made things convenient for the installation.

Description

Mainboard and display device

Technical Field

The embodiment of the utility model relates to the field of circuit boards, in particular to a main board and a display device.

Background

A display device, which is generally a device for displaying images and playing sounds, is generally configured with a main board for processing signals, and common display devices include a conference display screen, a liquid crystal display, a touch integrated machine, a self-service terminal, and the like. Taking a liquid crystal display as an example, a main board and a PC module of the liquid crystal display are divided into two independent modules for connection, so that the liquid crystal display is convenient for modularized installation and replacement. However, the PC module is arranged outside the motherboard, which affects the efficiency of signal transmission of the PC module and the motherboard, so that the PC module is arranged on the motherboard in a common way to improve the efficiency of signal transmission, however, a processor of the PC module generates a large amount of heat during operation, and affects the normal operation of the entire motherboard in serious cases, thereby bringing inconvenience.

Disclosure of utility model

In order to solve the above technical problems, an embodiment of the utility model provides a motherboard capable of dissipating heat and a display device.

The technical scheme adopted by the embodiment of the utility model for solving the technical problems is as follows:

A main board comprises a board body, a processor, a heat radiation module and a strengthening component, wherein the board body comprises a board main body and a connecting column fixed on the board main body; the processor is arranged on one surface of the plate main body; the heat dissipation module comprises a heat dissipation assembly and a connecting piece which are connected, wherein the connecting piece is connected to one end of the connecting column, the heat dissipation assembly is abutted to the processor, and the heat dissipation assembly is used for dissipating heat of the processor; the reinforcing component is connected to the other end of the connecting column and is positioned on the other surface of the plate main body.

Optionally, the heat dissipation assembly includes a heat dissipation fan and a radiator, the heat dissipation fan is accommodated in the radiator, the radiator abuts against the processor, wherein the radiator includes a radiator main body and a bump connected with the radiator main body, and one end of the connecting piece passes through the bump and is connected with the connecting column.

Optionally, the number of the bumps is four, the four bumps are disposed around the cooling fan, the number of the connecting posts is four, the number of the connecting pieces is four, and one connecting piece passes through one bump to be connected with one connecting post.

Optionally, the heat dissipation assembly further includes a boss, where the boss is disposed on a surface of the heat sink facing the processor, and the boss abuts against the processor.

Optionally, the heat dissipation module further includes a heat conducting member, and the heat conducting member is disposed between the boss and the processor.

Optionally, the connector comprises a spring screw or a screw.

Optionally, the reinforcement assembly includes a metal sheet, an insulating member and a fastener, the insulating member is disposed on a surface of the metal sheet facing the plate body, the fastener penetrates through the metal sheet and the insulating member and then is connected to the connection post, and the insulating member is used for insulating the plate body from the metal sheet.

Optionally, the metal sheet is rectangular frame-shaped, and the metal sheet is arranged around the processor.

Optionally, the main board further includes foam, and the foam is installed at one end of the heat dissipation module, which is away from the processor.

The technical problems of the embodiment of the utility model are solved by adopting the following technical scheme:

The display device comprises the main board, the shell and the display main body, wherein the main board is arranged between the shell and the display main body, and the shell is arranged on the display main body.

The embodiment of the utility model has the beneficial effects that: the main board provided by the embodiment of the utility model comprises a board body, a processor, a heat dissipation module and a strengthening component, wherein the board body comprises a board main body and a connecting column fixed on the board main body; the processor is arranged on one surface of the plate main body; the heat dissipation module comprises a heat dissipation component and a connecting piece which are connected, the connecting piece is connected to one end of the connecting column, the heat dissipation component is abutted with the processor, and the heat dissipation component is used for dissipating heat of the processor; the reinforcement component is connected to the other end of the connecting column and is positioned on the other surface of the plate main body. Through foretell heat dissipation module, can dispel the heat to the treater, reduce the risk that causes the temperature to rise too high because of the treater generates heat, be favorable to improving the stability of mainboard. And the heat dissipation module and the reinforcing component are connected to the plate body through the connecting column, so that the installation is convenient.

Drawings

One or more embodiments are illustrated by way of example and not limitation in the figures of the accompanying drawings, in which like references indicate similar elements, and in which the figures of the drawings are not to be taken in a limiting sense, unless otherwise indicated.

FIG. 1 is a schematic diagram of a motherboard according to one embodiment of the present application;

FIG. 2 is a schematic diagram of another view of FIG. 1;

FIG. 3 is a schematic view of FIG. 1 taken along section line AA;

FIG. 4 is an exploded view of a portion of the structure of FIG. 1;

fig. 5 is a schematic structural diagram of a display device according to another embodiment of the present application;

FIG. 6 is an exploded view of the structure of FIG. 5;

In the figure: 100. a main board; 200. a housing; 300. a display main body; 400. a display device; 10. a plate body; 20. a processor; 30. a heat dissipation module; 40. a reinforcement assembly; 50. soaking cotton; 11. a plate main body; 12. a connecting column; 31. a heat dissipation assembly; 32. a connecting piece; 311. a heat radiation fan; 312. a heat sink; 3111. a fan body; 3112. a driving motor; 3121. a radiator body; 3122. a bump; 3123. a boss; 41. a metal sheet; 42. an insulating member; 43. a fastener.

Detailed Description

In order that the utility model may be readily understood, a more particular description thereof will be rendered by reference to specific embodiments that are illustrated in the appended drawings. It will be understood that when an element is referred to as being "fixed" to another element, it can be directly on the other element or one or more intervening elements may be present therebetween. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or one or more intervening elements may be present therebetween. The terms "upper," "lower," "inner," "outer," "vertical," "horizontal," and the like as used in this specification, refer to an orientation or positional relationship based on that shown in the drawings, merely for convenience of description and to simplify the description, and do not denote or imply that the devices or elements referred to must have a particular orientation, be constructed and operated in a particular orientation, and thus should not be construed as limiting the utility model. Furthermore, the terms "first," "second," and the like are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.

Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this utility model belongs. The terminology used in the description of the utility model herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the utility model. The term "and/or" as used in this specification includes any and all combinations of one or more of the associated listed items.

In addition, the technical features mentioned in the different embodiments of the utility model described below can be combined with one another as long as they do not conflict with one another.

As shown in fig. 1-3, a motherboard 100 according to one embodiment of the present application includes a board body 10, a processor 20, a heat dissipation module 30, and a reinforcement assembly 40. The processor 20 is mounted on one surface of the board 10, and the heat dissipation module 30 is mounted on the board 10 and abuts against the processor 20. The heat dissipation module 30 is used for dissipating heat from the processor 20. The reinforcing component 40 is disposed on the other surface of the board body 10, and is used for reinforcing the strength of the board body 10, so as to prevent the board body 10 from being deformed by the extrusion force and affecting the flatness of the surface of the mounting area of the processor 20, which is beneficial to improving the stability of the mounting position of the processor 20. Wherein the plate body 10 includes a plate main body 11 and a connection post 12 fixed on the plate main body 11; the heat dissipation module 30 includes a heat dissipation component 31 and a connecting member 32, wherein the connecting member 32 is connected to one end of the connecting column 12, and the reinforcement component 40 is connected to the other end of the connecting column 12. It should be understood that the connection member 32 may be a screw, a spring screw, or any other member as long as the heat dissipating assembly 31 is connected to the connection post 12. In the present embodiment, the connecting member 32 is a spring screw, which can ensure the connection with the heat dissipation component 31 without falling off, and can avoid loosening with the connecting post 12.

In this way, through the above heat dissipation module 30, heat can be dissipated to the processor 20, which reduces the risk of excessively high temperature rise caused by heat generation of the processor 20, and is beneficial to improving the stability of the motherboard 100. Meanwhile, the strength of the board body 10 can be enhanced by the reinforcing component 40, so that the risk that the surface flatness of the mounting area of the processor 20 is affected due to the fact that the board body 10 is bent under the action of external force is reduced, and the risk that the processor 20 is stressed is reduced. And the heat dissipation module 30 and the reinforcement assembly 40 are connected to the board body 10 through the connection posts 12, thereby facilitating installation.

It should be understood that the motherboard 100 further includes a power connector mounted on the board body 10, a hard disk slot for plugging in a storage disk, and other existing components such as a memory socket for mounting a memory bank, which will not be described herein.

In some embodiments, referring to fig. 3 and 4, the heat dissipation assembly 31 includes a heat dissipation fan 311 and a heat sink 312, the heat dissipation fan 311 is accommodated in the heat sink 312, and the heat sink 312 abuts against the processor 20. The heat dissipation fan 311 includes a fan body 3111 and a driving motor 3112, wherein the driving motor 3112 is fixed to the heat sink 312, and the driving motor 3112 is used for driving the fan body 3111 to rotate. The heat sink 312 includes a heat sink body 3121 and a protrusion 3122 connected to the heat sink body 3121, and one end of the connection member 32 passes through the protrusion 3122 and is connected to the connection post 12, thus achieving connection between the heat sink body 3121 and the plate body 10.

Further, the number of the protrusions 3122 is four, and the four protrusions 3122 are disposed around the heat dissipation fan 311, that is, four corners of the heat sink main body 3121 are respectively connected with the protrusions 3122. The number of the connecting posts 12 is four, the number of the connecting members 32 is four, and one connecting member 32 is connected to one connecting post 12 through one bump 3122. It should be appreciated that the tab 3122 is provided with relief holes (not shown) for the passage of the connector 32. In the present embodiment, the radiator body 3121 is formed by connecting a plurality of heat conductive scales, and the heat conductive scales are disposed in a gap between each other to facilitate heat exchange.

In some embodiments, the heat sink 312 further includes a boss 3123, where the boss 3123 is disposed on a surface of the heat sink 312 facing the processor 20, and the boss 3123 abuts against the processor 20, so as to absorb heat generated during operation of the processor 20 and transfer the heat to the heat sink main body 3121. With the boss 3123, there is a gap between the heat sink body 3121 and the processor 20 into which air may enter, thereby facilitating heat exchange.

Further, the heat dissipation module 30 further includes a heat conducting member (not shown) disposed between the boss 3123 and the processor 20, the heat conducting member being configured to conduct heat emitted from the processor 20 to the boss 3123 and indirectly to the heat sink body 3121. It can be appreciated that the heat conducting member is made of a material with a better heat conducting property, so that the heat of the processor 20 can be conducted more, and the effect of rapid cooling is achieved. In the present embodiment, the heat conductive member is a heat conductive silicone grease layer coated on the surface of the boss 3123.

In some embodiments, the reinforcement assembly 40 includes a metal sheet 41, an insulating member 42, and a fastener 43, where the insulating member 42 is disposed on a surface of the metal sheet 41 facing the plate body 10, and the fastener 43 passes through the metal sheet 41 and the insulating member 42 and is connected to the connection post 12, and the insulating member 42 is used to insulate the plate body 10 from the metal sheet 41. Since the metal sheet 41 has a certain hardness and can play a role in resisting bending, the metal sheet 41 is mounted on the plate body 10 to strengthen the plate body 10. In this embodiment, the metal sheet 41 has a rectangular frame shape, and the metal sheet 41 is disposed around the processor 20. The metal sheet 41 may be an iron sheet or a sheet made of another metal.

The insulating member 42 may be made of any insulating material as long as insulation between the metal sheet 41 and the board body 10 can be achieved. In this embodiment, the insulating member 42 is an insulating mylar.

The fastener 43 may be a screw or the like, so long as it can connect the metal sheet 41 to the connection post 12 to fix the metal sheet 41 and the plate body 10 relatively. In the present embodiment, the fasteners 43 are screws, and the number of the fasteners is four, and the four screws are respectively disposed at four corners of the metal sheet, so as to connect the metal sheet 41 to the board body 10.

Along the direction of the reinforcement member 40 toward the processor 20, the projection of the metal sheet 41 is located within the projection of the heat dissipation module 30, so that the strength of the heat dissipation module 30 in the mounting area of the board body 10 can be enhanced.

In some embodiments, the motherboard 100 further includes a foam 50, the foam 50 being mounted at an end of the heat dissipation module 30 facing away from the processor 20. In the present embodiment, the foam 50 is mounted on an end surface of the radiator body 3121 facing away from the processor 20. Thus, when the main board 100 is mounted on the housing of the display device, the foam 50 can be tightly adhered to the surface of the housing, so that the air inlet of the cooling fan 311 is separated from the housing, hot air in the housing is prevented from entering from the air inlet of the cooling fan 311, low-temperature air is ensured to enter from the air inlet of the housing, and hot air passing through the radiator 312 is dispersed from the heat dissipation hole of the housing, thereby being beneficial to improving heat dissipation efficiency.

The motherboard 100 provided by the embodiment of the application comprises a board body 10, a processor 20, a heat dissipation module 30 and a reinforcement assembly 40, wherein the board body 10 comprises a board main body 11 and a connecting column 12 fixed on the board main body 11; the processor 20 is mounted on one side of the board main body 11; the heat dissipation module 30 includes a heat dissipation component 31 connected to each other, and a connecting member 32, where the connecting member 32 is connected to one end of the connecting post 12, the heat dissipation component 31 abuts against the processor 20, and the heat dissipation component 31 is used for dissipating heat from the processor 20; the reinforcement member 40 is connected to the other end of the connection post 12 and is located at the other side of the plate body 11. Through the above heat dissipation module 30, the heat dissipation of the processor 20 can be performed, which reduces the risk of excessively high temperature rise caused by the heat generation of the processor 20 and is beneficial to improving the stability of the motherboard 100. In addition, the reinforcement component 40 can strengthen the board body 10, reduce the risk of the processor 20 being stressed by external force, and is beneficial to enhancing the stability of the motherboard 100.

Referring to fig. 5 and fig. 6, a display device 400 according to another embodiment of the application includes a main board 100, a housing 200, and a display main body 300 according to the above embodiment, wherein the main board 100 is mounted between the housing 200 and the display main body 300, and the housing 200 is mounted on the display main body 300. Wherein, the casing 200 is provided with a plurality of air inlet holes and a plurality of heat dissipation holes, and the plurality of air inlet holes are located at one side of the heat dissipation module 30 of the main board 100, which is away from the board body 10, and the plurality of heat dissipation holes are used for supplying hot air blown by the heat dissipation fan 311 to flow out of the casing.

The foregoing description is only of embodiments of the present utility model, and is not intended to limit the scope of the utility model, and all equivalent structures or equivalent processes using the descriptions and the drawings of the present utility model or directly or indirectly applied to other related technical fields are included in the scope of the present utility model.

Claims (10)

1. A motherboard, comprising:

the plate body comprises a plate main body and a connecting column fixed on the plate main body;

a processor mounted on one surface of the board main body;

The heat dissipation module comprises a heat dissipation assembly and a connecting piece, wherein the heat dissipation assembly and the connecting piece are connected, the connecting piece is connected to one end of the connecting column, the heat dissipation assembly is abutted to the processor, and the heat dissipation assembly is used for dissipating heat of the processor;

And the reinforcing component is connected to the other end of the connecting column and positioned on the other surface of the plate main body.

2. The motherboard of claim 1, wherein the heat dissipating assembly comprises a heat dissipating fan and a heat sink, the heat dissipating fan is accommodated in the heat sink, the heat sink abuts against the processor, wherein the heat sink comprises a heat sink body and a bump connected with the heat sink body, and one end of the connecting piece passes through the bump and is connected with the connecting post.

3. The motherboard of claim 2, wherein the number of said bumps is four, four said bumps are disposed around said cooling fan, the number of said connecting posts is four, the number of said connecting members is four, and one of said connecting members is connected to one of said connecting posts through one of said bumps.

4. The motherboard of claim 2, wherein the heat dissipation assembly further comprises a boss disposed on a side of the heat sink facing the processor, the boss abutting the processor.

5. The motherboard of claim 4, wherein said heat dissipation module further comprises a thermally conductive member disposed between said boss and said processor.

6. The motherboard of claim 1, wherein the connector comprises a spring screw or a screw.

7. The motherboard of claim 1, wherein the reinforcement assembly comprises a metal sheet, an insulating member, and a fastener, the insulating member is disposed on a surface of the metal sheet facing the board body, the fastener penetrates through the metal sheet and the insulating member and then is connected to the connection post, and the insulating member is used for insulating the board body from the metal sheet.

8. The motherboard of claim 7, wherein said metal sheet has a rectangular frame shape, said metal sheet being disposed around said processor.

9. The motherboard of any one of claims 1-8, further comprising foam mounted to an end of the heat dissipation module facing away from the processor.

10. A display device comprising the main board according to any one of claims 1 to 9, a housing, and a display main body, the main board being mounted between the housing and the display main body, the housing being mounted to the display main body.