CN212623860U - Heat dissipation computer housing - Google Patents
Heat dissipation computer housing Download PDFInfo
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- CN212623860U CN212623860U CN202021151959.2U CN202021151959U CN212623860U CN 212623860 U CN212623860 U CN 212623860U CN 202021151959 U CN202021151959 U CN 202021151959U CN 212623860 U CN212623860 U CN 212623860U
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- heat dissipation
- pipe
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- water pipe
- computer
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Abstract
The utility model discloses a heat dissipation computer shell, which relates to the technical field of computer heat dissipation and mainly solves the problem that the existing computer heat dissipation structure can not meet the heat dissipation requirement of a high-end computer; the device includes the shell, be provided with the heat dissipation frame on the shell, the heat dissipation frame evenly is provided with the louvre, the heat dissipation frame is sandwich design, the cooling tube is evenly installed to the intermediate position of heat dissipation frame, the upside and the first transverse connection pipe of cooling tube link to each other, first transverse connection pipe links to each other with first water pipe, first water pipe links to each other with the mount pad, the mount pad links to each other with the second water pipe, the second water pipe links to each other with the inside water pump of water tank, the downside and the second transverse connection pipe of cooling tube link to each other, the second transverse connection pipe passes through the third water pipe and links to each other with the water tank, install the fan in the shell, the utility model discloses an above-mentioned structure effectively promotes heat-sinking capability, promotes computer running performance.
Description
Technical Field
The utility model relates to a computer machine case technical field specifically is a heat dissipation computer housing.
Background
Along with the increasingly powerful computing power of computer processing chips, the power of the computer chips is also increasingly larger, more and more heat is generated in the working process, and the temperature rise easily causes the frequency reduction work of the computer, so that the performance of the computer is reduced, and therefore the heat dissipation requirement of the computer is higher, and the conventional ventilation type heat dissipation structure is difficult to meet the heat dissipation requirement of a high-end computer.
The existing computer heat dissipation system mostly dissipates the heat conducted out by the heat dissipation copper pipe through the heat dissipation fan, but the heat dissipation effect of the heat dissipation mode is limited, and the heat dissipation of the high-end computer can not meet the requirements.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to provide a heat dissipation computer housing to solve the problem that proposes among the above-mentioned background art.
In order to achieve the above object, the utility model provides a following technical scheme:
the utility model provides a heat dissipation computer casing, includes the shell, be provided with the heat dissipation frame on the shell, the heat dissipation frame evenly is provided with the louvre, the heat dissipation frame is sandwich design, the cooling tube is evenly installed to the intermediate position of heat dissipation frame, the upside and the first transverse connection pipe of cooling tube link to each other, first transverse connection pipe links to each other with first water pipe, first water pipe links to each other with the mount pad, the mount pad links to each other with the second water pipe, the second water pipe links to each other with the inside water pump of water tank, the downside and the second transverse connection pipe of cooling tube link to each other, the second transverse connection pipe passes through the third water pipe and links to each other with the water tank, install the fan in the shell.
As a further aspect of the present invention: and a filter screen is arranged on the inner side of the heat dissipation frame.
As a further aspect of the present invention: the filter screen is detachably installed.
As a further aspect of the present invention: the first transverse connecting pipe is connected with the first water pipe through the connector, and the second transverse connecting pipe is connected with the third water pipe through the connector.
As a further aspect of the present invention: the internal diameter of the radiating pipe is three millimeters.
As a further aspect of the present invention: the radiating pipe is a transparent rubber hose.
As a further aspect of the present invention: the water tank is designed in a cuboid shape and is transversely arranged at the bottom of the shell.
Compared with the prior art, the beneficial effects of the utility model are that:
the utility model discloses a set up the heat dissipation frame on the shell, install the cooling tube with the help of the heat dissipation frame of sandwich design, through first water pipe, the second water pipe, the third water pipe, and first transverse connection pipe, the hydrologic cycle is realized to the second transverse connection pipe, in taking the heat that the treater of installation gived off on the mount pad to the cooling tube on the heat dissipation frame, the fan that recombines promotes the holistic heat-sinking capability of computer, the temperature when greatly reduced computer operation, promote computer working property, prevent that the computer from reducing the frequency work.
Drawings
Fig. 1 is a schematic structural diagram of a heat dissipation computer housing.
Fig. 2 is a schematic structural diagram of a heat dissipation frame in a heat dissipation computer housing.
Fig. 3 is a schematic view of the installation of a heat pipe in a heat dissipation computer housing.
In the figure: 1-shell, 2-radiating frame, 20-radiating holes, 3-radiating pipe, 4-filter screen, 5-first transverse connecting pipe, 50-second transverse connecting pipe, 51-third water pipe, 6-first water pipe, 7-connector, 8-mounting seat, 9-second water pipe, 10-water tank, 11-water pump and 12-fan.
Detailed Description
In the description of the present invention, it is to be understood that the terms "lateral," "upper," "lower," "top," "bottom," "inner," "outer," and the like are used in the orientation or positional relationship indicated in the drawings for convenience of description and simplicity of description, and do not indicate or imply that the device or element so indicated must have a particular orientation, be constructed and operated in a particular orientation, and thus should not be construed as limiting the present invention.
Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of the present invention, "a plurality" means two or more unless specifically limited otherwise.
In the present invention, unless otherwise expressly stated or limited, the terms "mounted," "connected," and "fixed" are to be construed broadly and may, for example, be fixedly connected, detachably connected, or integrally formed; can be mechanically or electrically connected; either directly or indirectly through intervening media, either internally or in any other relationship. The specific meaning of the above terms in the present invention can be understood according to specific situations by those skilled in the art.
The technical solution of the present patent will be described in further detail with reference to the following embodiments.
Example 1:
referring to fig. 1-3, a heat dissipation computer case includes a case 1, a heat dissipation frame 2 is disposed on the case 1, heat dissipation holes 20 are uniformly disposed on the heat dissipation frame 2, the heat dissipation frame 2 is of a sandwich design, a heat dissipation tube 3 is uniformly disposed at a middle position of the heat dissipation frame 2, an upper side of the heat dissipation tube 3 is connected to a first transverse connection tube 5, the first transverse connection tube 5 is connected to a first water tube 6, the first water tube 6 is connected to a mounting seat 8, the mounting seat 8 is connected to a second water tube 9, the second water tube 9 is connected to a water pump 11 inside a water tank 10, a lower side of the heat dissipation tube 3 is connected to a second transverse connection tube 50, the second transverse connection tube 50 is connected to the water tank 10 through a third water tube 51, and a fan 12 is disposed in the case 1.
Specifically, the high-temperature water flow from the mounting seat 8 is dispersed to the radiating pipe 3 through the first water pipe 6, the second water pipe 9, the third water pipe 51, the first transverse connecting pipe 5 and the second transverse connecting pipe 50, and then the heat in the radiating pipe 3 is dissipated from the radiating hole 20 by means of the fan 12, so that the water circulation is realized, and the effect of circular radiation is realized.
Furthermore, a filter screen 4 is installed on the inner side of the heat dissipation frame 2.
Further, the filter screen 4 is detachably mounted.
Specifically, the filter screen 4 is arranged on the inner side of the heat dissipation frame 2 to prevent dust from entering the computer.
Further, the first transverse connecting pipe 5 is connected with the first water pipe 6 through a connector 7, and the second transverse connecting pipe 50 is connected with the third water pipe 51 through the connector 7.
Specifically, the first transverse connecting pipe 5 and the second transverse connecting pipe 50 are connected by the connector 7, so that the installation and the disassembly are convenient.
Further, the inner diameter of the radiating pipe 3 is three millimeters.
Further, the radiating pipe 3 is a transparent rubber hose.
Example 2:
this embodiment is a further improvement and a limitation of embodiment 1 on the basis of embodiment 1.
A heat dissipating computer housing comprising all of the components of embodiment 1, further comprising:
further, the water tank 10 is designed in a rectangular parallelepiped shape, and the water tank 10 is transversely installed at the bottom of the housing 1.
Specifically, the water tank 10 is provided as a rectangular parallelepiped having a flat shape to reduce the space occupied by the water tank 10 for the inside of the computer as much as possible.
The utility model discloses a theory of operation is:
as shown in fig. 1-3, the utility model discloses a set up heat dissipation frame 2 on shell 1, combine the heat dissipation frame 2 of sandwich design, evenly install cooling tube 3 in heat dissipation frame 2 inside, combine first water pipe 6, second water pipe 9, third water pipe 51 and first transverse connection pipe 5, 50 high temperature water that come from mount pad 8 of second transverse connection pipe are carried to the position of cooling tube 3, the inside heat of cooling tube 3 is discharged through louvre 20 with the help of fan 12 again, thereby reach the temperature that reduces the treater position, guarantee the computer and normally work.
The above description is only a preferred embodiment of the present invention, and should not be taken as limiting the invention, and any modifications, equivalent replacements, improvements, etc. made within the spirit and principle of the present invention should be included in the protection scope of the present invention. Any reference sign in a claim should not be construed as limiting the claim concerned.
Furthermore, it should be understood that although the present description refers to embodiments, not every embodiment may contain only a single embodiment, and such description is for clarity only, and those skilled in the art should integrate the description, and the embodiments may be combined as appropriate to form other embodiments understood by those skilled in the art.
Claims (7)
1. A heat dissipation computer shell comprises a shell (1) and is characterized in that a heat dissipation frame (2) is arranged on the shell (1), heat dissipation holes (20) are uniformly formed in the heat dissipation frame (2), the heat dissipation frame (2) is designed in a sandwich mode, heat dissipation pipes (3) are uniformly installed in the middle of the heat dissipation frame (2), the upper sides of the heat dissipation pipes (3) are connected with a first transverse connecting pipe (5), the first transverse connecting pipe (5) is connected with a first water pipe (6), the first water pipe (6) is connected with a mounting seat (8), the mounting seat (8) is connected with a second water pipe (9), the second water pipe (9) is connected with a water pump (11) inside a water tank (10), the lower sides of the heat dissipation pipes (3) are connected with a second transverse connecting pipe (50), and the second transverse connecting pipe (50) is connected with the water tank (10) through a third water pipe (51), a fan (12) is arranged in the shell (1).
2. A heat dissipating computer housing according to claim 1, characterized in that a filter screen (4) is mounted inside the heat dissipating frame (2).
3. A heat dissipating computer housing according to claim 2, wherein the filter screen (4) is detachably mounted.
4. A heat-dissipating computer housing as claimed in claim 1, characterized in that the first transverse connecting pipe (5) is connected to the first water pipe (6) by means of a connecting head (7), and the second transverse connecting pipe (50) is connected to the third water pipe (51) by means of a connecting head (7).
5. A radiating computer housing according to claim 1, characterised in that the internal diameter of the radiating pipe (3) is three millimetres.
6. A radiating computer housing according to claim 5, characterized in that the radiating pipe (3) is a transparent rubber hose.
7. A heat-dissipating computer housing as claimed in claim 1, characterized in that the water tank (10) is of rectangular parallelepiped design, the water tank (10) being mounted transversely at the bottom of the housing (1).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202021151959.2U CN212623860U (en) | 2020-06-19 | 2020-06-19 | Heat dissipation computer housing |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202021151959.2U CN212623860U (en) | 2020-06-19 | 2020-06-19 | Heat dissipation computer housing |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN212623860U true CN212623860U (en) | 2021-02-26 |
Family
ID=74755890
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202021151959.2U Active CN212623860U (en) | 2020-06-19 | 2020-06-19 | Heat dissipation computer housing |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN212623860U (en) |
-
2020
- 2020-06-19 CN CN202021151959.2U patent/CN212623860U/en active Active
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| TR01 | Transfer of patent right | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20220811 Address after: A005, Building 8, Xixian Youth Pioneer Park, Shanglin Road, Fengdong New Town, Xi'an City, Shaanxi Province 710000 Patentee after: Xi'an Hongxinlong Information Technology Co., Ltd. Address before: 016000 xilaifeng circular economy industrial park, Wuhai City, Inner Mongolia Autonomous Region Patentee before: Liu Xinyue |