CN210466230U

CN210466230U - Computer motherboard with bidirectional heat dissipation function

Info

Publication number: CN210466230U
Application number: CN201922161498.0U
Authority: CN
Inventors: 黄枧清
Original assignee: Shenzhen Yupu Technology Co ltd
Current assignee: Shenzhen Yupu Technology Co ltd
Priority date: 2019-12-05
Filing date: 2019-12-05
Publication date: 2020-05-05
Anticipated expiration: 2029-12-05

Abstract

The utility model discloses a two-way radiating computer motherboard, including mount pad and computer motherboard body, the mounting groove has been seted up on the top of mount pad, be equipped with the heat dissipation copper in the mounting groove, just the lateral wall of heat dissipation copper and the inner wall fixed connection of mount pad, computer motherboard body sets up in the top of heat dissipation copper, just the bottom of computer motherboard body is located the mounting groove, computer motherboard body passes through fixed establishment with the mount pad and is connected, first through-hole has been seted up to the bottom inner wall of mounting groove, be equipped with the heat dissipation fan in the first through-hole. A two-way radiating computer motherboard, through the heat on heat dissipation copper and the fin conduction computer motherboard body, and then through the two-way heat dissipation of the cooperation of heat dissipation fan and guide plate for the radiating effect is good, and makes the relative mount pad elastic connection of heat dissipation fan, reduces the influence of heat dissipation fan vibration to computer motherboard body.

Description

Computer motherboard with bidirectional heat dissipation function

Technical Field

The utility model relates to a computer field, in particular to two-way radiating computer motherboard.

Background

Computers are now widely used in various fields and industries, and computer boards are central or main circuit boards that constitute complex electronic systems such as electronic computers. A typical motherboard can provide a series of connections for a processor, graphics card, sound card, hard drive, memory, external device, etc. The most important component is the chipset on the mainboard, and the core component of prior art's computer is the computer motherboard, and the computer motherboard is direct or install in the computer through the mount pad, and prior art's computer motherboard mount pad structure radiating effect is poor, can take place the vibration when the heat dissipation fan moves in addition, and along with the increase of time, can cause the influence to the computer motherboard, directly leads to the unable normal operating of mainboard even.

SUMMERY OF THE UTILITY MODEL

A primary object of the present invention is to provide a two-way radiating computer motherboard, which can effectively solve the problems in the background art.

In order to achieve the above purpose, the utility model adopts the following technical scheme:

a computer mainboard capable of dissipating heat in two directions comprises a mounting seat and a computer mainboard body, wherein the top end of the mounting seat is provided with a mounting groove, a heat-dissipating copper plate is arranged in the mounting groove, the side wall of the heat-dissipating copper plate is fixedly connected with the inner wall of the mounting seat, the computer mainboard body is arranged at the top end of the heat-dissipating copper plate, the bottom of the computer mainboard body is positioned in the mounting groove, the computer mainboard body is connected with the mounting seat through a fixing mechanism, the inner wall of the bottom end of the mounting groove is provided with a first through hole, a heat-dissipating fan is arranged in the first through hole, the heat-dissipating fan is connected with the mounting seat through an elastic mechanism, the bottom end of the heat-dissipating copper plate is fixedly connected with a flow guide plate positioned above the heat-dissipating fan, a plurality of heat-dissipating fins are symmetrically arranged on two sides of the flow, a plurality of first louvres are seted up to one side of fin, a plurality of second louvres are seted up to the bilateral inner wall symmetry of mounting groove, the bottom bilateral symmetry of mount pad is equipped with first L shape connecting plate, first L shape connecting plate and mount pad fixed connection.

Preferably, elastic mechanism sets up in the second L shape connecting plate of heat dissipation fan bottom both sides including the symmetry, second L shape connecting plate and heat dissipation fan fixed connection, a plurality of second through-holes have been seted up on the second L shape connecting plate, be equipped with first dead lever in the second through-hole, the top and the mount pad fixed connection of first dead lever, the bottom cover of first dead lever is equipped with first solid fixed ring, all be equipped with a plurality of springs between second L shape connecting plate and the mount pad and between second L shape connecting plate and the first solid fixed ring, just the outside of first dead lever is located to the spring housing.

Preferably, an elastic ring is arranged between the second through hole and the first fixing rod, and the first fixing ring is in threaded connection with the first fixing rod.

Preferably, fixed establishment is including setting up in the press platen of computer motherboard body top both sides, the top bilateral symmetry of mount pad is equipped with a plurality of second dead levers, second dead lever and mount pad fixed connection, just the top of second dead lever is run through the press platen, the outside cover of second dead lever is equipped with and is located the solid fixed ring of second on press platen top, the solid fixed ring of second is threaded connection with the connected mode of second dead lever.

Preferably, the cross section of the guide plate is of a triangular structure.

Preferably, a plurality of mounting holes are formed in the first L-shaped connecting plate.

Compared with the prior art, the utility model discloses following beneficial effect has: through setting up the heat dissipation copper, the computer motherboard body, first through-hole, the heat dissipation fan, the guide plate, the fin, the mating reaction of first louvre and second louvre, through the heat on heat dissipation copper and the fin conduction computer motherboard body, and then through the cooperation two-way heat dissipation of heat dissipation fan and guide plate, make the radiating effect good, elastic mechanism through setting up, make the relative mount pad elastic connection of heat dissipation fan, reduce the influence of heat dissipation fan vibration to the computer motherboard body, through the fixed establishment who sets up, can be simple convenient carry out the dismouting to the computer motherboard body.

Drawings

Fig. 1 is a schematic view of an overall structure of a bidirectional heat dissipation computer motherboard according to the present invention;

fig. 2 is a front cross-sectional view of a computer motherboard with bidirectional heat dissipation according to the present invention;

FIG. 3 is an enlarged view of a portion of FIG. 2 at A;

fig. 4 is a side view of the computer motherboard with bidirectional heat dissipation according to the present invention.

In the figure: 1. a mounting seat; 2. mounting grooves; 3. a heat-dissipating copper plate; 4. a computer motherboard body; 5. a first through hole; 6. a heat dissipation fan; 7. a baffle; 8. a heat sink; 9. a first heat dissipation hole; 10. a second heat dissipation hole; 11. a first L-shaped connecting plate; 12. a second through hole; 13. a first fixing lever; 14. a spring; 15. a first retaining ring; 16. a pressing plate; 17. a second fixing bar; 18. a second retaining ring; 19. mounting holes; 20. a second L-shaped connecting plate.

Detailed Description

In order to make the technical means, creation features, achievement purposes and functions of the present invention easy to understand, the present invention is further described below with reference to the following embodiments.

In the description of the present invention, it should be noted that the terms "upper", "lower", "inner", "outer", "front end", "rear end", "both ends", "one end", "the other end" and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of description and simplification of description, but do not indicate or imply that the device or element to which the reference is made must have a specific orientation, be constructed in a specific orientation, and be operated, and thus, should not be construed as limiting the present invention. Furthermore, the terms "first" and "second" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.

In the description of the present invention, it is to be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "disposed," "connected," and the like are to be construed broadly, and for example, "connected" may be either fixedly connected or detachably connected, or integrally connected; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meaning of the above terms in the present invention can be understood in specific cases to those skilled in the art.

As shown in FIGS. 1-4, a computer motherboard with bidirectional heat dissipation comprises a mounting seat 1 and a computer motherboard body 4, wherein the top end of the mounting seat 1 is provided with a mounting groove 2, a heat dissipation copper plate 3 is arranged in the mounting groove 2, the side wall of the heat dissipation copper plate 3 is fixedly connected with the inner wall of the mounting seat 1, the computer motherboard body 4 is arranged at the top end of the heat dissipation copper plate 3, the bottom of the computer motherboard body 4 is positioned in the mounting groove 2, the computer motherboard body 4 is connected with the mounting seat 1 through a fixing mechanism, the inner wall of the bottom end of the mounting groove 2 is provided with a first through hole 5, a heat dissipation fan 6 is arranged in the first through hole 5, the heat dissipation fan 6 is connected with the mounting seat 1 through an elastic mechanism, the bottom end of the heat dissipation copper plate 3 is fixedly connected with a flow guide plate 7 positioned above the heat dissipation fan 6, a plurality of heat, the bottom end of the radiating fin 8 is fixedly connected with the inner wall of the bottom end of the mounting groove 2, one side of the radiating fin 8 is provided with a plurality of first radiating holes 9, the inner walls of two sides of the mounting groove 2 are symmetrically provided with a plurality of second radiating holes 10, two sides of the bottom end of the mounting seat 1 are symmetrically provided with first L-shaped connecting plates 11, and the first L-shaped connecting plates 11 are fixedly connected with the mounting seat 1;

the elastic mechanism comprises second L-shaped connecting plates 20 symmetrically arranged on two sides of the bottom end of the heat dissipation fan 6, the second L-shaped connecting plates 20 are fixedly connected with the heat dissipation fan 6, a plurality of second through holes 12 are formed in the second L-shaped connecting plates 20, first fixing rods 13 are arranged in the second through holes 12, the top ends of the first fixing rods 13 are fixedly connected with the mounting seat 1, first fixing rings 15 are sleeved at the bottom ends of the first fixing rods 13, a plurality of springs 14 are arranged between the second L-shaped connecting plates 20 and the mounting seat 1 and between the second L-shaped connecting plates 20 and the first fixing rings 15, and the springs 14 are sleeved outside the first fixing rods 13; an elastic ring is arranged between the second through hole 12 and the first fixing rod 13, and the first fixing ring 15 is in threaded connection with the first fixing rod 13; the fixing mechanism comprises pressing plates 16 arranged on two sides of the top end of the computer main board body 4, a plurality of second fixing rods 17 are symmetrically arranged on two sides of the top end of the mounting seat 1, the second fixing rods 17 are fixedly connected with the mounting seat 1, the top ends of the second fixing rods 17 penetrate through the pressing plates 16, second fixing rings 18 located at the top ends of the pressing plates 16 are sleeved outside the second fixing rods 17, and the second fixing rings 18 are connected with the second fixing rods 17 in a threaded mode; the cross section of the guide plate 7 is of a triangular structure; the first L-shaped connecting plate 11 is provided with a plurality of mounting holes 19.

It should be noted that, the utility model relates to a computer motherboard with bidirectional heat dissipation, when in use, the heat dissipation fan 6 is externally connected with a control switch and a power supply, the heat on the computer motherboard body 4 is conducted through the heat dissipation copper plate 3 and the heat dissipation fins 8, the heat dissipation area is increased, and then the heat dissipation fan 6 is started, so that the air enters the mounting groove 2 through the heat dissipation fan 6, the air flows in two directions through the guide plate 7, and then the heat on the heat dissipation copper plate 3 and the heat dissipation fins 8 is taken away, so that the heat dissipation effect is better, the vibration generated by the operation of the heat dissipation fan 6 is reduced, through the elasticity of the spring 14 and the elastic ring, the influence of the vibration of the heat dissipation fan 6 on the computer motherboard body 4 is reduced, when the computer motherboard body 4 needs to be removed, only the second fixing ring 18 needs to be rotated, so that the second fixing ring 18 is separated from the second, and then lift computer motherboard body 4 up, can take out computer motherboard body 4, when needing to install computer motherboard body 4, the above-mentioned split step of reverse operation can.

The basic principles and the main features of the invention and the advantages of the invention have been shown and described above. It will be understood by those skilled in the art that the present invention is not limited to the above embodiments, and that the foregoing embodiments and descriptions are provided only to illustrate the principles of the present invention without departing from the spirit and scope of the present invention. The scope of the invention is defined by the appended claims and equivalents thereof.

Claims

1. The utility model provides a two-way radiating computer motherboard which characterized in that: comprises a mounting seat (1) and a computer mainboard body (4), wherein the top end of the mounting seat (1) is provided with a mounting groove (2), a heat-radiating copper plate (3) is arranged in the mounting groove (2), the side wall of the heat-radiating copper plate (3) is fixedly connected with the inner wall of the mounting seat (1), the computer mainboard body (4) is arranged at the top end of the heat-radiating copper plate (3), the bottom of the computer mainboard body (4) is positioned in the mounting groove (2), the computer mainboard body (4) is connected with the mounting seat (1) through a fixing mechanism, the inner wall of the bottom end of the mounting groove (2) is provided with a first through hole (5), a heat-radiating fan (6) is arranged in the first through hole (5), the heat-radiating fan (6) is connected with the mounting seat (1) through an elastic mechanism, the bottom end of the heat-radiating copper plate (3) is fixedly connected with a guide plate (7), the bilateral symmetry of guide plate (7) is equipped with a plurality of fin (8), the top and the heat dissipation copper (3) fixed connection of fin (8), the bottom of fin (8) and the bottom inner wall fixed connection of mounting groove (2), a plurality of first louvre (9) have been seted up to one side of fin (8), a plurality of second louvre (10) have been seted up to the bilateral inner wall symmetry of mounting groove (2), the bottom bilateral symmetry of mount pad (1) is equipped with first L shape connecting plate (11), first L shape connecting plate (11) and mount pad (1) fixed connection.

2. The computer motherboard with bidirectional heat dissipation according to claim 1, wherein: elastic mechanism sets up in second L shape connecting plate (20) of heat dissipation fan (6) bottom both sides including the symmetry, second L shape connecting plate (20) and heat dissipation fan (6) fixed connection, a plurality of second through-holes (12) have been seted up on second L shape connecting plate (20), be equipped with first dead lever (13) in second through-hole (12), the top and mount pad (1) fixed connection of first dead lever (13), the bottom cover of first dead lever (13) is equipped with first solid fixed ring (15), all be equipped with a plurality of springs (14) between second L shape connecting plate (20) and mount pad (1) and between second L shape connecting plate (20) and first solid fixed ring (15), just the outside of first dead lever (13) is located to spring (14) cover.

3. The computer motherboard with bidirectional heat dissipation according to claim 2, wherein: an elastic ring is arranged between the second through hole (12) and the first fixing rod (13), and the first fixing ring (15) is connected with the first fixing rod (13) in a threaded manner.

4. The computer motherboard with bidirectional heat dissipation according to claim 1, wherein: the fixing mechanism comprises pressing plates (16) arranged on two sides of the top end of a computer main board body (4), a plurality of second fixing rods (17) are symmetrically arranged on two sides of the top end of a mounting seat (1), the second fixing rods (17) are fixedly connected with the mounting seat (1), the top ends of the second fixing rods (17) penetrate through the pressing plates (16), second fixing rings (18) located on the tops of the pressing plates (16) are sleeved outside the second fixing rods (17), and the second fixing rings (18) are connected with the second fixing rods (17) in a threaded mode.

5. The computer motherboard with bidirectional heat dissipation according to claim 1, wherein: the cross section of the guide plate (7) is of a triangular structure.

6. The computer motherboard with bidirectional heat dissipation according to claim 1, wherein: the first L-shaped connecting plate (11) is provided with a plurality of mounting holes (19).