CN212749709U

CN212749709U - Computer motherboard radiator

Info

Publication number: CN212749709U
Application number: CN202021567045.4U
Authority: CN
Inventors: 王鹏程
Original assignee: Shenzhen Xufeng High Tech Electronics Co ltd
Current assignee: Shenzhen Xufeng High Tech Electronics Co ltd
Priority date: 2020-07-31
Filing date: 2020-07-31
Publication date: 2021-03-19
Anticipated expiration: 2030-07-31

Abstract

The utility model discloses a computer motherboard radiator, including radiating fin, fixed plate, heat conduction post, dustcoat and heat dissipation fan, radiating fin has a plurality of and equidistance setting, and the radiating fin's in the outside is provided with the fixed plate, and the fixed plate is the L template, and a plurality of radiating fin's both sides and center have all been pegged graft and have the heat conduction post, and the outside that the fixed plate was all worn out at three heat conduction post both ends is provided with the screw thread in the end of wearing out, and the heat conduction post is worn out end screw thread and is connected with the fixed thread cover. The utility model provides a pair of according to the whole size of computer motherboard when computer motherboard radiator installs, select the radiating fin of suitable quantity, and insert three heat conduction posts, and it is fixed with a plurality of radiating fin in both ends screw in fixed thread bush, align the third screw thread fixed orifices and the screw in gasket center with the second screw thread fixed orifices on the mounting on the dustcoat of top afterwards, accomplish the installation operation, the device can adapt to the radiating work of not unidimensional mainboard, make the radiating effect better.

Description

Computer motherboard radiator

Technical Field

The utility model relates to a computer motherboard heat dissipation field particularly, relates to a computer motherboard radiator.

Background

The motherboard, also called a motherboard, is installed in a computer main chassis, is one of the most basic and important components of a computer, and plays a role in the whole computer system. The quality of the manufactured motherboard determines the stability of the hardware system. The mainboard is closely related to the CPU, and the major upgrading of the CPU each time inevitably leads to the upgrading of the mainboard. The main board is the core of a computer hardware system and is also a printed circuit board with the largest area in the main case. The main function of the main board is to transmit various electronic signals, and part of the chips are also responsible for primarily processing some peripheral data. All components in the computer host are connected through a mainboard, and the control of the computer on the system memory, the storage device and other I/O devices during normal operation is completed through the mainboard. Whether the performance of the computer is fully developed, whether the hardware functions are sufficient, and how compatible the hardware is, etc., depend on the design of the motherboard. The quality of the motherboard determines to some extent the overall performance, age and functional scalability of a computer.

The heat dissipation work of computer mainboard in the course of the work is very important, if fail in time to spill can cause serious loss to the mainboard, but the fixed quantity that can't effectively increase or reduce radiating fin according to the size of mainboard of traditional computer mainboard's radiator mechanism adapts to the mainboard of different sizes.

An effective solution to the problems in the related art has not been proposed yet.

SUMMERY OF THE UTILITY MODEL

An object of the utility model is to provide a computer motherboard radiator to solve the problem that proposes among the above-mentioned background art.

In order to achieve the above object, the utility model provides a following technical scheme: the utility model provides a computer motherboard radiator, includes radiating fin, fixed plate, heat conduction post, dustcoat and heat dissipation fan, its characterized in that, radiating fin has a plurality ofly and equidistance setting, the outside radiating fin's the outside is provided with the fixed plate, the fixed plate is the L template, and is a plurality of radiating fin's both sides and center are all pegged graft and are had the heat conduction post, three the heat conduction post both ends are all worn out the outside of fixed plate and are provided with the screw thread in the end of wearing out, the heat conduction post is worn out end screw thread and is connected with the fixed thread cover, the fixed thread cover screw in face is hugged closely the lateral surface of fixed plate, and is a plurality of be provided with directly over radiating fin the dustcoat, the dustcoat.

Furthermore, the fixing parts are arranged on two sides of the outer cover, second threaded fixing holes vertically penetrate through the fixing parts, the bottom surfaces of the fixing parts are lapped on a plurality of fixing gaskets arranged on the radiating fins, and bolts are connected with the inner threads of the second threaded fixing holes in a threaded manner and penetrate through the holes to be in the third threaded fixing holes formed in the fixing gaskets.

Furthermore, the fixing gasket is made of the same material as the radiating fins, and the fixing gasket is welded with the radiating fins on the contact surface.

Furthermore, the radiating fin is formed by pressing two copper sheets and two aluminum sheets.

Furthermore, a plurality of semicircular grooves are formed in the lower pressing surface of the copper sheet and are matched with a plurality of semicircular convex grains arranged on the upper pressing surface of the aluminum sheet.

Furthermore, the lower pressing surface of the aluminum sheet is provided with a plurality of semicircular grooves which are matched with a plurality of semicircular convex grains arranged on the upper pressing surface of the copper sheet.

Furthermore, two first thread fixing holes are formed in the lower fixing surface of the fixing plate and are fixed on the computer main board through screws.

Furthermore, the heat dissipation fan is fixedly connected to the center of the top surface of the fixing frame arranged on the top surface of the outer cover.

Compared with the prior art, the utility model discloses following beneficial effect has:

(1) the utility model provides a pair of according to the whole size of computer motherboard when computer motherboard radiator installs, select the radiating fin of suitable quantity, and insert three heat conduction posts, and it is fixed with a plurality of radiating fin in both ends screw in fixed thread bush, align the third screw thread fixed orifices and the screw in gasket center with the second screw thread fixed orifices on the mounting on the dustcoat of top afterwards, accomplish the installation operation, the device can adapt to the radiating work of not unidimensional mainboard, make the radiating effect better.

Drawings

In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings required to be used in the embodiments will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to these drawings without creative efforts.

Fig. 1 is an exploded view of a computer motherboard heat sink according to an embodiment of the present invention;

fig. 2 is a schematic diagram of an internal structure of a heat dissipation fin of a computer motherboard heat sink according to an embodiment of the present invention.

Reference numerals:

1. a heat dissipating fin; 2. a fixing plate; 3. a heat-conducting column; 4. fixing the threaded sleeve; 5. a first threaded fixing hole; 6. fixing a gasket; 7. a housing; 8. a fixing member; 9. a heat dissipation fan; 10. a fixed mount; 11. a second threaded fixing hole; 12. a copper sheet; 13. aluminum sheets; 14. a semicircular groove; 15. semicircular convex grains; 16. and a third threaded fixing hole.

Detailed Description

The technical solution in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, rather than all embodiments, and all other embodiments obtained by a person of ordinary skill in the art without creative work belong to the protection scope of the present invention based on the embodiments of the present invention.

In the description of the present invention, it should be noted that the terms "top", "bottom", "one side", "the other side", "front", "back", "middle part", "inside", "top", "bottom", etc. indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings, which is only for the convenience of description and simplification of the description, but does not indicate or imply that the device or element referred to must have a specific orientation, be constructed in a specific orientation, and be operated, and thus, should not be construed as limiting the present invention; the terms "first," "second," and "third" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance; furthermore, unless expressly stated or limited otherwise, the terms "mounted," "connected," and "connected" are to be construed broadly, as they may be fixedly connected, detachably connected, or integrally connected, for example; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meaning of the above terms in the present invention can be understood in specific cases to those skilled in the art.

Referring to fig. 1-2, a computer motherboard heat sink according to an embodiment of the present invention includes heat dissipating fins 1, a fixing plate 2, heat conducting pillars 3, a housing 7 and a heat dissipating fan 9, it is characterized in that a plurality of radiating fins 1 are arranged at equal intervals, the fixing plate 2 is arranged at the outer side of the radiating fin 1 at the outermost side, the fixing plate 2 is an L-shaped plate, the heat-conducting columns 3 are inserted at the two sides and the center of the plurality of radiating fins 1, the two ends of the three heat-conducting columns 3 penetrate out of the outer side of the fixing plate 2 and are provided with threads at the penetrating ends, the heat-conducting column 3 is connected with a fixed thread sleeve 4 through a thread at the penetrating end, the screwing-in surface of the fixed thread sleeve 4 is tightly attached to the outer side surface of the fixed plate 2, the outer cover 7 is arranged right above the heat-radiating fins 1, and the heat-radiating fan 9 is arranged inside the outer cover 7.

Through the above technical scheme of the utility model, 7 both sides of dustcoat all are provided with mounting 8, 8 inside vertical penetrations of mounting have second thread fixing hole 11, 8 bottom surfaces of mounting overlap joint in a plurality of on the fixed shim 6 that sets up on the radiating

fin

1, 11 inside threaded connection of second thread fixing hole have the bolt and wear out downthehole with 16 inside third thread fixing holes that set up on the fixed shim 6.

Through the above technical scheme of the utility model, fixed gasket 6 adopt with the same material of radiating fin 1 is made, fixed gasket 6 and contact surface radiating fin 1 welds mutually.

Through the above technical scheme of the utility model, radiating fin 1 comprises two copper sheets 12 and two aluminum sheets 13 pressfittings.

Through the above technical scheme of the utility model, the lower pressfitting face of copper sheet 12 be provided with a plurality of semicircular groove 14 and with a plurality of semicircle convex particles 15 that set up on the last pressfitting face of aluminum sheet 13 agree with mutually.

Through the above technical scheme of the utility model, aluminum sheet 13's lower pressfitting face be provided with a plurality of semicircular groove 14 and with a plurality of semicircle convex particles 15 that set up on copper sheet 12's the last pressfitting face agree with mutually.

Through the above technical scheme of the utility model, be provided with two first thread fixing holes 5 under the fixed plate 2 on the stationary plane and through the screw fixation on the computer motherboard.

Through the above technical scheme of the utility model, heat dissipation fan 9 fixed connection in the center of the mount 10 top surface that the 7 top surfaces of dustcoat set up.

During specific application, during installation, according to the overall size of a computer mainboard, a proper number of radiating fins 1 are selected, three heat-conducting columns 3 are inserted, the two ends of the radiating fins are screwed into the fixing threaded sleeves 4 to fix the radiating fins 1, and then the second threaded fixing holes 11 in the fixing pieces 8 on the upper outer cover 7 are aligned to the third threaded fixing holes 16 in the center of the fixing gaskets 6 and screwed into screws, so that the installation operation is completed.

Finally, it should be noted that: although the present invention has been described in detail with reference to the foregoing embodiments, it will be apparent to those skilled in the art that modifications may be made to the embodiments described in the foregoing embodiments, or equivalents may be substituted for elements thereof. Any modification, equivalent replacement, or improvement made within the spirit and principle of the present invention should be included in the protection scope of the present invention.

Claims

1. A computer motherboard radiator comprises a plurality of radiating fins (1), a fixing plate (2), heat-conducting columns (3), an outer cover (7) and radiating fans (9), and is characterized in that the radiating fins (1) are arranged at equal intervals, the fixing plate (2) is arranged on the outer side of the outermost radiating fin (1), the fixing plate (2) is an L-shaped plate, the heat-conducting columns (3) are inserted into the two sides and the center of the radiating fins (1), the two ends of the three heat-conducting columns (3) penetrate out of the outer side of the fixing plate (2) and are provided with threads at penetrating ends, the penetrating ends of the heat-conducting columns (3) are connected with fixing thread sleeves (4) in a threaded manner, the screw-in surfaces of the fixing thread sleeves (4) are tightly attached to the outer side surface of the fixing plate (2), and the outer cover (7) is arranged right above the radiating fins (1), the heat dissipation fan (9) is arranged inside the outer cover (7).

2. The computer motherboard heat sink according to claim 1, wherein fixing pieces (8) are disposed on both sides of the outer cover (7), second threaded fixing holes (11) vertically penetrate through the fixing pieces (8), the bottom surfaces of the fixing pieces (8) are lapped on fixing gaskets (6) disposed on the plurality of heat dissipating fins (1), and bolts are connected to the inner threads of the second threaded fixing holes (11) and penetrate through the inner threads of the second threaded fixing holes (11) and the third threaded fixing holes (16) disposed on the fixing gaskets (6).

3. The computer motherboard heat sink according to claim 2, wherein said fixing pad (6) is made of the same material as said heat dissipating fin (1), and said fixing pad (6) is welded to said heat dissipating fin (1) of the contact surface.

4. The computer motherboard heat sink according to claim 1, wherein said heat sink fins (1) are formed by laminating two copper sheets (12) and two aluminum sheets (13).

5. The computer motherboard heat sink according to claim 4, wherein the lower press-fit surface of said copper sheet (12) is provided with a plurality of semicircular grooves (14) and is engaged with a plurality of semicircular protrusions (15) provided on the upper press-fit surface of said aluminum sheet (13).

6. The computer motherboard heat sink according to claim 4, wherein the lower press-fit surface of said aluminum sheet (13) is provided with a plurality of semicircular grooves (14) and is engaged with a plurality of semicircular protrusions (15) provided on the upper press-fit surface of said copper sheet (12).

7. The computer motherboard heat sink according to claim 1, wherein two first threaded fixing holes (5) are provided on the lower fixing surface of the fixing plate (2) and are fixed on the computer motherboard by screws.

8. The computer motherboard heat sink according to claim 1, wherein said heat dissipating fan (9) is fixedly attached to the center of the top surface of a fixing frame (10) provided on the top surface of said housing (7).